JP5119360B2 - 半導体チップ検査用ソケット - Google Patents
半導体チップ検査用ソケット Download PDFInfo
- Publication number
- JP5119360B2 JP5119360B2 JP2011501714A JP2011501714A JP5119360B2 JP 5119360 B2 JP5119360 B2 JP 5119360B2 JP 2011501714 A JP2011501714 A JP 2011501714A JP 2011501714 A JP2011501714 A JP 2011501714A JP 5119360 B2 JP5119360 B2 JP 5119360B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- hole
- socket
- silicon
- plunger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Description
本発明の他の目的は製作の容易な構造を採択した半導体チップ検査用ソケットを提供することにある。
前記円筒状本体の下部には円錐形の下部突起が突設され、導電性シリコン部の上面に円錐形に陷沒した陷沒部に装着されることができる。
図4は図3のA−A’線についての断面図、図5は図4のB部の拡大図である。
前記キャップ80は前記プランジャ30を固定させる役目をし、前記プランジャ30に対応する位置に貫通孔82が形成され、下部に収容部86が形成されて前記シリコン部の突出部12を収容する。
図6は本発明の好ましい一実施例による半導体チップ検査用ソケットの結合関係を示す分解斜視図である。
図7は本発明の他の好ましい実施例による半導体チップ検査用ソケットを示す分解断面図である。
2 ソルダボール
3 シリコン接着剤
10 シリコン部
12 突出部
20 導電性シリコン部
22 金属ボール
24 陷沒部
26 収容孔
30 プランジャ
32 本体
34 探針突起
36 係合突条
38 下部突起
39 円柱
40 上部絶縁テープ
50 下部絶縁テープ
52 貫通孔
60 支持プレート
62 結合孔
64 締結孔
70 検査回路基板
72 接触部
80 キャップ
82 貫通孔
84 傾斜部
86 収容部
88 装着部
100 検査ソケット
Claims (6)
- 半導体チップ検査用ソケットにおいて、
中心部に上下に締結孔が貫設された平板状の支持プレート60と;
前記締結孔に結合され、上方に突出部12が突設されたシリコン部10と;
前記突出部12に金属ボールを垂直に配置してなる多数の導電性シリコン部20と;
前記導電性シリコン部20の上部に装着され、半導体チップのソルダボールに接触する多数のプランジャ30と;
前記プランジャ30に対応する位置に貫通孔82が形成され、下部に収容部86が形成されて前記突出部12を収容し、前記シリコン部10に結合されて前記プランジャ30を固定させるキャップ80と;を含み、
前記プランジャ30は、
円筒状本体32と;
前記円筒状本体32の上部に形成された探針突起34と;
前記円筒状本体32の外周面に突設された係合突条36と;を備え、
前記円筒状本体32の下部には円錐形の下部突起38が突設され、前記導電性シリコン部20の上面に円錐形に陷沒した陷沒部24に装着されることを特徴とする、半導体チップ検査用ソケット。 - 前記下部突起38の中心には下方に突出した円柱39が形成され、前記陷沒部24の中心に形成された収容孔26に挿合されることを特徴とする、請求項1に記載の半導体チップ検査用ソケット。
- 前記探針突起34は前記キャップ80に形成された前記貫通孔82の内部に挿入され、前記係合突条36は前記貫通孔82の下部に拡開した装着部88に結合されることを特徴とする、請求項1または2に記載の半導体チップ検査用ソケット。
- 前記キャップ80は、下面が前記シリコン部10の上面とシリコン接着剤3で固定されることを特徴とする、請求項1ないし3のいずれか1項に記載の半導体チップ検査用ソケット。
- 前記キャップ80は、エンジニアリングプラスチック材で製作されることを特徴とする、請求項1ないし4のいずれか1項に記載の半導体チップ検査用ソケット。
- 前記貫通孔82は、上端部に一定角度で傾いた傾斜部84が形成されることを特徴とする、請求項1ないし5のいずれか1項に記載の半導体チップ検査用ソケット。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080029730 | 2008-03-31 | ||
KR10-2008-0029730 | 2008-03-31 | ||
KR10-2009-0017393 | 2009-03-02 | ||
KR1020090017393A KR100929645B1 (ko) | 2008-03-31 | 2009-03-02 | 반도체 칩 검사용 소켓 |
PCT/KR2009/001249 WO2009145416A1 (ko) | 2008-03-31 | 2009-03-12 | 반도체 칩 검사용 소켓 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011515817A JP2011515817A (ja) | 2011-05-19 |
JP5119360B2 true JP5119360B2 (ja) | 2013-01-16 |
Family
ID=41377265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011501714A Active JP5119360B2 (ja) | 2008-03-31 | 2009-03-12 | 半導体チップ検査用ソケット |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5119360B2 (ja) |
KR (1) | KR100929645B1 (ja) |
TW (1) | TWI381165B (ja) |
WO (1) | WO2009145416A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100994219B1 (ko) | 2009-11-04 | 2010-11-12 | 리노공업주식회사 | 반도체 칩 검사용 소켓 |
KR101138963B1 (ko) * | 2010-01-21 | 2012-04-25 | 주식회사 아이에스시테크놀러지 | 테스트 소켓 및 그 테스트 소켓의 제조방법 |
KR101153167B1 (ko) * | 2011-11-30 | 2012-06-18 | (주)기가레인 | 테스트소켓 용 칩 가이드 유닛 |
WO2014088131A1 (ko) * | 2012-12-05 | 2014-06-12 | 에이케이이노텍주식회사 | 반도체 검사용 소켓 |
KR101353481B1 (ko) * | 2013-02-28 | 2014-01-20 | 주식회사 아이에스시 | 고밀도 도전부를 가지는 테스트용 소켓 |
KR101483757B1 (ko) * | 2013-07-15 | 2015-01-19 | 주식회사 아이에스시 | 전기접속용 커넥터 |
KR20160046621A (ko) | 2014-10-21 | 2016-04-29 | 삼성전자주식회사 | 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법 |
KR101586340B1 (ko) * | 2014-12-26 | 2016-01-18 | 주식회사 아이에스시 | 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법 |
KR101739536B1 (ko) * | 2016-05-11 | 2017-05-24 | 주식회사 아이에스시 | 검사용 소켓 및 도전성 입자 |
