WO2018105896A1 - Appareil de type prise de test - Google Patents

Appareil de type prise de test Download PDF

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Publication number
WO2018105896A1
WO2018105896A1 PCT/KR2017/012347 KR2017012347W WO2018105896A1 WO 2018105896 A1 WO2018105896 A1 WO 2018105896A1 KR 2017012347 W KR2017012347 W KR 2017012347W WO 2018105896 A1 WO2018105896 A1 WO 2018105896A1
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WO
WIPO (PCT)
Prior art keywords
inspection
substrate
cover part
test
cover
Prior art date
Application number
PCT/KR2017/012347
Other languages
English (en)
Korean (ko)
Inventor
정영배
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to CN201780081264.6A priority Critical patent/CN110121655A/zh
Publication of WO2018105896A1 publication Critical patent/WO2018105896A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to a test socket device, and more particularly to a test socket device that can increase the reliability of the test while being simple in structure.
  • a plurality of integrated circuits are formed on a wafer made of silicon, for example, and each of these integrated circuits is then examined for basic electrical characteristics to thereby obtain an integrated circuit having a defect.
  • a probe test to sort is done.
  • the semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package and sealed. Further, by inspecting the electrical characteristics of each of the packaged semiconductor integrated circuit devices, an electrical test for selecting a semiconductor integrated circuit device having a potential defect is performed.
  • Korean Patent No. 10-1245837 is known.
  • the socket device for testing a semiconductor package includes a fixed body part 100, a cover part 200, an adapter 300, a latch 400, and a contact pin 500. And a test is performed for a BGA type semiconductor package having a solder ball, including the working body 600.
  • the fixed body part 100 is a rectangular frame structure in which the component parts of the socket device are assembled, and fixedly support the contact pin 500, and the cover part 200, the adapter 300, and the working body part ( 600 is assembled to move up and down, the latch 400 is rotatably coupled.
  • the fixed body portion 100 may have a variety of forms to securely support the contact pin 500, as shown in Figure 2, the base 110 and the base (110) through which the contact pin 500 is assembled 110 may be provided by the stopper 120 and the lead guide 130 to be assembled to the lower portion to securely support the contact pin 500.
  • the cover part 200 has a rectangular frame structure that is open to allow the semiconductor package to pass therethrough, and is elastically supported on the upper part of the fixed body part 100 to be assembled to allow vertical operation.
  • the first springs 201 are provided at four corners between the cover part 200 and the base 110, so that the cover part 200 is elastic on the fixed body part 100. Supported up and down movement is possible. Meanwhile, the first spring 201 is fixed and assembled to the fixed body part 100 and the cover part 200.
  • the adapter 300 is elastically supported on the upper portion of the fixed body portion 100 to move upward and downward, and the semiconductor package 10 is seated.
  • the latch 400 is provided on the fixed body part 100 so as to press down the upper portion of the semiconductor package 10 seated on the adapter 300 in conjunction with the vertical movement of the cover part 200.
  • the contact pin 500 is electrically fixed to the solder ball of the semiconductor package 10 according to the upper and lower positions of the working body part 600 by inserting and fixing the lower end part of the fixing body part 100.
  • it is provided as a fine line in the form of a straight line having elasticity.
  • the operating body 600 is provided to be movable up and down between the fixed body 100 and the adapter 300, the head hole 610 is formed so as to correspond to the contact pins 500 one-to-one, respectively. .
  • the inspection socket apparatus is configured to be connected to the inspection substrate by contact pins while the semiconductor device is placed in the adapter. Specifically, in the semiconductor device, the seating plane must maintain a certain distance from the lower part of the inspection apparatus. In order to maintain a certain distance from the lower part of the inspection apparatus, in the prior art, a semiconductor substrate is mounted on an adapter and then the inspection substrate After the contact pins 500 were separately disposed in the space between the test pins and the contact pins 500, electrical connection between the test substrate and the semiconductor device was performed.
  • the ball terminal of the semiconductor device may be damaged. That is, there is a problem that the ball terminal surface of the semiconductor device is damaged due to the contact between the metals.
  • the distance between the contact pins connected to the terminals must be reduced as well as the thickness of the contact pins according to the tendency of the fine pitch to be narrowed between the terminals of the semiconductor device.
  • the production yield of the contact pins decreases as the contact pins become finer, manufacturing costs increase, and the airborne and assembly defects are likely to occur during the pin manufacturing process.
  • the distance between the inspection substrate and the semiconductor device is long, and contact pins are disposed therebetween, resulting in high resistance, which inevitably leads to a problem in that the reliability of the inspection is also deteriorated.
  • the present invention has been made to solve the above-mentioned problems, and more particularly, it is an object of the present invention to provide a test socket device that can improve the reliability of the test as a simple structure.
  • the inspection socket apparatus of the present invention for achieving the above object, in the inspection socket apparatus for electrically connecting the device under test to the inspection substrate,
  • a cover part disposed on an upper side of the inspection substrate, the cover part being elastically supported by the body part and movable up and down;
  • An adapter on which the device to be inspected is seated and disposed between the body portion and the cover portion and installed on the inspection substrate;
  • a latch means which moves in association with vertical movement of the cover part and is rotatably connected to the body part and the cover part, respectively, to press the upper part of the device under test seated in the adapter toward the test substrate side.
