KR101833009B1

KR101833009B1 - Test socket having magnetic arrangement of conductive particle using ferrite wire and method for manufacturing thereof

Info

Publication number: KR101833009B1
Application number: KR1020160032586A
Authority: KR
Inventors: 박성규; 전진국
Original assignee: 주식회사 오킨스전자
Priority date: 2016-03-18
Filing date: 2016-03-18
Publication date: 2018-02-27
Also published as: KR20170108522A

Abstract

A method of manufacturing a test socket of the present invention includes the steps of preparing a first PCB film, magnetizing a conductive wire, preparing an insulating silicone rubber including a through hole, forming the magnetized conductive wire on the first PCB film A step of mounting an insulating silicone rubber on the first PCB film, a step of installing a second PCB film on the surface of the insulating silicone rubber, and filling the through hole with the liquid conductive silicone rubber. According to the structure of the present invention as described above, the conductive particles are not scattered despite the repetitive test, and the inspection yield is maintained.

Description

TECHNICAL FIELD The present invention relates to a test socket in which conductive particles are magnetically arranged by magnetized conductive wires and a method of manufacturing the test socket.

The present invention relates to a test socket having conductive particles arranged by a magnetized conductive wire and a method of manufacturing a test socket in which conductive particles are magnetically aligned in the contact direction by a magnetized conductive wire More particularly, the present invention relates to a test socket for inspecting electrical characteristics of a semiconductor device manufactured through a semiconductor package manufacturing process before shipment, and a method of manufacturing the same.

In general, a processed semiconductor device is subjected to an electrical inspection process before being provided to a user. In the electrical inspection process, the electrical characteristics of the semiconductor device are inspected using a test socket.

Conventional test sockets for testing semiconductor devices with QFN, MLF, LGA, BGA, QFP and SOP types include spring probe (pogo pin) method, stamping pin method, and pressure sensitive conductive rubber Rubber: PCR) method.

When radio frequency testing is required, such as RF (Radio Frequency) semiconductor devices, it is necessary to minimize the electrical path, so test sockets using short spring probes or plate pin of various shapes are being developed.

In recent years, the use of a pressurized conductive silicone rubber system using silicone rubber as an elastic material has been increasingly used because of the short conductive path and minimizing the damage to balls of a semiconductor device.

However, the pressure-conductive silicone rubber has various problems such as increased conductivity only when sufficient pressure is applied in the longitudinal direction.

First, in order to enhance the conductivity, even if the density of the conductive particles is increased, if the conductive particles are not anisotropic, they can not show the electrical characteristics in the contact direction.

Second, as the repetitive test proceeds, the conductive particles are scattered from the contact area. Therefore, the yield decreases with time. There is a need for a means to concentrate the conductive particles so as not to scatter them.

Finally, the pressure-conducting silicone rubber gradually loses its function after impact through repeated testing. At this time, we need a means to supplement it.

KR Patent Publication No. 10-2012-0138304

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a test socket in which conductive particles can be concentrated without being scattered in the longitudinal direction of the conductive connector, will be.

Another object of the present invention is to provide a test socket in which magnetic arrays of conductive particles can be formed on their own without using an external magnetic field and a method of manufacturing the same.

It is still another object of the present invention to provide a test socket and a method of manufacturing the same that can complement the conductive silicone rubber which is gradually lost by repeated testing.

According to an aspect of the present invention, there is provided a test socket including a first PCB film on which a plurality of first pads are formed, a conductive wire magnetized on the first pad, A conductive silicone rubber filled in the through hole and supporting the conductive wire, the conductive silicone rubber being provided in the through hole and having a plurality of through holes corresponding to the conductive wire, And a second PCB film provided on the insulating silicone rubber and connected to the conductive wire through a second pad.

According to another aspect of the present invention, a method of manufacturing a test socket of the present invention includes the steps of preparing a first PCB film, magnetizing a conductive wire, preparing an insulating silicone rubber including a through hole, A step of connecting the magnetized conductive wire to the electrically conductive wire, a step of installing an insulative silicone rubber on the first PCB film, a step of installing a second PCB film on the insulative silicone rubber, Lt; / RTI >

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since the density of the conductive particles in the direction of the contact is increased, inspection yield is maintained without providing sufficient pressure in the test.

Second, magnetized conductive wires are provided through the conductive silicone rubber to provide a magnetic field during magnetic alignment, and the inspection yield is greatly improved since conductive particles are not scattered in the contact direction despite repetitive testing.

Third, even if the conductive silicone rubber is lost due to repetitive testing, it is excellent because the conductive property is ensured by the conductive wire.

1 is a partially cutaway perspective view showing a configuration of a test socket according to the present invention;
Figs. 2 to 5 are cross-sectional views showing the manufacturing method of Fig.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the test socket according to the present invention will be described in detail with reference to the accompanying drawings.

