WO2021002690A1 - Prise de test - Google Patents

Prise de test Download PDF

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Publication number
WO2021002690A1
WO2021002690A1 PCT/KR2020/008625 KR2020008625W WO2021002690A1 WO 2021002690 A1 WO2021002690 A1 WO 2021002690A1 KR 2020008625 W KR2020008625 W KR 2020008625W WO 2021002690 A1 WO2021002690 A1 WO 2021002690A1
Authority
WO
WIPO (PCT)
Prior art keywords
contactor
test socket
conductive
contact
elastic matrix
Prior art date
Application number
PCT/KR2020/008625
Other languages
English (en)
Korean (ko)
Inventor
김학준
조병호
박상희
조용호
Original Assignee
주식회사 새한마이크로텍
주식회사 마이크로프랜드
김학준
조병호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 새한마이크로텍, 주식회사 마이크로프랜드, 김학준, 조병호 filed Critical 주식회사 새한마이크로텍
Publication of WO2021002690A1 publication Critical patent/WO2021002690A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to a test socket used for measuring electrical properties of an electrical device.
  • a performance test of the manufactured semiconductor device is required.
  • a test socket that electrically connects the contact pad of the inspection device and the terminal of the semiconductor device is required.
  • test sockets equipped with an anisotropic conductive sheet with an insulating part that insulates and supports the contact parts in which conductive particles are arranged in the thickness direction of the silicone rubber and adjacent contacts, and absorbs mechanical shock or deformation, enabling flexible connection. And, there is an advantage that the manufacturing cost is low.
  • the anisotropic conductive sheet 5 of the conventional test socket is composed of an insulating portion 8 that insulates and supports the contact portion 6 in contact with the terminal 2 of the semiconductor element 1 and the adjacent contact portions 6 .
  • the upper and lower ends of the contact portion 6 are in contact with the terminal 2 of the semiconductor element 1 and the contact pad 4 of the semiconductor inspection device 3, respectively, and electrically connect the terminal 2 and the contact pad 4 to each other.
  • the contact part 6 is solidified by mixing silicon resin with small spherical conductive particles 7 and acts as a conductor through which electricity flows.
  • the cross-sectional area of the contact portion 6 decreases, and accordingly, the resistance of the contact portion 6 increases.
  • the loss of the signal due to the increase in resistance becomes an obstacle that decreases the inspection speed and accuracy.
  • the present invention has been made to improve the above-described problems, and an object thereof is to provide a test socket having a new structure with improved inspection speed and accuracy by minimizing signal loss.
  • the present invention is a test socket disposed between opposing terminals to electrically connect terminals, the first contact pins having both ends in contact with opposing power or signal terminals, and At least one second contact pin in contact with ground terminals facing opposite ends, at least one first bridge connecting the first contact pins to each other, and at least one connecting the first contact pin and the second contact pin to each other It provides a test socket including a second bridge of.
  • each of the first contact pins includes a first contact, a first shield electrode, and a first insulating support.
  • the first contactor includes a first elastic matrix in the form of a column, and a plurality of first conductive particles arranged in the first elastic matrix in the longitudinal direction of the first elastic matrix.
  • the first shield electrode has a cylindrical shape surrounding the side surface of the first contactor while being spaced apart from the side surface of the first contactor.
  • a first insulating support part is disposed between the first contact and the first shield electrode to connect the first contact and the first shield electrode in an electrically separated state.
  • the first bridge electrically connects the first shield electrodes adjacent to each other.
  • the present invention provides a test socket, wherein the first contactor further includes a conductive coil spring embedded in the first elastic matrix.
  • the first contact provides a test socket further comprising a conductive tip coupled to one end of the first elastic matrix.
  • the conductive tip provides a test socket including a conductive plate coupled to one end of the first elastic matrix and a conductive protrusion protruding from the conductive plate.
  • test socket having a metal layer formed on the surface of the conductive tip is provided.
  • test socket further comprising a conductive anchor portion protruding from the conductive plate to the inside of the first elastic matrix.
  • the second contact pin includes a second contactor having a second elastic matrix in the form of a column, and a plurality of second conductive particles arranged in the length direction of the second elastic matrix inside the second elastic matrix.
  • a test socket that includes.
  • the second contact pin may include a second shield electrode in a cylindrical shape surrounding a side surface of the second contactor in a state spaced apart from the side surface of the second contactor, and between the second contactor and the second shield electrode.
  • a second insulating support portion disposed on and a conductive connection portion electrically connecting the second contactor to the second shield electrode, and the second bridge is a test for connecting the first shield electrode and the second shield electrode Provides a socket for use.
  • the second bridge provides a test socket connecting the first shield electrode and the second contact.
  • test socket according to the present invention minimizes signal loss. Therefore, inspection speed and accuracy are improved.
  • FIG. 1 is a view showing a test socket according to the prior art.
  • FIG. 2 is a perspective view of a test socket according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the test socket shown in FIG. 2.
  • FIG. 4 is a cross-sectional view of a test socket according to another embodiment of the present invention.
  • 5 to 7 are cross-sectional views of test sockets according to still other embodiments of the present invention.
  • FIG. 2 is a perspective view of a test socket according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of the test socket shown in FIG. 2.
  • the test socket is disposed between opposing terminals and serves to electrically connect the terminals.
  • the test socket 100 serves to electrically connect the terminal 4 of the test apparatus 3 and the terminal 2 of the semiconductor element 1.
