JP2001099863A - Probe and probe card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-reliability probe card which allows the probe to be changed, if the probe fails. SOLUTION: The probe card comprises probes 100 contacted to electrodes 910 of a semiconductor integrated circuit 900 of an object to be measured such as LSI chips, etc., a board 200 having wiring patterns (not shown), a means 300 provided on the backside of the board 200 for supporting the probes 100, and a microconnector 400 to be a means for electrically connecting the probes 100 to the wiring pattern, and the probe 100 has an elastic part 130 formed like a flat plate between a rear end connection 120 and a top end contact 110.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for measuring various electrical characteristics of a semiconductor integrated circuit such as an LSI to be measured.

[0002]

2. Description of the Related Art A probe card used for measuring various electrical characteristics of a semiconductor integrated circuit such as an LSI formed on a wafer includes a horizontal type using a horizontal probe called a cantilever type and a vertical type. There are two types, a vertical type using a vertical probe called a type.
The cantilever type probe card is disadvantageous for simultaneous measurement of multiple chips of a recent semiconductor integrated circuit which has been miniaturized, increased in speed, and highly integrated. A vertical probe card has attracted attention as a material suitable for the recent simultaneous measurement of multiple chips. This is because the vertical probe card can have a higher probe density than the cantilever type and has a higher degree of freedom in the arrangement of the probes.

The conventional vertical probe card C shown in FIG. 5 uses hundreds to thousands of probes 950. At the middle part of the probe 950, a resilient portion 951 having a substantially rectangular shape in the lateral direction protruding in the lateral direction is provided. The elastic portion 951 deforms when the probe 950 comes into contact with the electrode 910 of the semiconductor integrated circuit 900 to secure a contact pressure between the probe 950 and the electrode.

[0004]

However, the above-described vertical probe card has the following problems. That is, among hundreds to thousands of probes 950,
The problem is that if even one of them fails, its replacement is difficult. That is, since the elastic portion 951 is formed in the probe 950, the elastic member 951 is sandwiched between the upper support plate 961 and the lower support plate 962, so that the elastic member 951 can be moved upward or downward. They cannot be pulled out.

As a probe which has solved this problem, there is a type in which a part 991 of a probe 990 is formed thinner than other parts, as shown in FIG. 6, instead of an elastic part.
In this case, the probe 991 can be pulled out both upward and downward.

[0006] However, in this type of probe, the buckling of the thinly formed portion is close to the elastic limit.
There is a problem that plastic deformation sometimes occurs, and reliability is lacking.

The present invention has been made in view of the above circumstances, and has as its object to provide a probe which can be easily replaced even if a problem occurs and which has high reliability, and a probe card using the probe. I have.

[0008]

According to the present invention, there is provided a probe comprising: a contact portion for contacting an electrode of an object to be measured; a connection portion for connection to a wiring pattern of a substrate constituting a probe card; And an elastic part provided between the elastic part and the elastic part. The elastic part is flattened.

A probe card according to the present invention comprises a probe in contact with an electrode of an object to be measured, a substrate on which a wiring pattern is formed, and support means provided on the back side of the substrate and supporting the probe. Connecting means for electrically connecting the probe and the wiring pattern, wherein the probe has a flattened elastic portion between a rear end connecting portion and a front end contacting portion. ing.

[0010]

FIG. 1 is a schematic sectional view of a probe card according to a first embodiment of the present invention, and FIG. 2 is a diagram showing a probe used in the probe card according to the first embodiment of the present invention. FIG. 3 is a schematic perspective view, FIG. 3 is a schematic sectional view of a probe card according to a second embodiment of the present invention, and FIG. 4 is a schematic of a micro connector used in the probe card according to the second embodiment of the present invention. FIG.

In FIG. 1 and FIG. 3, only three probes 100 and 600 are drawn on the probe cards A and B for the sake of drawing. However, actually, several hundred to several thousand probes are shown. There are probes 100 and 600.

The probe card A according to the first embodiment of the present invention includes a probe 100 which is in contact with an electrode 910 of a semiconductor integrated circuit 900 such as an LSI chip which is an object to be measured.
200 on which a wiring pattern (not shown) is formed
A support means 300 provided on the back side of the substrate 200 for supporting the probe 100;
And a micro connector 400 as a connecting means for electrically connecting between the probe 100 and the wiring pattern. The probe 100 includes a connecting portion 120 at a rear end and a contact portion 1 at a front end.
The elastic part 130 is flattened between the elastic part 10 and the elastic part 130.

