WO2021033824A1

WO2021033824A1 - Test socket with replaceable portion

Info

Publication number: WO2021033824A1
Application number: PCT/KR2019/011908
Authority: WO
Inventors: 문해중; 이은주; 정주연; 김장중
Original assignee: 주식회사 이노글로벌
Priority date: 2019-08-22
Filing date: 2019-09-16
Publication date: 2021-02-25
Also published as: KR102191701B1

Abstract

The present invention relates to a test socket with a replaceable portion, comprising: a first socket module comprising a first insulating main body made of an insulation material, and a plurality of first conductive patterns formed to be spaced apart from each other on the first insulating main body so as to form a conductive line in the vertical direction; and a second socket module comprising a second insulating main body made of an insulation material, and a plurality of second conductive patterns forming a conductive line in the vertical direction, wherein, when the second socket module is mounted on the first socket module, the first conductive patterns and the second conductive patterns at mutually corresponding locations make contact so that the first conductive patterns are electrically connected to the second conductive patterns, each of the first conductive patterns comprises an upper contact part protruding upward toward the second socket module so as to make contact with the second conductive pattern, and an empty space is formed between the first insulating main body and the second insulating main body by means of the upper contact part protruding upward toward the second socket module. Therefore, while providing a PCR-type test socket capable of implementing a fine pitch, an empty space is formed between the first socket module and the second socket module so that, when an upper device such as a semiconductor device is pushed downward, force for stopping same can be reduced.

Description

Partly replaceable test socket

The present invention relates to a test socket that can be partially replaced, and more particularly, it is possible to perform a stable test even at a low pressure in a repetitive test process, but only partially cover an upper area where there is a high risk of damage due to contact with an upper device such as a semiconductor device. It relates to a test socket that can be replaced.

A device such as a semiconductor device (hereinafter referred to as a'semiconductor device') undergoes a manufacturing process and then performs an inspection to determine whether the electrical performance is defective. The test of a semiconductor device is performed in a state in which a test socket (or a contactor or a connector) formed to be electrically contacted with a terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board. In addition, the test socket is used in the burn-in test process during the manufacturing process of the semiconductor device in addition to the final pass/fail inspection of the semiconductor device.

According to the development and miniaturization of semiconductor device integration technology, the size and pitch of the terminals of semiconductor devices, that is, leads, are also being reduced, and accordingly, a method of forming minute gaps between conductive patterns of test sockets is required. Therefore, there is a limitation in manufacturing a test socket for testing integrated semiconductor devices with the existing Pogo-pin type test socket.

The proposed technology to meet the integration of such semiconductor devices is to form a perforated pattern in a vertical direction on a silicon body made of a silicon material made of elastic material, and then fill a conductive powder inside the perforated pattern to form a conductive pattern. PCR socket type (or rubber type, hereinafter the same) is widely used.

1 is a diagram showing a cross section of a conventional semiconductor test apparatus 1 of a PCR socket type. Referring to FIG. 1, a conventional semiconductor test apparatus 1 includes a support plate 30 and a PCR socket type test socket 10.

The support plate 30 supports the test socket 10 when the test socket 10 is positioned between the semiconductor element 3 and the inspection circuit board 5. Here, a main through-hole (not shown) for advancing and retreating guide is formed in the center of the support plate 30, and through-holes for coupling are formed to be spaced apart from each other along the edge forming the main through-hole. . In addition, the test socket 10 is fixed to the support plate 30 by a peripheral support portion 50 bonded to the upper and lower surfaces of the support plate 30.

In the PCR socket type test socket 10, a perforated pattern is formed on an insulating silicon body, and conductive patterns are formed in the vertical direction by conductive powder 11 filled in the perforated pattern.

Meanwhile, the number of terminals of semiconductor devices, that is, package balls, is gradually increasing, and as many as 20,000 pins are manufactured in one package. The reason for this is to put several types of packages in one package and operate them as easily as one chip. To test such a package, a test socket with 20,000 conductive patterns must be manufactured.

However, in the process of testing a semiconductor device using a test socket having 20,000 conductive patterns, the semiconductor device needs a force to press the test socket. If the force that must be applied to one conductive pattern is 20g, it is arithmetically 200,000 In the test socket having a conductive pattern, a semiconductor device must press the test socket with a force of 400,000 g.

