KR102102816B1 - Data signal transmission connector and manufacturing method for the same - Google Patents

Abstract

The present invention provides a signal transmission connector which can be stably connected to a terminal of an electronic component by improving a structure corresponding to the distortion phenomenon of the electronic component and a manufacturing method thereof. The signal transmission connector of the present invention comprises: a plurality of conductive units including a plurality of conductive particles in an elastic insulating material so as to be connected to a terminal of an electronic component; an insulating body made of an elastic insulating material and surrounding the plurality of conductive units so as to be spaced apart from each other; and a plurality of springs coupled to the insulating body to correspond to the plurality of conductive units, spaced apart from the conductive units corresponding to each of the same, and surrounding the periphery of the corresponding conductive units. The height of one or more of the plurality of conductive units is higher than the height of the remaining conductive units, and the plurality of springs have a height corresponding to the height of the corresponding conductive units.

Description

Signal transmission connector and its manufacturing method {DATA SIGNAL TRANSMISSION CONNECTOR AND MANUFACTURING METHOD FOR THE SAME}

The present invention relates to a signal transmission connector, and more particularly, to a signal transmission connector for connecting an electronic component such as a semiconductor package and transmitting an electrical signal, and a method for manufacturing the same.

Currently, various types of connectors are used for transmitting electrical signals in various fields such as the electronics industry and the semiconductor industry.

For example, in the case of a semiconductor package, it is manufactured through a pre-process, a post-process, and a test process, and a connector is used in this manufacturing process. The entire process is also called a fab (FAB) process, and is a process of forming an integrated circuit on a wafer made of single crystal silicon. The post process is also called an assembly process, and separates the wafer into individual chips, connects conductive leads or balls to the chip to enable connection of electrical signals with external devices, and epoxy resins to protect the chip from the external environment. This is a process of forming a semiconductor package by molding with a resin. The test process is a process of testing whether a semiconductor package operates normally, and selecting good and bad products.

One of the key components applied to the test process is a so-called test socket. The test socket is mounted on a printed circuit board electrically connected to an integrated circuit test tester and used for inspection of a semiconductor package. The test socket has a contact pin, which electrically connects the lead of the semiconductor package to the terminal of the printed circuit board.

The tester generates an electrical signal for testing a semiconductor package to be connected to a test socket, outputs it to the semiconductor package, and then tests whether the semiconductor package operates normally using an electrical signal input through the semiconductor package. As a result, the semiconductor package is determined to be good or bad.

1 shows a conventional test socket used for inspection of a semiconductor package.

Upon inspection of the semiconductor package, the terminal 12 of the semiconductor package 10 comes into contact with the conductive portion 22 of the test socket 20, and an electrical signal is transmitted to the tester through the conductive portion 22.

However, as shown in FIG. 1, the semiconductor package 10 having a relatively wide width may be slightly twisted in a shape in which the center portion rises upward compared to the edge or other shape after manufacturing. The warpage of the semiconductor package 10 may be difficult to visually check due to its fine degree, but during inspection, the terminal 12 cannot contact the conductive portion 22 of the test socket 20 stably. As a result, the inspection accuracy of the semiconductor package 10 may be deteriorated.

In addition, in the case of the semiconductor package 10 where warpage occurs, when the semiconductor package 10 is pressed against the test socket 20 for inspection, the pressure received by the conductive portion 22 due to the difference in height between the terminals 12 is reduced. They may appear different. At this time, concentrated stress is generated in the conductive portion 22 under a relatively large pressing force, and when this phenomenon is repeated, the conductive portion 22 generating the concentrated stress is damaged, thereby shortening the life of the test socket 20. The problem arises.

Published Patent Publication No. 2018-0043095 (Apr. 27, 2018)

The present invention has been devised in view of the above-mentioned points, and it is possible to stably connect to a terminal of an electronic component through an improvement in structure corresponding to a warping phenomenon of an electronic component such as a semiconductor package, increase product life, and signal. It is an object of the present invention to provide a signal transmission connector capable of improving transmission performance and a method for manufacturing the same.

