CN216411367U - Probe and integrated circuit test equipment - Google Patents

Abstract

The utility model provides a probe and integrated circuit test equipment, wherein the probe comprises a first contact section, a connecting section and a second contact section which are sequentially arranged from top to bottom, the upper end of the first contact section is used for contacting a test IC, and the lower end of the second contact section is used for contacting a test PCB; the first contact section the linkage segment the second contact section integration sets up, first contact section is formed with the contact inclined plane, the contact inclined plane from top to bottom sets up inwards, the contact inclined plane be used for with test IC's tin ball contact, second contact section can take place elastic deformation in vertical direction. Therefore, the utility model solves the problems of larger impedance, larger impedance among probes, poorer consistency and the like in the prior art.

Description

Probe and integrated circuit test equipment

Technical Field

The utility model relates to the technical field of integrated circuit test equipment, in particular to a probe and integrated circuit test equipment comprising the probe.

Background

In the prior art, a probe for testing an integrated circuit is usually formed by combining a needle tube, a needle head and a spring component in an elastic piece arrangement. However, such an arrangement results in a long path through which current needs to pass during testing, and a plurality of components are in contact conduction with each other, so that the contact resistance is large, which affects the actual testing effect of the integrated circuit. The probe for the integrated circuit test in the prior art has the problems of high impedance and poor impedance consistency among the probes, and meanwhile, the existing test probe is formed by assembling parts such as a needle tube, a needle head and a spring, so that the processing and assembling cost is high.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a probe and integrated circuit testing equipment comprising the probe. The probe aims to solve the problems of large impedance, poor consistency and the like of the probe for testing the integrated circuit in the prior art.

In order to solve the above problems, the present invention provides a probe, which includes a first contact section, a connection section, and a second contact section sequentially arranged from top to bottom, wherein an upper end of the first contact section is used for contacting a test IC, and a lower end of the second contact section is used for contacting a test PCB;

the first contact section the linkage segment the second contact section integration sets up, first contact section is formed with the contact inclined plane, the contact inclined plane from top to bottom sets up inwards, the contact inclined plane be used for with test IC's tin ball contact, second contact section can take place elastic deformation in vertical direction.

In an optional embodiment, the probe further comprises a support portion, a support plate is arranged between the test IC and the test PCB, and the support portion is used for contacting with the inner wall of the support plate to prevent the probe from shaking.

In an alternative embodiment, the support portion includes a first support portion, and the first support portion and the connecting section are spaced apart from each other.

In an alternative embodiment, the lower end of the first contact section is disposed between the upper end of the first contact section and the support portion.

In an alternative embodiment, the support portion includes a first support portion and a second support portion, and the first support portion and the second support portion are respectively formed at left and right sides of the connecting section.

In an alternative embodiment, the second contact section includes a notched ring structure, the upper side of the notch is provided with a first free end, the lower side of the notch is provided with a second free end, and when the probe is compressed by a force, the first free end and the second free end approach each other.

In an optional embodiment, the second contact section is a C-shaped member, the C-shaped member includes a first notch, the first free end and the second free end are respectively disposed on the upper side and the lower side of the first notch, the bottom end of the C-shaped member is configured to contact the test PCB, and when the probe is compressed by a force, the first free end and the second free end contact each other.

In an optional embodiment, the second contact section is arranged in an S-shaped part, the S-shaped part includes a second notch and a third notch arranged from top to bottom, a first free end is arranged on the upper side of the second notch, a second free end is arranged on the lower side of the third notch, a transition section is arranged between the third notch and the second notch, the bottom end of the S-shaped part is used for contacting the test PCB, when the probe is compressed by a force, the first free end contacts the transition section, and the second free end contacts the transition section; alternatively, the first and second electrodes may be,

the second contact section is arranged in an m-shaped piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an 8-shaped piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an annular piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an inverted trapezoidal shape; alternatively, the first and second electrodes may be,

the second contact section is arranged in a triangular shape; alternatively, the first and second electrodes may be,

the second contact section is arranged in a half-frame shape piece; alternatively, the first and second electrodes may be,

the second contact section comprises an annular piece and a gapped annular structure, wherein the annular piece is disposed below the gapped annular structure; alternatively, the ring is disposed over the gapped ring structure.