Due to the above circumstances, test socket manufacturers are continuing research to reduce the force of the test socket, but in the case of the existing test socket that uses silicon as the body, the conductive pattern is wrapped with silicon, There was a limit to reducing Force). This means that if the force of the body made of silicon is used as a weak material, the repulsive force or restoring force is weakened and the body is not restored when the body is pressed, which adversely affects the life of the test socket. Since the test socket must be pressed with a large force, there is a problem that the semiconductor device may be damaged.

Accordingly, there is a demand for a test socket capable of reducing a force than a conventional test socket while manufacturing a PCR type test socket having a conductive pattern composed of a silicon body and a conductive powder.

Meanwhile, in a state in which the lower portion of the test socket is fixed to the inspection circuit board, the semiconductor element is pressed while contacting from the upper side, and the test is performed through electrical connection. In the case of a test of a semiconductor device using a single test socket, tens of thousands of tests are performed, and the upper side of the test socket is in contact with the semiconductor device tens of thousands of times, resulting in a relatively high probability of damage.

If any one of the 20,000 conductive patterns constituting the test socket is damaged, the entire test socket must be replaced, and thus, a test socket having a short lifespan acts as a factor that increases the cost.

Accordingly, the present invention was conceived to solve the above problems, and it is possible to perform a stable test even at a low pressure in the repetitive test process, and partially cover only the upper region where there is a high risk of damage due to contact with the upper device such as a semiconductor device. Its purpose is to provide a test socket that can be replaced with a replaceable part.

The above object is, according to the present invention, in a test socket that can be partially replaced, a first insulating body made of an insulating material, and a plurality of first insulating bodies formed to be spaced apart from each other on the first insulating body to form a conductive line in the vertical direction, respectively. When a first socket module including a conductive pattern, a second insulating body made of an insulating material, and a plurality of second conductive patterns each forming a conductive line in a vertical direction, and seated on an upper portion of the first socket module And a second socket module in which the first conductive pattern and the second conductive pattern are in contact with each other to be electrically connected to the first conductive pattern and the second conductive pattern; Each of the first conductive patterns includes an upper contact portion protruding upward toward the second socket module to contact the second conductive pattern; It is achieved by a partially replaceable test socket, characterized in that it is formed in an empty space between the first insulating body and the second insulating body by the upper contact portion protruding upward toward the second socket module.

Here, a plurality of first through holes penetrating in the vertical direction are formed in the first insulating body; Each of the first conductive patterns further includes an inner conductive portion formed by curing a liquid material including conductive powder having conductivity in the first through hole; The upper contact portion may be formed on the inner conductive portion to protrude upward toward the second socket module.

In addition, a diameter of the upper contact portion may be provided smaller than a diameter of the inner conductive portion, and the upper contact portion may be pushed into the inner conductive portion when pressed downward by the second socket module.

Further, a lower contact portion formed under the inner conductive portion and protruding toward a lower portion of the first insulating body may be further included.

Further, the diameter of the lower contact portion is provided smaller than the diameter of the inner conductive portion, and when the first socket module is pressed downward by the second socket module, the lower contact portion may be pushed into the inner conductive portion. .

In addition, the upper contact portion and the lower contact portion may be formed by curing a liquid material including conductive powder.

In addition, an elastic spring provided inside the first insulating body to surround the inner conductive portion may be further included.

In addition, a plurality of second through holes penetrating in the vertical direction may be formed in the second insulating body, and the second conductive patterns may be formed inside each of the second through holes.

Further, the second socket module further includes a support ring interposed between the inner surface of each of the second through holes and the circumference of the second conductive pattern to support the second conductive pattern so as to be located inside the second through hole. Includes; The support ring may be made of an insulating material having elasticity, and may elastically support movement of the second conductive pattern in a downward direction when the second conductive pattern is pressed downward.

In addition, the second insulating body is provided with an FR4 film or a PI film; The second insulating body may have a thickness thinner than that of the first insulating body.

