WO2011099822A2 - Prise de vérification - Google Patents

Prise de vérification Download PDF

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Publication number
WO2011099822A2
WO2011099822A2 PCT/KR2011/000955 KR2011000955W WO2011099822A2 WO 2011099822 A2 WO2011099822 A2 WO 2011099822A2 KR 2011000955 W KR2011000955 W KR 2011000955W WO 2011099822 A2 WO2011099822 A2 WO 2011099822A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
pin
connection electrode
conductive pin
conductive member
Prior art date
Application number
PCT/KR2011/000955
Other languages
English (en)
Korean (ko)
Other versions
WO2011099822A3 (fr
Inventor
이재학
Original Assignee
Lee Jae Hak
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Jae Hak filed Critical Lee Jae Hak
Publication of WO2011099822A2 publication Critical patent/WO2011099822A2/fr
Publication of WO2011099822A3 publication Critical patent/WO2011099822A3/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit

Definitions

  • the present invention relates to a test socket, and more particularly, to a test socket capable of stably contacting a terminal of a semiconductor device having a fine pitch to a test socket.
  • a semiconductor device manufactured is subjected to a predetermined defect inspection in order to determine whether there is a defect.
  • whether the semiconductor device is defective may be determined by an electrical signal from the test apparatus while the semiconductor device is electrically connected to the test apparatus.
  • the pad of the test apparatus may be damaged, and in particular, the pad of the test apparatus may be worn while inspecting a large number of semiconductor devices. Will be.
  • the semiconductor device and the test apparatus are indirectly connected to each other by using a test socket that is a mediator separate from the test apparatus.
  • test socket various structures, such as a pogo pin and an anisotropic conductive sheet, are used.
  • a spring 120 is inserted into a housing 110 in which a plurality of through holes 111 are formed, and the semiconductor device ( The structure in which the terminal 141 of the 140 is connected to the pad 131 of the test apparatus 130 is known.
  • the electrical signal from the pad of the test apparatus has a long distance to the terminal of the semiconductor device, that is, the current pass, and the signal flows while spirally rotating along the coil, so that the signal from the test apparatus is transmitted.
  • the signal from the test apparatus is transmitted.
  • there are disadvantages such as generating a lot of resistance.
  • test socket 200 is a test socket different from the related art of FIG. 1, wherein the test socket 200 includes an inner spring 221 formed of a close contact portion and an elastic portion in a through hole 211 of the housing 210, and an outer spring 220. Inserted into and placed in the electrical signal is transmitted through the close contact portion so that the effect of improving the signal transmission characteristics.
  • the terminal 141 of the semiconductor device 140 is connected to the pad 131 of the test apparatus 130 through the inner spring and the outer spring.
  • this prior art has a problem that it is difficult to be applied to a semiconductor device having a narrow pitch between terminals. That is, in order to contact terminals with fine pitch, the distance between adjacent through holes and the diameter of each through hole must also be reduced. There is a limit in reducing the outer diameter of the spring, especially the diameter of the spring inserted inside the double spring. Since this has to be more than a certain amount, there is a disadvantage in that it is not easy to apply to fine pitch.
  • plating may be performed on the inner and outer surfaces of the spring.
  • the plating solution is not easily penetrated, and thus plating is not easy. Will be.
  • the plating layer 311 is formed on the inner wall of the through hole of the housing 310 and the pin 321 and the spring 320 are inserted into the test socket 300. As the plating layer 311 is in contact with each other, electrical signal transmission characteristics may be improved. The signal flows through the terminal 141 of the semiconductor device 140 to the terminal 131 of the test apparatus 130 via the pin 321, the plating layer 311, and the lower end of the spring.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a test socket which is excellent in signal transmission characteristics and which is easy to manufacture and which can be easily applied to a test for a semiconductor device having a fine pitch terminal. do.
  • the test socket according to the present invention for achieving the above object is a test socket disposed between the semiconductor device and the test apparatus for electrically connecting the terminals of the semiconductor device and the pad of the test apparatus,
  • a housing disposed below the first sheet member and having a through hole extending in a vertical direction at a position corresponding to the first connection electrode;
  • a conductive member inserted into the through hole of the housing and contacting a lower surface of the first connection electrode and having an insertion hole extending in a vertical direction in a center thereof;
  • a conductive pin inserted into the through hole of the housing and positioned below the conductive member, the lower end of the conductive member protruding from the through hole, and the upper end of the conductive pin being inserted into the insertion hole of the conductive member to contact the inner wall of the insertion hole;
  • a spring member disposed between the conductive member and the conductive pin to elastically bias the conductive member and the conductive pin in a direction away from each other.
  • An upper pin portion smaller than an inner diameter of the spring member and having a diameter equal to the inner diameter of the insertion hole and inserted into the insertion hole through the spring member;
  • the stepped portion is formed at the upper end to allow the spring member to be seated, and the diameter is larger than the inner diameter of the spring member, and preferably consists of a lower pin portion connected to the upper pin portion integrally.
  • the first connection electrode and the conductive member may be bonded by solder or conductive epoxy to integrate the first connection electrode and the conductive member.
  • the second connection electrode and the conductive pin may be bonded by solder or a conductive epoxy to integrate the second connection electrode and the conductive pin.
  • the lower side of the conductive pin is integrally formed with a protruding portion protruding to the outside of the housing while having a larger diameter than the through hole.
  • the conductive member is made of a wire wound spirally formed integrally with the spring member, it is preferable that the wire is wound in close contact.
  • the conductive member is preferably a cylinder made of a conductive metal.
  • a plating layer is formed on an inner wall of the insertion hole of the conductive pin.
  • the conductive pin may contact the inner wall of the insertion hole of the conductive member when the spring member is compressed.
