KR20200137625A - A test socket and maufacturing method thereof - Google Patents

Abstract

According to one embodiment of the present invention, provided is a test socket, which is the test socket for electrically connecting an upper device and a lower device. The test socket comprises: a body portion having a plurality of through holes penetrating in a vertical direction; and a plurality of conductive portions installed in each of the plurality of through holes and forming a signal line in the vertical direction. The conductive portion integrally forms a conductive body having a diameter smaller than the diameter of the through hole, an upper end extending to the top of the conductive body to have a diameter larger than the diameter of the conductive body, and a lower end extending to the bottom of the conductive body to have a diameter larger than the diameter of the conductive body, is installed to surround the outer circumferential surface of the conductive body between the upper and lower parts, and is provided with an elastic spring compressed by pressure in a vertical direction in a space between an inner wall of the through hole and the inner wall and providing restoration force to the upper end and the lower end.

Description

Test socket and manufacturing method thereof {A TEST SOCKET AND MAUFACTURING METHOD THEREOF}

The present invention relates to a test socket and a method of manufacturing the same, and in detail, by compression and restoration of a conductive part in the vertical direction, it is not affected by the lateral deformation of the through hole even when the upper device is repeatedly pressed, and the upper device is stably It relates to a test socket that can electrically connect the and lower devices, and a method of manufacturing the same.

A semiconductor device undergoes a manufacturing process and then performs an inspection to determine whether or not the electrical performance is good or bad. The test of a semiconductor device is performed in a state in which a semiconductor test socket (or a contactor or connector) formed so as to be in electrical contact with a terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board. In addition, the semiconductor test socket is used in a burn-in test process during the manufacturing process of a semiconductor device in addition to the final pass/fail inspection of a semiconductor device.

According to the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also becoming finer, and accordingly, a method of forming minute gaps between conductive patterns of test sockets is required.

However, there is a limitation in manufacturing a semiconductor test socket for testing integrated semiconductor devices with the existing pogo-pin type semiconductor test socket. 1 and 2 are views showing an example of a conventional pogo-pin type semiconductor test socket disclosed in Korean Laid-Open Patent Publication No. 10-2011-0065047.

Referring to FIGS. 1 and 2, the conventional semiconductor test socket 1100 includes a housing 1110 in which a through hole 1111 is formed in a vertical direction at a position corresponding to the terminal 1131 of the semiconductor device 1130, A pogo-pin 1120 mounted in the through hole 1111 of the housing 1110 to electrically connect the terminal 1131 of the semiconductor device 1130 and the pad 1141 of the test apparatus 1140 Consists of

The configuration of the pogo-pin 1120 includes a barrel 1124 that is used as a pogo-pin body and has a cylindrical shape with an empty inside, and is formed on the lower side of the barrel 1124. The contact tip 1123 and the spring 1122 connected to the contact tip 1123 in the barrel 1124 to perform contraction and expansion movement, and the spring 1122 connected to the contact tip 1123 are connected to the opposite side of the semiconductor device ( It is composed of a contact pin 1121 that performs vertical motion according to the contact with the 1130.

At this time, the spring 1122 contracts and expands while absorbing the mechanical shock transmitted to the contact pin 1121 and the contact tip 1123, and the terminal 1131 of the semiconductor device 1130 and the test apparatus 1140 The pad 1141 is electrically connected to inspect whether there is an electrical defect.

However, the conventional pogo-pin type semiconductor test socket as described above uses a physical spring to maintain the elasticity in the vertical direction, and the spring and pin are inserted into the barrel, and the barrel is Since it must be inserted into the through hole of the housing again, the process is complicated, and the manufacturing price increases due to the complexity of the process.

In addition, the physical configuration itself for realizing an electrical contact structure having elasticity in the vertical direction has a limitation in implementing a fine pitch, and it is applied to an integrated semiconductor device in recent years, and has reached the limit.

In addition, as shown in Figs. 1 and 2, the pogo-pin type semiconductor test socket is connected with a connection tip 1123, a spring 1122, and a connection pin 1121 in the upper and lower directions. There is a limit to reducing the length in the vertical direction because it has a structure that can be used, but such a limit on the length acts as a limit for testing high-speed devices.

3 is a diagram showing a cross section of a conventional semiconductor test apparatus 10 of a PCR socket type.

Referring to FIG. 3, in the conventional PCR socket type semiconductor test socket 10, a perforation pattern is formed in an insulating silicon body 11, and the vertical direction is made by conductive powder 12 filled in the perforated pattern. Conductive patterns are formed. The PCR-type semiconductor test socket 10 has an advantage that a fine pitch can be implemented.

However, in the PCR type semiconductor test socket 10, when the conductive powder 12 filled in the perforated pattern contacts the terminal 21 of the semiconductor element 20 and the terminal 31 of the inspection circuit board 30 In that conductivity is formed by the generated pressure, as shown in the enlarged view of FIG. 1B, the conductive powder 12 is applied by the pressure applied when the semiconductor device 20 and the inspection circuit board 30 contact each other. ) Spreads sideways, there is a drawback of being limited in thickness formation in the vertical direction.

In addition, in the case of the PCR type, there is a problem in that contact failure occurs between the semiconductor device and the test circuit board as the conductive powder spreads due to the pressure generated when the semiconductor device and the test circuit board contact each other.

On the other hand, semiconductor test sockets are also used in structures that electrically connect two devices in addition to testing semiconductor devices. As a representative example, it is applied as an interposer that connects pins of the CPU and terminals of the board between a board and a CPU used in a high-speed CPU, such as a large-capacity server.