In addition, the first socket module further includes an upper insulating ring surrounding the outer circumferential surface of each of the upper contact parts, and surrounding the upper contact part so that the upper part of the upper contact part protrudes upward; The upper insulating rings adjacent to each other may be spaced apart from each other to form a space therebetween.

In addition, the first socket module further includes a lower insulating ring surrounding the outer circumferential surface of each of the lower contact portions, and surrounding the lower contact portion so that the lower portion of the lower contact portion protrudes downward; The lower insulating rings adjacent to each other may be spaced apart from each other to form a space therebetween.

According to the above configuration, according to the present invention, while providing a PCR-type test socket capable of implementing a fine pitch, an empty space is formed between the first socket module and the second socket module, so that the upper device such as a semiconductor device is lowered. A test socket is provided to reduce the force that blocks it when pressed in the direction.

In addition, according to the present invention, the test socket can be separated into a first socket module and a second socket module, and only the second socket module on the upper side can be replaced with a relatively damaged possibility. Partially replaceable test sockets are provided that can significantly reduce replacement costs due to damage.

1 is a diagram showing a cross section of a conventional semiconductor test apparatus of a PCR socket type,

2 is a perspective view of a test socket according to a first embodiment of the present invention,

3 is a cross-sectional view taken along line III-III of FIG. 2,

4 is a cross-sectional view of a test socket according to a second embodiment of the present invention,

5 is a view for explaining the operation process of the test socket according to the first embodiment of the present invention,

6 is a view for explaining embodiments of the second socket module of the test socket according to an embodiment of the present invention,

7 and 8 are views for explaining a method of manufacturing a test socket according to a first embodiment of the present invention,

9 is a cross-sectional view of a test socket according to a third embodiment of the present invention,

10 is a view showing another example of the second socket module of the test socket according to an embodiment of the present invention.

The present invention relates to a test socket that can be partially replaced, and includes a first insulating body made of an insulating material, and a plurality of first conductive patterns formed to be spaced apart from each other on the first insulating body to form conductive lines in the vertical direction, respectively. A first socket module that includes a first socket module, a second insulating body made of an insulating material, and a plurality of second conductive patterns each forming a conductive line in a vertical direction, and positions corresponding to each other when seated on an upper portion of the first socket module And a second socket module in which the first conductive pattern and the second conductive pattern are in contact with each other to electrically connect the first conductive pattern and the second conductive pattern; Each of the first conductive patterns includes an upper contact portion protruding upward toward the second socket module to contact the second conductive pattern; It is characterized in that it is formed in an empty space between the first insulating body and the second insulating body by the upper contact portion protruding upward toward the second socket module.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view of the test socket 100 according to the first embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2. 2 and 3, the test socket 100 according to the first embodiment of the present invention includes a first socket module 110 and a second socket module 130.

The first socket module 110 is disposed under the second socket module 130 and is electrically connected to the inspection circuit board side. Here, the first socket module 110 includes a first insulating body 111 and a plurality of first

conductive patterns

112, 113, and 114.

The first insulating body 111 is made of an insulating material, and is made of a silicon material having elasticity. Here, the first insulating body 111 is formed with a plurality of first through holes 111a (see Fig. 7 (a)) penetrating in the vertical direction, and each of the first

conductive patterns

112, 113 and 114 It is formed in the through hole 111a to form a plurality of conductive lines in the vertical direction.

Each of the first

conductive patterns

112, 113, and 114 may include an upper contact part 113 and an inner conductive part 112. In addition, each of the first

conductive patterns

112, 113, and 114 may further include a lower contact portion 114.

The upper contact portions 113 protrude upward toward the first socket module 110 and contact each of the second conductive patterns 132 to be described later of the first socket module 110. In the present invention, the upper contact part 113 protrudes upward from the inner conductive part 112 and is in contact with the second conductive pattern 132, so that the second conductive pattern 132, the upper contact part 113, and the inner conductive part 112 is to form a conductive line in the vertical direction.

The inner conductive part 112 is formed in the first through hole 111a, and is formed by curing a liquid material including conductive powder having conductivity in the first through hole 111a. That is, when conductive powder and liquid silicon are mixed and injected into the first through hole 111a to cure it, the inner conductive portion 112 having conductivity can be formed.

