CN216411479U - Probe and integrated circuit test equipment - Google Patents
Probe and integrated circuit test equipment Download PDFInfo
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- CN216411479U CN216411479U CN202122292198.3U CN202122292198U CN216411479U CN 216411479 U CN216411479 U CN 216411479U CN 202122292198 U CN202122292198 U CN 202122292198U CN 216411479 U CN216411479 U CN 216411479U
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Abstract
The utility model provides a probe and integrated circuit test equipment, wherein the probe comprises a first contact section, a connection section and a second contact section which are sequentially arranged from top to bottom, the upper end of the first contact section is used for connecting a test IC, and the lower end of the second contact section is used for connecting a test PCB; the probe is an elastic piece and has an initial position and a deformation position; the second contact section or the connection section is arranged in a C-shaped piece, a first free end and a second free end are arranged at the notch of the C-shaped piece, and when the probe is in the initial position, a gap exists between the first free end and the second free end; the first free end and the second free end are in contact when the probe is in the deformed position. Therefore, the utility model solves the problem that the probe for the integrated circuit test has larger impedance in the prior art.
Description
Technical Field
The utility model relates to the technical field of integrated circuit test equipment, in particular to a probe and integrated circuit test equipment comprising the probe.
Background
In the prior art, probes for testing integrated circuits are often arranged in an elastic manner. However, such an arrangement may result in a long path through which current needs to pass during testing, i.e., a probe having a large impedance, which may affect the testing efficiency of the integrated circuit. Namely, the probe for testing the integrated circuit in the prior art has the problem of larger impedance.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a probe and integrated circuit testing equipment comprising the probe. The probe aims to solve the problem that the integrated circuit test probe in the prior art has large impedance.
In order to solve the above problems, the present invention provides a probe, which includes a first contact section, a connection section, and a second contact section sequentially arranged from top to bottom, wherein an upper end of the first contact section is used for connecting a test IC, and a lower end of the second contact section is used for connecting a test PCB; the probe is an elastic piece and has an initial position and a deformation position; the second contact section or the connection section is arranged in a C-shaped piece, a first free end and a second free end are arranged at the notch of the C-shaped piece, and when the probe is in the initial position, a gap exists between the first free end and the second free end; the first free end and the second free end are in contact when the probe is in the deformed position.
In an alternative embodiment, when the second contact section is arranged in a C-shaped piece, the bottom end of the C-shaped piece is provided with a contact surface for contacting with the test PCB; or, the bottom end of the C-shaped piece is provided with a contact bulge for contacting with the test PCB.
In an alternative embodiment, the second contact section is formed with contact protrusions for contacting the test PCB when the connection section is provided in a C-shaped configuration.
In an optional embodiment, the probe further comprises a support part, a support plate is arranged between the test IC and the test PCB, and the support part is used for contacting with the inner wall of the support plate to prevent the support plate from shaking left and right.
In an optional embodiment, the support portion includes a first support portion and a second support portion, the first support portion and the second support portion are respectively formed on the left side and the right side of the connecting section, and gaps exist between the connecting section and the first support portion and between the connecting section and the second support portion.
In an alternative embodiment, the support portion includes a first support portion formed between the first contact section and the connection section, and a second support portion formed between the connection section and the second contact section, and the support plate is formed with support grooves corresponding to the first support portion and the second support portion, respectively.
In an optional embodiment, the test IC has a solder ball, an upper end of the first contact section is used for connecting the solder ball, the first contact section includes a first positioning element and a second positioning element, and the solder ball is disposed between the first positioning element and the second positioning element.
In an optional embodiment, the first positioning element and the second positioning element are arranged in a gradually expanding manner towards the direction of the solder ball.
In an alternative embodiment, the first contact section, the connecting section and the second contact section are integrally arranged.
The utility model also proposes an integrated circuit test device comprising the probe described above.