In an optional embodiment, the lower end of the second contact section is provided with a contact surface; alternatively, the first and second electrodes may be,

a plurality of contact protrusions are formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,

a single contact point is formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,

the lower end of the second contact section is arranged in a W-shaped piece, a V-shaped piece and a U-shaped piece.

The utility model also proposes an integrated circuit test device comprising the probe described above.

According to the technical scheme, the probe and the integrated circuit testing equipment comprising the probe are provided, and the first contact section, the connecting section and the second contact section of the probe are integrally arranged, so that the problems of high probe impedance, poor consistency and the like in the prior art are solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a first embodiment of a probe according to the present invention;

FIG. 2 is a schematic structural diagram of a second embodiment of a probe according to the present invention;

FIG. 3 is a cross-sectional view of a first embodiment of the integrated circuit test apparatus of the present invention;

FIG. 4 is a cross-sectional view of a second embodiment of the integrated circuit test apparatus of the present invention;

FIG. 5 is a cross-sectional view of a third embodiment of the integrated circuit test apparatus of the present invention.

FIG. 6 is a schematic structural diagram of an integrated circuit test apparatus according to a fourth embodiment of the present invention;

the reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Probe needle	11	First contact section
11a	Contact ramp		12					Connecting segment
				13	Second contact section	14a	First free end
14b	Second free end	14c	Transition section
				16a	A first supporting part	16b	Second supporting part
20	Testing IC	21	Tin ball
				30	Testing PCB	31	Test point
40	First supporting plate	50	Second support plate

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a probe 10, where the probe 10 includes a first contact section 11, a connection section 12 and a second contact section 13 sequentially arranged from top to bottom, an upper end of the first contact section 11 is used for contacting a test IC20, and a lower end of the second contact section 13 is used for contacting a test PCB 30. First contact segment 11 the linkage segment 12 the integration of second contact segment 13 sets up, first contact segment 11 is formed with contact inclined plane 11a, contact inclined plane 11a from top to bottom sets up inwards, contact inclined plane 11a be used for with test IC 20's tin ball 21 contacts, second contact segment 13 can take place elastic deformation in vertical direction.

In the prior art, the probe 10 for testing the integrated circuit is usually formed by combining a needle tube, a needle head and a spring component in an elastic piece arrangement. However, such an arrangement results in a long path through which current needs to pass during testing, and a plurality of components are in contact conduction with each other, so that the contact resistance is large, which affects the actual testing effect of the integrated circuit. In the probe 10 of the present invention, the first contact section 11, the connecting section 12, and the second contact section 13 are integrally formed metal pieces. Thus, the contact resistance among the components can be effectively reduced, and meanwhile, the assembly and manufacturing cost is reduced.

Referring to fig. 5, the probe 10 is further applied to an IC testing apparatus and disposed between the testing IC20 and the testing PCB30, wherein the upper end of the first contact segment 11 contacts the solder ball 21 of the testing IC20, and the lower end of the second contact segment 13 contacts the testing point 31 of the testing PCB 30. Between the test IC20 and the test PCB30, a first support plate 40 and a second support plate 50 are sequentially disposed from top to bottom. And a plurality of probes 10 are disposed between the test IC20 and the test PCB 30. In an alternative embodiment, a plurality of probes 10 may be arranged in an array. And for each probe 10, a containing groove for containing the probe 10 is formed between the first supporting plate 40 and the second supporting plate 50. The deformation position is changed as the probe 10 is compressed in the vertical direction during the test. In order to facilitate the probe 10 to be compressed, in the initial position, the probe 10 extends out of the opening of the containing groove, and in the deformed position, the bottom end of the probe 10 is compressed to be flush with the opening of the containing groove. This is due to the difficulty in making contact between the bottom end of each of the probes 10 and the test point 31 on the test PCB30 when the test IC20 is in close proximity to the test PCB30 for a plurality of different probes 10.