In the case of a CPU used in a high-capacity server, the area is wider than that of a general PC and the number of pins is more than 1000 in many cases. If it is directly contacted with the terminal of the board, contact failure may occur. A pogo-pin type interposer elastically connects the two devices in the vertical direction.

However, in the case of a Pogo-pin type interposer, as described above, there is a limitation in applying to a CPU whose pitch interval is narrowed due to the limitation of the pitch, as well as the length in the vertical direction. Due to the limitations, it is difficult to keep up with the speed of the CPU operating at high speed.

In the case of the PCR-type interposer, when the upper device and the lower device are electrically connected, the thicker the interposer is, the lower the cohesive force between the conductive powders, and thus there is a problem in that signal transmission is not properly performed.

The present invention is not affected by the lateral deformation of the through hole even when the upper device is repeatedly pressed by compressing and restoring the elastic material of the conductive part and the elastic spring in the vertical direction, stably electrically connecting the upper device and the lower device. It aims to provide a test socket that can be used.

In addition, an object of the present invention is to provide a method of manufacturing a test socket having a plurality of conductive parts provided with an elastic spring surrounding an outer circumferential surface of a conductive body by filling and curing a liquid conductive material in a mold.

A test socket according to an embodiment of the present invention is a test socket for electrically connecting an upper device and a lower device, comprising: a body portion having a plurality of through holes penetrating in an up-down direction; And a plurality of conductive parts installed in each of the plurality of through holes to form a signal line in the vertical direction, wherein the conductive part is conductive to have a conductive body having a diameter smaller than the diameter of the through hole and a diameter larger than the diameter of the conductive body. The upper part extending to the upper part of the body and the lower part extending to the lower part of the conductive body to have a diameter larger than the diameter of the conductive body are integrally formed, and installed to surround the outer circumferential surface of the conductive body between the upper part and the lower part, and the inner wall of the through hole In the space between the and the conductive body, it is preferable that an elastic spring is provided that is compressed by pressing in the vertical direction, and when the pressure is removed, the compression is released and provides a restoring force to the upper and lower portions.

In an embodiment of the present invention, it is preferable that the elastic spring has conductivity, and thus forms a signal line while electrically contacting the upper and lower ends when the upper device is pressed.

In one embodiment of the present invention, it is preferable that the conductive part is formed by mixing and curing a conductive powder in a liquid elastic material.

In an embodiment of the present invention, the upper cover further includes an upper cover provided with a plurality of upper cover holes having a diameter smaller than the diameter of the through hole, and the upper cover is installed on the upper surface of the main body so that the upper end is exposed to the outside through the upper cover hole. As a result, it is preferable to prevent the through-hole of the conductive part from being separated from the top.

In an embodiment of the present invention, a lower cover further includes a lower cover provided with a plurality of lower cover holes having a diameter smaller than the diameter of the through hole, and the lower cover is installed on the lower surface of the main body so that the lower end is exposed to the outside through the lower cover hole. As a result, it is preferable to prevent the through-hole of the conductive part from being separated from the bottom.

On the other hand, in the manufacturing method of the test socket according to an embodiment of the present invention, (A) a first mold having a first mold opening having a T-shaped longitudinal section is prepared, and a liquid conductive material is filled with the first mold opening and Curing, forming a conductive body and a conductive portion integrally provided with an upper end extending to the upper portion of the conductive body; (B) A second mold is prepared in which the second upper mold and the second lower mold are detachably assembled in the vertical direction, and a liquid conductive material is filled and hardened into the second mold groove provided in the second lower mold to conduct conductivity. Forming a lower end of the unit; (C) placing a second upper mold provided with a second mold opening communicating with the second mold groove on the upper surface of the second lower mold, and inserting the elastic spring into the second mold opening and placing it on the upper surface of the lower end; (D) the conductive part is inserted into the second mold opening, the conductive body passing through the elastic spring and in contact with the lower end, being installed in the second upper mold; (E) As the flat mold is placed on the upper part of the second upper mold and presses the upper end of the conductive part, the conductive body and the lower end are integrally combined, and the elastic spring forms a conductive part surrounding the outer circumferential surface of the conductive body at the upper and lower parts. step; And (F) preparing a body portion having a plurality of through holes penetrating in the vertical direction, and inserting the conductive portions into the through holes, respectively.

In an embodiment of the present invention, in step (A), a third mold having a third mold opening having a diameter smaller than the diameter of the upper end is prepared, and the third mold is formed so that the third mold opening is positioned at the upper end. 1 step of being installed in the mold; And forming an upper protrusion protruding upward from the upper end while the liquid conductive material is filled with the third mold opening and the liquid conductive material is integrally cured with the upper end.

In one embodiment of the present invention, (G) an upper cover provided with a plurality of upper cover holes having a diameter smaller than the diameter of the through hole is prepared, and the upper cover is the upper surface of the main body so that the upper end is exposed to the outside through the upper cover hole. It is preferable to further include the step of being installed in.

In one embodiment of the present invention, (H) a lower cover provided with a plurality of lower cover holes having a diameter smaller than the diameter of the through hole is prepared, and the lower cover is the upper surface of the main body so that the lower end is exposed to the outside through the lower cover hole. It is preferable to further include the step of being installed in.

