WO2018208117A1 - Douille d'inspection - Google Patents

Douille d'inspection Download PDF

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Publication number
WO2018208117A1
WO2018208117A1 PCT/KR2018/005427 KR2018005427W WO2018208117A1 WO 2018208117 A1 WO2018208117 A1 WO 2018208117A1 KR 2018005427 W KR2018005427 W KR 2018005427W WO 2018208117 A1 WO2018208117 A1 WO 2018208117A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
guide sheet
inspection
conductive portion
elastic
Prior art date
Application number
PCT/KR2018/005427
Other languages
English (en)
Korean (ko)
Inventor
정영배
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Publication of WO2018208117A1 publication Critical patent/WO2018208117A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to an inspection socket, and more particularly to an inspection socket capable of achieving the reliability of inspection without damaging the terminals of the device under test.
  • test socket is used as a device for connecting the device under test to the test apparatus.
  • the role of the test socket is to connect the terminals of the device under test and the pad of the test apparatus with each other so that electrical signals can be exchanged in both directions.
  • an elastic conductive sheet or pogo pin is used as a contact means used in the inspection socket.
  • the elastic conductive sheet is to connect the conductive portion having elasticity with the terminal of the device under test, and the pogo pin has a spring provided therein to facilitate the connection between the device under test and the inspection device, It is used for most inspection sockets because it can cushion shocks.
  • Korean Patent Laid-Open No. 2010-157472 is known.
  • the prior art will be described with reference to FIGS. 1 and 2 as follows.
  • the electrode 2a provided at the position corresponding to the solder ball 110 of the semiconductor device 100 is connected to the connector 1 with a guide to the inspection device 2 provided at the upper surface 2b, and the BGA type semiconductor device. Examine (100).
  • the guide 1 with the guide pin 2c is fixed by inserting the guide pin 2c into the guide pin insertion hole 22 formed in the guide 1 with guide.
  • the semiconductor device guide frame 4 is fixed by the guide pin 2c by inserting the guide pin 2c into the guide pin insertion hole 4a formed in the semiconductor device guide frame 4.
  • the transfer arm 200 provided with the vacuum suction means 210 in the state which fixed the height adjusting member 3, the guide
  • the semiconductor device 100 is transferred onto the connector 1 with the guide.
  • the solder ball 110 of the BGA type semiconductor device 100 is disposed so as to substantially face the conductive portion of the connector 1 with the guide.
  • the BGA semiconductor device 100 is brought into contact with the guide connector 1. If the solder ball 110 is not positioned directly above the conductive portion of the connector 10, the solder ball 110 is in contact with the inner surface 21a of the solder ball guide through-hole 21 of the solder ball guide 20. And slide downward along the inner surface 21a of the solder ball guide through-hole 21. Therefore, since the solder ball 110 moves toward the center of the solder ball guide through-hole 21, the solder ball 110 is guided to the protrusion 11b of the conductive portion inserted into the solder ball guide through-hole 21.
  • the guide provided in the connector is typically configured in the form of a film made of a hard material such as polyimide.
  • a hard material such as polyimide.
  • the alignment of the solder balls 110 can be easily performed.
  • the solder ball 110 has a disadvantage that the surface damage is inevitable because it is stamped on the corner.
  • the inner surface and the conductive portion of the through hole 21 are in contact with each other.
  • the conductive portion is the solder ball 110.
  • the conductive portion is not sufficiently pressed, which is a factor that reduces the overall conductivity.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide an inspection socket for easily aligning a device under test, preventing damage to a terminal, and allowing a conductive portion to be sufficiently pressed.
  • the inspection socket for achieving the above object is provided between the device under test and the inspection device in the inspection socket for electrically connecting the terminal of the device under test and the pad of the inspection device,
  • a first conductive portion disposed at a position corresponding to the terminal of the device under test, wherein a plurality of first conductive particles are arranged in an insulating elastic material in a thickness direction;
  • An insulating support part disposed around the first conductive part to insulate each of the first conductive parts from each other while supporting the first conductive part;
  • An anisotropic conductive sheet protruding upward from the first conductive portion and including a second conductive portion positioned higher than an upper surface of the insulating support portion;
  • a guide sheet disposed above the insulating support part, spaced apart from the insulating support part, and having a through hole at each position corresponding to the second conductive part;
  • It includes a plurality of elastic bumps spaced apart from the second conductive portion in the horizontal direction,
  • each elastic bump is in contact with the upper surface of the insulating support and the upper surface is in contact with the lower surface of the guide sheet to support the guide sheet,
