CN218567436U

CN218567436U - Probe and integrated circuit test equipment

Info

Publication number: CN218567436U
Application number: CN202221929758.XU
Authority: CN
Inventors: 陶杉; 段超毅; 蒋伟; 周闯
Original assignee: Shenzhen Kzt Microelectronics Technology Co ltd
Current assignee: Shenzhen Kzt Microelectronics Technology Co ltd
Priority date: 2022-07-22
Filing date: 2022-07-22
Publication date: 2023-03-03
Anticipated expiration: 2032-07-22
Also published as: WO2024016568A1

Abstract

The utility model discloses a probe and integrated circuit test equipment, wherein, the probe includes two first contact sections, first linkage segment, second linkage segment and second contact section; the two first contact sections are arranged at intervals, the upper ends of the two first contact sections are respectively provided with a contact surface for contacting with a test IC, the two first contact sections can elastically deform in the horizontal direction, the second connection section comprises a plurality of straight sections and a plurality of bending sections, the straight sections and the bending sections are sequentially connected end to end, the straight sections extend towards the length direction of the first connection section, the bending section at the head end of the second connection section is connected with the first connection section, and the second connection section is elastically arranged so that the probe has an initial state and a test state; the utility model discloses technical scheme has reduced the impedance of probe when the test, has improved the test effect of probe.

Description

Probe and integrated circuit testing equipment

Technical Field

The utility model relates to a test equipment technical field, in particular to probe and integrated circuit test equipment.

Background

Electrical conductors such as test probes or conductive gels are commonly used to test the electrical performance of integrated circuits. Test probes are used in test sockets or test contactors to provide electrical interconnection between a test circuit board and a Device Under Test (DUT), such as an electronic package.

And the probe among the prior art is by syringe needle, needle tubing and spring unit for syringe needle and spring and needle tubing compression contact have certain friction during the compression, make the life-span of probe have certain influence, and the route that the electric current need pass through when leading to the test is longer, and a plurality of parts contact each other switches on the constitution, makes its contact impedance great, influences integrated circuit's actual test effect, thereby unsatisfied current demand.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a probe aims at reducing the impedance of probe when the test, improves the test effect of probe.

In order to achieve the above object, the present invention provides a probe, including:

the two first contact sections are arranged at intervals, the upper ends of the two first contact sections are respectively provided with a contact surface for contacting with a test IC, and the two first contact sections can elastically deform in the horizontal direction;

the first connecting sections are connected to the lower ends of the two first contact sections;

the second connecting section comprises a plurality of straight sections and a plurality of bent sections, the straight sections and the bent sections are sequentially connected end to end, the straight sections extend towards the length direction of the first connecting section, and the bent section at the head end of the second connecting section is connected with the first connecting section; and

a second contact section connected to the straight section at the end of the second connection section for contacting a test PCB;

the second connecting sections are elastically arranged so that the probe has an initial state and a test state, in the initial state, any two adjacent straight sections are arranged at intervals, and in the test state, any two adjacent straight sections are abutted.

Optionally, a reinforcing protrusion is respectively disposed on each of the two first contact sections, and the two reinforcing protrusions are respectively disposed on the sides of the two first contact sections facing each other.

Optionally, the test IC includes a solder ball, and the solder ball presses the two contact surfaces to deform the two first contact sections in the horizontal direction.

Optionally, two of the first contact sections are respectively provided with a positioning element, the contact surface is arranged on the positioning element, and the two positioning elements can be close to and far away from each other to clamp and loosen the solder ball.

Optionally, one side of each of the two contact surfaces facing each other is an arc-shaped arrangement protruding outwards.

Optionally, in the test state, the second contact section abuts against an adjacent straight section.

Optionally, the probe still includes first spacing portion, test IC with respectively be equipped with a backup pad between the test PCB, be equipped with the spacing portion of second in the backup pad, the probe passes through first spacing portion spacing in the spacing portion of second.

Optionally, the first limiting portion is a limiting protrusion, the second limiting portion is a limiting groove, and the limiting protrusion is clamped into the limiting groove.

Optionally, the number of the limiting protrusions and the number of the limiting grooves are two, and the two limiting protrusions are located at two ends of the first connecting section respectively and extend towards a direction close to the contact surface.

The utility model also provides an integrated circuit test equipment, include as above the probe.

