JP2012173263A - Electrical contact and electrical contact unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve high frequency characteristics of a contact probe while securing a desired overdrive amount, a desired needle pressure, and a desired current resistance characteristic.SOLUTION: In a vertical probe comprising a body 1 and a contact 2, the body 1 comprises two or more slender plates 10A to 10C whose main surfaces face each other via gaps 10S, a first connection part 11 for connecting one ends of the plates 10A to 10C with each other, and a second connection part 12 for connecting the other ends of the plates 10A to 10C with each other. By making the plates 10A to 10C thinner, stress at the overdrive is reduced so that a desired overdrive amount is secured by bending the plates 10A to 10C more largely. By including two or more plates 10A to 10C, a cross sectional area is increased so that a desired needle pressure and a desired current resistance characteristic are secured.

Description

  The present invention relates to an electrical contact and an electrical contact unit, and more specifically, an electrical contact that performs electrical connection by contacting an electrode terminal, and such an electrical contact. The present invention relates to an improvement of an electrical contact unit.

  A semiconductor device is manufactured by forming a large number of semiconductor devices on a semiconductor wafer, dicing the semiconductor wafer after conducting an electrical property test on these semiconductor devices, and separating the semiconductor devices.

  An electrical characteristic test of a semiconductor device is performed by bringing a semiconductor wafer close to a probe card in which a large number of contact probes are formed on a wiring board, and bringing each contact probe into contact with a corresponding electrode pad on the semiconductor wafer. When the contact probe and the electrode pad are brought into contact with each other, a process of bringing the semiconductor wafer closer to the probe card is performed after reaching a state where the contact probe and the electrode pad begin to contact each other. Such processing is called overdrive, and the distance of overdrive is called overdrive amount.

  Overdrive is a process that elastically deforms contact probes. By performing overdrive, all contact probes are reliably brought into contact with the electrode pads even if the heights of the electrode pads and contact probes vary. be able to. In addition, the contact probe is elastically deformed during overdrive, and the tip of the contact probe moves on the electrode pad, thereby scrubbing. By this scrubbing, the oxide film on the electrode pad surface is removed, and the contact resistance can be reduced.

  In such a probe card, if the length of the contact probe is shortened, its inductance can be reduced and the high frequency characteristics of the test signal can be improved. However, if it is attempted to secure a sufficient overdrive amount while shortening the length of the contact probe, there is a problem that the contact probe is plastically deformed during overdrive.

  If the length of the contact probe is made shorter, it is necessary to bend the contact probe more greatly during overdrive. As a result, if the stress generated in the contact probe exceeds the stress limit, plastic deformation occurs. For this reason, it has been difficult to shorten the length of the contact probe while securing the amount of overdrive.

  Therefore, it is conceivable to suppress the stress during overdrive by reducing the thickness of the contact probe. When the contact probe is bent in the thickness direction, the maximum stress is generated outside the bending portion. Since this stress has a value corresponding to the thickness of the contact probe, the stress during overdrive can be reduced by reducing the thickness of the contact probe. That is, even if the length of the contact probe is shortened, a desired overdrive amount can be ensured by reducing the thickness accordingly.

  However, if the thickness of the contact probe is reduced, the cross-sectional area thereof is also reduced, so that there are problems that the needle pressure at the time of overdrive is reduced and the current resistance characteristics are deteriorated. In order to solve such a problem, it is necessary to increase the width of the contact probe to ensure a cross-sectional area. However, there is a limit to increasing the width of the contact probe. For example, the maximum width determined by manufacturing restrictions and contact probe arrangement intervals cannot be exceeded, and there is a limit to shortening the contact probe length.

  Such a problem is a common problem for electrical contacts that are brought into contact with an electrode terminal with elastic deformation and reliably connected to the electrode terminal, and are contact probes used for electrical characteristic tests of semiconductor devices. Is an example of such an electrical contact.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to improve the high frequency characteristics of an electrical contact that is brought into contact with an electrode terminal with elastic deformation. In particular, an object is to improve high-frequency characteristics while ensuring needle pressure during elastic deformation. Moreover, it aims at improving a high frequency characteristic, ensuring a withstand current characteristic.

  Another object of the present invention is to improve the high frequency characteristics of an electrical contact unit having a large number of electrical contacts. In particular, it is an object to improve high-frequency characteristics while ensuring a needle pressure during elastic deformation of each electrical contact. Moreover, it aims at improving a high frequency characteristic, ensuring a withstand current characteristic.

