CN112526178A

CN112526178A - Probe and testing device

Info

Publication number: CN112526178A
Application number: CN201910875885.2A
Authority: CN
Inventors: 吴俊杰
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-09-17
Filing date: 2019-09-17
Publication date: 2021-03-19

Abstract

The invention discloses a probe and a testing device, which are used for testing a chip, wherein the probe is arranged in a mounting hole of a testing seat, is in a sheet shape and is made of conductive materials, and comprises a base part, a buffer part and a contact part. The base part is positioned in the mounting hole and clamped on the test seat, the buffer part is positioned in the mounting hole and extends outwards spirally from the base part integrally, the contact part is positioned in the mounting hole and extends integrally from the buffer part to be spaced from the base part, and the tail end of the contact part protrudes out of the mounting hole and extends into the test space. The probe is integrally formed, so that impedance and noise can be reduced, the manufacturing cost of the testing device comprising the probe is reduced, and the assembly convenience is improved.

Description

Probe and testing device

Technical Field

The present invention relates to a test apparatus, and more particularly, to a probe and a test apparatus for testing a semiconductor device.

Background

With the progress of semiconductor technology, the requirement for precision of the tester is greatly increased, and in the case of IC testing or high frequency testing, the test signal is transmitted by the probe, so when the probe conducting the signal has many contact points, it is easy to generate discontinuous surface to form impedance discontinuity, which causes the reflection loss distortion of the test signal, and the excessive contact points will make the response speed of the probe slow, which affects the accuracy of the test.

Referring to fig. 1, a conventional test probe 1 is replaceably disposed in a probe hole 101 of a test socket 100 for electrically connecting a test contact a and a receiving contact B. The test probe 1 includes a shell member 11 passing through the probe hole 101, an upper contact member 12, a lower contact member 13, and an elastic member 14. The shell member 11 has a hollow bottom wall 111, a surrounding wall 112 extending upward from the bottom wall 111, a top wall 113 connecting the top ends of the surrounding wall 112, and a through hole 114 defined by the bottom wall 111, the surrounding wall 112 and the top wall 113.

The upper contact 12 is disposed on the upper half of the through hole 114 of the housing member 11 in a vertically movable manner, and has an abutting portion 121, a connecting portion 122 extending downward from the abutting portion 121, and a contact portion 123 extending upward from the abutting portion 121 and penetrating through the top wall 113. The lower contact 13 is disposed in the lower half of the through hole 114 of the housing member 11 to be movable up and down, and has an abutting portion 131, a connecting portion 132 extending upward from the abutting portion 131, and a contact portion 133 extending downward from the abutting portion 131 and penetrating through the bottom wall 111. The elastic element 14 is disposed in the through hole 114 in a compression-deformable manner, and two ends of the elastic element are respectively connected to the connecting portion 122 of the upper contact 12 and the connecting portion 132 of the lower contact 13, and are used for cushioning and adjusting the distance between the upper contact 12 and the lower contact 13 according to the distance between the test contact a and the receiving contact B.

Referring to fig. 2, in use, the test socket 100 is disposed above the receiving contact B, and the contact portion 133 of the lower contact 13 contacts the receiving contact B, and the test contact a contacts the contact portion 123 of the upper contact 12, and the upper contact 12 and the lower contact 13 cooperate to compress the elastic member 14 according to the distance between the test contact a and the receiving contact B, so that the contact portion 123 of the upper contact 12 and the contact portion 133 of the lower contact 13 are deflected against the housing member 11, and the test contact a, the upper contact 12, the housing member 11, the lower contact 13 and the receiving contact B form an electrical path.

However, since the upper contact 12, the lower contact 13 and the elastic member 14 move against the housing 11 during use, the contact portion 123 of the upper contact 12 and the contact portion 133 of the lower contact 13 are only inclined against the housing 11 to form electrical conduction, the actual contact areas are not large, and the impedance during signal transmission is increased due to more contact points, noise is easily generated during IC testing to cause erroneous judgment, which is not favorable for semiconductor testing, not only is the signal transmission speed not effectively increased, but also particles scraped off due to mutual friction between the surfaces of the members are deposited in the housing 11, and the accuracy of information transmission is affected.

