WO2017209357A1

WO2017209357A1 - Bidirectional conductive pin, bidirectional conductive pattern module and method for preparing same

Info

Publication number: WO2017209357A1
Application number: PCT/KR2016/012421
Authority: WO
Inventors: 문해중; 이지형; 이은주
Original assignee: 주식회사 이노글로벌
Priority date: 2016-05-30
Filing date: 2016-11-01
Publication date: 2017-12-07
Also published as: TWI635283B; TW201741675A; CN108283014A

Abstract

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: an upper contact portion which is formed by means of winding a conductive thin plate into the form of a spring with respect to a vertical axis and is for resiliently supporting upon contact from the upper part; a lower contact portion which is formed by means of winding a conductive thin plate into the form of a spring with respect to the vertical axis and is for resiliently supporting upon contact from the lower part; and at least one connecting portion which is for electrically connecting the upper contact portion and the lower contact portion. Therefore, conductive thin metal plates are patterned, spring-type upper contact portion and lower contact portion are formed by winding the patterns by means of molding and the like, and connecting portions are wound and twisted together in the circumferential direction and have a resilient restoring force in the vertical direction, and thus a vertical bidirectional conductive pin can be produced.

Description

Bidirectional conductive pins, bidirectional conductive pattern modules, and a method of manufacturing the same

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method of manufacturing the same, and more particularly, to a bidirectional conductive pin, a bidirectional conductive pattern module, and a fabrication thereof, which can compensate for a disadvantage of a pogo-pin type semiconductor test socket. It is about a method.

After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.

However, the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, a conventional semiconductor test socket 100 includes a housing 110 having a through hole 111 formed in a vertical direction at a position corresponding to a terminal 131 of a semiconductor device 130; Pogo-pin 120 mounted in the through hole 111 of the housing 110 to electrically connect the terminal 131 of the semiconductor device 130 and the pad 141 of the test device 140. Is done.

The configuration of the pogo-pin (120) (pogo-pin) (120) is used as a pogo-pin (Pogo-pin) body, the barrel 124 having a cylindrical shape with an empty inside, and formed on the lower side of the barrel 124 The semiconductor device may be connected to a contact tip 123, a spring 122 connected to the contact tip 123 inside the barrel 124 and contracting and expanding a motion, and a spring 122 connected to the contact tip 123. 130 is composed of a contact pin 121 to perform the vertical movement in accordance with the contact.

At this time, the spring 122 is contracted and expanded while absorbing the mechanical shock transmitted to the contact pin 121 and the contact tip 123, the terminal 131 of the semiconductor device 130 and the pad of the test device 140 141 is electrically connected to check whether there is an electrical defect.

However, the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.

In order to overcome the limitations of the pogo-pin type semiconductor device, the limited technology forms a perforated pattern in a vertical direction on a silicon main body made of an elastic silicon material, and then conductive powder inside the perforated pattern. It is a PCR socket type semiconductor test socket that fills the conductive pattern to form a conductive pattern.

However, the PCR-type semiconductor test socket also has a problem due to structural limitations of the PCR-type semiconductor test socket, such as a problem of shortening of life due to separation of conductive powder filled therein.

Accordingly, there is a need for development of other types of semiconductor test sockets capable of realizing fine pitches, but also to solve the problems of height limitations and other types of semiconductor test sockets such as PCR type semiconductor test sockets.

Accordingly, the present invention has been made to solve the above problems, to compensate for the shortcomings of the pogo-pin type and PCR-type semiconductor test socket, bi-directional conductivity that can replace the pogo-pin type semiconductor test socket An object of the present invention is to provide a pin, a bidirectional conductive pattern module, and a method of manufacturing the same.

According to the present invention, in the bidirectional conductive pin, the conductive thin plate is formed by winding in the vertical shape in the axial direction, and the upper contact portion to elastically support during contact in the upper direction, and the thin plate having conductivity A lower contact part formed by winding in a vertical shape with an axis in the vertical direction and supporting elastically when contacted in a lower direction, and at least one connection part electrically connecting the upper contact part and the lower contact part; Achieved by a bidirectional conductive pin.

Here, the upper contact portion, the lower contact portion and the connecting portion may be formed together by winding a base pattern formed by patterning a conductive thin plate in a winding shape along the vertical direction.

