TWI708949B - A probe and a test device - Google Patents

Abstract

A probe is disposed in a mounting hole of a test seat and is formed in a sheet shape and made of a conductive material, and includes a base portion, a buffer portion, and a contact portion. The base portion is located in the mounting hole and is engaged with the test seat. The buffer portion is located in the mounting hole and extends spirally outwardly from the base portion, and the contact portion is located in the mounting hole and extends integrally from the buffer portion and spaced apart from the base portion, and the end of the contact portion protrudes outside the mounting hole to extend into the test space. The probe is integrally molded to reduce impedance and noise, reduce manufacturing costs, and improve assembly convenience. The invention also provides a test device comprising the above probe.

Description

Probe and test device

The invention relates to a test equipment, in particular to a probe used for testing semiconductor components and a test device thereof.

With the advancement of semiconductor technology, the requirements for the precision of testing equipment have been greatly increased. In the case of IC testing or high-frequency testing, the test signal is transmitted by the probe. Therefore, when the probe that conducts the signal has many contact points , It is easy to produce discontinuities and form impedance discontinuities, causing distortion of the reflection loss of the test signal, and too many contact points will also make the probe's response speed slower and affect the accuracy of the test.

Referring to FIG. 1, the traditional test probe 1 is replaceably disposed in a probe hole 101 of a test base 100 for electrically connecting a test contact A and a receiving contact B. The test probe 1 includes a housing member 11 passing through the probe hole 101, an upper contact member 12, a lower contact member 13, and an elastic element 14. The housing member 11 has a hollow bottom wall 111, a surrounding wall 112 extending upward from the bottom wall 111, a top wall 113 connected to the top end of the surrounding wall 112, and a bottom wall 111 and a surrounding wall 112 and A perforation 114 defined by the top wall 113.

Wherein, the upper contact member 12 is movably arranged on the upper half of the perforation 114 of the housing member 11, and has an abutting portion 121, a connecting portion 122 extending downward from the abutting portion 121, and A contact portion 123 extending upward from the abutting portion 121 and passing through the top wall 113. The lower contact member 13 is movably arranged in the lower half of the perforation 114 of the housing member 11, and has an abutting portion 131, a connecting portion 132 extending upward from the abutting portion 131, and a The abutting portion 131 extends downward and passes through the contact portion 133 of the bottom wall 111. The elastic element 14 is arranged in the through hole 114 in a compressible and deformable manner, and its two ends are respectively connected to the connecting portion 122 of the upper contact piece 12 and the connecting portion 132 of the lower contact piece 13, and are used in response to the test contact A And the spacing of the receiving contact B buffers and modulates the distance between the upper contact 12 and the lower contact 13.

Referring to FIG. 2, when in use, the test socket 100 is set above the receiving contact B, and the contact portion 133 of the lower contact 13 is brought into contact with the receiving contact B, and the contact A to be tested is brought into contact According to the distance between the test contact A and the receiving contact B of the contact portion 123 of the upper contact 12, the upper contact 12 cooperates with the lower contact 13 to compress the elastic element 14, so that the upper The contact portion 123 of the contact piece 12 and the contact portion 133 of the lower contact piece 13 simultaneously deflect against the housing piece 11, so that the test contact A, the upper contact piece 12, the housing piece 11, the The lower contact 13 and the receiving contact B form an electrical path.

However, during use, the upper contact member 12, the lower contact member 13 and the elastic element 14 move against the housing member 11, and only rely on the contact portion 123 of the upper contact member 12 and the lower contact member 13 At the same time, the contact portion 133 is slanted against the housing member 11 to form electrical conduction. The actual contact area between each other is not large, and more contact points will increase the impedance during signal transmission, which is prone to noise during IC testing. This leads to misjudgment and is detrimental to semiconductor testing. Not only the signal transmission speed cannot be effectively improved, but also particles scraped off due to the friction between the surfaces of the components are deposited in the housing member 11, which affects the accuracy of message transmission.