  • the test socket 100 includes a plurality of first contact pins 10, a second contact pin 50, and a first contact pin. At least one first bridge 90 connecting the 10 to each other, and at least one second bridge 95 connecting the first contact pin 10 and the second contact pin 50 to each other.
  • first contact pins 10 and one second contact pin 50 are shown in FIG. 2, the sum of the first contact pins 10 and the second contact pins 20 may be several tens to several hundred. have.
  • the first contact pin 10 serves to electrically connect power terminals or signal terminals 2a and 4a facing each other.
  • Each of the first contact pins 10 includes a first contactor 20, a first shield electrode 30, and a first insulating support portion 40.
  • the first contactor 20 serves to electrically connect the terminals 2a and 4a by contacting the terminals 2a and 4a.
  • the first shield electrode 30 serves to minimize signal loss of the first contactor 20.
  • the first insulating support part 40 serves to connect the first contactor 20 and the first shield electrode 30 to each other. Since the first insulating support part 40 is made of an electrically insulating material, the first contactor 20 and the first shield electrode 30 are connected in an electrically insulated state.
  • the first contactor 20 includes a first elastic matrix 21 and a plurality of first conductive particles 22.
  • the first elastic matrix 21 has a pillar shape having both ends 25 and 26 and side surfaces 27.
  • it may be in the form of a cylinder or a polygonal column such as a square, hexagon, or octagon.
  • the first elastic matrix 21 serves to support the first conductive particles 22.
  • the pressure applied to the terminals 2a and 4a is reduced, and the first contactor 20 is brought into close contact with the terminals 2a and 4a.
  • the first elastic matrix 21 may be formed of various types of polymer materials. For example, it may be implemented with a diene-type rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof. Further, it may be implemented with a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and a hydrogen compound thereof. In addition, it may be implemented with chloroprene, urethane rubber, polyethylene-type rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylene diene copolymer, or the like. The first elastic matrix 21 can be obtained by curing a liquid resin.
  • a diene-type rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • a block copolymer such as a styren
  • the first conductive particles 22 are arranged in the longitudinal direction of the first elastic matrix 21.
  • the first conductive particles 22 contact each other to impart conductivity in the longitudinal direction of the first contactor 20.
  • the first contactor 20 is compressed in the longitudinal direction.
  • the electrical conductivity in the longitudinal direction of the first contactor 20 is further increased.
  • the first conductive particles 22 may be implemented with a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, or the like, or an alloy material of two or more of these metal materials.
  • the first conductive particles 22 may be implemented by coating the surface of the core metal with a metal such as gold, silver, rhodium, palladium, platinum, or silver and gold, yin and rhodium, silver and palladium having excellent conductivity. .
  • the first shield electrode 30 has a cylindrical shape surrounding the side surface 27 of the first contactor 20. As shown in FIG. 2, the first shield electrode 30 may have a cylindrical shape or a polygonal cylindrical shape such as a square or hexagon. The inner surface 31 of the first shield electrode 30 is spaced apart from the side surface 27 of the first contactor 20 at regular intervals.
  • the first shield electrode 30 may be made of, for example, nickel or nickel cobalt alloy.
  • the first insulating support part 40 is disposed in a space between the inner side surface 31 of the first shield electrode 30 and the side surface 27 of the first contactor 20.
  • the first insulating support 40 may be made of an electrically insulating polymer material.
  • the first insulating support part 40 may be made of polydimethylsiloxane (PDMS).
  • the length of the first shield electrode 30 and the first insulating support portion 40 is shorter than that of the first contactor 20. This is because the end of the first contactor 20 must protrude compared to the first insulating support part 40 to facilitate contact with the terminal. As shown in FIG. 2, the end 25 facing the terminal 2a of the semiconductor element 1 may protrude from the end portions 25 and 26 of the first contactor 20.
  • the second contact pin 50 connects the ground terminals 2b and 4b facing each other.
  • Each of the second contact pins 50 includes a second contactor 60, a second shield electrode 70, and a second insulating support 80.
  • the second contactor 60 serves to electrically connect the terminals 2b and 4b by contacting the terminals 2b and 4b.
  • the second insulating support 80 serves to connect and support the second contact 60 and the second shield electrode 70.
  • the second contact pin 50 is electrically connected to the second contact 60 and the second shield electrode 70 through the conductive connection part 85.
  • the first bridge 90 electrically connects the first shield electrodes 30 of the first contact pins 10 to each other.
  • the first bridge 90 may be made of, for example, nickel or nickel cobalt alloy.
  • the shape of the first bridge 90 is not particularly limited. As shown in FIGS. 2 and 3, the first bridge 90 may have a bar shape having a uniform thickness.
  • the second bridge 95 electrically connects the first shield electrode 30 of the first contact pin 10 with the second contact pin 50 to each other.
  • the second bridge 95 is similar to the first bridge 90. It may be made of nickel or nickel cobalt alloy, and may be in the form of a bar having a uniform thickness.
  • the second contact pin 50 is connected to the ground electrodes 2b and 4b, and the second contact pin 50 is connected to the first shield electrode 30 through the second bridge 95. Further, since the first shield electrode 30 is connected to the other first shield electrode 30 through the first bridge 90, all of the first shield electrodes 30 are connected to the ground.
  • FIG. 4 is a cross-sectional view of a test socket according to another embodiment of the present invention.