The pin body may further include an insulating pin body having an elasticity formed between the upper contact portion and the lower contact portion to be accommodated therein.

The apparatus may further include at least one internal support part extending downward from the upper contact part, the lower end of which is spaced apart from the lower contact part by a predetermined distance.

In addition, the inner curled portion of the upper contact portion may protrude in an upward direction than the outer curled portion and may be formed stepped outward in the radial direction.

The inner contact portion of the lower contact portion may protrude in a lower direction than the outer curl portion to be stepped outward in the radial direction.

In addition, the connection part may be formed to have a predetermined width in the horizontal direction to support the upper contact part and the lower contact part in the vertical direction between the upper contact part and the lower contact part.

On the other hand, the above object is, according to another embodiment of the present invention, in the bidirectional conductive pattern module, the insulating body and the inside of the insulating body in a state spaced apart from each other in the horizontal direction, each of the upper and lower portions of the insulating body A plurality of bidirectional conductive pins exposed on the top and bottom surfaces of the substrate; Each of the bidirectional conductive pins is formed by winding a thin conductive sheet in an up-and-down direction in an axial spring shape to support elastically upon contact in an upward direction, and a thin conductive plate is axially in the vertical direction. It is also achieved by the bidirectional conductive pattern module, characterized in that it comprises a lower contact portion which is formed in the form and is elastically supported during contact in the lower direction, and at least one connection portion that electrically connects the upper contact portion and the lower contact portion. do.

Here, the inner curled portion of the lower contact portion may protrude in a lower direction than the outer curled portion and may be stepped outward in the radial direction.

On the other hand, the above object is, according to another embodiment of the present invention, in the method of manufacturing a bidirectional conductive pattern module, (a) by patterning a thin plate having conductivity, and a plurality of upper contact patterns spaced apart from each other in the horizontal direction, and up and down A base having a plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the horizontal direction and spaced apart from each other in the horizontal direction, and at least one connection pattern connecting the upper contact patterns and the lower contact patterns at mutually corresponding positions; Forming a pattern; (b) plating the base pattern; (c) connecting the plurality of upper contact portions, the plurality of lower contact portions, and the corresponding upper contact portion and the lower contact portion by rolling the shaft in the up-down direction such that each of the upper contact pattern and each of the lower contact patterns has a winding shape. It is also achieved by a method of manufacturing a bidirectional conductive pattern module comprising the step of forming a connecting portion.

Here, (d) an insulating main body of an insulating material having elasticity such that upper portions of the upper contact portions and lower surfaces of the lower contact portions are exposed in the upper direction and the lower direction, respectively, so that the connection portion is accommodated therein. It may further comprise forming a.

In addition, in the step (a), the connection pattern may be formed in a diagonal direction to connect the upper contact pattern and the lower contact pattern corresponding to each other.

In addition, the upper contact pattern and the lower contact pattern corresponding to each other in the step (c) may be formed around the same axis in an up and down direction so that the upper contact part and the lower contact part are formed at a position corresponding to the up and down direction.

In the step (a), at least one inner support pattern protruding from the upper contact pattern in the direction of the lower contact pattern is formed together with a thin plate having conductivity in the patterning process; The inner support pattern may form an inner support part extending downward from the upper contact part through the step (c).

The upper contact pattern may have a different width in the vertical direction or may be stepped in the horizontal direction, such that the inner curled portion of the upper contact portion protrudes upward from the outer curled portion to step radially outwardly. Can be formed.

In addition, the lower contact pattern is formed in a different width in the vertical direction or stepped in the horizontal direction, so that the inner curled portion of the lower contact portion protrudes in a lower direction than the outer curled portion to step outward in the radial direction Can be formed.

The connection pattern may be formed to have a predetermined width in the horizontal direction so that the connection part may support the upper contact part and the lower contact part in the vertical direction between the upper contact part and the lower contact part.

On the other hand, according to another embodiment of the present invention, in the manufacturing method of the bidirectional conductive pin, the step of manufacturing the bidirectional conductive pattern module according to the manufacturing method of the bidirectional conductive pattern module, and the bidirectional conductive pattern module It is also achieved by the method of manufacturing a bi-directional conductive pin comprising the step of cutting the insulating body of the upper and lower direction, but the interconnected one by one of the upper contact, the lower contact and the connecting unit to form a plurality of bi-directional conductive pins. .