To solve this problem, the first contact section 11 is elastically deformable in the horizontal direction, and the second contact section 13 is elastically deformable in the vertical direction. Therefore, when the probe 10 is tested, the bottom end of the probe 10 is fully contacted with the test PCB30, and the top end of the probe 10 is fully contacted with the solder ball 21, so as to obtain a better contact effect. When a plurality of probes 10 are tested simultaneously, the upper side and the lower side of each probe 10 can be fully contacted.

To adapt the shape of the solder ball, the first contact section 11 and the solder ball 21 have a sufficient contact area. The first contact section 11 is formed with a contact slope 11 a. The contact slope 11a is provided to effectively increase the contact area between the solder ball 21 and the first contact section 11 compared with the contact plane. Specifically, when the solder ball 21 approaches the contact slope 11a, the contact slope 11a is subjected to a downward force to deform in the horizontal direction, and the contact slope 11a is subjected to the force of the solder ball 21 to be closer to the horizontal state, so that the upper end of the first contact section 11 is in full contact with the solder ball 21.

Further, the first contact section upper end includes 1 cantilever, and the cantilever upper end forms 1 contact inclined plane. So set up, the structure is more simplified, and the processing degree of difficulty obtains further reducing.

In an alternative embodiment, the probe 20 further comprises a support plate disposed between the test IC20 and the test PCB30, the support plate being configured to contact an inner wall of the support plate to prevent the probe 20 from shaking. Because the probe 10 is telescopically arranged in the accommodating groove in the vertical direction, a certain gap inevitably exists between the probe 10 and the inner wall of the accommodating groove for the convenience of processing. The provision of the support portion serves to prevent the probe 10 from shaking due to the gap.

In an alternative embodiment, the support portion includes a first support portion 16a and a second support portion 16b, and the first support portion 16a and the second support portion 16b are respectively formed at left and right sides of the connecting section 12.

Referring to fig. 2, in an alternative embodiment, the support portions include a first support portion 16a and a second support portion 16b, and the first support portion 16a and the second support portion 16b are respectively formed at left and right sides of the connecting section 12. While the integrated circuit test equipment is in operation. The first support portion 16a and the second support portion 16b are in contact with the left and right inner walls of the support plate, respectively. So as to avoid the influence of the too large shaking amplitude of the probe 10 on the test effect.

Referring to fig. 2, in an alternative embodiment, a gap exists between the connecting section 12 and the first supporting portion 16a, and a gap exists between the connecting section 12 and the second supporting portion 16 b. It is noted that the connecting section 12 and the first and second support portions 16a and 16b are disposed at intervals. This arrangement leaves a certain deformation margin for the probe 10. The probability of the first and second support portions 16a and 16b being damaged by contact with the support plate is reduced.

It is noted that the solder ball 21 moves downward and contacts the contact slope 11 a. The forces experienced by the probe are not balanced from side to side. If the spacing between the first support portion 16a, the second support portion 16b and the connecting section 12 is equal. A good supporting effect may not be achieved. Therefore, in an embodiment, the distance between the first supporting portion 16a and the connecting section 12 is not equal to the distance between the second supporting portion 16b and the connecting section 12. Please refer to fig. 1. The upper end of the contact inclined plane 11a is arranged between the first supporting part 16a and the lower end of the contact inclined plane 11a, and the distance from the first supporting part 16a to the connecting section 12 is smaller than the distance from the second supporting part 16b to the connecting section 12.

Referring to fig. 2, in an alternative embodiment, the support portion includes a first support portion 16a, and the first support portion 16a is spaced apart from the connecting section 12. But due to the provision of the contact ramp 11a of the single arm. In the case where the external environment is not much affected, the probe pin 10 is more easily shaken toward the side contacting the upper end of the inclined surface 11 a. Therefore, in order to further simplify the structure and save the cost, the support portion 16 includes a first support portion 16 a.

