CN107656183B

CN107656183B - Testing device

Info

Publication number: CN107656183B
Application number: CN201710046642.9A
Authority: CN
Inventors: 朱伟硕
Original assignee: ASE Test Inc
Current assignee: Taiwan Frey Electronic Ltd By Share Ltd
Priority date: 2016-07-25
Filing date: 2017-01-19
Publication date: 2020-12-11
Anticipated expiration: 2037-01-19
Also published as: TW201809678A; TWI593970B; CN107656183A

Abstract

The invention relates to a testing device which comprises a base and a flexible plate. The flexible board has a first portion, a second portion, a plurality of test probes, and a plurality of test contacts. The test probe is electrically connected to the test contact, the test probe is located on the first portion of the flexible board and above the base, and the test contact is located on the second portion of the flexible board and below the base.

Description

Testing device

Technical Field

The present invention relates to a test apparatus. More particularly, the present invention relates to a test device comprising a flexible sheet.

Background

In semiconductor processing, when a semiconductor device (e.g., a semiconductor package) is manufactured, it is often necessary to perform a test to avoid shipping bad products to customers. In a conventional manner, a workpiece to be tested is contacted with a conventional testing apparatus for testing. The conventional testing apparatus includes a support body, a plurality of probes, and an electrode region. The first side (upper side) of the support body is provided with a plurality of first through holes, and the second side (lower side) of the support body is provided with a plurality of second through holes. The probe is bendable and elastic and is positioned in the support body. Each probe has a first end (upper end) and a second end (lower end), the first end of the probe can extend through the first through aperture of the support body and beyond the first side of the support body, and the second end of the probe can extend through the second through aperture of the support body and beyond the second side of the support body. The electrode area is adjacent to the second side of the support body and is provided with a plurality of electrodes (metal pads) for contacting the second end of the probe. The electrodes are electrically connected to a Tester (Tester).

The conventional test method is as follows. Firstly, a workpiece to be tested is provided, wherein the workpiece to be tested is provided with a plurality of pads to be tested. Next, the workpiece to be tested is moved toward the first side of the testing device (i.e., moved downward) so that the pads to be tested contact the first ends of the probes. And then, slightly moving the workpiece to be tested downwards to enable the workpiece to be tested to apply a downward pressure on the probe, wherein the second end of the probe slightly moves downwards to closely contact the electrode of the corresponding electrode area, and the test is carried out. At this time, the body of each probe may be deformed to have elastic force. After the test is completed, the workpiece to be tested is removed and the probe returns to its original shape, at which point the second end of the probe moves slightly upward without coming into close contact with the electrode or even without coming into contact with the electrode.

The disadvantages of the above conventional test methods are as follows. First, since the electrode (metal pad) in the electrode region is repeatedly applied with a positive pressure by the second end of the probe, a depression is easily generated, resulting in poor contact and an increase in contact resistance. The pits are not easy to be detected and maintained in time in the test process, and good products are easy to be judged by mistake. That is, direct pressure of the probe against the electrode causes rapid wear of the electrode. Second, the probe is fabricated using conventional turning. When the size of the pad to be tested of the workpiece to be tested is smaller, the diameter of the probe is required to be smaller relatively. However, the tolerance of the traditional turning mode is large, the small-size processing is limited by the capability of a machine table, the finished product rate is poor, and the manufacturing cost is high. Third, the distribution design (or arrangement pattern) of the electrodes in the electrode area must completely correspond to the pads to be tested of the workpiece to be tested. That is, the distribution of the electrodes in the electrode area is designed to be dedicated, and the electrodes are only suitable for the workpieces to be tested of a specific model, and when the mass production period of the workpieces to be tested is finished, the conventional testing device cannot be used for the workpieces to be tested of other models.

Therefore, there is a need to provide an improved testing device to solve the above problems.

Disclosure of Invention

One aspect of the invention relates to a testing device that includes a base and a flexible sheet. The flexible board is provided with a first part, a second part, a plurality of test probes and a plurality of test contacts, wherein the test probes are electrically connected to the test contacts, the test probes are positioned on the first part of the flexible board and positioned above the base, and the test contacts are positioned on the second part of the flexible board and positioned below the base.

Drawings

FIG. 1 shows a schematic cross-sectional view of a testing device according to an embodiment of the present invention.