  • the elastic bump is made of a softer material than the guide sheet.
  • the elastic bumps may be integrally attached to the insulating support and the guide sheet.
  • the elastic bumps may be formed in a columnar shape.
  • the second conductive part is a second conductive particles are distributed in the thickness direction in the insulating elastic material, the average particle diameter of the second conductive particles may be smaller than the average particle diameter of the first conductive particles.
  • the second conductive part is a second conductive particle is distributed in the thickness direction in the insulating elastic material, the second conductive particles may be disposed at a higher density than the first conductive particles.
  • the second conductive part is a second conductive particles are distributed in the thickness direction in the insulating elastic material, the average particle diameter of the second conductive particles may be equal to the average particle diameter of the first conductive particles.
  • the guide sheet may be made of a polyimide material, and the elastic bumps may be made of a silicone rubber material.
  • the horizontal cross-sectional area of the guide sheet may be larger than the horizontal cross-sectional area of the elastic bump.
  • a peripheral portion of the through hole in the guide sheet may protrude toward the second conductive portion from the elastic bump.
  • a separation space may be provided between the elastic bump and the second conductive portion such that the deformed second conductive portion does not come into contact with the elastic bump even when the second conductive portion is compressed by the pressure of the device under test.
  • An inspection socket provided between a device under test and an inspection device for electrically connecting a terminal of the device under test and a pad of the inspection device with each other,
  • a conductive portion disposed at each position corresponding to the terminal of the device under test, wherein a plurality of conductive particles are arranged in an insulating elastic material in a thickness direction;
  • An anisotropic conductive sheet disposed around the conductive portion and including an insulating support portion that insulates each conductive portion from each other while supporting the conductive portion;
  • a guide sheet disposed above the anisotropic conductive sheet and provided with a through hole for each position corresponding to the conductive portion;
  • Is disposed between the guide sheet and the anisotropic conductive sheet is connected to the guide sheet and the anisotropic conductive sheet, including an elastic bump made of a softer material than the guide sheet,
  • the upper end of the conductive portion protrudes upward from the upper surface of the insulating support
  • the elastic bump is provided with a space between the conductive portion.
  • the horizontal cross-sectional area of the guide sheet may be larger than the horizontal cross-sectional area of the elastic bump.
  • a peripheral portion of the through hole in the guide sheet may protrude toward the second conductive portion from the elastic bump.
  • the upper end of the conductive portion may be located at the same height as the upper surface of the guide sheet.
  • the upper end of the conductive portion may be located lower than the upper surface of the guide sheet.
  • the inspection socket of the present invention can minimize damage of the terminal of the device under test by the guide sheet by providing an elastic bump softer than the guide sheet under the guide sheet.
  • the inspection socket of the present invention can improve the reliability of the inspection by suppressing the expansion of the conductive portion in the inspection process by providing a space between the conductive portion and the elastic bump supporting the guide sheet.
  • 1 is a view of the inspection socket according to the prior art.
  • FIG. 2 is a diagram illustrating a test performed using the test socket of FIG. 1.
  • FIG. 2 is a diagram illustrating a test performed using the test socket of FIG. 1.
  • FIG. 3 is a view showing the operation of the inspection socket of FIG.
  • Figure 4 is an exploded perspective view of the test socket according to an embodiment of the present invention.
  • FIG. 5 is a perspective view of the combination of FIG.
  • FIG. 6 is a VI-VI cross-sectional view of FIG. 5
  • FIG. 7 is a V-VIII cross-sectional view of FIG. 5.
  • FIG. 8 and 9 are views showing the operation of the inspection socket of FIG.
  • 10 to 11 is a view showing a test socket according to another embodiment of the present invention.
  • test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
  • the inspection socket 100 is disposed between the device under test 140 and the inspection device 150, and thus the terminal 141 and the inspection device 150 of the device under inspection 140.
  • To electrically connect the pads 151 to each other to perform the electrical inspection of the device under test 140 and includes an anisotropic conductive sheet 110, a guide sheet 120, and an elastic bump 130. .
  • the anisotropic conductive sheet 110 includes a first conductive part 111, an insulating support part 112, and a second conductive part 113.
  • the first conductive part 111 is disposed at each position corresponding to the terminal 141 of the device under test 140, and a plurality of first conductive particles 111 a are arranged in the thickness direction in the insulating elastic material. will be.