The probe card A can measure a plurality of semiconductor integrated circuits 900 simultaneously.

The probe 100 is composed of a thin wire made of tungsten or the like having a diameter of about 80 μm. As shown in FIG. 2 (A), the elastic portion 130 of the probe 100 is flattened by hitting the thin line. That is, the contact portion 110 at the tip of the probe 100
And the connecting portion 120 at the rear end remain as a thin line left without being hit. However, the tip of the contact portion 110 is sharpened.

Since the elastic portion 130 is thinner than the other portions, that is, the contact portion 110 and the connecting portion 120, the elastic portion 130 is deformed when a vertical force is applied between the contact portion 110 and the connecting portion 120. It has become.

As another method of forming the elastic portion 130, there is a method of crushing with a roll. There is also a method of forming the probe 100 having the elastic portion 130 which is flattened from the beginning by an electroforming method using a photolithography technique.

On the other hand, the substrate 200
And the wiring pattern is formed in each layer. The substrate 200 has a through hole 2
Ten have been established. The through hole 210 is a portion through which a tail 420 of the micro connector 400 described later penetrates.

The support means 300 serves to prevent adjacent probes 100 from contacting each other and to prevent the positions of the contact portions 110 of a large number of probes 100 from shifting. With the support member 310 suspended from the support member 130,
It comprises an upper support plate 320 and a lower support plate 330 supported in parallel with the substrate 200.

The upper support plate 320 and the lower support plate 33
Since 0 is for preventing a short circuit due to contact between adjacent probes 100, the probe is naturally made of a material having an insulating property, for example, ceramics or the like.

The lower support plate 330 has a lower through hole 33 corresponding to the arrangement of the electrode 910 of the semiconductor integrated circuit 900.
1 has been established. The upper support plate 320 has an upper through hole 321 corresponding to the through hole 210 of the substrate 200. The upper through hole 321 is connected to the connection portion 120 of the probe 100 by the lower through hole 331.
Are portions where the contact portions 110 of the probe 100 are respectively inserted.

Here, the lower through hole 331 into which one probe 100 is inserted and the upper through hole 321 are not on a vertical line. That is, as shown in FIG.
1 and the upper through-hole 321 are displaced. The deviation between the upper through-hole 321 and the lower through-hole 331 is intentionally provided to deform the elastic portion 130 of the probe 100 into a bow shape (substantially S shape as shown in FIG. 2B). Things. That is, if the two through holes 321 and 331 are displaced, the elastic portion 130 is inevitably deformed. In addition, since the elastic portion 130 is flattened, it deforms like a bow.

The probe 100 is fixed to the upper support plate 320 with a silicon resin 500 or the like in a state where the connecting portion 120 is projected from the upper through hole 321 of the upper support plate 320.

On the other hand, the through hole 210 of the substrate 200 is located just above the upper through hole 321 of the upper support plate 320.

Incidentally, the micro connector 400
Is made of a palladium alloy, a nickel tungsten alloy, or a copper beryllium alloy, and has a cylindrical portion 410 into which the connecting portion 120 on the rear end side of the probe 100 is inserted, and which projects from the cylindrical portion 410 and is connected to the wiring pattern. Tail 420. The cylindrical portion 410 is formed in a cylindrical shape with an inner diameter set to about 80 μm and an upper end closed. Further, the tail part 420 protrudes from the closed upper end of the cylindrical part 410. This tail 420
It is inserted into the through hole 210 of the substrate 200 and is electrically connected to the wiring pattern.

The micro connector 400 has a Ni-
In some cases, a W-based or Fe-W-based electrolytic deposition alloy is used. These alloys have an amorphous or nanocrystalline structure, and are excellent in high hardness and high thermal stability.

Next, measurement of various electrical characteristics of the semiconductor integrated circuit 900 using the probe card configured as described above will be described. The wafer on which a number of semiconductor integrated circuits 900 are formed is sucked to the suction table 920. And
The probe card A and the suction table 920 are relatively approached to each other, and the contact portion 110 of the probe 100 is brought into contact with the electrode 910 of the semiconductor integrated circuit 900. Even after the two touch, the probe card A and the suction table 920 are relatively approached. This approach (referred to as overdrive) applies an upward force to the probe 100, and the elastic portion 130 of the probe 100 is deformed. The probe 100 and the electrode 910 are deformed by the deformation of the elastic part 130.
And the contact pressure between them.

