WO2015012498A1 - Connecteur conducteur et son procédé de fabrication - Google Patents

Connecteur conducteur et son procédé de fabrication Download PDF

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Publication number
WO2015012498A1
WO2015012498A1 PCT/KR2014/005777 KR2014005777W WO2015012498A1 WO 2015012498 A1 WO2015012498 A1 WO 2015012498A1 KR 2014005777 W KR2014005777 W KR 2014005777W WO 2015012498 A1 WO2015012498 A1 WO 2015012498A1
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WO
WIPO (PCT)
Prior art keywords
conductive
coating layer
metal coating
conductive metal
connector
Prior art date
Application number
PCT/KR2014/005777
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English (en)
Korean (ko)
Inventor
황규식
이병주
Original Assignee
주식회사 아이에스시
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Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to CN201480041445.2A priority Critical patent/CN105452877B/zh
Publication of WO2015012498A1 publication Critical patent/WO2015012498A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Definitions

  • the present invention relates to a conductive connector and a method for manufacturing the same, and more particularly, to a conductive connector for a test socket used for testing the electrical characteristics of the device under test and a method for manufacturing the same.
  • the electrical connection between the device under test and the test device should be made stable, and an electrical connection connector is used for this purpose. That is, the role of the connector device for electrical connection is to connect the terminal of the device under test and the pad of the test device with each other so that the electrical signals can be exchanged in both directions.
  • This electrical connection connector is used in a test apparatus for testing a device under test and is also called a test socket in that the device under test is coupled.
  • the conductive connector has a structure in which a conductive portion having elasticity is connected to the terminal of the device under test, and the pogo pin is configured to elastically contact the terminal of the device under test by a spring provided therein.
  • the conventional conductive connector and the pogo pin have a merit that can cushion the mechanical shock that may occur when the device under test and the test device are connected, and thus are widely used as test sockets.
  • FIG. 1 illustrates a conductive connector as an example of a conventional electrical connector
  • FIGS. 2 and 3 are plan views and cross-sectional views showing an enlarged conductive part of the conventional conductive connector shown in FIG. 1.
  • the conventional conductive connector 10 includes a plurality of conductive portions 12 disposed at positions corresponding to the terminals 22 of the device under test 20, and the plurality of conductive portions.
  • the insulating support part 11 which insulates each other while supporting the 22 is included.
  • the conductive portion 12 has a structure in which the conductive particles 12a are arranged in a thickness direction, that is, in a vertical direction, in a substrate made of an insulating elastic material 11a such as silicone rubber. It is made of the same material as the elastic material 11a in the conductive portion 12, for example, silicone rubber.
  • the conductive connector 10 is mounted on the inspection apparatus 30 and is inspected while the device under test 20 descends while the conductive portion 12 is in contact with the pad 32 of the inspection apparatus 30.
  • the terminal 22 of the device 20 presses the conductive portion 12 downward, the conductive particles 12a in the conductive portion 12 come into contact with each other to be in an electrically conductive state.
  • the part 12 is elastically compressive and deforms to cushion the mechanical shock that may occur when contacting the terminal 22 of the device under test 20.
  • the inspection device 30 is provided.
  • a predetermined test signal is applied from the pad 32 of the ())
  • the signal is transmitted to the terminal 22 of the device under test 20 via the conductive portion 12 of the conductive connector 10, thereby providing a predetermined electrical test. It can be done.
  • the conductive portion 12 of the conventional conductive connector 10 has a structure in which the conductive particles 12a are contained in the insulating elastic material 11a as described above. Only a portion of the small amount of conductive particles 12a is exposed to the upper surface of the conductive portion 12 in contact with the terminal 22 of the device under test 20 due to the elastic material 11a. Thereby, the contact area between the electroconductive particle 12a of the electroconductive part 12 and the terminal 22 of the device under test 20 is narrow, and the terminal 22 of the electroconductive part 12 and the device under test 20 is tested. Since the electrical contact resistance between the contact increases or poor contact occurs, there is a problem that the reliability of the conductive connector 10, that is, the quality screening ability for the device under test 20 is lowered.