Fig. 2 shows a schematic top view of the base of the testing device according to fig. 1.

Fig. 3 shows a schematic top view of a flexible plate of the testing device according to fig. 1.

Fig. 4 shows a cross-sectional, partially enlarged schematic view of a flexible plate of the testing device according to fig. 1.

FIG. 5 shows a cross-sectional, partially enlarged schematic view of a flexible sheet according to an embodiment of the invention.

FIG. 6 shows a cross-sectional, partially enlarged schematic view of a flexible sheet according to an embodiment of the invention.

FIG. 7 shows a cross-sectional, partially enlarged schematic view of a flexible sheet according to an embodiment of the invention.

FIG. 8 shows a cross-sectional, partially enlarged schematic view of a flexible sheet according to an embodiment of the invention.

FIG. 9 shows a cross-sectional, partially enlarged schematic view of a flexible sheet according to an embodiment of the invention.

FIG. 10 is a schematic diagram illustrating a testing method of a testing apparatus according to an embodiment of the present invention.

FIG. 11 shows a schematic cross-sectional view of a testing device according to an embodiment of the present invention.

FIG. 12 shows a schematic cross-sectional view of a testing device according to an embodiment of the present invention.

FIG. 13 shows a schematic cross-sectional view of a testing device according to an embodiment of the present invention.

FIG. 14 shows a schematic cross-sectional view of a testing device according to an embodiment of the invention.

Fig. 15 to 27 are schematic views showing a method of manufacturing a flexible board according to an embodiment of the present invention.

Detailed Description

Fig. 1 shows a schematic cross-sectional view of a testing device 1 according to an embodiment of the present invention. The testing device 1 comprises a base 10, a cushioning structure 2 and a flexible sheet 14. The base 10 has a first surface 101, a second surface 102, at least one through groove 103 and a plurality of fixing holes 104. The second surface 102 is opposite to the first surface 101. The through groove 103 penetrates the base 10 for the flexible board 14 to pass through. The fixing holes 104 are located on the outer periphery of the base 10 for passing a plurality of screws 20 therethrough to fix the base 10 to the electrode carrying body 22. It will be appreciated that in other embodiments, the base 10 may be affixed to the electrode-carrying body 22 in other manners.

The cushioning structure 2 is located on the first surface 101 of the base 10. In this embodiment, the buffer structure 2 is fixed to the first surface 101 of the base 10, and includes a receiving seat 23 and an elastic structure 21. The elastic structure 21 is located on the base 10 to provide cushioning. In this embodiment, the elastic structure 21 includes an upper plate 211, a lower plate 212, a plurality of springs 213 and at least one position-limiting cylinder 214. The lower plate 212 is fixed to the first surface 101 of the base 10. The spring 213 is located between the upper plate 211 and the lower plate 212. That is, one end of each of the springs 213 is connected to the upper plate 211, and the other end is connected to the lower plate 212. The limiting column 214 has a main body portion 2141 and a top abutting portion 2142, and the top abutting portion 2142 is located at the upper end of the main body portion 2141, so that the cross section of the limiting column 214 is substantially T-shaped. The main body portion 2141 passes through the through hole 2111 of the upper plate 211 (the size of the through hole 2111 is smaller than that of the abutting portion 2142), and the lower end of the main body portion 2141 is fixedly connected (e.g., locked) to the lower plate 212. Therefore, when the upper plate 211 is pressed downward, it moves downward along the body portion 2141 of the restraining cylinder 214 to compress the spring 213; when the downward pressure is removed, the upper plate 211 is pushed upward by the elastic force of the spring 213 and moves upward along the body portion 2141 of the limiting cylinder 214 until abutting against the abutting portion 2142. The lower end of the socket 23 is connected to the elastic structure 21, and the upper end of the socket 23 is used to receive a portion of the flexible board 14.

The electrode carrier body 22 is disposed adjacent to the second surface 102 of the susceptor 10 and has a plurality of electrodes 24. The upper end of each electrode 24 is exposed to the upper surface of the electrode carrier body 22 to form a metal pad 241 for electrically connecting the flexible board 14. The lower end of each of the electrodes 24 is electrically connected to a Tester (not shown).