The signal transmission connector according to the present invention for solving the above object is a signal transmission connector that can be connected to an electronic component to transmit an electrical signal, a plurality of elastic insulating material to be connected to the terminal of the electronic component A plurality of conductive parts containing conductive particles; An insulator made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts to be spaced apart from each other; And a plurality of springs coupled to the insulator to correspond to the plurality of conductive parts and spaced apart from the corresponding conductive parts to surround the periphery of the conductive part. Is higher than the height of the remaining conductive portions, and the plurality of springs have a height corresponding to the height of the corresponding conductive portion.

The spring is made of a conductive material so that it can be connected to the terminal of the electronic component, and can be spaced from the conductive portion within a range that can contact the terminal when the terminal contacts the conductive portion.

The insulator includes a plurality of insulating parts surrounding each of the plurality of conductive parts, and the plurality of insulating parts may have a height corresponding to the height of the corresponding conductive part.

A conductive part having a relatively high height among the plurality of conductive parts may be disposed at an intermediate portion of the insulator than a conductive part having a relatively low height.

The conductive part having the lowest height among the plurality of conductive parts may include a conductive part bump whose end is located on the surface of the insulator, and the remaining conductive parts protrude from the surface of the insulator.

The plurality of conductive parts and the plurality of springs may be arranged in a staircase structure in which their height decreases from the middle of the insulator toward the edge.

On the other hand, the method for manufacturing a signal transmission connector according to the present invention for solving the above-mentioned object is a method for manufacturing a signal transmission connector capable of transmitting an electrical signal by connecting to an electronic component, wherein (a) has a cavity therein. Preparing a provided molding mold and a plurality of springs having at least one height different from the rest; (b) disposing a plurality of springs in the cavity to be spaced apart; (c) injecting a liquid elastic insulating material into the cavity in which the plurality of springs are disposed; (d) curing the elastic insulating material to form an insulator supporting the plurality of springs, and separating the insulator to which the plurality of springs are coupled from the molding mold; (e) forming a plurality of insulator holes in the insulator at a height corresponding to the height of the springs surrounding the respective circumferences so as to penetrate through portions of the insulators each surrounded by the plurality of springs; (f) injecting a conductive mixture containing conductive particles in a liquid elastic insulating material into each of the plurality of insulator holes to a height corresponding to the height of each insulator hole; And (g) a height corresponding to the height of the spring surrounding each of the plurality of conductive parts spaced by the spring and spaced apart from the spring so that the conductive mixture is cured after application of a magnetic field to be connected to a terminal of the electronic component. Forming with; includes.

In the signal transmission connector according to the present invention, a plurality of conductive parts in which the electronic component comes into contact with a terminal has a relatively low height, a relatively high height, and is spaced apart from the insulator, and has a height corresponding to the height of each conductive part. By surrounding the conductive parts of the spring of the, it can be stably connected to the electronic component deformed so that the height difference between the terminals.

In addition, in the signal transmission connector according to the present invention, a spring surrounds the periphery of the conductive portion that repeatedly contacts the terminal of the electronic component, so that the strength of the conductive portion is reinforced, and the conductive portion is subjected to different pressures by the terminal of the electronic component. It is possible to reduce the problem that the conductive portion is deformed or damaged while stress concentration occurs in the conductive portion.

In addition, in the signal transmission connector according to the present invention, when the terminal of the electronic component comes into contact with the conductive portion and the electronic component presses the conductive portion, the spring may apply elastic force to the electronic component in the opposite direction to press the conductive portion. Therefore, the conductive portion can be protected by not receiving excessive load from the electronic component, and the damage of the conductive portion can be minimized by inducing the terminal of the electronic component to contact the conductive portion with a stable stroke without generating over-stroke.

1 shows a conventional test socket used for semiconductor package inspection.
2 shows a signal transmission connector according to an embodiment of the present invention and an electronic component connected thereto.
3 is an enlarged view of a portion of the signal transmission connector shown in FIG. 2.
4 to 7 are for explaining a method of manufacturing a signal transmission connector according to an embodiment of the present invention.
8 shows a signal transmission connector according to another embodiment of the present invention and an electronic component connected thereto.
9 shows a signal transmission connector according to another embodiment of the present invention.
10 is an enlarged view of a portion of the signal transmission connector shown in FIG. 9.

