CN201021933Y - Device for integrated circuit test - Google Patents
Device for integrated circuit test Download PDFInfo
- Publication number
- CN201021933Y CN201021933Y CNU2007201184760U CN200720118476U CN201021933Y CN 201021933 Y CN201021933 Y CN 201021933Y CN U2007201184760 U CNU2007201184760 U CN U2007201184760U CN 200720118476 U CN200720118476 U CN 200720118476U CN 201021933 Y CN201021933 Y CN 201021933Y
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- Prior art keywords
- integrated circuit
- stretch section
- probe
- electrically connected
- spring
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Abstract
The utility model relates to a test device for integrated circuits, which comprises a pressing component (1), a probe positioning plate (2) and probes, wherein the probe positioning plate (2) is provided with through-holes, the distance between two adjacent through-holes is equal to the distance between two adjacent conductive points of an integrated circuit (4) to be tested, the probes which are spiral springs (3) get through the through-holes on the probe positioning plate (2), the upper end of each spiral spring (3) is electrically connected with the integrated circuit (4) to be tested and the lower end is electrically connected with a test printed circuit board (5). Or, each probe comprises a contact pin (6) and a spiral spring (3), one end of the contact pin (6) is provided with a head shape which is electrically connected with the integrated circuit (4) to be tested or the test printed circuit board (5), the other end of the contact pin (6) contacts one end of the spiral spring (3), and accordingly, the other end of the spring (3) is electrically connected with the test printed circuit board (5) or the integrated circuit (4) to be tested. The utility model has the technical effects that the probes adopted are simple in structure, and thereby the utility model is low-cost and can be applied to test integrated circuits with a small distance between two adjacent conductive points.
Description
Technical field
The utility model relates to the electric performance test or the fault-location instrument of semiconductor devices, particularly relates to the device that is used for testing integrated circuits.
Background technology
Along with SMT, be Surface Mount Technology, the development of surface mounting technology, SIC (semiconductor integrated circuit) (being called for short IC) particularly adopts ball grid array Ball Grid Array, is called for short BGA, i.e. the arrangement mode of Feng Zhuan I/O (I/O) pin is a grid array, and the pin end is that the IC of tin ball develops towards high density, little spacing direction, the I/O pin of encapsulation is increased to the hundreds of root gradually from tens, may reach 2,000 in the near future.Correspondingly, integrated circuit testing being required can be more and more higher.The probe that can satisfy high density, closely spaced IC test request in the prior art has two kinds, as shown in Figure 1 a kind of, it is made up of pipe shaft a, two tip portion b and pipe shaft inner spring, two tip portion b that guarantee probe can be along pipe shaft a inwall parallel sliding freely, to guarantee that simultaneously its serviceable life is more than 500,000 times, under the very little situation of pipe shaft a external diameter, the process technology difficulty of probe and equipment requirements are very high and yields is low.Apart from being the probe of 0.5mm, the pipe shaft external diameter has only φ 0.35mm such as testing integrated circuits conductiving point pin, and the needle point diameter of section has only about φ 0.17mm, and machining tolerance must be controlled in the 0.01mm, and general high-precision automatic machine tool all can not reach technological requirement.And technological parameter has slightly unreasonablely will cause product rejection, and build-up tolerance also must be controlled at below the 0.003mm, thereby cost is high.Another kind as shown in Figure 2, its by an end have one fixedly pipe shaft d, the movable needle point e of needle point and the spring in the pipe shaft d forms, owing to spring-loaded pipe shaft d one end band needle point, the endoporus shock mount of the other end, whole must employing turning processing is so cost is also quite high.The reason that cost is high, this series products of the first are by existing processes, and machining precision, assembly precision require high, it two is that to produce the required equipment requirements of this class probe very high, the machine costliness, a production line is all wanted more than 1,000 ten thousand yuans, so equipment cost is high.More than two kinds of double ended probes have only several companies to do at present in the world.In addition, the test structure made from above-mentioned two kinds of probes is if quality problems need change certain root probe the time, must be taken total apart and could change, and maintenance is inconvenient.
Summary of the invention
The technical problems to be solved in the utility model is to avoid above-mentioned the deficiencies in the prior art part and proposes a kind of device that is used for testing integrated circuits, and this installs not only, and cost is extremely low, and can be used to test closely spaced integrated circuit.