In the method of manufacturing a test socket according to another embodiment of the present invention, (A) a first mold having a first mold opening having a T-shaped longitudinal section is prepared, and a liquid conductive material is filled and cured through the first mold opening. , Forming a conductive body and a conductive portion integrally provided with a lower end extending to a lower portion of the conductive body; (B) an elastic spring is installed in the conductive portion to surround the outer peripheral surface of the conductive body; (C) A body portion with a plurality of through holes penetrating in the vertical direction and a lower cover with a plurality of lower cover holes having a diameter smaller than the diameter of the through hole are prepared, and the through hole is exposed to the outside through the lower cover hole. So, the step of installing the lower cover on the lower surface of the body portion; (D) inserting the conductive part into the through hole together with the elastic spring so that the lower end of the through hole is exposed to the outside through the lower cover hole; And (E) at a position spaced apart from the lower end, injecting a liquid conductive material into the upper portion of the through hole and curing together with the conductive body to form an upper end of the conductive part.

In a method of manufacturing a test socket according to another embodiment of the present invention, (A) a pin mold having a mold opening penetrating in the vertical direction is prepared, and a liquid conductive material is injected and cured through the mold opening, thereby forming a straight longitudinal section. Forming a conductive body having; (B) The main body with a plurality of through holes penetrating in the vertical direction, an upper cover and a lower cover are prepared, and an elastic spring is inserted into each of the plurality of through holes, preventing the elastic spring from being separated from the through hole To do this, an upper cover is installed on an upper surface of the main body, and a lower cover is installed on a lower surface of the main body; (C) preparing a mold for pin bonding in which a mold groove is provided, a liquid conductive material is injected into the mold groove, and then placing the body part on the upper surface of the pin bonding mold so that the through hole corresponds to the mold groove; (D) the conductive body is inserted into the through hole, the conductive body is cured together with the liquid conductive material in the mold groove; And (E) a step of hardening the conductive body together with the liquid conductive material by injecting a liquid conductive material into the through hole at the top of the conductive body.

In an embodiment of the present invention, it is preferable that the elastic spring has conductivity, so that when the upper device is pressed, a signal line is formed in the vertical direction together with the conductive body while being in electrical contact with the upper and lower ends.

In one embodiment of the present invention, the liquid conductive material is preferably a liquid elastic material mixed with a conductive powder.

The present invention is not affected by the lateral deformation of the through hole even when the upper device is repeatedly pressed by compressing and restoring the elastic material of the conductive part and the elastic spring in the vertical direction, stably electrically connecting the upper device and the lower device. I can.

Unlike the conventional PCR-type test socket, the present invention is a method of filling and curing a liquid conductive material mixed with a conductive powder and a liquid elastic material into a mold, and then manufacturing the conductive part in a pin shape having elasticity in the vertical direction. , It is manufactured by inserting the conductive part into the through hole provided in the main body.

Accordingly, in the present invention, the conductive part has elasticity in the vertical direction by the elastic spring, so even if the shape of the through hole is deformed while the through hole is pressed laterally when the upper device is pressed, the conductive part is not affected by the lateral deformation of the through hole. , It is possible to prevent the lateral spread of the conductive powder due to the lateral deformation of the through hole, which was a problem of the conventional PCR type.

In addition, in the present invention, since the elastic spring has conductivity, when the upper device is pressed, the elastic spring contacts the upper and lower ends of the conductive part, forming a signal line together with the conductive body, so that the test socket is manufactured as an interposer, As the thickness of the poser is thicker, the cohesive force between the conductive powders decreases, thereby solving the problem of improper signal transmission.

The present invention is a method of filling and curing a liquid conductive material in a mold, and a plurality of conductive portions can be manufactured at once, thereby reducing manufacturing cost and improving manufacturing efficiency compared to manufacturing a pogo pin.

1 and 2 are views for explaining a conventional pogo-pin type semiconductor test socket,
3 is a diagram for explaining a conventional semiconductor test apparatus of the PCR socket type,
4 and 5 are diagrams for explaining a test socket according to a first embodiment of the present invention.
6 and 7 are views for explaining a test socket according to a second embodiment of the present invention.
8 is a view for explaining a test socket according to a third embodiment of the present invention.
9 is a view for explaining a test socket according to a fourth embodiment of the present invention.
10 is a view for explaining a test socket according to a fifth embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a description will be given of a test socket and a method of manufacturing the test socket according to an embodiment of the present invention. The present invention can be used as a test socket for testing the performance of an upper device, and can also be used as an interposer.

● First embodiment

Hereinafter, a test socket 100 and a method of manufacturing a test socket according to an embodiment of the present invention will be described with reference to FIGS. 4 and 5.

The test socket 100 according to an embodiment of the present invention is a test socket that electrically connects the upper device 10 and the lower device 20. The test socket 100 includes a body portion 110 and a conductive portion 120.

The body portion 110 has insulating properties. The body portion 110 may be made of silicone having insulating properties and predetermined elasticity. The body portion 110 is provided with a plurality of through holes 111 penetrating in the vertical direction. The plurality of through holes 111 are provided at pitch intervals between terminals of the upper device 10. A conductive part 120 is installed in each through hole 111.

The conductive parts 120 are installed in each of the plurality of through holes 111 to form signal lines in the vertical direction. The conductive part 120 electrically connects the terminal of the upper device 10 and the terminal of the lower device 20.

The conductive part 120 is formed by mixing and curing conductive powder in a liquid elastic material. As the conductive powder, any one of nickel powder, gold-plated nickel powder, or silver-plated nickel powder may be used.

The conductive part 120 includes a conductive body 121, an upper end 122 extending from an upper portion of the conductive body 121, and a lower end 123 extending from a lower portion of the conductive body 121 in an integrated manner. The conductive part 120 has a shape having an I-shaped longitudinal section. The conductive body 121 has a diameter smaller than the diameter of the through hole 111. Further, the upper end 122 and the lower end 123 have a diameter larger than the diameter of the conductive body 121.

