CN113866464A - Probe and integrated circuit test equipment - Google Patents
Probe and integrated circuit test equipment Download PDFInfo
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- CN113866464A CN113866464A CN202111110835.9A CN202111110835A CN113866464A CN 113866464 A CN113866464 A CN 113866464A CN 202111110835 A CN202111110835 A CN 202111110835A CN 113866464 A CN113866464 A CN 113866464A
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- 239000000523 sample Substances 0.000 title claims abstract description 98
- 238000012360 testing method Methods 0.000 title claims abstract description 87
- 230000005489 elastic deformation Effects 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000010354 integration Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 230000007704 transition Effects 0.000 claims description 16
- 230000000694 effects Effects 0.000 description 7
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VAHKBZSAUKPEOV-UHFFFAOYSA-N 1,4-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=CC=C1Cl VAHKBZSAUKPEOV-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a probe and integrated circuit test equipment, wherein the probe comprises a first contact section, a connecting section and a second contact section which are sequentially arranged from top to bottom, the upper end of the first contact section is used for contacting a test IC, and the lower end of the second contact section is used for contacting a test PCB; the first contact section the linkage segment the second contact section integration sets up, first contact section upper end is formed with the contact inclined plane that 2 intervals set up, the contact inclined plane be used for with test IC's tin ball contact, first contact section can take place elastic deformation in the horizontal direction, works as when first contact section takes place elastic deformation in the horizontal direction, 2 contact inclined plane keeps away from each other, second contact section can take place elastic deformation in vertical direction. Therefore, the invention solves the problems of larger impedance, larger impedance among probes, poorer consistency and the like in the prior art.
Description
Technical Field
The invention relates to the technical field of integrated circuit test equipment, in particular to a probe and integrated circuit test equipment comprising the probe.
Background
In the prior art, a probe for testing an integrated circuit is usually formed by combining a needle tube, a needle head and a spring component in an elastic piece arrangement. However, such an arrangement results in a long path through which current needs to pass during testing, and a plurality of components are in contact conduction with each other, so that the contact resistance is large, which affects the actual testing effect of the integrated circuit. The probe for the integrated circuit test in the prior art has the problems of high impedance and poor impedance consistency among the probes, and meanwhile, the existing test probe is formed by assembling parts such as a needle tube, a needle head and a spring, so that the processing and assembling cost is high.
Disclosure of Invention
The invention mainly aims to provide a probe and integrated circuit testing equipment comprising the probe. The probe aims to solve the problems of large impedance, poor consistency and the like of the probe for testing the integrated circuit in the prior art.
In order to solve the above problems, the present invention provides a probe, which includes a first contact section, a connection section, and a second contact section sequentially arranged from top to bottom, wherein an upper end of the first contact section is used for contacting a test IC, and a lower end of the second contact section is used for contacting a test PCB; the first contact section the linkage segment the second contact section integration sets up, first contact section upper end is formed with the contact inclined plane that 2 intervals set up, the contact inclined plane be used for with test IC's tin ball contact, first contact section can take place elastic deformation in the horizontal direction, works as when first contact section takes place elastic deformation in the horizontal direction, 2 contact inclined plane keeps away from each other, second contact section can take place elastic deformation in vertical direction.
In an optional embodiment, the first contact section includes a first positioning element and a second positioning element, the first contact section is used for connecting a solder ball of the test IC, and the first positioning element and the second positioning element can move close to and away from each other to clamp and release the solder ball.
In an optional embodiment, the first positioning element and the second positioning element are arranged in a gradually expanding manner towards the direction of the solder ball.
In an alternative embodiment, the second contact section includes a notched ring structure, the upper side of the notch is provided with a first free end, the lower side of the notch is provided with a second free end, and when the probe is compressed by a force, the first free end and the second free end approach each other.
In an optional embodiment, the second contact section is a C-shaped member, the C-shaped member includes a first notch, the first free end and the second free end are respectively disposed on the upper side and the lower side of the first notch, the bottom end of the C-shaped member is configured to contact the test PCB, and when the probe is compressed by a force, the first free end and the second free end contact each other.
In an optional embodiment, the second contact section is arranged in an S shape, the S-shaped part includes a second notch and a third notch arranged from top to bottom, a first free end is arranged on the upper side of the second notch, a second free end is arranged on the lower side of the third notch, a transition section is arranged between the first notch and the second notch, the bottom end of the S-shaped part is used for contacting the test PCB, when the probe is compressed by a force, the first free end contacts the transition section, and the second free end contacts the transition section;
or the second contact section is arranged in an m shape; or the second contact section is arranged in a shape of 8; or the second contact section comprises an annular piece and a gapped annular structure, wherein the annular piece is disposed below the gapped annular structure; alternatively, the ring is disposed over the gapped ring structure; or the second contact section is arranged in an inverted trapezoid shape; or the second contact section is arranged in a triangular shape; alternatively, the second contact section is provided in a half-frame shape.