In the present invention, the upper contact part 113 is also formed by curing a liquid material including a conductive powder having conductivity, for example, liquid silicon. In this case, the composition of the conductive powder and liquid silicon for forming the inner conductive part 112 and the upper contact part 113 may be different from each other. For example, the upper contact part 113 may have a higher composition of the conductive powder so that the conductive powder is more densely disposed. In this case, the hardness of the upper contact part 113 is larger than that of the inner conductive part 112. do.

In addition, the diameter of the upper contact part 113 is provided smaller than the diameter of the inner conductive part 112. When the upper contact part 113 is pressed in the lower direction by the second socket module 130, the diameter of the inner conductive part ( The upper contact portion 113, which is smaller than 112) and having a hardness greater than that of the inner conductive portion 112, may have a shape that is pushed into the inner conductive portion 112, and a detailed description will be described later.

Meanwhile, the lower contact portion 114 is formed under the inner conductive portion 112 and protrudes downward of the first insulating body 111. Like the upper contact part 113, it may be formed by curing a liquid material including a conductive powder having conductivity, for example, liquid silicone. In addition, the composition of the conductive powder and liquid silicon for forming the inner conductive part 112 and the lower contact part 114 may be different from each other. For example, the lower contact portion 114 may have a more dense composition of the conductive powder, so that the lower contact portion 114 has a hardness larger than that of the inner conductive portion 112. do.

In addition, the diameter of the lower contact portion 114 is provided smaller than the diameter of the inner conductive portion 112. When the first

conductive patterns

112, 113, 114 are pressed downward, the diameter is smaller than the inner conductive portion 112, and the hardness is The lower contact portion 114 that is larger than the inner conductive portion 112 may have a shape that is pushed into the inner conductive portion 112, and a detailed description will be provided later.

Meanwhile, the second socket module 130 includes a second insulating body 131 and a plurality of second conductive patterns 132.

The second insulating body 131 is made of an insulating material, and in the present invention, it is assumed that it is made of an FR4 film or a PI film. The thickness of the second insulating body 131 manufactured in the form of a film is provided to be thinner than that of the first insulating body 111, and the first insulating body 111 forms the entire structure of the test socket 100, and 2 The second socket module 130 including the insulating body 131 is mounted on the first socket module 110.

A plurality of second through holes 131a penetrated in the vertical direction are formed in the second insulating body 131, and the second conductive patterns 132 are formed in each of the second through holes 131a.

In the present invention, as an example, the second conductive pattern 132 is formed by curing a liquid material including a conductive powder having conductivity, for example, liquid silicon, and a method of manufacturing the second conductive pattern 132 will be described later.

Here, the second socket module 130 according to the present invention may further include a support ring 133. The support ring 133 is interposed between the inner surface of each second through hole 131a and the circumference of the second conductive pattern 132 so that the second conductive pattern 132 is inside the second through hole 131a. Supported to be positioned.

In addition, the support ring 133 is made of a material having elasticity, and in the present invention, it is assumed that liquid silicone is cured and formed. Through this, when the second conductive pattern 132 is pressed in the downward direction, the movement of the second conductive pattern 132 in the downward direction is elastically supported. This support structure supports the second conductive pattern 132 in a structure similar to a trampoline.

Meanwhile, FIG. 4 is a cross-sectional view of a test socket 100a according to a second embodiment of the present invention. The test socket 100a according to the second embodiment shown in FIG. 4 corresponds to the configuration of the first embodiment, and further includes an elastic spring 115.

The elastic spring 115 is provided inside the first insulating body 111 to surround each inner conductive portion 112. In addition, the elastic spring 115 provides a restoring force in the upper direction when the second socket module 130 is pressed downward during the test process.

According to the above configuration, as shown in FIG. 3, when the second socket module 130 is seated on the first socket module 110, the upper portion protruding upward from the first socket module 110 The contact portion 113 is in contact with the second conductive pattern 132 of the second socket module 130, at this time, the first insulating body by the upper contact portion 113 protruding upward toward the first socket module 110 An empty space is formed between 111 and the second insulating body 131.