Furthermore, since the upper contact piece 12 and the lower contact piece 13 are designed in the form of sharp points, they will scratch the contact points when they are in contact with the test contact A and the receiving contact B, which is commonly known as a scraper. The loss of test equipment and parts is large, which is unfavorable to the industrialized mass production of the test process and also increases production costs.

Therefore, the purpose of the present invention is to provide a probe that solves the above-mentioned problems.

The probe of the present invention is arranged in a mounting hole of a test seat, the test seat has a test space for accommodating a wafer, the mounting hole is connected to the test space, and the probe is in the shape of a sheet and is electrically conductive Made of material, it includes a base, a buffer, and a contact. The base is located in the mounting hole and is engaged with the test seat, the buffer portion is located in the mounting hole and extends spirally outward from the base, and the contact portion is located in the mounting hole and is formed by The buffer part is integrally extended to be spaced apart from the base part, and the end protrudes out of the mounting hole to extend into the test space.

Another technical means of the present invention is that the end of the contact portion is arc-shaped.

Another technical means of the present invention is that the base has a body area and a plurality of clamping areas protruding outwardly from the end of the body area.

Another technical means of the present invention is that the clamping area extends in different directions.

Another object of the present invention is to provide a testing device including the above-mentioned probe.

The test device of the present invention is used to test a chip, and includes a test seat and at least one probe as described above. The test base includes a base and a test space formed on the base for accommodating the chip, and the base has at least one mounting hole. The probe is detachably arranged in the mounting hole of the base body, and the end protrudes out of the mounting hole to extend into the test space. When the chip is set in the test space, it will press against the probe The part that protrudes from the test space.

The effect of the present invention is that the probe is integrally formed to shorten the signal transmission path and reduce the problem of increased impedance due to too many components. At the same time, through the structural design of the buffer portion, the contact portion can move downward when subjected to external pressure It is in contact with the base to form a conduction state, which achieves the chip test effect, and is particularly suitable for the test of high-frequency chips.

The features and technical content of the related patent applications of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. Before detailed description, it should be noted that similar elements are represented by the same numbers.

Refer to FIG. 3, which is a preferred embodiment of the test device of the present invention for testing a chip 4 (shown in FIG. 5). The test device includes a test socket 2 and a plurality of probes arranged at intervals in the test socket 2 Needle 3.

The test base 2 includes a base 21 and a test space 22 formed on the base 21. Wherein, the base body 21 has a plurality of mounting holes 211 arranged at intervals. In this embodiment, the test space 22 is rectangular, and the mounting holes 211 are arranged at intervals along two sides of the test space 22. It should be noted that the arrangement of the mounting holes 211 is designed according to the type of the chip 4 to be tested. In actual implementation, there can be many changes according to the pin layout of the chip 4, as shown in FIG. 3 The type shown is only the implementation of the preferred embodiment, and should not be limited to what is disclosed in the preferred embodiment.

Referring to FIG. 4 and in conjunction with FIG. 3, each probe 3 is in the shape of a thin sheet and made of conductive material, and includes a base 31, a buffer portion 32, and a contact portion 33.

In this preferred embodiment, the thickness of the thin probe is between 0.03~0.7mm, preferably between 0.1~0.3mm, and the material of the probe is made of beryllium copper, nickel aluminum alloy to make. The base 31 is positioned in the corresponding mounting hole 211 in the test socket 2. In more detail, the base 31 has a body area 311, and a plurality of portions protruding outwardly at intervals from the end of the body area 311 Card system area 312. As shown in FIG. 3, the clamping area 312 extends from the two ends of the main body area 311 to the two sides and upward respectively, so the lower part of the main body area 311 is flat. With the structural design of the clamping area 312, each probe 3 can be detachably integrated into the corresponding mounting hole 211 through the base 31, and the clamping area 312 respectively extends in different directions and It is clamped on the base 21 to increase the stability of the combination of the base 31 and the base 21 without moving arbitrarily, in addition to avoiding the probe 3 from shaking or tipping during the test, and signal failure occurs. In a stable or disconnected condition, the flat body area 311 below can also avoid the formation of a squeegee with the subsequently assembled test substrate.

