CN207181625U - Microelectronic testing module and system - Google Patents
Microelectronic testing module and system Download PDFInfo
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- CN207181625U CN207181625U CN201721204530.3U CN201721204530U CN207181625U CN 207181625 U CN207181625 U CN 207181625U CN 201721204530 U CN201721204530 U CN 201721204530U CN 207181625 U CN207181625 U CN 207181625U
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Abstract
The utility model belongs to product test technical field, there is provided a kind of microelectronic testing module and system.The microelectronic testing module includes typified form, probe and shell fragment, the top of typified form is provided with through hole, the bottom of typified form is provided with groove, probe is connected with shell fragment, and correspond and set, the other end of probe is located at through hole, and the other end of shell fragment is fixed in the groove of typified form bottom, and probe and shell fragment are conducting medium.The utility model microelectronic testing module and system, it is possible to increase stability and accurate testing degree, reduce maintenance rate and production cost.
Description
Technical field
It the utility model is related to product test technical field, and in particular to a kind of microelectronic testing module and system.
Background technology
In electronic product industry, product design requires less and less, and internal structure requirement is more and more accurate.In this ring
Under the background of border, the design of electronic product internal part is also less and less, and FPC or accurate compact PCBA applications are got over
Come more extensive.Due to the small precision that part becomes, the contact connected between part is less and less, therefore, before part shipment
Quality control, service check difficulty increasingly increase.
Generally, when quality control, service check are carried out before part shipment, the signal between part and test system IO ends
Connection realizes detection rapidly and efficiently by the way of elastic probe.
The connected mode being presently used between component contact and test system, mainly using probe, micropin, double ended probes,
The modes such as connector, pcba, the side that the detection for small precise part is mainly connected using double ended probes or micropin
Formula.The module of such mode, which is mainly processed several precision components by CNC and is assembled together with double ended probes or micropin, to be formed, and is visited
Pin end thereof contacts component contact, the IO ends of other end engaged test system, realizes the connection between component contact and test system.
But there are the following problems for present test structure：
Firstth, cost is high：The monovalent higher of double ended probes, the micropin of module needs etc. is formed, the single price of double-ended needle is big
About 10~30 yuan/PCS, the price of micropin is higher, about 20~40 yuan/PCS, and precision component manufacturing man-hours length, yields is low, makes
Manufacturing cost remains high.
Secondth, difficulty of processing is big and the process-cycle is grown：The precision component of CNC processing, particularly fixed double-ended needle and micropin
Part, because element precision requires higher, and have very high requirement to process equipment and manufacturing process, add difficulty of processing
Greatly, non-defective unit output capacity is relatively low, causes the part manufacturing cycle to grow, influences corresponding efficiency.
3rd, service life is low：During use, the easy bending of double ended probes, lose elastic force and damage, frequency of maintenance and into
This is all very high.
4th, it is inconvenient to safeguard：After needle mould damage, when changing double-ended needle and micropin, whole needle mould need to be dismantled, do not noted slightly
Meaning is easy for breaing up the assembly relation of whole needle mould and pin, and therefore, needle mould need to be assembled again, causes to safeguard a pin
The mould consuming time is excessive, is normally produced so as to influence producing line.
5th, off-gauge design：Due to the variation of test component, plus current test mode, so that this mould
Block needs to follow the change of part and ceaselessly change mounting means, increases designer's workload, causes the wasting of resources.
The stability and accurate testing degree of microelectronic testing module are how improved, maintenance rate and production cost is reduced, is
The problem of those skilled in the art's urgent need to resolve.
Utility model content
The utility model is intended to one of technical problem at least solving in correlation technique to a certain extent.
Therefore, the first purpose of the present utility model is to propose a kind of microelectronic testing module and system, particular technique side
Case is as follows：
In a first aspect, the utility model provides a kind of microelectronic testing module, the microelectronic testing module includes stock mould
Plate, probe and shell fragment, the top of typified form are provided with through hole, and the bottom of typified form is provided with groove, and probe is connected with shell fragment, and one
One is correspondingly arranged, and the other end of probe is located at through hole, and the other end of shell fragment is fixed in the groove of typified form bottom, probe and bullet
Piece is conducting medium.
Further, typified form includes the probe fixed plate and shell fragment fixed plate being fixedly connected, the top for fixed plate of popping one's head in
Portion is provided with through hole, and the bottom of shell fragment fixed plate is provided with groove.