  • the present invention has been made to solve the conventional problems as described above, and forms a conductive metal coating layer on the upper surface of the conductive portion to reduce the electrical contact resistance between the terminal and the conductive portion of the device under test and its manufacture.
  • the purpose is to provide a method.
  • a conductive connector according to an aspect of the present invention for achieving the above technical problem is disposed between the device under test and the test device, the conductive connector for electrically connecting the terminal of the device under test and the pad of the test device with each other.
  • a plurality of conductive portions disposed at positions corresponding to the terminals of the device under test and having conductive particles arranged in a vertical direction in an elastic material; An insulating support portion for insulating the plurality of conductive portions while supporting the plurality of conductive portions; And a conductive metal coating layer formed on an upper surface of each of the plurality of conductive parts.
  • the conductive parts may be formed to protrude upward from the upper surface of the insulating support, and the conductive metal coating layer may be formed on the upper surfaces of the protruding parts of the plurality of conductive parts.
  • the conductive metal coating layer may be formed on the side of the protrusion of the plurality of conductive parts.
  • the conductive metal coating layer may be formed to a diameter larger than the diameter of the plurality of conductive parts.
  • a guide film for guiding the terminal of the device under test to the center of the conductive part may be attached to an upper surface of the insulating support part, and the guide film may have a plurality of through-holes into which protrusions of the plurality of conductive parts are inserted.
  • the conductive metal coating layer may have a thickness of 0.1 ⁇ m ⁇ 10 ⁇ m.
  • the conductive metal of the conductive metal coating layer may include at least one selected from the group consisting of iron, nickel, chromium, gold, silver, copper, platinum, and alloys thereof.
  • the conductive metal coating layer may be made of conductive metal nanoparticles.
  • the average particle diameter of the conductive metal nanoparticles may be 10nm ⁇ 100nm.
  • the forming of the conductive metal coating layer may include attaching a mask film having holes formed on the upper surface of the insulating support to expose the plurality of conductive parts; Forming a conductive metal coating layer on an upper surface of the mask film and an upper surface of the plurality of conductive portions exposed by the holes; And removing the conductive metal coating layer formed on the upper surface of the mask film while removing the mask film from the upper surface of the insulating support.
  • the conductive parts may be formed to protrude upward from the upper surface of the insulating support, and the conductive metal coating layer may be formed on the upper surfaces of the protruding parts of the conductive parts.
  • the conductive metal coating layer may be formed on the side of the protrusion of the plurality of conductive parts.
  • the conductive metal coating layer may be formed to a diameter larger than the diameter of the plurality of conductive parts.
  • a guide film for guiding the terminal of the device under test to the center of the conductive part may be attached to an upper surface of the insulating support part, and the guide film may have a plurality of through-holes into which protrusions of the plurality of conductive parts are inserted.
  • the holes formed in the mask film may have a diameter greater than or equal to the diameter of the conductive portion.
  • the mask film is polyimide (PI), polyethylene terephthalate (PET), triacetate cellulose (TAC), ethylene vinyl acetate (EVA), polyflopropylene (PP), polycarbonate (PC), copper It may be made of any one material selected from the group consisting of a thin film sheet, an aluminum thin film sheet, and a stainless thin film sheet.
  • PI polyimide
  • PET polyethylene terephthalate
  • TAC triacetate cellulose
  • EVA ethylene vinyl acetate
  • PP polyflopropylene
  • PC polycarbonate
  • copper may be made of any one material selected from the group consisting of a thin film sheet, an aluminum thin film sheet, and a stainless thin film sheet.
  • the conductive metal coating layer may be formed to have a thickness of 0.1 ⁇ m ⁇ 10 ⁇ m.
  • the conductive metal paste may be coated on the upper surface of the mask film and the upper surface of the plurality of conductive parts by a printing method and then dried to form the conductive metal coating layer.
  • the conductive metal nanoparticle aqueous solution may be sprayed, sprayed, and then coated on the upper surface of the mask film and the upper surface of the plurality of conductive parts to form the conductive metal coating layer by drying.
  • the conductive connector since the conductive metal coating layer is formed on the upper surface of the conductive portion, the contact area with the terminal of the device under test is widened, so that the electrical contact resistance between the terminal of the device under test and the conductive portion is This decrease results in a stable electrical connection. Thereby, there exists an effect which improves the reliability of a conductive connector and the quality selection ability with respect to the device under test.