Here, when the

test sockets

100 and 100a according to the present invention are applied for inspection of a semiconductor device, each terminal or ball of the semiconductor device moves each of the second conductive patterns 132 and the first

conductive patterns

112, 113, and 114 downward. At this time, the force acting in the upper direction decreases the force applied in the upper direction by the empty space between the first insulating body 111 and the second insulating body 131. As a result, the semiconductor device is pressed with a relatively small force, so that damage to the semiconductor device or the

test sockets

100 and 100a can be prevented.

In addition, in the trend that the plate surface size increases with the increase in the number of pins of the semiconductor package, the semiconductor device is pressed in the direction of the

test sockets

100 and 100a with a greater force to compensate for the height deviation between the two edges. As the force applied to the upper direction of the

test sockets

100 and 100a in the test process is reduced, the test is possible even if the semiconductor device is pressed with a relatively small force, so that damage to the semiconductor device can be prevented.

In addition, in the second embodiment, the elastic spring 115 compensates for the restoring force that may be lost due to the empty space. That is, the force acting in the upper direction does not have a large influence by the elastic modulus of the spring, but due to the characteristic of the elastic spring 115, the restoring force increases, thereby increasing the life of the test socket 100a according to the present invention. You can make it.

In addition, of the first socket module 110 and the second socket module 130 forming an empty space, the second socket module 130, which is easily damaged by contact with the semiconductor element, is removed from the first socket module 110. Since it can be separated, it is possible to replace only the second socket module 130 when the second socket module 130 is damaged, thereby reducing the replacement cost according to the damage. Similarly, even when the first socket module 110 is damaged, only the first socket module 110 can be replaced, and thus test

sockets

100 and 100a capable of partial replacement are provided.

5 is a diagram for explaining an operation process of the test socket 100 according to the first embodiment of the present invention. Referring to FIG. 5, an operation process of the test socket 100 according to the first embodiment of the present invention will be described. As shown in FIG. 5A, when the semiconductor device descends, each of the semiconductor devices The ball comes into contact with the second conductive pattern 132.

When the ball of the semiconductor device continues to push the second conductive pattern 132 downward, as shown in FIGS. 5B and 5D, the upper contact portion of the first socket module 110 ( 113) and the lower contact portion 114 are pushed into the inner contact portion, thereby elastically supporting the pressing of the semiconductor device.

An example of the operation shown in FIG. 5 is shown on the assumption that the test socket 100 according to the present invention is pressed in an extremely downward direction, and is transformed into a shape as shown in FIG. 5 in all test processes. Does not mean. In addition, although the lower contact portion 114 is first pushed in and the upper contact portion 113 is pushed in later, the order is not limited thereto, and may be pushed together or in the opposite order.

Similarly, as shown in (a) of Figure 6, according to the structure of the support ring 133 described above, the elastic support of the support ring 133 before the upper contact portion 113 and the lower contact portion 114 are pushed in. It can happen first or later. That is, each of the components constituting the test socket 100 according to the present invention elastically supports the pressure in the upward direction, the order of which is not limited to the above-described example, regardless of the order of the present invention. It is natural to be included in the technical matters.

6B shows the second socket module 130a when the terminal of the semiconductor device is in the LGA (Land Grid Array) form instead of the BGA (Ball Grid Array) form shown in FIG. 6A. 2 is a view showing an example in which the protruding contact portion 134 protruding from the upper surface of the conductive pattern 132 is formed.

Hereinafter, a method of manufacturing the test socket 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 7 and 8.

7 is a view for explaining a method of manufacturing the first socket module 110 of the test socket 100 according to the first embodiment of the present invention. Referring to FIG. 7, first, a first insulating body 111 in which a plurality of first through holes 111a are formed is provided. Here, after the first insulating body 111 is made of a silicon material, the first through hole 111a may be formed through a laser.

In addition, a plurality of first mold rods (not shown, hereinafter the same) are injected into a first mold (not shown, hereinafter the same) that protrudes upward and then cured, thereby forming a first through hole 111a. 1 Insulation body 111 can be manufactured. Here, in the case of the test socket 100 according to the second embodiment described above, when the elastic spring 115 is inserted into each of the first mold rods, silicone is injected and then cured, each of the first through holes 111a ) It is possible to manufacture the first insulating body 111 in which the elastic spring 115 is disposed around.

