CN215641664U

CN215641664U - Chip test structure

Info

Publication number: CN215641664U
Application number: CN202121812511.5U
Authority: CN
Inventors: 宁丽娟
Original assignee: Shenzhen Furuida Electronics Co ltd
Current assignee: Shenzhen Furuida Electronics Co ltd
Priority date: 2021-08-04
Filing date: 2021-08-04
Publication date: 2022-01-25
Anticipated expiration: 2031-08-04

Abstract

The utility model relates to a chip testing structure which comprises a testing seat main body and a plurality of groups of testing piece assemblies, wherein each group of testing piece assemblies at least comprises a first testing piece and a second testing piece, the first testing piece and the second testing piece are arranged on the testing seat main body, the first testing piece and the second testing piece respectively comprise a testing piece main body, a first contact end and a second contact end, the testing piece main body is arranged on the testing seat main body, the first contact end and the second contact end are respectively arranged at two ends of the testing piece main body, the first contact end of the first testing piece and the first contact end of the second testing piece are arranged at intervals, and the first contact end arranged close to the bottom of the testing seat main body is arranged at one side close to the middle part of the testing seat main body. This structure makes the structure of test seat simple more, compact, in addition, can also prevent that first test piece and second test piece from contacting each other in the course of the work.

Description

Chip test structure

Technical Field

The utility model relates to an electronic chip tests technical field, in particular to chip test structure.

Background

Along with the rapid development of modern electronic products, an electronic chip is taken as an important composition core, quality detection control becomes stricter in the production and processing processes, in the actual detection process, the electronic chip is placed in a limiting frame by a test fixture through an automatic production line and is pressed by applying force, and the electronic chip is communicated with a detection circuit through a test elastic sheet, so that the performance detection of the electronic chip is realized.

At present, most of detection devices for electronic chips adopt the kelvin test method to perform chip performance test, which is also called as four-terminal detection (4T detection), four-wire detection or 4-point probe method, and is an electrical impedance measurement technology, and a single pair of current-carrying and voltage-carrying detection electrodes are used, so that more accurate measurement can be performed compared with the traditional two-terminal (2T) sensing, and the kelvin four-wire detection is used for some ohm meters and impedance analyzers, and can also be used for measuring the resistance of thin layers of films or chips in the wiring configuration of a precision strain gauge and a resistance thermometer.

In the prior art, a metal sheet is often used to connect an electronic chip and a detection circuit, so as to realize kelvin testing for the electronic chip. Because one pin of the chip needs to contact two metal sheets for contact so as to realize multi-contact testing, but the existing metal sheets adopt the design of spacing on the axis in the same vertical direction, when the pin of the chip is pressed and contacted with the two metal sheets at the same time, because the gap between the two metal sheets is very small and the pin of the chip does not necessarily completely act on the whole contact surfaces of the two metal sheets, and because the contact surfaces of the two metal sheets are on the same plane, the contact area of the lower metal sheet and the pin is longer than the contact area of the upper metal sheet and the pin, the two metal sheets may not completely move in the vertical direction when pressed and moved by force, but may incline, so that the two metal sheets may incline towards opposite directions when pressed and finally contact together, causing the test to fail.

Therefore, how to design a chip testing structure in which two metal sheets do not contact during testing becomes a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned drawbacks of the prior art, the present invention provides a chip testing structure to solve the above-mentioned problems in the background art.

The technical scheme adopted by the utility model for solving the problems in the prior art is as follows: a chip testing structure comprises a testing seat main body and a plurality of groups of testing sheet assemblies which are uniformly arranged in parallel along the X-axis direction on the testing seat main body, wherein each group of testing sheet assemblies at least comprises a first testing sheet and a second testing sheet, the first testing sheet and the second testing sheet are respectively arranged on the testing seat main body at intervals along the Z-axis direction, the first testing sheet and the second testing sheet are respectively arranged on the testing seat main body at intervals, the first testing sheet and the second testing sheet respectively comprise a testing sheet main body, a first contact end used for being in contact with a chip and a second contact end used for being in contact with a PCB (printed circuit board), the testing sheet main body is arranged on the testing seat main body, the first contact end and the second contact end are respectively arranged at two ends of the testing sheet main body, the first contact end of the first testing sheet and the first contact end of the second testing sheet are arranged at intervals along the X-axis horizontal direction, and the first contact end of the first testing sheet or the second contact end of the first testing sheet arranged close to the bottom of the testing seat main body is close to the first contact end of the testing seat main body One side of the middle part of the test seat main body is provided.

In a preferred embodiment of the present invention, the second contact ends of the first test strip and the second test strip are arranged along the Y-axis direction in a staggered manner.

As a preferable aspect of the present invention, the first contact end is provided with a first bump facilitating contact with the chip at an end surface contacting with the chip.

