CN102706267A - Blind hole offset detecting method - Google Patents
Blind hole offset detecting method Download PDFInfo
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- CN102706267A CN102706267A CN2012101901523A CN201210190152A CN102706267A CN 102706267 A CN102706267 A CN 102706267A CN 2012101901523 A CN2012101901523 A CN 2012101901523A CN 201210190152 A CN201210190152 A CN 201210190152A CN 102706267 A CN102706267 A CN 102706267A
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- lamellar body
- blind hole
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- ground floor
- layer sheet
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Abstract
The invention relates to a blind hole offset detecting method, which comprises the following steps of: setting a plurality of mutually independent first-layer sheet bodies and a plurality of interconnected second-layer sheet bodies before laser drilling, wherein a central hole is formed in the center of each second-layer sheet body; correspondingly arranging the first-layer sheet bodies and the second-layer sheet bodies vertically; drilling blind holes on the first-layer sheet bodies by using laser, plating copper in the blind holes, and performing offset detection; connecting a meter pen of a universal meter to a first-layer sheet body corresponding to the upper part of a tested sheet body in the second-layer sheet bodies, and sequentially connecting the other meter pen to the first-layer sheet body corresponding to the upper part of the other sheet body in the second-layer sheet bodies; and judging the offset according to the conduction condition of the meter pens. The range of the magnitude of blind hole offset can be accurately judged by designing and detecting the sheet bodies, and whether a product has risk or not is judged by combining the minimum ring width of the blind holes in a plate; and the method is easy to design and convenient in judgment, and the quality of the product is improved.
Description
Technical field
the present invention relates to a kind of blind hole bias detecting method.
Background technology
are present, also do not have non-scrapping property can detect the method for blind hole bias size, can't judge blind hole side-play amount in the plate more, thereby can't confirm whether electrical measurement OK plate exists the fiduciary level risk.
Summary of the invention
the purpose of this invention is to provide a kind of blind hole bias detecting method.
For achieving the above object, the technical scheme that the present invention adopts is:
A kind of blind hole bias detecting method may further comprise the steps:
(1), carry out being provided with before the laser boring following structure:
The ground floor lamellar body: have several, separate between several described ground floor lamellar bodies;
Second layer lamellar body: identical with described ground floor lamellar body quantity; Interconnect between several described second layer lamellar bodies; The center of described second layer lamellar body offers center pit; And the aperture of described center pit reduces successively, has at least one test lamellar body in the described second layer lamellar body;
With described ground floor lamellar body, the corresponding upper and lower setting of second layer lamellar body, the center line that is positioned at upper and lower described ground floor lamellar body, second layer lamellar body is located along the same line;
(2), on described ground floor lamellar body, carry out laser and beat blind hole, in blind hole, carry out copper facing, carry out offset detection:
Multimeter is used in
, and a test pencil is connected to the corresponding ground floor lamellar body in test lamellar body top in the described second layer lamellar body, and another root test pencil is connected to the corresponding ground floor lamellar body in other lamellar body top in the described second layer lamellar body successively; If D1 is second layer lamellar body center pit aperture, the corresponding bottom of this ground floor lamellar body, D2 is the blind hole ring width, and when test pencil not during conducting, the single-side shift amount of blind hole is within (D1-D2)/2; When the test pencil conducting, the single-side shift amount of blind hole exceeds (D1-D2)/2.
preferably, described second layer lamellar body bottom is provided with identical, the corresponding three-layer tablet body in position of quantity with it.
preferably, described test lamellar body is provided with two, center pit is not offered at two described test lamellar body centers.
preferably, in step (2), test pencil is connected to the ground floor lamellar body on the big second layer lamellar body top of described center pit from the ground floor lamellar body on the little second layer lamellar body top of described center pit.
further preferably; When the single-side shift amount of blind hole exceeds (D1-D2)/2; Test pencil is connected to the ground floor lamellar body on the big second layer lamellar body top of an adjacent center pit, and when test pencil not during conducting, the single-side shift amount of blind hole is between the numerical value of adjacent two (D1-D2)/2; When the test pencil conducting, repeat said process.
preferably, multimeter is adjusted to the buzzing shelves, and buzzing is sounded during the test pencil conducting.
Because the technique scheme utilization, the present invention compared with prior art has advantage:
the present invention can judge the residing scope of blind hole bias size accurately through the design and the detection of lamellar body (PAD), again the situation of blind hole minimum annular ring in the board; Thereby judge whether devoid of risk of product; Its simplicity of design, it is convenient to judge, has improved the quality of product.
Description of drawings
Accompanying drawing 1 is the synoptic diagram of ground floor lamellar body among the present invention;
Accompanying drawing 2 is the synoptic diagram of second layer lamellar body among the present invention;
Accompanying drawing 3 is the synoptic diagram of three-layer tablet body among the present invention;
Accompanying drawing 4 is for three-layer tablet body stack among the present invention and the schematic top plan view after offering blind hole;
accompanying drawing 5 is for three-layer tablet body stack among the present invention and the cross-sectional schematic after offering blind hole.
wherein: 1, ground floor lamellar body; 2, second layer lamellar body; 20, center pit; 21, test lamellar body; 3, three-layer tablet body; 4, blind hole.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described:
A kind of blind hole bias detecting method may further comprise the steps:
(1), carry out being provided with before the laser boring following structure lamellar body (PAD):
As shown in Figure 1: ground floor lamellar body 1: have 13,1 of 13 ground floor lamellar bodies is separate, for multimeter provides contact point;
As shown in Figure 2: second layer lamellar body 2: also have 13, interconnect between 13 second layer lamellar bodies 2, the center of second layer lamellar body 2 offers center pit 20, and the aperture of center pit 20 increases (1-11) from right to left successively; Have 2 test lamellar bodies 21 (the 12nd, 13) in the second layer lamellar body 2, center pit is not offered at test lamellar body 31 centers;
are as shown in Figure 3: three-layer tablet body 3, also have 13, and shield, prevent that blind hole from getting to other other layer.
are provided with ground floor lamellar body 1, second layer lamellar body 2 and three-layer tablet body 3 corresponding upper, middle and lower; The center line that is positioned at ground floor lamellar body 1, second layer lamellar body 2 and the three-layer tablet body 3 of upper, middle and lower is located along the same line, and connects through electroplating the second layer lamellar body 2 that ground floor lamellar body 1 is corresponding with being positioned at its underpart.
(2), like Fig. 4, shown in 5: on ground floor lamellar body 1, carry out laser and beat blind hole 4, do not have when blind hole 4 can to pass from the center pit of second layer lamellar body 2 under the situation of skew; If have under the situation of skew; Then can beat on second layer lamellar body 2, in blind hole 4, carry out copper facing, if blind hole 4 is displaced to a certain degree; Electro-coppering will make ground floor lamellar body 1, second layer lamellar body 2 link together
When carrying out offset detection:
Multimeter is used in
; Multimeter is adjusted to the buzzing shelves; A test pencil is connected to the corresponding ground floor lamellar body 1 in test lamellar body 21 (the 12nd, 13) top in the second layer lamellar body 2, and another root test pencil is connected to the corresponding ground floor lamellar body 1 in other lamellar body in the second layer lamellar body 2 (being connected to the 11st from the 1st) top successively; 1,1.25,1.5,1.75,2,2.25,2.5,2.75,3.25,3.75,4.25mil if D1 is the aperture of these ground floor lamellar body 1 corresponding bottom second layer lamellar body 2 center pits 20, D2 is the ring width of blind hole 4, and the size of establishing A in the accompanying drawing 4 is respectively to 11 from the 1st:; When connecting the 1st,, then represent side-play amount in 1mil when test pencil does not sound; Do not ring as the 1st; The 2nd sounds, then represents side-play amount between 1-1.25mil, by that analogy.
The minimum 2.5mil of being of blind hole 4 ring widthes in the plate is supposed in
, that the 7th the loud OK that then represents; If loudness more than or equal to 7 sound then need cut into slices and confirm whether blind hole has the carrying of exceeding in the plate, need be scrapped processing if having then, then can afterflow if do not have.
the foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to let the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (6)
1. blind hole bias detecting method is characterized in that: may further comprise the steps:
(1), carry out being provided with before the laser boring following structure:
The ground floor lamellar body: have several, separate between several described ground floor lamellar bodies;
Second layer lamellar body: identical with described ground floor lamellar body quantity; Interconnect between several described second layer lamellar bodies; The center of described second layer lamellar body offers center pit; And the aperture of described center pit reduces successively, has at least one test lamellar body in the described second layer lamellar body;
With described ground floor lamellar body, the corresponding upper and lower setting of second layer lamellar body, the center line that is positioned at upper and lower described ground floor lamellar body, second layer lamellar body is located along the same line;
(2), on described ground floor lamellar body, carry out laser and beat blind hole, in blind hole, carry out copper facing, carry out offset detection:
Use multimeter, a test pencil is connected to the corresponding ground floor lamellar body in test lamellar body top in the described second layer lamellar body, another root test pencil is connected to the corresponding ground floor lamellar body in other lamellar body top in the described second layer lamellar body successively; If D1 is second layer lamellar body center pit aperture, the corresponding bottom of this ground floor lamellar body, D2 is the blind hole ring width, and when test pencil not during conducting, the single-side shift amount of blind hole is within (D1-D2)/2; When the test pencil conducting, the single-side shift amount of blind hole exceeds (D1-D2)/2.
