KR20180092167A - Open cell type FPCB film, test socket having thereof, and method for manufacturing thereof - Google Patents

Abstract

A test socket according to the present invention includes an insulating silicon rubber which absorbs a shock during a test by configuring a body between a semiconductor device and a test device and has a plurality of through holes at regular intervals, a conductive silicone rubber which electrically connects the semiconductor device and the test device by filling the through hole with conductive liquid silicon, and an FPCB film which is integrated with one side of the insulating silicon rubber and one side of the conductive silicon rubber and has a part corresponding to the insulating silicon rubber which is opened. According to the configuration of the present invention, the silicon rubber is three-dimensionally combined with a film sheet by a net structure by an open cell of the FPCB film, thereby enhancing durability and individual contact characteristic of a conductive pad.

Description

[0001] The present invention relates to an open cell type FPCB film, a test socket including the same, and a method of manufacturing the same,

The present invention relates to an open cell FPCB film, a test socket including the test socket, and a method of manufacturing the same. More particularly, the present invention relates to a test socket for inspecting electrical characteristics of a semiconductor device manufactured through a semiconductor package manufacturing process, And a manufacturing method thereof.

Particularly, when the top film of the test socket covers the entirety of the silicone rubber, the top film and the silicone rubber can not be bonded together, In order to solve this problem, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an FPCB Film, a test socket, and a method of manufacturing the same.

In general, semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests.

Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, in order to electrically connect the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device to each other , A test socket is disposed between the semiconductor device and the test apparatus.

However, the test socket is provided with a conductive connector (wire or spring, etc.) for contacting the terminals provided in the test instrument.

Such a conductive connector must be capable of absorbing the impact even in contact with a semiconductor device. When a conductive wire is used to form a connector, if the conductive wire is broken by an impact due to repetitive testing, the function can not be performed.

Further, since the conductive wires connect the upper and lower pads of the socket, if the length of the conductive wires is increased, a test is required at a high frequency such as an RF (Radio Frequency) semiconductor device.

Further, even when the test is performed by inserting the conductive wire into the conductive silicone rubber to electrically connect the semiconductor device and the test device, there is a problem that the conductive silicone rubber or the conductive wire is in direct contact with the conductive ball of the external device, have.

Further, even when the conductive wire is included in the conductive silicone rubber, since the conductive wire is inserted during the molding of the conductive silicone rubber, the assembling property is significantly deteriorated.

Further, in the case of electrically connecting the conductive connectors connecting the upper and lower pads of the socket to the conductive balls of the external device, when the upper and lower pads are not aligned horizontally or the height of the conductive balls is different, a contact failure occurs, .

On the other hand, Korean Registered Patent No. 10-1683017 discloses that an FPCB film is formed on the top surface of a socket body. However, since the FPCB film covers the whole body of the socket, it is highly likely that the FPCB film is easily peeled off from the insulating silicone rubber or the conductive bump of the FPCB film is arbitrarily detached by repeated inspection. Therefore, a test socket in which the socket body and the FPCB film are tightly coupled is required.

In addition, in the injection molding process, there is a problem that the conductive bumps and the conductive silicone rubber are mutually inconsistent on a straight line, which causes contact failures. That is, a means for vertically aligning the conductive bumps and the conductive silicone rubber in the injection molding process is required. In particular, fine pitches are more likely to misalign.

Korean Registration Bulletin 10-1683017

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a test socket in which an insulating silicone rubber escapes into an FPCB film and the insulating silicone rubber and the FPCB film are firmly and stably bonded. And a manufacturing method thereof.

Another object of the present invention is to provide a test socket in which the conductive silicone rubber is vertically aligned with the conductive bumps of the FPCB film and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a test socket, which comprises a body between a semiconductor device and a test device to absorb impacts during inspection and has a plurality of through holes at regular intervals Wherein the conductive silicone rubber is electrically connected to the semiconductor device and the test device by filling the through hole with a conductive liquid silicone so as to electrically connect the semiconductor device and the test device to one side of the insulating silicone rubber and the conductive silicone rubber corresponding to the semiconductor device And an FPCB film formed integrally with the insulating silicone rubber and partially open corresponding to the insulating silicone rubber.