  • the insulating elastic material forming the first conductive portion 111 a heat resistant polymer material having a crosslinked structure is preferable.
  • a heat resistant polymer material having a crosslinked structure is preferable.
  • the liquid silicone rubber may be an additive type or a condensation type, but an additional type liquid silicone rubber is preferable in view of easy formability and elastic deformation.
  • the conductive portion is formed of a cured product of liquid silicone rubber (hereinafter referred to as "silicone rubber cured product")
  • the silicone cured product preferably has a compression set of 10% or less at 150 ° C. More preferably, it is 8% or less, More preferably, it is 6% or less. When this compressive permanent distortion exceeds 10%, when the obtained elastic conductive sheet is repeatedly used in a high temperature environment, a disturbance occurs in the chain of the electroconductive particle in the conductive part for connection, and the required conductivity is maintained. It becomes difficult to do it.
  • the first conductive particles 111a it is preferable that a highly conductive metal is coated on the surface of the core particles (hereinafter, referred to as magnetic).
  • the term "highly conductive metal” means a conductivity at 0 ° C.
  • the magnetic core particles for obtaining the conductive particles P preferably have a number average particle diameter of 3 to 40 ⁇ m, wherein the number average particle diameter of the magnetic core particles is a laser.
  • iron, nickel, cobalt, a coating of these metals on copper, a resin, or the like can be used, but the saturation magnetization is 0.1 dl / m 2 or more.
  • Gold, silver, rhodium, platinum, chromium and the like can be used as the highly conductive metal to be coated on the surface of the magnetic core particles, and among these, gold is preferably used because it is chemically stable and has high electrical conductivity.
  • the insulating support 112 performs a function of maintaining insulation between the conductive parts while supporting the conductive part.
  • the insulating support part 112 may be made of the same material as the insulating elastic material in the conductive part, but is not limited thereto. Any material having excellent elasticity and excellent insulating property may be used.
  • the second conductive portion 113 protrudes upward from the conductive portion and is positioned higher than the upper surface of the insulating support portion 112.
  • the second conductive part 113 is provided to be spaced apart from the guide sheet 120 and the elastic bumps 130, respectively, and a predetermined separation space S is provided therebetween.
  • the second conductive particles 113a are distributed in the thickness direction in the insulating elastic material.
  • the average particle diameter of the second conductive particles 113a in the second conductive portion 113 is preferably smaller than the average particle diameter of the first conductive particles 111a in the conductive portion.
  • the second conductive particles 113a may be disposed at a higher density than the first conductive particles 111a.
  • the insulating elastic material constituting the second conductive part 113 may have the same elastic force as the insulating elastic material constituting the conductive part, but is not limited thereto and may be rigid.
  • the guide sheet 120 is disposed above the insulating support part 112, is spaced apart from the insulating support part 112, and has a through hole 121 provided at a position corresponding to the second conductive part 113.
  • the through hole 121 of the guide sheet 120 is formed larger than the outer diameter of the second conductive portion 113, so that the position of the terminal 141 of the device under test 140 is slightly displaced, so that the through hole 121 is formed.
  • the terminal 141 of the device under test 140 in contact with the periphery may move to the second conductive part 113 inside the through hole 121.
  • resin materials such as a liquid crystal polymer, a polyimide resin, a polyester resin, a poly aramid resin, a polyamide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, etc.
  • Fiber-reinforced resin materials such as glass fiber-reinforced polyimide resins, composite resin materials containing inorganic materials such as alumina and boron nitride as fillers, and the like can be used.
  • polyimide resins having excellent dimensional stability and good heat resistance are preferred.
  • the elastic bumps 130 are positioned between the guide sheet 120 and the anisotropic conductive sheet 110 in the vertical direction, and are disposed between the second conductive portions 113 in the horizontal direction.
  • the elastic bumps 130 are formed in a cylindrical shape as a whole and are provided in plural.
  • the upper surface of the elastic bump 130 is integrally attached to the guide sheet 120, and the lower surface is integrally attached to the upper surface of the insulating support 112.
  • the elastic bump 130 is made of a softer material than the guide sheet 120, and more specifically, a material having excellent elastic force such as silicone rubber may be used.
  • the elastic bumps 130 support the guide sheet 120 under the guide sheet 120 and absorb the pressing force applied to the guide sheet 120 so that the guide sheet 120 can be easily deformed.