Referring to FIGS. 3 and 4, the buffer portion 32 is spirally extended outwards from the base 31 integrally. In the preferred embodiment, the buffer portion 32 is spirally extended outwards and upwards from the base 31. It forms a structure like a mosquito coil. The contact portion 33 is integrally extended from the buffer portion 32 and is spaced apart from the base portion 31, and the end protrudes out of the mounting hole 211 and extends into the test space 22. It should be particularly noted that the spiral structure of the buffer portion 32 is matched with the gap formed between the contact portion 33 and the base portion 31, so that the contact portion 33 can be slightly larger than the buffer portion 32 and the base portion 31. The swing up and down.

The top end of the base portion 31 is provided with an elastic support area 313 extending obliquely upward, and the contact portion 33 further has a connection area 331 connected to the spiral buffer portion 32. In the preferred embodiment, the width of the connecting area is H1, the width of the elastic support area is H2, and the ratio of the width of H1 to H2 is 1:0.5~1.5, preferably 1:0.8~1.2. The width distribution ratio of the connecting area 331 and the elastic support area 313 can ensure the rigidity of the entire probe 3 and maintain the elasticity of the spiral buffer portion 32 and the elastic support area 313.

The shape of the elastic support area 313 is a long strip, and has an arc that matches the shape of the bottom edge of the bottom edge of the contact portion 33. The arc design can make the contact portion 33 press down compared with the elastic support area 313. Large contact area. When the width of H2 is too thick, the elastic support area 313 will lose its flexibility, and when the width of H2 is too thin, it will affect the transmission of electrical signals, so overall consideration must be given. It is worth mentioning that the shape of the elastic support area 313 disclosed in the present invention is an arc-shaped strip, and it can also be circular or other geometric shapes in actual implementation, and should not be limited thereto.

Refer to FIG. 5 in conjunction with FIG. 3, which is an explanation of the preferred embodiment. When the chip 4 is to be inspected in the present preferred embodiment, the chip 4 is placed in the test space 22 of the test seat 2 so that the contacts at the bottom of the chip 4 are respectively connected to the contact portions of the probe 3 The end of 33 touches. Since the contact form at the bottom of the chip 4 varies according to the type of the chip 4, it is not shown in detail in FIG. 5.

The end of the contact portion 33 of the probe 3 is arc-shaped, which can increase the contact area compared with the conventional pointed structure, and can also avoid causing the contact of the chip 4 during the test. damage. When the chip 4 is placed in the test space 22, it will gradually press down on the end of the contact portion 33 of the probe 3. When the chip 4 is completely and surely positioned in the test space 22, as shown in Figure 5 As shown, the end of the contact portion 33 of the probe 3 will also be pressed down to touch the elastic support area 313 of the base 31. At this time, the test signal will be directly transmitted through the contact portion 33 in the shortest distance. The base 31 to the bottom forms a state where the upper and lower signals are turned on, and the signals can be transmitted to test the chip 4.

Since the probe 3 is made of a conductive material, usually a beryllium copper metal material, a slight flexibility can be produced when it is made into a thin sheet. Therefore, when the end of the contact portion 33 of the probe 3 is pressed down, in addition to the connected buffer portion 32 that will accumulate an elastic restoring force, the extended elastic support area 313 will provide some elastic support to ensure When the contact portion 33 is pressed down, it can contact the elastic support area 313. The elastic recovery design of the buffer portion 32 prevents the rigid structure of the probe 3 from being damaged. When the chip 4 is tested, the test space 22 When it is removed, the elastic restoring force released by the buffer portion 32 will restore the contact portion 33 of the probe 3 to the position shown in FIG. 3, and the next test can be performed again.