The conductive part 120 includes an elastic spring 125 surrounding the outer circumferential surface of the conductive body 121. The elastic spring 125 is compressed in the vertical direction between the upper end 122 and the lower end 123 by the force pressed by the upper end 122 when the upper device 10 is pressed. In addition, when the pressure of the upper device 10 is removed, the elastic spring 125 provides a restoring force to the upper part 122 and the lower part 123.

The elastic spring 125 has conductivity, and when the upper device 10 is pressed, it may form a signal line together with the conductive body 121 while being in electrical contact with the upper end 122 and the lower end 123.

In the present invention, when the upper device 10 presses the conductive part 120, the elastic material of the conductive part 120 and the elastic spring 125 are compressed and restored in the vertical direction to prevent the lateral spread of the conductive powder. Thus, it is possible to stably electrically connect the upper device 10 and the lower device 20.

Hereinafter, a method of manufacturing a test socket according to a first embodiment of the present invention will be described with reference to FIG. 5.

As shown in Fig. 5(a), a first mold 30 provided with a first mold opening 31 having a T-shaped longitudinal section is prepared. It is preferable that the first mold 30 has excellent heat resistance and is made of a material that can be easily separated from the first mold opening 31 after the liquid conductive material 170a is cured at the first mold opening 31. . The first mold 30 is made of a Teflon-based material.

As shown in FIG. 5(b), the liquid conductive material 170a is filled with the first mold opening 31. The liquid conductive material 170a is a mixture of a liquid elastic material, a conductive powder, and an adhesive component. Here, the conductive powder is preferably any one of nickel powder, gold-plated nickel powder, or silver-plated nickel powder.

As shown in Fig. 5(c), while the liquid conductive material 170a is cured in the first mold 30, the conductive body 121 and the upper end 122 extending upward of the conductive body 121 The conductive part 120 is formed integrally. The conductive part 120 has a T-shaped longitudinal section.

As shown in FIG. 5(d), a second mold 40 in which the second upper mold 42 and the second lower mold 41 are detachably assembled in the vertical direction is prepared.

The second lower mold 41 is provided with a second mold groove 41a. Here, the second mold groove 41a has a larger diameter than the conductive body 121. In addition, a second mold opening 42a is provided in the second upper mold 42. It is preferable that the second mold 40 has excellent heat resistance, and is made of a material in which the cured liquid conductive material 170a can be easily separated. The second mold 40 is made of a Teflon-based material.

As shown in FIG. 5(e), a liquid conductive material 170a is filled and hardened into the second mold groove 41a provided in the second lower mold 41, and the lower end 123 of the conductive part 120 ) Is formed.

As shown in Fig. 5(f), a second upper mold 42 provided with a second mold opening 42a communicating with the second mold groove 41a is placed on the upper surface of the second lower mold 41 , The elastic spring 125 is inserted into the second mold opening 42a and placed on the upper surface of the lower end 123.

As shown in Fig. 5(g), the conductive part 120 having a T-shaped longitudinal section is inserted through the second mold opening 42a, so that the conductive body 121 penetrates the elastic spring 125 and the lower end 123 ) Is installed in the second upper mold 42 to be in contact with.

As shown in Fig. 5(h), as the flat mold is placed on the second upper mold 42 and presses the upper end 122 of the conductive part 120, the conductive body 121 and the lower end 123 ) Are integrally combined.

As shown in FIG. 5(i), the conductive part 120 is manufactured so that the elastic spring 125 surrounds the outer circumferential surface of the conductive body 121 at the upper end 122 and the lower end 123.

Thereafter, as shown in FIG. 4, a plurality of conductive portions 120 are inserted into a plurality of through holes 111 provided in the body portion 110. When the material of the body part 110 and the elastic material which is one of the materials constituting the conductive part 120 is the same as silicon, when the conductive part 120 is inserted into the through hole 111, the through hole 111 The portion where the inner wall and the upper portion 122 abut, and the portion where the inner wall and the lower end 123 of the through hole 111 abut, are coupled to the body portion 110 due to the stickiness of the silicone. For this reason, the present invention allows the conductive part 120 to be installed on the main body 110 without a configuration (eg, an upper cover and/or a lower cover) to prevent separation of the conductive part 120 from the through hole 111. have.

● Second embodiment

Hereinafter, a test socket 200 and a method of manufacturing a test socket according to a second embodiment of the present invention will be described with reference to FIGS. 6 and 7.

The test socket 200 according to an embodiment of the present invention includes a body part 210, a conductive part 220, an upper cover 240 and a lower cover 230.

In this embodiment, in order to avoid repetition of the description, a description of the main body 210 having the same configuration as that of the first embodiment will be omitted.

The conductive part 220 according to the present embodiment differs only in the structure of the upper part 222 and the lower part 223 as compared with the first embodiment described above. In this embodiment, in order to avoid repetition of the description, a description of a portion in which the same elastic spring 225 as in the first embodiment is installed surrounding the outer circumferential surface of the conductive body 221 will be omitted.

In this embodiment, an upper protrusion 222a is provided at the upper end 222 of the conductive part 220. The upper protrusion 222a has a diameter smaller than the diameter of the upper end 222 and protrudes above the upper end 222.

The upper cover 240 is provided with a plurality of upper cover holes 241 having a diameter smaller than the diameter of the through hole 211. The upper cover 240 is installed on the upper surface of the main body 210 so that the upper end 222 is exposed to the outside through the upper cover hole 241. In this case, the upper protrusion 222a passes through the upper cover hole 241 and is exposed to the outside. The upper protrusion 222a is a portion in electrical contact with the terminal of the upper device 10 when the upper device 10 presses the test socket 200. The upper cover 240 may prevent the conductive part 220 from being separated from the top of the through hole 211.