According to the present invention according to the configuration as described above, by patterning the metal thin plate with conductivity, and rolled the pattern using a method such as a mold to form the upper contact portion and the lower contact portion of the winding shape, the connecting portion is wound together wound in the circumferential direction It has elastic restoring force in the vertical direction, so that one bidirectional conductive pin can be realized in the vertical direction.

In addition, when the upper contact portion in the form of a spring comes into contact with the terminal of the semiconductor element, for example, a ball, the main part of the main spring is first contacted and then sequentially contacted to the outside to allow more stable contact and stable restoration when the contact is removed. do.

In addition, by patterning the thin metal plate using an etching or stamping method, and rolling it into a cylindrical shape with a mold or the like, the manufacturing method can be simplified and the manufacturing cost can be significantly reduced.

In addition, a semiconductor test in which a plurality of conductive patterns are formed in a horizontal direction and a depth direction by manufacturing a bidirectional conductive pattern module having a plurality of bidirectional conductive pins formed in a horizontal direction by simultaneously manufacturing a plurality of patterns in the horizontal direction and placing them in a depth direction. It is also possible to manufacture a socket for use.

1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket,

4 is a view for explaining the principle of formation of the bidirectional conductive pin according to an embodiment of the present invention,

5 and 6 are views for explaining a manufacturing method of a bidirectional conductive pin and a bidirectional conductive pattern module according to the present invention,

7 to 11 are views showing various examples of the base pattern according to the present invention,

12 and 13 illustrate an example of a bidirectional conductive pin according to another embodiment of the present invention.

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method of manufacturing the same. The bidirectional conductive pin according to the present invention is formed by winding a thin conductive plate in an up-and-down direction in an axial direction, and an upper contact part elastically supporting the contact in the upper direction, and a thin conductive plate is in the vertical direction. It is characterized in that it comprises a lower contact portion which is formed in a winding form and elastically supports when contacting in the lower direction, and at least one connecting portion electrically connecting the upper contact portion and the lower contact portion.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

4 is a view for explaining the principle of formation of the bidirectional conductive pin 10 according to the present invention. Referring to FIG. 4B, the bidirectional conductive pin 10 according to the present invention includes an upper contact 11, a lower contact 12, and a connection 13. In addition, the bidirectional conductive pin 10 according to the present invention may further include a pin body 14.

Bi-directional conductive pin 10 according to the present invention, as shown in Fig. 4 (a), is produced using a base pattern 100a formed through the patterning of a thin plate having conductivity, for example, a metal thin plate. As illustrated in FIG. 4A, the base pattern 100a includes an upper contact pattern 11a, a lower contact pattern 12a, and at least one connection pattern 13a connecting them.

The upper contact pattern 11a and the lower contact pattern 12a of the base pattern 100a are dried two or more times with the axis (Axis, hereinafter equal) up and down, as shown in FIG. 4C. When manufactured in the form, the upper contact portion 11 and the lower contact portion 12 of the bidirectional conductive pin 10 according to the present invention can be formed.

Here, in the present invention, as shown in Fig. 4 (a), the connection pattern 13a is in the diagonal direction between the upper contact pattern 11a and the lower contact pattern 12a and the lower contact with the upper contact pattern 11a. When the pattern 12a is formed to be connected to each other, the upper contact pattern 11a and the lower contact pattern 12a are rolled together to form the upper contact portion 11 and the lower contact portion 12 in a winding shape, and thus It has a twisted shape as shown in (b).

When the terminal of the semiconductor device, for example, the ball, contacts the upper contact portion 11 having the spring shape as described above in the downward direction, as shown in (c) of FIG. ① part first comes into contact with the ball and descends in the downward direction, and ② is sequentially contacted in the order of # and ③, thereby having elastic contact and restoring force to restore to the original state after contact removal. That is, it is elastically supported during contact in the upper direction.

Similarly, when the terminal of the test circuit board contacts the lower contact portion 12 from the lower direction to the upper direction, the terminal of the inspection circuit board is sequentially contacted from the inner portion to the outer portion of the winding shape to elastically support the contact in the lower direction. .