Furthermore, since the upper contact 12 and the lower contact 13 are designed in a tip form, the contact points, known as scrapers, are scratched when contacting the test contact a and the receiving contact B, which not only causes large loss to the test equipment and parts, but also increases the production cost, which is not favorable for industrial mass production of the test process.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a probe that solves the above problems.

The probe is arranged in a mounting hole of a test base, the test base is provided with a test space for accommodating a chip, the mounting hole is communicated with the test space, the probe is in a sheet shape and made of conductive materials, and the probe comprises a base part, a buffer part and a contact part. The base part is positioned in the mounting hole and clamped on the test seat, the buffer part is positioned in the mounting hole and extends outwards spirally from the base part integrally, the contact part is positioned in the mounting hole and extends integrally from the buffer part to be spaced from the base part, and the tail end of the contact part protrudes out of the mounting hole and extends into the test space.

Another technical means of the present invention is that the end of the contact portion is arc-shaped.

Another technical means of the present invention is that the base has a body region and a plurality of clamping regions protruding outward from the end of the body region at intervals.

Another technical means of the present invention is that the plurality of locking regions extend in different directions.

Another technical means of the present invention is to provide the thin sheet-like probe with a thickness of 0.03mm to 0.7 mm.

Another technical means of the present invention is that an elastic supporting area is obliquely extended from the top end of the base portion, and the contact portion further has a connection area connected to the spiral buffer portion.

Another technical means of the present invention is to define the width of the connection region as H1, the width of the elastic support region as H2, and the ratio of the widths of H1 and H2 as 1: 0.5-1.5.

Another object of the present invention is to provide a testing apparatus including the probe.

The testing device is used for testing a chip and comprises a testing seat and at least one probe. The test seat comprises a seat body and a test space which is formed on the seat body and used for containing the chip, wherein the seat body is provided with at least one mounting hole. The at least one probe is detachably arranged in the at least one mounting hole of the base body, the tail end of the probe protrudes out of the mounting hole and extends into the testing space, when the chip is arranged in the testing space, the probe is pressed against the part protruding out of the testing space, so that the contact part sinks to be in contact with the base part, and a testing signal is directly transmitted to the base part through the contact part to form up-down signal conduction.

The invention has the advantages that the probe is integrally formed, the signal transmission path can be shortened, the problem of impedance increase caused by excessive components is reduced, and meanwhile, through the structural design of the buffer part, the contact part can move downwards to be in contact with the base part to form a conducting state when being subjected to external pressure, so that the chip testing effect is achieved, and the probe is particularly suitable for testing a high-frequency chip.

Drawings

FIG. 1 is a side view schematically illustrating a structure of a conventional test probe;

FIG. 2 is a schematic side view illustrating the use state of FIG. 1;

FIG. 3 is a partial perspective view of a preferred embodiment of the testing device of the present invention;

FIG. 4 is a perspective view illustrating the structure of a probe of FIG. 3;

fig. 5 is a partial perspective view to assist in explaining the use state of fig. 3.

Symbolic illustration in the drawings:

100 test seats; 101 a probe hole; 1 testing probe; 11 a shell member; 111 a bottom wall; 112 surrounding the wall; 113 a top wall; 114, perforating; 12 an upper contact; 121 abutting part; 122 connecting part; 123 contact part; 13 lower contact parts; 131 abutting part; 132 a connecting part; 133 a contact portion; 14 an elastic component; a, testing a contact; b, receiving the signal contact; 2, a test seat; 21, a seat body; 211 mounting holes; 22 a test space; 3, a probe; 31 a base portion; 311 a body region; 312 a clamping area; 313 an elastic support region; 32 a buffer part; 33 a contact portion; 331 an attachment zone; 4, a chip; the width of the H1 attachment region; width of the elastic support region of H2.

Detailed Description

The features and technical content of the related applications of the present invention will become apparent from the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings. Before proceeding with the detailed description, it should be noted that like components are represented by like reference numerals.

Referring to FIG. 3, a preferred embodiment of the testing device of the present invention for testing a chip 4 (shown in FIG. 5) includes a test socket 2 and a plurality of probes 3 spaced apart in the test socket 2.

