WO2021045286A1

WO2021045286A1 - Test socket having empty space

Info

Publication number: WO2021045286A1
Application number: PCT/KR2019/011909
Authority: WO
Inventors: 문해중; 이은주
Original assignee: 주식회사 이노글로벌
Priority date: 2019-09-06
Filing date: 2019-09-16
Publication date: 2021-03-11
Also published as: KR102191702B1

Abstract

The present invention relates to a test socket having an empty space, the test socket comprising: a base sheet through which a plurality of first conductive holes are formed in the up and down directions; a plurality of insulating material insulation pattern pillars which protrude upward from the regions of the first conductive holes of the base sheet, respectively, and has second conductive holes formed through the inside thereof in the up and down direction and communicating with the first conductive holes in the up and down directions; a conductive filling part which forms a conductive line in the up and down directions by filling each of the second conductive holes with a filler including conducive powder; and an insulating body which has a space-forming hole corresponding to each of the insulation pattern pillars and formed to be larger than the insulation pattern pillars, and forms an empty space between the insulation pattern pillar and the space-forming hole corresponding to each other, when the corresponding insulation pattern pillar is stably placed at the base sheet while passing through the corresponding space-forming hole.

Description

Test socket with empty space

The present invention relates to a test socket in which an empty space is formed, and more particularly, to a test socket capable of a stable test even at a small pressure in a repetitive test process.

A device such as a semiconductor device (hereinafter referred to as a'semiconductor device') undergoes a manufacturing process and then performs an inspection to determine whether the electrical performance is defective. The test of a semiconductor device is performed in a state in which a test socket (or a contactor or a connector) formed to be in electrical contact with a terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board. In addition, the test socket is used in a burn-in test process during the manufacturing process of a semiconductor device in addition to the final pass/fail inspection of the semiconductor device.

According to the development and miniaturization of semiconductor device integration technology, the size and pitch of terminals of semiconductor devices, that is, leads, are also becoming smaller, and accordingly, there is a need for a method of forming minute gaps between conductive patterns of test sockets. Therefore, there is a limitation in manufacturing a test socket for testing integrated semiconductor devices with the conventional Pogo-pin type test socket.

The proposed technology to meet the integration of such semiconductor devices is to form a perforated pattern in a vertical direction on a silicon body made of a silicon material made of an elastic material, and then fill the conductive powder inside the perforated pattern to form a conductive pattern. The PCR socket type (or rubber type, hereinafter the same) is widely used.

1 is a diagram showing a cross section of a conventional semiconductor test apparatus 1 of a PCR socket type. Referring to FIG. 1, a conventional semiconductor test apparatus 1 includes a support plate 30 and a PCR socket type test socket 10.

The support plate 30 supports the test socket 10 when the test socket 10 is positioned between the semiconductor element 3 and the inspection circuit board 5. Here, a main through hole (not shown) for advancing and retreating guide is formed in the center of the support plate 30, and the through hole for coupling is formed to be spaced apart from each other at a position separated from the edge along the edge forming the main through hole. . In addition, the test socket 10 is fixed to the support plate 30 by a peripheral support portion 50 bonded to the upper and lower surfaces of the support plate 30.

In the PCR socket type test socket 10, a perforated pattern is formed in an insulating silicon body, and conductive patterns are formed in the vertical direction by conductive powder 11 filled in the perforated pattern.

Meanwhile, the number of terminals of semiconductor devices, that is, package balls, is gradually increasing, and as many as 20,000 pins are manufactured in one package. The reason for this is to put several types of packages in one package and operate them as easily as a single chip. In order to test such a package, a test socket with 20,000 conductive patterns must be manufactured.

However, in the process of testing a semiconductor device using a test socket having 20,000 conductive patterns, the semiconductor device needs a force to press the test socket. In the test socket having a conductive pattern, a semiconductor device must press the test socket with a force of 400,000 g.

Due to the above circumstances, test socket manufacturers are continuing research to reduce the force of the test socket, but in the case of the conventional PCR socket type test socket using silicon material as the body, the conductive pattern is made of silicon. As it was wrapped, there was a limit to reducing the force. This means that if the force of the silicon body is used as a weak material, the repulsive force or restoring force is weakened and the body is not restored when pressed, which adversely affects the life of the test socket. Conversely, if the force is increased, the semiconductor device Since the test socket must be pressed with a large force, there is a problem in that the semiconductor device may be damaged.

Accordingly, there is a demand for a test socket capable of reducing a force than a conventional test socket while manufacturing a PCR type test socket having a conductive pattern composed of a silicon body and a conductive powder.

Meanwhile, in a state in which the lower part of the test socket is fixed to the inspection circuit board, the semiconductor element is pressed while contacting from the upper side, and the test is performed through electrical connection. In the case of a test of a semiconductor device using a single test socket, tens of thousands of tests are performed, and the upper side of the test socket is in contact with the semiconductor device tens of thousands of times, resulting in relatively high probability of damage.

If any one of the 20,000 conductive patterns constituting the test socket is damaged, the entire test socket must be replaced, and thus, the test socket having a short lifespan acts as a factor that increases the cost.

Accordingly, the present invention has been conceived to solve the above problems, and an object of the present invention is to provide a test socket having an empty space capable of performing a stable test even at a small pressure in a repetitive test process.

In addition, there is another object to provide a test socket having an empty space that can partially replace only an upper area that is likely to be damaged due to contact with an upper device such as a semiconductor device.

According to the present invention, in a test socket having an empty space, a base sheet having a plurality of first conductive holes penetrating in a vertical direction is formed; A plurality of insulating pattern pillars made of insulating material which protrude upward from each of the first conductive hole regions of the base sheet, are formed through the inside in an up-down direction, and have a second conductive hole communicating with the first conductive hole in an up-down direction and; A conductive filling unit for forming a conductive line in a vertical direction by filling each of the second conductive holes with a filler including conductive powder; A space forming hole corresponding to each of the insulating pattern pillars is formed, but is formed larger than the insulating pattern pillar, so that when each of the insulating pattern pillars pass through the corresponding space forming hole and are seated on the base sheet, the insulation corresponding to each other It is achieved by a test socket having an empty space, characterized in that it comprises an insulating body forming an empty space between the pattern pillar and the space forming hole.

Here, it may further include an elastic spring installed inside each of the insulating pattern pillars, disposed to surround the corresponding conductive filling portion in the vertical direction, and providing a restoring force in the vertical direction.

In addition, a lower region of the conductive filling part may protrude in a lower direction than a lower plate surface of the base sheet.

In addition, the base sheet may be formed of any one of FR4 and PI film.

In addition, the insulating body may be made of a silicon material.

In addition, the insulating body includes an inner body formed of a material having a conductive material having a plurality of space-forming holes formed thereon, and an insulating coating layer for coating the outer surface of the inner body so that the outer surface of the inner body is electrically insulated. And a ground line extending outside the insulating coating layer while being electrically connected to the inner body and connected to an external ground.

In addition, an insulating sheet made of an insulating material and a plurality of conductive patterns each forming a conductive line in a vertical direction, the conductive filling portion and the conductive pattern at positions corresponding to each other when seated from the upper portion of the insulating pattern pillar It may further include an upper seat module electrically connected.

In addition, the insulating sheet may be formed of an FR4 or PI film material.

In addition, each of the conductive filling portions includes a protruding contact portion protruding upward from the insulating pattern pillar to contact the conductive pattern; The insulating sheet and the insulating body may be spaced apart from each other in the vertical direction by the protruding contact portion to form an empty space.

In addition, a plurality of third conductive holes penetrating in the vertical direction may be formed in the insulating sheet, and each of the conductive patterns may be formed inside each of the third conductive holes.

In addition, the upper sheet module further includes a support ring interposed between the inner surface of each of the third conductive holes and the circumference of the conductive pattern to support the conductive pattern so as to be positioned inside the third conductive hole; The support ring may be made of an insulating material having elasticity, and may elastically support movement of the conductive pattern in a downward direction when the conductive pattern is pressed downward.

In addition, a plurality of lower portions of an insulating material protruding downward from each of the first conductive hole regions of the base sheet and having a fourth conductive hole formed therein in an up-down direction and communicating with the first conductive hole in an up-down direction. An insulating pattern pillar and a lower space forming hole corresponding to each of the lower insulating pattern pillars are formed, but are formed larger than the lower insulating pattern pillars, so that each of the lower insulating pattern pillars pass through the corresponding lower space forming hole and the base And a lower insulating body forming an empty space between the lower insulating pattern pillars and the lower space forming holes corresponding to each other when seated on the sheet from a lower direction; The conductive filling part may be formed over the first conductive hole and the fourth conductive hole.

In addition, an upper reinforcing pattern provided on the conductive filling portion and the insulating pattern pillar so as to cover the upper surface of each of the conductive filling portions and the insulating pattern pillar, and in electrical contact with the conductive filling portion. can do.

And, when electrically connecting the upper device and the lower device, the base sheet side may be disposed to face toward the upper device; An end of the conductive filling part contacting the lower device may be formed to protrude from the insulating pattern pillar.

In addition, a loader board on which the base sheet is seated and a contact terminal electrically contacting the conductive filling portion is formed at a position corresponding to each of the plurality of conductive filling portions, and a plurality of guide rods protruding upward in the edge region is provided. Including; A first guide hole penetrating up and down at a position corresponding to the guide rod is formed in an edge region of the base sheet; A second guide hole is formed in an edge region of the insulating body at a position corresponding to the guide rod; The base sheet is seated on the loader board in a state in which the guide rod is inserted into the first guide hole of the base sheet; In a state in which the guide rod is inserted into the second guide hole of the insulating body, the insulating body is seated on the base sheet, so that the loader board, the base sheet, and the insulating body may be aligned and fixed.

According to the present invention according to the configuration as described above, an empty space is formed around each of the insulating pattern pillars surrounding the conductive filling part forming a conductive line in the vertical direction while providing a PCR-type test socket capable of implementing a fine pitch. When an upper device such as an element is pressed in a downward direction, a test socket is provided with an empty space that can reduce the force by giving the insulation pattern column a space to move around.

In addition, an upper sheet module capable of reinforcing the upper part is placed on the upper part, but it is arranged detachably to reinforce the upper part of the test socket, and it is possible to replace only the upper sheet module on the upper side, which has a relatively high possibility of damage. It is possible to significantly reduce the replacement cost due to damage to the contact part with the device.

In addition, an empty space is also formed between the upper sheet module and the lower insulating body, so that when an upper device, such as a semiconductor device, is pressed downward, a force that prevents the upper device, such as a semiconductor device, is reduced.

In addition, the inner body constituting the inside of the insulating body is prepared with a conductive material, and the outer body is coated with an insulating material so that the insulating body has insulating properties, and the entire inner body is grounded so that the periphery of each conductive filling part is grounded. As a result, more stable signal transmission is possible.

1 is a view showing a cross section of a conventional semiconductor test apparatus of the PCR socket type,

2 is a perspective view of a test socket in which an empty space is formed according to an embodiment of the present invention,

3 is a cross-sectional view taken along line III-III of FIG. 2,

4 is a view showing an example of a method of fixing a test socket with an empty space according to the present invention to a road board,

5 and 6 are views for explaining a manufacturing process of a test socket in which an empty space is formed according to an embodiment of the present invention,

7 to 11 are views for explaining a test socket in which an empty space is formed according to other embodiments of the present invention.

The present invention relates to a test socket in which an empty space is formed, the base sheet having a plurality of first conductive holes penetrating in the vertical direction; A plurality of insulating pattern pillars made of insulating material which protrude upward from each of the first conductive hole regions of the base sheet, are formed through the inside in an up-down direction, and have a second conductive hole communicating with the first conductive hole in an up-down direction and; A conductive filling unit for forming a conductive line in a vertical direction by filling each of the second conductive holes with a filler including conductive powder; A space forming hole corresponding to each of the insulating pattern pillars is formed, but is formed larger than the insulating pattern pillar, so that the insulation corresponding to each other when each of the insulating pattern pillars passes through the corresponding space forming hole and is seated on the base sheet It characterized in that it comprises an insulating body forming an empty space between the pattern pillar and the space forming hole.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view of a test socket 100 in which an empty space is formed according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2. 2 and 3, the test socket 100 according to the present invention includes a base sheet 130, a plurality of insulating pattern columns 111, a plurality of conductive filling parts 114, and an insulating body 150. Includes.

The base sheet 130 is formed with a plurality of second conductive holes 131 and 131 (refer to (a) of FIG. 5) penetrating in the vertical direction. The base sheet 130 is made of an insulating material, and may be made of a plastic material, FR4 or PI material, and the material of the base sheet 130 is not limited thereto.