Hereinafter, a signal transmission connector and a manufacturing method according to the present invention will be described in detail with reference to the drawings.

As shown in the figure, the signal transmission connector 100 according to an embodiment of the present invention is capable of transmitting an electrical signal by connecting to the electronic component 30, and can be connected to the terminal 32 of the electronic component 30. The plurality of conductive parts 110 and 112, and the insulator 120 surrounding the plurality of conductive parts 110 and 112 to support the plurality of conductive parts 110 and 112 to be spaced apart from each other, and a conductive It includes a plurality of springs 130 and 132 coupled to the insulator 120 so as to surround the periphery of the parts 110 and 112. The signal transmission connector 100 may be used to connect various electronic components and transmit electrical signals, thereby inspecting electronic components through a tester or electrically connecting electronic components and various electronic devices.

Hereinafter, it will be described, for example, that the signal transmission connector 100 according to an embodiment of the present invention is used to inspect the electronic component 30 by connecting to the electronic component 30.

The conductive parts 110 and 112 are formed in such a way that a plurality of conductive particles are contained in the elastic insulating material so as to be connected to the terminals 32 of the electronic component 30. The conductive parts 110 and 112 are spaced apart from the inside of the insulator 120 so as to correspond to the terminals 32 provided in the electronic component 30 to which a plurality of objects are connected. The conductive parts 110 and 112 may be provided in a shape that penetrates the insulator 120 in a thickness direction in a cylindrical shape or various other shapes.

As the elastic insulating material constituting the conductive parts 110 and 112, a heat-resistant polymer material having a crosslinked structure, for example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber , Acrylonitrile-butadiene copolymer rubber, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, Ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber, and the like can be used.

Further, as the conductive particles constituting the conductive parts 110 and 112, those having magnetism so as to react by a magnetic field may be used. For example, as the conductive particles, particles of a metal exhibiting magnetic properties such as iron, nickel, and cobalt, or alloy particles thereof, or particles containing these metals or these particles as core particles, and gold on the surface of the core particles , Silver, palladium, radium, etc., which has good conductivity, plated with metal, or non-magnetic metal particles, inorganic particles such as glass beads, and polymer particles as core particles, and conductive surfaces such as nickel and cobalt on the surface of the core particles A plated magnetic body, or a plated core particle having a conductive magnetic body and a metal having good conductivity may be used.

Among the plurality of conductive parts 110 and 112, at least one conductive part 112 has a height higher than that of the remaining conductive parts 110. The plurality of conductive portions 110 and 112 having different heights are disposed at appropriate positions in the insulator 120 according to the height. That is, among the plurality of conductive portions 110 and 112, the conductive portion 112 having a relatively high height is disposed in the middle portion of the insulator 120 rather than the conductive portion 110 having a relatively low height, and has a relatively high height. The lower conductive portion 110 is disposed at the edge of the insulator 120 than the relatively high conductive portion 112.

The structure and arrangement of the conductive parts 110 and 112 are for stable connection with the warped electronic component 30 in a form in which the central part rises upward compared to the edge as shown in the figure. In the process of inspecting the electronic component 30, the terminal of the electronic component 30 positioned at a relatively lower position by pressing the electronic component 30 twisted in a form in which the central portion is raised upwards compared to the edge is positioned toward the signal transmission connector 100 ( When 32) is in contact with the conductive portion 110 of the signal transmission connector 100, the terminal 32 of the electronic component 30 positioned relatively upwards will contact the conductive portion 112 with a relatively high height. You can. Therefore, even if the electronic component 30 is distorted or deformed to create a height difference between the terminals 32, the electronic component 30 can be stably connected to the signal transmission connector 100.

When designing the conductive parts 110 and 112, the difference in height between the relatively high conductive part 112 and the relatively low conductive part 110 is that of the electronic component 30 having a height difference between the terminals 32. The height difference between the uppermost terminal 32 and the lowermost terminal 32 may be set to be substantially the same.

The insulator 120 is made of an elastic insulating material, and surrounds the plurality of conductive parts 110 and 112 to support the plurality of conductive parts 110 and 112 to be spaced apart from each other. The elastic insulating material constituting the insulator 120 may be an elastic insulating material such as an elastic insulating material constituting the conductive parts 110 and 112.