The utility model solve the technical problem can be by realizing by the following technical solutions:
Design, a kind of device that is used for integrated circuit testing of use, comprise compacting part, probe location-plate and probe, have on this probe location-plate with each conductiving point of tested integrated circuit between pin apart from identical through hole, this each probe passes through the through hole on the described probe location-plate; Described probe is the bung flange spring, and the upper end of described each spring is electrically connected with tested integrated circuit, and the lower end is electrically connected with testing printed circuit board.
Perhaps, described each probe is made up of contact pilotage and bung flange spring, and described contact pilotage one end is provided with capitiform, is electrically connected the other end of this contact pilotage and spring one end in contact with tested integrated circuit or testing printed circuit board; Correspondingly, the described spring other end is electrically connected with testing printed circuit board or tested integrated circuit.
Compare with prior art, technique effect of the present utility model is: used probe is made up of contact pilotage and bung flange spring, or is made up of single bung flange spring, simple in structure, can do very for a short time, very short, not only cost is extremely low, and can be used to test closely spaced integrated circuit.
Description of drawings
Fig. 1 is the used first kind of double ended probes synoptic diagram of device that is used for testing integrated circuits in the prior art;
Fig. 2 is the used second kind of double ended probes synoptic diagram of device that is used for testing integrated circuits in the prior art;
Fig. 3 is the structural representation that the utility model is used for the device embodiment one of testing integrated circuits;
Fig. 4 is the synoptic diagram of the utility model embodiment one used probe;
Fig. 5 is the A portion enlarged diagram of Fig. 4;
Fig. 6 is the structural representation of the utility model embodiment two;
Fig. 7 is the synoptic diagram of the utility model embodiment two used probes;
Fig. 8 is the structural representation of the utility model embodiment three;
Fig. 9 is the synoptic diagram of the utility model embodiment three used probes;
Figure 10 is the contact pilotage synoptic diagram of described embodiment three;
Figure 11 is the structural representation of the utility model embodiment four;
Figure 12 is the structural representation of the utility model embodiment five;
Figure 13 is the structural representation of the utility model embodiment six;
Figure 14 is the structural representation of the utility model embodiment seven;
Figure 15 is the synoptic diagram of the utility model embodiment seven used probes;
Figure 16 is the contact pilotage synoptic diagram of described embodiment seven;
Figure 17 is the structural representation of the utility model embodiment eight.
Embodiment
Be described in further detail below in conjunction with the most preferred embodiment shown in the accompanying drawing.
Embodiment one:
Present embodiment is used for the device of integrated circuit testing, as shown in Figure 3, comprise compacting part 1, probe location-plate 2 and probe, have on this probe location-plate 2 with tested integrated circuit 4 each conductiving point between pin apart from identical through hole, each probe passes through the through hole on the described probe location-plate 2.Described probe is a bung flange spring 3.During test, integrated circuit places between compacting part 1 and the probe location-plate 2, and the upper end of described each spring 3 is electrically connected with tested integrated circuit 4, and the lower end is electrically connected with testing printed circuit board 5.As shown in Figure 4, described spring 3 comprises stretch section 31 and stretch section 32 not.As shown in Figure 4, described stretch section 31 ends are electrically connected with tested integrated circuit 4, and stretch section 32 ends are not electrically connected with testing printed circuit board 5.As Fig. 4, shown in Figure 5, the time from probe location-plate 2, do not drop out in assembling in order to guarantee spring 3, the diameter of described not stretch section 32 is less than the diameter of stretch section 31, promptly at the intersection of stretch section 32 and stretch section 31 not step 33 is set.In order to guarantee that spring 3 can touch the center of pad on the pcb board 5, the diameter of the close end segments of described not stretch section 32 is less than the diameter of remainder, promptly at the place, close end of stretch section 32 not step 34 arranged.
