WO2009145416A1 - Support pour tester une puce semi-conductrice - Google Patents

Support pour tester une puce semi-conductrice Download PDF

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Publication number
WO2009145416A1
WO2009145416A1 PCT/KR2009/001249 KR2009001249W WO2009145416A1 WO 2009145416 A1 WO2009145416 A1 WO 2009145416A1 KR 2009001249 W KR2009001249 W KR 2009001249W WO 2009145416 A1 WO2009145416 A1 WO 2009145416A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
socket
cap
hole
conductive silicon
Prior art date
Application number
PCT/KR2009/001249
Other languages
English (en)
Korean (ko)
Inventor
이채윤
Original Assignee
리노공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리노공업(주) filed Critical 리노공업(주)
Priority to JP2011501714A priority Critical patent/JP5119360B2/ja
Publication of WO2009145416A1 publication Critical patent/WO2009145416A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Definitions

  • the semiconductor chip inspection socket according to the present invention is more specifically a semiconductor chip inspection socket characterized in that the plunger is coupled to the conductive silicon portion, and the plunger is fixed using a cap.
  • test probe In order to check whether the semiconductor chip is normally operated, a test probe (probe) is mounted on the test socket and contacted with the semiconductor chip to apply a test current to the test circuit board.
  • connection terminal solder ball
  • metal balls pasted or the like vertically on the body of silicon material to form a conductive silicon portion, and through this, It is applied to the test circuit board to determine whether the semiconductor chip is operating normally.
  • FIG. 1 is a conceptual cross-sectional view showing a socket for inspecting a semiconductor chip using a conventional silicone rubber.
  • the conductive silicon portion 22 having the metal balls 22 disposed vertically is formed in the silicon portion 10, and insulating tapes 40 and 50 are formed on upper and lower portions of the silicon portion 10. Combined.
  • the support plate 60 which serves as a support frame, is generally coupled to the lower portion of the silicon part 10.
  • the solder ball 2 of the semiconductor chip 1, which is an inspection target, and the contact portion 72 of the inspection circuit board 70 are electrically connected to determine whether the semiconductor chip is normally operated through the inspection circuit board. do.
  • such a conventional inspection socket has a limited service life due to a phenomenon in which the upper surface of the conductive silicon portion is damaged in a repetitive inspection process, and improved such a point, Republic of Korea Utility Model Publication No. 278989, Application No. 10- 2004-0105638 and the like have been proposed to contact the solder ball of the semiconductor using a metal plate.
  • FIG. 2 is a conceptual cross-sectional view showing another conventional semiconductor chip inspection socket using a conductive silicon portion.
  • the plunger in the form of a metal ring 30a is coupled to the upper portion of the conductive silicon portion 20 to solve the problem that the conductive silicon portion is broken during the contact process of the semiconductor chip.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a socket for a semiconductor chip inspection with an extended life.
  • Still another object of the present invention is to provide a socket for inspecting a semiconductor chip employing a structure that is easy to manufacture.
  • the plunger is characterized by consisting of a cylindrical body, a probe protrusion formed on the cylindrical body and a locking projection protruding on the outer circumferential surface of the cylindrical body.
  • the lower protrusion 38 of the semi-conical shape protrudes from the lower portion of the cylindrical body 32, it is characterized in that it is seated in the depression 24 recessed in the semi-conical shape on the upper surface of the conductive silicon portion, the lower protrusion A cylinder 39 protruding downward is formed at the center of the 38, and is inserted into the receiving groove 26 recessed in the center of the depression 24.
  • the probe protrusion is inserted into the inside of the through hole formed in the cap, the locking jaw is characterized in that coupled to the seating portion expanded to the lower portion of the through hole.
  • the cap is characterized in that the lower surface is fixed through the silicone adhesive and the upper surface of the silicon portion, it is made of engineering plastics material.
  • the through hole is characterized in that the inclined portion is formed at an angle to the upper end.
  • the semiconductor chip inspection socket according to the present invention has the advantage that the life of the inspection socket can be improved by preventing abrasion of the conductive silicon portion by combining a plunger having a probe protrusion contacting the solder ball of the semiconductor chip on the conductive silicon portion. .