The insulator 120 includes a plurality of insulating parts 121 and 122 surrounding each of the plurality of conductive parts 110 and 112, and an insulating extension part 123 that is disposed outside. The insulating extension 123 may be combined with a structure such as a support plate for supporting the insulator 120 so that it is not easily deformed. The plurality of insulating parts 121 and 122 have a height corresponding to the height of the conductive parts 110 and 112 surrounded by each of them, that is, a vertical thickness.

Specifically, the insulating portion 121 surrounding the conductive portion 110 having a relatively low height is relatively low in height, and the height thereof is substantially equal to the height of the corresponding conductive portion 110. In addition, the insulating portion 122 surrounding the relatively high conductive portion 112 has a relatively high height, and the height thereof is substantially equal to the height of the corresponding conductive portion 112. Therefore, similar to the conductive parts 110 and 112, the insulating parts 121 and 122 are also disposed in the middle portion of the relatively high-height insulating part 122 than the relatively low-height insulating part 121, The relatively low insulation portion 121 is disposed on the edge side of the relatively high insulation portion 122.

The plurality of springs 130 and 132 are spaced apart from each of the conductive parts 110 and 112 to be insulated from each of the conductive parts 110 and 112, and insulators to surround the circumference of each of the conductive parts 110 and 112 It is coupled to 120. The springs 130 and 132 may take a conventional coil spring structure as shown, or various other structures that may surround the perimeter of the conductive portions 110 and 112. The plurality of springs 130 and 132 has a height corresponding to the height of the conductive parts 110 and 112 corresponding to each.

That is, the spring 130 surrounding the conductive portion 110 having a relatively low height is relatively low in height, and the height thereof is substantially equal to the height of the corresponding conductive portion 110. And the spring 132 surrounding the relatively high conductive portion 112 is relatively high in height, the height of which is substantially the same as the height of the corresponding conductive portion 112. Therefore, similar to the conductive parts 110 and 112, the plurality of springs 130 and 132 also have a relatively high height of the spring 132, a relatively low height of the spring 130, the middle part of the insulator 120. It is disposed on, the relatively low spring 130 is disposed on the edge side of the insulator 120 than the relatively high spring 132.

The springs 130 and 132 surround the conductive parts 110 and 112 so that when the conductive parts 110 and 112 contact the terminal 32 of the electronic component 30, the conductive parts ( 110) (112) supports not to spread sideways and reinforces the strength of the conductive parts (110) (112). Accordingly, when the electronic component 30 is compressed to the signal transmission connector 100, the entire signal transmission connector 100 and each conductive portion 110, 112 can withstand the load caused by the pressing force, and the terminal 32 ) As the electronic component 30 deformed to have a difference in height is compressed, a problem that stress concentration occurs in some conductive portions may be reduced. In addition, the springs 130 and 132 minimize deformation of the entire conductive parts 110 and 112 and the signal transmission connector 100, and thereby extend the life of the signal transmission connector 100.

Spring 130, 132 is made of a conductive material, the end of which can be exposed to the outside from the surface of the insulator 120. The conductive springs 130 and 132 are terminals of the electronic component 30 together with the conductive portions 110 and 112 when the terminal 32 of the electronic component 30 is connected to the conductive portions 110 and 112. It is possible to transmit an electrical signal by connecting to (32). The conductive springs 130 and 132 may serve to expand the connection area of the signal transmission connector 100. That is, even if the terminal 32 of the electronic component 30 does not properly contact the conductive parts 110 and 112, the spring 130 and 132 contact the terminal 32 and transmit an electrical signal, thereby transmitting the electrical signal. The problem of signal transmission due to incorrect contact of (110) and 112 may be reduced.

To this end, the springs 130 and 132 each conductive portion 110 within a range in which the terminal 32 is in contact with the terminal 32 when the terminal 32 is pressed on the corresponding conductive portion 110 and 112. It can be spaced from 112.