KR101739537B1 (ko) * | 2016-05-11 | 2017-05-25 | 주식회사 아이에스시 | 검사용 소켓 및 도전성 입자 |
KR101689249B1 (ko) * | 2016-08-19 | 2016-12-26 | 전형근 | 전자 소자 검사용 핀 조립체, 전자 소자 검사용 핀 조립체 제조용 지그 및 전자 소자 검사용 핀 조립체 제조 방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6426642B1 (en) * | 1999-02-16 | 2002-07-30 | Micron Technology, Inc. | Insert for seating a microelectronic device having a protrusion and a plurality of raised-contacts |
JP2001004664A (ja) | 1999-06-25 | 2001-01-12 | Jsr Corp | 回路装置の電気的検査装置 |
JP2001084841A (ja) * | 1999-09-14 | 2001-03-30 | Jsr Corp | 異方導電性シートおよびその製造方法 |
JP2001091579A (ja) * | 1999-09-24 | 2001-04-06 | Jsr Corp | シート状コネクターおよびその製造方法、半導体装置接続装置並びに検査装置 |
JP4288814B2 (ja) | 2000-01-28 | 2009-07-01 | 凸版印刷株式会社 | 半導体検査治具及びその製造方法 |
JP3427086B2 (ja) | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | Icソケット |
JP2001307851A (ja) * | 2000-04-25 | 2001-11-02 | Toshiba Corp | 半導体装置のテストソケット |
US6441629B1 (en) * | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
JP2003092317A (ja) * | 2001-09-19 | 2003-03-28 | Jsr Corp | シート状コネクターおよびプローブ装置 |
JP4213455B2 (ja) * | 2002-11-27 | 2009-01-21 | 株式会社エンプラス | 電気部品用ソケット |
JP4507644B2 (ja) * | 2003-06-12 | 2010-07-21 | Jsr株式会社 | 異方導電性コネクター装置およびその製造方法並びに回路装置の検査装置 |
TWI223711B (en) * | 2003-08-22 | 2004-11-11 | Advanced Semiconductor Eng | Test apparatus for semiconductor package |
KR200368243Y1 (ko) * | 2004-08-27 | 2004-11-18 | 주식회사 아이에스시테크놀러지 | 도전강화층이 형성된 집적화된 실리콘 콘택터 |
KR20060062824A (ko) * | 2004-12-06 | 2006-06-12 | 주식회사 아이에스시테크놀러지 | 반도체 패키지 테스트용 실리콘 커넥터 |
-
2009
- 2009-03-02 KR KR1020090017393A patent/KR100929645B1/ko active IP Right Grant
- 2009-03-12 WO PCT/KR2009/001249 patent/WO2009145416A1/ko active Application Filing
- 2009-03-12 JP JP2011501714A patent/JP5119360B2/ja active Active
- 2009-03-27 TW TW098109926A patent/TWI381165B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2009145416A1 (ko) | 2009-12-03 |
TWI381165B (zh) | 2013-01-01 |
KR100929645B1 (ko) | 2009-12-03 |
TW200940994A (en) | 2009-10-01 |
KR20090104659A (ko) | 2009-10-06 |
JP2011515817A (ja) | 2011-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5119360B2 (ja) | 半導体チップ検査用ソケット | |
KR100769891B1 (ko) | 검사용 탐침 장치 및 이를 이용한 검사용 소켓 | |
KR100994219B1 (ko) | 반도체 칩 검사용 소켓 | |
JP2004251884A (ja) | 集積回路テストプローブ | |
KR101471116B1 (ko) | 고밀도 도전부를 가지는 테스트용 소켓 | |
KR100977491B1 (ko) | 반도체 칩 검사용 탐침 장치 | |
KR101483757B1 (ko) | 전기접속용 커넥터 | |
KR101007061B1 (ko) | 반도체 칩 검사용 소켓 | |
JP5491581B2 (ja) | 半導体チップ検査用ソケット | |
KR101173118B1 (ko) | 반도체 칩 검사용 소켓 | |
KR101138964B1 (ko) | 테스트 소켓 | |
KR100970895B1 (ko) | 반도체 칩 검사용 소켓 | |
KR100979313B1 (ko) | 반도체 테스트 소켓 | |
KR100992966B1 (ko) | 반도체 칩 검사용 소켓 | |
KR100985498B1 (ko) | 반도체 칩 패키지 검사용 소켓 | |
KR100791888B1 (ko) | 반도체 칩 검사용 소켓 | |
KR20090030190A (ko) | 반도체 칩 검사용 소켓 | |
KR101019720B1 (ko) | 도전체가 패드에 밀착될 수 있는 테스트소켓 | |
KR101173117B1 (ko) | 반도체 칩 검사용 소켓 | |
KR100911892B1 (ko) | 반도체 칩 검사용 소켓 | |
JP2004257831A (ja) | 接触子及び電気的接続装置 | |
KR101026992B1 (ko) | 메모리 모듈용 테스트 소켓 | |
KR100958134B1 (ko) | 반도체 칩 검사용 소켓 | |
KR20160002559U (ko) | 검사용 소켓 | |
KR100875142B1 (ko) | 검사용 탐침 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120125 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120423 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120926 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121022 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5119360 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151026 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |