CN211505623U - Test socket for electronic chip and electronic connector - Google Patents
Test socket for electronic chip and electronic connector Download PDFInfo
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- CN211505623U CN211505623U CN201922065864.2U CN201922065864U CN211505623U CN 211505623 U CN211505623 U CN 211505623U CN 201922065864 U CN201922065864 U CN 201922065864U CN 211505623 U CN211505623 U CN 211505623U
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Abstract
The utility model belongs to the technical field of electronic chip and electronic connector test, a test seat for electronic chip and electronic connector is disclosed, including insulating barrier, shell fragment subassembly and insulating rod, insulating barrier and shell fragment subassembly's quantity is a plurality of and staggered arrangement each other, insulating rod wears to locate insulating barrier and shell fragment subassembly and is used for fixed insulating barrier and direction and fixed shell fragment subassembly, shell fragment subassembly comprises the metal shrapnel of two structural symmetries, two metal shrapnel lists in one side and the symmetry of position of insulating barrier separately, the metal shrapnel includes test portion, elasticity portion and fixed part, elasticity portion be horizontal U-shaped structure and respectively with test portion and fixed part body coupling, the one end of test portion and electronic chip's pin or electronic connector's contact butt, the one end extension of fixed part has the connection pin, a test panel is surveyed to external PCB. The utility model relates to a simply, rational in infrastructure has improved the life of test seat, the sexual valence relative altitude.
Description
Technical Field
The utility model belongs to the technical field of electronic chip and electronic connector test, especially, relate to a test seat for electronic chip and electronic connector.
Background
With the rapid development of modern electronic products, electronic chips or electronic connectors are used as the important core components, quality detection and control are increasingly strict in the production and processing processes, in the actual detection process, the electronic chips or electronic connectors are placed on a test seat by a test fixture through an automatic production line, force is applied to press the electronic chips or electronic connectors, and the electronic chips or electronic connectors are communicated with a detection circuit through a test elastic sheet, so that the performance detection of the electronic chips or electronic connectors is realized.
At present, the performance test of the detection device of the electronic chip or the electronic connector is mostly performed by using a kelvin test method, which is also called as a four-terminal detection (4T detection, 4T sensing), a four-wire detection or a 4-point probe method, and is an electrical impedance measurement technology, a single pair of current-carrying and voltage-carrying detection electrodes are used, and compared with the traditional two-terminal (2T) sensing, the kelvin four-wire detection is used for some ohm meters and impedance analyzers, and in the wiring configuration of a precision strain gauge and a resistance thermometer, the kelvin four-wire detection can also be used for measuring the resistance of a thin layer of a thin film or a chip.
In the prior art, the test socket with a built-in metal elastic sheet is mostly adopted to connect the electronic chip or the electronic connector and the detection circuit, so as to realize the kelvin test for the electronic chip or the electronic connector, but the test socket in the prior art is limited by the material or the structure of the built-in metal elastic sheet, so that defects exist in the service life, the long-term effective running of the test cannot be ensured, the problem of waist fracture of the metal elastic sheet often occurs, and the test socket in the prior art is rigid in multiple formats and poor in adaptability, different test sockets need to be adapted to different test sockets for testing different electronic chips or electronic connectors, the production efficiency is affected, the flexibility is high, the cost is high, and therefore, how to design the test socket with a long service life and high cost performance is a technical problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a test seat for electronic chip and electronic connector to solve the problem mentioned in the above-mentioned background art.
For realizing the purpose of the above utility model, the technical scheme adopted is as follows:
a test seat for electronic chip and electronic connector, including insulating barrier, shell fragment subassembly and insulating rod, its characterized in that: the number of the insulating partition plates and the number of the elastic sheet assemblies are multiple and are staggered with each other, the number of the insulating partition plates corresponds to the number of pins of an electronic chip or contacts of an electronic connector, the thickness of the insulating partition plates is the same as the distance between the pins of the electronic chip or the distance between the contacts of the electronic connector, the insulating rod penetrates through the insulating partition plates and the elastic sheet assemblies and is used for fixing the insulating partition plates and guiding and fixing the elastic sheet assemblies, each elastic sheet assembly consists of two metal elastic sheets with symmetrical structures, the two metal elastic sheets are respectively arranged on one side of the insulating partition plates and are symmetrical in position, each metal elastic sheet comprises a testing part, an elastic part and a fixing part, each elastic part is of a horizontal U-shaped structure and is respectively and integrally connected with the testing part and the fixing part, one end of the testing part is abutted against the pins of the electronic chip or the contacts of the electronic connector, one end of the fixing part extends to form a connecting pin for externally connecting a PCB test board.