  • the upper surface of the conductive portion is covered by a harder coating layer than the conductive portion, wear and damage of the conductive portion caused by the conductive portion directly contacting the terminal of the device under test can be prevented, and contamination or damage of the conductive portion by foreign matter can be prevented. As a result, the service life of the conductive connector can be extended.
  • FIG. 1 is a cross-sectional view showing an example of a conventional conductive connector.
  • FIG. 2 and 3 are enlarged plan views and cross-sectional views of conductive portions of the conventional conductive connector shown in FIG.
  • FIG. 4 illustrates a conductive connector according to an embodiment of the present invention.
  • FIG. 5 is an enlarged view of the conductive part and the coating layer shown in FIG. 4.
  • FIG. 6 is a view partially showing a conductive connector according to another embodiment of the present invention.
  • FIG. 7 is a view partially showing a conductive connector according to another embodiment of the present invention.
  • FIG. 8 to 11 are diagrams for explaining step-by-step the manufacturing method of the conductive connector according to an embodiment of the present invention shown in FIG.
  • FIG. 12 and 13 are views for explaining a method of manufacturing a conductive connector according to another embodiment of the present invention shown in FIG.
  • FIG. 14 and 15 are views for explaining a method of manufacturing a conductive connector according to another embodiment of the present invention shown in FIG.
  • FIG. 4 is a view showing a conductive connector according to an embodiment of the present invention
  • Figure 5 is an enlarged view showing the conductive portion and the coating layer shown in FIG.
  • the conductive connector 100 is disposed between the device under test 20 and the test device 30 of the device under test 20. It is a kind of electrical connection connector, that is, a test socket, which serves to electrically connect the terminal 22 and the pad 32 of the test apparatus 30 to each other.
  • the conductive connector 100 enables electrical flow in a thickness direction, that is, a vertical direction, and disables electrical flow in a plane direction orthogonal to the thickness direction, that is, in a horizontal direction. It is configured to absorb the impact force applied from the terminal 22 of the device under test 20.
  • the conductive connector 100 includes a plurality of conductive parts 120, an insulating support part 110, and a conductive metal coating layer 130.
  • the conductive portion 120 is disposed at a position corresponding to the terminal 22 of the device under test 20 and has a structure in which the conductive particles 120a are arranged in the thickness direction in the elastic material 110a.
  • the horizontal cross section of the conductive portion 120 may have various shapes, but preferably has a circular cross-sectional shape. That is, the conductive portion 120 preferably has a cylindrical shape.
  • a heat resistant polymer material having a crosslinked structure may be used.
  • the curable polymer material forming material that can be used to obtain such an elastic polymer material various materials can be used, but liquid silicone rubber is preferable in terms of molding processability and electrical properties.
  • the liquid silicone rubber may be any of an addition type, a condensation type, a vinyl group or a hydroxyl group. Specifically, dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methylphenyl vinyl silicone raw rubber, etc. are mentioned.
  • the silicone rubber cured product preferably has a compression set of 10% or less, more preferably 8% or less at 150 ° C. Most preferably, it is 6% or less.
  • the compression set is more than 10%, when the obtained conductive connector 100 is repeatedly used in a high temperature environment, it is disturbed in the chain of the conductive particles 120a in the conductive portion 120, so that it is necessary. Maintaining conductivity becomes difficult.
  • the conductive particles 120a constituting the conductive portion 120 it is preferable to use those in which a highly conductive metal is coated on the surface of core particles (hereinafter, referred to as "magnetic core particles") that exhibit magnetic properties.
  • the magnetic core particles preferably have an average particle diameter of 3 ⁇ m to 40 ⁇ m.
  • the average particle diameter of a magnetic core particle says what was measured by the laser diffraction scattering method.
  • the saturation magnetization is preferably 0.1 m 3 / m 2 or more, more preferably 0.3 m 3 / m 2 or more, and 0.5 m 3 It is most preferable that it is / m ⁇ 2> or more.
  • the said highly conductive metal means that the electrical conductivity in 0 degreeC is 5 * 10 ⁇ 6> / ohm or more.
