KR101833009B1 - Test socket having magnetic arrangement of conductive particle using ferrite wire and method for manufacturing thereof - Google Patents
Test socket having magnetic arrangement of conductive particle using ferrite wire and method for manufacturing thereof Download PDFInfo
- Publication number
- KR101833009B1 KR101833009B1 KR1020160032586A KR20160032586A KR101833009B1 KR 101833009 B1 KR101833009 B1 KR 101833009B1 KR 1020160032586 A KR1020160032586 A KR 1020160032586A KR 20160032586 A KR20160032586 A KR 20160032586A KR 101833009 B1 KR101833009 B1 KR 101833009B1
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- KR
- South Korea
- Prior art keywords
- conductive
- silicone rubber
- conductive wire
- magnetized
- wire
- Prior art date
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-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
A method of manufacturing a test socket of the present invention includes the steps of preparing a first PCB film, magnetizing a conductive wire, preparing an insulating silicone rubber including a through hole, forming the magnetized conductive wire on the first PCB film A step of mounting an insulating silicone rubber on the first PCB film, a step of installing a second PCB film on the surface of the insulating silicone rubber, and filling the through hole with the liquid conductive silicone rubber. According to the structure of the present invention as described above, the conductive particles are not scattered despite the repetitive test, and the inspection yield is maintained.
Description
The present invention relates to a test socket having conductive particles arranged by a magnetized conductive wire and a method of manufacturing a test socket in which conductive particles are magnetically aligned in the contact direction by a magnetized conductive wire More particularly, the present invention relates to a test socket for inspecting electrical characteristics of a semiconductor device manufactured through a semiconductor package manufacturing process before shipment, and a method of manufacturing the same.
In general, a processed semiconductor device is subjected to an electrical inspection process before being provided to a user. In the electrical inspection process, the electrical characteristics of the semiconductor device are inspected using a test socket.
Conventional test sockets for testing semiconductor devices with QFN, MLF, LGA, BGA, QFP and SOP types include spring probe (pogo pin) method, stamping pin method, and pressure sensitive conductive rubber Rubber: PCR) method.
When radio frequency testing is required, such as RF (Radio Frequency) semiconductor devices, it is necessary to minimize the electrical path, so test sockets using short spring probes or plate pin of various shapes are being developed.
In recent years, the use of a pressurized conductive silicone rubber system using silicone rubber as an elastic material has been increasingly used because of the short conductive path and minimizing the damage to balls of a semiconductor device.
However, the pressure-conductive silicone rubber has various problems such as increased conductivity only when sufficient pressure is applied in the longitudinal direction.
First, in order to enhance the conductivity, even if the density of the conductive particles is increased, if the conductive particles are not anisotropic, they can not show the electrical characteristics in the contact direction.
Second, as the repetitive test proceeds, the conductive particles are scattered from the contact area. Therefore, the yield decreases with time. There is a need for a means to concentrate the conductive particles so as not to scatter them.
Finally, the pressure-conducting silicone rubber gradually loses its function after impact through repeated testing. At this time, we need a means to supplement it.
SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a test socket in which conductive particles can be concentrated without being scattered in the longitudinal direction of the conductive connector, will be.
Another object of the present invention is to provide a test socket in which magnetic arrays of conductive particles can be formed on their own without using an external magnetic field and a method of manufacturing the same.
It is still another object of the present invention to provide a test socket and a method of manufacturing the same that can complement the conductive silicone rubber which is gradually lost by repeated testing.
According to an aspect of the present invention, there is provided a test socket including a first PCB film on which a plurality of first pads are formed, a conductive wire magnetized on the first pad, A conductive silicone rubber filled in the through hole and supporting the conductive wire, the conductive silicone rubber being provided in the through hole and having a plurality of through holes corresponding to the conductive wire, And a second PCB film provided on the insulating silicone rubber and connected to the conductive wire through a second pad.