  • a separate conductive member and a conductive pin are directly in contact with the spring member, and the spring member is inserted into the conductive pin so that the thickness of the spring can be maintained more than a predetermined time while improving signal transmission characteristics.
  • FIG. 1 is a diagram of a test socket according to the prior art
  • FIG. 2 is a view of a test socket according to another prior art.
  • FIG. 3 is a view of a test socket according to another prior art.
  • FIG. 4 is a diagram of a test socket in accordance with a preferred embodiment of the present invention.
  • FIG. 6 is a view of a test socket according to another embodiment of the present invention.
  • the test socket 10 may be connected to the semiconductor device 80 and the terminal 81 of the semiconductor device 80 and the pad 91 of the test apparatus 90. As disposed between the test apparatus 90, the first sheet member 20, the housing 30, the conductive member 40, the conductive pin 50, the spring member 60, and the second sheet member 70. Is made of.
  • the first connection electrode 21 is disposed at a position corresponding to the terminal 81 of the semiconductor device 80.
  • the first sheet member 20 supports each first connecting electrode 21 to maintain a constant position between the housing 30 and the terminal 81.
  • the first sheet member 20 is not particularly limited as long as it is an insulating flexible material.
  • a resin sheet made of a polyimide resin, a liquid crystal polymer, polyester, a fluorine resin, or the like, and the above-described resin Although an impregnated sheet etc. can be used, a polyimide is preferable.
  • the first connection electrode 21 is connected to the terminal 81 of the semiconductor device 80 and the conductive member 40 in a state of being supported by the first sheet member 20.
  • the first connection electrode 21 is preferably used as a metal material having excellent electrical conductivity.
  • nickel, copper, gold, silver, palladium, iron, or the like may be used, and even if the whole is made of a single metal, It may be made of an alloy of two or more kinds of metals or a laminate of two or more kinds of metals.
  • the first connection electrode 21 may be formed on the surface thereof with a chemically stable and conductive metal film such as gold, silver, palladium and the like.
  • diamond particles may be distributed on the surface of the first connection electrode 21 so as to easily remove foreign substances formed on the surface of the terminal 81.
  • the nickel particles may be plated and bonded to the first connection electrode 21 due to nickel.
  • the housing 30 is disposed below the first sheet member 20 and has a through hole 31 extending in a vertical direction at a position corresponding to the first connection electrode 21.
  • a housing 30 may be used in engineering plastics and other various synthetic resin materials having excellent insulation and high strength.
  • the conductive member 40 is inserted into the through hole 31 of the housing 30 and is in contact with the bottom surface of the first connection electrode 21 and has a metallic insertion hole 41 extending in the vertical direction in the center thereof. Is a conductor.
  • the upper portion of the conductive member 40 is joined to the lower surface of the first connection electrode 21 by solder or conductive epoxy, and thus can be raised or lowered together with the first connection electrode 21.
  • a conductive pin 50 is inserted into the insertion hole 41 so that the conductive member 40 is directly electrically connected to the conductive pin 50.
  • the conductive member 40 may have a structure in which a wire is spirally wound in the same manner as the spring member 60. However, the difference from the spring member 60 is that the conductive member 40 is the wires are wound close to each other. In this way, when the wire is closely wound and wound, the electrical signal does not flow while turning along the wire, but can flow in a straight line in a vertical direction.
  • the conductive member 40 is integrally connected with the spring member 60 is preferably manufactured with the spring member 60, in addition to the spring member 60 may be assembled separately.
  • the element wire forming the conductive member is preferably used as a metal material excellent in electrical conductivity.
  • a plating layer may be formed inside the conductive member 40, and the plating layer (not shown) enables the conductive pin 50 and the conductive member 40 to be electrically connected to each other securely. As such, when the plating layer is formed inside the conductive member 40, the conductive member may form a tube integrated.
  • the conductive pin 50 is inserted into the through hole 31 of the housing 30 and is located below the conductive member 40, and a lower end thereof protrudes from the through hole 31.
  • the upper end of the conductive pin 50 is inserted into the insertion hole 41 of the conductive member 40 and is in direct contact with the inner wall of the insertion hole 41 so that the conductive pin 50 is electrically connected to the conductive member 40.
  • the conductive pin 50 is composed of an upper pin portion 51 and a lower pin portion 52.
  • the upper pin portion 51 forms the upper side of the conductive pin 50, and has a shape of a win column as a whole, and the outer diameter thereof is smaller than the inner diameter of the spring member 60 so that it is inserted into the spring member 60. Can be.
  • the outer diameter of the upper pin portion 51 is almost the same as or slightly smaller than the inner diameter of the insertion hole 41 can be in direct contact with the inner diameter of the insertion hole 41.
  • the pin member is equal to or larger than the inner diameter of the insertion hole 41, it is not preferable because the pin member is hard to move inside the conductive pin 50. That is, it is preferable to have the outer diameter of the grade which contacts with the said conductive pin 50, and is easy to move.
  • the upper pin portion 51 may be formed with a chemically stable and conductive metal film such as gold, silver, palladium, etc. on its surface in order to provide excellent electrical conduction with the spring member 60.
  • the upper pin portion may be in contact with the conductive member 40 even before the test is performed, that is, before the spring member 60 is compressed, but is not limited thereto. Before the test is performed, the conductive member 40 may be used. It is also possible that the spring member 60 is in contact with the conductive member 40 while the spring member 60 is compressed and the conductive member 40 descends.
  • the lower pin portion 52 has a stepped portion formed at an upper end thereof so that the spring member 60 can be seated, and the diameter is larger than the inner diameter of the spring member 60 and integrally connected to the upper pin portion 51. Will be.
  • the lower pin portion 52 has a diameter larger than the diameter of the upper pin portion 51 and has a cylindrical shape as a whole, but may be formed to decrease in diameter toward the lower side.
  • the lower pin portion 52 is preferably bonded to the second connection electrode 71 disposed at the bottom by solder or conductive epoxy.
  • the spring member 60 is disposed between the conductive member 40 and the conductive pin 50 to elastically bias the conductive member 40 and the conductive pin 50 in a direction away from each other.
