WO2019039628A1 - Module conducteur bidirectionnel ayant une technologie de traitement laser appliquée à celui-ci et son procédé de fabrication - Google Patents

Module conducteur bidirectionnel ayant une technologie de traitement laser appliquée à celui-ci et son procédé de fabrication Download PDF

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Publication number
WO2019039628A1
WO2019039628A1 PCT/KR2017/009255 KR2017009255W WO2019039628A1 WO 2019039628 A1 WO2019039628 A1 WO 2019039628A1 KR 2017009255 W KR2017009255 W KR 2017009255W WO 2019039628 A1 WO2019039628 A1 WO 2019039628A1
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WO
WIPO (PCT)
Prior art keywords
holes
vertical direction
conductive
mold
base
Prior art date
Application number
PCT/KR2017/009255
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English (en)
Korean (ko)
Inventor
문해중
이은주
Original Assignee
주식회사 이노글로벌
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Publication of WO2019039628A1 publication Critical patent/WO2019039628A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Definitions

  • the present invention relates to a bidirectional conductive module and a method of manufacturing the same, and more particularly, to a bidirectional conductive module and a method of manufacturing the same, which can improve the electrical characteristics while overcoming the limitations of fine pitch and thickness, will be.
  • the semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. Inspection is carried out with a semiconductor test socket (or a connector or a connector) formed so as to be in electrical contact with a terminal of a semiconductor element inserted between a semiconductor element and an inspection circuit board. Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.
  • a technique proposed to be compatible with the integration of such semiconductor devices is to form a perforated pattern in a vertical direction on a silicon body made of a silicone material made of an elastic material and then to fill the perforated pattern with a conductive powder to form a conductive pattern PCR socket type is widely used.
  • a conventional semiconductor testing apparatus 1 includes a support plate 30 and a semiconductor test socket 10 of PCR socket type.
  • the support plate 30 supports the semiconductor test socket 10 when the semiconductor test socket 10 moves between the semiconductor element 3 and the test circuit board 5.
  • a main through hole (not shown) for the advance and retreat guide is formed at the center of the support plate 30, and the through holes for coupling are spaced apart from each other along the edge forming the main through hole .
  • the semiconductor test socket 10 is fixed to the support plate 30 by a peripheral support portion 50 joined to the upper and lower surfaces of the support plate 30.
  • the PCR socket type semiconductor test socket 10 has a perforated pattern formed on an insulating silicon body and conductive patterns are formed in the vertical direction by the conductive powder 11 filled in the perforated pattern.
  • the semiconductor type test socket 10 of the PCR type uses a body made of silicon
  • the semiconductor element 3 is pressed downward in contact with the semiconductor test socket 10
  • Deformation occurs.
  • a cross-section of the perforated pattern is deformed in the form of a jar by pressing in the downward direction.
  • Such a phenomenon causes an increase in electrical resistance, .
  • the upper part of the conductive powder is provided with an inclined surface, Thereby forming a groove or the like.
  • the present invention provides a bidirectional conductive module and a method of manufacturing the same that can overcome limitations of fine pitch and thickness while improving electrical characteristics and manufacturing by a simple manufacturing method It has its purpose.
  • a bi-directional conductive module comprising: an insulating main body formed of insulating material and having a plurality of through holes penetrating in a vertical direction; A conductive pattern portion including conductive particles having conductivity to be filled in each of the through holes; And at least one region is formed in the insulating main body so as to surround the peripheries of the through holes, thereby providing a restoring force in a vertical direction.
  • the elastic spring may be formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material.
  • the elastic spring may include a coil spring that is wound along the vertical direction inside the insulating main body around the through hole.
  • a method of manufacturing a bidirectional conductive module comprising the steps of: (a) providing a base mold having a plurality of mold pins protruding upward; (b) inserting an elastic spring into each of the mold pins so as to surround the respective mold pins; (c) injecting a liquid phase of an insulating material into the base mold and curing the base mold to form an insulating main body; (d) separating the insulating main body from the base metal mold, wherein a plurality of through holes are vertically formed in the insulating main body by each of the metal mold fins, and each of the through holes is formed so as to surround each of the through holes At least one region of the elastic spring being formed inside the insulating body; (e) filling the respective through holes with a filler including conductive particles having conductivity, and curing the filler. [5] The method of manufacturing a bidirectional conductive module according to claim 1,
  • the elastic spring may be formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material.