According to another aspect of the present invention, a method of manufacturing a test socket of the present invention includes the steps of preparing a first PCB film, magnetizing a conductive wire, preparing an insulating silicone rubber including a through hole, A step of connecting the magnetized conductive wire to the electrically conductive wire, a step of installing an insulative silicone rubber on the first PCB film, a step of installing a second PCB film on the insulative silicone rubber, Lt; / RTI >
As described above, according to the configuration of the present invention, the following effects can be expected.
First, since the density of the conductive particles in the direction of the contact is increased, inspection yield is maintained without providing sufficient pressure in the test.
Second, magnetized conductive wires are provided through the conductive silicone rubber to provide a magnetic field during magnetic alignment, and the inspection yield is greatly improved since conductive particles are not scattered in the contact direction despite repetitive testing.
Third, even if the conductive silicone rubber is lost due to repetitive testing, it is excellent because the conductive property is ensured by the conductive wire.
1 is a partially cutaway perspective view showing a configuration of a test socket according to the present invention;
Figs. 2 to 5 are cross-sectional views showing the manufacturing method of Fig.
Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.
Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.
Hereinafter, preferred embodiments of the test socket according to the present invention will be described in detail with reference to the accompanying drawings.
1, a test socket 100 according to the present invention includes a
The
The
The
At this time, the
In particular, the present invention includes a conductive wire in which the
When the
For example, when the upper end region of the
In addition, since the conductive path is formed by the
The insulating
Silicone rubber, urethane rubber, epoxy rubber or other elastic rubber may be used for the
However, the conductive particles to be magnetically arranged may be mixed here. The conductive particles may be composed of iron (Fe), nickel (Ni), cobalt (Co), other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core. Alternatively, the
Or the
Hereinafter, a method of manufacturing a test socket according to the present invention will be described with reference to the drawings.
Referring to FIG. 2, a
And the
Referring to FIG. 3, the insulating
At this time, the insulating
Referring to FIG. 4, a
Referring to FIG. 5, the through-
In order to strengthen the magnetic arrangement in the vertical direction prior to curing of the liquid silicone rubber, an additional external magnetic field may be provided. For example, in order to further strengthen the magnetic field, an external magnetic field may be further provided so that a magnetic field is formed in the thickness direction of the insulating
As described above, according to the present invention, in the case of the pressure-conductive silicone rubber, the conductivity is ensured only by a sufficient pressure, and the yield is lowered in repetitive inspection. Therefore, the conductive particles are put into the conductive silicone rubber, The conductive particles are not scattered by the magnetized conductive wire but are kept in a constant arrangement by the magnetic field. Therefore, it is possible to arrange the magnetic material without using the external magnetic field, It can be seen that the configuration in which the conductive particles are not scattered is regarded as a technical idea. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.
100: test socket 110: first PCB film
120: Magnetized conductive wire 130: Insulated silicone rubber
140: first PCB film 160: conductive silicone rubber
Claims (10)
A conductive wire connected to the first pad and magnetized;
An insulating silicone rubber provided on the first PCB film and having a plurality of through holes corresponding to the conductive wires, the conductive wires being mounted on the through holes;
Wherein the through hole is provided in a number corresponding to the number of the magnetized conductive wires, and the conductive wire is formed in a cylindrical shape whose circle width is not smaller than the width of the first pad, and the magnetized conductive wire mounted on the through hole A conductive silicone rubber that is non-linear to absorb the impact, is filled in the through hole and supports the conductive wire; And
And a second PCB film provided on the insulating silicone rubber and connected to the conductive wire through a second pad,
Even if the conductive wire is cut by a repetitive test through a conductive path by the magnetized conductive wire connecting the first pad and the second pad and a conductive path by the conductive particle, The contact is maintained and the contact is held by the conductive wire even if the conductive particles are separated or scattered,
Characterized in that the conductive particles do not flow in spite of repetitive testing because they are gathered around the magnetized conductive wire.
