KR101667929B1 - Silicon rubber socket - Google Patents
Silicon rubber socket Download PDFInfo
- Publication number
- KR101667929B1 KR101667929B1 KR1020150045635A KR20150045635A KR101667929B1 KR 101667929 B1 KR101667929 B1 KR 101667929B1 KR 1020150045635 A KR1020150045635 A KR 1020150045635A KR 20150045635 A KR20150045635 A KR 20150045635A KR 101667929 B1 KR101667929 B1 KR 101667929B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor element
- contact
- conductive
- deflection
- stepped
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The present invention provides a silicone rubber socket in which a deflection compensating portion is formed in a silicon rubber socket, so that a terminal of a semiconductor device where sagging occurs and a conductive portion of the silicone rubber socket are uniformly contacted.
To this end, the present invention provides a semiconductor device comprising: an insulating part made of a silicon rubber for electrically connecting a terminal of a semiconductor device to a conductive pad of a test board; and at least one conductive layer formed by fusing a plurality of conductive particles and silicone rubber, Wherein a deflection compensating portion is formed on a portion of the conductive portion corresponding to a deflection position of the semiconductor element to compensate deflection of the semiconductor element when the terminal of the semiconductor element and the conductive portion come into contact with the conductive portion, Provide rubber socket.
Description
The present invention relates to a silicon rubber socket for testing semiconductor devices, and more particularly, to a silicon rubber socket for electrically connecting a terminal of a semiconductor device under test to a conductive pad of a test board.
When the manufacturing process of the semiconductor device is finished, a test for the semiconductor device is required. When testing a semiconductor device, a test socket for electrically connecting the test equipment and the semiconductor device is required. The test socket is a mediator component that allows signals from a tester to be transferred to a semiconductor device to be inspected through a test board during a test process. The test socket requires a stable electrical contact capability so that the discrete semiconductor device moves to the correct position and has the mechanical contact ability to make accurate contact with the test board and the signal distortion at the contact point at the time of signal transmission to be minimized.
Among them, the silicon rubber socket is characterized by being able to achieve a dense electrical connection without using any means such as soldering or mechanical coupling, and by being capable of flexible connection by absorbing mechanical shock or deformation, It is widely used as a socket for inspection of equipment.
The conventional silicone rubber socket is composed of a conductive portion which is in contact with a terminal of a semiconductor element and an insulating portion which serves as an insulating layer between the conductive portion.
The upper and lower ends of the conductive part respectively contact the terminals of the semiconductor device and the conductive pads of the test board connected to the test equipment, thereby electrically connecting the terminals and the conductive pads.
On the other hand, due to the development of the technology, a silicon rubber socket which contacts with a semiconductor element is required to be operated in such a circumstance because it requires a semiconductor device which operates at a high frequency and a high current and a high temperature.
However, there has been a problem in that when the terminals of the semiconductor element are brought into contact with the silicon rubber socket in the test process using the conventional silicone rubber socket, defective contact occurs due to deflection of the semiconductor element.
More specifically, the semiconductor device is sagged in one direction depending on the supporting structure. Since the silicon rubber socket is made in a flat state, the portion where deflection of the semiconductor device occurs is first contacted and deflection There is a problem that non-contact portions are brought into contact with each other at a later time, resulting in non-uniform contact with each other, thereby deteriorating the electrical characteristics and greatly affecting the life of the silicone rubber socket.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a silicone rubber socket in which a deflection compensating part is formed to uniformly contact a conductive part of a silicon rubber socket with a terminal of a semiconductor device, To provide a silicone rubber socket.
In order to achieve the above object, the present invention provides a semiconductor device comprising: an insulating part made of silicon rubber for electrically connecting a terminal of a semiconductor device and a conductive pad of a test board; a plurality of conductive particles and silicone rubber fused, Wherein the conductive part is provided with a deflection compensating part at a portion corresponding to a deflection position of the semiconductor element to compensate deflection of the semiconductor element when the terminal of the semiconductor element and the conductive part come into contact with the conductive part, And a silicone rubber socket.
The conductive part is provided on one side of the body part and has a first contact part to be in contact with a terminal of the semiconductor device to be tested, and a second contact part provided on the other side of the body part to be in contact with the conductive pad of the test board. And a contact portion.