  • the elastic spring may include a coil spring for surrounding the mold pin.
  • a bidirectional conductive module comprising: an insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction; And a conductive pattern portion formed in each of the through holes and having conductivity in a vertical direction; The conductive pattern portion being inserted into the through hole to provide a restoring force in an up and down direction, the conductive pattern portion having elasticity; And a filler including conductive particles having conductivity to be filled between the elastic springs.
  • the elastic spring may include at least one of a carbon spring material, a stainless steel material, a tungsten material, and a plastic material; And a plating layer of a conductive material formed on the surface of the base spring.
  • the elastic spring may include a coil spring that is wound along the vertical direction within the through hole.
  • a method of manufacturing a bidirectional conductive module comprising: (a) providing an insulating main body of an insulating material having a plurality of through holes penetrating in a vertical direction; (b) inserting an elastic spring having electrical conductivity and providing a restoring force in each of the through-holes in a vertical direction; (c) filling the respective through-holes with a filler including conductive particles having conductivity, filling the spaces between the elastic springs and curing the conductive material, and .
  • a method of manufacturing a bidirectional conductive module comprising: (a) providing an insulating main body of an insulating material having a plurality of through holes penetrating in a vertical direction; (b) providing a fin-making mold having a mold hole having an inner diameter of a size corresponding to the inner diameter of the through-hole; (c) placing a base elastic spring having conductivity inside the mold hole; (d) filling the mold hole with a filler including conductive particles having conductivity, filling the gap between the base elastic springs and curing the base pin to form a base pin; (e) cutting the base pin in units corresponding to the thickness of the insulating main body to form a conductive pattern pin, the conductive pattern pin including an elastic spring formed by cutting and a filler; (f) inserting the conductive pattern pins into the respective through-holes to form conductive pattern portions, wherein the elastic springs in the conductive pattern fins are arranged to form a restoring force in
  • the elastic spring may include at least one of a carbon spring material, a stainless steel material, a tungsten material, and a plastic material; And a plating layer of a conductive material formed on the surface of the base spring.
  • the elastic spring may include a coil spring that is wound along the vertical direction within the through hole.
  • the elastic spring is formed inside the insulating body so as to surround the periphery of the through hole, thereby preventing deformation of the insulating body due to downward pressing generated in the test process of the semiconductor element
  • the present invention also provides a bidirectional conductive module and a method of manufacturing the same, which can provide a restoring force due to elastic support, thereby preventing deterioration of electrical characteristics due to deformation and enabling more stable inspection.
  • the elastic spring is supported by the spring, its deformation is minimized, and the life of the product can be improved.
  • FIG. 1 is a cross-sectional view of a conventional semiconductor test apparatus of PCR socket type
  • FIG. 2 is a view for explaining a warp phenomenon of a conventional PCR socket-type semiconductor test socket
  • FIG. 3 is a view for explaining a bidirectional conductive module according to the first embodiment of the present invention.
  • FIGS. 4 and 5 are views for explaining a method of manufacturing the bidirectional conductive module according to the first embodiment of the present invention
  • FIG. 6 is a view for explaining a method for manufacturing a bidirectional conductive module according to a second embodiment of the present invention
  • FIG. 7 and 8 are views for explaining another method of manufacturing the bidirectional conductive module according to the second embodiment of the present invention.
  • bidirectional conductive module 110, 310, 510 bidirectional conductive module 110, 310, 510:
  • the present invention relates to a bidirectional conductive module, and more particularly, to a bidirectional conductive module comprising: an insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction; A conductive pattern portion including conductive particles having conductivity to be filled in each of the through holes; And at least one region is formed inside the insulating body so as to surround the perimeter of each of the through holes, thereby providing a restoring force in a vertical direction.
  • FIG. 3 is a view for explaining the bidirectional conductive module 100 according to the first embodiment of the present invention.