  • the conductive member 40 absorbs the pressing force when the conductive member 40 is lowered by the semiconductor device 80, and the terminal 81 and the first connection electrode 21 of the semiconductor device 80 closely adhere to each other. And the terminal 81 and the second connection electrode 71 of the test apparatus 90 may be electrically connected to each other.
  • the spring member 60 is a conventional spring in which the element wires are wound in a spiral shape, and the element elements are arranged to be spaced apart in the vertical direction. In this regard, there is a difference from the conductive member 40. However, the spring member 60 and the conductive member 40 is made of one wire is connected.
  • the lower side of the spring member 60 may be formed to narrow the inner diameter toward the lower side. Specifically, it is preferable that the lower end of the spring member is narrowed to the outer diameter of the upper pin portion 51 so as to be fit. That is, the middle or upper side of the spring member is slightly larger than the outer diameter of the upper pin portion 51 to allow the spring member to be compressed or extended, and the lower side of the spring member is pressed against the upper pin portion 51. It is possible to suppress the spring member 60 from moving up and down unnecessarily.
  • the structure for the interference fit is not limited to this, it is possible that the spring member is forcibly fitted to the upper pin portion by slightly increasing the outer diameter of the portion requiring the interference fit in the upper pin portion.
  • the second sheet member 70 corresponds to the first sheet member 20 but is disposed under the housing 30, and a second connection electrode 71 corresponding to the first connection electrode 21 is provided.
  • the second connection electrode 71 may be in contact with the conductive pin 50.
  • the second connection electrode 71 and the conductive pin 50 are bonded to each other by solder and conductive epoxy. Of course, in addition to this can be bonded by a variety of materials and it is also possible to be in contact only with each other without a bonding material. This may be equally applied to the first connection electrode 21 and the conductive member 40.
  • test socket 10 according to the preferred embodiment of the present invention has the following effects.
  • the semiconductor device 80 descends to press the test socket 10. That is, when the terminal 81 of the semiconductor device 80 presses the first connection electrode 21, the first connection electrode 21 descends while lowering the conductive member 40, and with this, the conductive pin 50 The upper pin portion 51 of the c) is more deeply inserted into the insertion hole 41 of the conductive member 40, and is surely in contact with the conductive member 40. In this situation, since the spring member 60 is compressed and elastic repulsion occurs, the conductive member 40 and the conductive pin 50 are pushed away from each other. Accordingly, the first connection electrode 21 and the terminal of the semiconductor device 80 are pushed. The 81 and the second connection electrode 71 and the pad 91 of the test apparatus 90 may be in close contact with each other.
  • the conductive member 40 is the through hole 31 in the through hole 31 of the housing during the lowering of the conductive pin.
  • the conductive pin is tilted in the through hole 31 of the housing so that the conductive member and the conductive pin 5 can contact each other.
  • the bending of the conductive member and the tilting of the conductive pin can be made selectively or simultaneously with each other.
  • the signal is transmitted to the semiconductor device 80 via the test socket 10 and the signal flowing through the semiconductor device 80 is as shown in FIG. 5.
  • test socket according to the preferred embodiment of the present invention has the following effects.
  • the test socket according to the preferred embodiment of the present invention has an advantage that the current transfer path is shortened because there is almost no rotational movement of the signal through the spring, so that the transfer efficiency is excellent.
  • the test socket according to a preferred embodiment of the present invention is easy to manufacture a fine pitch.
  • the prior art shown in FIG. 2 has a structure in which the inner spring is fitted into the outer spring to be coupled. In such a case, it is difficult to adjust the force of the spring and the inner plating to improve the connection force. There is also the problem of difficulty. In particular, to reduce the diameter of the through-hole while reducing the diameter of the through-hole in order to match the fine pitch is too easy to manufacture the diameter is reduced. On the other hand, in the embodiment according to the present invention, since the upper pin portion of the conductive pin is inserted into the spring and the spring is fitted to the outside thereof, the inner diameter of the through hole can be sufficiently reduced accordingly.
  • test socket of the present invention may be modified as follows.
  • the second sheet member provided with the second connection electrode is disposed under the conductive pin, but the present invention is not limited thereto, and the protrusion 53 may be formed as shown in FIG. 6.
  • the protrusion 53 is formed integrally with the lower pin portion 52 below the lower pin portion 52 of the conductive pin, and has a larger diameter than the through hole, so that the protrusion 53 is not inserted into the through hole. It protrudes outward. In this case, since there is no need to arrange the second connection electrode and the sheet member, the manufacturing cost is reduced.
  • the first connection electrode 21 and the conductive member 40 are bonded by solder or conductive epoxy so that the first connection electrode 21 and the conductive member 40 are integrated. Accordingly, there is little concern that the first connection electrode 21 and the conductive member 40 may be separated from each other. That is, the first connection electrode 21 does not slip with respect to the conductive member 40 while the terminal of the semiconductor device is in contact with the first connection electrode.
  • first connection electrode 21 and the conductive member 40 are integrated with each other, there is no need to directly bond the first sheet member 20 to the housing 30 separately. Since the first connection electrodes 21 can be separated from each other, there is an advantage that the interference between the first sheet member and the like for carrying the semiconductor device is less likely to occur.
  • the conductive member 40 has been described as having a spring-like structure in which the element wire is in close contact with the wire, but is not limited thereto. It is also possible to have a cylindrical shape made of a conductive metal as shown in FIG. At this time, the conductive member is disposed on the upper side of the spring member, the upper end of the conductive pin is fitted therein.
  • test socket of the present invention described above is not limited thereto, and the scope of rights may be extended as long as it can be interpreted by the claims.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