As a preferred embodiment of the present invention, the first contact end has an inclined surface on an end surface contacting with the chip, and the inclined surface reduces the number of contact points between the first contact end and the chip, thereby facilitating better contact between the first contact end and the chip.

As a preferable scheme of the present invention, the test strip body further extends with a connecting portion near the first contact end, the connecting portion is inclined toward the middle of the test seat body, and the first contact end is disposed on the connecting portion.

As a preferable aspect of the present invention, the second contact end includes a bent portion and a contact portion, which are integrally formed, the contact portion is used for contacting with a PCB, and an end surface of the contact portion is disposed along a horizontal direction.

As a preferable aspect of the present invention, the test socket main body includes a first housing, a second housing, and a third housing, which are sequentially stacked together, and the second housing and the third housing are respectively provided with an accommodating groove for accommodating the test strip main body along a Y-axis direction.

As a preferable scheme of the utility model, the manufacturing material of the test strip assembly is a copper sheet, an iron sheet or an alloy sheet.

Compared with the prior art, the utility model has the following technical effects:

the chip testing structure of the application is convenient for the first testing piece and the second testing piece to be arranged on the testing seat main body along the Z-axis horizontal direction at intervals, so that the structure of the testing seat is simpler and more compact, the first testing piece and the second testing piece are more convenient to be arranged and replaced, in addition, the first contact end of the first test strip or the second test strip arranged near the bottom of the test seat main body is arranged near one side of the middle part of the test seat main body, this is because the first contact end of the test strip located near the bottom of the test socket body moves with a greater stroke after being stressed than the first contact end of the test strip located far from the bottom of the test socket body, this configuration allows a gap to be maintained between the first contact ends of the first and second test strips.

Drawings

FIG. 1 is a block diagram of a chip test structure according to the present invention;

FIG. 2 is a block diagram of a test chip assembly in a chip test configuration according to the present invention;

fig. 3 is an exploded view of a chip test structure according to the present invention.

Reference numbers in the figures:

10. a test socket body; 11. a first housing; 12. a second housing; 13. a third housing; 14. a containing groove;

20. a test piece assembly; 21. a first test piece; 22. a second test piece; 211. a test strip body; 212. a first contact end; 213. a second contact end; 214. a connecting portion; 215. bolt holes.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The chip testing structure provided by the application can be used for testing a chip, and it should be noted that the chip testing structure can be used for testing an electronic connector or other electronic components besides the chip, and the types of the electronic components are not limited herein.

As shown in figures 1 and 2: a chip testing structure comprises a testing seat main body 10 and a plurality of groups of testing sheet assemblies 20 uniformly arranged on the testing seat main body 10, wherein the number of the testing sheet assemblies 20 can be determined according to the number of pins of a chip to be tested, each group of testing sheet assemblies 20 at least comprises a first testing sheet 21 and a second testing sheet 22, and the first testing sheet 21 and the second testing sheet 22 are arranged on the testing seat main body 10 at intervals along the Z-axis direction, so that the structure of the testing seat main body 10 is simpler and more compact, and meanwhile, the first testing sheet 21 and the second testing sheet 22 are more convenient to install and replace.

In the present embodiment, the first test strip 21 and the second test strip 22 are used to test two contacts of one pin of the chip. In other embodiments, the test strip assembly 20 may further include a plurality of test strips, such as a first test strip 21, a second test strip 22, and a third test strip, according to actual test requirements, and the specific number of the test strips is not limited herein.

Further, referring to fig. 2, each of the first test strip 21 and the second test strip 22 includes a test strip main body 211, a first contact end 212 for contacting a chip, and a second contact end 213 for contacting a PCB, the test strip main body 211 is disposed on the test socket main body 10, the first contact end 212 and the second contact end 213 are respectively disposed at two ends of the test strip main body, wherein the first contact ends 212 of the first test strip 21 and the second contact end 213 of the second test strip 22 are disposed at intervals along the X-axis horizontal direction, and the second contact ends 213 of the first test strip 21 and the second test strip 22 are disposed at intervals along the Y-axis horizontal direction.

The first contact end 212 of the first test strip 21 or the second test strip 22 disposed near the bottom of the test socket body 10 is disposed near one side of the middle of the test socket body 10 (for example, referring to the first test strip 21 in fig. 1 and fig. 2), because the first contact end 212 of the first test strip 21 disposed near the bottom 10 of the test socket body moves with a stroke larger than that of the first contact end 212 of the second test strip 22 after being stressed, the structure can keep a gap between the first contact ends 212 of the first test strip 21 and the second test strip 22, and prevent contact caused by inconsistent movement strokes of the first contact ends 212 of the first test strip 21 and the second test strip 22 during testing.

