CN211856799U - Integrated circuit IC carrier board post-balling test instrument - Google Patents

Abstract

The utility model discloses an integrated circuit IC carrier board post-balling test instrument, comprising a fixture structure board and a probe structure, the probe structure includes a probe connecting line, a square probe, and a connection between the probe connecting line and the square probe. The ends are connected. The square probe includes the target body and the raised ribs arranged on the end face of the target body. The cross section of the target body is rectangular, and the vertical projected area of the target body is larger than the vertical projected area of the raised ribs; the fixture structure board includes the upper part. The structural board, the lower structural board, and the circuit board to be tested are provided with several spherical test contact positions, the fixture structural board and the probe structure are close to the circuit board to be tested, and the raised rib contacts the spherical test contact position for testing. Testing through the target body reduces the distance between adjacent target bodies, thereby reducing the contact area of the probes. Due to the guiding nature of the target, the distance between the needles can be minimized to meet the solder ball testing requirements for smaller PCB boards.

Description

Integrated circuit IC carrier board post-balling test instrument

technical field

The utility model relates to the field of testing, in particular to an integrated circuit IC carrier board post-balling testing instrument.

Background technique

At present, PCB, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support body for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. Almost every electronic device, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between the various components, use printed circuit boards. plate. The printed circuit board consists of an insulating base plate, connecting wires and pads for assembling and soldering electronic components, and has the dual functions of a conductive circuit and an insulating base plate. It can replace complex wiring and realize the electrical connection between components in the circuit, which not only simplifies the assembly and welding of electronic products, reduces the workload of wiring in the traditional way, and greatly reduces the labor intensity of workers; it also reduces the size of the whole machine. volume, reduce product cost, and improve the quality and reliability of electronic equipment. The printed circuit board has good product consistency, and it can adopt standardized design, which is conducive to the realization of mechanization and automation in the production process. At the same time, the entire printed circuit board that has been assembled and debugged can be used as an independent spare part, which is convenient for the exchange and maintenance of the whole product. At present, printed circuit boards have been widely used in the manufacture of electronic products.

However, the existing solder ball testing has the following drawbacks:

Please refer to FIG. 3, which is a side view of the prior art. Two pogo pins are arranged on the jig board. Two pogo pins are designed on the tin balls of the PCB board to contact the product for testing. It is composed of an outer layer of spring casing, and the design structure occupies a large space and cannot meet the solder ball test of smaller PCB boards.

Utility model content

In order to overcome the deficiencies of the prior art, one of the objectives of the present invention is to provide an integrated circuit IC carrier board post-ball testing instrument, which can solve the problem of solder ball testing of small PCB boards.

One of the purposes of the present utility model adopts the following technical scheme to realize:

An integrated circuit IC carrier board post-balling test instrument, including a fixture structure board and a probe structure, the probe structure includes a probe connection line and a square probe, the probe connection line and the square probe The square probe includes a target body and a raised rib arranged on the end face of the target body, the cross section of the target body is rectangular, and the vertical projected area of the target body is larger than the vertical projection of the raised rib. Projected area; the fixture structure board includes an upper structure board and a lower structure board, and the upper structure board and the lower structure board are fixed by screws; the target body is fixed on the upper structure board and the lower structure board ; A number of spherical test contact positions are arranged on the circuit board to be tested. During testing, the fixture structure board and the probe structure approach the circuit board to be tested, and the raised rib contacts the spherical test contact bit to test.

Further, the upper structural board is parallel to the lower structural board, and the probe connecting lines are perpendicular to the lower structural board.

Further, the lower end surface of the raised rib is provided with an arc-shaped end surface, and the arc-shaped end surface faces the spherical test contact position.

Further, the side end surface of the raised rib is flush with the side end surface of the main body of the guideline.

Further, the number of the probe structures is an even number, and the probe structures are correspondingly disposed on the jig structure plate in pairs.

Further, in the two corresponding probe structures, the raised ribs are distributed on the inner sides of the two probe structures.

Further, the main body of the guideline is perpendicular to the raised rib.

Further, the vertical projected area of the main body of the guideline is 2-3 times the vertical projected area of the raised rib.

Compared with the prior art, the beneficial effects of the present utility model are:

The cross section of the target body is rectangular, and the vertical projection area of the target body is larger than the vertical projection area of the raised rib; the fixture structural board includes an upper structural board, a lower structural board, the upper structural board and the The lower structure board is fixed by screws; the target body is fixed on the upper structure board and the lower structure board; a number of spherical test contact positions are set on the circuit board to be tested. During testing, the fixture structure board and the probe structure approaches the circuit board to be tested, and the raised rib contacts the spherical test contact position for testing. Testing through the target body reduces the distance between adjacent target bodies, thereby reducing the contact area of the probes. Due to the guiding nature of the target, the distance between the needles can be minimized, and the tinning of smaller PCBs can be achieved. Ball test requirements.

The above description is only an overview of the technical solution of the present invention, in order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present invention better. It is obvious and easy to understand, and the preferred embodiments are exemplified below, and the detailed description is as follows in conjunction with the accompanying drawings.

Description of drawings

1 is a structural diagram of the application;

FIG. 2 is another structural diagram of the application.

FIG. 3 is a structural diagram of a solder ball test in the prior art.