  • the bidirectional conductive module 100 according to the first embodiment of the present invention includes an insulating main body 110, a conductive pattern portion 130, and an elastic spring 120.
  • the insulating main body 110 is made of an insulating material, and is made of a material having elasticity such as silicon.
  • the insulating main body 110 is formed with a plurality of through holes 111 (see Fig. 5) penetrating in the vertical direction.
  • the conductive pattern portion 130 is filled in each of the through holes 111 to form a conductive line in the vertical direction.
  • the conductive pattern part 130 includes conductive conductive particles 131.
  • the conductive pattern part 130 may be formed by filling and curing a filler mixed with the liquid silicon 132 and the conductive particles 131.
  • the conductive particles 131 may have the form of conductive conductive powder, conductive fiber, or conductive wire, and a plating of a conductive material may be formed on the outer surface to improve the conductivity.
  • At least one region of the elastic spring 120 is formed inside the insulating body 110 so as to surround the peripheries of the respective through holes 111.
  • 3 shows an example in which the entirety of the elastic spring 120 is formed inside the insulating main body 110 so as to surround the peripheries of the respective through holes 111.
  • FIG. 3 shows an example in which the entirety of the elastic spring 120 is formed inside the insulating main body 110 so as to surround the peripheries of the respective through holes 111.
  • the elastic spring 120 is formed so as to provide a restoring force in a vertical direction.
  • the elastic coil 120 is wound around the through hole 111 in the vertical direction inside the insulating main body 110, It is exemplified that it is composed of a spring type.
  • the bidirectional conductive module 100 is used as a semiconductor test socket, so that the terminals or the ball grid of the semiconductor element in the upper direction can direct the conductive pattern portion 130 downward
  • the resilient spring 120 resiliently supports the insulating body 110 together with the insulating body 110 to prevent deformation of the insulating body 110 when pressing. As a result, it is possible to prevent deterioration of electrical characteristics due to deformation.
  • the insulating main body 110 made of a silicon material can solve the problem of loss of restoring force and deformation in a continuous inspection process, life of the product can be improved.
  • the elastic spring 120 is formed of at least one of carbon steel material, stainless steel material, tungsten material, and plastic material. However, it may be made of other material capable of elastically supporting in the up- Of course it is.
  • FIG. 1 a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5.
  • FIG. 1 a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5.
  • FIG. 1 a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5.
  • a base mold 1 in which a plurality of mold pins 3 protrude upward is provided.
  • the plurality of mold pins 3 formed on the base metal mold 1 are provided at a size and an interval corresponding to the through holes 111 of the bidirectional conductive module 100.
  • the elastic springs 120 are inserted into the respective mold pins 3 so as to enclose the respective mold pins 3.
  • a liquid for example, a liquid silicone of an insulating material is injected into the base metal mold 1 , And cured at a high temperature to form the insulating main body 110.
  • high temperature curing is performed at a temperature of 150 DEG C for 15 minutes or more.
  • the insulating body 110 When the insulating body 110 is removed from the base metal 1 after the curing is completed, the insulating body 110 having the plurality of through holes 111 formed therein is completed, as shown in FIG. At this time, as described above, a plurality of through-holes penetrating in the vertical direction are formed in the insulating main body 110 by the respective metal mold pins 3, and a shape in which the elastic springs 120 surround the peripheries of the through- Is formed inside the insulating main body 110.
  • the filler including the conductive particles 131 for example, the filler mixed with the liquid silicon 132 and the conductive particles 131 is filled in the respective through holes 111 and then hardened,
  • the pattern portion 130 is formed to complete the fabrication of the bidirectional conductive module 100 as shown in Fig.
  • the filler is cured at a high temperature, for example, a high temperature of 160 ⁇ or higher.
  • bidirectional conductive module 300 according to a second embodiment of the present invention and a method of manufacturing the same will be described with reference to FIG.
  • the bidirectional conductive module 300 includes an insulating main body 310 and a conductive pattern portion 330 as shown in FIG. 6 (c).
  • the insulating main body 310 is made of an insulating material as in the first embodiment, and is made of a material having elasticity such as silicon.
  • the insulating main body 310 is formed with a plurality of through holes 311 penetrating in the vertical direction.
