CN108064118B - Dislocation-preventing PCB drilling method - Google Patents
Dislocation-preventing PCB drilling method Download PDFInfo
- Publication number
- CN108064118B CN108064118B CN201711192661.9A CN201711192661A CN108064118B CN 108064118 B CN108064118 B CN 108064118B CN 201711192661 A CN201711192661 A CN 201711192661A CN 108064118 B CN108064118 B CN 108064118B
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- laser
- mechanical
- hole
- drilling
- holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Drilling And Boring (AREA)
Abstract
The invention discloses a dislocation-preventing PCB drilling method, which comprises the following process steps: laser drilling: processing holes on the PCB by using a laser hole forming technology to obtain laser holes; mechanical drilling: drilling the PCB by using a drill bit to obtain a mechanical hole; in the laser drilling step, a laser pore-forming technology is further utilized to surround and arrange a plurality of laser identification holes around the machining position in the mechanical drilling step by taking the machining center in the mechanical drilling step as a circle center, and the distance between the circle center of the identification hole and the machining center in the mechanical drilling step is equal to the sum of the radius of the mechanical hole, the radius of the laser identification hole and the required distance of production errors. Compared with the prior art, through setting up the radium-shine identification hole of a plurality of around the mechanical hole, whether the mechanical hole is seriously misplaced is discerned directly perceivedly after convenient processing, effectively improves the efficiency of processing, simultaneously, in time adjustment equipment after discovering the dislocation, also can improve the yields.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a dislocation-preventing PCB drilling method.
Background
At present, after laser drilling, the expansion and contraction of a plurality of plates are measured, and after the expansion and contraction data are averaged, the coefficient compensation is carried out on a drill belt of mechanical drilling. And then mechanical drilling is carried out, the dislocation condition of the laser drilling and the mechanical drilling is difficult to check after the drilling is finished, only the film contraposition clapper board check can be carried out in the dry film process, but if the laser drilling belt and the mechanical drilling belt are not matched, the production board is scrapped. The method greatly reduces the yield of products and improves the production cost.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the above-mentioned problems in the related art. Therefore, the invention provides a dislocation-preventing PCB drilling method for effectively improving the yield.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a dislocation-preventing PCB drilling method comprises the following process steps:
laser drilling: processing holes on the PCB by using a laser hole forming technology to obtain laser holes;
mechanical drilling: drilling the PCB by using a drill bit to obtain a mechanical hole;
in the laser drilling step, a laser pore-forming technology is further utilized to surround and arrange a plurality of laser identification holes around the machining position in the mechanical drilling step by taking the machining center in the mechanical drilling step as a circle center, and the distance between the circle center of the identification hole and the machining center in the mechanical drilling step is equal to the sum of the radius of the mechanical hole, the radius of the laser identification hole and the required distance of production errors.
As an improvement of the above technical scheme, eight laser identification holes are provided.
As a further improvement of the above technical solution, the plurality of laser identification holes are uniformly distributed.
Further, after the mechanical drilling step, the method comprises the following steps:
and (4) checking: confirming whether the mechanical hole is intersected with the laser identification hole;
adjusting: and measuring intersecting data of the intersecting mechanical hole and the laser identification hole, and performing coefficient compensation on the mechanical drilling step according to the intersecting data.
Furthermore, the laser identification holes are consistent in size.
The invention has the beneficial effects that: a dislocation-preventing PCB drilling method comprises the following process steps: laser drilling: processing holes on the PCB by using a laser hole forming technology to obtain laser holes; mechanical drilling: drilling the PCB by using a drill bit to obtain a mechanical hole; in the laser drilling step, a laser pore-forming technology is further utilized to surround and arrange a plurality of laser identification holes around the machining position in the mechanical drilling step by taking the machining center in the mechanical drilling step as a circle center, and the distance between the circle center of the identification hole and the machining center in the mechanical drilling step is equal to the sum of the radius of the mechanical hole, the radius of the laser identification hole and the required distance of production errors. Compared with the prior art, through setting up the radium-shine identification hole of a plurality of around the mechanical hole, whether the mechanical hole is seriously misplaced is discerned directly perceivedly after convenient processing, effectively improves the efficiency of processing, simultaneously, in time adjustment equipment after discovering the dislocation, also can improve the yields.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic view of the arrangement of laser marking holes of the present invention.
Detailed Description
Referring to fig. 1, a method for drilling a PCB panel with dislocation prevention according to the present invention,
the method comprises the following process steps:
laser drilling: processing holes on the PCB by using a laser hole forming technology to obtain laser holes;
mechanical drilling: drilling the PCB by using a drill bit to obtain a mechanical hole 1;
in the laser drilling step, a laser pore-forming technology is further utilized to surround and arrange a plurality of laser identification holes 2 around the machining position in the mechanical drilling step by taking the machining center in the mechanical drilling step as a circle center, and the distance between the circle center of the identification hole and the machining center in the mechanical drilling step is equal to the sum of the radius of the mechanical hole 1, the radius of the laser identification hole 2 and the required distance of production errors.