The test socket 2 includes a socket body 21 and a test space 22 formed on the socket body 21. In the present embodiment, the base 21 has a plurality of mounting holes 211 disposed at intervals, the testing space 22 is rectangular, and the mounting holes 211 are disposed at intervals along two sides of the testing space 22. It should be noted that the arrangement of the mounting holes 211 is designed according to the type of the chip 4 to be tested, and there are many variations in actual implementation according to the pin layout of the chip 4, and the form shown in fig. 3 is only an implementation form of the preferred embodiment and should not be limited to the disclosure of the preferred embodiment.

Referring to fig. 4 and fig. 3, each probe 3 is made of a conductive material and has a base 31, a buffer 32, and a contact 33.

In the preferred embodiment, the thickness of the thin sheet-like probe is between 0.03mm and 0.7mm, preferably between 0.1mm and 0.3mm, and the material of the thin sheet-like probe is beryllium copper or nickel-aluminum alloy. The base 31 is positioned in the corresponding mounting hole 211 of the test socket 2, and more specifically, the base 31 has a body region 311 and a plurality of clamping regions 312 protruding outward from the end of the body region 311 at intervals. As shown in fig. 3, the plurality of clamping regions 312 extend from two ends of the body region 311 to two sides and upward, respectively, so that the body region 311 is flat below. By the structural design of the clamping areas 312, each probe 3 can be detachably combined in the corresponding mounting hole 211 through the base 31, and the plurality of clamping areas 312 extend in different directions and are clamped on the base body 21, so that the combination stability of the base 31 and the base body 21 can be increased without any movement, the situation that the probe 3 shakes or topples over in the testing process to cause unstable or open circuit of signals is avoided, and the body area 311 which is flat below can also avoid forming a scraper with a subsequently assembled testing substrate.

Referring to fig. 3 and 4, the buffer part 32 is integrally and spirally extended from the base part 31, and in the preferred embodiment, the buffer part 32 is spirally extended from the base part 31 to the outside and to the top, forming a structure like a mosquito coil. The contact portion 33 is integrally extended from the buffer portion 32 and spaced apart from the base portion 31, and the end thereof protrudes out of the mounting hole 211 and extends into the testing space 22. In particular, the helical structure of the buffer portion 32, in conjunction with the gap formed between the contact portion 33 and the base portion 31, allows the contact portion 33 to slightly swing up and down with respect to the buffer portion 32 and the base portion 31.

The top of the base 31 is extended with an elastic support region 313, and the contact portion 33 further has a connection region 331 connected to the spiral buffer portion 32. In the preferred embodiment, the width of the connection region is defined as H1, the width of the elastic support region is defined as H2, the ratio of the widths of H1 and H2 is 1: 0.5-1.5, preferably 1: 0.8-1.2, and the distribution ratio of the widths of the connection region 331 and the elastic support region 313 can ensure the rigidity of the whole probe 3 and maintain the elasticity of the spiral buffer 32 and the elastic support region 313.

The shape of the elastic support region 313 is a long strip and has a curvature matching the shape of the bottom edge of the contact portion 33, so that the contact portion 33 can obtain a larger contact area with the elastic support region 313 when pressed downward by using an arc design. The elastic support region 313 loses its elasticity when the width H2 of the elastic support region is too thick, and affects the transmission of electrical signals when the width H2 of the elastic support region is too thin. It should be noted that the shape of the elastic support region 313 disclosed in the present invention is an arc-shaped strip, and may be circular or other geometric shapes in practical implementation, which should not be construed as a limitation.

Referring to FIG. 5 in conjunction with FIG. 3, an illustration of the preferred embodiment is shown. When the chip 4 is to be tested in the preferred embodiment, the chip 4 is placed in the testing space 22 of the testing base 2, so that the contacts at the bottom of the chip 4 are respectively contacted with the ends of the contact portions 33 of the probes 3. The contact pattern at the bottom of the chip 4 varies depending on the type of the chip 4, and is not specifically shown in fig. 5.