As described above, in the signal transmission connector 100 according to an embodiment of the present invention, the height of the conductive parts 110 and 112 in which the electronic component 30 contacts the terminal 32 is relatively low, and the height is high. Is mixed with a relatively high one is spaced apart from the insulator 120, a plurality of springs 130, 132 having a height corresponding to the height of each conductive portion 110, 112, each conductive portion 110, 112 ), It is possible to stably connect to the electronic component 30 that is deformed so as to have a height difference between the terminals 32.

In addition, the signal transmission connector 100 according to an embodiment of the present invention has a spring 130, 132 around the periphery of the conductive portion 110, 112 that repeatedly contacts the terminal 32 of the electronic component 30. By surrounding, the strength of the conductive parts 110 and 112 is reinforced, and the conductive parts 110 and 112 are subjected to different pressures by the terminals 32 of the electronic component 30, thereby stressing some conductive parts. It is possible to reduce the problem that the conductive portion is deformed or damaged as concentration occurs.

In addition, in the signal transmission connector 100 according to an embodiment of the present invention, the springs 130 and 132 are connected to the terminals 32 of the electronic component 30 to transmit electrical signals, so that the electrical signals are generated only by the conductive part. Compared to the prior art for transmitting a wider connection area with the electronic component 30, it is possible to reduce the problem of signal transmission errors due to incorrect contact between the terminal 32 and the conductive parts 110 and 112.

In addition, the signal transmission connector 100 according to an embodiment of the present invention, the terminal 32 of the electronic component 30 is in contact with the conductive portion 110, 112, the electronic component 30 is the conductive portion 110 (( When pressing the 112, the spring 130, 132 may apply an elastic force to the electronic component 30 in the opposite direction to press the conductive portion 110, 112. Therefore, the conductive parts 110 and 112 are not subjected to excessive loads from the electronic parts 30 so that the conductive parts 110 and 112 can be protected, and the terminals 32 of the electronic parts 30 are over- By inducing contact with the conductive parts 110 and 112 with a stable stroke without generating a stroke, damage to the conductive parts 110 and 112 may be minimized.

Hereinafter, a method of manufacturing a signal transmission connector 100 according to an embodiment of the present invention as described above with reference to FIGS. 4 to 7 will be described.

First, a molding mold 50 as shown in FIG. 4 is prepared. The molding mold 50 may include an upper mold 52 and a lower mold 54 disposed to face each other. A plurality of upper mold grooves 52 and 53 having different heights are provided inside the upper mold 51, and a lower mold groove 55 is provided inside the lower mold 54. The plurality of upper mold grooves 52 and 53 provided in the upper mold 51 may be divided into an upper mold groove 52 having a relatively low vertical height and an upper mold groove 53 having a relatively high height. . The upper mold groove 53 having a relatively high height is disposed in the middle of the upper mold 51 compared to the upper mold groove 52 having a relatively low height.

Next, as shown in FIG. 5, the upper mold 51 and the lower mold 54 are superimposed to form a cavity 56 surrounded by the upper mold 51 and the lower mold 54, and the cavity 56 The plurality of springs 130 and 132 are spaced apart. The cavity 56 includes a plurality of forming spaces 57 and 58 having different heights and heights, and the plurality of forming spaces 57 and 58 are relatively vertically formed with a relatively low forming space 57. It can be divided into a high molding space (58). The molding space 58 having a relatively high height is disposed in the middle of the molding die 50 compared to the molding space 57 having a relatively low height. At this time, the spring 130 having a relatively low height is placed in the forming space 57 having a relatively low height, and the spring 132 having a relatively high height is placed in the forming space 58 having a relatively high height.

After the arrangement of the springs 130 and 132, a liquid elastic insulating material is injected into the cavity 56, and the elastic insulating material injected into the cavity 56 is cured to support the plurality of springs 130 and 132. Insulator 120 is formed. At this time, the elastic insulating material filling the forming space 57 of the cavity 56 forms an insulating portion 121 supporting the spring 130 having a relatively low height, and another forming space 58 of the cavity 56 The elastic insulating material filling the to form an insulating portion 122 supporting the spring 132 having a relatively high height.