Referring to fig. 2, when the solder ball approaches the probe 10 and contacts the contact slope 11a, the probe 10 is forced toward the upper end of the contact slope 11 a. The support is provided to balance this force and to make the probe 10 more stable. Thus, in an alternative embodiment, the lower end of the first contact section 11 is arranged between the upper end of the first contact section 11 and the support.

Referring to fig. 1 and 6, in an alternative embodiment, the second contact section 13 includes a ring structure with a notch, a first free end 14a is disposed on an upper side of the notch, and a second free end 14b is disposed on a lower side of the notch, and when the probe 10 is compressed by a force, the first free end 14a and the second free end 14b approach each other. With a plurality of different probes 10, it is difficult to make the bottom end of each of the probes 10 contact a test point 31 on the test PCB30 when the test IC20 is close to the test PCB 30. Therefore, the second contact section 13 is a notched ring structure. When the structure is compressed, i.e. the first free end 14a and the second free end 14b are close to each other, the height of the probe 10 as a whole in the vertical direction is also reduced accordingly. The first free end 14a and the second free end 14b may be in contact with each other or may be close to each other without being in contact.

Referring to fig. 6, in an alternative embodiment, the second contact section 13 is configured as a C-shaped member, the C-shaped member includes a first notch, the first free end 14a and the second free end 14b are respectively disposed at upper and lower sides of the first notch, a bottom end of the C-shaped member is configured to contact the test PCB30, and when the probe 10 is compressed by a force, the first free end 14a and the second free end 14b contact each other. And a probe 10 in a spring arrangement, as compared to a vertically arranged probe 10. The path traveled by current from test IC20 to test PCB30 inevitably increases, which inevitably increases the impedance of probe 10, affecting the test performance.

Referring to fig. 1 to 4, in an alternative embodiment, the second contact section 13 is disposed in an S shape, the S-shaped member includes a second notch and a third notch disposed from top to bottom, a first free end 14a is disposed on an upper side of the second notch, a second free end 14b is disposed on a lower side of the third notch, a transition section 14c is disposed between the third notch and the second notch, a bottom end of the S-shaped member is configured to contact the test PCB30, when the probe 10 is compressed by a force, the first free end 14a contacts the transition section 14c, and the second free end 14b contacts the transition section 14 c.

The second contact section 13 may also be arranged in an m-shaped piece, in an 8-shaped piece. Or the second contact section 13 comprises an annular member and a notched annular structure, wherein the annular member is disposed below the notched annular structure; alternatively, the ring is disposed over the gapped ring structure. In addition, other shapes that are vertically deformable, i.e., capable of being compressed to reduce the height in the vertical direction, are also within the scope of the present application. Optionally, the second contact section 13 may also be disposed in an inverted trapezoidal shape, or the second contact section 13 is disposed in a triangular shape, or the second contact section 13 is disposed in a half-frame shape.

The S-shaped member can be viewed as being comprised of two oppositely directed gapped annular structures. When the test IC20 and the test PCB30 are brought into close proximity, i.e., the bottom end of the probe pin 10 contacts the test point 31 on the test PCB 30. The first free end 14a and the transition section 14c are in contact to short circuit the gapped annular structure between the first free end 14a and the transition section 14 c. Therefore, the impedance of the probe 10 is reduced, and the detection effect of the probe 10 and the integrated circuit test equipment using the probe 10 is improved.

On the basis of the last alternative embodiment, after the first free end 14a and the transition end have been contacted. The probe 10 continues to be compressed. The second free end moves towards the transition section 14 c. Until the second free end 14b contacts the transition section 14 c. Specifically, the second contact section 13 is arranged in an S shape, so that the movement between the second free end 14b and the transition section 14c leaves more deformation allowance for the probe 10 while realizing short circuit to reduce the impedance of the probe 10. So that the probe 10 can be applied to an integrated circuit test apparatus in which a plurality of probes 10 are simultaneously tested. The manufacturing accuracy requirements of the probe 10 are reduced.