Based on above-mentioned any microelectronic testing module embodiments, further, probe and shell fragment are multiple.
Further, the outer surface of probe is high conduction electrodeposited coating.
Further, the end shape of probe is pawl head, tip, round end or conical head.
Further, the outer surface of shell fragment is high conduction electrodeposited coating.
Further, the middle part for fixed plate of popping one's head in is provided with projection, and through hole is positioned at raised top.
Second aspect, the utility model provide a kind of microelectronic testing system, and the system includes：Microelectronic testing module,
Test system fixed plate and test system IO ends, microelectronic testing module include typified form, probe and shell fragment, typified form
Top is provided with through hole, and the bottom of typified form is provided with groove, and probe is connected with shell fragment, and is corresponded and set, the other end of probe
Positioned at through hole, the other end of shell fragment is fixed in the groove of typified form bottom, and probe and shell fragment are conducting medium, test system
Fixed plate is fixed on microelectronic testing module both sides, and test system IO ends are located at microelectronic testing module bottom, and connect with shell fragment
Connect, in unit test, the parts to be tested is connected by probe and shell fragment with test system IO ends.
The present embodiment provides microelectronic testing module and system, using the typified form of microelectronic testing module, probe and
Shell fragment, the module of probe, double ended probes or micropin used in current technology and the precision component composition of CNC processing is replaced,
So as to improve the stability of microelectronic product test, extended testing system module service life, it is adapted to bulk production, reduces processing
In the cycle, reduce enterprise procurement cost.Also, the compatible a variety of products of different specifications of test of microelectronic testing module, help to subtract
The design time of few designer, improve the maintenance efficiency of attendant.Probe and shell fragment are arranged to conducting medium, transmission letter
It is number more stable, cross that electric energy power is strong, test is more accurate.Microelectronic testing module is fixed test system fixed plate, improves and surveys
The stability of examination process, ensure that the parts to be tested is stably connected with test system IO ends.
Brief description of the drawings
, below will be right in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art.In all of the figs, it is similar
Element or part are typically identified by similar reference.In accompanying drawing, each element or part might not be according to the ratios of reality
Draw.
Fig. 1 shows a kind of structural representation of microelectronic testing module provided by the utility model；
Fig. 2 shows a kind of partial structural diagram provided by the utility model；
Fig. 3 shows a kind of top view of microelectronic testing module provided by the utility model；
Fig. 4 shows a kind of sectional view of microelectronic testing system provided by the utility model.
Embodiment
The embodiment of technical solutions of the utility model is described in detail below in conjunction with accompanying drawing.Following examples are only
For clearly illustrating the technical solution of the utility model, therefore example is intended only as, and this reality can not be limited with this
With new protection domain.
It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application should be this reality
The ordinary meaning understood with new one of ordinary skill in the art.
The microelectronic testing module and system that the utility model embodiment is provided, industry is tested suitable for electronic product,
Can testing electronic parts include FPC, FFC, PCB, PCBA electronic product etc. any one, be especially practically applicable to signalling contact signal
Switching, as plate to partitioned signal contact, plate to line signalling contact, substrate to FPC signalling contacts, FPC FFC signalling contacts, golden hand
Finger, TP points etc..
In a first aspect, a kind of microelectronic testing module that the utility model embodiment is provided, with reference to Fig. 1 or Fig. 2, this is micro-
Electronic Testing module includes typified form 1, probe 2 and shell fragment 3, the top of typified form 1 and is provided with through hole, the bottom of typified form 1
Portion is provided with groove, and probe 2 is connected with shell fragment 3, and corresponds setting, and 2 other end of popping one's head in is located at through hole, the other end of shell fragment 3
It is fixed in the groove of the bottom of typified form 1, probe 2 and shell fragment 3 are conducting medium.
The microelectronic testing module that the present embodiment provides, using typified form 1, probe 2 and shell fragment 3, replace current technology
Used in probe, double ended probes or micropin and CNC processing precision component composition module, so as to improve microelectronic product
The stability of test, extended testing system module service life, its service life time are 10 times of current probe structure, are adapted to criticize
The production of amount property, reduces the process-cycle, reduces enterprise procurement cost.Also, the compatible test of the present embodiment microelectronic testing module
A variety of products of different specifications, help to reduce the design time of designer, improve the maintenance efficiency of attendant.Meanwhile this
Embodiment microelectronic testing module will pop one's head in 2 and shell fragment 3 be arranged to conducting medium, by diameter and larger-size conductive material
Processing, its internal resistance resistance is low, increases electric energy power, avoids the occurrence of in test process because of short circuit, or electric current is excessive and what is occurred hit
Wear or burn phenomenon, enhancing stable signal transmission, test are more accurate.