  • Highly conductive metals coated on the surface of the magnetic core particles include gold, silver, rhodium, platinum, chromium, and the like, and among them, gold is preferable in terms of chemical stability and high conductivity.
  • the insulating support 110 supports the conductive part 120 and maintains insulation between the conductive parts 120.
  • the insulating support 110 is preferably made of the same material as the elastic material 110a in the conductive part 120, for example, silicone rubber.
  • the present invention is not limited thereto and may be used as long as the material has good elasticity and excellent insulation.
  • the coating layer 130 is coated on the upper surface of the conductive portion 120 in contact with the terminal 22 of the device under test 20.
  • the coating layer 130 may be formed to the same diameter as the diameter of the conductive portion 120, but is not limited thereto, and may be formed to a diameter larger than the diameter of the conductive portion 120.
  • the coating layer 130 is preferably formed to have a thickness of 0.1 ⁇ m ⁇ 10 ⁇ m.
  • the conductive metal for forming the coating layer 130 for example, iron, nickel, chromium, gold, silver, copper, platinum, or an alloy thereof may be used.
  • the coating layer 130 may be made of nanoparticles of the conductive metal, the average particle diameter of the conductive metal nanoparticles is preferably 10nm ⁇ 100nm.
  • the conductive connector 100 having the configuration as described above is mounted on the inspection apparatus 30, and thus, the bottom of the conductive portion 120 of the conductive connector 100 and the inspection apparatus 30.
  • the pad 32 is in contact.
  • the terminal 22 of the device under test 20 contacts the coating layer 130 formed on the upper surface of the conductive part 120, and the coating layer 130 and the conductive part ( 120) press down.
  • the conductive particles 120a in the conductive portion 120 are in contact with each other to be electrically conductive, and in this process, the conductive portion 120 is elastically compressed and deformed while the terminal 22 of the device under test 20. ) To cushion mechanical shocks that may occur.
  • the pad 32 of the test device 30 is electrically connected.
  • a predetermined test signal is applied to the terminal, and the signal is transmitted to the terminal 22 of the device under test 20 through the conductive portion 120 and the coating layer 130 to perform a predetermined electrical test.
  • the conductive connector 100 has the following effects.
  • the terminal 22 of the device under test 20 is formed on the upper surface of the conductive portion 120. Since the contact with the conductive metal coating layer 130, the electrical contact area is widened. Accordingly, since the electrical contact resistance between the terminal 22 and the conductive portion 120 of the device under test 20 is reduced, thereby making a stable electrical connection, the reliability of the conductive connector 100 and the device under test 20 are reduced. It is effective to improve the quality of the screening ability for good.
  • the coating layer 130 is made of a conductive metal, it is formed harder than the conductive portion 120.
  • the conductive portion 120 of the conductive portion 120 generated by the direct contact with the terminal 22 of the device under test 20 Since wear and damage can be prevented, and contamination or damage of the conductive portion 120 due to foreign matter can be prevented, there is an effect of extending the life of the conductive connector 100.
  • FIG. 6 is a view partially showing a conductive connector according to another embodiment of the present invention
  • Figure 7 is a view partially showing a conductive connector according to another embodiment of the present invention.
  • the conductive connector 200 includes a plurality of conductive parts 220, an insulating support part 210, and a conductive metal coating layer 230. .
  • the conductive portion 220 is disposed at a position corresponding to the terminal 22 of the device under test 20 and has a structure in which the conductive particles 220a are arranged in the thickness direction in the elastic material 210a.
  • the insulating support portion 210 supports the conductive portion 220 and performs a function of maintaining insulation between the conductive portions 220.
  • Detailed configuration of the conductive portion 220 and the insulating support 210 is the same as the configuration of the conductive connector 100 according to the embodiment shown in Figures 4 and 5, a detailed description thereof will be omitted.
  • the conductive portion 220 is formed to protrude upward from the upper surface of the insulating support portion 210. That is, the conductive portion 220 includes a protrusion 222 protruding a predetermined height above the upper surface of the insulating support portion 210. As described above, when the conductive portion 220 protrudes upward from the upper surface of the insulating support portion 210, there is an advantage in that a reliable contact with the terminal 22 of the device under test 20 is possible.