  • the first contactor 120 and the second contactor 160 further include conductive coil springs 129 and 169, and a first bridge (not shown) and a second bridge 195 Since the difference from the embodiment shown in Figs. 2 and 3 in that the thickness of is thick, only here will be described in detail.
  • the conductive coil springs 129 and 169 are embedded in the first elastic matrix 121 and the second elastic matrix 161.
  • the conductive coil springs 129 and 169 may be made of stainless steel, aluminum, bronze, phosphorus, nickel, gold, silver, palladium, or an alloy thereof. In addition, it may be a spring in which a plating layer having high conductivity is formed on a piano steel wire having a large elastic modulus.
  • the conductive coil springs 129 and 169 may be in the form of a cylindrical coil spring made by spirally winding a wire rod.
  • the lengths of the conductive coil springs 129 and 169 may be the same as or slightly shorter than the lengths of the first elastic matrix 121 and the second elastic matrix 161.
  • the conductive coil springs 129 and 169 restore the first elastic matrix 121 and the second elastic matrix 161 when the first elastic matrix 121 and the second elastic matrix 161 are compressed in the longitudinal direction. It serves to provide an elastic force in the direction.
  • the first elastic matrix 121 and the second elastic matrix 161 Is compressed, and at the same time, the conductive coil springs 129 and 169 embedded in the first elastic matrix 121 and the second elastic matrix 161 are also compressed.
  • the first elastic matrix 121 and the second elastic matrix 161 expand in the longitudinal direction to restore their original shape.
  • the conductive coil springs 129 and 169 provide elastic force in the direction in which the first elastic matrix 121 and the second elastic matrix 161 expand, so that the first elastic matrix 121 and the second elastic matrix 161 It plays a role of assisting in quicker recovery.
  • the cross section of the wire rod of the conductive coil springs 129 and 169 is shown to be circular, but the cross section of the wire rod of the conductive coil spring 129 and 169 may be square.
  • a wire rod having a rectangular cross-section (a rectangular cross-section whose vertical value is smaller than the horizontal value) is used as compared to a wire rod having a circular cross-section of the same cross-sectional area. It is preferable to use a spring manufactured by doing so.
  • Springs made using a wire rod with a rectangular cross section with a small secondary moment are more than a circular cross section wire spring with the same spring height (free length) and the same spring pitch (same cross-sectional area). Since it can have a long stroke, a stable low force contact pin can be implemented.
  • the first bridge (not shown) and the second bridge 195 are different from the first bridge 90 and the second bridge 95 shown in FIGS. 2 and 3, the first shield electrode 30 And as thick as the second shield electrode 70.
  • FIG. 5 is a cross-sectional view of a test socket according to another embodiment of the present invention.
  • the embodiment shown in FIG. 5 is different from the embodiment shown in FIGS. 2 and 3 in that the first contactor 220 further includes a conductive tip 228, and thus only here will be described in detail.
  • the conductive tip 228 includes a conductive plate 228a coupled to the lower end of the first elastic matrix 221, a conductive protrusion 228b protruding from the conductive plate 228a, and a metal layer formed on the lower surface of the conductive tip 228 ( 228c).
  • the conductive plate 228a and the conductive protrusion 228b may be made of, for example, nickel or nickel cobalt alloy.
  • the conductive plate 228a is a thin plate having the same cross-section as that of the first elastic matrix 221.
  • the conductive plate 228a contacts the first conductive particles 222 inside the first elastic matrix 221.
  • the conductive protrusion 228b extends toward the terminal 4 from the lower surface of the conductive plate 228a.
  • the conductive protrusion 228b is thicker than the conductive plate 228a, and may have a small disk shape.
  • a metal layer 228c made of a metal such as gold or silver having high electrical conductivity may be formed on the lower surface of the conductive protrusion 228b and the conductive plate 228a.
  • the second contactor 260 further includes a conductive tip 268.
  • FIG. 6 is a cross-sectional view of a test socket according to another embodiment of the present invention.
  • the embodiment shown in FIG. 6 is different from the embodiment shown in FIG. 5 in that it further includes a conductive anchor 328d extending from the conductive tip 328 to the inside of the first elastic matrix 321.
  • the conductive anchor 328d is installed in the center of the first elastic matrix 321 in the longitudinal direction.
  • the conductive anchor 328d has a shape of a cylinder or a polygonal column.
  • the conductive tip 368 of the second contactor 360 further includes a conductive anchor 368d.
  • FIG. 7 is a cross-sectional view of a test socket according to another embodiment of the present invention.
  • the embodiment shown in FIG. 7 is different from the embodiment shown in FIG. 1 in the form of the second contact pin 450.
  • the second contact pin 450 of the present embodiment does not include a second shield electrode or a second insulating support.
  • the second bridge 295 directly connects the second contact 460 of the second contact pin 450 and the first shield electrode 30. This embodiment has the advantage of a simple structure.
  • the length of the shield electrode and the insulating support is shorter than the length of the contactor, but may be longer than the length of the contactor.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne une prise de test utilisée pour mesurer les propriétés électriques d'un élément électrique. La présente invention concerne une prise de test disposée entre des bornes opposées pour les connecter électriquement, la prise de test comprenant : des premières broches de contact dont les deux extrémités sont en contact avec des bornes de puissance ou de signal opposées ; des secondes broches de contact dont les deux extrémités sont en contact avec des bornes de mise à la terre opposées ; au moins un premier pont reliant les premières broches de contact l'une à l'autre ; et au moins un second pont reliant les premières broches de contact et les secondes broches de contact l'une à l'autre.
PCT/KR2020/008625 2019-07-03 2020-07-02 Prise de test WO2021002690A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190080265A KR102133675B1 (ko) 2019-07-03 2019-07-03 테스트용 소켓
KR10-2019-0080265 2019-07-03