In order to further improve the stability of the present embodiment microelectronic testing module, typified form 1 includes what is be fixedly connected
Probe fixed plate and shell fragment fixed plate, the top for fixed plate of popping one's head in are provided with through hole, and the bottom of shell fragment fixed plate is provided with groove, stability
By force, it is convenient to take out and install.
Specifically, with reference to Fig. 3, locating slot 5 is additionally provided with the top of fixed plate of popping one's head in, locating slot 5 is used to fix the parts to be tested,
In order to carry out precise positioning to the parts to be tested.
Specifically, pop one's head in be multiple, particular number can determine according to the signalling contact of the parts to be tested, and it has good lead
Electrical property, main raw material(s) are copper, steel, and 2 outer surface of popping one's head in is the high conduction electrodeposited coating such as layer gold or nickel dam, prevents material oxygen
Change, strengthen electric conductivity.The end shape of probe 2 is pawl head, tip, round end or conical head, can be entered according to electronic unit to be measured
Row is set, and strengthens measuring stability.The diameter of each probe 2 is distributed in 0.05~0.8mm any specifications, mutual minimum
Distance can accomplish 0.05mm.
Specifically, shell fragment is multiple that particular number can determine according to the signalling contact of the parts to be tested, and it has good lead
Electrical property, main raw material(s) are copper, steel, and material surface processing is the high conduction electrodeposited coatings such as gold-plated or nickel plating, prevents material oxygen
Change, strengthen electric conductivity.Shell fragment 3 can be one or more, and with certain elastic and good electric conductivity, can make
Contact is completely embedded between probe 2, test system IO ends 7, it is ensured that the stability of test.The manufacture of shell fragment 3 can pass through mould
The any-modes such as tool punching, Laser Processing, electric spark, line are cut, CNC manufacture, and shell fragment 3 is possessed certain elasticity.
Specifically, the middle part for fixed plate of popping one's head in is provided with projection, and locating slot 5 and through hole are respectively positioned on the top of projection, in order to
Microelectronic testing module is fixed.Probe fixed plate has good insulating properties, it is ensured that will not be short-circuit between probe 2, visit
By machine one-shot forming, accuracy is high for head fixed plate and shell fragment fixed plate, after can installing probe 2, between each other
Minimum range can accomplish that 0.05mm, position have higher uniformity, and part can be accurately positioned.Probe is solid
Fixed board and the equal manufacture of shell fragment fixed plate, can be manufactured by either types such as mold injection molding, 3D printing, CNC.
Second aspect, a kind of microelectronic testing system that the utility model embodiment is provided, with reference to Fig. 4, the microelectronics
Test system includes：Microelectronic testing module, test system fixed plate 6 and test system IO ends 7, microelectronic testing module includes
Typified form 1, probe 2 and shell fragment 3, the top of typified form 1 are provided with through hole, and the bottom of typified form 1 is provided with groove, pop one's head in 2 and
Shell fragment 3 connects, and corresponds and set, and 2 other end of popping one's head in is located at through hole, and the other end of shell fragment 3 is fixed on the bottom of typified form 1
In the groove in portion, probe 2 and shell fragment 3 are conducting medium, and test system fixed plate 6 is fixed on microelectronic testing module both sides, are surveyed
Test system IO ends 7 are located at microelectronic testing module bottom, and are connected with shell fragment 3, and in unit test, the parts to be tested passes through probe
2 and shell fragment 3 be connected with test system IO ends 7.
In practical application, one end of probe 2 is in contact with electronic product components contact, 2 other ends of probe and shell fragment 3 one
End in contact, the other end of shell fragment 3 are connected with test system IO ends 7, and certain pressure is provided by tester table, make shell fragment 3 by one
Fixed compression, it is ensured that be in close contact between electronic product components contact, probe 2, shell fragment 3 and test system IO ends 7, realize electronics
Part and the signal of test system transmit, and are tested.