  • the present invention has the advantage that it is easy to manufacture the inspection socket by adopting a simple structure that combines the cap formed in the lower portion of the receiving portion using a silicone portion and an adhesive.
  • FIG. 2 is a conceptual cross-sectional view showing another conventional semiconductor chip inspection socket using a conductive silicon portion.
  • FIG. 3 is a plan view illustrating a socket for inspecting a semiconductor chip according to an exemplary embodiment of the present invention.
  • FIG. 4 is a cross-sectional view taken along line AA ′ of FIG. 3.
  • FIG. 5 is an enlarged view of a portion B of FIG. 4.
  • FIG. 6 is an exploded perspective view showing a coupling relationship of a socket for a semiconductor chip test according to an exemplary embodiment of the present invention.
  • Figure 7 is an exploded cross-sectional view showing a semiconductor chip inspection socket according to another preferred embodiment of the present invention.
  • FIG. 8 is an exploded perspective view showing a socket for inspecting a semiconductor chip according to another preferred embodiment of the present invention.
  • the probe protrusion 34 is inserted into the through hole 82 formed in the cap 80, and the locking jaw 36 is coupled to the seating part 88 secured to the lower portion of the through hole 82. .
  • the cap 80 has a lower surface fixed through the upper surface of the silicon portion 10 and the silicone adhesive 3, and is made of an engineering plastics material, specifically, a polyetherimide resin It is preferable to use the extrusion-molded ULTEM.
  • FIG. 6 is an exploded perspective view illustrating a coupling relationship of a socket for a semiconductor chip test according to an exemplary embodiment of the present invention.
  • the lower insulating tape 50 is coupled to the lower surface of the support plate 60, and the lower insulating tape 50 contacts the contact portion (electrode pad) of the circuit board for inspection to the lower surface of the conductive silicon portion 20.
  • the through hole 52 is formed so that it can be.
  • a cylinder 39 protruding downward is formed at the center of the lower protrusion 38 to be inserted into the receiving groove 26 recessed in the center of the depression 24 to position the plunger at a more accurate position. It may be configured to allow.
  • FIG. 8 is an exploded perspective view illustrating a socket for inspecting a semiconductor chip according to another exemplary embodiment of the present invention.
  • the present invention is applicable to a socket for semiconductor chip inspection, wherein the plunger is coupled to a conductive silicon portion and the plunger is fixed by a cap.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un support servant à tester une puce semi-conductrice. L'invention vise à améliorer la longévité et la facilité de fabrication d'un tel support. A cet effet, le support selon l'invention comprend une plaque support plane au centre de laquelle est réalisé un trou traversant, une partie en silicium qui est couplée au trou traversant et présente des protubérances, une pluralité d'éléments en silicium conducteurs qui sont réalisés par agencement vertical de billes métalliques sur les protubérances, une pluralité de plongeurs qui sont réalisés sur la partie supérieure des éléments en silicium conducteurs et qui sont mis en contact avec des globules de soudure de la puce semi-conductrice, ainsi qu'un élément de recouvrement présentant des trous traversants au niveau des positions correspondant aux plongeurs. Un accepteur réalisé sur la partie inférieure de l'élément de recouvrement reçoit les protubérances et l'élément de recouvrement couple les plongeurs à la partie en silicium. Comme les plongeurs présentant des sondes en saillie mises en contact avec les globules de soudure de la puce semi-conductrice sont couplés à la partie supérieure des éléments en silicium conducteurs, l'abrasion des éléments en silicium conducteurs peut être évitée. La longévité de la prise est également améliorée. En outre, ce support est aisé à fabriquer grâce à une structure simple qui permet à l'accepteur de relier la partie en silicium et l'élément de recouvrement à l'aide d'adhésifs.
PCT/KR2009/001249 2008-03-31 2009-03-12 Support pour tester une puce semi-conductrice WO2009145416A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011501714A JP5119360B2 (ja) 2008-03-31 2009-03-12 半導体チップ検査用ソケット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20080029730 2008-03-31
KR10-2008-0029730 2008-03-31
KR1020090017393A KR100929645B1 (ko) 2008-03-31 2009-03-02 반도체 칩 검사용 소켓
KR10-2009-0017393 2009-03-02

Publications (1)