Next, the intermediate molded product 60 in which the insulator 120 and the plurality of springs 130 and 132 are combined is separated from the molding mold 50, and the intermediate molded product 60 is thickness-directed as shown in FIG. 6. A plurality of insulator holes 62 passing through are formed. At this time, the insulator hole 62 is formed to have a height corresponding to the height of the springs 130 and 132 surrounding each of the insulator holes 62 so as to penetrate a portion surrounded by the springs 130 and 132 in the middle of the insulator 120. do. The insulator hole 62 may be formed in a uniform width through various methods such as laser hole processing, punching processing, and array processing.

Next, as shown in FIG. 7, a conductive mixture 72 containing conductive particles in a liquid elastic insulating material is injected into each of the plurality of insulator holes 62 at a height corresponding to the height of each insulator hole 62. do. The liquid conductive mixture 72 may be prepared in a state in which conductive particles are dispersed in the liquid elastic insulating material. At this time, by mixing the liquid adhesive primer to the liquid conductive mixture 72 together, the bonding between the conductive particles and the liquid elastic insulating material can be further strengthened. The dispenser 70 can be used to fill the liquid conductive mixture 72 into the insulator hole 62.

Next, by applying a magnetic field after curing the conductive mixture 72, a plurality of conductive parts 110, each surrounded by a plurality of springs 130, 132 so as to be connected to the terminals 32 of the electronic component 30 112 may be formed to a height corresponding to the height of the spring 130 and 132 corresponding to each.

The process of injecting the conductive mixture 72 into the insulator hole 62 and the process of applying a magnetic field to the conductive mixture 72 may be performed in a separate mold. When a magnetic field is applied to the conductive mixture 72, the conductive particles dispersed in the liquid elastic insulating material may be oriented in the thickness direction of the insulator 120 under the influence of the magnetic field to form an electrical passage.

Meanwhile, FIG. 8 shows a signal transmission connector according to another embodiment of the present invention and an electronic component connected thereto, FIG. 9 shows a signal transmission connector according to another embodiment of the present invention, and FIG. 10 shows FIG. 9 It is an enlarged view of a part of the signal transmission connector shown in.

First, the signal transmission connector 200 shown in FIG. 8 includes a plurality of conductive parts 210 and 212 and 214 and a plurality of conductive parts 210 and 210 that can be connected to the terminal 32 of the electronic component 30. 212) (214) surrounding the plurality of conductive parts 210, 212, 214 to support the insulator 220 to be spaced apart from each other, and the conductive parts 210, 212, 214 to surround the periphery And a plurality of springs 230, 232, and 234 coupled to the insulator 220.

The plurality of conductive parts 210, 212 and 214 are formed in a form in which a plurality of conductive particles are included in the elastic insulating material so as to be connected to the terminal 32 of the electronic component 30. The plurality of conductive parts 210, 212, and 214 are disposed at appropriate positions in the insulator 220 according to their heights. That is, a relatively high height among the plurality of conductive parts 210 and 212 and 214 is placed in the middle part of the insulator 220 rather than having a relatively low height, and the more from the middle part of the insulator 220 toward the edge, It is arranged in a staircase structure whose height decreases.

The insulator 220 includes a plurality of insulators 221, 222, and 223 surrounding each of the plurality of conductive parts 210, 212 and 214, and an insulating extension part 224 that is disposed outside. . The plurality of insulating parts 221, 222, and 223 have heights corresponding to the heights of the conductive parts 210, 212, and 214 surrounding each of them. That is, the plurality of insulating parts 221, 222, and 223 have a height substantially equal to the height of the conductive parts 210, 212, and 214, respectively. Therefore, the plurality of insulating parts 221, 222, and 223 are also arranged in a staircase structure in which the height decreases from the middle portion of the insulator 220 toward the edge.

The plurality of springs 230, 232, and 234 are spaced apart from each conductive portion 210, 212, 214, and insulated from each conductive portion 210, 212, 214, and each conductive portion 210 (212) (214) is coupled to the insulator 220 to surround the circumference. The plurality of springs 230, 232, and 234 have heights corresponding to the heights of the conductive portions 210, 212, and 214, respectively. That is, the plurality of springs 230, 232, 234 have a height substantially equal to the height of the conductive portions 210, 212, 214, which are enclosed. Therefore, the plurality of springs 230, 232, and 234 are also arranged in a staircase structure in which their height decreases toward the edge from the middle of the insulator 220. The plurality of springs 230, 232, and 234 may be made of a conductive material as in the above-described embodiment.