Publications (1)

Publication Number Publication Date
WO2021002690A1 true WO2021002690A1 (fr) 2021-01-07

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Application Number Title Priority Date Filing Date
PCT/KR2020/008625 WO2021002690A1 (fr) 2019-07-03 2020-07-02 Prise de test

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KR (1) KR102133675B1 (fr)
WO (1) WO2021002690A1 (fr)

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KR102357723B1 (ko) 2021-09-15 2022-02-08 (주)새한마이크로텍 신호 손실 방지용 테스트 소켓
KR102389136B1 (ko) * 2021-12-27 2022-04-21 주식회사 새한마이크로텍 신호 손실 방지용 테스트 소켓
KR20230137677A (ko) * 2022-03-22 2023-10-05 주식회사 새한마이크로텍 신호 손실 방지용 테스트 소켓
KR102525559B1 (ko) 2023-01-02 2023-04-25 (주)새한마이크로텍 신호 손실 방지용 테스트 소켓

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US20100244872A1 (en) * 2009-03-31 2010-09-30 Takuto Yoshida Inspection socket and method of producing the same
JP2011252766A (ja) * 2010-06-01 2011-12-15 3M Innovative Properties Co 接触子ホルダ
KR101193556B1 (ko) * 2011-11-22 2012-10-22 주식회사 세미콘테스트 피씨비 일체형 테스트 소켓
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