According to another aspect of the present invention, an open cell FPCB film of the present invention includes a plurality of conductive pads, a net connecting the conductive pads in the lateral and longitudinal directions, and an open cell formed by the net .

According to still another aspect of the present invention, there is provided a method of manufacturing a test socket, comprising the steps of: preparing an FPCB film including the open cell and the aligned cell; Preparing an upper mold having a concave-convex shape in which pins are repeated, preparing an upper mold including an alignment pin, placing the alignment cell on the alignment pin to seat the FPCB film on the upper mold, Inserting the insulative liquid silicone into the concave groove and escaping to the open cell by inserting insulative liquid silicone after assembling the lower mold and the upper mold; separating the lower mold and the upper mold, Molding the insulative silicone rubber formed integrally with the FPCB film and having the through holes, And a step of completing the test socket by injecting liquid silicone.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since there is an open cell in which the silicone rubber can escape from the top film combined with the insulating silicone rubber, the durability of the whole body is enhanced by the three-dimensional bonding and the stroke is improved.

Second, since the top film is opened to form the alignment cell, a space for inserting the alignment pins of the upper mold is provided, and the problem of misalignment between the conductive bumps and the conductive silicone rubber is solved fundamentally, The effect is expected.

1 is a sectional view showing a configuration of a test socket according to the present invention;
2 is a perspective view showing the structure of an FPCB film according to the present invention.
3A to 3E are cross-sectional views each illustrating a method of manufacturing a test socket according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the test socket according to the present invention will be described in detail with reference to the accompanying drawings.

A test socket is connected to a semiconductor device to be tested on one side and a test device which is an inspection device to the other side, thereby electrically connecting the semiconductor device and the test device. For example, the conductors of the test socket can electrically test the semiconductor device by interconnecting the terminals provided in the semiconductor device and the terminals of the test device. Here, a BGA (ball grid array) type terminal in which a plurality of balls are formed can be used as the terminal of the semiconductor device.

Referring to FIG. 1, the test socket 100 absorbs shocks during inspection by constructing a body between a semiconductor device (not shown) and a test device (not shown), and has a plurality of through holes A conductive silicone rubber 120 electrically connected to the semiconductor device and the test device by vertically filling a conductive liquid silicone resin in the through hole 102, An insulating silicone rubber 110 in contact with the semiconductor device, and an FPCB film 200 integrally formed on one side of the conductive silicone rubber 120.

The SUS base film 140 may be further formed on the outer side of the insulating silicone rubber 110. The SUS base film 140 may function to cut off external electromagnetic waves. Therefore, it can be formed of SUS (steel use stainless) material which is effective for shielding electromagnetic waves.

The insulating silicone rubber 110 may include a heat-resistant polymer material having a crosslinked structure. Any material having a predetermined elasticity is not limited to silicone rubber. For example, the hardenable polymer material may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber, and other elastic rubbers.

As the conductive silicone rubber 120, silicone rubber, urethane rubber, epoxy rubber or other elastic rubber can be used as in the case of the above-described insulating silicone rubber. However, a conductive powder to be arranged in a magnetic pattern may be mixed therewith. Conductive powder, iron, nickel, cobalt or other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core. Or a non-alignment type conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in a silicone rubber resin.

2, the FPCB film 200 includes a conductive pad 210 corresponding to the conductive silicone rubber 120, and a film sheet 220 corresponding to the insulating silicone rubber 110. The conductive pad 210 may include a pad formed by electroplating or electroless plating copper (Cu). The film sheet 220 may be a flexible printed circuit board for mass production.

Although this film sheet 220 connects a plurality of conductive pads 210, it does not have a one-to-one correspondence with the insulating silicone rubber 110. That is, the film sheet 220 has an open cell (net-eye) structure by the net N, and the film sheet 220 corresponding to the insulating silicone rubber 110 is opened.

