CN201828238U - Back drill depth test device for back drill board - Google Patents
Back drill depth test device for back drill board Download PDFInfo
- Publication number
- CN201828238U CN201828238U CN2010205583282U CN201020558328U CN201828238U CN 201828238 U CN201828238 U CN 201828238U CN 2010205583282 U CN2010205583282 U CN 2010205583282U CN 201020558328 U CN201020558328 U CN 201020558328U CN 201828238 U CN201828238 U CN 201828238U
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- back drill
- drill hole
- depth
- printed wire
- inner layer
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Abstract
The utility model discloses a back drill depth test device for a back drill board. The back drill depth test device comprises two groups of test holes, wherein each group of test holes comprises two metallized conduction holes and one back drill hole; the two metallized conduction holes of the first group of test holes are connected and conducted through a first printed wire on an appointed inner layer; a first back drill hole is designed between the two metallized conduction holes, and can drill through the inner layer according to the depth demands and can break the first printed wire in the inner layer by drilling; two metallized conduction holes of a second group of test holes are connected and conducted through a second printed wire on another appointed inner layer; a second back drill hole is designed between the two metallized conduction holes, and can not drill through the inner layer and can not break the second printed wire in the another inner layer by drilling; the width of the first printed wire is less than the diameter of the first back drill hole; and the width of the second printed wire is less than the diameter of the second back drill hole. As the back drill depth test device is adopted, the detection is extremely convenient and the detection efficiency can be remarkably improved.
Description
Technical field
The utility model belongs to the printed wiring board technical field, relates to a kind of back drill backboard drilling depth proving installation.
Background technology
Recent years, electron trade is under the drive of semiconductor technology and designing technique, and Mining is with HDI (high density interconnect circuit) designing technique significantly, the most familiarly is to use radium-shine blind hole technology, as 1+n+1, and 2+n+2 etc.But except radium-shine blind hole, also have power auger cellular type blind hole technology, i.e. PCB back drill hole technology.In recent years market constantly increases the demand of producing the backboard product, its dorsulum characteristics are except thickness of slab, size greatly outside, also have some electroplating holes after electroplating, use degree of depth keyhole technology, get out the electroless coating hole half, making half hole is to electroplate, and another side is an electroless coating, and this requirement all often occurs at backboard or high laminate, this technology is to use radium-shine drilling technique, must Mining back drill hole technology.What back drill hole technology was the most key is the control of back drill hole depth, and the direction of industry main attack at present is aspect its degree of depth control, but in the method for not having rapid detection aspect its depth test.Method in common is to take a sample to make section in the pcb board structural unit, judge by metaloscope whether the back drill hole depth meets the demands, the method efficient is not high, and the backboard that can only extract fraction detects, can't all production plates be detected, have the situation of omission to take place unavoidably.
The utility model content
The utility model wants the technical solution problem to provide a kind of back drill backboard drilling depth proving installation, adopts this back drill backboard drilling depth proving installation, and it is very convenient to detect, and can significantly improve detection efficiency.
The utility model is to solve the problems of the technologies described above the technical scheme that is adopted to be:
A kind of back drill backboard drilling depth proving installation comprises two groups of instrument connections, and each group instrument connection comprises 2 metallization vias and 1 back drill hole;
2 of first group of instrument connection metallization vias internal layer by appointment is that first printed wire on the internal layer A connects conducting, and the first back drill hole is arranged between these two the metallization vias;
2 of second group of instrument connection metallization vias another internal layer by appointment is that second printed wire on the inner layer B connects conducting, and the second back drill hole is arranged between these two the metallization vias;
The degree of depth of inner layer B is greater than the degree of depth of internal layer A;
The projected depth in the first back drill hole and the second back drill hole is greater than the degree of depth of internal layer A, less than the degree of depth of inner layer B;
The width of first printed wire is less than the diameter in the first back drill hole;
The width of second printed wire is less than the diameter in the second back drill hole.
The diameter of metallization via is 1.0mm.
To 0.2mm when young, the width of second printed wire is than the diameter in second back drill hole 0.2mm extremely when young than the diameter in the first back drill hole for the width of first printed wire.
The beneficial effects of the utility model:
Compared to existing technology, the utility model is in several the test-strips that have the via that metallizes of pcb board limit design, by measuring the break-make situation of several test-strips, can be fast, simple, directly perceived and judge accurately whether the degree of depth in back drill hole meets design requirement, the complexity of having avoided section to analyze.Adopt back drill backboard drilling depth proving installation of the present utility model, the detection efficiency height, the accuracy height, and easy to implement.