In this state, an electric signal is exchanged between a tester (not shown) connected to the probe card A and the semiconductor integrated circuit 900 to measure various electric characteristics of the plurality of semiconductor integrated circuits 900. At the same time.

When the measurement of this cycle is completed, the contact between the probe 100 and the electrode 910 is released, and the probe 100 is brought into contact with the electrode 910 of the next semiconductor integrated circuit 900.

Probe 1 is defective due to multiple use
If it occurs at 00, the failed probe 10
Replace 0. That is, the silicon resin 500 fixing the probe 100 and the upper support plate 320 is removed,
When the probe 100 is pulled downward, the probe 100 comes off the micro connector 400.
Can be easily removed.

After that, a new probe 100 is inserted through the lower through hole 331 of the lower support plate 330, the connecting portion 120 is inserted into the corresponding micro connector 400, and fixed to the upper support plate 320 with the silicon resin 500. Thus, the replacement of the probe 100 is completed.

In the above-described first embodiment, the probe 100 is described as being attached to the support means 300 in a state where the elastic part 130 is deformed into a bow shape from the beginning, but the following is also possible. is there.

That is, the probe is set with the upper through hole 321 of the upper support plate 320 constituting the support means 300 and the corresponding lower through hole 331 of the lower support plate 330 located on the same vertical line. The elastic portion 130 can be deformed like an arc by attaching the upper support plate 100 and thereafter displacing the upper support plate 320 and the lower support plate 330 in the lateral direction. This makes it easier to attach the probe 100 to the support means 300.

In the probe card A according to the first embodiment described above, the probe 100 has a flat elastic part 1.
However, in the probe card B according to the second embodiment described below, the micro connector 70 is provided.
It is characteristic that an elastic portion 730 flattened to zero is formed.

As shown in FIG. 3, the probe card B according to the second embodiment has an LSI as an object to be measured.
A probe 800 that contacts the electrode 910 of the semiconductor integrated circuit 900, a substrate 800 on which a wiring pattern (not shown) is formed, and support means 300 provided on the back side of the substrate 800 and supporting the probe 600. And a micro connector 700 as connection means for electrically connecting the probe 600 to the wiring pattern. The micro connector 700 is a cylinder into which a connection portion 620 on the rear end side of the probe 600 is inserted. It has a portion 710 and a tail portion 720 protruding from the cylindrical portion 710 and connected to the wiring pattern. The tail portion 720 has an elastic portion 730 deformed into an arc shape.

The probe 600 includes the probe 10
It is extremely shorter than 0, and is set to such a length that the connecting portion 620 protrudes from the upper surface of the lower support plate 330 in a state of penetrating the lower through hole 331 of the lower support plate 330 constituting the support means 300. ing. The probe 600 is fixed to the lower support plate 330 by the silicon resin 500.

The substrate 800 is substantially the same as the substrate 200 described in the first embodiment. However, the through hole 21
There is no equivalent to 0, and a pad 810 connected to the wiring pattern is formed on the lower surface. This pad 810
The arrangement pattern of the upper through holes 32 of the upper support plate 320
1 is the same as the arrangement pattern.

The support means 300 serves to prevent adjacent probes 600 from contacting each other and to prevent the positions of the contact portions 610 of a large number of probes 600 from shifting. A support member 310 suspended from the lower surface of the substrate, and an upper support plate 320 supported in parallel with the substrate 800 by the support member 310
And the lower support plate 330.

The upper support plate 320 and the lower support plate 33
Since 0 is for preventing a short circuit due to contact between adjacent probes 600, it is naturally made of a material having an insulating property, for example, ceramics or the like.

The lower support plate 330 has a lower through hole 33 corresponding to the arrangement of the electrode 910 of the semiconductor integrated circuit 900.
1 has been established. The upper support plate 320 has an upper through hole 321 corresponding to the pad 810 of the substrate 800. The upper through hole 321 is a portion into which a tail 720 of a micro connector 700 described later is inserted, and the lower through hole 331 is a portion into which a probe 600 is inserted.

