CN102478594B - High-frequency vertical spring probe card structure - Google Patents
High-frequency vertical spring probe card structure Download PDFInfo
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- CN102478594B CN102478594B CN201110326197.4A CN201110326197A CN102478594B CN 102478594 B CN102478594 B CN 102478594B CN 201110326197 A CN201110326197 A CN 201110326197A CN 102478594 B CN102478594 B CN 102478594B
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- probe
- contact element
- card structure
- probe card
- vertical type
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- 239000000523 sample Substances 0.000 title claims abstract description 167
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 abstract description 20
- 230000008859 change Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 15
- 238000013461 design Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The invention discloses a high-frequency vertical elastic sheet probe card structure, which comprises a first contact piece, a probe main body, a second contact piece and the like, wherein the first contact piece and the second contact piece are used as contact points for electrically contacting with an external member when the probe main body is compressed, the probe main body is provided with a plurality of elastic bodies and a plurality of embedded combination grooves, so that the plurality of probes can be mutually embedded together and bear the deformation elasticity when being compressed in the vertical direction, and the elastic bodies can change the thickness of the elastic bodies or increase the embedding quantity of the probes along with the needle pressure requirement of a test product. The probe with the structure of the invention has a simpler structure than the spring probe in the prior art to assemble a module, and provides a variable elastic body, thereby prolonging the service life of the probe.
Description
Technical field
The present invention relates to a kind of probe structure, particularly relating to a kind of Hf vertical type shrapnel probe card structure, is a kind of innovation shape design of miniature probe, can apply to the chip testing of high-frequency high-speed, possess can be by the elasticity of longitudinal compression time, still maintain contact condition good in test process.
Background technology
Probe is mainly used in before IC not yet encapsulates, being aided with relevant testing tool and software, does the operation of various functions test, thereby filters out defective products, the encapsulation engineering after non-defective unit carries out again for naked crystalline substance with probe.
Due to the continuous evolution of integrated circuit manufacture process, live width and spacing between circuit are dwindled day by day, and the probe demand of using when test, also the cantalever type probe of from needle point bending, laterally placing, changes the vertical probe that the spacing between pin footpath more tiny, more intensive and probe and probe more narrows into.In addition, the process technique of vertical probe, can be divided into the spring probe forming with machining, or with chemical etching, makes the probe of various geometric cross section, or make multilayer microprobe with micro electronmechanical processing procedure, or the dark etching model of micro-shadow (LIGA) technology is made etc.As shown in Figure 1, it is existing traditional vertical probe, probe 90 is by cylindrical portion 91, contact end face 92, 94 4 necessary parts of bearing 93 and Wound-rotor type spring form, its contact end face 92 is wherein one end of probe 90, in order to do in electrical contact to naked crystalline substance, the other end contacts on circuit board, and the inside of described cylindrical portion 91 is comprised of a bearing 93 and a Wound-rotor type spring, the periphery of its bearing 93 is wound around by Wound-rotor type spring 94, in order to increase deformation quantity and the elasticity of probe, by four steps like this, and complete the composition of a probe in probe.
But, the probe of above-mentioned prior art, a multi-step and more complicated package assembly, as considered, probe needs thousands of manufactured assemblings, the required time of expending of composition of each root probe is longer, causes expending of cost also considerable, and the contact end face of described probe is cylinder solid shape, during its shape contact chip, also cannot reach the requirement that the spacing of pin and pin is more dwindled, therefore the present invention proposes a kind of Hf vertical type shrapnel probe card structure to improve above-mentioned demand conception.
Summary of the invention
Technical matters to be solved by this invention is: in order to make up the deficiencies in the prior art, providing a kind of Hf vertical type shrapnel probe card structure, is the innovative design of a miniature probe structure, can be used among the apparatus for testing chip of high-frequency high-speed.
The probe of described Hf vertical type shrapnel probe card structure can be made the electric connection conductive component between IC assembly and circuit board.
In the middle of the probe of described Hf vertical type shrapnel probe card structure, partly having it presents the nonconforming elasticity of flexure up and down, described innovative design is born reacting force size depending on described probe and is determined the formation of its body, use this simply to design, the maximum deformation quantity can bear when increasing pressurized.
