JPH04206752A - Inspecting device for surface-mounting type ic - Google Patents

Abstract

PURPOSE:To prevent deformation of an external lead of a surface-mounting type IC, enable a positive electrical contact to be maintained for a long time, and further eliminate the need for purchasing or replacing an IC socket which is a conductive member by adopting a connector consisting of an anisotropic conductive rubber plate where a number of metal fine wires are buried, etc. CONSTITUTION:A positioning tool 5 for guiding an above IC1, a circuit substrate 9 with a pattern 10 corresponding to a placement of an external lead 2 of the IC1, and a connector which is included between the above positioning tool 5 and the circuit substrate 9 and consists of an anisotropic conductive rubber plate 3 where a number of metal thin wires 4 are buried are provided at a conductive part of an electrical characteristic measuring part of an inspection device of the surface-mounting type IC1. For example, the IC1 which is guided by the positioning tool 5 is supplied and mounted to a conductive part which is installed while the anisotropic conductive rubber plate 3 is sandwiched between the printed-circuit board 9 and the positioning tool 5. Then, when a lead press tool 7 is lowered and then the external lead 2 of the IC1 is pressed by an insulation press chip 8, the external lead 2 and the print pattern 10 are allowed to conduct according to the metal thin wire 4 of the anisotropic conductive rubber plate 3.

Description

[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to the measurement section of an inspection device that measures the electrical characteristics of surface-mounted ICs (hereinafter referred to as SMD) and classifies them based on the measurement results, particularly the conductive section. It is related to the configuration of.

[Conventional technology]

FIG. 2 is a perspective view showing the conventional configuration of a measuring section for measuring the electrical characteristics of an SMD, especially a conductive section, in which 1 is the SMD, 2 is its external lead, 12 is an IC socket, and 13 is this IC.
A contact 14 of the socket 12 is an IC guide. 7 connects the external lead of the SMD to the contact 1 of the IC socket.
A lead pressing tool 2 presses the lead pressing tool 7, and 8 is an insulating pressing tip attached to the lead pressing tool 7.

Next, a description will be given of the measurement section of the inspection device that automatically measures the electrical characteristics of SMDs, particularly the conduction method.

The SMD 1 is supplied and placed on the IC socket 12 having the contacts 13 arranged in accordance with the planar arrangement of the external leads 2 of the SMD 1 to be measured.
In order to ensure contact between the external leads 2 of the MDI and the contacts 13, by lowering the lead pressing tool 7, the external leads 2 of the SMD 1 are pressed against the lower surface of the insulating pressing chip 8 to the IC socket 12. Press the contact 13 of.

In this state, an IC tester connected to the IC socket 12 measures the electrical characteristics of the SMD.

[Problem to be solved by the invention]

The measuring section, particularly the conduction section, of a conventional SMD inspection device is configured to press the external lead of the SMD against the metal contact of the IC socket as described above. Therefore, problems such as breakage due to the mechanical life of the contact, poor electrical characteristics due to adhesion of surface solder, etc. of the SMD external lead to the contact, and deformation of the external lead frequently occur. For this reason,
IC sockets need to be replaced and cleaned frequently,
There were productivity and cost issues.

This invention was made to solve the above-mentioned problems, and it is possible to prevent deformation of the SMD external lead, maintain reliable electrical contact (continuity) for a long time, and further improve the IC socket, which is a conductive member. The purpose is to eliminate the need to purchase or exchange.

[Means to solve the problem]

The measuring section of the SMD inspection device according to the present invention employs a connector made of an anisotropically conductive rubber plate embedded with a large number of fine metal wires, and also connects this to an SMD positioning jig.
It is sandwiched between a printed circuit board that matches the external lead arrangement of the SMD, and these parts are combined and installed in an SMD inspection device.

[Effect]

The anisotropically conductive rubber plate connector of this invention has the same conductive function as the metal contacts in conventional IC sockets, and also has elasticity, which is a characteristic of rubber, and uses materials such as silicone rubber. As a result, it has excellent heat and cold resistance, and can be used in high and low temperature environments without any problems.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In Figure 1, l is the SMD, 2 is its external lead, and 3
is a connector made of an anisotropically conductive rubber plate made of silicone rubber, in which a large number of fine metal wires 4 are embedded in the thickness direction. 5 is a positioning jig for fitting and positioning the SMD, and 6 is a mounting hole thereof. 9 is the above S
A printed circuit board is provided with a printed pattern 1O that matches the arrangement of the external leads 2 of the MDI, and 1] is a mounting hole corresponding to the mounting hole 6 described above. Reference numeral 7 denotes a lead pressing tool for pressing the external lead 2 of the SMD against the anisotropically conductive rubber plate 3, and an insulating pressing tip 8 is attached thereto.

Next, the measurement method will be explained.

The zero-order where the SMDI guided by the positioning jig 5 is supplied and placed on the conductive part installed with the anisotropically conductive rubber plate 3 sandwiched between the printed circuit board 9 and the positioning jig 5. Then, the lead pressing tool descends and presses the external lead 2 of the SMDI appropriately with the insulating pressing tip 8. As a result, the external lead 2 and the printed pattern 1 on the printed circuit board surface are connected to each other.
The metal part between o is the anisotropically conductive rubber plate 3! 4 conducts.

In the above state, the mounting hole 6 of the positioning jig 5 and the mounting hole 11 of the printed circuit board 9 are located at such a position that the arrangement of the external lead 2 of the SMDl and the printed pattern 10 of the printed circuit board 9 match each other. Furthermore, since the metal fine wires 4 of the anisotropically conductive rubber plate 3 are completely insulated from adjacent fine wires by rubber, there is no short circuit between the external leads of the SMD.

In the above embodiment, a QFP type IC among SMDs was explained as an example, but similar effects can be expected for ICs having various shapes other than SMDs by implementing the test in the respective inspection apparatuses.

〔Effect of the invention〕

As described above, according to the present invention, a flat rubber connector is used instead of an IC socket having uneven contacts, which has a long mechanical life.
This has the effect of preventing deformation of the SMD external leads and occurrence of defective electrical characteristics. In addition, it is possible to eliminate the need to purchase spare parts for IC sockets, replace them, and clean them, thereby reducing costs and improving productivity.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an SMD inspection device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional device of this type. In the figure, 1 is an SMD, 2 is its external lead, 3 is an anisotropic conductive rubber plate, 4 is a fine metal wire, 5 is a positioning jig, 6.1
1 is a mounting hole, 9 is a printed circuit board, and IO is a printed pattern. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A positioning tool for guiding the IC, a circuit board having a pattern corresponding to the arrangement of external leads of the IC, and a positioning tool for guiding the IC, a circuit board having a pattern corresponding to the arrangement of the external leads of the IC, and a positioning tool for guiding the IC, and a circuit board for connecting the positioning tool and the circuit board to a conductive part of an electrical characteristic measuring section of a surface mount IC inspection device. 1. An inspection device for a surface-mounted IC, comprising: a connector made of an anisotropically conductive rubber plate in which a large number of fine metal wires are embedded;