WO2021002690A1

WO2021002690A1 - Test socket

Info

Publication number: WO2021002690A1
Application number: PCT/KR2020/008625
Authority: WO
Inventors: 김학준; 조병호; 박상희; 조용호
Original assignee: 주식회사 새한마이크로텍; 주식회사 마이크로프랜드; 김학준; 조병호
Priority date: 2019-07-03
Filing date: 2020-07-02
Publication date: 2021-01-07
Also published as: KR102133675B1

Abstract

The present invention relates to a test socket used for measuring electrical properties of an electric element. The present invention provides a test socket disposed between opposing terminals to electrically connect the terminals, the test socket comprising: first contact pins of which both ends are in contact with opposing power or signal terminals; second contact pins of which both ends are in contact with opposing ground terminals; at least one first bridge connecting the first contact pins to each other; and at least one second bridge connecting the first contact pins and the second contact pins to each other.

Description

Test socket

The present invention relates to a test socket used for measuring electrical properties of an electrical device.

When a semiconductor device is manufactured, a performance test of the manufactured semiconductor device is required. In the inspection of a semiconductor device, a test socket that electrically connects the contact pad of the inspection device and the terminal of the semiconductor device is required.

Among the test sockets, a test socket equipped with an anisotropic conductive sheet with an insulating part that insulates and supports the contact parts in which conductive particles are arranged in the thickness direction of the silicone rubber and adjacent contacts, and absorbs mechanical shock or deformation, enabling flexible connection. And, there is an advantage that the manufacturing cost is low.

1 is a view showing a conventional test socket. The anisotropic conductive sheet 5 of the conventional test socket is composed of an insulating portion 8 that insulates and supports the contact portion 6 in contact with the terminal 2 of the semiconductor element 1 and the adjacent contact portions 6 . The upper and lower ends of the contact portion 6 are in contact with the terminal 2 of the semiconductor element 1 and the contact pad 4 of the semiconductor inspection device 3, respectively, and electrically connect the terminal 2 and the contact pad 4 to each other. Connect. The contact part 6 is solidified by mixing silicon resin with small spherical conductive particles 7 and acts as a conductor through which electricity flows.

However, as the semiconductor device 1 becomes smaller, the cross-sectional area of the contact portion 6 decreases, and accordingly, the resistance of the contact portion 6 increases. The loss of the signal due to the increase in resistance becomes an obstacle that decreases the inspection speed and accuracy.

[Prior technical literature]

Korea Open Utility Model No. 2009-0006326

Korean Patent Publication No. 10-2017-0066981

Korean Patent Registration No. 10-0375117

The present invention has been made to improve the above-described problems, and an object thereof is to provide a test socket having a new structure with improved inspection speed and accuracy by minimizing signal loss.

In order to achieve the above object, the present invention is a test socket disposed between opposing terminals to electrically connect terminals, the first contact pins having both ends in contact with opposing power or signal terminals, and At least one second contact pin in contact with ground terminals facing opposite ends, at least one first bridge connecting the first contact pins to each other, and at least one connecting the first contact pin and the second contact pin to each other It provides a test socket including a second bridge of.

In addition, each of the first contact pins includes a first contact, a first shield electrode, and a first insulating support.

The first contactor includes a first elastic matrix in the form of a column, and a plurality of first conductive particles arranged in the first elastic matrix in the longitudinal direction of the first elastic matrix.

The first shield electrode has a cylindrical shape surrounding the side surface of the first contactor while being spaced apart from the side surface of the first contactor.

A first insulating support part is disposed between the first contact and the first shield electrode to connect the first contact and the first shield electrode in an electrically separated state.

In addition, the first bridge electrically connects the first shield electrodes adjacent to each other.

In addition, the present invention provides a test socket, wherein the first contactor further includes a conductive coil spring embedded in the first elastic matrix.

In addition, the first contact provides a test socket further comprising a conductive tip coupled to one end of the first elastic matrix.