The insulating pattern pillar 111 is extended upward from each conductive hole area of the base sheet 130. In addition, second conductive holes 131 and 112 (see FIG. 6 (a)) formed through the insulating pattern pillar 111 in the vertical direction are formed, together with the first conductive hole 112 in the vertical direction. Communicate.

In the present invention, as shown in FIG. 3, the insulating pattern pillar 111 has a shape protruding upward from the upper surface of the base sheet 130, but the outer side of the lower edge region of the insulating pattern pillar 111 The surface may be formed to protrude upward in a form attached to the inner wall surface of the first conductive hole 112 formed in the base sheet 130, and a detailed description thereof will be described later.

The conductive filling part 114 is filled with a filler including conductive powder in each of the second conductive holes 131 to form a conductive line in the vertical direction. Here, the filler may be formed by mixing conductive powder and liquid silicon, and liquid silicon including conductive powder may be filled in the second conductive hole 131 and then cured to form the conductive filling part 114. have.

In the embodiment illustrated in FIG. 3, the conductive filling part 114 is formed by filling the first conductive hole 112 and the second conductive hole 131 as an example. However, as described above, the insulating pattern pillar ( When the lower edge region of 111 is located inside the first conductive hole 112, it may be filled only in the second conductive hole 131.

Here, the lower region of the conductive filling part 114 may be provided to protrude downward from the lower plate surface of the base sheet 130. Through this, a more stable contact may be ensured when contacting the terminals of the lower device, for example, the inspection circuit board or the loader board 300, respectively.

In the insulating body 150, space forming holes 151 and 151 (refer to FIG. 4) corresponding to each of the insulating pattern pillars 111 are formed. Here, each space forming hole 151 is formed larger than the insulating pattern pillar 111. For example, when the insulating pattern pillar 111 is provided as a cylindrical pillar and the space forming hole 151 has a circular shape, the inner diameter of the space forming hole 151 is formed larger than the diameter of the insulating pattern pillar 111 .

Through this, when each insulating pattern pillar 111 passes through the corresponding space forming hole 151 and the insulating body 150 is seated on the base sheet 130, the insulating pattern pillar 111 and the space forming hole 151 An empty space 113 (hereinafter referred to as'air column') can be formed therebetween.

According to the above configuration, the air column 113 around the insulating pattern pillar 111 forming one conductive line (the actual conductive line is formed by the conductive filling portion 114 inside the insulating pattern pillar 111). ) Is formed, and when pressed in a downward direction by an upper device such as a semiconductor element, a free space in which each insulating pattern column 111 can be moved individually is formed, thereby preventing a force acting in the upper direction. It can be significantly reduced.

In addition, even if the size of the ball of the semiconductor device is different due to design or error, or the height at which the ball is in contact with the ball (Baa) is different due to the bending of the substrate of the semiconductor device, the insulating pattern column 111 can be moved individually. In addition, a more stable contact is ensured even by a small pressure.

3B is a view showing a cross section of a test socket 100a according to another embodiment of the present invention. The test socket 100a shown in FIG. 3B is a modified example of the above-described embodiment, and may further include an elastic spring 115.

The elastic spring 115 is installed inside each of the insulating pattern pillars 111, and is disposed to surround the conductive filling part 114 in the vertical direction, thereby providing a restoring force in the vertical direction. Through this, when a terminal such as a ball of the upper device presses each conductive filling part 114 downward, as described above, the air column 113 around each insulating pattern column 111 ), the force is reduced, and when the upper device is removed, the restoring force of the elastic spring 115 is added to the restoring force of each insulating pattern column 111 to improve the restoring force.

4 is a view for explaining an example of a method of fixing the test socket 100 according to the present invention to a load board (Road board). Referring to FIG. 4, the base sheet 130 is mounted on the loader board 300, and a contact terminal electrically contacting the conductive filling portion 114 at a position corresponding to each of the plurality of conductive filling portions 114 320 is formed.

In addition, the loader board 300 is provided with a plurality of guide rods 310 protruding upward in an edge region. Here, the guide rod 310 is an example that protrudes upward from four corner regions of the loader board 300, the number for alignment of the loader board 300, the base sheet 130, and the insulating body 150, and Can be provided on site.