  • the conductive pattern portion 330 is formed in each of the through holes 311 to form a conductive line in the vertical direction.
  • the conductive pattern portion 330 includes the elastic spring 320 and a filler.
  • the elastic spring 320 is inserted into the through hole 311 to elastically provide a restoring force in a vertical direction.
  • the elastic spring 320 has conductivity.
  • the elastic spring 320 includes a base spring formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material, and a plating layer of a conductive material formed on the surface of the base spring For example.
  • the plating layer may be formed through sequential plating of nickel and gold.
  • the elastic spring 320 is formed as a coil spring that is wound along the vertical direction in the through-hole.
  • the filler is filled in a state in which the conductive particles 331 having conductivity and the liquid silicon 332 are mixed and cured.
  • the conductive particles 331 are filled between the elastic springs 320, the contact between the conductive particles 331 and the elastic springs 320 when pressed during the testing process of the semiconductor device, The electrical connection can be made more stably by the contact.
  • the elastic spring 320 elastically supports the terminal or the ball of the semiconductor element and disperses the pressure applied to the insulating main body 310 so that the deformation of the insulating main body 310 is minimized and the electrical characteristic It is possible to prevent deterioration and extend its service life.
  • FIG. 6A a method of manufacturing the bidirectional conductive module 300 according to the second embodiment of the present invention will be described.
  • a plurality of through- An insulating main body 310 of an insulating material formed with balls is provided.
  • the insulating main body 310 can be manufactured through the base mold 3 as shown in Fig. 4 (a), or through holes can be formed through laser processing.
  • the resilient spring 320 is inserted into each of the through holes 311 to provide a restoring force in the up-and-down direction and have conductivity.
  • the elastic spring 320 is provided as a coil spring that is wound along the vertical direction inside the through-hole.
  • the conductive pattern portion 330 is formed in the through hole 311, and the conductive pattern portion 330 is formed in the through hole 311, .
  • the filler includes the conductive particles 331 and the liquid silicon 332, and the conductive particles 331 are filled in the space between the elastic springs 320 when filled.
  • FIGS. 7 and 8 are views for explaining a bidirectional conductive module 500 according to a third embodiment of the present invention and a method of manufacturing the same.
  • the insulating main body 510 in which a plurality of through holes 511 are formed is provided as in the above-described embodiment (see Fig. 8B).
  • a fin forming mold 5 is prepared.
  • a mold hole 7 having an inner diameter corresponding to the inner diameter of the through hole 511 is formed.
  • the length of the mold hole 7 is longer than the thickness of the insulating main body 510, and the plurality of conductive pattern portions 530 are formed in the subsequent cutting process.
  • the base elastic spring 520a having conductivity is seated in the inside of the mold hole 7.
  • the base elastic spring 520a is cut in the subsequent cutting process to form the elastic spring 520.
  • the base spring 520 is made of at least one of carbon steel material, stainless steel material, tungsten material, and plastic material so as to have conductivity.
  • a plating layer of a conductive material formed on the surface thereof is the same as the above-described embodiment.
  • a filler containing a conductive particle 531a having conductivity for example, a filler in which liquid silicone 532a and conductive particles 531a are mixed is injected into the mold hole 7 in a state in which the base elastic spring 520a is seated. And then hardened to form a base pin 530a as shown in Fig. 8 (a). Here, the conductive particles 531a are cured in a state filled between the base elastic springs 520a.
  • the base pin 530a is cut in a unit corresponding to the thickness of the insulating main body 510 to form the conductive pattern fin 530b.
  • an elastic spring 520 formed by cutting and a filler that is, a conductive particle 531 and a cured silicon 532 are formed in the conductive pattern fin 530b formed by cutting the base pin 530a do.
  • the conductive pattern pin 530b when the conductive pattern pin 530b is inserted into the through hole 511 of the insulating main body 510, the conductive pattern pin 530b is electrically connected to the bidirectional conductive module 500
  • the conductive pattern portion 530 of the conductive pattern portion 530 is formed to enable the fabrication of the bidirectional conductive module.