The present embodiment provides microelectronic testing system, using the typified form 1 of microelectronic testing module, probe 2 and shell fragment
3, the module of probe, double ended probes or micropin used in current technology and the precision component composition of CNC processing is replaced, so as to
The stability of microelectronic product test is improved, extended testing system module service life, is adapted to bulk production, reduces processing week
Phase, reduce enterprise procurement cost.Also, the compatible a variety of products of different specifications of test of microelectronic testing module, help to reduce
The design time of designer, improve the maintenance efficiency of attendant.Probe 2 and shell fragment 3 are arranged to conducting medium, transmission letter
It is number more stable, cross that electric energy power is strong, test is more accurate.Microelectronic testing module is fixed test system fixed plate 6, improves and surveys
The stability of examination process, ensure that the parts to be tested is stably connected with test system IO ends 7.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present utility model.In this manual, to the schematic table of above-mentioned term
State and be necessarily directed to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be with
Combined in an appropriate manner in any one or more embodiments or example.In addition, in the case of not conflicting, this area
Technical staff the different embodiments or example and the feature of different embodiments or example described in this specification can be entered
Row combines and combination.
Finally it should be noted that：Various embodiments above is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the utility model is described in detail with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：It can still modify to the technical scheme described in foregoing embodiments, either to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly
The scope of each embodiment technical scheme of type, it all should cover among claim of the present utility model and the scope of specification.
Claims (8)
- A kind of 1. microelectronic testing module, it is characterised in that including：Typified form, probe and shell fragment,The top of the typified form is provided with through hole, and the bottom of the typified form is provided with groove,The probe is connected with the shell fragment, and is corresponded and set,The other end of the probe is located at the through hole,The other end of the shell fragment is fixed in the groove of the typified form bottom, and the probe and the shell fragment are conductive Jie Matter.
- 2. microelectronic testing module according to claim 1, it is characterised in thatThe typified form includes the probe fixed plate and shell fragment fixed plate being fixedly connected,The top of the probe fixed plate is provided with the through hole,The bottom of the shell fragment fixed plate is provided with the groove.
- 3. microelectronic testing module according to claim 1, it is characterised in thatThe probe and the shell fragment are multiple.
- 4. microelectronic testing module according to claim 3, it is characterised in thatThe outer surface of the probe is high conduction electrodeposited coating.
- 5. microelectronic testing module according to claim 3, it is characterised in thatThe end shape of the probe is pawl head, tip, round end or conical head.
- 6. microelectronic testing module according to claim 3, it is characterised in thatThe outer surface of the shell fragment is high conduction electrodeposited coating.
- 7. microelectronic testing module according to claim 2, it is characterised in thatThe middle part of the probe fixed plate is provided with projection,The through hole is located at the raised top.
- A kind of 8. microelectronic testing system, it is characterised in that including：Microelectronic testing module, test system fixed plate and test system IO ends,The microelectronic testing module includes typified form, probe and shell fragment,The top of the typified form is provided with through hole, and the bottom of the typified form is provided with groove,The probe is connected with the shell fragment, and is corresponded and set,The other end of the probe is located at the through hole,The other end of the shell fragment is fixed in the groove of the typified form bottom, and the probe and the shell fragment are conductive Jie Matter,The test system fixed plate is fixed on the microelectronic testing module both sides,The test system IO ends are located at the microelectronic testing module bottom, and are connected with the shell fragment,In unit test, the parts to be tested is connected by the probe and the shell fragment with the test system IO ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721204530.3U CN207181625U (en) | 2017-09-18 | 2017-09-18 | Microelectronic testing module and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721204530.3U CN207181625U (en) | 2017-09-18 | 2017-09-18 | Microelectronic testing module and system |
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| Publication Number | Publication Date |
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| CN207181625U true CN207181625U (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721204530.3U Active CN207181625U (en) | 2017-09-18 | 2017-09-18 | Microelectronic testing module and system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919007A (en) * | 2018-07-16 | 2018-11-30 | 常州信息职业技术学院 | Microelectronic testing system |
| CN113607991A (en) * | 2021-07-24 | 2021-11-05 | 深圳市欧米加智能科技有限公司 | Stacking complementary microneedle and high-current testing device thereof |
-
2017
- 2017-09-18 CN CN201721204530.3U patent/CN207181625U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919007A (en) * | 2018-07-16 | 2018-11-30 | 常州信息职业技术学院 | Microelectronic testing system |
| CN113607991A (en) * | 2021-07-24 | 2021-11-05 | 深圳市欧米加智能科技有限公司 | Stacking complementary microneedle and high-current testing device thereof |
| CN113607991B (en) * | 2021-07-24 | 2022-06-28 | 深圳市欧米加智能科技有限公司 | Stacking complementary microneedle and high-current testing device thereof |
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