The flexible board 14 has a first surface 141, a second surface 142, a first portion 143, at least a second portion 144, a plurality of test probes 145 and a plurality of test contacts 146, and at least a third portion 147. The test probe 145 is electrically connected to the test contact 146. The test probes 145 are located on the first portion 143 of the flexible board 14 and above the base 10 (i.e., above the first surface 101 of the base 10) for contacting a plurality of pads 301 to be tested of a workpiece 30 to be tested (e.g., a chip). The test contact 146 is located at the second portion 144 of the flexible board 14 and below the base 10 (i.e. below the second surface 102 of the base 10) for contacting the metal pad 241 of the electrode carrier body 22. The third portion 147 connects the first portion 143 and the second portion 144.

In the embodiment shown in fig. 1, the flexible board 14 passes through the through groove 103 of the base 10, wherein a portion (the first portion 143) of the flexible board 14 is located above the base 10 and is attached (e.g., adhered) to the upper end of the socket 23 of the cushioning structure 2, i.e., the upper end of the socket 23 is used for receiving the first portion 143 of the flexible board 14. In addition, another portion of the flexible board 14 (the second portion 144) is located below the base 10 and is attached (e.g., adhered) to the second surface 102 of the base 10, i.e., the second surface 102 of the base 10 is used to receive the second portion 144 of the flexible board 14.

In the embodiment shown in fig. 1, the test probes 145 are disposed adjacent to the first surface 141 of the flexible board 14 at the first portion 143, and the second surface 142 of the flexible board 14 is attached (e.g., adhered) to the upper end of the socket 23. In the second portion 144, the test contact 146 is disposed adjacent to the second surface 142 of the flexible board 14, and the first surface 141 of the flexible board 14 is attached (e.g., adhered) to the second surface 102 of the base 10. Thus, the test contacts 146 are not directly under the test probes 145. Moreover, in other embodiments, the test contact 146 may be disposed adjacent to the first surface 141 of the flexible board 14 at the second portion 144, and the second surface 141 of the flexible board 14 is attached (e.g., adhered) to the second surface 102 of the base 10.

Fig. 2 shows a schematic top view of the base 10 of the testing device 1 according to fig. 1. In the present embodiment, the base 10 has four through grooves 103. The through grooves 103 are not communicated with each other and surround the central portion 105. The central portion 105 is used for the buffer structure 2 (fig. 1) to be located thereon. In this embodiment, the lower plate 212 of the elastic structure 21 of the buffer structure 2 is fixed to the central portion 105.

Fig. 3 shows a schematic top view of the flexible plate 14 of the testing device 1 according to fig. 1. In this embodiment, the flexible sheet 14 has a first portion 143, four second portions 144, and four third portions 147. The four third portions 147 are connected to the corresponding four second portions 144 by the first portions 143 extending outward in four directions, respectively, thereby forming the flexible board 14 into a cross-like appearance. As shown in FIG. 3, the test probes 145 are arranged in an array within the first portion 143, however, in other embodiments, the test probes 145 may be arranged in other manners. It is to be noted that the arrangement pattern of the test probes 145 corresponds to the arrangement pattern of the pads 301 to be tested of the workpiece 30 to be tested. The test contacts 146 are disposed adjacent to the second surface 142 of the flexible board 14 and are also arranged in a specific pattern. It is noted that the arrangement pattern of the test contacts 146 corresponds to the arrangement pattern of the metal pads 241 of the electrodes 24 of the electrode carrying body 22. The test probes 145 are electrically connected to the test contacts 146 by conductive traces 148 of a conductive layer located within the third portion 147, wherein the correspondence between the test probes 145 and the test contacts 146 may be one-to-one, one-to-many, or many-to-one.

Fig. 4 shows a cross-sectional, partially enlarged schematic view of the flexible plate 14 of the testing device 1 according to fig. 1. In this embodiment, the flexible board 14 further includes a core layer 32, a first conductive layer 34, a second conductive layer 36, a plurality of conductive channels 38, a first insulating layer 391, and a second insulating layer 392. The first conductive layer 34 is a patterned metal layer made of copper or other suitable material and is located on the second surface 322 of the core layer 32. The second conductive layer 36 is a patterned metal layer made of copper or other suitable materials and is located on the first surface 321 of the core layer 32. The conductive via 38 extends through the core layer 32 and electrically connects the first conductive layer 34 and the second conductive layer 36. In the present embodiment, the conductive via 38 is a plated metal layer 44 located on the inner sidewall of the through hole 42 of the core layer 32. In an embodiment, the conductive via 38 further extends through the first conductive layer 34, and the metal layer 44 is further located on the first surface 321 of the core layer 32 and the lower surface of the first conductive layer 34.