Description of drawings
The overall distribution synoptic diagram of Fig. 1 back drill hole depth proving installation on pcb board;
Fig. 2 back drill hole depth proving installation ectonexine design drawing; Three components of upper, middle and lower are represented the structural representation of skin, internal layer (being internal layer A) and another internal layer (being inner layer B) respectively.
Fig. 3 back drill depth test device schematic cross-section.(situation that Fig. 3 a and Fig. 3 b adhere to specification for the back drill hole depth, Fig. 3 c and Fig. 3 d cross situation when dark for the back drill hole, Fig. 3 e and Fig. 3 f cross situation when shallow for the back drill hole)
Wherein, 1-PCB plate, 2-back drill depth test bar, first group of instrument connection of 3-, second group of instrument connection of 4-, first group of metallization of 5-via, second group of metallization of 6-via, the 7-first back drill hole, the 8-second back drill hole, 9-first printed wire, 10-second printed wire.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Embodiment 1
Referring to Fig. 1-2, design several back drill hole depth test-strips 2 on PCB 1 edges of boards limit, back drill depth test bar 2 is made up of two groups of instrument connections (i.e. first group of instrument connection 3 and second group of instrument connection 4).The back drill hole requires to drill internal layer A from skin, but can not get into inner layer B.
First group of metallization via 5 be 1.0mm by two diameters the metallization via is formed, two metallization vias in internal layer A by 9 connections of one first printed wire.7 designs of the first back drill hole are on the mid point of two metallization vias of first group, and the degree of depth in the first back drill hole 7 requires to drill internal layer A, and bore first printed wire 9 in disconnected this internal layer.First printed wire, 9 width that connect via among the internal layer A than the diameter in back drill hole to 0.2mm when young.
Second group of metallization via 6 is 1.0mm by two diameters the metallization via is formed that two metallization vias design 10 connections of one second printed wire in inner layer B.8 designs of the second back drill hole are on the mid point of two metallization vias, and the degree of depth in the second back drill hole 8 is the same with the first back drill hole 7, requires only to drill internal layer A, can not get into inner layer B, and can not bore second printed wire 10 in the disconnected inner layer B.The width of second printed wire 10 that connects the metallization via in the inner layer B than the diameter in back drill hole to 0.2mm when young.
Referring to Fig. 3, after back drill is finished, use on off test instrument (as multimeter etc.) to test the break-make situation of first group of metallization via 5 and the break-make situation of second group of metallization via 6 respectively.
The test result of (1) first group of metallization via 5 is for opening circuit, and the test result of second group of metallization via 6 is a path, and then the back drill hole depth meets design requirement; As Fig. 3 a and Fig. 3 b.
The test result of (2) first groups of metallization vias 5 is for opening circuit, and the test result of second group of metallization via 6 is also for opening circuit, and then the back drill hole depth is dark excessively, does not arrive designing requirement; As Fig. 3 c and Fig. 3 d.
The test result of (3) first groups of metallization vias 5 is a path, and the test result of second group of metallization via 6 also is a path, and then the back drill hole depth is shallow excessively, does not reach designing requirement.As Fig. 3 e and Fig. 3 f.
According to the half-finished size of pcb board, can be in 1-2 back drill hole depth test-strips of every edges of boards design.
The electric performance test instrument can be easy on off test instrument, and the test that also can increase in the special test frame this test-strips realizes that robotization detects.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.
Claims (3)
1. a back drill backboard drilling depth proving installation is characterized in that, comprises two groups of instrument connections, and each group instrument connection comprises 2 metallization vias and 1 back drill hole;
2 of first group of instrument connection metallization vias internal layer by appointment is that first printed wire on the internal layer A connects conducting, and the first back drill hole is arranged between these two the metallization vias;
2 of second group of instrument connection metallization vias another internal layer by appointment is that second printed wire on the inner layer B connects conducting, and the second back drill hole is arranged between these two the metallization vias;
The degree of depth of inner layer B is greater than the degree of depth of internal layer A;
The projected depth in the first back drill hole and the second back drill hole is greater than the degree of depth of internal layer A, less than the degree of depth of inner layer B;
The width of first printed wire is less than the diameter in the first back drill hole;
The width of second printed wire is less than the diameter in the second back drill hole.
2. back drill backboard drilling depth proving installation according to claim 1 is characterized in that, the diameter of metallization via is 1.0mm.