The utility model discloses technical scheme is through setting up elastic second linkage segment, through with straight section and the section end to end setting of bending to make the probe when the test condition, the butt between two adjacent straight sections, and then shortened the route that the electric current needs to pass through, and then reduced the impedance of probe in the testing process, and then improved the test effect of probe.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the probe of the present invention;

fig. 2 is a schematic structural view of the probe according to the present invention after assembly;

fig. 3 is a schematic structural diagram of another embodiment of the probe of the present invention;

fig. 4 is a schematic structural diagram of another embodiment of the probe according to the present invention after assembly.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Testing IC	23	Second connecting section
11	Tin ball	231	Straight section
				20	Probe needle	232	Bending section
21	First contact section	24	Second contact section
				211	Locating piece	25	A first limit part
212	Contact surface	30	Testing PCB
				213	Reinforcing protrusion	40	Supporting plate
22	First connecting section

The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, "and/or" in the whole text includes three schemes, taking a and/or B as an example, and includes a technical scheme a, a technical scheme B, and a technical scheme that a and B meet simultaneously; in addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a probe 20, including:

the two first contact sections 21 are arranged at intervals, the upper ends of the two first contact sections 21 are respectively provided with a contact surface 212 used for contacting with the test IC10, and the two first contact sections 21 can elastically deform in the horizontal direction;

a first connecting section 22 connected to lower ends of the two first contact sections 21;

the second connecting section 23 comprises a plurality of straight sections 231 and a plurality of bent sections 232, the plurality of straight sections 231 and the plurality of bent sections 232 are sequentially connected end to end, the plurality of straight sections 231 all extend towards the length direction of the first connecting section 22, and the bent section 232 at the head end of the second connecting section 23 is connected with the first connecting section 22; and

a second contact section 24, the second contact section 24 being connected to the straight section 231 of the end of the second connection section 23 for contacting the test PCB 30;

the second connecting segments 23 are all elastically disposed, so that the probe 20 has an initial state and a test state, in the initial state, any two adjacent straight segments 231 are disposed at an interval, and in the test state, any two adjacent straight segments 231 are abutted.

The utility model discloses technical scheme is through setting up elastic second linkage segment 23, through setting up straight section 231 and the 232 end to end of the section of bending to make probe 20 when the test condition, the butt between two adjacent straight sections 231, and then shortened the route that the electric current needs to pass through, and then reduced the impedance of probe 20 in the test procedure, and then improved probe 20's test effect.

Furthermore, two reinforcing protrusions 213 are respectively disposed on the two first contact sections 21, and the two reinforcing protrusions 213 are respectively disposed on the sides of the two first contact sections 21 facing each other; by providing the reinforcing protrusions 213 so as to enhance the strength of the first contact section 21, the risk of the first contact section 21 breaking due to the pressing of the solder balls 11 is reduced.

The probe 20 is applied to an integrated circuit testing device and is disposed between the testing IC10 and the testing PCB30, in order to further reduce the impedance of the probe 20 and improve the fixing effect between the parts of the probe 20, in this embodiment, the first contact section 21, the first connection section 22, the second connection section 23, and the second contact section 24 are integrally disposed; through the integrated arrangement, compared with other common fixed connection modes, the integrated arrangement has no contact resistance generated by other fixed connection modes, so that the impedance of the probe 20 is reduced, and meanwhile, the cost of the integrated arrangement is tighter and lower compared with other fixed connection modes.

In this embodiment, the test IC10 includes a solder ball 11, and the solder ball 11 presses the two contact surfaces 212 to deform the two contact surfaces 212 in the horizontal direction; in the testing state, the solder ball 11 is squeezed between the two contact surfaces 212, so as to move the two contact surfaces 212 in the horizontal direction away from each other; the contact surface 212 with elasticity is arranged, so that the probe 20 can be used for adapting to the solder balls 11 with different sizes, the practicability of the probe 20 is improved, and meanwhile, compared with the scheme that the contact surface 212 is arranged on two sides of the solder ball 11 in parallel, the arrangement of the contact surface 212 can increase the contact area between the first contact section 21 of the probe 20 and the solder ball 11; further, the contact surface 212 in this embodiment may be arranged in a plane or an arc.

It can be understood that the first contact section 21 is deformed in the horizontal direction, and the second connection section 23 is deformed in the vertical direction, so that the probe 20 is in the pressing state in the testing state, and the connection between the test IC10 and the test PCB30 and the probe 20 is more tight, and meanwhile, the probe 20 can be applied to integrated circuits with different sizes, and the practicability of the probe 20 is improved.