The first insulating layer 391 covers the first conductive layer 34 and has a plurality of openings 3911. In this embodiment, the first insulating layer 391 further extends into the conductive channel 38. The test contact 146 is located in the opening 3911 and electrically connected to the first conductive layer 34. Each of the test contacts 146 includes a base 1461 and a cover 1462, wherein the base 1461 is made of copper or nickel, and the cover 1462 is made of nickel, palladium and/or gold.

The second insulating layer 392 covers the second conductive layer 36 and a portion of the first surface 321 of the core layer 32, and the test probes 145 are electrically connected to the second conductive layer 36 and protrude from the second insulating layer 392. In the present embodiment, a plurality of intermediate pads 149 are located on the second conductive layer 36, and the test probes 145 are located on the corresponding intermediate pads 149. The intermediate pad 149 is made of copper or other suitable material. However, it is understood that the intermediate pad 149 may be omitted. That is, the test probes 145 may be directly on the second conductive layer 36.

The material of the test probe 145 may be copper, nickel or nickel-tungsten alloy. In this embodiment, the core layer 32 is made of Polyimide (PI), and the first insulating layer 391 and the second insulating layer 392 are made of a photosensitive resin type cured material. The photosensitive resin type includes Polyimide (PI) resin, Photoinitiator (Photoinitiator), Coupling Agent (Coupling Agent), and Solvent (Solvent). In other embodiments, the core layer 32, the first insulating layer 391 and the second insulating layer 392 may be made of different materials, and may be made of other suitable materials. In the present embodiment, the end of each of the test probes 145 is a plane, i.e., the cross section of each of the test probes 145 is substantially rectangular.

Fig. 5 shows a cross-sectional partially enlarged schematic view of a flexible sheet 14a according to an embodiment of the present invention. The flexible board 14a of the present embodiment is substantially the same as the flexible board 14 shown in fig. 4, and its differences are as follows. In the flexible board 14a, a portion of the second insulating layer 392 is located on a sidewall of each of the test probes 145 to surround and protect the test probes 145, and only ends of the test probes 145 are exposed outside the second insulating layer 392.

Fig. 6 shows a cross-sectional partially enlarged schematic view of a flexible board 14b according to an embodiment of the present invention. The flexible board 14b of the present embodiment is substantially the same as the flexible board 14 shown in fig. 4, and its differences are as follows. In the flexible board 14b, the end of each of the test probes 145 is pointed, which has a chamfered surface, i.e., the cross section of each of the test probes 145 is substantially trapezoidal.

Fig. 7 shows a cross-sectional partially enlarged schematic view of a flexible board 14c according to an embodiment of the present invention. The flexible board 14c of the present embodiment is substantially the same as the flexible board 14 shown in fig. 4, and its differences are as follows. In the flexible board 14c, the end of each of the test probes 145 is conical, having a chamfer around the central axis; alternatively, the end of each of the test probes 145 may have a wedge-shaped appearance with two chamfered surfaces. In the present embodiment, each of the test probes 145 has a substantially pentagonal cross-section.

Fig. 8 shows a cross-sectional partially enlarged schematic view of a flexible board 14d according to an embodiment of the present invention. The flexible board 14d of the present embodiment is substantially the same as the flexible board 14 shown in fig. 4, and its differences are as follows. In the flexible board 14d, each of the test probes 145 is formed in a bolt shape having a head 1451 with a large size. In an embodiment, the top surface of the head 1451 is curved.

Fig. 9 shows a cross-sectional partially enlarged schematic view of a flexible board 14e according to an embodiment of the present invention. The flexible board 14e of the present embodiment is substantially the same as the flexible board 14 shown in fig. 4, and its differences are as follows. In the flexible board 14e, the end of each of the test probes 145 is serrated.

