CN113141709A - Equipment self-checking method for blind hole position offset of circuit board - Google Patents
Equipment self-checking method for blind hole position offset of circuit board Download PDFInfo
- Publication number
- CN113141709A CN113141709A CN202110220641.8A CN202110220641A CN113141709A CN 113141709 A CN113141709 A CN 113141709A CN 202110220641 A CN202110220641 A CN 202110220641A CN 113141709 A CN113141709 A CN 113141709A
- Authority
- CN
- China
- Prior art keywords
- positioning
- circuit board
- hole
- blind hole
- blind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000002950 deficient Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
Abstract
The invention provides a self-checking method of equipment for hole site deviation of a blind hole of a circuit board, which comprises the following steps that A, 4 positioning holes and a blind hole are set on the circuit board to be processed as target points, the circuit board is placed on a table board, and the coordinate information of 5 target points is input into the table board; B. moving the table top of the machine table into a lens alignment area on the machine table, sequentially moving 4 positioning holes on the circuit board into the lens alignment area, and performing first target-grabbing positioning on coordinate points of the 4 positioning holes by the lens; C. carrying out laser processing on a blind hole coordinate point on the circuit board; D. and after the blind hole is machined, performing secondary target grabbing and positioning on the blind hole, and detecting whether the hole position of the target point deviates or not. The blind hole deviation detection method has the advantages of being capable of detecting whether the blind hole position deviates in time, improving the detection capability of the blind hole deviation, avoiding mass hole position deviation and missing hitting and the like.
Description
Technical Field
The invention belongs to the field of PCB processing, and particularly relates to a self-checking method for equipment for blind hole position offset of a circuit board.
Background
At present, interlayer conduction of the HDI board in the manufacturing process needs to be completed by manufacturing blind holes, the number of the blind holes is large, the blind holes are not easy to find when field personnel check, each blind hole cannot be checked, batch manufacturing is completed when a blind hole inspection machine scans, and if the blind holes are found to be seriously deviated, the number of wastes is large. Therefore, a new technical solution needs to be proposed
Disclosure of Invention
The invention aims to provide a self-checking method for blind hole position offset of a circuit board, which can timely detect whether the blind hole position is offset, improve the detection capability of the blind hole offset and avoid mass hole position offset and missing printing.
In order to achieve the above purpose, the invention adopts the following technical scheme: a self-checking method for hole position offset of blind hole of circuit board includes such steps as providing a blind hole on circuit board,
A. setting 4 positioning holes and a blind hole on a circuit board to be processed as target spots, placing the circuit board on the table top of a machine table, and inputting coordinate information of 5 target spots into the machine table;
B. moving the table top of the machine table into a lens alignment area on the machine table, sequentially moving 4 positioning holes on the circuit board into the lens alignment area, and performing first target-grabbing positioning on coordinate points of the 4 positioning holes by the lens;
after the C.4 positioning holes are successfully positioned, carrying out laser processing on blind holes at blind hole coordinate points on the circuit board;
D. after the blind hole is machined, performing secondary target grabbing positioning on the blind hole, and detecting whether the hole site of a target point deviates or not;
E. and after determining that the blind hole position has no offset, moving the circuit board out of the machine table.
Further, the 4 positioning holes form a rectangular shape, and the 4 positioning holes are arranged at four corners of the rectangle.
Further, the blind hole is provided at any point within a rectangular area formed by the 4 positioning holes.
Furthermore, the first target-grabbing positioning of the 4 positioning holes is set to perform 25 searches on each positioning hole coordinate point, and if the search is successful, the search is sequentially switched to the search of the next positioning hole coordinate point until the 4 positioning holes are successfully searched.
Furthermore, in the first target grabbing positioning, as long as one positioning hole fails to be searched, the circuit board is determined to be defective.
Furthermore, in the second target grabbing and positioning, the coordinate points of the blind holes are searched for only once, if the search is successful, the blind holes are judged to be good, and if the search is failed, the blind holes are judged to be defective.
Compared with the prior art, the invention realizes the self-checking of the hole site of the machine by utilizing the original lens and the operation principle of the machine, can effectively avoid the deviation and the missing of the hole site in batch, checks the self abnormity of the machine, prevents the occurrence of the missing of the hole site in batch and the sudden interruption or reduction of energy caused by the problem of the machine, and improves the yield of products.
Detailed Description
In order to further illustrate the technical means adopted and the technical effects achieved by the present invention, the following detailed description is made with reference to the embodiments.
The invention provides a self-checking method of equipment for hole site deviation of a blind hole of a circuit board, which comprises the following steps,
A. setting 4 positioning holes and a blind hole on a circuit board to be processed as target spots, placing the circuit board on the table top of a machine table, and inputting coordinate information of 5 target spots into the machine table;
B. moving the table top of the machine table into a lens alignment area on the machine table, sequentially moving 4 positioning holes on the circuit board into the lens alignment area, and performing first target-grabbing positioning on coordinate points of the 4 positioning holes by the lens;
after the C.4 positioning holes are successfully positioned, carrying out laser processing on blind holes at blind hole coordinate points on the circuit board;
D. after the blind hole is machined, performing secondary target grabbing positioning on the blind hole, and detecting whether the hole site of a target point deviates or not;
E. and after determining that the blind hole position has no offset, moving the circuit board out of the machine table.
The 4 positioning holes form a rectangular shape, and the 4 positioning holes are arranged at four corners of the rectangle.