Furthermore, the test strip body is further provided with a connecting portion 214 near the first contact end, the connecting portion 214 is inclined towards the middle of the test socket body 211, and the first contact end 212 is disposed on the connecting portion 214. This configuration enables the first contact terminals 212 between each set of test pad assemblies to be more compact and to test chips with smaller pin clearance, while the configuration enables the clearance of the second contact terminals 213 between each set of test pad assemblies to be unaffected by the smaller clearance between the chip pins, and enables the clearance of the second contact terminals 213 between each set of test pad assemblies to be set larger for contact with a PCB board.

In addition, the structure is easy to cause the movement direction of the first contact end 212 of the first test strip 21 to incline after contacting the chip pins, because the width area of the first contact end 212 is smaller than the width area of the connecting portion 214, so the first contact end 212 is only arranged at the side edge of the connecting portion 214, and the movement direction of the first contact end 212 inclines after being stressed, and the arrangement of the first contact end 212 of the first test strip 21 or the second test strip 22 close to the bottom of the test socket main body 10 in the application can also well solve the problem.

In this embodiment, the test strip body 211, the connecting portion 214, and the second contact end 213 can be integrally formed to reduce the manufacturing cost.

Further, the first contact end 212 is provided with a first bump at the end surface contacting with the chip for better contact with the chip.

Further, the first contact end 212 is provided with an inclined surface at the end surface contacting with the chip, and the inclined surface reduces the number of contact points between the first contact end 212 and the chip, so as to facilitate better contact between the first contact end 212 and the chip.

In a preferred embodiment of the present invention, the second contact end 213 includes an integrally formed bent portion and a contact portion, and the contact portion is used for contacting with a PCB.

Furthermore, the end face of the contact part is arranged along the horizontal direction, so that the contact part is better contacted with the PCB.

Referring to fig. 3, the test socket main body 10 includes a first housing 11, a second housing 12, and a third housing 13 stacked in sequence, and the second housing 12 and the third housing 13 are respectively provided with an accommodating groove 14 for accommodating the test strip main body along the Y-axis direction.

The first casing 11, the second casing 12 and the third casing 13 can be detachably connected by bolts, the accommodating groove 14 on the second casing 12 can be used for accommodating one test strip main body 21 of the first test strip 21 or the second test strip 22, and the accommodating groove 14 on the third casing 13 can be used for accommodating the other test strip main body 21.

Further, a bolt hole 215 may be further provided in the test strip body 21, and the bolt hole 215 facilitates positioning of the mounting position of the test strip body 21 on the one hand and connection between the first casing 11, the second casing 12, and the third casing 13 on the other hand.

As a preferred embodiment of the present invention, the material for manufacturing the test strip assembly 20 is a copper sheet, an iron sheet, or an alloy sheet.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip testing structure is characterized by comprising a testing seat main body and a plurality of groups of testing sheet assemblies which are uniformly arranged in parallel in the X-axis direction on the testing seat main body, wherein each group of testing sheet assemblies at least comprises a first testing sheet and a second testing sheet, the first testing sheet and the second testing sheet are respectively arranged on the testing seat main body at intervals in the Z-axis direction, the first testing sheet and the second testing sheet respectively comprise a testing sheet main body, a first contact end used for being in contact with a chip and a second contact end used for being in contact with a PCB, the testing sheet main body is arranged on the testing seat main body, the first contact end and the second contact end are respectively arranged at two ends of the testing sheet main body, the first contact end of the first testing sheet and the first contact end of the second testing sheet are arranged at intervals in the X-axis horizontal direction, and the first contact end of the first test piece or the second test piece arranged close to the bottom of the test seat main body is arranged close to one side of the middle part of the test seat main body.

2. The chip test structure according to claim 1, wherein: and the second contact ends of the first test piece and the second test piece are arranged along the Y-axis direction in a staggered manner.

3. The chip test structure according to claim 1, wherein: the first contact end is provided with a first bump convenient for contacting the chip on the end surface contacting the chip.

4. The chip test structure according to claim 3, wherein: the first contact end is provided with an inclined surface on the end surface contacted with the chip, and the inclined surface reduces the contact points of the first contact end and the chip, so that the first contact end is better contacted with the chip.

5. The chip test structure according to claim 1, wherein: the test strip main part is close to first contact jaw and still extends there is connecting portion, and connecting portion slope setting towards the middle part direction of test seat main part, first contact jaw sets up in on the connecting portion.

6. The chip test structure according to claim 1, wherein: the second contact end comprises a bending part and a contact part which are integrally formed, the contact part is used for being in contact with the PCB, and the end face of the contact part is arranged along the horizontal direction.

7. The chip test structure according to claim 1, wherein: the test seat main body comprises a first shell, a second shell and a third shell which are sequentially laminated together, and accommodating grooves for accommodating the test piece main body are formed in the second shell and the third shell respectively along the Y-axis direction.

8. The chip testing structure according to any one of claims 1 to 7, wherein: the test piece assembly is made of copper sheets, iron sheets or alloy sheets.