Here, the lower through hole 331 into which one probe 600 is inserted and the corresponding upper through hole 321 into which the tail 710 of the micro connector 700 is inserted are not on a vertical line. That is, as shown in FIG. 3, the lower through hole 331 and the upper through hole 321 are shifted. The displacement between the upper through-hole 321 and the lower through-hole 331 is intentionally provided to deform the elastic portion 730 of the micro connector 700 into a bow shape (substantially S shape as shown in FIG. 4B). It is a thing. That is, if the two through holes 321 and 331 are shifted, the elastic portion 73
0 is deformed.

The micro connector 700 is made of a palladium alloy or a copper beryllium alloy, and has a cylindrical portion 71 into which a connecting portion 620 at the rear end of the probe 600 is inserted.
0 and a tail 710 protruding from the cylindrical portion 710 and connected to the wiring pattern. Up to this point, the configuration is the same as that of the micro connector 700 according to the first embodiment. However, the micro connector 700 according to the second embodiment is different from the micro connector 700 in that a bow-shaped elastic portion 730 is formed on the tail portion 720.

Next, measurement of various electrical characteristics of the semiconductor integrated circuit 900 using the probe card configured as described above will be described. The wafer on which a number of semiconductor integrated circuits 900 are formed is sucked to the suction table 920. And
The probe card B and the suction table 920 are relatively approached to each other, and the contact portion 610 of the probe 600 is brought into contact with the electrode 910 of the semiconductor integrated circuit 900. Even after the two touch, the probe card B and the suction table 920 are relatively approached. This approach (referred to as overdrive) applies an upward force to the probe 600. Then, the probe 600 moves itself to the lower support plate 330.
Is displaced upward against the silicon resin 500 fixed to the substrate. Due to the upward displacement of the probe 600, the elastic portion 730 of the micro connector 700 is deformed. Due to the deformation of the elastic portion 730, a contact pressure between the probe 600 and the electrode 910 is secured.

In this state, electric signals are exchanged between a tester (not shown) connected to the probe card B and the semiconductor integrated circuit 900 to measure various electric characteristics of the plurality of semiconductor integrated circuits 900. At the same time.

When the measurement of this cycle is completed, the contact between the probe 600 and the electrode 910 is released, and the probe 600 is brought into contact with the electrode 910 of the next semiconductor integrated circuit 900.

The probe 6 failed due to many uses.
If it occurs at 00, the failed probe 60
Replace 0. That is, the silicon resin 500 fixing the probe 600 and the upper support plate 320 is removed,
When the probe 600 is pulled downward, the probe 600 comes off the micro connector 700 and also comes off the lower support plate 330.

After that, a new probe 600 is inserted from the lower through hole 331 of the lower support plate 330, the connection portion 620 is inserted into the corresponding micro connector 700, and fixed to the lower support plate 330 with the silicon resin 500. . Thus, the replacement of the probe 600 is completed.

In the above-described second embodiment, the micro connector 700 is described as being attached to the support means 300 in a state where the elastic portion 730 is deformed like a bow from the beginning, but the following is also possible. It is.

That is, the upper through-hole 321 of the upper support plate 320 constituting the support means 300 and the corresponding lower through-hole 331 of the lower support plate 330 are positioned on the same vertical line. By attaching the connector 700 and thereafter displacing the upper support plate 320 and the lower support plate 330 in the horizontal direction, it is also possible to deform the elastic portion 730 in a bow shape. This makes it easier to attach the micro connector 700 to the support means 300.

[0049]

According to the probe of the present invention, a contact portion that contacts an electrode of an object to be measured, a connection portion that is connected to a wiring pattern of a substrate constituting a probe card, and a connection portion between the contact portion and the connection portion. And an elastic portion provided in the elastic member, and the elastic portion is flattened.

For this reason, this probe has high reliability because plastic deformation does not occur in the elastic portion as in the prior art. Also, when replacing the probe, the flattened part does not hinder the extraction of the probe,
Easy to replace.

On the other hand, the probe card according to the present invention comprises a probe contacting an electrode of an object to be measured, a substrate on which a wiring pattern is formed, and support means provided on the back side of the substrate and supporting the probe. Connecting means for electrically connecting the probe and the wiring pattern, wherein the probe has an elastic portion flattened between a connecting portion at a rear end and a contact portion at a front end. ing.