In addition, the conductive tip provides a test socket including a conductive plate coupled to one end of the first elastic matrix and a conductive protrusion protruding from the conductive plate.

In addition, a test socket having a metal layer formed on the surface of the conductive tip is provided.

In addition, it provides a test socket further comprising a conductive anchor portion protruding from the conductive plate to the inside of the first elastic matrix.

In addition, the second contact pin includes a second contactor having a second elastic matrix in the form of a column, and a plurality of second conductive particles arranged in the length direction of the second elastic matrix inside the second elastic matrix. Provides a test socket that includes.

In addition, the second contact pin may include a second shield electrode in a cylindrical shape surrounding a side surface of the second contactor in a state spaced apart from the side surface of the second contactor, and between the second contactor and the second shield electrode. A second insulating support portion disposed on and a conductive connection portion electrically connecting the second contactor to the second shield electrode, and the second bridge is a test for connecting the first shield electrode and the second shield electrode Provides a socket for use.

In addition, the second bridge provides a test socket connecting the first shield electrode and the second contact.

The test socket according to the present invention minimizes signal loss. Therefore, inspection speed and accuracy are improved.

1 is a view showing a test socket according to the prior art.

2 is a perspective view of a test socket according to an embodiment of the present invention.

3 is a cross-sectional view of the test socket shown in FIG. 2.

4 is a cross-sectional view of a test socket according to another embodiment of the present invention.

5 to 7 are cross-sectional views of test sockets according to still other embodiments of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples in order to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below and may be embodied in other forms. In addition, in the drawings, the width, length, thickness, etc. of the component may be exaggerated for convenience. The same reference numbers throughout the specification indicate the same elements.

2 is a perspective view of a test socket according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of the test socket shown in FIG. 2. The test socket is disposed between opposing terminals and serves to electrically connect the terminals. For example, the test socket 100 serves to electrically connect the terminal 4 of the test apparatus 3 and the terminal 2 of the semiconductor element 1.

2 and 3, the test socket 100 according to an embodiment of the present invention includes a plurality of first contact pins 10, a second contact pin 50, and a first contact pin. At least one first bridge 90 connecting the 10 to each other, and at least one second bridge 95 connecting the first contact pin 10 and the second contact pin 50 to each other.

Although three first contact pins 10 and one second contact pin 50 are shown in FIG. 2, the sum of the first contact pins 10 and the second contact pins 20 may be several tens to several hundred. have.

The first contact pin 10 serves to electrically connect power terminals or

signal terminals

2a and 4a facing each other. Each of the first contact pins 10 includes a first contactor 20, a first shield electrode 30, and a first insulating support portion 40.

The first contactor 20 serves to electrically connect the

terminals

2a and 4a by contacting the

terminals

2a and 4a. The first shield electrode 30 serves to minimize signal loss of the first contactor 20. The first insulating support part 40 serves to connect the first contactor 20 and the first shield electrode 30 to each other. Since the first insulating support part 40 is made of an electrically insulating material, the first contactor 20 and the first shield electrode 30 are connected in an electrically insulated state.

The first contactor 20 includes a first elastic matrix 21 and a plurality of first conductive particles 22.

The first elastic matrix 21 has a pillar shape having both

ends

25 and 26 and side surfaces 27. For example, it may be in the form of a cylinder or a polygonal column such as a square, hexagon, or octagon. The first elastic matrix 21 serves to support the first conductive particles 22. In addition, while being elastically deformed during measurement, the pressure applied to the

terminals

2a and 4a is reduced, and the first contactor 20 is brought into close contact with the

terminals

2a and 4a.

The first elastic matrix 21 may be formed of various types of polymer materials. For example, it may be implemented with a diene-type rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof. Further, it may be implemented with a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and a hydrogen compound thereof. In addition, it may be implemented with chloroprene, urethane rubber, polyethylene-type rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylene diene copolymer, or the like. The first elastic matrix 21 can be obtained by curing a liquid resin.