2. blind hole bias detecting method according to claim 1 is characterized in that: described second layer lamellar body bottom is provided with identical, the corresponding three-layer tablet body in position of quantity with it.
3. blind hole bias detecting method according to claim 1 is characterized in that: described test lamellar body is provided with two, and center pit is not offered at two described test lamellar body centers.
4. blind hole bias detecting method according to claim 1; It is characterized in that: in step (2), test pencil is connected to the ground floor lamellar body on the big second layer lamellar body top of described center pit from the ground floor lamellar body on the little second layer lamellar body top of described center pit.
5. blind hole bias detecting method according to claim 4; It is characterized in that: when the single-side shift amount of blind hole exceeds (D1-D2)/2; Test pencil is connected to the ground floor lamellar body on the big second layer lamellar body top of an adjacent center pit, and when test pencil not during conducting, the single-side shift amount of blind hole is between the numerical value of adjacent two (D1-D2)/2; When the test pencil conducting, repeat said process.
6. blind hole bias detecting method according to claim 1 is characterized in that: multimeter is adjusted to the buzzing shelves, and buzzing is sounded during the test pencil conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190152.3A CN102706267B (en) | 2012-06-11 | 2012-06-11 | Blind hole offset detecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190152.3A CN102706267B (en) | 2012-06-11 | 2012-06-11 | Blind hole offset detecting method |
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| CN102706267A true CN102706267A (en) | 2012-10-03 |
| CN102706267B CN102706267B (en) | 2014-12-17 |
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| CN201210190152.3A Active CN102706267B (en) | 2012-06-11 | 2012-06-11 | Blind hole offset detecting method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415165A (en) * | 2013-05-07 | 2013-11-27 | 胜宏科技（惠州）股份有限公司 | Method for testing quality of blind hole of HDI circuit board |
| CN104180747A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Method of detecting alignment degree of blind holes and work-in-process PCB |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN109443194A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | The device and method of quantization detection blind via bottom Aligning degree |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
| CN113163591A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
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| JPH05226846A (en) * | 1992-02-14 | 1993-09-03 | Fujitsu Ltd | Checking method for deviation of inner layer of multilayer printed wiring board |
| JPH09205281A (en) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | Method for inspecting inner-layer circuit pattern deviation of multilayer printed wiring board |
| CN101709948A (en) * | 2009-12-23 | 2010-05-19 | 深南电路有限公司 | Alignment detecting method of multilayer printed wiring board |
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2012
- 2012-06-11 CN CN201210190152.3A patent/CN102706267B/en active Active
Patent Citations (3)
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| JPH05226846A (en) * | 1992-02-14 | 1993-09-03 | Fujitsu Ltd | Checking method for deviation of inner layer of multilayer printed wiring board |
| JPH09205281A (en) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | Method for inspecting inner-layer circuit pattern deviation of multilayer printed wiring board |
| CN101709948A (en) * | 2009-12-23 | 2010-05-19 | 深南电路有限公司 | Alignment detecting method of multilayer printed wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 高层板对位精度计算模型研究: "李艳国等", 《印制电路信息》, no. 4, 30 April 2011 (2011-04-30), pages 47 - 49 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415165A (en) * | 2013-05-07 | 2013-11-27 | 胜宏科技（惠州）股份有限公司 | Method for testing quality of blind hole of HDI circuit board |
| CN103415165B (en) * | 2013-05-07 | 2016-05-11 | 胜宏科技（惠州）股份有限公司 | A kind of method of testing HDI wiring board blind hole quality |
| CN104180747A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Method of detecting alignment degree of blind holes and work-in-process PCB |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
| CN109526156B (en) * | 2018-11-05 | 2021-04-06 | 深圳崇达多层线路板有限公司 | Detection module and detection method for detecting deviation degree of drilling hole |
| CN109443194A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | The device and method of quantization detection blind via bottom Aligning degree |
| CN109443194B (en) * | 2018-12-06 | 2023-05-12 | 奥士康科技股份有限公司 | Device and method for quantitatively detecting blind hole bottom alignment degree |
| CN113163591A (en) * | 2021-04-25 | 2021-07-23 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
| CN113163591B (en) * | 2021-04-25 | 2023-08-22 | 东莞市五株电子科技有限公司 | HDI blind hole board test structure and HDI blind hole board |
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| Publication number | Publication date |
|---|---|
| CN102706267B (en) | 2014-12-17 |
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