A first guide hole 132 penetrating in the vertical direction at a position corresponding to the guide rod 310 is formed in the edge region of the base sheet 130. Likewise, a second guide hole 152 is formed at a position corresponding to the guide rod 310 in the edge region of the insulating body 150. As shown in FIG. 4, the second guide hole 152 may be formed through in the vertical direction and may be formed to a predetermined depth in the upper direction from the lower plate surface of the insulating body 150.

According to the above configuration, the base sheet 130 is seated on the loader board 300 with the guide rod 310 inserted into the first guide hole 132 of the base sheet 130, and similarly, the insulating body ( The insulating body 150 is seated on the base sheet 130 in a state in which the guide rod 310 is inserted into the second guide hole 152 of 150). Through this, if the loader board 300, the base sheet 130, and the insulating body 150 are aligned in a state in which the insulating body 150 is pressed downward from the top, it can be fixed in an aligned state. It is done.

Hereinafter, a manufacturing process of the test socket 100 according to the present invention will be described with reference to FIGS. 5 and 6.

First, as shown in FIG. 5A, a base sheet 130 having a plurality of first conductive holes 112 formed thereon is mounted in a mold 500 in which a mold rod 510 protruding upward is formed. At this time, when the base sheet 130 is seated, each of the mold rods 510 passes through the first conductive hole 112.

Then, as shown in (b) of Figure 5, the dummy mold 520 is mounted on the base sheet 130, a dummy mold having a mold hole (not shown) larger than the diameter of the mold rod 510 ( When the 520 is mounted, a column formation space 521 is formed between the dummy mold 520 and the mold rod 510, as shown in FIG. 5B.

In addition, when an insulating material, such as liquid silicon, is injected into the column formation space 521 and passed, and the dummy mold 520 is removed, as shown in FIG. 6(a), the base sheet 130 A cylindrical insulating pattern pillar 111 is formed thereon. Here, a second conductive hole 131 is formed in the insulating pattern pillar 111 by the mold rod 510, and a body mounting hole for mounting the insulating body 150 is formed between the insulating pattern pillars 111 do.

Here, when the diameter of the mold rod 510 is made smaller than the inner diameter of the first conductive hole 112 of the base sheet 130 and the dummy mold 520 is seated and then silicon is injected, as described above, 1 The insulating pattern pillar 111 protrudes upward from the inner diameter of the conductive hole 112.

Again, as shown in (a) of FIG. 6, when a plurality of insulating pattern pillars 111 are formed in the base sheet 130, the second conductive holes 131 formed in each of the insulating pattern pillars 111 When a filler including a conductive powder is filled and cured, a conductive filling part 114 is formed in each of the second conductive holes 131 as shown in FIG. 6B. In the embodiment shown in FIG. 6, for example, the conductive filling part 114 is formed over the first conductive hole 112 and the second conductive hole 131, and is formed to protrude from the base sheet 130 in the lower direction. This is an example.

When the conductive filling part 114 is formed as described above, the insulating body 150 is seated on the base sheet 130 through the body mounting hole. As shown in FIG. 4, the space forming hole of the insulating body 150 ( As the insulating pattern pillar 111 passes through 151, it is possible to be seated, and a test socket 100 is manufactured as shown in (c) of FIG. 6. Here, the insulating body 150 is formed by attaching it to a sheet with a glue or the like, or, as shown in FIG. 4, to be seated in a form that is inserted into a guide rod 310 formed on a lower substrate such as the loader board 300. I can.

Hereinafter, a test socket 100b having an empty space according to another embodiment of the present invention will be described with reference to FIG. 7. In the embodiment shown in FIG. 7, the grounding structure of the test socket 100b is improved.

Referring to FIG. 7, the insulating body 150b of the test socket 100b according to another embodiment of the present invention includes an inner body 153b, an insulating coating layer 154b, and a ground line 155b. I can.

The inner body 153b forms the entire structure of the insulating body 150b. That is, a plurality of space forming holes (not shown) are formed in the inner body 153b. In the present invention, the inner body 153b is made of a conductive material.

The insulating coating layer 154b applies the entire outer surface of the inner body 153b so that the outer surface of the inner body 153b is electrically insulated. That is, while the inner body 153b is made of a conductive material, the insulating coating layer 154b covers the entire outer surface of the inner body 153b, so that the entire outer surface of the insulating body 150b operates as an insulator. .