As described above, the film sheet 220 is opened by the open cell so that the open cell is filled with the insulating liquid silicone resin, and the insulating silicone rubber 110 filled in the open cell prevents the conductive pad 210 from being separated while enhancing the overall durability So that the shock can be easily absorbed during the inspection.

Therefore, the FPCB film 200 having the open cell C can include a PI (polyimide) film which is easy to pattern design by using a screen printing or a photolithography process and has excellent workability. At the same time, since the space in which the silicon can escape by the open cell C is provided, the durability of the test socket can be strengthened as a whole, and the stroke can be greatly improved.

Particularly, the above-described open cell C is strengthened by independent individual contacts of the conductive pads 210 by solving the rigidity as compared with covering the whole, thereby dispersing the compressive load due to the contact during the test process, .

On the other hand, the FPCB film 200 further includes an aligning cell A in the open cell C between the conductive pads 210. The aligned cell A is an open cell which is also open, but not the entire open cell as in the open cell C, but only to the extent that the later-described alignment pin of the mold is inserted. At least two such aligned cells (A) are present.

As described above, the problem that the conductive silicone rubber 110 and the conductive pads 210 of the FPCB film 200 are not aligned in a straight line, thereby causing a contact failure, can be solved. In particular, in order to perform electrical inspection of a semiconductor device implementing a fine pitch, a conductive connector of a test socket must provide a fine pitch. In fact, in the mold forming process, (Misalignment) often occurs.

3A to 3E are sectional views showing a configuration of a mold for manufacturing a test socket according to the present invention.

Referring to FIG. 3A, an FPCB film 200 having an open cell structure is prepared. The film sheet 220 is removed except for the net N connecting the neighboring conductive pads 210 in order to provide a space in which the silicon can escape. Thereby, the open cell C is provided. The net N extends in the lateral and longitudinal directions of the conductive pad 210 and surrounds it in the conductive pad 210 portion.

Meanwhile, the center of the conductive pad 210 is provided with an open hole 212 through which silicon can escape. The open hole 212 is filled with silicon to prevent the conductive pad 210 from being detached from the test socket 100. The conductive pads 210 are impacted by the conductive balls by the repetitive test of several thousand times or more, and if the conductive pads 210 are damaged, the entire test socket 100 may need to be replaced.

At least two of the above-described open cells C may be composed of the aligned cells A. The aligned cell (A) is not a space in which silicon escapes, but is a space into which a mold alignment pin is inserted.

Referring to FIG. 3B, a mold 300 for a test socket 100 including a lower mold 310 and an upper mold 320 is prepared.

The lower mold 310 is formed with numerous irregularities that determine the shapes of the conductive silicone rubber 120 and the insulating silicone rubber 110. The concave groove 312 in the concavity and convexity is a space into which the insulating liquid silicone resin is injected. The convex pin 314 in the concave and convex portions remains as an empty space after the injection molding, and is filled with the conductive liquid silicone resin by a process to be described later. One end of the lower mold 310 may be provided with an injection port (not shown) for injecting an insulating liquid silicone resin.

A space in which the FPCB film 200 is seated is provided in the upper mold 320. As described above, it is possible to prevent the inconsistency between the conductive pad 210 and the conductive silicone rubber 120 and to prevent the FPCB film 200 from moving due to the pressure of silicone when insulative liquid silicone resin is injected, (322) are provided.

Referring to FIG. 3C, the FPCB film 200 is mounted on the upper mold 320. At this time, the alignment pin (322) is inserted into the alignment cell (A). Then, the SUS base film 140 is disposed between the upper mold 320 and the lower mold 310.

Referring to FIG. 3D, when the upper and lower dies 320 and 310 are assembled, an insulating liquid silicone resin is injected between the upper and lower dies 320 and 310 through an injection port (not shown).

At this time, a plurality of convex pins 314 are present in the lower mold 310 and the convex pins 314 are formed in through holes (not shown) when the insulating liquid silicone resin is injected into the molds 320 and 310 102, and the through-hole 102 performs a space function of filling the liquid conductive silicone resin.