The end of the contact portion 33 of the probe 3 is arc-shaped, which can increase the contact area compared with the known pointed structure, and can also avoid the damage to the contact of the chip 4 during the testing process. When the chip 4 is placed in the test space 22, the ends of the contact portions 33 of the probes 3 are gradually pressed downward, and when the chip 4 is completely and reliably positioned in the test space 22, as shown in fig. 5, the ends of the contact portions 33 of the probes 3 are also pressed downward to touch the elastic support regions 313 of the base portion 31, and at this time, the test signal is directly transmitted to the underlying base portion 31 through the contact portions 33 at the shortest distance to form a vertical signal conduction state, so that the signal can be transmitted to test the chip 4.

Since the probe 3 is made of a conductive material, typically beryllium copper, it can be slightly flexible when made into a sheet shape. Therefore, when the end of the contact portion 33 of the probe 3 is pressed downward, in addition to the elastic restoring force accumulated by the connected buffer portion 32, the extended elastic support region 313 provides some elastic support to ensure that the contact portion 33 can contact with the elastic support region 313 when pressed downward, the rigid structure of the probe 3 can be prevented from being damaged by the elastic restoring design of the buffer portion 32, and when the chip 4 is tested and removed from the test space 22, the elastic restoring force released by the buffer portion 32 can restore the contact portion 33 of the probe 3 to the position shown in fig. 3, so that the next test can be performed again.

In summary, the probe 3 used in the testing apparatus of the present invention is designed to be integrally formed, so as to improve the assembly convenience, reduce the cost, and shorten the signal transmission path. Meanwhile, through the structural design of the buffer part 32 of the probe 3, the contact part 33 has a slight movement margin, so that the contact part 33 can move downwards to contact with the elastic support region 313 of the base part 31 to form a conduction state when being pressed by the chip 4, thereby achieving the testing effect of the chip 4, and the tail end of the contact part 33 is arc-shaped, thereby not only increasing the contact area, but also avoiding damaging the contact of the chip 4 above, and the bottom of the base part 31 is flat and limited by the clamping region 312, so that the substrate contact below can not be scratched by any movement. Moreover, the probe 3 is an integrated structure, which can effectively reduce the problem of impedance increase caused by too many components, and can avoid the generation of noise, so that the probe is particularly suitable for testing high-frequency chips.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made in the claims and the description of the present invention are within the scope of the present invention.

Claims

1. The utility model provides a probe, its characterized in that sets up in a mounting hole of a test socket, and this test socket has a test space that is used for holding a chip, and this mounting hole communicates in this test space, and this probe is the slice and makes with electrically conductive material, and contains:

a base part which is positioned in the mounting hole and clamped on the test seat;

a buffer part which is positioned in the mounting hole and extends outward spirally from the base part; and

a contact part which is positioned in the mounting hole and integrally extends from the buffer part to be spaced from the base part, and the tail end of the contact part protrudes out of the mounting hole and extends into the test space.

2. The probe of claim 1 wherein the base portion has a body region and a plurality of retaining regions projecting outwardly from the body region at spaced apart ends.

3. The probe of claim 2 wherein the plurality of clamping areas extend in different directions.

4. The probe of claim 3, wherein the contact portion has a rounded distal end.

5. The probe of claim 1, wherein the thickness of the sheet-like probe is 0.03mm to 0.7 mm.

6. The probe of claim 1, wherein the tip of the base extends obliquely to form an elastic support region, and the contact portion further has a connection region connected to the helical buffer portion.

7. The probe of claim 6, wherein the width of the linking region is defined as H1, the width of the flexible support region is defined as H2, and the ratio of the widths of H1 and H2 is 1: 0.5-1.5.

8. A test apparatus for providing test signals to test a chip, comprising:

the test seat comprises a seat body and a test space which is formed on the seat body and used for accommodating the chip, wherein the seat body is provided with at least one mounting hole; and

at least one probe according to any one of claims 1 to 7, detachably disposed in the at least one mounting hole of the base, and the end of the probe protrudes out of the mounting hole and extends into the testing space, when the chip is disposed in the testing space, the probe will be pressed against the portion of the probe protruding out of the testing space, so that the contact portion sinks to contact the base, and the testing signal will be directly transmitted to the base through the contact portion, thereby forming a vertical signal conduction.