The ground line 155b extends outside the insulating coating layer 154b while being electrically connected to the inner body 153b. In addition, the ground line 155b is connected to an external ground while extending to the outside of the insulating coating layer 154b, thereby grounding the entire test socket 100b.

According to the above configuration, the inner body 153b constituting the inside of the insulating body 150b is provided with a conductive material, the outside is coated with an insulating material so that the insulating body 150b has insulating properties, and the inner inner body The entire 153b is grounded, so that the periphery of each conductive filling part 114 is grounded, so that more stable signal transmission is possible.

8 is a cross-sectional view of a test socket 100c in which an empty space is formed according to another embodiment of the present invention. Referring to FIG. 8, the test socket 100c according to another embodiment of the present invention further includes an upper seat module 200.

The upper sheet module 200 may include an insulating sheet 210 and a plurality of conductive patterns 220. The insulating sheet 210 is made of an insulating material, for example, a flexible FR4 or PI film material.

Each conductive pattern 220 forms a conductive line in the vertical direction. When the upper sheet module 200 is seated from the top of the insulating pattern column 111, it is electrically In contact with the conductive filling part 114, a conductive line is formed in the vertical direction.

Here, each of the conductive filling parts 114 may include a protruding contact part 115c protruding upward from the insulating pattern pillar 111 and in contact with the conductive pattern 220. In addition, the insulating sheet 210 and the insulating body 150 are separated from each other in the vertical direction by the protruding contact portion 115c to form an empty space therebetween.

In addition, the conductive pattern 220 formed in the upper sheet module 200 may be formed inside the third conductive hole (not shown) formed in the upper sheet module 200.

Here, the upper sheet module 200 is interposed between the inner surface of each of the third conductive holes and the circumference of the conductive pattern 220 to support the conductive pattern 220 so as to be located inside the third conductive hole. It may further include.

Here, the support ring 230 is made of an insulating material having elasticity, for example, a silicon material, and elastically supports the movement of the conductive pattern 220 in the downward direction when the conductive pattern 220 is pressed downward. . This support structure supports the conductive pattern 220 in a structure similar to a trampoline.

According to the above structure, the upper part of the test socket 100c to be relatively damaged may be reinforced by the upper seat module 200, and as shown in FIG. 4, in a form in which the upper part of the test socket 100c is mounted without being attached to the upper part. By configuring, only the upper seat module 200 can be replaced.

That is, the upper seat module 200 capable of reinforcing the upper portion is disposed on the upper portion, but is arranged detachably to reinforce the upper portion of the test socket 100c, while the upper seat module on the upper side having a relatively high possibility of damage ( Since only 200) can be replaced, the replacement cost due to damage to the contact portion with the semiconductor device can be significantly reduced.

In addition, an empty space is also formed between the upper sheet module 200 and the lower insulating body 150 to reduce a force that prevents the upper device such as a semiconductor device from being pressed downward.

9 is a cross-sectional view of a test socket 100d in which an empty space is formed according to another embodiment of the present invention. The test socket 100d according to the embodiment illustrated in FIG. 9 may further include a plurality of lower insulating pattern pillars 111d and a lower insulating body 150d.

The lower insulating pattern pillar 111d protrudes downward from each of the first conductive hole 112 regions of the lower base sheet 130d. In addition, a fourth conductive hole is formed in the lower insulating pattern pillar 111d through the vertical direction and communicates with the first conductive hole 112 in the vertical direction.

In the lower insulating body 150d, a lower space forming hole (not shown) corresponding to each upper insulating pattern pillar 111 is formed, but is formed larger than the lower insulating pattern pillar 111d, so that each lower insulating pattern pillar 111d is formed. When) passes through the corresponding lower space forming hole and is seated from the lower direction of the lower base sheet 130, the air pillar 113 is formed between the corresponding lower insulating pattern pillar 111d and the lower space forming hole.

In such a structure, as shown in FIG. 9, one unit in which the insulating body 150 is seated on the base sheet 130 on which the plurality of insulating pattern columns 111 is formed is placed on the back side of the base sheet 130, that is, The insulating pattern pillar 111 may be formed by attaching opposite sides of the surface on which the insulating pattern pillars 111 are formed. On the other hand, one base sheet 130 has an insulating pattern column 111 and a lower insulating pattern column 111d formed on both sides thereof, and the insulating body 150 and the lower insulating body 150d are mounted on both sides. You may.