In addition, the connecting portion 13 electrically connects the upper contact portion 11 and the lower contact portion 12, so that the upper contact portion 11, the connecting portion 13, and the lower contact portion 12 form one conductive line in the vertical direction. It becomes possible to use for the inspection of a semiconductor element by doing so.

Here, the pin body 14 is formed between the upper contact portion 11 and the lower contact portion 12 so that the connecting portion 13 is accommodated therein to support the upper contact portion 11 and the lower contact portion 12. Here, for example, the pin body 14 is made of an insulating material having elasticity, for example, a silicon material.

Hereinafter, a method of manufacturing the bidirectional conductive pattern module 100 and the bidirectional conductive pin 10 according to the present invention will be described in detail with reference to FIGS. 5 and 6.

Referring to FIGS. 5 and 6, first, a thin metal plate is prepared and the metal thin plate is patterned to form a base pattern 100a as shown in FIG. 5A. Here, the metal thin plate may be provided with a material having conductivity, but the conductivity may be formed through a plating process to be described later, and the conductivity of the metal thin plate may not be essential. The material of the metal sheet may be formed of copper or a copper alloy, for example BeCu. In the present invention, an etching method or a stamping method is applied as an example of the metal thin plate patterning method.

Referring to FIG. 5A, the base pattern 100a formed through the patterning process of the thin metal plate may include a plurality of upper contact patterns 11a, a plurality of lower contact patterns 12a, and corresponding upper portions. The connection pattern 13a connects the contact pattern 11a and the lower contact pattern 12a. Here, the configuration of one upper contact pattern 11a, lower contact pattern 12a, and a connection pattern 13a connecting the same is as shown in FIG. 4A, and is shown in FIG. 5A. In the illustrated embodiment, the connection pattern 13a has a shape that is curved in the horizontal direction.

The plurality of upper contact patterns 11a are formed to be spaced apart from each other in the horizontal direction. The plurality of lower contact patterns 12a are formed to be spaced apart from each other in the horizontal direction while being spaced apart from the upper contact pattern 11a in the vertical direction.

Here, the base pattern 100a may be configured to simultaneously perform subsequent operations using the plurality of upper contact patterns 11a, the plurality of lower contact patterns 12a, and the connection pattern 13a, respectively. And an upper support pattern 121 connected to the upper connection pattern 123, and a lower support pattern 122 connected to each of the lower contact patterns 12a and the lower connection pattern 124.

When the manufacturing of the base pattern 100a is completed as described above, the plating process is performed to improve the conductivity of the base pattern 100a. In the present invention, the nickel plating and gold plating are sequentially performed.

When the plating process is completed, as shown in (c) of FIG. 4, the upper and lower directions are rolled around the axis such that each of the upper contact patterns 11a and each of the lower contact patterns 12a have a winding shape. As shown in (b), the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 are formed, respectively. Here, when the upper contact pattern 11a and the lower contact pattern 12a are wound in a winding shape, the connection part 13 is formed in a twisted shape in which the connection pattern 13a is rolled together.

In this case, the upper contact pattern 11a and the lower contact pattern 12a corresponding to each other may be rolled about the same axis in the vertical direction to form the upper contact portion 11 and the lower contact portion 12 at positions corresponding to the vertical direction. .

As described above, when the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 is formed, as shown in (c) of FIG. 5, the upper surface of each upper contact portion 11, and The insulating body 110 is formed such that the lower surface of the lower contact portion 12 is exposed in the upper direction and the lower direction. In FIG. 5C, the insulating main body 110 is formed such that the connecting portion 13 can be accommodated therein to the extent that the lower portion of the upper contact portion 11 and the upper portion of the lower contact portion 12 are covered. Yes.

For example, the base pattern 100a illustrated in FIG. 5B may be installed in a mold, and then the liquid silicone may be injected and then cured to form the insulating body 110. Through this, the upper surface of the upper contact portion 11 and the lower surface of the lower contact portion 12 are exposed to the outside of the insulating body 110, the remaining portion of the upper contact portion 11, of the lower contact portion 12 The remaining part and the connection part 13 are positioned inside the insulating body 110.