1, a test socket 100 according to the present invention includes a first PCB 110 on which a plurality of first pads 102 are formed, a conductive wire 120 wire-bonded to the first pad 102, An insulating silicone rubber 130 mounted on the 1 PCB film 110 and having a plurality of through holes 122 corresponding to the conductive wires 120 and having conductive wires 120 mounted on the through holes 122, A conductive silicone rubber 160 filled in the through hole 122 and supporting the conductive wire 120 and a conductive silicone rubber 160 provided on the insulating silicone rubber 130 and connected to the conductive wire 120 through the second pad 132 And a second PCB film 140 formed on the second PCB 140.

The first pad 102 is fastened to one end of the conductive wire 120 by a bonding joint and the second pad 132 is fastened to the conductive wire 120 through an adhesive or a soldering joint It can be concluded with the other end of. The first pad 102 may contact the semiconductor device and the second pad 132 may contact the test device.

The first PCB film 110 or the second PCB film 140 may be a rigid printed circuit board (RIGID PCB) formed by printing copper (Cu) on an epoxy or phenol resin or a polyamide A flexible printed circuit board (Flexible PCB) that forms various circuit patterns by copper (Cu), gold (Ag), or other conductive material on a polyimide film may be used.

The conductive wire 120 may be plated with conductive gold (Ag) or nickel (Ni). The conductive wire 120 may vertically or slantly connect the first pad 102 and the second pad 132 between the first PCB substrate 110 and the second PCB substrate 140.

At this time, the conductive wire 120 does not necessarily have to be formed in a straight line shape so that the test socket 100 can be pressed by the semiconductor device while absorbing the impact and maintain the electrical connection at the time of inspection of the semiconductor device. By providing for example zigzag or helical spring, it can absorb physical impact and minimize damage.

In particular, the present invention includes a conductive wire in which the conductive wire 120 is magnetized. The conductive particles mixed in the conductive silicone rubber by the magnetized conductive wire 120 are gathered around the conductive wire 120 by the magnetic field, and the conductive density becomes high. Further, the anisotropy of the conductive silicone rubber 160 in the vertical direction is strengthened, so that the conductive characteristic is enhanced even with a small pressure at the time of pressing.

When the conductive silicone rubber 160 is pressed and filled with the conductive wire 120 magnetized in the through hole 122 of the insulating silicone rubber 130 as described above, 160 are automatically magnetically arrayed. In particular, since the conductive particles are gathered around the magnetized conductive wire 120, when the conductive path is formed by the conductive particles in the vertical direction and pressed in the vertical direction during the test, the conductive properties of the conductive silicone rubber 160 are enhanced do.

For example, when the upper end region of the conductive wire 120 is magnetized to the N pole and the lower end portion is magnetized to the S pole, a constant magnetic field is formed from the upper portion of the conductive wire 120 to the lower portion (or vice versa). The surrounding conductive particles are gathered along these magnetic fields, and the conductive particles are arranged in the vertical direction to form a conductive path in the vertical direction.

In addition, since the conductive path is formed by the conductive silicone rubber 160 and the magnetized conductive wire 120, even if an accident such as broken or breakage occurs in the conductive wire 120 by repeated tests, When the conductive wire 120 and the conductive silicone rubber 160 are combined and used, the conductive wire 120 is prevented from being cut and the contact function is maintained even if the conductive wire 120 is cut off.

The insulating silicone rubber 130 is not limited to the silicone rubber as long as it has a predetermined elasticity. For example, polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber, and other elastic rubbers may be used as the heat resistant polymer material having a crosslinked structure.

Silicone rubber, urethane rubber, epoxy rubber or other elastic rubber may be used for the conductive silicone rubber 160 in the same manner as the insulating silicone rubber 130.

However, the conductive particles to be magnetically arranged may be mixed here. The conductive particles may be composed of iron (Fe), nickel (Ni), cobalt (Co), other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core. Alternatively, the conductive silicone rubber 160 may be composed of a compound in which a filler such as carbon (C) is excessively filled.

Or the conductive silicone rubber 160 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in a silicone rubber resin. In addition, the above-mentioned conductive powder among the unaligned conductive connectors may be a single metal of magnetic silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) . Compared with the conductive connector formed by magnetically arranging the conductive particles in the silicone rubber resin, the conductive silicone rubber 160 is much simpler and the yield is improved.

Hereinafter, a method of manufacturing a test socket according to the present invention will be described with reference to the drawings.

Referring to FIG. 2, a first PCB film 110 is prepared. A plurality of first pads 102 are formed on the first PCB film 110. The first pad 102 may include a bonding pad formed by electroplating or electroless plating copper (Cu). The first PCB film 110 is a flexible printed circuit board. The flexible printed circuit board is easy to design a circuit pattern using a screen printing or a photolithography process, and has excellent workability.

And the conductive wire 120 is connected to the first PCB film 110 by using the first pad 102. The conductive wire 120 is in contact with the first pad 102. Whereby a bonding joint can be formed. The conductive wire 120 may be composed of a single wire or a double wire.

Referring to FIG. 3, the insulating silicone rubber 130 is disposed on the first PCB film 110 on which the conductive wire 120 is wire-bonded. Thus, the conductive wire 120 is mounted on the corresponding plurality of through holes 122.