The first conductive particles 22 are arranged in the longitudinal direction of the first elastic matrix 21. The first conductive particles 22 contact each other to impart conductivity in the longitudinal direction of the first contactor 20. When pressure is applied in the longitudinal direction of the first contactor 20 for inspection of the semiconductor device 1, the first contactor 20 is compressed in the longitudinal direction. In addition, as the first conductive particles 22 become closer to each other, the electrical conductivity in the longitudinal direction of the first contactor 20 is further increased.

The first conductive particles 22 may be implemented with a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, or the like, or an alloy material of two or more of these metal materials. In addition, the first conductive particles 22 may be implemented by coating the surface of the core metal with a metal such as gold, silver, rhodium, palladium, platinum, or silver and gold, yin and rhodium, silver and palladium having excellent conductivity. .

The first shield electrode 30 has a cylindrical shape surrounding the side surface 27 of the first contactor 20. As shown in FIG. 2, the first shield electrode 30 may have a cylindrical shape or a polygonal cylindrical shape such as a square or hexagon. The inner surface 31 of the first shield electrode 30 is spaced apart from the side surface 27 of the first contactor 20 at regular intervals. The first shield electrode 30 may be made of, for example, nickel or nickel cobalt alloy.

The first insulating support part 40 is disposed in a space between the inner side surface 31 of the first shield electrode 30 and the side surface 27 of the first contactor 20. The first insulating support 40 may be made of an electrically insulating polymer material. For example, the first insulating support part 40 may be made of polydimethylsiloxane (PDMS).

In this embodiment, the length of the first shield electrode 30 and the first insulating support portion 40 is shorter than that of the first contactor 20. This is because the end of the first contactor 20 must protrude compared to the first insulating support part 40 to facilitate contact with the terminal. As shown in FIG. 2, the end 25 facing the terminal 2a of the semiconductor element 1 may protrude from the

end portions

25 and 26 of the first contactor 20.

The second contact pin 50 connects the

ground terminals

2b and 4b facing each other. Each of the second contact pins 50 includes a second contactor 60, a second shield electrode 70, and a second insulating support 80.

The second contactor 60 serves to electrically connect the

terminals

2b and 4b by contacting the

terminals

2b and 4b. The second insulating support 80 serves to connect and support the second contact 60 and the second shield electrode 70.

Unlike the first contact pin 20, the second contact pin 50 is electrically connected to the second contact 60 and the second shield electrode 70 through the conductive connection part 85.

The first bridge 90 electrically connects the first shield electrodes 30 of the first contact pins 10 to each other. The first bridge 90 may be made of, for example, nickel or nickel cobalt alloy. The shape of the first bridge 90 is not particularly limited. As shown in FIGS. 2 and 3, the first bridge 90 may have a bar shape having a uniform thickness.

The second bridge 95 electrically connects the first shield electrode 30 of the first contact pin 10 with the second contact pin 50 to each other. The second bridge 95 is similar to the first bridge 90. It may be made of nickel or nickel cobalt alloy, and may be in the form of a bar having a uniform thickness.

The second contact pin 50 is connected to the

ground electrodes

2b and 4b, and the second contact pin 50 is connected to the first shield electrode 30 through the second bridge 95. Further, since the first shield electrode 30 is connected to the other first shield electrode 30 through the first bridge 90, all of the first shield electrodes 30 are connected to the ground.

In the embodiment shown in FIG. 4, the first contactor 120 and the second contactor 160 further include conductive coil springs 129 and 169, and a first bridge (not shown) and a second bridge 195 Since the difference from the embodiment shown in Figs. 2 and 3 in that the thickness of is thick, only here will be described in detail.

The conductive coil springs 129 and 169 are embedded in the first elastic matrix 121 and the second elastic matrix 161. The conductive coil springs 129 and 169 may be made of stainless steel, aluminum, bronze, phosphorus, nickel, gold, silver, palladium, or an alloy thereof. In addition, it may be a spring in which a plating layer having high conductivity is formed on a piano steel wire having a large elastic modulus. The conductive coil springs 129 and 169 may be in the form of a cylindrical coil spring made by spirally winding a wire rod. The lengths of the conductive coil springs 129 and 169 may be the same as or slightly shorter than the lengths of the first elastic matrix 121 and the second elastic matrix 161.