When the first insulating body 111 having a plurality of first through holes 111a formed as described above is provided, liquid silicon including conductive powder is injected into each of the first through holes 111a and then cured. As shown in (b) of 7, the inner conductive portion 112 is formed in the first insulating body 111.

In addition, as shown in (c) of FIG. 7, a first mold sheet having a first mold hole 310a having an inner diameter smaller than that of the first through hole 111a is formed on the first insulating body 111 ( After mounting 310), when liquid silicon including conductive powder is injected into each of the first mold holes 310a and then cured, the upper contact part 113 is formed on the inner conductive part 112. In this case, when the lower contact portion 114 is formed in the same manner, the first socket module 110 as shown in FIG. 7D can be manufactured.

Referring to FIG. 8, the manufacturing process of the second socket module 130 according to the present invention will be described. First, a second insulating body 131 having a plurality of second through holes 131a formed thereon is formed with a second mold rod ( The second mold 321 is mounted on the formed second mold 320. At this time, each second mold rod 321 is inserted into the second through hole 131a, and as shown in Fig. 8A, the diameter of the second mold rod 321 is the second through hole A space is formed between the second mold rod 321 and the second through hole 131a by providing smaller than the inner diameter of (131a).

And, as shown in (b) of FIG. 8, when liquid silicone is injected between the second mold rod 321 and the second through hole 131a and then cured, it is shown in (c) of FIG. As described above, the support ring 133 is formed, and after placing it on the third mold 330 of the flat plate, liquid silicon having conductive powder is injected into the space formed by the removal of the second mold rod 321 to cure. If so, it is possible to manufacture the second socket module 130 composed of the second conductive pattern 132, the support ring 133, and the second insulating body 131, as shown in (d) of FIG. do.

9 is a cross-sectional view of a test socket 100b according to a third embodiment of the present invention. The test socket 100b according to the third embodiment shown in FIG. 9 is a modified example of the test socket 100 according to the first embodiment, and further includes an upper insulating ring 116.

The upper insulating ring 116 is formed to surround the outer circumferential surface of each of the upper contact parts 113, and surrounds the outside of the upper contact part 113 so that the upper part of the upper contact part 113 protrudes upward. In this case, the upper insulating rings 116 adjacent to each other are spaced apart from each other to form a space therebetween, as shown in FIG. 9, thereby providing the same effect as in the first embodiment, and the adjacent upper contact portions 113 It is possible to prevent a short that may occur between the liver.

Likewise, the test socket 100b according to the third embodiment of the present invention may further include a lower insulating ring 117. The lower insulating ring 117 is formed to surround the outer circumferential surface of each of the lower contact portions 114, and surround the outside of the lower contact portion 114 so that the lower portion of the lower contact portion 114 protrudes downward. In this case, the lower insulating rings 117 adjacent to each other are spaced apart from each other to form a space therebetween, as shown in FIG. 9, thereby providing the same effect as in the first embodiment, and the adjacent lower contact portions 114 It is possible to prevent a short that may occur between the liver.

Here, the upper insulating ring 116 and the lower insulating ring 117 are formed with the upper contact part 113 and the lower contact part 114 as shown in (c) and (d) of FIG. 7. 113) and a mold sheet (not shown) having a mold hole (not shown) having an inner diameter larger than the diameter of the lower contact portion 114 to be manufactured through the method shown in FIGS. 8A and 8B. I can.

10 is a diagram showing another example of the second socket module 130b of the test socket 100 according to an embodiment of the present invention. As shown in FIG. 10, a plurality of operation holes 135 vertically penetrating between the second conductive patterns 132 are formed in the second insulating sheet of the second socket module 130b. Here, the plurality of operation holes 135 may be formed randomly in the second insulating sheet or may be formed with a certain rule.

The plurality of operation holes 135 are formed between the second conductive patterns 132, so that the second conductive patterns 132 of the second insulating body 131 can independently move in the vertical direction. By providing, each of the second conductive patterns 132 can independently and stably contact the first

conductive patterns

112, 113, and 114.