Hf vertical type shrapnel probe card structure of the present invention is by the following technical solutions:
The pointed shape of the probe of described Hf vertical type shrapnel probe card structure can have a sharp knife shape or knife back shape, it mainly comprises the parts such as the first contact element, probe body and the second contact element, described the first contact element and described the second contact element were used for and external member contact point in electrical contact as when compression, described probe body has at least one elastic body and at least one embedding combination slot is combined into, and bears the elasticity of distortion when being compressed by vertical direction.
Described the first contact element and described the second contact element, its shape can be a circular arc camber body, taper, plane body or zigzag body.
The described embedding combination slot of described probe body has at least one projection.
The described embedding combination slot of described probe body also has at least one slotted eye, causes corresponding at least one projection to be entrenched togather.
Described elastomeric described embedding combination slot, its projection can be a cylinder solid shape or square cubic shape.
Described elastomeric described embedding combination slot, its slotted eye can be a through hole shape body or groove body.
Described elastic body can be bending type body.
The cross section area of described elastomeric described bending type body is not identical, and being upper and lower flexure type body can be inconsistent state.
Described at least two first contact elements or the second contact element can contact on same tin ball simultaneously.
Therefore,, according to technique scheme, Hf vertical type shrapnel probe card structure of the present invention at least has following advantages and beneficial effect:
(1) this kind of Hf vertical type shrapnel probe card structure, its simple structure, assembling that embeds combination is easy, makes the greatly minimizing consuming time completing at probe assembling;
(2) hold the narration of an advantage, the assembling of probe described in it, man-hour expend and cost cost also significantly reduces;
(3) its side view of this Hf vertical type shrapnel probe card structure is comparatively flat, can put more probes to probe, and the spacing of needle point and needle point is also come to such an extent that more dwindle compared with traditional type probe structure, reach thousands of probe demand at present;
(4) this Hf vertical type shrapnel probe card structure, also can use two probes to be contacted with on same tin ball, and the design of other end contact point strengthens spacing, on it, be contacted with on different circuit boards, and reach resistance to electric current and proof voltage effect, reduce the interference of probe to signal, thereby reach accurate measurement and promote measuring current and the power bracket of chip.
Hereby for making your auditor can have further Liao to separate for the present invention, and for the personnel of same technical field can be implemented according to this according to this description and embodiment, therefore with one preferred embodiment, coordinate element numbers graphic, same components to indicate to illustrate, structure content of the present invention is described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the stereographic map of prior art spring probe structure.
Fig. 2 is the textural association schematic perspective view of the first embodiment of the present invention.
Fig. 3 is that the textural association of the first embodiment of the present invention is arranged schematic diagram.
Fig. 4 A is the decomposing schematic representation of the first embodiment of the present invention.
Fig. 4 B is the assembling schematic diagram of the first embodiment of the present invention.
Fig. 5 is the decomposing schematic representation of the second embodiment of the present invention.
Fig. 6 is the first embodiment of the present invention diagrammatic cross-section in use.
Fig. 7 A is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 7 B is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 7 C is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 7 D is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 7 E is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 7 F is the another kind of shape schematic diagram of probe contact tip of the present invention.
Fig. 8 is probe contact tip of the present invention position schematic diagram.
Wherein, description of reference numerals is as follows:
1,1A, 1B, probe 11,11A the first contact element
90
12,12A, the second contact element 13 probe bodies
12B、12C、
12D、12E、
12F
14 elastic bodys 15 embed combination slot
2 probe 3 circuit boards
The prominent pad of 31 signal metal contact 4 fixed cells
41 accommodation space 5 testing components
51 tin ball 91 cylindrical portion
92 contact end face 93 bearings
94 Wound-rotor type springs
Embodiment
Please refer to Fig. 2, Fig. 2 is the textural association schematic perspective view of the first embodiment of the present invention.Probe 1 of the present invention is mainly comprised of the first contact element 11, the second contact element 12, probe body 13, and described the first contact element 11 is used for during as compression with described the second contact element 12 and external member contact point in electrical contact; Described probe body 13 centre positions are to be combined into multiple embedding combination slots 15 by multiple elastic bodys 14, in order to maintain the distortion elasticity that can bear pressure when described probe 1 is compressed by vertical direction.