Through the above process, when the insulating main body 110 is completed, the upper connection pattern 123 and the lower connection pattern through laser cutting or the like along the cutting lines C1 and C2 shown in FIG. When cutting 124, the bidirectional conductive pattern module 100 as shown in FIG. 6A can be manufactured.

Referring to FIG. 6A, the bidirectional

conductive pattern modules

100 and 100 are spaced apart from each other in the transverse direction inside the insulating

bodies

110 and 110, respectively. Is formed. At this time. The upper contact portion 11, the lower contact portion 12, and the connection portion 13 of the honeycomb constitute one bidirectional conductive pin 10 and form one conductive line in the vertical direction.

When the plurality of bidirectional conductive pattern modules 100 are arranged in the depth direction, the semiconductor test socket having the plurality of conductive patterns in the horizontal direction and the depth direction can be configured.

In addition, by cutting along a cutting line C3 shown in FIG. 6A by laser cutting or the like, one bidirectional conductive pin 10 as shown in FIG. 6B can be manufactured. The remaining portion between the upper contact portion 11 and the lower contact portion 12 of the insulating body 110 forms the pin body 14 of the bidirectional conductive pin 10. One bidirectional conductive pin 10 manufactured as described above may replace the existing pogo pin.

7 to 11 illustrate examples of various types of base patterns 100a. The technical idea according to the present invention is as described above, and various modifications and other modifications of the base pattern 100a illustrated in FIGS. 7 to 11 are also included in the technical idea of the present invention. That is, those skilled in the art will be able to manufacture the base pattern 100a according to various modifications within the scope of the technical idea of the present invention in addition to the embodiments illustrated in the present invention.

For example, FIG. 10 illustrates an example in which the upper contact portion 11 and the lower contact portion 12 are changed in shape according to the shape of the upper contact pattern 11a and the lower contact pattern 12a. In addition, in the example shown in FIG. 11A, when the inner support pattern 15a is formed from the upper contact pattern 11a to the lower side, the insulating main body 110 or the pin body 14 is formed in FIG. 11. As an example, the inner support 15 is formed as shown in (b). In this case, the inner support pattern 15a may be formed together in the patterning process of the metal sheet in the exaggeration of the formation of the base pattern 100a through the patterning of the metal sheet.

Hereinafter, a bidirectional conductive pin 10 ′ according to another embodiment of the present invention will be described with reference to FIG. 12.

Referring to FIG. 12, the bidirectional conductive pin 10 ′ according to the present invention includes an upper contact 11 ′, a lower contact 12 ′ and a connection 13 ′. In addition, as in the above-described embodiment, the bidirectional conductive pin 10 ′ may include an internal support 15 ′ and a pin body 14.

Here, in the embodiment shown in FIG. 12, as shown in FIG. 12A, the upper contact pattern 11a ′ is formed to be stepped in the horizontal direction. Accordingly, when the upper contact pattern 11a 'is rolled up in an up-and-down direction in a spring shape to form the upper contact portion 11', as shown in FIG. 12 (b), the upper contact portion 11 ' The inner curled portion projects upwards from the outer curled portion. That is, as shown in FIG. 12B, the upper contact portion 11 ′ is stepped radially outward.

Accordingly, when the terminals of the semiconductor element come into contact with the upper surface of the upper contact portion 11 ′, the inner curled portion first contacts and moves downward, and the outer curled portion further contacts to make more stable contact and elastic contact. This becomes possible.

In the embodiment illustrated in FIG. 12, the upper contact pattern 11a ′ is formed to be stepped in the horizontal direction, but as in the embodiment illustrated in FIGS. 10B, 10C, and 10D. Since the upper contact pattern 11a ′ is formed to have a different width in the vertical direction, the upper contact portion 11 ′ may be formed to have a shape protruding upward toward the inner side.

Similarly, as shown in FIG. 12A, the lower contact pattern 12a ′ may be stepped in the horizontal direction. Accordingly, when the lower contact pattern 12a 'is rolled up in an up-and-down direction to form a lower contact part 12', as shown in FIG. 12 (b), the lower contact part 12 ' The inner curled portion projects outward from the outer curled portion. That is, as shown in FIG. 12B, the lower contact portion 12 ′ is stepped radially outward.

Accordingly, when the terminals of the test circuit board come into contact with the lower surface of the lower contact portion 12 ', the inner curled portion first contacts and moves downward, and the outer curled portion further contacts to make more stable contact and elasticity. Contact is possible.