Although some embodiments of the present invention have been shown and described, those skilled in the art of ordinary skill in the art to which the present invention pertains will appreciate that the present embodiments can be modified without departing from the principles or spirit of the present invention. . The scope of the invention will be determined by the appended claims and their equivalents.

[Explanation of code]

100, 100a, 100b: test socket

110: first socket module 111: first insulating body

111a: first through hole 112: inner conductive part

113: upper contact portion 114: lower contact portion

115: elastic spring

130, 130a, 130b: second socket module

131: second insulating body 131a: second through hole

132: second conductive pattern 133: support ring

134: protruding contact part 135: operation hole

310: first mold sheet 310a: first mold hole

320: second mold 321: second mold rod

330: 3rd mold

The present invention is disposed between an electronic component such as a semiconductor device and an inspection circuit board and applied to electrically connect it.

Claims

In a partially replaceable test socket,

A first socket module including a first insulating body made of an insulating material, and a plurality of first conductive patterns formed to be spaced apart from each other on the first insulating body to form conductive lines in a vertical direction, respectively,

A second insulating body made of an insulating material and a plurality of second conductive patterns each forming a conductive line in a vertical direction, the first conductive pattern at a position corresponding to each other when seated on the first socket module And a second socket module in which the second conductive pattern is in contact with each other to electrically connect the first conductive pattern and the second conductive pattern;

Each of the first conductive patterns includes an upper contact portion protruding upward toward the second socket module to contact the second conductive pattern;

Partly replaceable test socket, characterized in that formed in an empty space between the first insulating body and the second insulating body by the upper contact portion protruding upward toward the second socket module.
The method of claim 1,

A plurality of first through holes penetrating in the vertical direction are formed in the first insulating body;

Each of the first conductive patterns further includes an inner conductive portion formed by curing a liquid material including conductive powder having conductivity in the first through hole;

The upper contact part is formed on the inner conductive part and protrudes upward toward the second socket module.
The method of claim 2,

The upper contact portion has a diameter smaller than the diameter of the inner conductive portion, and the upper contact portion is pushed into the inner conductive portion when pressed in a downward direction by the second socket module. .
The method of claim 2,

And a lower contact portion formed under the inner conductive portion and protruding toward a lower portion of the first insulating body.
The method of claim 4,

The lower contact portion is provided with a diameter smaller than the diameter of the inner conductive portion, and the lower contact portion is pushed into the inner conductive portion when the first socket module is pressed downward by the second socket module. Test socket with partial replacement.
The method of claim 4,

The upper and lower contact portions are partially replaceable test sockets, characterized in that formed by curing a liquid material containing conductive powder.
The method of claim 2,

Partly replaceable test socket, characterized in that it further comprises an elastic spring provided inside the first insulating body so as to surround the inner conductive portion.
The method of claim 1,

The second insulating body is provided with a plurality of second through holes penetrating in the vertical direction, and the second conductive pattern is formed in each of the second through holes.
The method of claim 8,

The second socket module further includes a support ring interposed between the inner surface of each of the second through holes and the circumference of the second conductive pattern to support the second conductive pattern so as to be located inside the second through hole, ;

The support ring is made of an insulating material having elasticity, and when the second conductive pattern is pressed downward, it elastically supports the movement of the second conductive pattern in a downward direction. socket.
The method of claim 8,

The second insulating body is provided with an FR4 film or a PI film;

Partly replaceable test socket, characterized in that the thickness of the second insulating body is provided thinner than the thickness of the first insulating body.
The method of claim 2,

The first socket module further includes an upper insulating ring surrounding the outer circumferential surface of each of the upper contact portions, and surrounding the upper contact portion such that an upper portion of the upper contact portion protrudes upward;

The upper insulating rings adjacent to each other are spaced apart from each other to form a space between the test socket that can be partially replaced.
The method of claim 4,

The first socket module further includes a lower insulating ring surrounding the outer circumferential surface of each of the lower contact portions, and surrounding the lower contact portion such that a lower portion of the lower contact portion protrudes downward;

The partially replaceable test socket, characterized in that the lower insulating rings adjacent to each other are spaced apart from each other to form a space therebetween.