The conductive coil springs 129 and 169 restore the first elastic matrix 121 and the second elastic matrix 161 when the first elastic matrix 121 and the second elastic matrix 161 are compressed in the longitudinal direction. It serves to provide an elastic force in the direction. When pressure is applied to both ends 125 and 126 of the first contactor 120 and both ends 165 and 166 of the second contactor 160 during the measurement process, the first elastic matrix 121 and the second elastic matrix 161 ) Is compressed, and at the same time, the conductive coil springs 129 and 169 embedded in the first elastic matrix 121 and the second elastic matrix 161 are also compressed. When the measurement is completed and the pressure applied to both ends 125 and 126 of the contactor 120 is removed, the first elastic matrix 121 and the second elastic matrix 161 expand in the longitudinal direction to restore their original shape. The conductive coil springs 129 and 169 provide elastic force in the direction in which the first elastic matrix 121 and the second elastic matrix 161 expand, so that the first elastic matrix 121 and the second elastic matrix 161 It plays a role of assisting in quicker recovery.

In FIG. 4, the cross section of the wire rod of the conductive coil springs 129 and 169 is shown to be circular, but the cross section of the wire rod of the

conductive coil spring

129 and 169 may be square. In particular, when a plurality of contact pins (110, 150) are used, a wire rod having a rectangular cross-section (a rectangular cross-section whose vertical value is smaller than the horizontal value) is used as compared to a wire rod having a circular cross-section of the same cross-sectional area. It is preferable to use a spring manufactured by doing so.

Springs made using a wire rod with a rectangular cross section with a small secondary moment (a rectangular cross section with a vertical value less than a horizontal value) are more than a circular cross section wire spring with the same spring height (free length) and the same spring pitch (same cross-sectional area). Since it can have a long stroke, a stable low force contact pin can be implemented.

In this embodiment, the first bridge (not shown) and the second bridge 195 are different from the first bridge 90 and the second bridge 95 shown in FIGS. 2 and 3, the first shield electrode 30 And as thick as the second shield electrode 70.

5 is a cross-sectional view of a test socket according to another embodiment of the present invention.

The embodiment shown in FIG. 5 is different from the embodiment shown in FIGS. 2 and 3 in that the first contactor 220 further includes a conductive tip 228, and thus only here will be described in detail.

The conductive tip 228 includes a conductive plate 228a coupled to the lower end of the first elastic matrix 221, a conductive protrusion 228b protruding from the conductive plate 228a, and a metal layer formed on the lower surface of the conductive tip 228 ( 228c).

The conductive plate 228a and the conductive protrusion 228b may be made of, for example, nickel or nickel cobalt alloy. The conductive plate 228a is a thin plate having the same cross-section as that of the first elastic matrix 221. The conductive plate 228a contacts the first conductive particles 222 inside the first elastic matrix 221.

The conductive protrusion 228b extends toward the terminal 4 from the lower surface of the conductive plate 228a. The conductive protrusion 228b is thicker than the conductive plate 228a, and may have a small disk shape.

A metal layer 228c made of a metal such as gold or silver having high electrical conductivity may be formed on the lower surface of the conductive protrusion 228b and the conductive plate 228a.

Like the first contactor 220, the second contactor 260 further includes a conductive tip 268.

6 is a cross-sectional view of a test socket according to another embodiment of the present invention.

The embodiment shown in FIG. 6 is different from the embodiment shown in FIG. 5 in that it further includes a conductive anchor 328d extending from the conductive tip 328 to the inside of the first elastic matrix 321. The conductive anchor 328d is installed in the center of the first elastic matrix 321 in the longitudinal direction. The conductive anchor 328d has a shape of a cylinder or a polygonal column.