The blind hole is arranged at any point in a rectangular area formed by the 4 positioning holes.
And carrying out target grabbing and positioning for the first time on the 4 positioning holes, wherein 25 times of searching is set to be carried out on each positioning hole coordinate point, and if the searching is successful, sequentially turning to the searching of the next positioning hole coordinate point until the searching of the 4 positioning holes is successful.
In the first target grabbing positioning, as long as one positioning hole fails to be searched, the circuit board is judged to be defective.
In the second target grabbing and positioning, the coordinate points of the blind holes are searched for once, if the search is successful, the blind holes are judged to be good, and if the search is failed, the blind holes are judged to be defective.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
While embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and that changes, modifications and variations may be made therein by those of ordinary skill in the art within the scope of the present invention.
Claims (6)
1. A self-checking method of the hole site offset of a blind hole of a circuit board is characterized in that: which comprises the following steps of,
A. setting 4 positioning holes and a blind hole on a circuit board to be processed as target spots, placing the circuit board on the table top of a machine table, and inputting coordinate information of 5 target spots into the machine table;
B. moving the table top of the machine table into a lens alignment area on the machine table, sequentially moving 4 positioning holes on the circuit board into the lens alignment area, and performing first target-grabbing positioning on coordinate points of the 4 positioning holes by the lens;
after the C.4 positioning holes are successfully positioned, carrying out laser processing on blind holes at blind hole coordinate points on the circuit board;
D. after the blind hole is machined, performing secondary target grabbing positioning on the blind hole, and detecting whether the hole site of a target point deviates or not;
E. and after determining that the blind hole position has no offset, moving the circuit board out of the machine table.
2. The self-checking method of equipment for hole site deviation of blind holes of circuit boards according to claim 1, characterized in that: the 4 positioning holes form a rectangular shape, and the 4 positioning holes are arranged at four corners of the rectangle.
3. The self-checking method of equipment for hole site deviation of blind holes of circuit boards according to claim 2, characterized in that: the blind hole is arranged at any point in a rectangular area formed by the 4 positioning holes.
4. The self-checking method of equipment for hole site deviation of blind holes of circuit boards according to claim 1, characterized in that: and carrying out target grabbing and positioning for the first time on the 4 positioning holes, wherein 25 times of searching is set to be carried out on each positioning hole coordinate point, and if the searching is successful, sequentially turning to the searching of the next positioning hole coordinate point until the searching of the 4 positioning holes is successful.
5. The self-checking method of equipment for hole site deviation of blind holes of circuit boards according to claim 4, characterized in that: in the first target grabbing positioning, as long as one positioning hole fails to be searched, the circuit board is judged to be defective.
6. The self-checking method of equipment for hole site deviation of blind holes of circuit boards according to claim 1, characterized in that: in the second target grabbing and positioning, the coordinate points of the blind holes are searched for once, if the search is successful, the blind holes are judged to be good, and if the search is failed, the blind holes are judged to be defective.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110220641.8A CN113141709A (en) | 2021-02-26 | 2021-02-26 | Equipment self-checking method for blind hole position offset of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110220641.8A CN113141709A (en) | 2021-02-26 | 2021-02-26 | Equipment self-checking method for blind hole position offset of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113141709A true CN113141709A (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110220641.8A Pending CN113141709A (en) | 2021-02-26 | 2021-02-26 | Equipment self-checking method for blind hole position offset of circuit board |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958288A (en) * | 2011-08-21 | 2013-03-06 | 深南电路有限公司 | Printed circuit board drilling method |
| CN109807477A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of PCB aperture combined machining method |
| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
| CN111385977A (en) * | 2018-12-31 | 2020-07-07 | 长沙牧泰莱电路技术有限公司 | PCB (printed circuit board) blind hole layer negative film process |
| CN111465219A (en) * | 2020-04-15 | 2020-07-28 | 深圳市信维通信股份有限公司 | Circuit board processing method |
-
2021
- 2021-02-26 CN CN202110220641.8A patent/CN113141709A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958288A (en) * | 2011-08-21 | 2013-03-06 | 深南电路有限公司 | Printed circuit board drilling method |
| CN109807477A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of PCB aperture combined machining method |
| CN111385977A (en) * | 2018-12-31 | 2020-07-07 | 长沙牧泰莱电路技术有限公司 | PCB (printed circuit board) blind hole layer negative film process |
| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
| CN111465219A (en) * | 2020-04-15 | 2020-07-28 | 深圳市信维通信股份有限公司 | Circuit board processing method |
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