  An electrical contact according to a first aspect of the present invention is an electrical contact for bringing a contact portion into contact with an electrode terminal with elastic deformation of the main body, and the main body is opposed to a main surface through a gap. Two or more elongated plate-shaped bodies, a first coupling portion that couples one end of the plate-shaped body to each other, and a second coupling portion that couples the other ends of the plate-shaped body to each other, It is formed at the tip of the second coupling part. The main surface here means the wide surface of the plate-like body.

  By making a part of the electrical contact into a plate-like body, it is possible to bend more greatly without plastic deformation by reducing the stress generated when it is bent in the thickness direction. For this reason, it is possible to shorten the electrical contact while ensuring a desired overdrive amount. That is, it is possible to improve the high frequency characteristics of the electrical contact that can be reliably brought into contact with the electrode terminal.

  In addition, two or more plate-like bodies are provided, and the main surfaces of these plate-like bodies are opposed to each other via a gap, thereby increasing the cross-sectional area without increasing the width of each plate-like body, and increasing the needle pressure and resistance. Current characteristics can be ensured. That is, the high frequency characteristics can be improved while ensuring the needle pressure and the current resistance characteristics of the electrical contact that can be reliably brought into contact with the electrode terminal.

  An electrical contact unit according to a second aspect of the present invention comprises two or more elongated plate-like bodies whose main surfaces are opposed to each other through a gap, a first coupling portion for joining one end of the plate-like body to each other, and the plate-like body And a contact portion formed at a tip of the second coupling portion, the contact portion being brought into contact with the electrode terminal with elastic deformation of the plate-like body. An electrical contact, a support substrate that supports a first coupling portion of the electrical contact, a guide hole through which the electrical contact penetrates, and a second coupling portion that faces the inner peripheral surface of the guide hole And a guide plate that supports the electrical contactor so as to be movable in the longitudinal direction.

  With the second coupling portion facing the inner peripheral surface of the guide hole, the guide plate supports the electrical contactor so as to be movable in the longitudinal direction. It can suppress moving in parallel with the electrode terminal. That is, during overdrive, the contact portion can be moved in the longitudinal direction of the electrical contact, so that the overdrive suppresses the contact portion from largely moving on the electrode terminal and coming off from the electrode terminal. it can.

  The electrical contact according to the present invention can be bent more greatly by reducing the stress generated during bending by forming a part of the electrical contact into a plate-like body. For this reason, the electrical contact can be shortened while ensuring a desired overdrive amount, and the high frequency characteristics of the electrical contact can be improved.

  In addition, by providing two or more plate-like bodies, the cross-sectional area is increased without increasing the thickness and width of each plate-like body by making the main surfaces of these plate-like bodies face each other via a gap, and the needle Pressure and current resistance characteristics can be secured. Therefore, the high frequency characteristics can be improved while securing the needle pressure and current resistance characteristics of the electrical contact.

  Further, the electrical contact unit according to the present invention is configured such that the guide plate supports the electrical contact so as to be movable in the longitudinal direction in a state where the second coupling portion is opposed to the inner peripheral surface of the guide hole. At the time of overdrive for bending the state body, the contact portion can be moved substantially in the longitudinal direction of the electrical contact. Therefore, it is possible to suppress the contact portion from being largely moved on the electrode terminal and being detached from the electrode terminal due to overdrive.

It is the external view which showed one structural example of the contact probe by embodiment of this invention. It is the figure which showed one structural example of the probe card by embodiment of this invention. It is the figure which showed an example of the elastic deformation by the overdrive of the contact probe 101 by embodiment of this invention. It is the figure which showed an example of the elastic deformation by the overdrive of the contact probe 102 by embodiment of this invention. It is the figure which showed the other example of the elastic deformation by the overdrive of the contact probe 101 of FIG. It is the figure which showed the other example of the elastic deformation by the overdrive of the contact probe 102 of FIG. It is the figure which showed an example of the elastic deformation by the overdrive of the contact probe 103 by embodiment of this invention. It is explanatory drawing about an example of the manufacturing method of the contact probe 100 of FIG. It is explanatory drawing about an example of the manufacturing method of the contact probe 100 of FIG. It is the perspective view which showed a mode that the board | substrate 400 of FIG.8 (c) was seen from diagonally upward.

  FIG. 1 is an external view showing an example of the configuration of a contact probe according to an embodiment of the present invention. In FIGS. 1A and 1B, contact probes 100 and 110 are shown, respectively. The contact probes 100 and 110 are probes used for electrical characteristic tests of semiconductor devices, and are examples of electrical contacts.