In an optional embodiment, the probe further comprises a support portion, a support plate is arranged between the test IC and the test PCB, and the support portion is used for contacting with the inner wall of the support plate to prevent the probe from shaking.
In an alternative embodiment, the support portion includes a first support portion and a second support portion, and the first support portion and the second support portion are respectively formed at left and right sides of the connecting section.
In an optional embodiment, the lower end of the second contact section is provided with a contact surface; or a plurality of contact bulges are formed at the lower end of the second contact section; or a single contact point is formed at the lower end of the second contact section; or the lower end of the second contact section is arranged in a W-shaped piece, a V-shaped piece or a U-shaped piece.
The invention also proposes an integrated circuit test device comprising the probe described above.
According to the technical scheme, the probe and the integrated circuit testing equipment comprising the probe are provided, and the first contact section, the connecting section and the second contact section of the probe are integrally arranged, so that the problems of high probe impedance, poor consistency and the like in the prior art are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a first embodiment of a probe according to the present invention;
FIG. 2 is a schematic structural diagram of a second embodiment of a probe according to the present invention;
FIG. 3 is a schematic structural diagram of a third embodiment of a probe according to the present invention;
FIG. 4 is a schematic structural diagram of a fourth embodiment of a probe according to the present invention;
FIG. 5 is a cross-sectional view of a portion of the structure of one embodiment of the integrated circuit test apparatus of the present invention.
FIG. 6 is a schematic structural diagram of a fifth embodiment of a probe according to the present invention;
FIG. 7 is a cross-sectional view of a portion of another embodiment of the integrated circuit test apparatus of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | |
| 10 | |
11 | |
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| 12 | Connecting |
13 | |
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| 14a | First |
14b | Second |
|
| | Transition section | 15a | |
|
| 15b | |
16a | A first supporting |
|
| 16b | Second supporting |
20 | Testing |
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| 21 | |
30 | Testing PCB | |
| 31 | |
40 | First supporting |
|
| 50 | Second support plate |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a probe 10, where the probe 10 includes a first contact section 11, a connection section 12, and a second contact section 13 sequentially arranged from top to bottom, an upper end of the first contact section 11 is used for contacting a test IC20, and a lower end of the second contact section 13 is used for contacting a test PCB 30; first contact segment 11 the linkage segment 12 second contact segment 13 integration sets up, first contact segment 11 can take place elastic deformation in the horizontal direction, second contact segment 13 can take place elastic deformation in vertical direction. The upper end of the first contact section 11 is formed with 2 contact slopes arranged at intervals, the contact slopes are used for contacting with the solder balls 21 of the test IC20, the first contact section 11 can be elastically deformed in the horizontal direction, and when the first contact section 11 is elastically deformed in the horizontal direction, 2 contact slopes are far away from each other.
Referring to fig. 1, in an alternative embodiment, 2 of the contact slopes are gradually enlarged toward the direction of the solder ball 21. This is provided to accommodate the shape of the solder ball 21. The two contact slopes are the contact surfaces of the first contact segment upper end 11 and the solder ball 21. The contact surface may be a slanted plane or a slanted arc surface. Compared with the scheme that the contact surfaces are arranged on two sides of the solder ball in parallel, the arrangement of the contact inclined surface can increase the contact area between the first contact section 11 of the probe and the solder ball.
In the prior art, the probe 10 for testing the integrated circuit is usually formed by combining a needle tube, a needle head and a spring component in an elastic piece arrangement. However, such an arrangement results in a long path through which current needs to pass during testing, and a plurality of components are in contact conduction with each other, so that the contact resistance is large, which affects the actual testing effect of the integrated circuit. In the probe 10 of the present invention, the first contact section 11, the connecting section 12, and the second contact section 13 are integrally formed metal pieces. Thus, the contact resistance among the components can be effectively reduced, and meanwhile, the assembly and manufacturing cost is reduced.