The utility model discloses further set up to: the bottom end of one side of insulating barrier is equipped with the fixed block symmetrically, the fixed part is located the fixed slot has been seted up to the one end of connecting the pin, the fixed block with the fixed slot phase-match.
The utility model discloses further set up to: and a limiting guide groove is formed in one side of the insulating partition plate and positioned at the two testing parts, and is used for preventing the two metal elastic sheets from contacting with each other and guiding the metal elastic sheets to move.
The utility model discloses further set up to: the testing part is provided with a strip-shaped hole, the strip-shaped hole is sleeved on the insulating rod, one end of the strip-shaped hole is abutted to the insulating rod, and the other end of the strip-shaped hole is kept at a distance from the insulating rod.
The utility model discloses further set up to: rectangular windows are symmetrically arranged on two sides of the insulating partition plate and used for observing the elastic parts.
The utility model discloses further set up to: one end of the testing part protrudes out of the insulating partition plate, and the connecting pins protrude out of the insulating partition plate.
In summary, compared with the prior art, the utility model discloses a test socket for electronic chips and electronic connectors, which comprises an insulating partition plate, a spring plate component and an insulating rod, wherein a plurality of insulating partition plates and a plurality of spring plate components are arranged in a staggered way and are fixed by the insulating rod in a penetrating way, the spring plate component consists of two metal spring plates with symmetrical structures, the two metal spring plates are respectively arranged at one side of the insulating partition plate and are symmetrical in position, the metal spring plate consisting of a test part, an elastic part and a fixed part is abutted against pins of the electronic chips through the test part and is externally connected with a PCB test board through connecting pins, thereby achieving the Kelvin test aim of the electronic chips, and when the electronic chips are shared and tested through a transverse U-shaped structure of the elastic part, the pressing moment of the pins of the chip on the metal spring plates is relieved, the micro deformation generated when the metal spring plates are pressed is relieved, and the service life of the, the service life of the test socket is prolonged, the number of the insulating partition plates corresponds to the number of pins of the electronic chip or contacts of the electronic connector, and the thickness of the insulating partition plates is equal to the distance between the pins of the electronic chip or the distance between the contacts of the electronic connector, so that the test socket can be adapted to the electronic chips with different pin numbers or the electronic connectors with different contact numbers, the flexibility of the test socket is improved, unnecessary equipment die sinking is avoided, the production cost is reduced, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a block diagram of a test socket for an electronic chip and an electronic connector according to the present embodiment;
FIG. 2 is a schematic diagram of an internal structure of a test socket for an electronic chip and an electronic connector according to the present embodiment;
fig. 3 is a schematic view of the overall structure of the insulating spacer provided in the present embodiment;
fig. 4 is a schematic view of the overall structure of the spring assembly provided in this embodiment.
Reference numerals: 1. an insulating spacer; 11. a fixed block; 12. a limiting guide groove; 13. a rectangular window; 2. a spring plate assembly; 21. a metal spring sheet; 211. a test section; 212. an elastic portion; 213. a fixed part; 214. connecting pins; 215. fixing grooves; 216. a strip-shaped hole; 3. an insulating rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
A test seat for an electronic chip and an electronic connector is shown in figures 1-4 and comprises an insulating partition plate 1, a spring plate assembly 2 and an insulating rod 3, wherein the insulating partition plate 1 and the spring plate assembly 2 are arranged in a plurality of staggered mode, the number of the insulating partition plate 1 is equal to that of the spring plate assembly 2, the insulating rod 3 penetrates through the insulating partition plate 1 and the spring plate assembly 2, the insulating rod 3 is used for fixing the insulating partition plate 1 and the spring plate assembly 2 and guiding the spring plate assembly 2, the spring plate assembly 2 consists of two metal spring plates 21 with symmetrical structures, the two metal spring plates 21 are respectively arranged on one side of the insulating partition plate 1 and are symmetrical in position, each metal spring plate 21 comprises a test part 211, an elastic part 212 and a fixed part 213, the elastic part 212 is in a transverse U-shaped structure and is respectively and integrally connected with the test part 211 and the fixed part 213, one end of the test part 211 is abutted to a pin of the electronic chip or, one end of the fixing portion 213 extends with a connection pin 214 for externally connecting to a PCB test board.