Fig. 10 shows a schematic diagram of a testing method of the testing device 1 according to an embodiment of the invention. The test mode of this example is as follows. First, the first portion 143 of the flexible board 14 is attached to the upper end of the socket 23 of the cushion structure 2, and the second portion 144 of the flexible board 14 is attached to the second surface 102 of the base 10. The base 10 is then affixed to the electrode carrier body 22 such that the test contacts 146 contact the metal pads 241 of the electrode carrier body 22. Next, the workpiece to be tested 30 is moved toward the testing apparatus 1 such that the pads to be tested 301 of the workpiece to be tested 30 contact the test probes 145. Then, the workpiece to be tested 30 is further moved slightly downward so that the pad to be tested 301 is brought into close contact with the test probe 145 and a test is performed. At this time, the upper plate 211 is pressed downward, which moves downward along the body portion 2141 of the restraining cylinder 214 to compress the spring 213. That is, the spring 213 may provide cushioning. After the test is completed, the workpiece 30 to be tested is removed. At this time, the downward pressure is removed, and due to the elastic force of the spring 213, the upper plate 211 is pushed up and moves upward along the main body portion 2141 of the limiting cylinder 214 until abutting against the abutting portion 2142, so as to restore the state shown in fig. 1.

In the above-mentioned testing method, firstly, since the metal pad 241 of the electrode bearing main body 22 is not subjected to the forward pressure exerted in a reciprocating manner (i.e. the metal pad 241 is not affected by the pressing down or removing of the workpiece 30 to be tested), the metal pad 241 can be prevented from being damaged, which not only is not easy to cause good product and erroneous judgment, but also can prolong the service life. Moreover, the test probes 145 of the flexible board 14 may be fabricated by a yellow light process or a 3D printing method (the Pitch between the test probes 145 may be 50 microns or less), so that the flexibility of the fabrication of the product is improved according to the miniaturization trend of the product, and the yield of the process is easily monitored. In addition, the arrangement pattern of the metal pads 241 of the electrode bearing main body 22 can be standardized, and when different workpieces 30 to be tested need to be tested, only the corresponding flexible board 14 needs to be replaced, that is, the metal pads 241 of the electrode bearing main body 22 can be continuously used for different workpieces 30 to be tested, and are not limited to the workpieces 30 to be tested of a specific model. In other words, the arrangement pattern of the metal pads 241 of the electrode carrier body 22 may not correspond to the arrangement pattern of the pads 301 to be tested of the workpiece 30 to be tested.

Fig. 11 shows a schematic cross-sectional view of a testing device 1a according to an embodiment of the present invention. The test apparatus 1a of the present embodiment is substantially the same as the test apparatus 1 shown in fig. 1, and its differences are as follows. In the testing device 1a, the testing contact 146 is disposed adjacent to the first surface 141 of the flexible board 14 at the second portion 144 of the flexible board 14, and the second surface 141 of the flexible board 14 is attached to the second surface 102 of the central portion 105 of the base 10. At this time, the test contacts 146 and the test probes 145 are located on the first surface 141 of the flexible board 14, and the test contacts 146 are located right below the test probes 145.

Fig. 12 shows a schematic cross-sectional view of a testing device 1b according to an embodiment of the present invention. The test apparatus 1b of the present embodiment is substantially the same as the test apparatus 1 shown in fig. 1, and its differences are as follows. In the testing device 1b, the elastic structure 21b includes at least one first elastic polymer material 215 sandwiched between the upper plate 211 and the lower plate 212 for providing a buffer. That is, the elastic structure 21b does not have the spring 213 and the restraining cylinder 214. In addition, a second elastic polymer material 231 is sandwiched between the bearing seats 23b for providing cushioning.

Fig. 13 shows a schematic cross-sectional view of a testing device 1c according to an embodiment of the present invention. The test apparatus 1c of the present embodiment is substantially the same as the test apparatus 1b shown in fig. 12, and its differences are as follows. In the testing device 1c, the testing contact 146 is disposed adjacent to the first surface 141 of the flexible board 14 at the second portion 144 of the flexible board 14, and the second surface 141 of the flexible board 14 is attached to the second surface 102 of the central portion 105 of the base 10. At this time, the test contacts 146 and the test probes 145 are located on the first surface 141 of the flexible board 14, and the test contacts 146 are located right below the test probes 145.