Please refer to Fig. 3, Fig. 3 is that the textural association of the first embodiment of the present invention is arranged schematic diagram.Except the combination of the above-mentioned embedded combined member of probe, also have the two flat design probes 1 that each self-embedding has been combined to do neat being arranged in parallel, the plane of its arrangement is the side of probe, namely the long-pending comparatively narrow side of detecting probe surface; Probe 1, with the design of flat, contributes to dwindle the spacing after multiple probes 1 are arranged, and the second contact element 12 of two probes 1 can be pricked on same tin ball simultaneously, and the distance of needle point and needle point is also more close.Thus, the more probe 1 of more number can be set on testing component of the same area or circuit board, meet the at present proving installation of thousands of up to ten thousand number of probes, and realized the ideal that reaches area via arrangement and effectively utilize and have more the test combination of benefit.
Please also refer to Fig. 4 A and Fig. 4 B, Fig. 4 A and Fig. 4 B are STRUCTURE DECOMPOSITION schematic diagram and the structure assembling schematic diagram thereof of the first embodiment of the present invention.In the present embodiment, described probe 1 has probe 1A, probe 1B, the probe centre position of described probe 1A and probe 1B and probe body 13 all have multiple elastic bodys 14 and embed combination slot 15, described multiple elastic body 14 is the state of upper and lower nonuniformity or upper and lower asymmetry, described elastic body 14 is bending type bodies, when the first contact element is pressed down strength, and according to its stressed degree, adjust the size of the cross-sectional area of its flexure type body, so, elastic body can pressurized reacting force can not cause because pressurized is excessive distortion or under repeated action pressure, produce the situation of broken needle, therefore can effectively continue the serviceable life of probe.Above-mentioned probe 1A and probe 1B, its difference is that described embedding combination slot 15 is to have respectively projection 16A and slotted eye 16B, described projection 16A can be a cylinder solid shape or square cubic shape, and described slotted eye 16B can be perforation shape body or groove body, suppose that described probe 1A has multiple projection 16A, described probe 1B has the multiple slotted eye 16B corresponding to the projection 16A of probe 1A, that is to say, wherein a probe has a projection, another corresponding probe has the recess hole of cooperation, can do thus a chimeric action, complete an embedding combination slot 15, this invention does not limit probe 1A and has projection 16A, probe 1A also can have slotted eye 16B, as long as two probes can be in correspondence with each other, by this chimeric action, cause probe 1A and probe 1B to be together with each other, as shown in the probe 1 of Fig. 4 B, complete a stereo structure probe structure, but this is a kind of embodiment of the present invention, therefore do not limit the scope of the invention.
Please refer to Fig. 5, Fig. 5 is the another kind of decomposing schematic representation of the second embodiment of the present invention.In use, not limitting can only two mutual chimeric use, also can be by multiple structures that combine a stereo structure for probe 1 of the present invention.By two probe 1A and a probe 1B in the present embodiment, three chimeric probe structure that form a stereo structure of probe.Described probe 1B has multiple slotted eye 16B, also coordinate multiple projection 16A of probe 1A corresponding, during assembling two slotted eye 16B simultaneously clip in a corresponding projection 16A, two probe 1A and a probe 1B are together with each other, so form more than one Hf vertical type shrapnel probe card structures that combine, and the more test of high voltage and electric current can be provided.
Please refer to Fig. 6, Fig. 6 is the first embodiment of the present invention diagrammatic cross-section in use.Described probe 2 has a circuit board 3, fixed cell 4 and multiple probe 1.Described circuit board 3 is in conjunction with the prominent pad 31 of described fixed cell 4 and described signal contacting metal, described fixed cell 4 is formed with multiple accommodation spaces 41 in circuit board below, and described accommodation space 41 is installed on wherein for described probe 1, by fixed cell 4, to fix its position of probe 1 in probe 2, also limiting multiple probes simultaneously and can only cannot done by vertical direction pressurized laterally or the movement of other direction.When described probe 1 is fixed, the prominent pad 31 of signal metal on described the first contact element 11 and circuit board 3 does in electrical contact, and multiple probes 1 and the both circuits conducting of circuit board 3 are electrically connected.While testing, probe 2 can move on tester table, the probe 1 that makes probe 2 is during near testing component 5, described testing component 5 can be chip or circuit board, and described probe 1 does directly electrical and signal with described the second contact element 12 and the tin ball 51 on described testing component 5 and contacts.Described circuit board 3 and fixed cell 4 can combine with spiral shell fixing apparatus or other auxiliary fixing device, therefore the present invention can be applied to the use on probe product.Probe 1 of the present invention can be used in many products, and at present only wherein a kind of example of example is made operation instruction, but does not therefore limit range of application of the present invention.