  • the coating layer 230 is formed on the upper surface of the protrusion 222 of the conductive portion 220.
  • the coating layer 230 may be formed on the side surface of the protrusion 222, and may be formed to a diameter larger than the diameter of the conductive portion 220.
  • the type and thickness of the conductive metal forming the coating layer 230 are the same as the coating layer 130 of the conductive connector 100 according to the exemplary embodiment shown in FIGS. 4 and 5, a detailed description thereof will be omitted. .
  • the conductive connector 300 includes a plurality of conductive parts 320, an insulating support part 310, a conductive metal coating layer 330, and a guide. It comprises a film 340.
  • the conductive part 320 is disposed at a position corresponding to the terminal 22 of the device under test 20 and has a structure in which the conductive particles 320a are arranged in the thickness direction in the elastic material 310a.
  • the insulating support part 310 performs the function of maintaining the insulating property between the conductive parts 320 while supporting the conductive part 320.
  • the conductive metal coating layer 330 is formed on an upper surface of the protrusion 322 of the conductive portion 320.
  • the coating layer 330 may be formed on the side surface of the protrusion 322, and may be formed to a diameter larger than the diameter of the conductive portion 320.
  • Specific configuration of the conductive portion 320, the insulating support 310 and the conductive metal coating layer 330 is the same as the configuration of the conductive connector 200 according to another embodiment shown in Figure 6, the detailed description thereof will be omitted Let's do it.
  • the terminal 22 of the device under test 20 descends from the center of the conductive portion 320 on the upper surface of the insulating support portion 310, the terminal 22 is lowered.
  • Guide film 340 to guide the toward the center of the conductive portion 320 is attached.
  • the guide film 340 is formed to surround the side surface of the protrusion 322 at a predetermined distance from the side surface of the protrusion 322 of the conductive portion 320. That is, the guide film 340 is provided with a plurality of through holes 342 into which the protrusion 322 of the conductive part 320 is inserted.
  • the diameter of the through hole 342 is formed to be larger than the diameter of the protrusion 322 of the conductive portion 320.
  • the height of the guide film 340 may be the same as the height of the protrusion 322.
  • a synthetic resin material such as polyimide may be used, but is not limited thereto.
  • the conductive connectors 200 and 300 according to other embodiments of the present invention having the configuration as described above also have the same operation and effect as the conductive connector 100 according to the embodiment shown in FIGS. 4 and 5. Therefore, detailed description thereof will be omitted.
  • FIG. 8 to 11 are diagrams for explaining step-by-step the manufacturing method of the conductive connector according to an embodiment of the present invention shown in FIG.
  • the upper mold 420 is disposed on the upper portion of the lower mold 410 via the spacer 430.
  • a molding space surrounded by the spacer 430 is formed between the lower mold 410 and the upper mold 420.
  • a magnetic layer 412 is formed at each position, and a nonmagnetic layer 411 is formed at a portion other than the magnetic layer 412.
  • a magnetic layer 422 is formed at a position corresponding to the conductive portion 120 of the conductive connector 100 on the bottom of the upper magnetic substrate 424, and the magnetic layer 422.
  • the nonmagnetic layer 421 is formed at portions other than the?
  • the molding material 100a is injected into the molding space inside the prepared mold 400.
  • the molding material 100a may be manufactured by containing a plurality of conductive particles 120a in a liquid elastic material 110a, for example, a liquid silicone rubber.
  • the elastic material 110a and the conductive particles 120a have been described in detail above.
  • an electromagnet (not shown) disposed on the bottom surface side of the lower mold 310 and the upper surface side of the upper mold 320 is operated to be injected into the molding space inside the mold 400.
  • the magnetic field is applied to the formed molding material 100a in the vertical direction.
  • the conductive particles 120a dispersed in the liquid elastic material 110a are arranged in a vertical direction by flocking between the magnetic layer 322 of the upper mold 320 and the magnetic layer 312 of the lower mold 310. do.
  • the molding material 100a is cured in the mold 400 for 1.5 hours at a temperature of, for example, approximately 100 ° C.