  A contact probe 100 shown in FIG. 2A is a vertical probe in which a contact portion 2 is formed at one end of a main body portion 1 having a substantially linear and elongated shape. The main body 1 and the contact 2 are both made of a conductive material, the main body 1 is arranged so as to be substantially perpendicular to the inspection object (not shown), and the contact 2 is connected to the electrode terminal on the inspection object. Are used in contact with each other. Further, at the time of overdrive, the main body 1 is elastically deformed into a bow shape, so that the contact portion 2 can be reliably brought into contact with the electrode terminal.

  The main body 1 is a first coupling portion in which two plate-like bodies 10A and 10B whose main surfaces are opposed to each other via a gap 10S and one end (rear end) of these plate-like bodies 10A and 10B are coupled to each other. 11 and a second coupling portion 12 in which the other ends (front ends) of the plate-like bodies 10A and 10B are coupled to each other. The contact portion 2 is formed at the tip (front end) of the second coupling portion 12 and has a shape protruding from the second coupling portion 12.

  The main body 1 is preferably made of a material having high conductivity and excellent elastic properties, for example, a Ni-Co (nickel cobalt) alloy, and the contact portion 2 has high conductivity and wear resistance. It is desirable to be made of an excellent material such as Rh (rhodium). However, if the main body 1 and the contact 2 are integrally formed using the same metal material, the manufacturing cost can be suppressed. Moreover, the contact part 2 should just protrude from the front end of the main-body part 1, The shape is arbitrary.

  The plate-like bodies 10A and 10B have a thickness shorter than the width, and can be easily bent in the thickness direction by the needle pressure that the contact portion 2 receives from the electrode terminals. When the plate-like bodies 10A and 10B are curved, the maximum stress is generated outside the curved portion. In general, if the curvature of the curved portion is the same, the stress generated in the curved portion has a value corresponding to the thickness of the plate-like bodies 10A and 10B. For this reason, if the thickness of plate-like body 10A, 10B is made thin, the stress which generate | occur | produces at the time of curvature can be reduced. That is, by reducing the thickness of the plate-like bodies 10A and 10B, the plate-like bodies 10A and 10B can be curved more greatly without plastic deformation, and the amount of overdrive can be increased.

  Moreover, plate-like body 10A, 10B can increase each cross-sectional area by increasing the width | variety. Furthermore, the cross-sectional area of the contact probe 100 can be further increased by arranging the two plate-like bodies 10A and 10B. If the cross-sectional area of the contact probe 100 is increased in this way, the needle pressure can be increased and the current resistance characteristics can be improved.

  That is, by using the two plate-like bodies 10A and 10B, the cross-sectional area of the contact probe 100 can be secured even if the thickness of the plate-like bodies 10A and 10B is reduced. Therefore, the main body 1 can be shortened while ensuring a desired overdrive amount and ensuring a desired stylus pressure and current resistance characteristics. If the main body 1 can be shortened, the inductance of the contact probe 100 can be reduced, and thus the high frequency characteristics can be improved.

  Compared with the contact probe 100, the contact probe 110 shown in (b) in the drawing is different in that it includes three plate-like bodies 10A to 10C, but the other configurations are the same. The three plate-like bodies 10A to 10C face each other through the gap 10S. Moreover, the 1st coupling | bond part 11 couple | bonds the end of three plate-like bodies 10A-10C mutually, and the 2nd coupling | bond part 12 has couple | bonded the other end of three plate-like bodies 10A-10C mutually. .

  If the thicknesses of the respective plate-like bodies 10A to 10C are the same, the contact probe 110 having the three plate-like bodies 10A to 10C is more main body than the contact probe 100 having the two plate-like bodies 10A and 10B. The cross sectional area of 1 can be increased. Exactly the same, if four or more plate-like bodies are provided, the cross-sectional area of the main body 1 can be further increased.

  FIG. 2 is a diagram showing a configuration example of the probe card according to the embodiment of the present invention. This probe card includes a main board 3, an ST (Space Transformer) board 4 and a probe unit 5. The probe unit 5 uses the contact probe 100 shown in FIG.

  The main board 3 is a wiring board that is detachably attached to a probe device (not shown), an external terminal is formed near the outer periphery, and an ST board 4 is attached near the center. The probe unit 5 is a structure that holds two or more contact probes 100 and is attached to the ST substrate 4. The ST substrate 4 is a substrate for electrically connecting electrode terminals (not shown) formed on the main substrate 3 with a wide pitch and electrode terminals (not shown) formed on the probe unit 5 with a narrow pitch.