The lower cover 230 is provided with a plurality of lower cover holes 231 having a diameter smaller than the diameter of the through hole 211. The lower cover 230 is installed on the lower surface of the main body 210 so that the lower end 223 is exposed to the outside through the lower cover hole 231.

At this time, a portion of the lower end 223 protruding downward is exposed to the outside through the lower cover hole 231. The lower part 223 is a part that is in electrical contact with the terminal of the lower device 20. The lower cover 230 prevents the conductive part 220 from being separated from the bottom of the through hole 211.

In addition, in the present invention, even if the conductive part 220 is inserted into the through hole to move in the vertical direction of the through hole 211, the conductive part 220 is formed by the lower cover 230 and the upper cover 230. 211) can be prevented.

In addition, in the present invention, the conductive part 220 has elasticity in the vertical direction by the elastic spring 225, and when the upper device 10 is pressed, the through hole 211 is pressed in the lateral direction and the shape of the through hole 211 Even if this is deformed, the conductive part 220 is not affected by the lateral deformation of the through hole 211, so that the lateral spread of the conductive powder due to the lateral deformation of the through hole 211, which was a problem of the conventional PCR type. Can be prevented.

In addition, in the present invention, the elastic spring 225 has conductivity, so that when the upper device 10 is pressed, the elastic spring 225 comes into contact with the upper and lower ends of the conductive part 220, and signals along with the conductive body 221 As the line is formed, when the test socket is manufactured as an interposer, the thicker the interposer is, the less cohesive force between the conductive powders decreases, thereby solving the problem of improper signal transmission.

Hereinafter, a method of manufacturing a test socket according to the present embodiment will be described with reference to FIG. 7.

As shown in Fig. 7(a), a first mold 30 provided with a first mold opening 31 having a T-shaped longitudinal section is prepared. It is preferable that the first mold 30 has excellent heat resistance and is made of a material that can be easily separated from the first mold opening 31 after the liquid conductive material 170a is cured at the first mold opening 31. . The first mold 30 is made of a Teflon-based material.

As shown in Fig. 7(b), a liquid conductive material 170a is filled with the first mold opening 31. The liquid conductive material 170a is a mixture of a liquid elastic material, a conductive powder, and an adhesive component. Here, the conductive powder is preferably any one of nickel powder, gold-plated nickel powder, or silver-plated nickel powder.

As shown in FIG. 7(c), a third mold 60 provided with a third mold opening 61 having a diameter smaller than the diameter of the upper end portion 222 is prepared. In addition, the third mold 60 is installed in the first mold 30 so that the third mold opening 61 is positioned at the upper end 222. It is preferable that the third mold 60 has excellent heat resistance and is made of a material in which the cured liquid conductive material 170a can be easily separated. The third mold 60 is made of a Teflon-based material.

As shown in Fig. 7(d), the liquid conductive material 170a is filled with the third mold opening 61. The liquid conductive material 170a is integrally cured with the upper end 222. Accordingly, an upper protrusion 222a is formed on the upper end 222. The upper protrusion 222a has a diameter smaller than the diameter of the upper end 222.

As shown in Fig. 7(e), as the flat mold 50 is placed on the third mold 60 and presses the conductive part 220, the upper end 222 and the upper protrusion 222a are integrated. Is formed by

As shown in FIG. 7(f), the liquid conductive material 170a is cured by the first mold 30 and the third mold 60, while the conductive body 221 and the conductive body 221 The upper protrusion 222a protruding upward of the upper end 222 and the upper protrusion 222a extending to the upper part of the upper part 222 are formed as a conductive part 220a provided integrally.

As shown in Fig. 7(g), a second mold 40 in which the second upper mold 42 and the second lower mold 41 are detachably assembled in the vertical direction is prepared. It is preferable that the second mold 40 has excellent heat resistance, and is made of a material in which the cured liquid conductive material 170a can be easily separated. The second mold 40 is made of a Teflon-based material.

The second lower mold 41 is provided with a second mold groove 41a. Here, the second mold groove 41a is provided so that the inner wall of the second mold groove 41a extends in a T-shaped longitudinal section in the vertical direction, and the diameter of the upper portion of the second mold groove 41a is larger than the diameter of the conductive body 221. In addition, a second mold opening 42a is provided in the second upper mold 42.

As shown in FIG. 7(h), the liquid conductive material 170a is filled and hardened into the second mold groove 41a provided in the second lower mold 41, and the lower end 223 of the conductive part 220 ) Is formed. At this time, the lower end 223 is manufactured in the shape of the second mold groove 41a.

As shown in Fig. 7(i), the second upper mold 42 provided with the second mold opening 42a communicating with the second mold groove 41a is placed on the upper surface of the second lower mold 41 , The elastic spring 225 is inserted into the second mold opening 42a and placed on the upper surface of the lower end 223.

As shown in FIG. 7(j), the conductive part 220a having a T-shaped longitudinal section is inserted into the second mold opening 42a, so that the conductive body 221 penetrates the elastic spring 225 and the lower end 223 ) Is installed in the second upper mold 42 to be in contact with.

As shown in FIG. 7(k), as the flat plate mold 50 is placed on the second upper mold 42 and presses the upper end 222 of the conductive part 220a, the conductive body 221 and The lower end 223 is integrally coupled.

As shown in Fig. 7(j), the conductive part 220 is manufactured so that the elastic spring 225 surrounds the outer circumferential surface of the conductive body 221 at the upper end 222 and the lower end 223.