Compared with the prior art, through setting up radium-shine sign hole 2 of a plurality of around mechanical hole 1, whether the serious dislocation of mechanical hole 1 is discerned directly perceivedly after convenient processing.
When the mechanical hole 1 is in the range of the laser drilling identification hole and the laser drilling identification hole is not intersected with the mechanical hole 1, the dislocation production error requirement of the mechanical drilling and the laser drilling is indicated;
when the mechanical drilling hole is intersected with the laser drilling hole, the dislocation of the mechanical drilling hole and the laser drilling hole exceeds the requirement of production error, and then the machining machine is adjusted.
The processing efficiency is improved, and meanwhile, the yield can also be improved.
As an improvement of the above technical solution, eight laser identification holes 2 are provided.
Preferably, the laser identification holes 2 are uniformly distributed.
Preferably, after the mechanical drilling step, the mechanical drilling method comprises the following steps:
and (4) checking: confirming whether the mechanical hole 1 is intersected with the laser identification hole 2;
adjusting: and measuring intersecting data of the intersecting mechanical hole 1 and the laser identification hole 2, and performing coefficient compensation on the mechanical drilling step according to the intersecting data.
The PCB is detected, the intersection coefficient is timely and effectively updated, the yield of products is favorably improved, and a producer can conveniently monitor the processing quality in time.
Preferably, the laser identification holes 2 are identical in size.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (4)
1. A dislocation-preventing PCB drilling method is characterized in that:
the method comprises the following process steps:
laser drilling: processing holes on the PCB by using a laser hole forming technology to obtain laser holes;
mechanical drilling: drilling the PCB by using a drill bit to obtain a mechanical hole (1);
in the laser drilling step, a laser pore-forming technology is further utilized to surround and arrange a plurality of laser identification holes (2) around the machining position in the mechanical drilling step by taking the machining center in the mechanical drilling step as the circle center, and the distance between the circle center of each laser identification hole (2) and the machining center in the mechanical drilling step is equal to the sum of the radius of each mechanical hole (1), the radius of each laser identification hole (2) and the required distance of production error;
after the mechanical drilling step, the method comprises the following steps:
and (4) checking: confirming whether the mechanical hole (1) is intersected with the laser identification hole (2) or not;
adjusting: and measuring intersecting data of the intersecting mechanical hole (1) and the laser identification hole (2), and performing coefficient compensation on the mechanical drilling step according to the intersecting data.
2. The dislocation-preventing PCB board drilling method as claimed in claim 1, wherein: eight laser identification holes (2) are arranged.
3. The dislocation-preventing PCB board drilling method as claimed in claim 1, wherein: the laser identification holes (2) are uniformly distributed.
4. The dislocation-preventing PCB board drilling method as claimed in claim 1, wherein: the laser identification holes (2) are consistent in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192661.9A CN108064118B (en) | 2017-11-24 | 2017-11-24 | Dislocation-preventing PCB drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192661.9A CN108064118B (en) | 2017-11-24 | 2017-11-24 | Dislocation-preventing PCB drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108064118A CN108064118A (en) | 2018-05-22 |
| CN108064118B true CN108064118B (en) | 2020-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711192661.9A Active CN108064118B (en) | 2017-11-24 | 2017-11-24 | Dislocation-preventing PCB drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108064118B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970848B (en) * | 2020-08-31 | 2024-04-09 | 深圳全成信电子有限公司 | Method for rapidly treating copper sticking in PCB hole |
| CN115421331A (en) * | 2022-08-19 | 2022-12-02 | 柏承科技(昆山)股份有限公司 | Small piece large typesetting and positioning processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155306A (en) * | 1984-01-20 | 1985-08-15 | Fujitsu Ltd | Drilling method of printed circuit board |
| CN102159020A (en) * | 2010-02-11 | 2011-08-17 | 欣兴电子股份有限公司 | Counterpoint structure of circuit board and manufacturing method thereof |
-
2017
- 2017-11-24 CN CN201711192661.9A patent/CN108064118B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155306A (en) * | 1984-01-20 | 1985-08-15 | Fujitsu Ltd | Drilling method of printed circuit board |
| CN102159020A (en) * | 2010-02-11 | 2011-08-17 | 欣兴电子股份有限公司 | Counterpoint structure of circuit board and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN108064118A (en) | 2018-05-22 |
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