The technical scheme of the utility model is that the probe is provided with a connecting section or a second contact section which is arranged in a C-shaped piece, and a first free end and a second free end are arranged at a notch of the C-shaped piece. When the probe is in the deformation position, the first free end is in contact with the second free end, and at the moment, the path through which the current needs to pass is shortest, namely, the impedance of the probe is reduced. Thus, the utility model solves the problem of larger probe impedance in the prior art.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of one embodiment of a probe of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of a probe of the present invention;
FIG. 3 is a schematic structural diagram of another embodiment of a probe of the present invention;
FIG. 4 is a cross-sectional view of one embodiment of the integrated circuit test apparatus of the present invention;
FIG. 5 is a diagram of another embodiment of an integrated circuit test apparatus according to the present invention;
the reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
11 | |
| 12 | Connecting |
13 | |
| 14a | First |
14b | Second |
| 15a | |
15b | |
| 16a | A first supporting |
16b | Second supporting |
| 20 | Testing |
21 | |
| 30 | Testing PCB | 31 | |
| 40 | First supporting |
50 | Second support plate |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 to 3, in order to solve the above problem, the present invention provides a probe 10, where the probe 10 includes a first contact section 11, a connection section 12, and a second contact section 13 sequentially arranged from top to bottom, an upper end of the first contact section 11 is used for connecting a test IC20, and a lower end of the second contact section 13 is used for connecting a test PCB 30; the probe 10 is an elastic piece, and the probe 10 has an initial position and a deformation position; wherein the second contact section 13 or the connecting section 12 is provided in a C-shaped piece, a first free end 14a and a second free end 14b are provided at the notch of the C-shaped piece, and when the probe 10 is in the initial position, a gap exists between the first free end 14a and the second free end 14 b; when the probe 10 is in the deformed position, the first free end 14a and the second free end 14b are in contact.
The probe 10 is applied to an integrated circuit test apparatus and is disposed between a test IC20 and a test PCB30, an upper end of the first contact section 11 is in contact with a solder ball of the test IC20, and a lower end of the second contact section 13 is in contact with a test point of the test PCB 30. Between the test IC20 and the test PCB30, a first support plate 40 and a second support plate 50 are sequentially disposed from top to bottom. And a plurality of probes 10 are disposed between the test IC20 and the test PCB 30. In an alternative embodiment, a plurality of probes 10 may be arranged in an array. And for each probe 10, a containing groove for containing the probe 10 is formed between the first supporting plate 40 and the second supporting plate 50. The deformation position is changed as the probe 10 is compressed in the vertical direction during the test. In order to facilitate the probe 10 to be compressed, in the initial position, the probe 10 extends out of the opening of the containing groove, and in the deformed position, the bottom end of the probe 10 is compressed to be flush with the opening of the containing groove. This is due to the difficulty in making each of the bottom ends of the probes 10 just contact the test PCB30 when the test IC20 is adjacent the test PCB30 for a plurality of different probes 10. Thus, the probe 10 is provided as a resilient member.
And a probe 10 in a spring arrangement, as compared to a vertically arranged probe 10. The path traveled by current from test IC20 to test PCB30 inevitably increases, which inevitably increases the impedance of probe 10, affecting the test performance. In contrast, in the probe 10 of the present invention, the first contact end and the second contact end are in contact when the probe 10 is in a compressed position, i.e., the end of the probe 10 is in contact with the test point. Thus, when current is moved to the first contact end, it can be moved directly to the second contact end. Corresponding to the C-shaped member being short-circuited. The arrangement effectively reduces the impedance of the probe 10 and improves the detection effect of the probe 10 and the integrated circuit test equipment using the probe 10.