  • the conductive particles 120a are arranged in the vertical direction in the cured elastic material 110a, and the plurality of conductive parts 120 are formed of the cured elastic material 110a around the plurality of conductive parts 120. Insulated support 110 is formed.
  • the mask film 150 is attached to the upper surface of the insulating support 110.
  • a plurality of holes 152 are formed in the mask film 150, through which a plurality of conductive parts 120 are exposed.
  • the plurality of holes 152 may be formed to have a diameter equal to or larger than the diameter of the conductive portion 120.
  • non-metal-based polyimide PI
  • PET polyethylene terephthalate
  • TAC triacetate cellulose
  • EVA ethylene vinyl acetate
  • PP polyflofilene
  • PC polycarbonate
  • the method of forming the holes 152 in the mask film 150 may include various methods such as laser processing, mechanical drill processing, wet processing by etching, exposure and development using photoresist and photomask, and the like. This can be used.
  • the conductive metal coating layer 130 is formed on the top surface of the mask film 150 and the top surfaces of the plurality of conductive parts 120 exposed by the holes 152.
  • the conductive metal paste is applied to the upper surface of the mask film 150 and the upper surface of the plurality of conductive parts 120 by a printing method with a predetermined thickness, and then the applied conductive metal paste is heated and dried to form a conductive metal.
  • the conductive metal coating layer 130 may be formed while the paste is hardened.
  • the conductive metal for example, iron, nickel, chromium, gold, silver, copper, platinum, or an alloy thereof may be used.
  • the average particle diameter of the conductive metal nanoparticles is preferably 10nm ⁇ 100nm.
  • the mask film 150 is removed. Specifically, when the mask film 150 is peeled off from the top surface of the insulating support 110, the coating layer 130 formed on the top surface of the mask film 150 is also removed, and the plurality of conductive parts 120 The conductive metal coating layer 130 coated on the upper surface remains.
  • the conductive metal coating layer 130 formed as described above has a diameter equal to the diameter of the conductive portion 120 or a diameter larger than the diameter of the conductive portion 120 according to the diameters of the holes 152 formed in the mask film 150. Have.
  • FIG. 12 and 13 are views for explaining a method of manufacturing a conductive connector according to another embodiment of the present invention shown in FIG.
  • the manufacturing method of the conductive connector 200 according to another embodiment of the present invention is similar to the manufacturing method of the conductive connector 100 according to the embodiment of the present invention described above, the following description will focus on the differences between them. Shall be.
  • the plurality of conductive parts 220 and the insulating support part 210 are formed in the same manner as shown in FIGS. 8 and 9.
  • the conductive portion 220 protrudes upward from the upper surface of the insulating support portion 210 so that the protrusion 222 is formed.
  • the protrusion 222 of the conductive portion 220 concave the magnetic layer 422 of the upper mold 420 shown in FIGS. 8 and 9 toward the upper magnetic substrate 424 as compared to the nonmagnetic layer 421.
  • the mask film 250 is attached to the upper surface of the insulating support portion 210.
  • a plurality of holes 252 are formed in the mask film 250, through which the protrusions 222 of the plurality of conductive parts 220 are exposed.
  • the plurality of holes 252 may be formed to have a diameter equal to or larger than a diameter of the protrusion 222 of the conductive part 220. Since the material of the mask film 250 and the method of forming the holes 252 are the same as described in the above-described embodiment, a description thereof will be omitted.
  • the conductive metal coating layer 230 is disposed on the upper surface of the mask film 250 and the upper surfaces of the protrusions 222 of the plurality of conductive parts 220 exposed by the holes 252. To form. In this case, the coating layer 230 may be formed on the side surface of the protrusion part 222 of the conductive part 220.
  • the method of forming the conductive metal coating layer 230 is the same as described in the above-described embodiment.
  • the coating layer 230 formed on the upper surface of the mask film 250 is removed. Accordingly, the conductive metal coating layer 230 coated on the top and side surfaces of the protrusions 222 of the plurality of conductive parts 220 remains.
  • FIG. 14 and 15 are views for explaining a method of manufacturing a conductive connector according to another embodiment of the present invention shown in FIG.