  The probe unit 5 includes a wiring board 50, guide plates 51 and 52, a guide support portion 53, and a contact probe 100. The wiring board 50 is a support board that supports two or more contact probes 100, and two or more electrode terminals 50t corresponding to the contact probes 100 are formed. The guide plate 51 is formed with two or more guide holes 51h, and is fixed to the wiring board 50 so as to expose the electrode terminals 50t. The guide plate 52 is disposed so as to face the guide plate 51 with a space interposed therebetween, and two or more guide holes 52h corresponding to the electrode terminals 50t are formed. The guide support portion 53 is fixed to the wiring board 50 and supports the guide plate 52.

  In the contact probe 100, the upper end of the main body 1 is inserted into the guide hole 51 h of the guide plate 51 and connected to the electrode terminal 50 t on the wiring board 50. Further, the lower end of the main body 1 where the contact portion 2 is formed penetrates the guide hole 52 h of the guide plate 52 and protrudes from the guide plate 52. The guide holes 51h and 52h restrain the contact probe 100 in the vicinity of both ends of the contact probe 100 and allow movement in the longitudinal direction while restricting movement in the direction intersecting the longitudinal direction.

  That is, the contact probe 100 is supported by the guide plates 51 and 52 so that the vicinity of both ends thereof can be moved up and down, and can be bent in the space between the guide plates 51 and 52 during overdrive. The position of both ends of 100 is prevented from shifting.

  FIG. 3 is a diagram showing an example of elastic deformation due to overdrive of the contact probe 101 according to the embodiment of the present invention. The contact probe 101 has the same configuration as the contact probe 100 of FIG. 1, and the rear end thereof is supported by the wiring board 50 and the guide plate 51, but the front end thereof is not supported by the guide plate 52, It is open.

  (A) in the drawing shows the state of the contact probe 101 immediately before overdrive. That is, the state when the inspection object and the contact probe 101 are brought close to each other and the electrode terminal 300 starts to contact the contact portion 2 is shown. Further, (b) in the figure shows the state of the contact probe 101 after overdrive. That is, the state when the inspection object and the contact probe 101 are brought closer to each other by the predetermined overdrive amount L from the state of (a) is shown.

  In the contact probe 101, the plate-like bodies 10A and 10B are greatly curved in the thickness direction, thereby causing the contact portion 2 to retreat by an overdrive amount L. For this reason, the contact probe 101 before overdrive is substantially perpendicular to the electrode terminal 300, but after the overdrive, the vicinity of the front end of the contact probe 101 is greatly inclined.

  The oxide film on the electrode terminal 300 is destroyed when the contact portion 2 comes into contact therewith. For this reason, by the subsequent overdrive, the contact probe 101 is tilted and the contact surface of the contact portion 2 that is brought into contact with the electrode terminal 300 is changed. Can be obtained.

  FIG. 4 is a diagram showing an example of elastic deformation due to overdrive of the contact probe 102 according to the embodiment of the present invention. (A) in the figure shows the state immediately before overdrive, and (b) in the figure shows the state after overdrive.

  The contact probe 102 is longer in the first coupling part 11 and the second coupling part 12 and shorter in the plate-like bodies 10 </ b> A and 10 </ b> B than the contact probe 101, but the other configurations are the same as the contact probe 101. It is. Since the contact probe 102 has short plate-like bodies 10A and 10B, the curvature after overdrive is slightly larger than that of the contact probe 101, and the inclination near the tip with respect to the electrode terminal 300 is also slightly larger. .

  FIG. 5 is a diagram showing another example of elastic deformation due to overdrive of the contact probe 101 of FIG. (A) in the figure shows the state immediately before overdrive, and (b) in the figure shows the state after overdrive. 5 differs from FIG. 3 in that the vicinity of the front end of the contact probe 101 is supported by the guide plate 52 so as to be movable in the longitudinal direction.

  By causing the contact probe 103 to pass through the guide hole 52h of the guide plate 52 and restraining the vicinity of the front end of the contact probe 101 by the guide plate 52, the contact portion 2 can be scrubbed with respect to the electrode terminal 300 during overdrive. . In the case of FIG. 3 in which the guide plate 52 is not used, only the angle of the contact probe 101 with respect to the electrode terminal 300 changes during overdrive, whereas in the case of FIG. The contact part 2 moves on the electrode terminal 300. For this reason, the oxide film on the electrode terminal 300 can be removed to obtain a good contact state.