Fig. 14 shows a schematic cross-sectional view of a testing device 1d according to an embodiment of the present invention. The test apparatus 1d of the present embodiment is substantially the same as the test apparatus 1 shown in fig. 1, and its differences are as follows. In the test apparatus 1d, the buffer structure 2d includes a socket 23d and an Air Chamber (Air Chamber) 25. The air chamber 25 is located on the first surface 101 of the base 10. The lower end of the socket 23d is located in the air chamber 25, and a closed space is formed in the air chamber 25, so that the lower end of the socket 23d can move in the air chamber 25 to provide a cushion. The upper end of the receiving seat 23d is used for receiving the first portion 143 of the flexible board 14.

Fig. 15 to 27 are schematic views showing a method of manufacturing a flexible board according to an embodiment of the present invention. Referring to fig. 15, a core layer 32 and a first metal layer 40 are provided. The core layer 32 is made of Polyimide (PI) or other suitable materials, and has a first surface 321 and a second surface 322. The first metal layer 40 is made of copper or other suitable material and is attached to the second surface 322 of the core layer 32. Next, a plurality of through holes 42 are formed to penetrate the core layer 32 and the first metal layer 40. In the present embodiment, the through hole 42 is formed by laser drilling. In another embodiment, the core layer 32 is made of Photosensitive Polyimide (PSPI), and the through holes 42 are formed by exposure and development. The core layer 32 has a thickness of about 12.5 micrometers (μm) or less, the first metal layer 40 has a thickness of about 9 micrometers or less, and each of the through-holes 42 has an inner diameter of about 5 to 100 micrometers. It is noted that the right side of the figure corresponds to the first portion 143 of the flexible sheet 14 of fig. 4, and the left side of the figure corresponds to the second portion 144 of the flexible sheet 14 of fig. 4.

Referring to fig. 16, a plated metal layer 44 is formed on the first surface 321 of the core layer 32, the lower surface of the first metal layer 40, and the inner sidewall of the through hole 42. In the present embodiment, the plating metal layer 44 is made of copper or other suitable materials, and is formed by electroless plating. The thickness of the plated metal layer 44 is about 1 to 5 microns. At this time, the metal layer 44 is plated on the inner sidewall of the through hole 42 to form the conductive via 38.

Referring to fig. 17, a first carrier 46 is attached to the electroplated metal layer 44 on the first surface 321 of the core layer 32. In this embodiment, the first carrier 46 is an adhesive tape. Next, a first photoresist layer 48 is formed on the electroplated metal layer 44 on the lower surface of the first metal layer 40. Next, a plurality of openings 481 are formed in the first photoresist layer 48 by exposure and development. Then, a portion of the plating metal layer 44 and a portion of the first metal layer 40 are removed by etching according to the opening 481 of the first photoresist layer 48. At this time, the first metal layer 40 forms the patterned first conductive layer 34.

Referring to fig. 18, the first photoresist layer 48 is removed, and a first insulating layer 391 is formed to cover the first conductive layer 34 and the plating metal layer 44. In the present embodiment, the first insulating layer 391 further extends to and fills the conductive via 38 and contacts the first carrier 46. The first insulating layer 391 is formed by curing a photosensitive resin type. The photosensitive resin type includes Polyimide (PI) resin, photoinitiator (photoinitiator), Coupling Agent (Coupling Agent), and Solvent (Solvent). Next, a plurality of openings 3911 are formed in the first insulating layer 391 to expose the plating metal layer 44. It is noted that the location of the opening 3911 corresponds to the second portion 144 of the flexible sheet 14 of fig. 4. The thickness of the first insulating layer 391 is about 3 to 5 microns.

Referring to fig. 19, a plurality of test contacts 146 are formed in the openings 3911, wherein the test contacts 146 contact the electroplated metal layer 44 to electrically connect the first conductive layer 34. Each of the test contacts 146 includes a base 1461 and a cover 1462, wherein the base 1461 is made of copper or nickel, and the cover 1462 is made of nickel, palladium and/or gold. In the present embodiment, the test contacts 146 are formed by an Electroless Nickel/Electroless Palladium Gold (ENEPIG) process. The thickness of the test contact 146 is about 4 to 6 microns.

Referring to fig. 20, a second carrier 50 is attached on the first insulating layer 391. In this embodiment, the second carrier 50 is attached to the first insulating layer 391 by an adhesive layer 52. The first carrier 46 is then removed.