The present invention does not limit described probe 1 and can only contact with testing component 5 with the second contact element 12, in other words, described probe 1 oppositely can be installed yet, and with the first contact element 11, contacts with testing component 5.Also probe of the present invention can be installed between two circuit boards in addition, directly as electrical and signal transmission.
Please also refer to Fig. 2, Fig. 7 A, Fig. 7 B and Fig. 7 C, Fig. 7 A, Fig. 7 B and Fig. 7 C are the another kind of shape schematic diagram of probe contact tip of the present invention.It is mainly the shape at described two tips in electrical contact of improvement (being the first contact element 11 and the second contact element 12 of Fig. 2).At this, enumerating contact tip is that the second contact element 12 is example, but therefore described contact tip be not limited, and the number of described the first contact element and the second contact element is not limit one yet in addition.As shown in Figure 7 A, described the second contact element 12A is flat sharp knife formula or knife back formula shape, protrudes from described embedding combination slot 15; Again as shown in Figure 7 B, described the second contact element 12B is the combination of circular arc camber body and taper; More can be as shown in Fig. 7 C, described the second contact element 12C can be also the combination of triangle cone and taper, and its projection 16A is identical with the first embodiment with the chimeric mode of slotted eye 16B, and this is no longer going to repeat them.
Please also refer to Fig. 7 D, Fig. 7 E, Fig. 7 F and Fig. 7 G, Fig. 7 D, Fig. 7 E, Fig. 7 F and Fig. 7 G are the another kind of shape schematic diagram of probe contact tip of the present invention.Except the presenting of above-mentioned combined probe shape, the single probe at described probe tip place also can do difform form and present, and is embedding combination two probes later, also can be same shape and be together with each other.As shown in Fig. 7 D, the second contact element 12D of probe contact tip can be a pyramid shape; Again or as shown in Fig. 7 E, its second contact element 12E can be a plane type body; More as shown in Figure 7 F, described probe tip, the second contact element 12F can be also zigzag type body, its three kinds of type bodies described above all protrude from and embed on combination slot 15, the projection 16A of described embedding is identical with the first embodiment with the chimeric mode of slotted eye 16B, and this is no longer going to repeat them.
In addition, please refer to Fig. 8, Fig. 8 is probe contact tip of the present invention position schematic diagram.In Fig. 8, take the first contact element 11A as example, described the first contact element 11A is a flat circular arc camber, and described the first contact element 11A is outstanding in the bottom of described embedding combination slot 15, jag position described in it, be not only limited to and protrude from the middle part that embeds combination slot 15, as shown in (a), can be also the left side of its jag, as shown in (b), or the right side of jag, as shown in (c).So, while making jag be partial to a certain side, spacing between pin and the pin of described a certain side needle tip strengthens, described tip is connected in behind circuit board place, by the expansion of distance between described two probes 1, and significantly reduce the number of plies on project engineering figure, the design of described circuit board can more be simplified, more plain easily.
Please also refer to Fig. 3 and Fig. 8, the design of the jag skew of above-mentioned the first contact element 11A, more has and carries out the method realization that voltage quasi position measurement (Kelvin Test) claims that again Kelvin measures.When the second contact element 12 of described two probes 1 contacts same tin ball simultaneously, described the first contact element 11A that cooperation can strengthen spacing is attached on the circuit board of unlike signal, can reach the measurement effect of accurate voltage, electric current, by voltage quasi position, measure (Kelvin Test) to reduce the erroneous judgement of probe to voltage quasi position, thereby reach accurate measurement and promote test voltage, electric current and the power bracket of chip.
Therefore, according to technique scheme, Hf vertical type shrapnel probe card structure of the present invention at least has following advantages and beneficial effect: the first contact element of probe 1 of the present invention and the shape of the second contact element, not only limit single kind of pattern, can optionally be designed to various shape, as long as described shape can, when probe and external member are electrically connected mutually, have good contact condition, make stable signal transmission.