Referring to fig. 5 and 7, in addition, the probe 10 is applied to an IC testing apparatus and disposed between the testing IC20 and the testing PCB30, the upper end of the first contact segment 11 contacts the solder ball 21 of the testing IC20, and the lower end of the second contact segment 13 contacts the testing point 31 of the testing PCB 30. Between the test IC20 and the test PCB30, a first support plate 40 and a second support plate 50 are sequentially disposed from top to bottom. And a plurality of probes 10 are disposed between the test IC20 and the test PCB 30. In an alternative embodiment, a plurality of probes 10 may be arranged in an array. And for each probe 10, a containing groove for containing the probe 10 is formed between the first supporting plate 40 and the second supporting plate 50. The deformation position is changed as the probe 10 is compressed in the vertical direction during the test. In order to facilitate the probe 10 to be compressed, in the initial position, the probe 10 extends out of the opening of the containing groove, and in the deformed position, the bottom end of the probe 10 is compressed to be flush with the opening of the containing groove. With a plurality of different probes 10, it is difficult to make the bottom end of each of the probes 10 contact a test point 31 on the test PCB30 when the test IC20 is close to the test PCB 30.
To solve this problem, the first contact section 11 is elastically deformable in the horizontal direction, and the second contact section 13 is elastically deformable in the vertical direction. Therefore, when the probe 10 is tested, the bottom end of the probe 10 is fully contacted with the test PCB30, and the top end of the probe 10 is fully contacted with the solder ball 21, so as to obtain a better contact effect. When a plurality of probes 10 are tested simultaneously, the upper side and the lower side of each probe 10 can be fully contacted.
Referring to fig. 1 to 4, in an alternative embodiment, the first contact section 11 includes a first positioning element 15a and a second positioning element 15b, the first contact section 11 is used for connecting the solder ball 21 of the test IC20, and the first positioning element 15a and the second positioning element 15b can move close to and away from each other to clamp and release the solder ball 21. Compared with the scheme that the first contact section 11 is directly welded with the solder ball 21, the scheme that the solder ball 21 is arranged between the first positioning part 15a and the second positioning part 15b can effectively reduce the processing difficulty, and the probe 10 can be more easily connected with the solder ball 21.
Referring to fig. 1, in an alternative embodiment, the first positioning element 15a and the second positioning element 15b are disposed in a gradually expanding manner toward the solder ball 21. Specifically, the first positioning element 15a and the second positioning element 15b are arranged in a gradually expanding bell mouth shape. Thus, the 2 contact slopes are respectively formed on the first positioning element 15a and the second positioning element 15b, and on the basis of the above optional embodiment, the first positioning element 15a and the second positioning element 15b are formed with contact surfaces for contacting with the solder balls 21 at the bell mouth. The solder ball 21 is soldered to the first positioning member 15a and the second positioning member 15b through the contact surface. The first positioning element 15a and the second positioning element 15b are arranged in a gradually expanding manner, which is beneficial to increasing the contact area between the probe 10 and the solder ball 21, so as to improve the testing effect of the integrated circuit testing equipment.
In another embodiment, the first contact section 11 may also be provided as a Y-shaped member, the upper end of which forms 2 contact slopes that diverge. I.e. the upper ends of the Y-shaped members may also be moved towards or away from each other, with similar effects to the embodiments described above. And the lower end of the Y-shaped member is adapted to be connected to the connecting section.
In another embodiment, the first contact section 11 is provided with a notched ring-shaped structure, and the shape of the structure is adapted to the shape of the solder ball. When the upper end of the first contact section 11 is close to the solder ball, it is deformed by the compression of the solder ball, and the solder ball enters the annular structure from the gap and is clamped by the annular structure with the gap. At the moment, 2 contact inclined planes are arranged in an arc-shaped surface and jointly form a notched annular structure.
Referring to fig. 1 and 6, in an alternative embodiment, the second contact section 13 includes a ring structure with a notch, a first free end 14a is disposed on an upper side of the notch, and a second free end 14b is disposed on a lower side of the notch, and when the probe 10 is compressed by a force, the first free end 14a and the second free end 14b approach each other. With a plurality of different probes 10, it is difficult to make the bottom end of each of the probes 10 contact a test point 31 on the test PCB30 when the test IC20 is close to the test PCB 30. Therefore, the second contact section 13 is a notched ring structure. When the structure is compressed, i.e. the first free end 14a and the second free end 14b are close to each other, the height of the probe 10 as a whole in the vertical direction is also reduced accordingly. The first free end 14a and the second free end 14b may be in contact with each other or may be close to each other without being in contact.