Thereafter, the main body 210, the upper cover 240 and the lower cover 230 are prepared. As shown in FIG. 6, the body part 210 is provided with a plurality of through holes 211 in the vertical direction. The upper cover 240 is provided with a plurality of upper cover holes 241 having a diameter smaller than the diameter of the through hole 211. Further, the lower cover 230 is provided with a plurality of lower cover holes 231 having a diameter smaller than the diameter of the through hole 211.

The conductive parts 220 manufactured by the process shown in FIG. 7 are respectively inserted into the through holes 211 of the body part 210. Subsequently, the lower cover 230 is installed on the lower surface of the main body 210 so that the lower end 223 is exposed to the outside through the lower cover hole 231. In addition, the upper cover 240 is installed on the upper surface of the main body 210 so that the upper end 222 is exposed to the outside through the upper cover hole 241.

The present invention is a method of filling and curing a liquid conductive material in a mold, so that a plurality of conductive parts 220 can be manufactured at once, thereby reducing manufacturing cost and improving manufacturing efficiency compared to manufacturing a pogo pin.

● Third embodiment

Hereinafter, a test socket 300 according to a third embodiment of the present invention will be described with reference to FIG. 8.

The test socket 300 according to an embodiment of the present invention includes a main body 310, a conductive part 320, and a lower cover 330. In this embodiment, the main body 310 and the lower cover 330 are the same as the second embodiment described above.

In the conductive part 320 according to the present embodiment, the process of forming the upper protrusion 322a on the upper end 322 in the above-described second embodiment (see FIGS. 7 (c) to (e)) is omitted, will be. The conductive part 320 according to the present embodiment is the same as the second embodiment described above except for the presence or absence of the upper protrusion, and a description thereof will be omitted hereinafter.

In the test socket 300 according to an embodiment of the present invention, the conductive parts 320 are respectively inserted into the through holes 311 of the body part 310. Subsequently, the lower cover 330 is installed on the lower surface of the main body 310 so that the lower end 323 is exposed to the outside through the lower cover hole 331. Thereafter, the upper end 322 of the conductive part 320 is coupled to the inner wall of the through hole 311 by a liquid elastic material (eg, silicon) 340 injected into the through hole 311.

In this embodiment, the conductive portion 320 is coupled to the inner wall of the through hole 311 while the upper portion 322 is cured with the liquid elastic material 340, whereas the lower portion 323 is coupled to the lower cover 330 Therefore, when the upper device 10 is pressed, the lower end 323 is moved into the through hole while in contact with the terminal of the lower device 20, and the elastic spring 325 is compressed.

Thereafter, when the pressure of the upper device 10 is removed, the elastic spring 325 provides a restoring force to the lower end 323 while the compression is released. Accordingly, the present invention is by compressing and restoring the elastic material of the conductive part 320 and the elastic spring 325 in the vertical direction, the lateral deformation of the through hole 311 even when repeatedly pressing the upper device 10 It is not affected by, and can stably electrically connect the upper device 10 and the lower device 20.

In the present invention, the conductive part 320 has elasticity in the vertical direction by the elastic spring 325, and when the upper device 10 is pressed, the through hole 311 is pressed in the lateral direction and the shape of the through hole 311 is deformed. Even if the conductive part 320 is not affected by the lateral deformation of the through hole 311, it is possible to prevent the lateral spread of the conductive powder due to the lateral deformation of the through hole 311, which was a problem of the conventional PCR type. I can.

In the present invention, the elastic spring 425 has conductivity, so that when the upper device 10 is pressed, the elastic spring 425 contacts the upper and lower ends of the conductive part 420, thereby providing a signal line together with the conductive body 421. As a result, when the test socket is manufactured as an interposer, as the thickness of the interposer increases, the cohesive force between the conductive powders decreases, thereby solving the problem of improper signal transmission.

● Fourth embodiment

Hereinafter, a test socket 400 according to a fourth embodiment of the present invention will be described with reference to FIG. 9.

The test socket 400 according to an embodiment of the present invention includes a body portion 410, a conductive portion 420, and a lower cover 430. In this embodiment, the body portion 410 and the lower cover 430 are the same as those of the second embodiment described above.

As shown in FIG. 9(a), the conductive part 420 according to this embodiment includes a conductive body 421, a lower end 423, and an elastic spring 425. The conductive part 420 is manufactured according to the process shown in FIGS. 7A to 7F described above in the second embodiment. Thereafter, the elastic spring 425 is installed to surround the conductive body 421.

As shown in FIG. 9(b), a main body 410 and a lower cover 430 are prepared. The body portion 410 and the lower cover 430 are the same as in the second embodiment described above. The lower cover 430 is installed on the lower surface of the main body 410 so that the through hole 411 is exposed to the outside through the lower cover hole 431. Thereafter, the conductive part 420 is inserted into the through hole 411 together with the elastic spring 425. In the through hole 411, the lower end 423 is exposed to the outside through the lower cover hole 431.

As shown in FIG. 9(c), a liquid conductive material 170a is injected into the upper portion of the through hole 411 to cure together with the conductive body 421, and the conductive part ( 420) to form an upper end.

However, in the conductive part 420 of the present invention, the lower part 423 is not coupled to the lower cover 430, so that when the upper device 10 is pressed, the lower part 423 is in contact with the terminal of the lower device 20. As it moves into the furnace through-hole 411, the elastic spring 425 is compressed.