Like the conductive tip 328 of the first contactor 320, the conductive tip 368 of the second contactor 360 further includes a conductive anchor 368d.

7 is a cross-sectional view of a test socket according to another embodiment of the present invention.

The embodiment shown in FIG. 7 is different from the embodiment shown in FIG. 1 in the form of the second contact pin 450. Unlike the second contact pin 50 shown in FIG. 1, the second contact pin 450 of the present embodiment does not include a second shield electrode or a second insulating support. In this embodiment, the second bridge 295 directly connects the second contact 460 of the second contact pin 450 and the first shield electrode 30. This embodiment has the advantage of a simple structure.

The above-described embodiments are merely describing preferred embodiments of the present invention, and the scope of the present invention is not limited to the described embodiments, and those skilled in the art within the scope of the technical spirit and claims of the present invention Various changes, modifications, or substitutions may be made by this, and such embodiments are to be understood as being within the scope of the present invention.

For example, it has been described that the length of the shield electrode and the insulating support is shorter than the length of the contactor, but may be longer than the length of the contactor.

In addition, it has been described that an end of the contactor facing the terminal 2 of the semiconductor element 1 protrudes from both ends of the contactor, but both ends may protrude or an end facing the terminal 4 of the inspection device 3 may protrude.

[Explanation of code]

100: test socket

10, 110, 210, 310: first contact pin

50, 150, 250, 350, 450: second contact pin

20, 120, 220, 320: first contact

60, 160, 260, 360: second contact

21, 121, 221, 321: first elastic matrix

22, 122, 222, 322: first conductive particles

30: first shield electrode

70: second shield electrode

40: first insulation support

80: second insulation support

90: first bridge

95, 195, 295: second bridge

129, 169: conductive coil spring

228, 328, 268, 368: conductive tip

Claims

As a test socket disposed between opposing terminals to electrically connect terminals,

First contact pins contacting the power or signal terminals facing each other at both ends thereof,

A second contact pin whose both ends are in contact with the ground terminals facing each other,

At least one first bridge connecting the first contact pins to each other,

And at least one second bridge connecting the first contact pin and the second contact pin to each other,

Each of the first contact pins,

A first contactor including a first elastic matrix in the form of a column and a plurality of first conductive particles arranged in the longitudinal direction of the first elastic matrix inside the first elastic matrix,

A first shield electrode in a cylindrical shape surrounding the side surface of the first contactor in a state spaced apart from the side surface of the first contactor,

A first insulating support portion disposed between the first contactor and the first shield electrode to connect the first contactor and the first shield electrode in an electrically separated state,

The first bridge,

A test socket for electrically connecting the adjacent first shield electrodes to each other.
The method of claim 1,

The first contactor,

A test socket further comprising a conductive coil spring embedded in the first elastic matrix.
The method of claim 1,

The first contactor,

Test socket further comprising a conductive tip coupled to one end of the first elastic matrix.
The method of claim 3,

The conductive tip,

A test socket comprising a conductive plate coupled to one end of the first elastic matrix and a conductive protrusion protruding from the conductive plate.
The method of claim 3,

A test socket having a metal layer formed on the surface of the conductive tip.
The method of claim 4,

A test socket further comprising a conductive anchor part protruding from the conductive plate into the first elastic matrix.
The method of claim 1,

The second contact pin,

A test socket including a second contactor including a second elastic matrix in the form of a column and a plurality of second conductive particles arranged in the second elastic matrix in the longitudinal direction of the second elastic matrix.
The method of claim 7,

The second contact pin,

A second shield electrode in a cylindrical shape surrounding a side surface of the second contactor in a state spaced apart from the side surface of the second contactor,

A second insulating support part disposed between the second contact and the second shield electrode,

Further comprising a conductive connecting portion electrically connecting the second contact and the second shield electrode,

The second bridge is a test socket for connecting the first shield electrode and the second shield electrode.
The method of claim 7,

The second bridge is a test socket for connecting the first shield electrode and the second contact.