In the specific implementation process, the number of the insulating partition plates 1 corresponds to the number of pins of an electronic chip or contacts of an electronic connector, and the thickness of the insulating partition plates 1 is the same as the distance between the pins of the electronic chip or the distance between the contacts of the electronic connector, so that the test socket is adaptive to the electronic chips with different pin numbers or the electronic connectors with different contact numbers, the flexibility of the test socket is improved, unnecessary equipment die sinking is avoided, the production cost is reduced, and the production efficiency is improved.
In the specific implementation process, the spring assembly 2 composed of the metal springs 21 arranged symmetrically with each other is connected to the pins of the electronic chip or the contacts of the electronic connector through the testing part 211, connected to the PCB testing board through the connecting pins 214 of the fixing part 213, in the automatic test process of the test socket, the electronic chip or the electronic connector is moved to the test socket from the previous station and is pressed down, so that the pins of the electronic chip or the contact pins of the electronic connector abut against one end of the test section 211, under the premise that the connecting pins 214 are externally connected with the PCB test board, the PCB test board is conducted and starts to work, a plurality of elastic sheet assemblies 2 are matched with a multi-pin electronic chip or a multi-contact electronic connector, a plurality of insulating partition plates 1 are used for sequentially separating the plurality of elastic sheet assemblies 2 to avoid short circuit caused by error contact among the elastic sheet assemblies 2, and the insulating rod 3 which is arranged on the insulating partition board 1 in a penetrating way is used for preventing the insulating partition board 1 from moving around.
Furthermore, the elastic part 212 is a horizontal U-shaped structure, and when the elastic part shares the function of testing an electronic chip or an electronic connector, the pin or the contact pin presses the metal elastic sheet 21 to relieve the micro-deformation of the metal elastic sheet 21 caused by compression, so that the service life of the metal elastic sheet 21 is prolonged to the maximum, and the service life of the test socket is prolonged.
It should be noted that the fixing blocks 11 are symmetrically disposed at the bottom end of one side of the insulating partition board 1, the fixing grooves 215 are disposed at one ends of the fixing portions 213, which are located at the connecting pins 214, and the fixing blocks 11 are matched with the fixing grooves 215, that is, by this arrangement, the fixing portions 213 and the insulating partition board 1 are relatively fixed, so as to prevent the metal elastic sheet 21 from moving relative to the metal elastic sheet 21.
The spacing guide grooves 12 are formed in one side of the insulating partition board 1 and located at the two testing parts 211, and are used for preventing the two metal elastic sheets 21 from contacting with each other and guiding the metal elastic sheets 21 to move, so that short-circuit accidents are prevented from occurring during Kelvin testing of electronic chips or electronic connectors.
It is understood that the specific principle and function of the kelvin test method can be obtained by those skilled in the art according to the prior art, and the detailed description of the circuit arrangement and the operation principle of the kelvin test method is omitted here.
In the specific implementation process, strip hole 216 has been seted up on test portion 211, and bar hole 216 cover is located insulating rod 3, the one end and the 3 butts of insulating rod of strip hole 216, and the other end and the insulating rod 3 of strip hole 216 keep having the distance, and the deformation orbit of metal shrapnel 21 when receiving the pin oppression of electronic chip is kept metal shrapnel 21 through strip hole 216 guide promptly.
It should be noted that one end of the testing portion 211 protrudes out of the insulating spacer 1, and the connecting pin 214 protrudes out of the insulating spacer 1, so that the metal elastic sheet 21 is connected to the outside.