In an alternative embodiment, when the second contact section 13 is provided as a C-shaped piece, the bottom end of the C-shaped piece is formed with a contact surface for contacting the test PCB 30; alternatively, the bottom end of the C-shaped piece is formed with a contact protrusion for contacting the test PCB 30. The end of the second contact section 13, the lowermost end of the probe 10, is used for contact with a contact test point of the test PCB30 to obtain a test result. And the probe 10 and the test PCB may be in point contact or surface contact. When the second contact section 13 is provided as a C-shaped piece, the bottom end of the C-shaped piece is adapted to contact the test PCB 30. In one embodiment, the arcuate face of the bottom end of the C-shaped member contacts the test PCB 30. In another embodiment, the bottom end of the C-shaped member may be machined to form contact bumps, the bottom surfaces of which are in contact with the test PCB 30.
In an alternative embodiment, the second contact section 13 is formed with a contact protrusion for contacting the test PCB30 when the connection section 12 is provided in a C-shaped configuration. At this point, the C-shaped piece is not in contact with the test PCB 30. The probe 10 is additionally provided with a contact bump. Which contact protrusion is arranged at the end of said second contact section 13.
In an alternative embodiment, the probe 10 further comprises a support part having a support plate between the test IC20 and the test PCB30, the support part being configured to contact an inner wall of the support plate to prevent the support plate from shaking left and right. Because the probe 10 is telescopically arranged in the accommodating groove in the vertical direction, a certain gap inevitably exists between the probe 10 and the inner wall of the accommodating groove for the convenience of processing.
Referring to fig. 1 and 2, in an alternative embodiment, the support portions include a first support portion 16a and a second support portion 16b, the first support portion 16a and the second support portion 16b are respectively formed at left and right sides of the connecting section 12, and gaps exist between the connecting section 12 and the first support portion 16a and between the connecting section 12 and the second support portion 16 b. While the integrated circuit test equipment is in operation. The first support portion 16a and the second support portion 16b are in contact with the left and right inner walls of the support plate, respectively. So as to avoid the influence of the too large left-right shaking amplitude of the probe 10 on the test effect. It is noted that the connecting section 12 and the first and second support portions 16a and 16b are disposed at intervals. This arrangement leaves a certain deformation margin for the probe 10. The probability of the first and second support portions 16a and 16b being damaged by contact with the support plate is reduced.
Referring to fig. 3, in an alternative embodiment, the support portion includes a first support portion 16a and a second support portion 16b, the first support portion 16a is formed between the first contact section 11 and the connection section 12, the second support portion 16b is formed between the connection section 12 and the second contact section 13, and the support plate is formed with support grooves corresponding to the first support portion 16a and the second support portion 16b, respectively.
Referring to fig. 5, for the probe 10 proposed in the above embodiment, the first support plate 40 and the second support plate 50 are respectively provided with support grooves corresponding to the first support part 16a and the second support part 16 b. And the first supporting portion 16a is in clearance fit with the first supporting groove, and the second supporting portion 16b is in clearance fit with the second supporting groove. To define the amplitude of the side-to-side oscillation of the probe 10.
In an alternative embodiment, the test IC20 has a solder ball, the upper end of the first contact section 11 is used for connecting the solder ball, the first contact section 11 includes a first positioning element 15a and a second positioning element 15b, and the solder ball is disposed between the first positioning element 15a and the second positioning element 15 b. In another alternative embodiment, the first contact segment 11 itself forms a positioning element, i.e. the upper end of the first contact segment 11 is directly soldered to the solder ball. Compared with the scheme that the first contact section 11 is directly welded with the solder ball, the scheme that the solder ball is arranged between the first positioning piece 15a and the second positioning piece 15b can effectively reduce the processing difficulty, and the probe 10 can be connected with the solder ball more easily.
In an optional embodiment, the first positioning element 15a and the second positioning element 15b are arranged to be gradually expanded toward the solder ball. Specifically, the first positioning element 15a and the second positioning element 15b are arranged in a gradually expanding bell mouth shape. On the basis of the above alternative embodiment, the first positioning element 15a and the second positioning element 15b are formed with contact surfaces for contacting with solder balls at the bell mouth. The solder ball is soldered to the first positioning member 15a and the second positioning member 15b through the contact surface. The first positioning element 15a and the second positioning element 15b are arranged in a gradually expanding manner, which is beneficial to increasing the contact area between the probe 10 and the solder ball, so as to improve the test effect of the integrated circuit test equipment.