Therefore, even if a problem occurs in the probe, it is easy to replace only the probe in which the problem occurs.

Further, if the elastic portion of the probe is deformed in a bow shape between the contact portion and the connecting portion, the elastic portion is deformed when an overdrive is applied. Contact pressure between the probe and the probe can be secured.

Further, the connecting means includes a tubular portion into which the connecting portion on the rear end side of the probe is inserted, and a projecting portion protruding from the tubular portion.
A micro connector having a tail connected to the wiring pattern facilitates electrical connection between the wiring pattern on the substrate and the probe. Specifically, just insert the connection part of the rear end of the probe into the cylindrical part of the micro connector,
The contact between the two, and the electrical connection between the probe and the wiring pattern on the substrate, is ensured. This is convenient for the operation of exchanging the probe.

Another probe card according to the present invention comprises a probe in contact with an electrode of an object to be measured, a substrate on which a wiring pattern is formed, and a substrate provided on the back side of the substrate. Connecting means for electrically connecting between, and a supporting means for supporting the connecting means and the probe, the connecting means, a cylindrical portion into which a connecting portion on the rear end side of the probe is inserted, A micro connector protruding from the cylindrical portion and having a tail portion connected to the wiring pattern, wherein the tail portion has an elastic portion deformed into an arc shape.

As described above, even if an elastic portion deformed in an arc shape is formed on the micro connector instead of the probe, the contact pressure can be ensured by overdrive. Moreover,
Since the replacement of the probe is completed simply by inserting and removing the probe from the tube portion of the micro connector, the replacement operation is further simplified.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a probe card according to a first embodiment of the present invention.

FIG. 2 is a schematic perspective view of a probe used for the probe card according to the first embodiment of the present invention.

FIG. 3 is a schematic sectional view of a probe card according to a second embodiment of the present invention.

FIG. 4 is a schematic perspective view of a micro connector used for a probe card according to a second embodiment of the present invention.

FIG. 5 is a schematic sectional view of a conventional vertical probe card.

FIG. 6 is a schematic front view of a probe used in a conventional vertical probe card.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 110 contact part 120 connecting part 130 elastic part 200 substrate 300 supporting means 400 micro connector (connecting means) 410 cylindrical part 420 tail part 900 semiconductor integrated circuit (measurement object) 910 electrode

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Hiroshi Iwata 2-5-113, Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Japan Electronic Materials Co., Ltd. F-term (reference) 2G003 AA07 AA10 AG03 AG04 AG12 AH00 2G011 AA17 AA21 AB06 AB07 AB08 AC05 AC14 AE03 AE22 AF01 AF07 4M106 AA01 AA02 BA01 BA14 DD03 DD09 DD10 DD18

Claims (5)

[Claims] A contact portion for contacting an electrode of an object to be measured;
The probe card has a connection portion connected to a wiring pattern of a substrate, and an elastic portion provided between the contact portion and the connection portion, and the elastic portion is a flat plate. A probe, characterized in that: 2. A probe in contact with an electrode of an object to be measured, a substrate on which a wiring pattern is formed, a supporting means provided on the back side of the substrate and supporting the probe, and Connection means for electrically connecting the probe and the probe, wherein the probe has a flattened elastic portion between the rear end connection portion and the front end contact portion. Probe card. 3. The probe card according to claim 2, wherein the elastic portion of the probe is deformed like a bow between the contact portion and the connection portion. 4. The micro connector according to claim 1, wherein said connecting means is a micro connector having a tubular portion into which a connecting portion on a rear end side of the probe is inserted, and a tail projecting from said tubular portion and connected to said wiring pattern. The probe card according to claim 2 or 3, wherein 5. A probe provided in contact with an electrode of an object to be measured, a substrate on which a wiring pattern is formed, and connection means provided on the back side of the substrate for electrically connecting the probe and the wiring pattern. And a connecting means and a supporting means for supporting the probe, wherein the connecting means is a cylindrical portion into which a connecting portion on the rear end side of the probe is inserted,
A probe card, comprising: a micro connector having a tail protruding from the cylindrical portion and connected to the wiring pattern, wherein the tail has an elastic portion deformed into an arc shape.