When the pressure of the upper device 10 is removed, the elastic spring 425 provides a restoring force to the lower end 423 while the compression is released. Accordingly, the present invention deforms the through hole 411 in the lateral direction even when repeatedly pressing the upper device 10 by compressing and restoring the elastic material of the conductive part 420 and the elastic spring 425 in the vertical direction. It is not affected by, and can stably electrically connect the upper device 10 and the lower device 20.

In the present invention, the conductive part 420 has elasticity in the vertical direction by the elastic spring 425, and when the upper device 10 is pressed, the through hole 411 is pressed in the lateral direction and the shape of the through hole 411 is deformed. Even if the conductive part 420 is not affected by the lateral deformation of the through hole 411, it is possible to prevent the lateral spread of the conductive powder due to the lateral deformation of the through hole 411, which was a problem of the conventional PCR type. I can.

In the present invention, the elastic spring 425 has conductivity, so that when the upper device 10 is pressed, the elastic spring 425 is the upper end of the conductive part 420 (not shown, the liquid conductive material is the conductive body 421). When the test socket is manufactured as an interposer, the cohesive force between the conductive powder increases as the thickness of the interposer increases, as the signal line is formed with the conductive body 421 while contacting the upper part) and the lower part 423. It can solve the problem that signal transmission is not working properly.

● 5th embodiment

Hereinafter, a test socket 500 and a method of manufacturing the test socket according to a fifth embodiment of the present invention will be described with reference to FIG. 10.

As shown in Figure 10 (f), the test socket 500 according to an embodiment of the present invention includes a body portion 510, a conductive portion 520, an upper cover 540 and a lower cover 530 do. In this embodiment, the main body 510, the upper cover 540, and the lower cover 530 are the same as those of the second embodiment described above.

A method of manufacturing the test socket according to the present embodiment will be described as follows.

First, a pin mold (not shown) with a mold opening penetrating in the vertical direction is prepared. The mold opening is an opening with a straight longitudinal section. The liquid conductive material 170a is injected and cured through a mold opening (not shown). As shown in Figure 10 (a), the conductive body 521 separated from the pin mold has a straight longitudinal section.

As shown in FIG. 10(b), the elastic spring 525 is inserted into each of the plurality of through holes 511 provided in the main body 510. And, in order to prevent the elastic spring 525 from being separated from the through hole 511, an upper cover 540 is installed on the upper surface of the main body 510, and the lower cover 530 is on the lower surface of the main body 510. ) Is installed.

As shown in Fig. 10(c), a mold 80 for pin coupling with a mold groove is prepared. A liquid conductive material 170a is injected into the mold groove. The body portion 510 is placed on the upper surface of the pin coupling mold 80. At this time, the main body 510 is preferably installed in the pin coupling mold 80 so that the through hole 511 corresponds to the mold groove.

As shown in FIG. 10(d), the conductive body 521 is inserted into the through hole 511, and the lower portion of the conductive body 521 is cured together with the liquid conductive material 170a in the mold groove. The lower cover 530 is coupled to the lower end 523 of the conductive part 520 while the liquid conductive material 170a is injected into the through hole 511 and cured.

As shown in FIG. 10(e), from the top of the conductive body 521, a liquid conductive material 170a is injected into the through hole 511, so that the top of the conductive body 521 is a liquid conductive material ( 170a) and cured to form an upper end portion 522 of the conductive portion 520. While the liquid conductive material 170a is injected into the through hole 511 and cured, the upper cover 540 is coupled to the upper end 522 of the conductive part 520.

Thereafter, when the main body 510 is separated from the pin coupling mold 80, a test socket 500 is manufactured. 10(f) shows a test socket 500 according to an embodiment of the present invention.

In the present invention, the conductive part 520 is formed in a structure in which the elastic spring 525 surrounds the conductive body 521 between the upper end 522 and the lower end 523 of the conductive part 520, so that the upper device 10 Even when repeatedly pressurized, it is not affected by the lateral deformation of the through hole 511, so that the lateral spread of the conductive powder due to the lateral deformation of the through hole 511, which is a problem of the conventional PCR type, can be prevented.

In addition, in the present invention, the elastic spring 525 has conductivity, so when the upper device 10 is pressed, the elastic spring 525 contacts the upper end 522 and the lower end 523 of the conductive part 520, By forming the signal line together with the 521, when the test socket 500 is manufactured as an interposer, as the thickness of the interposer is thicker, the cohesive force between the conductive powders decreases, thereby solving the problem of improper signal transmission.

The present invention described above is not limited by the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the technical spirit of the present invention. It will be obvious to those who have the knowledge of

100, 200, 300, 400, 500: test socket
110, 210, 310, 410, 510: main body
120, 220, 320, 420, 520: conductive part
121, 221, 321, 421, 521: conductive body
125, 225, 325, 425, 525: elastic spring
230, 330, 430, 530: lower cover
240, 540: upper cover
170a: liquid conductive material 30: first mold
40: second mold 41: second lower mold
42: second upper mold 50: flat mold
60: third mold 80: pin bonding mold

Claims (13)