In an alternative embodiment, the first contact section 11, the connecting section 12 and the second contact section 13 are integrally formed. Specifically, the probe 10 is an integrally formed elastic member. Compared with the probe 10 sold in the market, the probe 10 provided by the utility model has the advantages of simple structure, small volume, low manufacturing difficulty, low manufacturing cost and the like.
Referring to fig. 4 and 5, the present invention further provides an integrated circuit testing apparatus, where the integrated circuit testing apparatus employs the probe 10, and the specific structure of the probe 10 refers to the above embodiments, and since the integrated circuit testing apparatus employs all technical solutions of all the above embodiments, the integrated circuit testing apparatus at least has all beneficial effects brought by the technical solutions of the above embodiments, which are not described in detail herein.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A probe is used for testing an integrated circuit and is characterized by comprising a first contact section, a connection section and a second contact section which are sequentially arranged from top to bottom, wherein the upper end of the first contact section is used for connecting a test IC, and the lower end of the second contact section is used for connecting a test PCB; the probe is an elastic piece and has an initial position and a deformation position;
the second contact section or the connection section is arranged in a C-shaped piece, a first free end and a second free end are arranged at the notch of the C-shaped piece, and when the probe is in the initial position, a gap exists between the first free end and the second free end; the first free end and the second free end are in contact when the probe is in the deformed position.
2. The probe of claim 1, wherein when the second contact section is provided in a C-shaped piece, a bottom end of the C-shaped piece is formed with a contact surface for contacting the test PCB; or, the bottom end of the C-shaped piece is provided with a contact bulge for contacting with the test PCB.
3. The probe of claim 1, wherein the second contact section is formed with a contact protrusion for contacting the test PCB when the connection section is provided in a C-shaped configuration.
4. The probe of claim 1, further comprising a support part having a support plate between the test IC and the test PCB, the support part for contacting an inner wall of the support plate to prevent the support plate from shaking left and right.
5. The probe according to claim 4, wherein the support part includes a first support part and a second support part, the first support part and the second support part are respectively formed at left and right sides of the connection section, and gaps exist between the connection section and the first support part and between the connection section and the second support part.
6. The probe of claim 4, wherein the support part includes a first support part formed between the first contact section and the connection section and a second support part formed between the connection section and the second contact section, the support plate being formed with support grooves corresponding to the first support part and the second support part, respectively.
7. The probe of claim 1, wherein the test IC has a solder ball, the upper end of the first contact section is connected to the solder ball, the first contact section includes a first positioning element and a second positioning element, and the solder ball is disposed between the first positioning element and the second positioning element.
8. The probe as claimed in claim 7, wherein the first positioning member and the second positioning member are disposed to be gradually enlarged toward the solder ball.
9. The probe of claim 1, wherein the first contact section, the connecting section, and the second contact section are integrally disposed.
10. An integrated circuit test apparatus, characterized in that it comprises a probe according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122292198.3U CN216411479U (en) | 2021-09-22 | 2021-09-22 | Probe and integrated circuit test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122292198.3U CN216411479U (en) | 2021-09-22 | 2021-09-22 | Probe and integrated circuit test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216411479U true CN216411479U (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122292198.3U Active CN216411479U (en) | 2021-09-22 | 2021-09-22 | Probe and integrated circuit test equipment |
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|---|---|
| CN (1) | CN216411479U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113866464A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
| WO2024016568A1 (en) * | 2022-07-22 | 2024-01-25 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test device |
-
2021
- 2021-09-22 CN CN202122292198.3U patent/CN216411479U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113866464A (en) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test equipment |
| WO2024016568A1 (en) * | 2022-07-22 | 2024-01-25 | 深圳凯智通微电子技术有限公司 | Probe and integrated circuit test device |
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| GR01 | Patent grant |