  • a predetermined separation space S is provided between the elastic bumps 130 and the second conductive portion 113. Accordingly, the terminal 141 of the device under test 140 is connected to the second conductive portion 113.
  • the second conductive portion 113 can be easily expanded into the spaced space S without suppressing the expansion of the second conductive portion 113 in the left and right directions, thereby providing excellent pressure dispersion effect. That is, even when the second conductive portion 113 is compressed and expanded in the surface direction by the pressing of the device under test 140 by the space S, the expanded conductive portion does not contact the elastic bumps 130.
  • the elastic bump 130 has a horizontal cross-sectional area of the guide sheet 120 greater than the horizontal cross-sectional area of the elastic bump 130, and the periphery of the through hole 121 in the guide sheet 120 is the elastic cross section.
  • the bump 130 may protrude toward the second conductive portion 113. Accordingly, when the terminal 141 of the device under test 140 contacts the guide sheet 120, the guide sheet 120 is easily deformed, thereby minimizing damage to the terminal 141 of the device under test 140. Will be.
  • Inspection socket 100 according to an embodiment of the present invention has the following effects.
  • the device under inspection 140 even if the terminal 141 of the device under inspection 140 is disposed at a position slightly displaced without being located above the second conductive portion 113, the device under inspection 140.
  • the terminal 141 of the guide sheet 120 is configured to be movable toward the center of the through hole 121 by contacting the periphery of the through hole 121.
  • the guide sheet 120 is supported to be elastic by bumps under the guide sheet 120.
  • the impact exerted by the terminal 141 of the device 140 can be mitigated.
  • the through-hole 121 of the guide sheet 120 is projected more toward the conductive portion than the elastic bump 130, so that the deformation of the guide sheet 120 becomes easier, thereby maximizing the impact mitigation effect.
  • the second conductive portion ( 113 is expanded in the surface direction, the separation space (S) is provided between the elastic bump 130 and the second conductive portion 113, as shown in Figure 9 the surface direction of the second conductive portion 113
  • the second conductive portion 113 can be sufficiently compressed.
  • the second conductive particles 113a provided therein can be surely contacted with each other, thereby minimizing electrical resistance.
  • a predetermined inspection signal is applied from the inspection apparatus 150, and the signal is applied to the first conductive portion 111 and the second conductive portion ( The predetermined electrical test is performed by being transmitted to the terminal 141 of the device under test 140 through 113.
  • the inspection socket according to the present invention may be modified as shown in FIGS. 10 and 11.
  • the sizes and densities of the conductive particles of the first conductive part and the second conductive part are different from each other.
  • the present invention is not limited thereto, and as shown in FIG.
  • the sizes and densities of the conductive particles 211a and 213a constituting the first conductive portion 211 and the second conductive portion 213 may be equal to each other.
  • the above-described embodiment illustrates that the upper surface of the second conductive portion has the same height as the upper surface of the guide sheet, but is not limited thereto, and the second conductive portion 313 may be used in the inspection socket 300 illustrated in FIG. 11. ) Is located slightly lower than the upper surface of the guide sheet 320, it is possible to further improve the guide function.
  • the above-described embodiment illustrates that the periphery of the through hole in the guide sheet protrudes toward the second conductive portion rather than the elastic bump, but is not limited thereto. It is also possible to be positioned equally in the horizontal direction with the elastic bump below it.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une douille d'inspection, et plus particulièrement, une douille d'inspection qui comprend : une feuille conductrice anisotrope qui comprend une première partie conductrice, une partie de support isolante disposée autour de la première partie conductrice, et une seconde partie conductrice qui fait saillie vers le haut à partir de la première partie conductrice et est disposée plus haute que la surface supérieure de la partie de support isolante ; une feuille de guidage disposée au-dessus de la partie de support isolante tout en étant espacée de la partie de support isolante, et pourvue d'un trou traversant à chaque position qui correspond à la seconde partie conductrice ; et une pluralité de bosses élastiques espacées de la seconde partie conductrice dans une direction horizontale, la surface inférieure de chacune des bosses élastiques entrant en contact avec la surface supérieure de la partie de support isolante, et la surface supérieure de chacune des bosses élastiques entrant en contact avec la surface inférieure de la feuille de guidage pour supporter la feuille de guidage, et la bosse élastique étant constituée d'un matériau plus mou que celui de la feuille de guidage.
PCT/KR2018/005427 2017-05-11 2018-05-11 Douille d'inspection WO2018208117A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170058902A KR101920855B1 (ko) 2017-05-11 2017-05-11 검사용 소켓
KR10-2017-0058902 2017-05-11