In the test socket that electrically connects the upper device and the lower device,
A body portion having a plurality of through holes penetrating in the vertical direction; And
Each of the plurality of through-holes, including a plurality of conductive parts to form a signal line in the vertical direction,
The conductive part,
A conductive body having a diameter smaller than the diameter of the through hole, an upper end extending to the upper portion of the conductive body to have a diameter larger than the diameter of the conductive body, and extending to the lower portion of the conductive body to have a diameter larger than the diameter of the conductive body The lower part is formed integrally,
It is installed to surround the outer circumferential surface of the conductive body between the upper end and the lower end, and in the space between the inner wall of the through hole and the conductive body, it is compressed by vertical pressure, and when the pressure is removed, the compression is released and the Test socket, characterized in that provided with an elastic spring providing a restoring force to the upper end and the lower end. The method of claim 1,
Wherein the elastic spring has conductivity, and when the upper device is pressed, the signal line is formed by being in electrical contact with the upper end and the lower end. The method of claim 1,
The conductive part is a test socket, characterized in that formed by mixing and curing a conductive powder in a liquid elastic material. The method of claim 1,
Further comprising an upper cover provided with a plurality of upper cover holes having a diameter smaller than the diameter of the through hole,
The upper cover is installed on the upper surface of the main body so that the upper end is exposed to the outside through the upper cover hole, so as to prevent separation of the through hole from the conductive part to the upper part. The method of claim 1,
Further comprising a lower cover provided with a plurality of lower cover holes having a diameter smaller than the diameter of the through hole,
The lower cover is installed on the lower surface of the main body so that the lower end is exposed to the outside through the lower cover hole to prevent the conductive part from being separated from the through hole to the lower side. (A) A first mold with a first mold opening having a T-shaped longitudinal section is prepared, and a liquid conductive material is filled and cured through the first mold opening, and the conductive body and the upper end extending to the top of the conductive body Forming a conductive part provided integrally;
(B) A second mold is prepared in which the second upper mold and the second lower mold are detachably assembled in the vertical direction, and a liquid conductive material is filled and cured into the second mold groove provided in the second lower mold, Forming a lower end of the conductive part;
(C) The second upper mold having a second mold opening in communication with the second mold groove is placed on the upper surface of the second lower mold, and an elastic spring is inserted through the second mold opening to the upper surface of the lower part. Step laid;
(D) being installed in the second upper mold so that the conductive part is inserted into the second mold opening so that the conductive body penetrates the elastic spring and contacts the lower end;
(E) As a plate-shaped mold is placed on the second upper mold and presses the upper end of the conductive part, the conductive body and the lower end are integrally coupled, so that the elastic spring is formed on the upper and lower ends of the conductive body. Forming a conductive portion surrounding the outer peripheral surface of the; And
(F) A method of manufacturing a test socket, comprising preparing a body portion having a plurality of through holes penetrating in the vertical direction, and inserting the conductive portions into the through holes, respectively. The method of claim 6, wherein the step (A),
Preparing a third mold having a third mold opening having a diameter smaller than that of the upper end portion, and installing the third mold on the first mold so that the third mold opening is positioned at the upper end; And
The third mold opening is filled with a liquid conductive material, and the liquid conductive material is integrally cured with the upper end, thereby forming an upper protrusion protruding upward from the upper end. How to make a test socket. The method of claim 6,
(G) preparing an upper cover provided with a plurality of upper cover holes having a diameter smaller than the diameter of the through hole, and installing the upper cover on the upper surface of the main body so that the upper end is exposed to the outside through the upper cover hole Method of manufacturing a test socket, characterized in that it further comprises. The method of claim 6,
(H) preparing a lower cover having a plurality of lower cover holes having a diameter smaller than the diameter of the through hole, and installing the lower cover on the upper surface of the main body so that the lower end is exposed to the outside through the lower cover hole Method of manufacturing a test socket, characterized in that it further comprises. (A) A first mold with a first mold opening having a T-shaped longitudinal section is prepared, and a liquid conductive material is filled and cured through the first mold opening, and the conductive body and the lower end extending to the lower portion of the conductive body Forming a conductive part provided integrally;
(B) installing the elastic spring on the conductive portion to surround the outer peripheral surface of the conductive body;
(C) A body portion having a plurality of through holes penetrating in the vertical direction and a lower cover having a plurality of lower cover holes having a diameter smaller than the diameter of the through hole are prepared, and the through hole is formed through the lower cover hole. Installing the lower cover on a lower surface of the main body to be exposed to the outside;
(D) inserting the conductive part into the through hole together with the elastic spring so that the lower end of the through hole is exposed to the outside through the lower cover hole; And
(E) at a position spaced apart from the lower end, the liquid conductive material is injected into the upper portion of the through hole and cured together with the conductive body to form an upper end of the conductive part. Manufacturing method. In the manufacturing method of the test socket provided with a conductive part electrically connecting an upper device and a lower device,
(A) preparing a pin mold having a mold opening penetrating in the vertical direction, and injecting and curing a liquid conductive material through the mold opening to form a conductive body having a straight longitudinal section;
(B) A body portion having a plurality of through holes penetrating in the vertical direction, an upper cover and a lower cover are prepared, and an elastic spring is inserted into each of the plurality of through holes, and the elastic spring is inserted in the through hole. In order to prevent separation, the upper cover is installed on the upper surface of the main body, and the lower cover is installed on the lower surface of the main body;
(C) A mold for pin coupling with a mold groove is prepared, and after the liquid conductive material is injected into the mold groove, the main body part is on the upper surface of the pin coupling mold so that the through hole corresponds to the mold groove. Step laid;
(D) the conductive body is inserted into the through hole, and the conductive body is cured together with the liquid conductive material in the mold groove; And
(E) a method of manufacturing a test socket, comprising: injecting a liquid conductive material into the through hole from an upper portion of the conductive body, and curing the conductive body together with the liquid conductive material. The method according to any one of claims 6, 10, and 11,
The elastic spring has conductivity, and when the upper device is pressed, a signal line is formed in a vertical direction with the conductive body while being in electrical contact with the upper end and the lower end. The method according to any one of claims 6, 10, and 11,
The liquid conductive material is a method of manufacturing a test socket, characterized in that formed by mixing and curing a conductive powder with a liquid elastic material.

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