The deflection compensation unit may include a first stepped portion formed on one side of the first contact portion so as to be stepped downwardly at one side of the center of the first contact portion to correspond to the sagging of one side of the semiconductor element.
The deflection compensating unit may include a first stepped portion formed on one side of the first contact portion so as to be stepped downwardly and a second stepped portion formed on the other side of the first contacted portion in a downward direction so as to correspond to the sagging of both sides of the semiconductor element .
The deflection compensation unit may include a central stepped portion formed at a center of the first contact portion so as to be stepped downward in correspondence with the sagging of the central portion of the semiconductor element.
The upper end of the insulating portion may further include a guide plate having a guide hole for guiding the contact position between the terminal of the semiconductor element and the first contact portion and for preventing the conductive particles from falling out and falling out. do.
The silicone rubber socket according to the present invention provides the effect of improving the contact efficiency by allowing the terminals of the semiconductor element and the conductive portion of the silicone rubber socket to be in uniform contact with each other by forming the deflection compensation portion in the conductive portion of the silicone rubber socket. can do.
Accordingly, it is possible to prevent the deterioration of electrical characteristics and to improve the life of the silicone rubber socket.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a silicon rubber socket according to a first embodiment of the present invention. Fig.
2 is a schematic view of a silicon rubber socket according to a second embodiment of the present invention.
3 is a schematic view of a silicon rubber socket according to a third embodiment of the present invention.
4 is a schematic view of a silicon rubber socket according to a fourth embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention in which the above objects can be specifically realized will be described with reference to the accompanying drawings. In describing the present embodiment, the same designations and the same reference numerals are used for the same components, and additional description thereof will be omitted in the following.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic view of a silicon rubber socket according to a first embodiment of the present invention, and FIG. 2 is a schematic view of a silicon rubber socket according to a second embodiment of the present invention.
FIG. 3 is a schematic view of a silicon rubber socket according to a third embodiment of the present invention, and FIG. 4 is a schematic view of a silicon rubber socket according to a fourth embodiment of the present invention.
2 to 4, a
The
More specifically, the
The
The
In addition, the
The
The
That is, the
The
1, the
More specifically, when the
2, the
That is, in the first embodiment according to the present invention, the
More specifically, when the supported state of the
3, the
That is, in the first embodiment according to the present invention, the first
More specifically, in a state in which the
As described above, in each of the embodiments, each step portion is formed so as to correspond to the portion where the
The operation of the
First, a
In this state, a test signal is transmitted to the
At this time, even if deflection occurs in the semiconductor element due to the
As described above, the present invention is not limited to the above-described specific preferred embodiments, and various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention as claimed in the claims. And such variations are within the scope of the present invention.
100: silicone rubber socket 110: insulating part
110a: Silicone rubber 120: Conductive part
120a: conductive particles 121:
122: first contact portion 123: second contact portion
130: Deflection compensating part 131: First step
132: second step 133: central step
134: plural stepped portions 140: guide plate
141: Guide hole
Claims (6)
When the terminal 11 of the semiconductor element 10 and the conductive portion 120 are in contact with each other, the conductive portion 120 is deflected in a portion corresponding to the deflection position of the semiconductor element 10 in order to compensate deflection of the semiconductor element. And a compensation unit 130 is formed
The conductive part 120
A body portion 121 forming an outer appearance;
A first contact portion 122 provided on one side of the body portion 121 and in contact with the terminal 11 of the semiconductor device 10 to be tested; And,
And a second contact part 123 provided on the other side of the body part 121 and contacting the conductive pad 21 of the test board 20,
Wherein the deflection compensation unit (130) is formed such that a first contact portion (122) of the conductive portion (120) corresponding to a deflection position of the semiconductor element (10) is stepped downward.
The deflection compensating unit 130 compensates
And a first stepped portion (131) formed on one side of the center of the first contact portion (122) so as to correspond to the sagging of the semiconductor element (10) in a downward direction.
The deflection compensating unit 130 compensates
A first stepped portion 131 formed on one side of the first contact portion 122 so as to be stepped downward so as to correspond to the sagging of both sides of the semiconductor element 10; And a second stepped portion (132) formed on the other side thereof so as to be stepped downward.