Furthermore, two positioning parts 211 are respectively arranged on the two first contact sections 21, the contact surface 212 is arranged on the positioning parts 211, and the two positioning parts 211 can move close to and away from each other to clamp and release the solder ball 11.

Preferably, the sides of the two contact surfaces 212 facing each other are both in an arc shape protruding outwards; the arc arrangement protruding outwards enhances the structural strength of the two positioning parts 211, increases the toughness of the positioning parts 211, and increases the contact area between the cross section and the solder ball 11, thereby improving the test effect of the integrated circuit test equipment.

In this embodiment, the second contact section 24 is convex and extends along the second connection section 23 away from the first contact section 21; because second contact segment 24 locates the end of second linkage segment 23, second linkage segment 23 can produce certain ascending deformation in vertical direction when the test state, and second linkage segment 23 is the setting of S type, consequently, locate second contact segment 24 on the central line of the 23 vertical direction of second linkage segment, thereby make second contact segment 24 when compressed and test PCB30 between the distance, it is closer to compare in the distance between second linkage segment 23 and the test PCB30, prevent that second linkage segment 23 directly contacts with test PCB30, and second contact segment 24 is unsettled.

Further, in order to reduce the rocking of probe 20 in test and extrusion process production, consequently, probe 20 still includes first spacing portion 25, test IC10 with be equipped with backup pad 40 between the test PCB30, be equipped with the spacing portion of second on the backup pad 40, probe 20 passes through first spacing portion 25 is spacing in the spacing portion of second, when being in the test condition, probe 20 is through the cooperation of the spacing portion of first spacing portion 25 and second, firmly is fixed in between test IC10 and the test PCB30 to reduce rocking of probe 20, increased probe 20's fixed effect, improved probe 20's efficiency of software testing and accuracy.

Specifically, the first limiting part 25 is a limiting protrusion, the second limiting part is a limiting groove, and the limiting protrusion is clamped into the limiting groove; the size of the limiting protrusion is consistent with that of the limiting groove, so that when the probe 20 is in a test state, the limiting protrusion of the probe 20 is just limited in the limiting groove, the shaking of the probe 20 is reduced, and the limiting protrusion and the limiting groove are simple in structure and convenient to manufacture; of course, in other embodiments, the first position-limiting portion 25 and the second position-limiting portion may be provided as a snap-fit structure for snap-fit connection.

Further, in order to further increase the limiting effect of the probe 20, in this embodiment, two limiting protrusions and two limiting grooves are provided, and the two limiting protrusions are respectively located at two ends of the first connecting section 22 and extend toward the direction close to the contact surface 212.

The utility model discloses still provide an integrated circuit test equipment, integrated circuit test equipment includes the above probe 20. The specific structure of the probe 20 refers to the above embodiments, and since the integrated circuit test equipment adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and details are not repeated here.

The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A probe, comprising:

2. The probe of claim 1, wherein each of the two first contact sections has a reinforcing protrusion, and the two reinforcing protrusions are respectively disposed on sides of the two first contact sections facing each other.

3. The probe of claim 1, wherein said test IC includes a solder ball, said solder ball pressing both of said contact surfaces to deform both of said first contact sections in a horizontal direction.

4. The probe as claimed in claim 3, wherein each of the two first contact sections has a positioning member, the contact surface is disposed on the positioning members, and the two positioning members can move toward and away from each other to clamp and release the solder ball.

5. A probe according to claim 4, wherein the sides of the contact surfaces facing each other are each provided in an outwardly convex arc.

6. The probe of claim 1, wherein in the test state, the second contact segment abuts an adjacent straight segment.

7. The probe of claim 1, further comprising a first position-limiting portion, wherein a supporting plate is disposed between the test IC and the test PCB, a second position-limiting portion is disposed on the supporting plate, and the probe is positioned at the second position-limiting portion by the first position-limiting portion.

8. The probe of claim 7, wherein the first retention portion is a retention projection and the second retention portion is a retention groove, the retention projection snapping into the retention groove.

9. The probe according to claim 8, wherein there are two limiting protrusions and two limiting grooves, and the two limiting protrusions are respectively located at two ends of the first connecting section and extend in a direction close to the contact surface.

10. An integrated circuit test apparatus, characterized in that it comprises a probe according to any one of claims 1 to 9.