Referring to fig. 2 to 4, in an embodiment, a portion of the bottom end of the probe 10, which is contacted with the contact test point 31, may be provided in a ball shape or other shapes. Namely, the contact surface can be set to be a plane or an arc surface. Specifically, the lower end of the second contact section 13 is formed with a contact surface, which may be an arc surface or a plane surface. Or a plurality of contact protrusions are formed at the lower end of the second contact section 13. Alternatively, the lower end of the second contact section 13 is formed with a single contact point. In an embodiment, the lower end of the second contact section 13 may be disposed in a W-shaped, V-shaped, U-shaped or other different shapes. In one embodiment, the lower end of the second contact section 13 is provided as a W-shaped member, and the bottom end of the W-shaped member forms a plurality of contact protrusions.

The utility model also proposes an integrated circuit test device comprising the probe described above. The specific structure of the probe refers to the above embodiments, and since the integrated circuit test equipment adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A probe is used for integrated circuit test equipment and is characterized by comprising a first contact section, a connecting section and a second contact section which are sequentially arranged from top to bottom, wherein the upper end of the first contact section is used for contacting a test IC, and the lower end of the second contact section is used for contacting a test PCB;

the first contact section the linkage segment the second contact section integration sets up, first contact section is formed with the contact inclined plane, the contact inclined plane from top to bottom sets up inwards, the contact inclined plane be used for with test IC's tin ball contact, second contact section can take place elastic deformation in vertical direction.

2. The probe of claim 1, further comprising a support part, a support plate being disposed between the test IC and the test PCB, the support part being for contacting an inner wall of the support plate to prevent the probe from shaking.

3. The probe of claim 2, wherein the support comprises a first support, the first support and the connecting segment being spaced apart.

4. A probe according to claim 3, wherein the lower end of the first contact section is disposed between the upper end of the first contact section and the support portion.

5. The probe as claimed in claim 2, wherein the support part includes a first support part and a second support part, the first support part and the second support part being formed at left and right sides of the connection section, respectively.

6. The probe of claim 1, wherein the second contact section comprises a notched ring structure, the notch having a first free end disposed on an upper side of the notch and a second free end disposed on a lower side of the notch, the first free end and the second free end approaching each other when the probe is compressed by a force.

7. The probe of claim 6, wherein the second contact section is configured as a C-shaped member, the C-shaped member includes a first notch, the first free end and the second free end are respectively disposed at upper and lower sides of the first notch, a bottom end of the C-shaped member is configured to contact the test PCB, and when the probe is compressed by a force, the first free end and the second free end contact each other.

8. The probe of claim 6, wherein the second contact section is configured as an S-shaped member, the S-shaped member includes a second notch and a third notch arranged from top to bottom, a first free end is disposed on an upper side of the second notch, a second free end is disposed on a lower side of the third notch, a transition section is disposed between the third notch and the second notch, a bottom end of the S-shaped member is configured to contact the test PCB, when the probe is compressed by a force, the first free end contacts the transition section, and the second free end contacts the transition section; alternatively, the first and second electrodes may be,

the second contact section is arranged in an m-shaped piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an 8-shaped piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an annular piece; alternatively, the first and second electrodes may be,

the second contact section is arranged in an inverted trapezoidal shape; alternatively, the first and second electrodes may be,

the second contact section is arranged in a triangular shape; alternatively, the first and second electrodes may be,

the second contact section is arranged in a half-frame shape piece; alternatively, the first and second electrodes may be,

the second contact section comprises an annular piece and a gapped annular structure, wherein the annular piece is disposed below the gapped annular structure; alternatively, the ring is disposed over the gapped ring structure.

9. The probe of claim 1, wherein the second contact section is formed with a contact surface at a lower end thereof; alternatively, the first and second electrodes may be,

a plurality of contact protrusions are formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,

a single contact point is formed at the lower end of the second contact section; alternatively, the first and second electrodes may be,

the lower end of the second contact section is arranged in a W-shaped piece, a V-shaped piece and a U-shaped piece.

10. An integrated circuit test apparatus, characterized in that it comprises a probe according to any one of claims 1 to 9.

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