Here, in the embodiment shown in FIG. 9, a structure in which the conductive filling portion 114 is formed and then attached to the upper and lower units, that is, the conductive filling portion 114 and the lower conductive filling portion 114d are each Although the example is formed and attached, one conductive filling part (not shown) and one conductive filling part (not shown) formed inside the lower insulating pattern column 111d of the lower unit and the first conductive hole 112 are integrated. Of course, 114) can be formed.

Through the above configuration, it is possible to increase the length of the test socket 100d in the vertical direction according to the present invention.

10 is a cross-sectional view of a test socket 100e in which an empty space is formed according to another embodiment of the present invention. The test socket 100 according to the embodiment illustrated in FIG. 10 may further include an upper reinforcing pattern 115e.

The upper reinforcing pattern 115e is provided on the conductive filling portion 114 and the insulating pattern pillar so as to cover the upper surface of each conductive filling portion 114 and the upper surface of the insulating pattern pillar 111. In addition, the upper reinforcing pattern 115e is in electrical contact with the conductive filling portion 114 and is in contact with the terminal of the upper device.

The upper reinforcing pattern 115e may be manufactured by curing a filler including conductive powder, and it is preferable that the upper reinforcing pattern 115e has a relatively higher strength than the conductive filler part 114. This can be implemented by controlling the combination of the conductive powder and silicon, thereby reinforcing the upper side, which is relatively vulnerable to damage.

11 is a cross-sectional view of a test socket 100f in which an empty space is formed according to another embodiment of the present invention. The embodiment shown in FIG. 11 has a shape in which the direction of the embodiment shown in (a) of FIG. 3 is reversed in the vertical direction. That is, it is disposed so that the side of the base sheet 130 faces toward the upper device.

At this time, the end of the conductive filling portion 114 facing toward the lower device and in contact with the terminal of the lower device is formed to protrude from the insulating pattern pillar 111, thereby ensuring stable contact with the lower device.

In addition, an upper reinforcing pattern 115f is formed at the end of the conductive filling portion 114 facing toward the upper device and in contact with the terminal or ball of the upper device, so as to reinforce the upper region, as in the embodiment shown in FIG. 10. I can.

Although some embodiments of the present invention have been illustrated and described, those skilled in the art of ordinary skill in the art to which the present invention pertains will appreciate that the present embodiments can be modified without departing from the principles or spirit of the present invention. . The scope of the invention will be determined by the appended claims and their equivalents.

[Explanation of code]

100,100a,100b,100c,100d,100e,100f: Test socket

111: insulation pattern pillar 111d: lower insulation pattern pillar

112: first conductive hole 113: air column

114: conductive filling portion 114d: lower conductive filling portion

115:

elastic spring

115e, 115f: upper reinforcement pattern

130: base sheet 130d: lower base sheet

131: second conductive hole 132: first guide hole

150: insulating body 150d: lower insulating body

151: space forming hole 152: second guide hole

200: upper sheet module 210: insulation sheet

220: conductive pattern 230: support ring

300: loader board 310: guide rod

320: terminal 500: mold

510: mold rod 520: dummy mold

521: Column formation space

The present invention is disposed between an electronic component such as a semiconductor device and an inspection circuit board, and is applied to electrically connect it.

Claims

In the test socket formed with an empty space,

A base sheet having a plurality of first conductive holes penetrating in the vertical direction;

A plurality of insulating pattern pillars made of insulating material which protrude upward from each of the first conductive hole regions of the base sheet, are formed through the inside in an up-down direction, and have a second conductive hole communicating with the first conductive hole in an up-down direction and;

A conductive filling unit for forming a conductive line in a vertical direction by filling each of the second conductive holes with a filler including conductive powder;

A space forming hole corresponding to each of the insulating pattern pillars is formed, but is formed larger than the insulating pattern pillar, so that the insulation corresponding to each other when each of the insulating pattern pillars passes through the corresponding space forming hole and is seated on the base sheet A test socket having an empty space, comprising: an insulating body defining an empty space between the pattern pillar and the space forming hole.
The method of claim 1,