The signal transmission connector 200 according to another embodiment of the present invention includes a plurality of conductive parts 210, 212, 214, a plurality of insulating parts 221, 222, 223, and a plurality of springs 230 ) (232) (234) is arranged in a staircase structure in which its height decreases as it goes from the middle of the insulator 220 toward the edge, so that the central part rises upward compared to the edge, and the electronic component 30 is more stable. I can connect.

As described above, the signal transmission connector 200 is disposed with a spring 230, 232, 234 inside the molding die, and injecting a liquid elastic insulating material thereto to form an intermediate molding, and to the intermediate molding. After machining the insulator hole, it may be manufactured by injecting a liquid conductive mixture into the insulator hole.

The signal transmission connector 300 shown in FIGS. 9 and 10 includes a plurality of conductive parts 310 and 312 and a plurality of conductive parts 310 and 312 that can be connected to the terminal 32 of the electronic component 30. An insulator 320 surrounding the periphery to support the plurality of conductive parts 310 and 312 to be separated from each other, and a plurality of springs coupled to the insulator 320 to surround the periphery of the conductive parts 310 and 312 ( 330) (332).

The plurality of conductive parts 310 and 312 are formed in such a way that a plurality of conductive particles are included in the elastic insulating material so as to be connected to the terminal 32 of the electronic component 30. The plurality of conductive parts 310 and 312 are disposed at appropriate positions in the insulator 320 according to heights of different heights. That is, a relatively high height among the plurality of conductive parts 310 and 312 is disposed in the middle portion of the insulator 320 rather than a relatively low height, and a relatively low height is higher than a relatively high height. It is disposed on the edge side of the insulator 320. Among the plurality of conductive parts 310 and 312, the conductive part 310 having the lowest height is located on the surface of the insulator 320, and the remaining relatively high conductive part 312 is an electronic component. It has a conductive part bump 313 protruding from the surface of the insulator 320 so as to be in contact with the terminal 32 of the (30).

The insulator 320 includes a plurality of insulating parts 321 surrounding the plurality of conductive parts 310 and 312, and an insulating extension part 322 disposed outside the insulating part 321.

The plurality of springs 330 and 332 are spaced apart from each of the conductive parts 310 and 312 and insulated from each of the conductive parts 310 and 312, and an insulator to surround the circumference of each of the conductive parts 310 and 312. It is coupled to 320. The plurality of springs 330 and 332 have a height corresponding to the height of the conductive parts 310 and 312 corresponding to each. That is, the plurality of springs 330 and 332 have a height substantially equal to the height of the conductive parts 310 and 312 that are respectively surrounded. Therefore, the spring 330 surrounding the conductive portion 310 having a relatively low height is positioned at a height at which the upper end thereof is substantially the same as the upper end of the conductive portion 310 and the surface of the insulating portion 321. In addition, the spring 332 surrounding the relatively high conductive portion 312 has its upper end protruding from the surface of the insulating portion 321 and is located at a height substantially equal to the height of the upper end of the conductive portion 312. do. The plurality of springs 330 and 332 may be made of a conductive material as in the above-described embodiment.

When the signal transmission connector 300 contacts the warped electronic component 30 in a form in which the central portion rises upwards compared to the edge, the conductive portion bump 313 of the relatively high conductive portion 312 has an electronic component 30. ) Can be stably contacted with the terminal 32 positioned relatively upward, so that the electronic component 30 bent and deformed to have a high height difference between the terminals 32 can be stably connected.

Then, the spring 332 surrounds the conductive part bump 313 of the conductive part 312 protruding from the insulating part 321, so that when the terminal 32 is pressed against the conductive part bump 313, the conductive part bump ( 313) can spread sideways, or reduce the problem of damage.

In addition, when the electronic component 30 excessively descends toward the signal transmission connector 300, the spring 330 and 332 contact the electronic component 30 to elastically support the electronic component 30, thereby transmitting signals. It is possible to reduce the problem that the connector 300 is deformed or damaged under excessive pressure.