Referring to fig. 21, a second photoresist layer 54 is formed on the metal layer 44 on the first surface 321 of the core layer 32. Next, a plurality of openings 541 are formed in the second photoresist layer 54 by exposing and developing to expose a portion of the plated metal layer 44.

Referring to fig. 22, a second metal layer 56 is formed (e.g., electroplated) in the opening 541 of the second photoresist layer 54 to fill the opening 541 and contact the electroplated metal layer 44. At this time, the second metal layer 56 forms the patterned second conductive layer 36.

Referring to fig. 23, a third photoresist layer 58 is formed on the second photoresist layer 54 and the second conductive layer 36. Next, a plurality of openings 581 are formed in the third photoresist layer 58 by exposure and development to expose portions of the second conductive layer 36. It is noted that the position of the opening 581 corresponds to the first portion 143 of the flexible sheet 14 of fig. 4. The third photoresist layer 58 and the second photoresist layer 54 may be made of the same material or different materials.

Referring to fig. 24, a third metal layer is formed (e.g., electroplated) in the opening 581 of the third photoresist layer 58 to fill the opening 581 and contact the second conductive layer 36. At this time, the third metal layer forms the intermediate pad 149. The intermediate pad 149 is made of copper or other suitable material. However, it is understood that the intermediate pad 149 may be omitted.

Referring to fig. 25, a fourth photoresist layer 60 is formed on the third photoresist layer 58 and the intermediate pads 149. Next, a plurality of openings 601 are formed in the fourth photoresist layer 60 by exposure and development to expose the intermediate pads 149. In an embodiment, the intermediate pad 149 may correspond to a plurality of openings 601. A fourth metal layer is then formed (e.g., electroplated) in the opening 601 of the fourth photoresist layer 60 to fill the opening 601 and contact the intermediate pad 149. At this time, the fourth metal layer forms the test probes 145. That is, the test probes 145 are located on the corresponding intermediate pads 149, and one or more test probes 145 may be located on one intermediate pad 149. The material of the test probe 145 may be copper, nickel or nickel-tungsten alloy. In other embodiments, if the intermediate pad 149 is omitted, the test probe 145 is directly on the second conductive layer 36. In the present embodiment, the end of each test probe 145 (i.e., the end point contacting the pad 301 to be tested of the workpiece 30 to be tested) is a plane, i.e., the cross section of each test probe 145 is substantially rectangular. However, in other embodiments, the end of each test probe 145 may be pointed (as shown in fig. 6), wedge-shaped (as shown in fig. 7), bolt-shaped (as shown in fig. 8), saw-toothed (as shown in fig. 8), or other shapes that facilitate good contact with the pad 301 to be tested.

Referring to fig. 26, the fourth photoresist layer 60, the third photoresist layer 58 and the second photoresist layer 54, as well as a portion of the plated metal layer 44 (i.e., the plated metal layer 44 not covered by the second conductive layer 36) are removed.

Referring to fig. 27, a second insulating layer 392 is formed to cover the second conductive layer 36, the metal layer 44 and a portion of the first surface 321 of the core layer 32 and surround the intermediate pad 149. The test probes 145 protrude from the second insulating layer 392. In this embodiment, the second insulating layer 392 is made of a photosensitive resin cured material. The photosensitive resin type includes Polyimide (PI) resin, photoinitiator (photoinitiator), Coupling Agent (Coupling Agent), and Solvent (Solvent). In other embodiments, the core layer 32, the first insulating layer 391 and the second insulating layer 392 may be made of different materials, and may be made of other suitable materials.

Next, the second carrier 50 and the adhesive layer 52 are removed to obtain the flexible board 14 shown in fig. 1, 3 and 4.

In other embodiments, a portion of the second insulating layer 392 in fig. 27 extends to a sidewall of each of the test probes 145 to surround and protect the test probes 145, and only the ends of the test probes 145 are exposed outside the second insulating layer 392. Thus, after removing the second carrier 50 and the adhesive layer 52, a flexible board 14a as shown in fig. 5 can be obtained.