To sum up, the utility model discloses following beneficial effect has: the utility model discloses a test seat for electronic chips and electronic connectors, which comprises an insulating partition board 1, elastic sheet components 2 and an insulating rod 3, wherein the insulating partition boards 1 and the elastic sheet components 2 are arranged in a staggered way and are fixed by the insulating rod 3 in a penetrating way, the elastic sheet components 2 consist of two metal elastic sheets 21 with symmetrical structures, the two metal elastic sheets 21 are respectively arranged at one side of the insulating partition board 1 and are symmetrical in position, the metal elastic sheet 21 consisting of a test part 211, an elastic part 212 and a fixed part 213 is abutted against the pins of the electronic chips through the test part 211 and is externally connected with a PCB test board through a connecting pin 214, thereby achieving the Kelvin test purpose of the electronic chips, and when the electronic chips are shared and tested through a transverse U-shaped structure of the elastic part 212, the pressing moment of the chip pins against the metal elastic sheets 21 is relieved, the micro-deformation generated when the metal elastic sheets 21 are pressed is relieved, the service life of the metal elastic sheets 21 is prolonged to, the service life of the test seat is prolonged, the flexibility of the test seat is improved through the flexible arrangement of the insulation partition plate 1, unnecessary equipment die sinking is avoided, the production cost is reduced, and the production efficiency is improved.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (6)
1. A test seat for electronic chip and electronic connector, including insulating barrier, shell fragment subassembly and insulating rod, its characterized in that: the number of the insulating partition plates and the number of the elastic sheet assemblies are multiple and are staggered with each other, the number of the insulating partition plates corresponds to the number of pins of an electronic chip or contacts of an electronic connector, the thickness of the insulating partition plates is the same as the distance between the pins of the electronic chip or the distance between the contacts of the electronic connector, the insulating rod penetrates through the insulating partition plates and the elastic sheet assemblies and is used for fixing the insulating partition plates and guiding and fixing the elastic sheet assemblies, each elastic sheet assembly consists of two metal elastic sheets with symmetrical structures, the two metal elastic sheets are respectively arranged on one side of the insulating partition plates and are symmetrical in position, each metal elastic sheet comprises a testing part, an elastic part and a fixing part, each elastic part is of a horizontal U-shaped structure and is respectively and integrally connected with the testing part and the fixing part, one end of the testing part is abutted against the pins of the electronic chip or the contacts of the electronic connector, one end of the fixing part extends to form a connecting pin for externally connecting a PCB test board.
2. The test socket as claimed in claim 1, wherein the bottom of one side of the insulating partition board is symmetrically provided with fixing blocks, the fixing portions are provided with fixing grooves at one ends of the connecting pins, and the fixing blocks are matched with the fixing grooves.
3. The test socket according to claim 1, wherein a position-limiting guide groove is formed at one side of the insulating partition plate and at the two test portions for preventing the two metal strips from contacting each other and guiding the metal strips to move.
4. The socket of claim 1, wherein the testing portion has a strip-shaped hole, the insulating rod is sleeved with the strip-shaped hole, one end of the strip-shaped hole is abutted against the insulating rod, and the other end of the strip-shaped hole is spaced from the insulating rod.
5. The test socket according to claim 1, wherein rectangular windows are symmetrically formed on both sides of the insulating partition for observing the elastic portion.
6. The socket as claimed in claim 1, wherein one end of the testing portion protrudes from the insulating spacer, and the connecting pins protrude from the insulating spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922065864.2U CN211505623U (en) | 2019-11-26 | 2019-11-26 | Test socket for electronic chip and electronic connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922065864.2U CN211505623U (en) | 2019-11-26 | 2019-11-26 | Test socket for electronic chip and electronic connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211505623U true CN211505623U (en) | 2020-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922065864.2U Active CN211505623U (en) | 2019-11-26 | 2019-11-26 | Test socket for electronic chip and electronic connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211505623U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376511A (en) * | 2019-08-17 | 2019-10-25 | 深圳斯普瑞溙科技有限公司 | Test the golden finger of minimum spacing and contact chip |
| CN113917306A (en) * | 2021-12-07 | 2022-01-11 | 深圳市诺泰芯装备有限公司 | High-temperature test piece module and device for packaged product |
-
2019
- 2019-11-26 CN CN201922065864.2U patent/CN211505623U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376511A (en) * | 2019-08-17 | 2019-10-25 | 深圳斯普瑞溙科技有限公司 | Test the golden finger of minimum spacing and contact chip |
| CN113917306A (en) * | 2021-12-07 | 2022-01-11 | 深圳市诺泰芯装备有限公司 | High-temperature test piece module and device for packaged product |
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