In the embodiment illustrated in FIG. 12, the lower contact pattern 12a ′ is formed to be stepped in the horizontal direction, but as in the embodiment illustrated in FIGS. 10B, 10B, and 10D. Since the lower contact pattern 12a ′ is formed to have a different width in the vertical direction, the lower contact part 12 ′ may be formed to have a shape protruding downward toward the inner side.

Hereinafter, the bidirectional conductive pin 10 ″ according to another exemplary embodiment of the present invention will be described with reference to FIG. 13.

Referring to FIG. 13, the bidirectional conductive pin 10 ″ according to the present invention includes an upper contact 11 ″, a lower contact 12 ″ and a connection 13 ″. 13 illustrates an example in which the inner support 15 'is not provided.

In addition, in the embodiment shown in FIG. 13, the pin body 14 is not formed, and the connecting portion 13 ″ is the upper contact 11 ″ between the upper contact 11 ″ and the lower contact 12 ″. ) And the lower contact 12 '' are taken as an example. To this end, as shown in FIG. 13A, the connection pattern 13a ″ is formed to have a predetermined width in the horizontal direction, through which the upper contact pattern 11a ″ and the lower contact pattern 12a ′ are formed. When the ') is rolled up in an up-and-down direction in a winding shape, the connection pattern 13a' 'is also dried together, and the connection part 13' 'formed by the connection pattern 13a' 'is illustrated in FIG. As shown in b), it has a cylindrical shape to support the upper contact portion 11 '' and the lower contact portion 12 '' in the vertical direction.

At this time, the width in the horizontal direction of the connection pattern 13a '' is such that the connection portion 13 '' formed by the connection pattern 13a '' has a cylindrical shape or is provided so as to form only a part of the cylinder. It can be formed in the width of.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

[Description of the code]

10: bidirectional conductive pin

11: upper contact 11a: upper contact pattern

12: lower contact portion 12a: lower contact pattern

13 connection part 13a: connection pattern

14: pin body 15: internal support

15a: internal support pattern 100: bidirectional conductive pattern module

110: insulating body 100a: base pattern

121: upper support pattern 122: lower support pattern

123: upper connection pattern 124: lower connection pattern

The present invention can be applied to the inspection of the electrical performance or burn-in test in the manufacturing process of semiconductor devices, printed circuit boards, LCD displays and the like.

Claims

In the bidirectional conductive pin,

An upper contact portion having a conductive thin plate formed by winding in an up-and-down direction in an axial direction and elastically supporting the contact in the upper direction;

A lower contact portion which is electrically conductive and is formed in a winding shape in an axial direction with respect to the vertical direction to support elastically upon contact in a lower direction;

And at least one connecting portion electrically connecting the upper contact portion and the lower contact portion.
The method of claim 1,

The upper contact portion, the lower contact portion and the connecting portion is a bidirectional conductive pin, characterized in that the base pattern formed through the patterning of the conductive thin plate is rolled together in a winding form along the vertical direction.
The method of claim 1,

And a pin body of an insulating material having an elasticity formed between the upper contact portion and the lower contact portion so that the connection portion is received therein.
The method of claim 1,

And at least one inner support portion extending downward from the upper contact portion, the lower end being spaced apart from the lower contact portion by a predetermined distance.
The method of claim 1,

The inner curled portion of the upper contact portion protrudes in the upper direction than the outer curled portion is bidirectionally conductive pins, characterized in that formed stepped outward in the radial direction.
The method of claim 1,

The inner curled portion of the lower contact portion protrudes in a lower direction than the outer curled portion is bidirectional conductive pins, characterized in that formed stepped outward in the radial direction.
The method of claim 1,

And the connection part is formed to have a predetermined width in a horizontal direction to support the upper contact part and the lower contact part in the vertical direction between the upper contact part and the lower contact part.
In the bidirectional conductive pattern module,

With an insulating body,

A plurality of bidirectional conductive pins disposed inside the insulated body spaced apart from each other in a horizontal direction, each upper and lower portion being exposed to the upper and lower surfaces of the insulated body;