The test socket having an empty space, characterized in that it further comprises an elastic spring installed inside each of the insulating pattern pillars and disposed so as to surround the corresponding conductive filling portion in an up-down direction, and providing a restoring force in an up-down direction.
The method of claim 1,

A test socket having an empty space, wherein a lower region of the conductive filling part protrudes downward from a lower plate surface of the base sheet.
The method of claim 1,

The test socket having an empty space, wherein the base sheet is formed of any one of FR4 and PI film.
The method of claim 1,

The test socket having an empty space, wherein the insulating body is made of a silicon material.
The method of claim 1,

The insulating body

An inner body having a plurality of space forming holes formed therein and made of a conductive material,

An insulating coating layer for coating the outer surface of the inner body so that the outer surface of the inner body is electrically insulated,

A test socket having an empty space, characterized in that it includes a ground line that is electrically connected to the inner body and extends to the outside of the insulating coating layer and is connected to an external ground.
The method of claim 1,

An insulating sheet made of an insulating material and a plurality of conductive patterns each forming a conductive line in a vertical direction, and when seated from an upper portion of the insulating pattern pillar, the conductive filling portion and the conductive pattern corresponding to each other are electrically Test socket formed with an empty space, characterized in that it further comprises an upper seat module to be connected.
The method of claim 7,

The insulating sheet is a test socket having an empty space, characterized in that provided with a FR4 or PI film material.
The method of claim 7,

Each of the conductive filling portions includes a protruding contact portion protruding upward from the insulating pattern pillar to contact the conductive pattern;

The test socket having an empty space, characterized in that the insulating sheet and the insulating body are spaced apart from each other in a vertical direction by the protruding contact portion to form an empty space.
The method of claim 7,

A test socket having an empty space, characterized in that a plurality of third conductive holes penetrating in a vertical direction are formed in the insulating sheet, and each of the conductive patterns is formed inside each of the third conductive holes.
The method of claim 9,

The upper sheet module further includes a support ring interposed between an inner surface of each of the third conductive holes and a circumference of the conductive pattern to support the conductive pattern so as to be positioned inside the third conductive hole;

The support ring is made of an insulating material having elasticity, and when the conductive pattern is pressed in a downward direction, the test socket having an empty space, characterized in that elastically supporting the movement of the conductive pattern in a downward direction.
The method of claim 1,

A plurality of lower insulating patterns made of insulating material which protrude downward from each of the first conductive hole regions of the base sheet, are formed therein in an up-down direction, and have a fourth conductive hole communicating with the first conductive hole in an up-down direction With pillars,

A lower space forming hole corresponding to each of the lower insulating pattern pillars is formed, but is formed larger than the lower insulating pattern pillar, so that each of the lower insulating pattern pillars passes through the corresponding lower space forming hole, and from a lower direction to the base sheet. And a lower insulating body forming an empty space between the lower insulating pattern pillars and the lower space forming holes corresponding to each other when seated;

The test socket having an empty space, wherein the conductive filling part is formed over the first conductive hole and the fourth conductive hole.
The method of claim 1,

Further comprising an upper reinforcing pattern provided on the conductive filling portion and the insulating pattern pillar to cover the upper surface of each of the conductive filling portions and the insulating pattern pillar, and in electrical contact with the conductive filling portion. A test socket with an empty space characterized by.
The method of claim 1,

When electrically connecting the upper device and the lower device, the base sheet side is oriented toward the upper device;

The test socket having an empty space, wherein an end of the conductive filling part in contact with the lower device is formed to protrude from the insulating pattern pillar.
The method of claim 1,

The base sheet is seated, and a contact terminal electrically contacting the conductive filling portion is formed at a position corresponding to each of the plurality of conductive filling portions, and a loader board having a plurality of guide rods protruding upward in an edge region is further included. ;

A first guide hole penetrating up and down at a position corresponding to the guide rod is formed in an edge region of the base sheet;

A second guide hole is formed in an edge region of the insulating body at a position corresponding to the guide rod;

The base sheet is seated on the loader board in a state in which the guide rod is inserted into the first guide hole of the base sheet;

In a state in which the guide rod is inserted into the second guide hole of the insulating body, the insulating body is seated on the base sheet, and the loader board, the base sheet, and the insulating body are aligned and fixed. Formed test socket.