Embodiment two:
Present embodiment is used for the device of integrated circuit testing, and as shown in Figure 6 and Figure 7, be with the difference of embodiment one: described spring 3 middle parts are stretch section 31, and two ends are stretch section 32 not.Identical with embodiment one, the time from probe location-plate 2, do not drop out in assembling in order to guarantee spring 3, the diameter of described not stretch section 32 is less than the diameter of stretch section 31, promptly at the intersection of stretch section 32 and stretch section 31 not step 33 is set.In order to guarantee that spring 3 can touch the center of pad on the pcb board 5 and the tin ball of tested integrated circuit, the diameter of the close end segments of described not stretch section 32 is less than the diameter of remainder, promptly at the place, close end of stretch section 32 not step 34 arranged.
Embodiment three:
Present embodiment is used for the device of integrated circuit testing, extremely shown in Figure 10 as Fig. 8, comprise compacting part 1, probe location-plate 2 and probe, have on this probe location-plate 2 with tested integrated circuit 4 each conductiving point between pin apart from identical through hole, each probe passes through the through hole on the described probe location-plate 2.Described each probe comprises contact pilotage 6 and bung flange spring 3.Described contact pilotage 6 one ends are provided with the capitiform of pawl type, and the other end of this contact pilotage 6 has step 61, withstand an end of spring 3.During test, integrated circuit 4 places between compacting part 1 and the probe location-plate 2, and the end that contact pilotage 6 is provided with capitiform is electrically connected with tested integrated circuit 4, and described spring 3 testing printed circuit boards 5 are electrically connected.Described spring 3 is identical with spring among the embodiment one.
Embodiment four:
Present embodiment is used for the device of integrated circuit testing, and as shown in figure 11, basic identical with embodiment three, difference is: the capitiform of described contact pilotage 6 is a tip.
Embodiment five:
Present embodiment is used for the device of integrated circuit testing, as shown in figure 12, basic identical with embodiment three, difference is: the end that described contact pilotage 6 is provided with pawl type capitiform is electrically connected with testing printed circuit board 5, and two described springs 3 are electrically connected with tested integrated circuit 4.
Embodiment six:
Present embodiment is used for the device of integrated circuit testing, and as shown in figure 13, basic identical with embodiment five, difference is: the capitiform of described contact pilotage 6 is a tip.
Embodiment seven:
Present embodiment is used for the device of integrated circuit testing, and to shown in Figure 16, basic identical with embodiment three, difference is: described contact pilotage 6 one ends do not have step as Figure 14, is directly withstood an end of spring 3 by these contact pilotage 6 lower ends.
Embodiment eight:
Present embodiment is used for the device of integrated circuit testing, and as shown in figure 17, basic identical with embodiment seven, difference is: the capitiform of described contact pilotage 6 is a tip.
Claims (10)
1. device that is used for integrated circuit testing, comprise compacting part (1), probe location-plate (2) and probe, have on this probe location-plate (2) with each conductiving point of tested integrated circuit (4) between pin apart from identical through hole, each probe passes through the through hole on the described probe location-plate (2); It is characterized in that:
Described probe is bung flange spring (3), and the upper end of described each spring (3) is electrically connected with tested integrated circuit (4), and the lower end is electrically connected with testing printed circuit board (5).
2. the device that is used for integrated circuit testing according to claim 1, it is characterized in that: described spring (3) comprises stretch section (31) and stretch section (32) not, described stretch section (31) end is electrically connected with tested integrated circuit (4), and stretch section (32) end is not electrically connected with testing printed circuit board (5).
3. the device that is used for integrated circuit testing according to claim 1 is characterized in that: described spring (3) middle part is stretch section (31), and two ends are stretch section (32) not.
4. according to claim 2 or the 3 described devices that are used for integrated circuit testing, it is characterized in that: the diameter of described not stretch section (32) is less than the diameter of stretch section (31), promptly at the intersection of stretch section (32) and stretch section (31) not step (33) arranged.
5. according to claim 2 or the 3 described devices that are used for integrated circuit testing, it is characterized in that: the diameter of the close end segments of described not stretch section (32) is less than the diameter of remainder, promptly at the place, close end of stretch section (32) not step (34) arranged.
6. device that is used for integrated circuit testing, comprise compacting part (1), probe location-plate (2) and probe, have on this probe location-plate (2) with each conductiving point of tested integrated circuit (4) between pin apart from identical through hole, described each probe passes through the through hole on the described probe location-plate (2); It is characterized in that:
Described each probe comprises contact pilotage (6) and bung flange spring (3), and described contact pilotage (6) one ends are provided with capitiform, is electrically connected the other end of this contact pilotage (6) and spring (3) one end in contact with tested integrated circuit (4) or testing printed circuit board (5); Correspondingly, described spring (3) other end is electrically connected with testing printed circuit board (5) or tested integrated circuit (4).