Each of the bidirectional conductive pins

An upper contact portion having a conductive thin plate formed by winding in an up-and-down direction in an axial direction and elastically supporting the contact in the upper direction;

A lower contact portion which is electrically conductive and is formed in a winding shape in an axial direction with respect to the vertical direction to support elastically upon contact in a lower direction;

And at least one connection part electrically connecting the upper contact part and the lower contact part.
The method of claim 8,

The upper contact portion, the lower contact portion and the connecting portion is a bidirectional conductive pattern module, characterized in that the base pattern formed through the patterning of the conductive thin plate is rolled together in a winding shape in the vertical direction.
The method of claim 8,

And at least one inner support part extending downward from the upper contact part, the lower end being spaced apart from the lower contact part by a predetermined distance.
The method of claim 8,

The inner curled portion of the upper contact portion protrudes in the upper direction than the outer curled portion is bidirectional conductive pattern module, characterized in that formed stepped outward in the radial direction.
The method of claim 8,

The inner curled portion of the lower contact portion protrudes in a lower direction than the outer curled portion is bidirectional conductive pattern module, characterized in that formed stepped outward in the radial direction.
The method of claim 8,

And the connection part is formed to have a predetermined width in the horizontal direction to support the upper contact part and the lower contact part in the vertical direction between the upper contact part and the lower contact part.
In the manufacturing method of the bidirectional conductive pattern module,

a plurality of upper contact patterns spaced apart from each other in the horizontal direction by patterning a conductive thin plate, a plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the vertical direction, and spaced apart from each other in the horizontal direction; Forming a base pattern having at least one connection pattern connecting the upper contact pattern and the lower contact pattern at positions corresponding to each other;

(b) plating the base pattern;

(c) connecting the plurality of upper contact portions, the plurality of lower contact portions, and the corresponding upper contact portion and the lower contact portion by rolling the shaft in the up-down direction such that each of the upper contact pattern and each of the lower contact patterns has a winding shape. Method for manufacturing a bidirectional conductive pattern module comprising the step of forming a connecting portion.
The method of claim 14,

(d) forming an insulating body of an insulating material having elasticity such that the upper surfaces of the plurality of upper contact portions and the lower surfaces of the plurality of lower contact portions are respectively exposed in the upper direction and the lower direction so that the connecting portion is accommodated therein; Method of manufacturing a bidirectional conductive pattern module, characterized in that it further comprises a step.
The method of claim 14,

In the step (a), the connection pattern is formed in a diagonal direction connecting the upper contact pattern and the lower contact pattern corresponding to each other, characterized in that the manufacturing method of the bidirectional conductive pattern module.
The method of claim 14,

The upper contact pattern and the lower contact pattern corresponding to each other in the step (c) are rolled about the same axis in the vertical direction to form the upper contact portion and the lower contact portion at positions corresponding to the vertical direction. Method of manufacturing a pattern module.
The method of claim 14,

In the step (a), at least one inner support pattern protruding from the upper contact pattern in the direction of the lower contact pattern is formed together with the conductive thin plate in the patterning process;

The inner support pattern is a manufacturing method of the bidirectional conductive pattern module, characterized in that to form an inner support extending in the lower direction from the upper contact through the step (c).
The method of claim 14,

The upper contact pattern may have a different width in the vertical direction or may be stepped in the horizontal direction so that the inner curled portion of the upper contact portion protrudes upward from the outer curled portion and is stepped radially outward. Method of manufacturing a bidirectional conductive pattern module, characterized in that.
The method of claim 14,

The lower contact pattern may have a different width in the vertical direction or may be formed stepwise in the horizontal direction so that the inner curled portion of the lower contact portion protrudes downward from the outer curled portion and is stepped radially outward. Method of manufacturing a bidirectional conductive pattern module, characterized in that.
The method of claim 14,

The connection pattern may be formed to have a predetermined width in a horizontal direction so that the connection part supports the upper contact part and the lower contact part in the vertical direction between the upper contact part and the lower contact part. .
In the manufacturing method of the bidirectional conductive pin,

Manufacturing a bidirectional conductive pattern module according to any one of claims 14 to 21,

Cutting the insulating main body of the bidirectional conductive pattern module in a vertical direction, and cutting the upper and lower contact parts and the connecting part by one unit to form a plurality of bidirectional conductive pins.