The foregoing is only the preferred embodiments of the present invention, all equalizations of doing according to the claims in the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. a Hf vertical type shrapnel probe card structure, is characterized in that, described Hf vertical type shrapnel probe card structure comprises:
At least two probes, each probe comprises at least one the first contact element, at least one probe body and at least one the second contact element, described the first contact element and described the second contact element were used for and external member contact point in electrical contact as when compression, described probe body has at least one elastic body and at least one embedding combination slot is combined into, the elasticity of bearing distortion when being compressed by vertical direction, described at least two probes removably link into an integrated entity by described embedding combination slot separately.
2. Hf vertical type shrapnel probe card structure as claimed in claim 1, is characterized in that, described the first contact element and described the second contact element, and its shape is flat sharp knife shape or a knife back shape.
3. Hf vertical type shrapnel probe card structure as claimed in claim 1, is characterized in that, described the first contact element and described the second contact element, and its shape is a circular arc camber body, taper, plane body or zigzag body.
4. Hf vertical type shrapnel probe card structure as claimed in claim 1, is characterized in that, the described embedding combination slot of described probe body has at least one projection.
5. the Hf vertical type shrapnel probe card structure as described in claim 1 or 4, is characterized in that, the described embedding combination slot of described probe body also has at least one slotted eye, causes corresponding at least one projection to be entrenched togather.
6. Hf vertical type shrapnel probe card structure as claimed in claim 4, is characterized in that, described elastomeric described embedding combination slot, and its projection can be a cylinder solid shape or square cubic shape.
7. Hf vertical type shrapnel probe card structure as claimed in claim 5, is characterized in that, described elastomeric described embedding combination slot, and its slotted eye can be a through hole shape body or groove body.
8. Hf vertical type shrapnel probe card structure as claimed in claim 1, is characterized in that, described elastic body is bending type body.
9. Hf vertical type shrapnel probe card structure as claimed in claim 7, is characterized in that, the cross section area of described elastomeric described bending type body is not identical, and being upper and lower flexure type body can be inconsistent state.
10. Hf vertical type shrapnel probe card structure as claimed in claim 1, is characterized in that, described at least two first contact elements or the second contact element can contact on same tin ball simultaneously.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099140133 | 2010-11-22 | ||
| TW99140133A TW201221962A (en) | 2010-11-22 | 2010-11-22 | Structure of high frequency vertical elastic piece probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102478594A CN102478594A (en) | 2012-05-30 |
| CN102478594B true CN102478594B (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110326197.4A Expired - Fee Related CN102478594B (en) | 2010-11-22 | 2011-10-24 | High-frequency vertical spring probe card structure |
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| Country | Link |
|---|---|
| CN (1) | CN102478594B (en) |
| TW (1) | TW201221962A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469187A (en) * | 2010-11-01 | 2012-05-23 | 吴昌德 | Method for transmitting incoming call signal of mobile phone |
| KR101716803B1 (en) * | 2014-12-18 | 2017-03-15 | 이채갑 | Probe device |
| KR101672826B1 (en) * | 2016-02-03 | 2016-11-07 | 주식회사 프로이천 | Needle type pin board |
| CN106841999B (en) * | 2017-03-24 | 2023-05-30 | 深圳市斯纳达科技有限公司 | Integrated circuit testing device and testing probe thereof |
| CN113219220B (en) * | 2020-01-21 | 2023-10-10 | 台湾中华精测科技股份有限公司 | Probe card device and directional probe thereof |
| KR102498040B1 (en) * | 2021-02-22 | 2023-02-10 | (주)포인트엔지니어링 | The Electro-conductive Contact Pin Assembly |
| CN113607991B (en) * | 2021-07-24 | 2022-06-28 | 深圳市欧米加智能科技有限公司 | Stacking complementary microneedle and high-current testing device thereof |
| CN115308456B (en) * | 2022-09-29 | 2023-03-10 | 深圳市道格特科技有限公司 | Vertical probe and probe card |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| CN1745306A (en) * | 2002-12-23 | 2006-03-08 | 佛姆费克托公司 | Microelectronic contact structure |
-
2010
- 2010-11-22 TW TW99140133A patent/TW201221962A/en unknown
-
2011
- 2011-10-24 CN CN201110326197.4A patent/CN102478594B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| CN1745306A (en) * | 2002-12-23 | 2006-03-08 | 佛姆费克托公司 | Microelectronic contact structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201221962A (en) | 2012-06-01 |
| CN102478594A (en) | 2012-05-30 |
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