  • the manufacturing method of the conductive connector 300 according to another embodiment of the present invention is similar to the manufacturing method of the conductive connector 200 according to another embodiment of the present invention described above, the following description will focus on the differences between them. Let's do it.
  • a plurality of conductive portions 320 and insulating support portions 310 including protrusions 322 are formed in the same manner as described above.
  • a guide film 340 having a plurality of through holes 342 into which the protrusion 322 of the conductive part 320 is inserted is attached to an upper surface of the insulating support part 310.
  • the height of the guide film 340 may be the same as the height of the protrusion 322, the plurality of through holes 342 is formed to have a diameter larger than the diameter of the protrusion 322 of the conductive portion 320. Can be.
  • the mask film 350 is attached to the upper surface of the guide film 340.
  • a plurality of holes 352 are formed in the mask film 350, through which the protrusions 322 of the plurality of conductive parts 320 are exposed.
  • the plurality of holes 352 may be formed to have the same diameter as the diameter of the through hole 342 of the guide film 340. Since the material of the mask film 350 and the method of forming the holes 352 are the same as described in the above-described embodiment, a description thereof will be omitted.
  • the conductive metal coating layer 330 is disposed on the upper surface of the mask film 350 and the upper surfaces of the protrusions 322 of the plurality of conductive parts 320 exposed by the holes 352. To form. In this case, the coating layer 330 may be formed on the side surface of the protrusion 322 of the conductive part 320.
  • the method of forming the conductive metal coating layer 330 is the same as described in the above-described embodiment.
  • the coating layer 330 formed on the upper surface of the mask film 350 is removed. Accordingly, the conductive metal coating layer 330 coated on the upper and side surfaces of the protrusions 322 of the plurality of conductive parts 320 remains.
  • the present invention can be used in a conductive connector for a test socket used for inspecting electrical characteristics of a device under test and a method of manufacturing the same.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un connecteur conducteur agencé entre un dispositif à tester et un dispositif de test, destiné à connecter électriquement des bornes du dispositif à tester et des plages de connexion du dispositif de test les unes aux autres, et son procédé de fabrication. Ledit connecteur conducteur comprend : une pluralité de parties conductrices agencées à des emplacements correspondant aux bornes du dispositif à tester et comportant des particules conductrices alignées à l'intérieur d'un matériau élastique ; une partie support isolant permettant de supporter la pluralité de parties conductrices et d'isoler l'espace entre la pluralité de parties conductrices ; et une couche de revêtement métallique conductrice formée sur la surface supérieure de chaque partie parmi la pluralité de parties conductrices.
PCT/KR2014/005777 2013-07-24 2014-06-30 Connecteur conducteur et son procédé de fabrication WO2015012498A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201480041445.2A CN105452877B (zh) 2013-07-24 2014-06-30 导电连接器及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0087499 2013-07-24
KR1020130087499A KR101393601B1 (ko) 2013-07-24 2013-07-24 도전성 커넥터 및 그 제조방법

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WO2015012498A1 true WO2015012498A1 (fr) 2015-01-29

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KR (1) KR101393601B1 (fr)
CN (1) CN105452877B (fr)
TW (1) TWI516769B (fr)
WO (1) WO2015012498A1 (fr)

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TWI728906B (zh) * 2019-08-29 2021-05-21 南韓商Ｉｓｃ股份有限公司 測試座
CN113015914A (zh) * 2018-11-13 2021-06-22 株式会社Isc 用于电连接的连接器

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KR102103747B1 (ko) * 2018-10-25 2020-04-23 주식회사 오킨스전자 메탈-ｃｎｔ 복합체 및/또는 폴리머-ｃｎｔ 복합체를 포함하는 테스트 소켓
KR102193528B1 (ko) * 2019-04-17 2020-12-23 주식회사 아이에스시 극저온에서 적용 가능한 검사용 커넥터
JP7308660B2 (ja) * 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes
KR102606892B1 (ko) 2021-06-15 2023-11-29 (주)포인트엔지니어링 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓
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CN105452877A (zh) 2016-03-30
TW201512664A (zh) 2015-04-01
TWI516769B (zh) 2016-01-11
KR101393601B1 (ko) 2014-05-13
CN105452877B (zh) 2019-04-09

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