Referring to fig. 6, in an alternative embodiment, the second contact section 13 is configured as a C-shaped member, the C-shaped member includes a first notch, the first free end 14a and the second free end 14b are respectively disposed at upper and lower sides of the first notch, a bottom end of the C-shaped member is configured to contact the test PCB30, and when the probe 10 is compressed by a force, the first free end 14a and the second free end 14b contact each other. And a probe 10 in a spring arrangement, as compared to a vertically arranged probe 10. The path traveled by current from test IC20 to test PCB30 inevitably increases, which inevitably increases the impedance of probe 10, affecting the test performance.
Referring to fig. 1 to 4, in an alternative embodiment, the second contact section 13 is disposed in an S shape, the S-shaped member includes a second notch and a third notch disposed from top to bottom, a first free end 14a is disposed on an upper side of the second notch, a second free end 14b is disposed on a lower side of the third notch, a transition section 14c is disposed between the first notch and the second notch, a bottom end of the S-shaped member is configured to contact the test PCB30, when the probe 10 is compressed by a force, the first free end 14a contacts the transition section 14c, and the second free end 14b contacts the transition section 14 c.
The second contact section can also be arranged in an m-shaped piece or an 8-shaped piece. Or the second contact section comprises an annular piece and a gapped annular structure, wherein the annular piece is arranged below the gapped annular structure; alternatively, the ring is disposed over the gapped ring structure. In addition, other shapes that are vertically deformable, i.e., capable of being compressed to reduce the height in the vertical direction, are also within the scope of the present application. Optionally, the second contact section may also be disposed in an inverted trapezoidal shape, or the second contact section is disposed in a triangular shape, or the second contact section is disposed in a half-frame shape.
The S-shaped member can be viewed as being comprised of two oppositely directed gapped annular structures. When the test IC20 and the test PCB30 are brought into close proximity, i.e., the bottom end of the probe pin 10 contacts the test point 31 on the test PCB 30. The first free end 14a and the transition section 14c are in contact to short circuit the gapped annular structure between the first free end 14a and the transition section 14 c. Therefore, the impedance of the probe 10 is reduced, and the detection effect of the probe 10 and the integrated circuit test equipment using the probe 10 is improved.
On the basis of the last alternative embodiment, after the first free end 14a and the transition end have been contacted. The probe 10 continues to be compressed. The second free end moves towards the transition section 14 c. Until the second free end 14b contacts the transition section 14 c. Specifically, the second contact section 13 is arranged in an S shape, so that the movement between the second free end 14b and the transition section 14c leaves more deformation allowance for the probe 10 while realizing short circuit to reduce the impedance of the probe 10. So that the probe 10 can be applied to an integrated circuit test apparatus in which a plurality of probes 10 are simultaneously tested. The manufacturing accuracy requirements of the probe 10 are reduced.
Referring to fig. 5 and 7, in an alternative embodiment, the probe 10 further includes a supporting portion, and a supporting plate is disposed between the test IC20 and the test PCB30, and the supporting portion is used for contacting with an inner wall of the supporting plate to prevent the probe 10 from shaking. Because the probe 10 is telescopically arranged in the accommodating groove in the vertical direction, a certain gap inevitably exists between the probe 10 and the inner wall of the accommodating groove for the convenience of processing. The provision of the support portion serves to prevent the probe 10 from shaking due to the gap.
Referring to fig. 2, in an alternative embodiment, the support portions include a first support portion 16a and a second support portion 16b, and the first support portion 16a and the second support portion 16b are respectively formed at left and right sides of the connecting section 12. While the integrated circuit test equipment is in operation. The first support portion 16a and the second support portion 16b are in contact with the left and right inner walls of the support plate, respectively. So as to avoid the influence of the too large shaking amplitude of the probe 10 on the test effect.
Referring to fig. 2, in an alternative embodiment, a gap exists between the connecting section 12 and the first supporting portion 16a, and a gap exists between the connecting section 12 and the second supporting portion 16 b. It is noted that the connecting section 12 and the first and second support portions 16a and 16b are disposed at intervals. This arrangement leaves a certain deformation margin for the probe 10. The probability of the first and second support portions 16a and 16b being damaged by contact with the support plate is reduced.
Referring to fig. 2 to 4, in an embodiment, a portion of the bottom end of the probe 10, which is contacted with the contact test point 31, may be provided in a ball shape or other shapes. Namely, the contact surface can be set to be a plane or an arc surface. Specifically, a contact surface is formed at the lower end of the second contact section, and the contact surface may be an arc surface or a plane. Or a plurality of contact bulges are formed at the lower end of the second contact section. Optionally, the second contact section is formed with a single contact point at a lower end thereof. In one embodiment, the lower end of the second contact section may be provided in the shape of a W, a V, a U, or the like. In one embodiment, the lower end of the second contact section is provided with a W-shaped part, and the bottom end of the W-shaped part is provided with a plurality of contact protrusions.