  FIG. 6 is a view showing another example of elastic deformation due to overdrive of the contact probe 102 of FIG. (A) in the figure shows the state immediately before overdrive, and (b) in the figure shows the state after overdrive. 6 is different from FIG. 4 in that the vicinity of the front end of the contact probe 102 is supported by the guide plate 52 so as to be movable in the longitudinal direction.

  The contact probe 102 is held so that the second coupling portion 12 faces the inner peripheral surface of the guide hole 52 h of the guide plate 52 before and after overdrive. That is, the rear end of the second coupling portion 12 is located closer to the wiring board 50 than the guide plate 52 in a state before overdrive. For this reason, the contact part 2 moves substantially perpendicular to the electrode terminal 300 during overdrive. Therefore, when the area of the electrode terminal 300 is small, it is possible to prevent the contact portion 2 from coming into contact with the electrode terminal 300 by scrubbing the contact portion 2.

  FIG. 7 is a diagram showing an example of elastic deformation due to overdrive of the contact probe 103 according to the embodiment of the present invention. (A) in the figure shows the state immediately before overdrive, and (b) in the figure shows the state after overdrive.

  The contact probe 103 has three plate-like bodies 10A to 10C and has the same configuration as the contact probe 110 of FIG. Similarly to FIG. 7, the rear end is supported by the wiring substrate 50 and the guide plate 51, and the second coupling portion 12 is supported by the guide plate 52 so as to be movable in the longitudinal direction.

  The state of the contact probe 103 curved by overdrive is substantially the same as that of the contact probe 102 of FIG. However, since the number of the plate-like bodies 10A to 10C is large, the cross-sectional area of the contact probe is large, the needle pressure is increased, and the current resistance characteristics are also improved.

  8-10 is explanatory drawing about an example of the manufacturing method of the contact probe 100 of FIG. FIGS. 8A to 8D and FIGS. 9A to 9D are diagrams showing the manufacturing process of the contact probe 100 in time series. FIG. 10 is a perspective view showing the state of FIG.

  FIG. 8A shows a conductive substrate on which the contact probe 100 is formed. Here, it is assumed that the conductive thin film 401 is formed on the entire top surface of the silicon substrate 400.

  FIG. 8B shows a state in which a sacrificial layer 403 is formed in a region where the photoresist 402 is not formed after the photoresist 402 is selectively formed on the conductive thin film 401. After the photoresist 402 is formed on the entire surface of the substrate 400, only the photoresist 402 in a region corresponding to the contact portion 2 is selectively removed. That is, the conductive thin film 401 can be exposed in a region corresponding to the contact portion 2. In this state, if a sacrificial metal such as Cu is electroplated, the sacrificial metal can be deposited in a region corresponding to the contact portion 2 to form the sacrificial layer 403.

  FIG. 8C shows a state in which the photoresist 402 is removed and a new photoresist 404 is selectively formed. After the photoresist 404 is formed on the entire surface of the substrate 400, only the photoresist 404 in a region corresponding to the main body 1 is selectively removed. That is, the conductive thin film 401 can be exposed in a region corresponding to the main body 1. FIG. 10 is a perspective view showing a state where the substrate 400 at this time is viewed obliquely from above. Photoresist 404 is left in a region corresponding to between plate-like bodies 10A and 10B.

  FIG. 8D shows a state in which a conductive metal layer 405 is formed in a region where the photoresist 404 is not formed. In the state shown in FIG. 8C, if a conductive metal such as Ni—Co is electroplated, the conductive metal is deposited in a region corresponding to the main body 1 to form the conductive metal layer 405. it can.

  FIG. 9A shows a state in which the photoresist 404 is removed and a new photoresist 406 is selectively formed. After the photoresist 406 is formed on the entire surface of the substrate 400, only the photoresist 406 in the region corresponding to the main body portion 1 and the contact portion 2 is selectively removed. That is, the sacrificial layer 403 and the conductive metal layer 405 can be exposed.

  FIG. 9B shows a state in which a conductive metal is deposited in a region where the photoresist 404 is not formed. In the state of FIG. 9A, when a conductive metal such as Ni—Co is electroplated, the conductive metal can be deposited on the sacrificial layer 403 and the conductive metal layer 405.

  FIG. 9C shows a state in which the photoresist 406 is removed and a new photoresist 407 is selectively formed. After the photoresist 407 is formed on the entire surface of the substrate 400, only the photoresist 407 in the region corresponding to the main body 1 is selectively removed. That is, the contact part 2 is masked, and only the conductive metal layer 405 in the region corresponding to the main body part 1 can be exposed.