Referring to FIG. 3E, the upper and lower molds 320 and 310 are separated and the body of the test socket 100 is removed. The above-described through hole 102 is formed in the body of the test socket 100.

Referring again to FIG. 1, a conductive liquid silicone resin is injected into the space to complete the test socket 100. Conductive liquid silicone resin includes conductive powder. As described above, the body of the test socket 100 has electrical insulation, but the conductive liquid silicone resin filled in the through hole 102 of the present invention may include conductive powder.

The conductive powder may be composed of iron, nickel, cobalt or other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core. At this time, the test socket is completed through curing of the conductive liquid silicone resin, and the gap between the conductive powders can be reduced by applying the vertical pressure to the silicone rubber simultaneously with the curing process or before the curing process.

Accordingly, the test socket 100 of the present invention can be disposed between the semiconductor device and the test device, and the electrical characteristics of the semiconductor device can be inspected.

For example, by placing the test socket 100 on the test equipment and vertically pressing the semiconductor device on the test socket 100, the lead terminal of the semiconductor device and the test terminal of the test equipment are connected to the test socket 100, Of the conductive silicon rubber.

This makes it possible to check the electrical characteristics of the semiconductor device by forming an electrical flow between the lead terminal of the semiconductor device and the test terminal of the test device. At this time, the conductive silicone rubber provides elasticity to minimize damage to the device and to provide conductivity through the particles to improve inspection efficiency.

As described above, the present invention is based on a technical idea of a structure of an FPCB film which provides an open cell for exposing a net and silicone rubber by opening a part of a top film and connecting conductive bumps in a lateral direction and a longitudinal direction Able to know. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: Test Socket 110: Insulated Silicone Rubber
120: conductive silicone rubber 200: FPCB film
210: conductive pad 220: film sheet

Claims (8)

An insulative silicone rubber comprising a body between a semiconductor device and a test device to absorb impact during inspection and having a plurality of through holes at regular intervals;
A conductive silicone rubber that electrically connects the semiconductor device and the test device by filling the through hole with conductive liquid silicone; And
And a FPCB film integrally formed on one side of the insulating silicone rubber and the conductive silicone rubber corresponding to the semiconductor device, the FPCB film partially open corresponding to the insulating silicone rubber. The method according to claim 1,
In the FPCB film,
A conductive pad corresponding to the conductive silicone rubber, and
And a film sheet corresponding to the insulating silicone rubber,
Wherein the film sheet connects and supports the neighboring conductive pads by a net. 3. The method of claim 2,
Wherein the film sheet has an open cell (or net) structure by the net, the film sheet is opened by the open cell so that the open cell is filled with an insulating silicone rubber, Wherein the rubber prevents the detachment of the conductive pad and absorbs the shock during the inspection. 3. The method of claim 2,
Wherein the FPCB film has an open cell (or net) structure by the net, and the film sheet is opened by the alignment cell so that there is a mismatch between the conductive silicone rubber and the conductive pad Thereby preventing contact falsification due to the contact. A plurality of conductive pads;
A net connecting the conductive pads in the horizontal and vertical directions; And
And an open cell formed by the net. 6. The method of claim 5,
The net partially surrounds the conductive pads,
Wherein the conductive pad has an open hole at the center thereof. The method according to claim 6,
Wherein at least two of the open cells are aligned cells in which pins can be inserted. A method of manufacturing a test socket according to claim 1,
Preparing an FPCB film including the open cell and the aligned cell;
Preparing a lower mold having concave and convex shapes in which concave grooves and convex fins are repeated;
Preparing an upper mold including the alignment pins;
Placing the FPCB film on the upper mold by inserting the alignment cell into the alignment pins;
Inserting the insulating liquid silicon into the concave groove and escaping to the open cell by inserting the insulating liquid silicon after assembling the lower mold and the upper mold;
Separating the lower mold and the upper mold to form an insulating silicone rubber integrally formed with the FPCB film and having the through hole; And
And injecting conductive liquid silicon into the through hole to complete the test socket.

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