In the figure: 100. Test instrument after ball-planting of integrated circuit IC carrier board; 10. Fixture structure board; 11. Upper structure board; 12. Lower structure board; 20. Probe structure; 21. Probe connection line; Square probe; 221, target body; 222, raised edge; 2221, curved end face; 30, circuit board to be tested; 31, spherical test contact position; 200, fixture plate; 300, pogo pin.

Detailed ways

Hereinafter, the present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be noted that, on the premise of no conflict, the embodiments or technical features described below can be combined arbitrarily to form new implementations. example.

It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be a centered component. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a co-existence of an intervening component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a co-existing centered component. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for illustrative purposes only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIGS. 1-3 . The test instrument 100 after ball-mounting the IC carrier board includes a jig structure board 10 and a probe structure 20 . The probe structure 20 includes probe connecting lines 21 and square probes 22 . The probe connecting line 21 is connected to the end of the square probe 22. The square probe 22 includes a target main body 221 and a raised rib 222 disposed on the end surface of the target main body 221. The cross section of the target main body 221 is a Rectangular, the vertical projected area of the main body 221 is larger than the vertical projected area of the raised rib 222; the jig structural board 10 includes an upper structural board 11, a lower structural board 12, the The lower structure board 12 is fixed by screws; the target body 221 is fixed to the upper structure board 11 and the lower structure board 12 ; the circuit board 30 to be tested is provided with a number of spherical test contact positions 31 , during testing, the The jig structure board 10 and the probe structure 20 are close to the circuit board 30 to be tested, and the raised ribs 222 are in contact with the spherical test contact positions 31 for testing. Testing through the target main body 221 reduces the distance between adjacent target main bodies 221, thereby reducing the contact area of the probes. Since the target is oriented, the distance between the needles can be minimized, so that it can be used for smaller PCB boards. solder ball testing requirements.

In a specific application process, the jig plate 200 is used to fix the pogo pin 300, and the pogo pin 300 includes a pin and an outer spring sleeve, which enlarges the whole pogo pin 300. In this application, the width of the guide body 221 can be adjusted to be as large as the needle itself in the pogo pin 300, further reducing the contact area of the probe.

Preferably, the upper structural board 11 is parallel to the lower structural board 12 , and the probe connecting lines 21 are perpendicular to the lower structural board 12 . The lower end surface of the raised rib 222 is provided with an arc-shaped end surface 2221 , and the arc-shaped end surface 2221 faces the spherical test contact position 31 . Improve the stability of the test, for vertical testing, to avoid deviation.

Preferably, please refer to FIG. 2 in detail, the side end surface of the raised rib 222 is flush with the side end surface of the target body 221 . The purpose of this arrangement is to further reduce the contact area of the probes. The number of the probe structures 20 is an even number, and the probe structures 20 are correspondingly disposed on the jig structure board 10 two by two. In the two corresponding probe structures 20 , the raised ribs 222 are distributed on the inner sides of the two probe structures 20 . By setting in this way, it can be applied to a test with a smaller contact area.

Preferably, the target body 221 is perpendicular to the raised rib 222 . The vertical projected area of the target body 221 is 2-3 times the vertical projected area of the raised rib 222 . The structure is novel, the design is ingenious, the applicability is strong, and it is easy to promote.

The above-mentioned embodiments are only the preferred embodiments of the present invention, and the scope of protection of the present invention cannot be limited by this. Any insubstantial changes and replacements made by those skilled in the art on the basis of the present invention belong to the scope of the present invention. The scope of protection of the present utility model.

Claims (8)

1. The utility model provides an integrated circuit IC support plate test instrument after balling, includes tool structural slab and probe structure, its characterized in that:

the probe structure comprises a probe connecting line and a square probe, the probe connecting line is connected with the end part of the square probe, the square probe comprises a square needle main body and a raised edge arranged on the end surface of the square needle main body, the cross section of the square needle main body is rectangular, and the vertical projection area of the square needle main body is larger than that of the raised edge;

the jig structure plate comprises an upper structure plate and a lower structure plate, and the upper structure plate and the lower structure plate are fixed through screws; the guideline body is secured to the upper structural plate and the lower structural plate;

the test device comprises a jig structure plate, a probe structure, a spherical test contact position and a plurality of convex edges, wherein the jig structure plate and the probe structure are arranged on a circuit board to be tested, and the convex edges are contacted with the spherical test contact position to test.

2. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the upper structural plate is parallel to the lower structural plate, and the probe connecting lines are perpendicular to the lower structural plate.

3. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the lower end face of the convex ridge is provided with an arc-shaped end face, and the arc-shaped end face is right opposite to the spherical test contact position.

4. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the side end face of the convex edge is flush with the side end face of the square needle main body.

5. The IC carrier ball mounting post-test instrument according to claim 4, wherein: the number of the probe structures is even, and every two probe structures are correspondingly arranged on the jig structure plate.

6. The integrated circuit IC carrier ball mounting post-test instrument according to claim 5, wherein: in two corresponding probe structures, the convex ribs are distributed on the inner sides of the two probe structures.

7. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the square needle main body is perpendicular to the convex edges.

8. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the vertical projection area of the square needle main body is 2-3 times of the vertical projection area of the convex edge.

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