7. the device that is used for integrated circuit testing according to claim 6 is characterized in that: step (61) is arranged on the described contact pilotage (6).
8. the device that is used for integrated circuit testing according to claim 7, it is characterized in that: described spring (3) comprises stretch section (31) and stretch section (32) not, described stretch section (31) end contacts with contact pilotage (6), and stretch section (32) end is not electrically connected with testing printed circuit board (5) or tested integrated circuit (4).
9. the device that is used for integrated circuit testing according to claim 8 is characterized in that: the diameter of described not stretch section (32) is less than the diameter of stretch section (31), promptly at the intersection of stretch section (32) and stretch section (31) not step (33) arranged.
10. the device that is used for integrated circuit testing according to claim 8 is characterized in that: the diameter of the close end segments of described not stretch section (32) is less than the diameter of remainder, promptly must step (34) be arranged near the place, end at stretch section (32) not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201184760U CN201021933Y (en) | 2007-02-09 | 2007-02-09 | Device for integrated circuit test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201184760U CN201021933Y (en) | 2007-02-09 | 2007-02-09 | Device for integrated circuit test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201021933Y true CN201021933Y (en) | 2008-02-13 |
Family
ID=39089344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201184760U Expired - Lifetime CN201021933Y (en) | 2007-02-09 | 2007-02-09 | Device for integrated circuit test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201021933Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900750A (en) * | 2009-06-01 | 2010-12-01 | 株式会社光阳科技 | Electric contact and inspection jig with the same |
| CN102495248A (en) * | 2011-12-12 | 2012-06-13 | 段超毅 | Device for integrated circuit testing |
| CN104714064A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Probe module |
| CN104950250A (en) * | 2015-07-29 | 2015-09-30 | 江苏杰进微电子科技有限公司 | Integrated circuit (IC) test head and device with same |
| CN105807200A (en) * | 2016-05-13 | 2016-07-27 | 南京工业大学 | Solar cell and electroluminescent device general testing device |
| CN110850272A (en) * | 2019-11-15 | 2020-02-28 | 珠海格力电器股份有限公司 | Probe clamp and chip electrical property testing device |
| CN113357111A (en) * | 2021-07-01 | 2021-09-07 | 兰州空间技术物理研究所 | Installation method of probe of ion thruster |
| CN113406481A (en) * | 2021-07-08 | 2021-09-17 | 陈清梅 | Integrated circuit input end testing device |
| CN113866465A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
-
2007
- 2007-02-09 CN CNU2007201184760U patent/CN201021933Y/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900750A (en) * | 2009-06-01 | 2010-12-01 | 株式会社光阳科技 | Electric contact and inspection jig with the same |
| CN101900750B (en) * | 2009-06-01 | 2014-07-30 | 株式会社光阳科技 | Electric contact and inspection jig with the same |
| CN102495248A (en) * | 2011-12-12 | 2012-06-13 | 段超毅 | Device for integrated circuit testing |
| CN104714064A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Probe module |
| CN104950250A (en) * | 2015-07-29 | 2015-09-30 | 江苏杰进微电子科技有限公司 | Integrated circuit (IC) test head and device with same |
| CN105807200A (en) * | 2016-05-13 | 2016-07-27 | 南京工业大学 | Solar cell and electroluminescent device general testing device |
| CN110850272A (en) * | 2019-11-15 | 2020-02-28 | 珠海格力电器股份有限公司 | Probe clamp and chip electrical property testing device |
| CN113357111A (en) * | 2021-07-01 | 2021-09-07 | 兰州空间技术物理研究所 | Installation method of probe of ion thruster |
| CN113357111B (en) * | 2021-07-01 | 2022-03-18 | 兰州空间技术物理研究所 | Installation method of probe of ion thruster |
| CN113406481A (en) * | 2021-07-08 | 2021-09-17 | 陈清梅 | Integrated circuit input end testing device |
| CN113866465A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080213 |