  FIG. 9D shows a state in which a conductive metal is deposited in a region where the photoresist 407 is not formed. In the state of FIG. 9C, if a conductive metal such as Ni—Co is electroplated, a conductive metal can be further deposited on the conductive metal layer 405 in the region corresponding to the main body 1. .

  Finally, if only the conductive metal layer 405 is taken out, the contact probe 100 can be obtained. For example, if both the conductive thin film 401 and the sacrificial layer 403 are made of Cu, only the conductive metal layer 405 can be taken out using an etchant that selectively dissolves Cu.

  According to the present embodiment, the contact probes 100 to 103 are composed of the plate-like bodies 10A to 10C, and the plate-like bodies 10A to 10C are curved in the thickness direction during overdrive. For this reason, if the thickness of plate-like body 10A-10C is made thin and the stress at the time of overdrive is reduced, the main-body part 1 can be greatly curved, without exceeding an elastic limit. Therefore, the length of the contact probes 100 to 103 can be shortened and the high frequency characteristics can be improved while securing a desired overdrive amount.

  Moreover, according to this Embodiment, contact probe 100-103 consists of two or more elongate plate-like body 10A-10C which made the main surface oppose through the space | gap 10S, and plate-like body 10A-10C is made. Even if the thickness is reduced, the cross-sectional area of the main body 1 can be secured. Accordingly, it is possible to improve the high frequency characteristics of the contact probes 100 to 103 while ensuring the desired stylus pressure and shortening the length of the main body 1 while ensuring the current resistance characteristics.

  Further, according to the present embodiment, the contact probes 100 to 103 have the second coupling portion 12 that couples the front ends of the plate-like bodies 10 </ b> A to 10 </ b> C to each other and penetrate the guide holes 52 h of the guide plate 52. . And the 2nd coupling | bond part 12 is made to oppose the inner peripheral surface of the guide hole 52h. Therefore, the contact probes 100 to 103 are supported so as to be movable in the longitudinal direction, and the contact portion 2 can be moved in a direction substantially perpendicular to the electrode terminal 300 of the inspection object during overdrive. .

  In the present embodiment, examples of the contact probes 100 to 103 used for the electrical characteristic test of the semiconductor device have been described. However, the electrical contacts according to the present invention are limited to such contact probes 100 to 103. Not. That is, the present invention can be applied to various electrical contacts that bring the contact portion 2 into contact with the electrode terminal with the elastic deformation of the main body portion 1. For example, it can also be used as an electrical contact for conducting two circuit boards arranged with their main surfaces facing each other. Specifically, the present invention can be applied by replacing the wiring board 50 of the probe unit 5 in the present embodiment with one of the circuit boards and replacing the inspection object with the other of the circuit boards.

100 to 103, 110 Contact probe 1 Main body portion 10A to 10C Plate-like body 10S Air gap 11 First coupling portion 12 Second coupling portion 2 Contact portion 3 Main substrate 4 ST substrate 5 Probe unit 50 Wiring substrate 50t Electrode terminals 51, 52 Guide Plate 51h, 52h Guide hole 53 Guide support part 300 Electrode terminal 400 of inspection object Silicon substrate 401 Conductive thin film 402, 404, 406, 407 Photoresist 403 Sacrificial layer 405 Conductive metal layer L Overdrive amount

Claims (2)

In the electrical contact that makes the contact portion contact the electrode terminal with the elastic deformation of the main body,
The main body includes two or more elongated plate-like bodies opposed to the main surface through a gap, a first coupling portion for coupling one end of the plate-like body to each other, and the other end of the plate-like body coupled to each other A second coupling part that allows
The electrical contact according to claim 1, wherein the contact portion is formed at a tip of the second coupling portion. Two or more elongated plate-like bodies opposed to each other through a gap, a first coupling part for coupling one end of the plate-shaped body to each other, a second coupling part for coupling the other end of the plate-shaped body to each other, and A contact portion formed at the tip of the second coupling portion, and the electrical contact for bringing the contact portion into contact with the electrode terminal with elastic deformation of the plate-like body;
A support substrate for supporting the first coupling portion of the electrical contact;
A guide plate that has a guide hole through which the electrical contact passes, and supports the electrical contact so as to be movable in the longitudinal direction in a state where the second coupling portion is opposed to the inner peripheral surface of the guide hole; An electrical contact unit comprising:

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