Wherein the conductive silicone rubber further comprises conductive particles electrically connecting the first pad and the second pad,
Wherein the conductive particles are magnetically arranged in the thickness direction of the insulating silicone rubber by the magnetized conductive wires.
Wherein the conductive particles are composed of a single metal or a combination of two or more alloys having magnetism of iron (Fe), nickel (Ni), or cobalt (Co).
Wherein the conductive particles are formed in a mixed form in which the metal is plated on an insulating core.
Wherein the conductive silicone rubber further comprises a carbon (C) filler.
Wherein the conductive particles comprise non-passive conductive powder and platinum (Pt) catalyst.
Wherein the conductive powder is a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) or is composed of two or more metals.
Magnetizing the conductive wire;
Preparing an insulating silicone rubber including a through hole;
Bonding the magnetized conductive wire onto the first PCB film;
Installing an insulating silicone rubber on the first PCB film;
Providing a second PCB film on the top surface of the insulating silicone rubber; And
Filling the through hole with a liquid conductive silicone rubber,
Wherein filling the liquid conductive silicone rubber comprises:
The conductive particles of the conductive silicone rubber are automatically magnetically arranged by the magnetized conductive wire when the liquid conductive silicone rubber is press-filled with the magnetized conductive wire bonded to the through-hole of the insulating silicone rubber, And simultaneously providing an external magnetic field so that an additional magnetic field is formed in the thickness direction of the insulating silicone rubber.
Wherein the additional magnetic field is provided through upper and lower ends of the conductive wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020160032586A KR101833009B1 (en) | 2016-03-18 | 2016-03-18 | Test socket having magnetic arrangement of conductive particle using ferrite wire and method for manufacturing thereof |
Applications Claiming Priority (1)
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KR1020160032586A KR101833009B1 (en) | 2016-03-18 | 2016-03-18 | Test socket having magnetic arrangement of conductive particle using ferrite wire and method for manufacturing thereof |
Publications (2)
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KR20170108522A KR20170108522A (en) | 2017-09-27 |
KR101833009B1 true KR101833009B1 (en) | 2018-02-27 |
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Cited By (2)
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KR102030280B1 (en) * | 2018-07-04 | 2019-10-08 | 주식회사 새한마이크로텍 | Manufacturing method of anisotropic conductive sheet |
WO2021075628A1 (en) * | 2019-10-15 | 2021-04-22 | 주식회사 이노글로벌 | Bidirectional conductive module with buffer area formed around conductive lines |
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Citations (2)
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JP2005056860A (en) | 2001-02-09 | 2005-03-03 | Jsr Corp | Anisotropic conductive connector and application product of the same |
KR101468586B1 (en) * | 2013-07-16 | 2014-12-03 | 주식회사 아이에스시 | Conductive connector and manufacturing method of the same |
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2016
- 2016-03-18 KR KR1020160032586A patent/KR101833009B1/en active IP Right Grant
Patent Citations (2)
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JP2005056860A (en) | 2001-02-09 | 2005-03-03 | Jsr Corp | Anisotropic conductive connector and application product of the same |
KR101468586B1 (en) * | 2013-07-16 | 2014-12-03 | 주식회사 아이에스시 | Conductive connector and manufacturing method of the same |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102030280B1 (en) * | 2018-07-04 | 2019-10-08 | 주식회사 새한마이크로텍 | Manufacturing method of anisotropic conductive sheet |
WO2021075628A1 (en) * | 2019-10-15 | 2021-04-22 | 주식회사 이노글로벌 | Bidirectional conductive module with buffer area formed around conductive lines |
KR20210044935A (en) * | 2019-10-15 | 2021-04-26 | 주식회사 이노글로벌 | Test socket in which buffer area is formed around electrically conductive line |
KR102244246B1 (en) | 2019-10-15 | 2021-04-27 | 주식회사 이노글로벌 | Test socket in which buffer area is formed around electrically conductive line |
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