Publication Number Publication Date
WO2009145416A1 true WO2009145416A1 (fr) 2009-12-03

Family

ID=41377265

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/001249 WO2009145416A1 (fr) 2008-03-31 2009-03-12 Support pour tester une puce semi-conductrice

Country Status (4)

Country Link
JP (1) JP5119360B2 (fr)
KR (1) KR100929645B1 (fr)
TW (1) TWI381165B (fr)
WO (1) WO2009145416A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100994219B1 (ko) 2009-11-04 2010-11-12 리노공업주식회사 반도체 칩 검사용 소켓
KR101138963B1 (ko) * 2010-01-21 2012-04-25 주식회사 아이에스시테크놀러지 테스트 소켓 및 그 테스트 소켓의 제조방법
KR101153167B1 (ko) * 2011-11-30 2012-06-18 (주)기가레인 테스트소켓 용 칩 가이드 유닛
WO2014088131A1 (fr) * 2012-12-05 2014-06-12 에이케이이노텍주식회사 Support servant à tester un semi-conducteur
KR101353481B1 (ko) * 2013-02-28 2014-01-20 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓
KR101483757B1 (ko) * 2013-07-15 2015-01-19 주식회사 아이에스시 전기접속용 커넥터
KR20160046621A (ko) 2014-10-21 2016-04-29 삼성전자주식회사 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
KR101739537B1 (ko) * 2016-05-11 2017-05-25 주식회사 아이에스시 검사용 소켓 및 도전성 입자
KR101739536B1 (ko) * 2016-05-11 2017-05-24 주식회사 아이에스시 검사용 소켓 및 도전성 입자
KR101689249B1 (ko) * 2016-08-19 2016-12-26 전형근 전자 소자 검사용 핀 조립체, 전자 소자 검사용 핀 조립체 제조용 지그 및 전자 소자 검사용 핀 조립체 제조 방법

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20020000829A1 (en) * 1999-02-16 2002-01-03 Micron Technology, Inc. Test insert containing vias for interfacing a device containing contact bumps with a test substrate
KR200368243Y1 (fr) * 2004-08-27 2004-11-18 주식회사 아이에스시테크놀러지 Contacteur en silicium integre et couche renforçant la conduction
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터

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JP2001004664A (ja) 1999-06-25 2001-01-12 Jsr Corp 回路装置の電気的検査装置
JP2001084841A (ja) * 1999-09-14 2001-03-30 Jsr Corp 異方導電性シートおよびその製造方法
JP2001091579A (ja) * 1999-09-24 2001-04-06 Jsr Corp シート状コネクターおよびその製造方法、半導体装置接続装置並びに検査装置
JP4288814B2 (ja) 2000-01-28 2009-07-01 凸版印刷株式会社 半導体検査治具及びその製造方法
JP3427086B2 (ja) 2000-02-23 2003-07-14 Ｎｅｃエレクトロニクス株式会社 Ｉｃソケット
JP2001307851A (ja) * 2000-04-25 2001-11-02 Toshiba Corp 半導体装置のテストソケット
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
JP2003092317A (ja) * 2001-09-19 2003-03-28 Jsr Corp シート状コネクターおよびプローブ装置
JP4213455B2 (ja) * 2002-11-27 2009-01-21 株式会社エンプラス 電気部品用ソケット
JP4507644B2 (ja) * 2003-06-12 2010-07-21 Ｊｓｒ株式会社 異方導電性コネクター装置およびその製造方法並びに回路装置の検査装置
TWI223711B (en) * 2003-08-22 2004-11-11 Advanced Semiconductor Eng Test apparatus for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020000829A1 (en) * 1999-02-16 2002-01-03 Micron Technology, Inc. Test insert containing vias for interfacing a device containing contact bumps with a test substrate
KR200368243Y1 (fr) * 2004-08-27 2004-11-18 주식회사 아이에스시테크놀러지 Contacteur en silicium integre et couche renforçant la conduction
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터

Also Published As

Publication number Publication date
TW200940994A (en) 2009-10-01
JP2011515817A (ja) 2011-05-19
TWI381165B (zh) 2013-01-01
KR100929645B1 (ko) 2009-12-03
JP5119360B2 (ja) 2013-01-16
KR20090104659A (ko) 2009-10-06

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