The invention also proposes an integrated circuit test device comprising the probe described above. The specific structure of the probe refers to the above embodiments, and since the integrated circuit test equipment adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A probe is used for testing an integrated circuit and is characterized by comprising a first contact section, a connecting section and a second contact section which are sequentially arranged from top to bottom, wherein the upper end of the first contact section is used for contacting a test IC, and the lower end of the second contact section is used for contacting a test PCB;
the first contact section the linkage segment the second contact section integration sets up, first contact section upper end is formed with the contact inclined plane that 2 intervals set up, the contact inclined plane be used for with test IC's tin ball contact, first contact section can take place elastic deformation in the horizontal direction, works as when first contact section takes place elastic deformation in the horizontal direction, 2 contact inclined plane keeps away from each other, second contact section can take place elastic deformation in vertical direction.
2. The probe of claim 1, wherein the first contact section includes a first positioning member and a second positioning member, the first contact section is used for connecting a solder ball of a test IC, and the first positioning member and the second positioning member can move toward and away from each other to clamp and release the solder ball.
3. The probe as claimed in claim 2, wherein the first positioning member and the second positioning member are disposed to be gradually enlarged toward the solder ball.
4. The probe of claim 1, wherein the second contact section comprises a notched ring structure, the notch having a first free end disposed on an upper side of the notch and a second free end disposed on a lower side of the notch, the first free end and the second free end approaching each other when the probe is compressed by a force.
5. The probe of claim 4, wherein the second contact section is configured as a C-shaped member, the C-shaped member includes a first notch, the first free end and the second free end are respectively disposed at the upper side and the lower side of the first notch, the bottom end of the C-shaped member is configured to contact the test PCB, and when the probe is compressed by a force, the first free end and the second free end contact each other.
6. The probe of claim 4, wherein the second contact section is configured as an S-shaped member, the S-shaped member includes a second notch and a third notch arranged from top to bottom, a first free end is disposed on an upper side of the second notch, a second free end is disposed on a lower side of the third notch, a transition section is disposed between the first notch and the second notch, a bottom end of the S-shaped member is configured to contact the test PCB, when the probe is compressed by a force, the first free end contacts the transition section, and the second free end contacts the transition section; alternatively, the first and second electrodes may be,
the second contact section is arranged in an m-shaped piece; alternatively, the first and second electrodes may be,
the second contact section is arranged in an 8-shaped piece; alternatively, the first and second electrodes may be,
the second contact section is arranged in an annular piece; alternatively, the first and second electrodes may be,
the second contact section is arranged in an inverted trapezoidal shape; alternatively, the first and second electrodes may be,
the second contact section is arranged in a triangular shape; alternatively, the first and second electrodes may be,
the second contact section is arranged in a half-frame shape piece; alternatively, the first and second electrodes may be,
the second contact section comprises an annular piece and a gapped annular structure, wherein the annular piece is disposed below the gapped annular structure; alternatively, the ring is disposed over the gapped ring structure.
7. The probe of claim 1, further comprising a support part, a support plate being disposed between the test IC and the test PCB, the support part being for contacting an inner wall of the support plate to prevent the probe from shaking.
8. The probe as claimed in claim 7, wherein the support part includes a first support part and a second support part, the first support part and the second support part being formed at left and right sides of the connection section, respectively.
9. The probe of claim 1, wherein the second contact section is formed with a contact surface at a lower end thereof; alternatively, the first and second electrodes may be,
a plurality of contact protrusions are formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,
a single contact point is formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,
the lower end of the second contact section is arranged in a W-shaped piece, a V-shaped piece and a U-shaped piece.
10. An integrated circuit test apparatus, characterized in that it comprises a probe according to claims 1 to 9.
Priority Applications (1)
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|---|---|---|---|
| CN202111110835.9A CN113866464A (en) | 2021-09-22 | 2021-09-22 | Probe and integrated circuit test equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111110835.9A CN113866464A (en) | 2021-09-22 | 2021-09-22 | Probe and integrated circuit test equipment |
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| CN113866464A true CN113866464A (en) | 2021-12-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016568A1 (en) * | 2022-07-22 | 2024-01-25 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test device |
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| WO2024016568A1 (en) * | 2022-07-22 | 2024-01-25 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test device |
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