As described above, the signal transmission connector 300 is disposed with a spring 330 and 332 inside the molding die, and a liquid elastic insulating material is injected therein to form an intermediate molding, and an insulating hole is processed into the intermediate molding. Then, it can be prepared by injecting a liquid conductive mixture into an insulator hole.

The present invention has been described as a preferred example, but the scope of the present invention is not limited to the form described and illustrated above.

For example, it was previously described that the spring is made of a conductive material capable of transmitting an electrical signal, and its end is exposed to the outside of the insulator so that it can be connected to the terminal of the electronic component, the spring can be made of a non-conductive material. . The spring of the non-conductive material does not transmit an electrical signal, and may function to increase the strength of the conductive portion. In this case, the spring does not need to have its ends exposed outside the insulator 120 and can be entirely embedded in the insulator.

In addition, although the drawings show that the conductive parts, the insulating parts, and the springs each have two or three different heights, the heights of the conductive parts, the insulating parts, and the springs may be variously changed.

In addition, in the drawing, a conductive part, an insulating part, and a spring having a relatively high height are disposed at a middle portion of the insulator rather than having a relatively low height, and a relatively low height is an insulator than a relatively high height. Although shown as being disposed on the edge of the, these conductive parts, insulating parts, and springs can be arranged in various other structures such as a stepped arrangement structure, a wavy arrangement structure, or the like depending on the warping or bending shape of the electronic component.

In addition, prior to placing a spring inside the molding mold, and injecting a liquid elastic insulating material thereto to form an intermediate molding, and processing the insulator hole in the intermediate molding, and then injecting a liquid conductive mixture into the insulator hole Although it has been described as manufacturing a transmission connector, the signal transmission connector can be manufactured by various other methods than this manufacturing method.

Above, the present invention has been shown and described in connection with a preferred embodiment for illustrating the principles of the present invention, but the present invention is not limited to the configuration and operation as shown and described. Rather, those skilled in the art will appreciate that many changes and modifications to the present invention are possible without departing from the spirit and scope of the appended claims.

30: electronic component 32: terminal
50: forming mold 51: upper mold
54: lower mold 60: intermediate molding
62: insulator hole 70: dispenser
100, 200, 300: signal transmission connector
110, 112, 210, 212, 214: conductive part 120, 220, 320: insulator
121, 122, 221, 222, 223: insulation 123, 224, 322: insulation extension
130, 132, 230, 232, 234, 330, 332: spring
313: Bump of the conductive part

Claims (7)

In the signal transmission connector that can be connected to an electronic component to transmit an electrical signal,
A plurality of conductive parts including a plurality of conductive particles in an elastic insulating material to be connected to the terminals of the electronic component;
An insulator made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts to be spaced apart from each other; And
It includes a plurality of springs coupled to the insulator to correspond to the plurality of conductive parts, spaced apart from the conductive parts corresponding to each, and surrounding the periphery of the conductive part;
The height of at least one of the plurality of conductive parts is higher than the height of the remaining conductive parts, and the plurality of springs have a height corresponding to the height of the corresponding conductive part,
The conductive part having the lowest height among the plurality of conductive parts has an end portion located on the surface of the insulator, and the remaining conductive parts include a conductive part bump protruding from the surface of the insulator,
Of the plurality of springs, the spring surrounding the conductive part having the lowest height is positioned at the same height as the surface of the insulator, and the spring surrounding the conductive part having a relatively high height has an upper end projecting from the surface of the insulator. Signal transmission connector, characterized in that surrounding the conductive portion bump of the conductive portion.
According to claim 1,
The spring is made of a conductive material so as to be connected to the terminal of the electronic component, characterized in that spaced apart from the conductive portion within a range that can contact the terminal when the terminal contacts the conductive portion Signal transmission connector.
delete According to claim 1,
A signal transmission connector, characterized in that a conductive part having a relatively high height among the plurality of conductive parts is disposed in a middle portion of the insulator than a conductive part having a relatively low height.
delete According to claim 1,
The plurality of conductive parts and the plurality of springs is a signal transmission connector, characterized in that arranged in a staircase structure whose height decreases toward the edge from the middle of the insulator.
delete

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