The deflection compensating unit 130 compensates
And a central stepped portion (133) stepped downward in the center of the first contact portion (122) to correspond to the center of the semiconductor element (10).
At the upper end of the insulation part 110
A guide plate 140 provided with a guide hole 141 for guiding the contact position between the terminal of the semiconductor element and the first contact portion 122 and preventing the conductive particles 120a from being deviated and depressed to the outside Characterized in that it comprises a silicone rubber socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150045635A KR101667929B1 (en) | 2015-03-31 | 2015-03-31 | Silicon rubber socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150045635A KR101667929B1 (en) | 2015-03-31 | 2015-03-31 | Silicon rubber socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160117049A KR20160117049A (en) | 2016-10-10 |
| KR101667929B1 true KR101667929B1 (en) | 2016-10-20 |
Family
ID=57146253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150045635A KR101667929B1 (en) | 2015-03-31 | 2015-03-31 | Silicon rubber socket |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101667929B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210158041A (en) | 2020-06-23 | 2021-12-30 | (주)하이그레이드 | Method of reconstructing damaged silicone rubber socket |
| KR20220121555A (en) | 2021-02-25 | 2022-09-01 | 주식회사 엔티에스 | Camera module test socket |
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| KR101969791B1 (en) * | 2017-10-23 | 2019-04-17 | 주식회사 오킨스전자 | Ground circuit metal plate, and test socket using the same |
| KR101967401B1 (en) * | 2017-12-29 | 2019-04-10 | 에스케이하이닉스 주식회사 | Test socket |
| KR101999834B1 (en) * | 2018-03-27 | 2019-07-12 | 세메스 주식회사 | Test Apparatus |
| KR102090961B1 (en) * | 2018-10-25 | 2020-03-19 | 주식회사 오킨스전자 | Device for test socket having a plurality of vertically stacked rubber sockets |
| KR102102816B1 (en) * | 2019-01-08 | 2020-04-22 | (주)티에스이 | Data signal transmission connector and manufacturing method for the same |
| KR102175797B1 (en) * | 2019-03-25 | 2020-11-06 | 주식회사 아이에스시 | Electrical test socket |
| KR102220172B1 (en) * | 2020-03-03 | 2021-02-25 | (주)티에스이 | Data signal transmission connector |
| KR102360133B1 (en) | 2020-06-24 | 2022-02-09 | 양희성 | Test socket for semiconductor package |
| KR102359547B1 (en) * | 2020-09-25 | 2022-02-08 | (주)티에스이 | Test socket and test apparatus having the same |
| KR102644473B1 (en) * | 2021-08-27 | 2024-03-07 | 주식회사 티에스이 | Test apparatus for semiconductor package |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185259A (en) * | 1999-12-27 | 2001-07-06 | Daito:Kk | Contact structure of ic socket |
| JP2010157472A (en) | 2009-01-05 | 2010-07-15 | Shin Etsu Polymer Co Ltd | Connector with guide for ball grid array package |
| WO2013162343A1 (en) | 2012-04-27 | 2013-10-31 | Lee Jae Hak | Test socket which allows for ease of alignment |
| KR101366171B1 (en) * | 2013-02-19 | 2014-02-24 | 주식회사 아이에스시 | Test socket with high density conduction section |
-
2015
- 2015-03-31 KR KR1020150045635A patent/KR101667929B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185259A (en) * | 1999-12-27 | 2001-07-06 | Daito:Kk | Contact structure of ic socket |
| JP2010157472A (en) | 2009-01-05 | 2010-07-15 | Shin Etsu Polymer Co Ltd | Connector with guide for ball grid array package |
| WO2013162343A1 (en) | 2012-04-27 | 2013-10-31 | Lee Jae Hak | Test socket which allows for ease of alignment |
| KR101366171B1 (en) * | 2013-02-19 | 2014-02-24 | 주식회사 아이에스시 | Test socket with high density conduction section |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210158041A (en) | 2020-06-23 | 2021-12-30 | (주)하이그레이드 | Method of reconstructing damaged silicone rubber socket |
| KR20220121555A (en) | 2021-02-25 | 2022-09-01 | 주식회사 엔티에스 | Camera module test socket |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160117049A (en) | 2016-10-10 |
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Payment date: 20191008 Year of fee payment: 4 |