  • the bidirectional conductive modules 100, 300 and 500 according to the present invention can be applied to an interposer for connecting a PCB and a PCB (or a CPU), an interposer for wafer inspection, and the like in addition to inspection of semiconductor devices.
  • the present invention can be applied to connecting a semiconductor device to be tested to an inspection circuit board in a process of testing semiconductor devices, and the present invention is also applicable to an interposer connecting between a CPU and a board or an interposer used for wafer inspection.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une broche conductrice bidirectionnelle, un module à motif conducteur bidirectionnel et leur procédé de fabrication. La broche conductrice bidirectionnelle selon la présente invention comprend : un corps de broche formé d'un matériau isolant ; et un module de broche disposé à l'intérieur du corps de broche de sorte que la partie supérieure et la partie inférieure de celui-ci soient exposées sur la surface supérieure et la surface inférieure du corps de broche, respectivement. Le module de broche comprend : une partie de contact supérieure qui a une forme cylindrique et dont la partie supérieure est exposée sur la partie supérieure du corps de broche ; une partie de contact inférieure qui est cylindrique et dont la partie inférieure est exposée sur la partie inférieure du corps de broche ; et au moins une partie de connexion qui sert à connecter électriquement la partie de contact supérieure et la partie de contact inférieure à l'intérieur du corps de broche. L'au moins une partie de connexion est connectée à la partie de contact supérieure et à la partie de contact inférieure à des positions dans la direction circonférentielle de façon à connecter la partie de contact supérieure et la partie de contact inférieure tout en étant enroulées le long de la direction circonférentielle. En conséquence, une plaque mince métallique conductrice est configurée, et un motif est enroulé au moyen d'un moule, par exemple, de façon à former une partie de contact supérieure et une partie de contact inférieure. En conséquence, une partie de connexion est formée de façon à être enroulée dans la direction circonférentielle, et vient exercer une force de rappel élastique dans la direction montante/descendante, ce qui permet de mettre en œuvre une broche conductrice bidirectionnelle unique dans la direction montante/descendante.
PCT/KR2017/009255 2017-08-22 2017-08-24 Module conducteur bidirectionnel ayant une technologie de traitement laser appliquée à celui-ci et son procédé de fabrication WO2019039628A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0105910 2017-08-22
KR20170105910 2017-08-22

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Publication Number Publication Date
WO2019039628A1 true WO2019039628A1 (fr) 2019-02-28

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102191698B1 (ko) * 2019-05-31 2020-12-16 주식회사 이노글로벌 테스트 소켓 및 이의 제조방법
KR102158507B1 (ko) * 2019-07-09 2020-09-22 주식회사 이노글로벌 테스트 소켓 및 그 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237039A (ja) * 2000-02-23 2001-08-31 Nec Corp Ｉｃソケット
KR200312740Y1 (ko) * 2003-01-27 2003-05-13 주식회사 아이에스시테크놀러지 도전성 스프링을 갖는 집적화된 실리콘 콘택터
US20100221960A1 (en) * 2006-08-08 2010-09-02 Un-Young Chung Pogo pin, the fabrication method thereof and test socket using the same
KR101482245B1 (ko) * 2013-12-27 2015-01-16 주식회사 아이에스시 전기적 검사소켓
KR101526536B1 (ko) * 2013-12-27 2015-06-10 주식회사 아이에스시 전도성 탄성부재, 전도성 탄성부재의 제조방법 및 전기적 검사소켓

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237039A (ja) * 2000-02-23 2001-08-31 Nec Corp Ｉｃソケット
KR200312740Y1 (ko) * 2003-01-27 2003-05-13 주식회사 아이에스시테크놀러지 도전성 스프링을 갖는 집적화된 실리콘 콘택터
US20100221960A1 (en) * 2006-08-08 2010-09-02 Un-Young Chung Pogo pin, the fabrication method thereof and test socket using the same
KR101482245B1 (ko) * 2013-12-27 2015-01-16 주식회사 아이에스시 전기적 검사소켓
KR101526536B1 (ko) * 2013-12-27 2015-06-10 주식회사 아이에스시 전도성 탄성부재, 전도성 탄성부재의 제조방법 및 전기적 검사소켓

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