Publications (1)

Publication Number Publication Date
WO2018208117A1 true WO2018208117A1 (fr) 2018-11-15

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ID=64104710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/005427 WO2018208117A1 (fr) 2017-05-11 2018-05-11 Douille d'inspection

Country Status (3)

Country Link
KR (1) KR101920855B1 (fr)
TW (1) TWI669515B (fr)
WO (1) WO2018208117A1 (fr)

Cited By (2)

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CN114076836A (zh) * 2020-08-21 2022-02-22 Ｔｓｅ有限公司 测试插座及包括其的测试设备
CN114076836B (zh) * 2020-08-21 2024-06-04 Ｔｓｅ有限公司 测试插座及包括其的测试设备

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KR102133340B1 (ko) * 2019-01-09 2020-07-14 주식회사 이노글로벌 테스트 소켓
KR102179457B1 (ko) * 2020-03-25 2020-11-16 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법

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JP2000241498A (ja) * 1999-02-18 2000-09-08 Jsr Corp 半導体素子接続装置、半導体素子検査装置および検査方法
US6426553B2 (en) * 2000-04-25 2002-07-30 Kabushiki Kaishia Toshiba Test socket of semiconductor device
WO2007043350A1 (fr) * 2005-10-11 2007-04-19 Jsr Corporation Connecteur conducteur anisotrope et équipement d’inspection de dispositif de circuit
KR101353481B1 (ko) * 2013-02-28 2014-01-20 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓

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CN114076836A (zh) * 2020-08-21 2022-02-22 Ｔｓｅ有限公司 测试插座及包括其的测试设备
CN114076836B (zh) * 2020-08-21 2024-06-04 Ｔｓｅ有限公司 测试插座及包括其的测试设备

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