At this time, the insulating silicone rubber 130 can be patterned into a predetermined shape using a mold. For example, fins are formed in the mold at regular intervals and sizes. When the liquid silicone rubber is injected thereinto, the liquid silicone rubber is injected only into the portion excluding the pin, so that the insulating silicone rubber 130 having the through hole 122 can be formed. Alternatively, the through hole 122 may be formed after the insulating silicone rubber 130 is completed, by a laser process or the like.

Referring to FIG. 4, a second PCB film 140 is provided on the upper surface of the insulating silicone rubber 130. And is connected to the conductive wire 120 using the second pad 132. At this time, the conductive wire 120 may be connected to the second pad 132 by a conductive adhesive or may be connected by a soldering method. When connecting the second pad 132 through the soldering joint, the soldering can be performed by robot soldering or dot soldering.

Referring to FIG. 5, the through-hole 122 is filled with the liquid conductive silicone rubber. The liquid silicone rubber in which the conductive particles are impregnated and impregnated into the through holes 122 at a predetermined pressure is filled and cured. After curing, the conductive silicone rubber 160 supports the conductive wires 120 and forms electrical connections with one another.

In order to strengthen the magnetic arrangement in the vertical direction prior to curing of the liquid silicone rubber, an additional external magnetic field may be provided. For example, in order to further strengthen the magnetic field, an external magnetic field may be further provided so that a magnetic field is formed in the thickness direction of the insulating silicone rubber 130. Or the magnetic field can be strengthened at the upper and lower ends of the conductive wire 120, respectively.

As described above, according to the present invention, in the case of the pressure-conductive silicone rubber, the conductivity is ensured only by a sufficient pressure, and the yield is lowered in repetitive inspection. Therefore, the conductive particles are put into the conductive silicone rubber, The conductive particles are not scattered by the magnetized conductive wire but are kept in a constant arrangement by the magnetic field. Therefore, it is possible to arrange the magnetic material without using the external magnetic field, It can be seen that the configuration in which the conductive particles are not scattered is regarded as a technical idea. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: test socket 110: first PCB film
120: Magnetized conductive wire 130: Insulated silicone rubber
140: first PCB film 160: conductive silicone rubber

Claims

A first PCB film on which a plurality of first pads are formed;
A conductive wire connected to the first pad and magnetized;
An insulating silicone rubber provided on the first PCB film and having a plurality of through holes corresponding to the conductive wires, the conductive wires being mounted on the through holes;
Wherein the through hole is provided in a number corresponding to the number of the magnetized conductive wires, and the conductive wire is formed in a cylindrical shape whose circle width is not smaller than the width of the first pad, and the magnetized conductive wire mounted on the through hole A conductive silicone rubber that is non-linear to absorb the impact, is filled in the through hole and supports the conductive wire; And
And a second PCB film provided on the insulating silicone rubber and connected to the conductive wire through a second pad,
Even if the conductive wire is cut by a repetitive test through a conductive path by the magnetized conductive wire connecting the first pad and the second pad and a conductive path by the conductive particle, The contact is maintained and the contact is held by the conductive wire even if the conductive particles are separated or scattered,
Characterized in that the conductive particles do not flow in spite of repetitive testing because they are gathered around the magnetized conductive wire.

The method according to claim 1,
Wherein the conductive silicone rubber further comprises conductive particles electrically connecting the first pad and the second pad,
Wherein the conductive particles are magnetically arranged in the thickness direction of the insulating silicone rubber by the magnetized conductive wires.

3. The method of claim 2,
Wherein the conductive particles are composed of a single metal or a combination of two or more alloys having magnetism of iron (Fe), nickel (Ni), or cobalt (Co).

The method of claim 3,
Wherein the conductive particles are formed in a mixed form in which the metal is plated on an insulating core.

5. The method of claim 4,
Wherein the conductive silicone rubber further comprises a carbon (C) filler.

3. The method of claim 2,
Wherein the conductive particles comprise non-passive conductive powder and platinum (Pt) catalyst.

The method according to claim 6,
Wherein the conductive powder is a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) or is composed of two or more metals.

Preparing a first PCB film;
Magnetizing the conductive wire;
Preparing an insulating silicone rubber including a through hole;
Bonding the magnetized conductive wire onto the first PCB film;
Installing an insulating silicone rubber on the first PCB film;
Providing a second PCB film on the top surface of the insulating silicone rubber; And
Filling the through hole with a liquid conductive silicone rubber,
Wherein filling the liquid conductive silicone rubber comprises:
The conductive particles of the conductive silicone rubber are automatically magnetically arranged by the magnetized conductive wire when the liquid conductive silicone rubber is press-filled with the magnetized conductive wire bonded to the through-hole of the insulating silicone rubber, And simultaneously providing an external magnetic field so that an additional magnetic field is formed in the thickness direction of the insulating silicone rubber.

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9. The method of claim 8,
Wherein the additional magnetic field is provided through upper and lower ends of the conductive wire.