L'invention concerne une prise de vérification, et plus particulièrement une prise de vérification disposée entre un dispositif semi-conducteur et un dispositif d'essai, de sorte à interconnecter électriquement une borne du dispositif semi-conducteur et une pastille du dispositif d'essai. La prise selon l'invention comprend : un premier élément feuille soutenant une première électrode de connexion disposée à un emplacement correspondant à la borne du dispositif semi-conducteur ; un logement disposé en dessous du premier élément feuille et comportant un trou traversant formé à un emplacement correspondant à la première électrode de connexion et allongé verticalement ; un élément conducteur inséré dans le trou traversant du logement de sorte qu'il vienne en contact avec la surface inférieure de la première électrode de connexion, et comportant un centre pourvu d'un trou d'insertion allongé verticalement ; une tige conductrice insérée dans le trou traversant du logement de sorte à être placée en dessous de l'élément conducteur, son extrémité inférieure faisant saillie du trou traversant et son extrémité supérieure étant insérée dans le trou d'insertion de l'élément conducteur pour venir en contact avec la paroi interne du trou d'insertion ; et un élément ressort disposé entre l'élément conducteur et la tige conductrice, de sorte à solliciter de façon élastique l'élément conducteur et la tige conductrice dans le sens de leur séparation.
PCT/KR2011/000955 2010-02-11 2011-02-11 Prise de vérification WO2011099822A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100012904A KR101138964B1 (ko) 2010-02-11 2010-02-11 테스트 소켓
KR10-2010-0012904 2010-02-11