As used herein, and not otherwise defined, the terms "substantially", "essentially" and "about" are used to describe and contemplate minor variations. When used in conjunction with an event or circumstance, the terms can refer to the situation in which the event or circumstance occurs explicitly, as well as the situation in which the event or circumstance occurs in close approximation. For example, the term can refer to less than or equal to ± 10%, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1% or less than or equal to ± 0.05%.

Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such a range format is used for convenience and brevity, and should be interpreted flexibly to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited.

While the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not intended to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the invention as defined by the claims. The illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, there may be a distinction between artistic renditions in the present invention and actual equipment. There may be other embodiments of the invention not specifically described. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present invention. All such modifications are intended to fall within the scope of the claims herein. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present invention.

Description of the symbols

1 testing device

1a testing device

1b testing device

1c testing device

1d testing device

2 buffer structure

2d buffer structure

10 base

14 flexible board

14a flexible board

14b flexible board

14c flexible board

14d flexible board

14e flexible board

20 screw

21 elastic structure

21b elastic structure

22 electrode carrier body

23 bearing seat

23d bearing seat

24 electrode

25 air chamber

30 workpiece to be tested

32 core layers

34 first conductive layer

36 second conductive layer

38 conductive path

40 first metal layer

42 through hole

44 electroplated metal layer

46 first carrier

48 first photoresist layer

50 second carrier

52 adhesive layer

54 second photoresist layer

56 second metal layer

58 the third photoresist layer

60 fourth photoresist layer

101 first surface of base

102 second surface of the base

103 through trench

104 fixed hole

105 central part

141 first surface of flexible board

142 second surface of the flexible board

143 first part

144 second part

145 test probe

146 test contact

147 third part

148 conductive trace

149 middle contact pad

211 upper plate

212 lower plate

213 spring

214 position limiting column

215 first elastomeric polymer material

231 second elastic polymeric material

241 metal pad

301 pad to be tested

391 first insulating layer

392 second insulating layer

481 opening

541 opening

581 opening

601 opening

1451 head part

1461 bottom

1462 covering part

2111 through hole

2141A main body part

2142 a top abutting part

3911 opening

Claims

1. A test device, comprising:

a base; and

a flexible board having a first portion, at least one second portion, a plurality of test probes and a plurality of test contacts, wherein the test probes are electrically connected to the test contacts, the test probes are located on the first portion of the flexible board and above the base, the test contacts are located on the second portion of the flexible board and below the base, the first portion of the flexible board is located above the central portion of the base, and

the test device further includes a buffer structure located on the first surface of the base, the buffer structure being located on the central portion, a first portion of the flexible sheet being attached to the buffer structure, and a second portion of the flexible sheet being attached to the second surface of the base.

2. The test device of claim 1, wherein the base has at least one through-channel through which the flexible board passes.

3. The test device of claim 1, wherein the flexible board further has a first surface and a second surface, the test probe is disposed adjacent to the first surface of the flexible board, and the test contact is disposed adjacent to the first surface or the second surface of the flexible board.

4. The test apparatus of claim 1, wherein the flexible board further comprises a core layer, a first conductive layer on the second surface of the core layer, a second conductive layer on the first surface of the core layer, and a plurality of conductive vias extending through the core layer and electrically connecting the first conductive layer and the second conductive layer, the test contacts electrically connecting the first conductive layer, and the test probes electrically connecting the second conductive layer.

5. The test apparatus as claimed in claim 4, wherein the flexible board further comprises a second insulating layer covering the second conductive layer and a portion of the first surface of the core layer, the test probe being electrically connected to the second conductive layer and protruding from the second insulating layer.

6. The test apparatus as claimed in claim 5, wherein a portion of the second insulating layer is disposed on a sidewall of each of the test probes to surround and protect the test probes.

7. The test device of claim 1, wherein an end of each of the test probes is planar, pointed, wedge-shaped in appearance, bolt-shaped, or serrated.

8. The test device of claim 1, wherein the cushioning structure comprises a socket and a resilient structure, the resilient structure being located on the base to provide cushioning; the lower end of the bearing seat is connected to the elastic structure, and the upper end of the bearing seat is used for bearing the first part of the flexible plate.

9. The test device of claim 1, wherein the buffer structure comprises a socket and an air chamber, the air chamber located on the base; the lower end of the bearing seat can move in the air chamber, and the upper end of the bearing seat is used for bearing the first part of the flexible plate.