3. according to each described back drill backboard drilling depth proving installation of claim 1～2, it is characterized in that, to 0.2mm when young, the width of second printed wire is than the diameter in second back drill hole 0.2mm extremely when young than the diameter in the first back drill hole for the width of first printed wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205583282U CN201828238U (en) | 2010-10-11 | 2010-10-11 | Back drill depth test device for back drill board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205583282U CN201828238U (en) | 2010-10-11 | 2010-10-11 | Back drill depth test device for back drill board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201828238U true CN201828238U (en) | 2011-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205583282U Expired - Fee Related CN201828238U (en) | 2010-10-11 | 2010-10-11 | Back drill depth test device for back drill board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201828238U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096643A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| CN103376050A (en) * | 2013-07-04 | 2013-10-30 | 深圳市五株科技股份有限公司 | Multilayer circuit board drilling depth test method |
| CN103517556A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Circuit board depth control type drilling depth determining method and circuit board |
| CN104567611A (en) * | 2013-10-25 | 2015-04-29 | 北大方正集团有限公司 | Method for detecting backdrilling depth |
| CN104582288A (en) * | 2015-01-14 | 2015-04-29 | 景旺电子科技(龙川)有限公司 | PCB back drilling plate back drilling depth detecting method |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105716563A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Through hole depth measurement device and drilling machine |
| CN105973177A (en) * | 2016-07-15 | 2016-09-28 | 广州兴森快捷电路科技有限公司 | Back drill stump nondestructive detection method and PCB nondestructive detection method |
| CN109540020A (en) * | 2018-11-27 | 2019-03-29 | 安徽四创电子股份有限公司 | A kind of optical detecting method and detection device of back drill depth |
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| CN111256578A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Method for detecting depth of back drilling plate |
| CN111830395A (en) * | 2020-07-14 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Method for detecting back drilling capability of circuit board |
| CN112797887A (en) * | 2020-11-17 | 2021-05-14 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
-
2010
- 2010-10-11 CN CN2010205583282U patent/CN201828238U/en not_active Expired - Fee Related
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013064048A1 (en) * | 2011-11-03 | 2013-05-10 | 北大方正集团有限公司 | Pcb back drill detection method and pcb plating |
| CN103096643B (en) * | 2011-11-03 | 2015-04-22 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| CN103096643A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| US9258885B2 (en) | 2011-11-03 | 2016-02-09 | Zhuhai Founder Tech Hi-Density Electronic Co Ltd. | PCB back drill detection method and PCB plating |
| CN103517556A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Circuit board depth control type drilling depth determining method and circuit board |
| CN103517556B (en) * | 2012-06-15 | 2016-12-21 | 深南电路有限公司 | A kind of circuit board depth control type drilling depth determining method and circuit board |
| CN103376050B (en) * | 2013-07-04 | 2016-03-30 | 深圳市五株科技股份有限公司 | Multilayer circuit board drilling depth method of testing |
| CN103376050A (en) * | 2013-07-04 | 2013-10-30 | 深圳市五株科技股份有限公司 | Multilayer circuit board drilling depth test method |
| CN104567611A (en) * | 2013-10-25 | 2015-04-29 | 北大方正集团有限公司 | Method for detecting backdrilling depth |
| CN105716563A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Through hole depth measurement device and drilling machine |
| CN105716563B (en) * | 2014-12-03 | 2018-05-01 | 北大方正集团有限公司 | Device for measuring depth of through hole and drilling machine |
| CN104582288A (en) * | 2015-01-14 | 2015-04-29 | 景旺电子科技(龙川)有限公司 | PCB back drilling plate back drilling depth detecting method |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105973177A (en) * | 2016-07-15 | 2016-09-28 | 广州兴森快捷电路科技有限公司 | Back drill stump nondestructive detection method and PCB nondestructive detection method |
| CN105973177B (en) * | 2016-07-15 | 2019-07-12 | 广州兴森快捷电路科技有限公司 | A kind of lossless detection method and PCB lossless detection method of back drill stub |
| CN109540020A (en) * | 2018-11-27 | 2019-03-29 | 安徽四创电子股份有限公司 | A kind of optical detecting method and detection device of back drill depth |
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| WO2021051647A1 (en) * | 2019-09-20 | 2021-03-25 | 胜宏科技（惠州）股份有限公司 | Back-drilling nondestructive testing method for pcb |
| CN111256578A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Method for detecting depth of back drilling plate |
| CN111830395A (en) * | 2020-07-14 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Method for detecting back drilling capability of circuit board |
| CN112797887A (en) * | 2020-11-17 | 2021-05-14 | 天津普林电路股份有限公司 | Depth test structure and method for back drilling hole layer of high-rise multilayer board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20121011 |