Publications (2)

Publication Number Publication Date
WO2011099822A2 true WO2011099822A2 (fr) 2011-08-18
WO2011099822A3 WO2011099822A3 (fr) 2011-12-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000955 WO2011099822A2 (fr) 2010-02-11 2011-02-11 Prise de vérification

Country Status (2)

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KR (1) KR101138964B1 (fr)
WO (1) WO2011099822A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装
EP3333983A4 (fr) * 2015-08-07 2019-06-26 Joinset Co., Ltd Borne connectrice électrique
CN114252656A (zh) * 2020-09-25 2022-03-29 Ｔｓｅ有限公司 测试插座及包括其的测试设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160001723A (ko) 2013-10-23 2016-01-07 주식회사 아테코 테스트 소자 인서트 및 전자부품 테스트 장치
KR102270275B1 (ko) * 2020-04-10 2021-06-28 주식회사 오킨스전자 테스트 소켓

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116795A (ja) * 1999-10-18 2001-04-27 Mitsubishi Electric Corp テスト用ソケット、およびテスト用ソケットに用いる接続シート
JP2003084047A (ja) * 2001-06-29 2003-03-19 Sony Corp 半導体装置の測定用治具
KR200313240Y1 (ko) * 2003-02-27 2003-05-17 (주)티에스이 볼 그리드 어레이(ｂｇａ) 패키지용 테스트 소켓

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200163193Y1 (ko) 1999-07-01 2000-02-15 리노공업주식회사 분리형칩검사소켓장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116795A (ja) * 1999-10-18 2001-04-27 Mitsubishi Electric Corp テスト用ソケット、およびテスト用ソケットに用いる接続シート
JP2003084047A (ja) * 2001-06-29 2003-03-19 Sony Corp 半導体装置の測定用治具
KR200313240Y1 (ko) * 2003-02-27 2003-05-17 (주)티에스이 볼 그리드 어레이(ｂｇａ) 패키지용 테스트 소켓

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106057771A (zh) * 2015-04-06 2016-10-26 爱思开海力士有限公司 具有插座插头互连结构的半导体封装
CN106057771B (zh) * 2015-04-06 2020-03-03 爱思开海力士有限公司 具有插座插头互连结构的半导体封装
EP3333983A4 (fr) * 2015-08-07 2019-06-26 Joinset Co., Ltd Borne connectrice électrique
CN114252656A (zh) * 2020-09-25 2022-03-29 Ｔｓｅ有限公司 测试插座及包括其的测试设备
CN114252656B (zh) * 2020-09-25 2023-06-16 Ｔｓｅ有限公司 测试插座及包括其的测试设备

Also Published As

Publication number Publication date
KR101138964B1 (ko) 2012-04-25
WO2011099822A3 (fr) 2011-12-15
KR20110093085A (ko) 2011-08-18

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