In summary, the probe 3 used in the testing device of the present invention adopts an integrated design, which improves assembly convenience, reduces cost, and shortens the signal transmission path. At the same time, through the structural design of the buffer portion 32 of the probe 3, the contact portion 33 has a slight margin of movement, so that the contact portion 33 can move downward and the base portion when it is pressed by the wafer 4 The elastic support area 313 of 31 is contacted to form a conductive state, which achieves the test function of the chip 4, and the end of the contact portion 33 is arc-shaped, which not only increases the contact area, but also prevents damage to the upper chip 4 contacts. The bottom of the base 31 is flat and is limited by the clamping area 312, so it will not move randomly and scratch the substrate contacts below. Furthermore, the integrated structure of the probe 3 can also effectively reduce the problem of increased impedance due to too many components, and can also avoid the generation of noise, and is particularly suitable for high-frequency chip testing.

However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.

100: test seat 101: Probe hole 1: Test probe 11: Shell parts 111: bottom wall 112: around the wall 113: top wall 114: Piercing 12: Upper contact 121: abutment 122: connection part 123: Contact 13: Lower contact 131: Abutment Department 132: Connection 133: Contact 14: Elastic element A: Test contact B: Receiving contact 2: Test seat 21: Seat 211: mounting hole 22: test space 3: Probe 31: Base 311: Body area 312: Card System 313: Elastic Support Area 32: Buffer 33: Contact 331: connection area 4: chip H1: The width of the connecting area H2: width of elastic support area

Figure 1 is a schematic side view showing the structure of a traditional test probe; Figure 2 is a schematic side view illustrating the state of use of Figure 1; Figure 3 is a partial three-dimensional schematic diagram of a preferred embodiment of the testing device of the present invention; Figure 4 is a perspective view illustrating the structure of a probe in Figure 3; and Fig. 5 is a partial three-dimensional schematic diagram to assist in explaining the use state of Fig. 3.

2: Test seat

21: Seat

211: mounting hole

22: test space

3: Probe

31: Base

311: Body area

312: Card System

313: Elastic Support Area

32: Buffer

33: Contact

331: connection area

Claims (8)

A probe is arranged in a mounting hole of a test base, the test base has a test space for accommodating a chip, the mounting hole is connected to the test space, and the probe is in the shape of a sheet and made of conductive material It is manufactured and includes: a base located in the mounting hole and snapped on the test base; a buffering portion located in the mounting hole and extending from the base in a spiral shape; and a contact portion located at the Inside the mounting hole and integrally extended by the buffer part to be spaced apart from the base part, and the end protrudes out of the mounting hole to extend into the test space; when the chip is placed in the test space, it will press against the contact part The part extending in the test space makes the contact part sink to contact the base part, and the test signal will be directly transmitted to the base part through the contact part, forming upper and lower signal conduction. According to the probe described in item 1 of the scope of patent application, the base has a body region and a plurality of clamping regions protruding outwardly from the end of the body region. According to the probe described in item 2 of the scope of patent application, the clamping area extends in different directions. According to the probe described in item 3 of the scope of patent application, the end of the contact portion is arc-shaped. According to the probe described in item 1 of the scope of patent application, the thickness of the thin-shaped probe is between 0.03 and 0.7 mm. The probe according to the first item of the scope of patent application, wherein the tip of the base extends diagonally An elastic support area is provided, and the contact portion further has a connection area connected with the spiral buffer portion. According to the probe described in item 6 of the scope of patent application, the width of the connecting area is H1, the width of the elastic support area is H2, and the width ratio of H1 to H2 is 1:0.5~1.5. A test device for providing a test signal to test a chip, comprising: a test base including a base, and a test space formed on the base for accommodating the chip, the base having at least one mounting hole; And at least one probe, which is detachably disposed in the mounting hole of the base body, the probe is in the shape of a sheet and made of conductive material, and includes a probe located in the mounting hole and clamped on the test base The base, a buffer part located in the mounting hole and spirally extending outward from the base part, and a contact part located in the mounting hole and integrally extending from the buffer part, the contact part being spaced apart from the base , And the end protrudes out of the mounting hole to extend into the test space. When the chip is placed in the test space, it will press against the part of the probe protruding from the test space, causing the contact portion to sink and to contact the base. Contact, the test signal will be directly transmitted to the base through the contact part, forming upper and lower signal conduction.

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