  • the cover part operates the latch means while at least a portion of the cover part moves up and down relative to a body part disposed below the test substrate while passing through the test substrate.
  • the cover portion is provided with a hinge coupling portion connected to the latch means, the hinge coupling portion can be moved up and down while passing through the inspection substrate.
  • the latch means The latch means,
  • An intermediate arm having one end connected to a link with a middle of the latch arm and the other end rotatably coupled to the body portion;
  • a first hinge pin may be provided at a rear end of the latch arm and rotatably coupled to the cover part.
  • the cover part is provided with a departure prevention part to prevent the cover part from being separated from the body part by hanging on the body part,
  • the detachment preventing part may be moved up and down together with the cover part while passing through a through hole provided in the test substrate, and a lower end thereof may be coupled to a body part disposed below the test substrate.
  • the adapter may be provided on the test substrate and provided with an anisotropic conductive sheet in which an elastic insulating material and conductive particles are mixed.
  • the conductive material may include a plurality of conductive parts arranged in a thickness direction in the elastic insulating material, and an insulating part for insulating adjacent conductive parts while supporting each conductive part spaced apart from each other in the plane direction.
  • the elastic insulating material may be silicone rubber.
  • An inspection socket device for electrically connecting a device under test to an inspection board
  • a cover part disposed on an upper side of the inspection substrate, the cover part being elastically supported by the body part and movable up and down;
  • latch means connected to the body and the cover, respectively, to move in conjunction with the vertical movement of the cover and to press the device under test disposed on the inspection board toward the inspection board.
  • the cover part operates the latch means while at least a part passes through the inspection substrate.
  • An adapter may be provided between the cover part and the test substrate to accommodate the device under test inside the test substrate.
  • the adapter may be fixed to the inspection substrate.
  • the inspection substrate On the inspection substrate, it may be installed on the anisotropic conductive sheet in which the elastic insulating material and the conductive particles are mixed.
  • An anisotropic conductive sheet in which an elastic insulating material and conductive particles are mixed may be provided between the test substrate and the adapter.
  • the anisotropic conductive sheet includes a conductive portion in which conductive particles are disposed in an elastic insulating material in a thickness direction, an upper surface of the conductive portion is in contact with a terminal of the device under test, and a lower surface of the conductive portion is a pad of the test substrate. It may be contactable with.
  • the inspection socket apparatus has an advantage of expanding the variety of inspection structures and inspection objects by shortening the distance between the inspection substrate and the device under inspection. In particular, it is possible to increase the reliability of the electrical inspection by enabling the electrical connection without using the existing contact pin.
  • test socket device has an effect of increasing the pressing force in proportion to the leverage. That is, there is an advantage that the pressing force is increased in comparison with the existing structure while minimizing the latch stroke.
  • the present invention can shorten the separation distance between the inspection substrate and the device under test, so that a low resistance value can be measured, thereby improving the reliability of the test.
  • the present invention has the advantage that can be easily applied to the electrical inspection of the device under inspection with a fine pitch.
  • FIG. 1 is a perspective view of a socket device for inspection of the prior art.
  • Figure 2 is an exploded perspective view of Figure 1;
  • FIG. 3 is a partial cross-sectional view of the inspection socket of FIG.
  • Figure 4 is an exploded perspective view of the test socket according to an embodiment of the present invention.
  • FIG. 5 is a perspective view of the combination of FIG.
  • FIG. 6 is a plan view of FIG. 4.
  • FIG. 7 is a side view of FIG. 4.
  • FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 6.
  • FIG. 10 is a cross-sectional view taken along line X-X in FIG. 9.
  • test socket device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
  • the inspection socket device 1 of the present invention includes a body portion 10, a cover portion 20, an adapter 30, a latch means 40, and an anisotropic conductive sheet 50.
  • the inspection socket device 1 is for electrically connecting the device under test 70 and the test substrate 60 to each other, specifically, the terminal of the device under test 70 and the test substrate 60.
  • the pad is one-to-one electrical connection to each other.
  • the body portion 10 is disposed below the inspection substrate 60 in which pads are provided at positions corresponding to the terminals of the device under test 70.
  • the body portion 10 has a rectangular frame structure in which a pair of first side walls 11 facing each other and a pair of second side walls 12 facing each other are connected at right angles to each other.
  • the body portion 10 is a corner portion is fixed to the inspection substrate 60 by a bolt (not shown) or the like.
  • the first side wall 11 which is a pair of opposite sidewalls of the body portion 10, is provided with a hinge connecting portion 111 to which the other end of the intermediate arm 42 connected to the middle of the latch arm 41 is connected.
  • the hinge connecting portion 111 is a hole into which the second hinge pin 421 installed at the other end of the intermediate arm 42 is fitted, and a pair of each of the first side walls 11 faces each other.
  • the second side wall 12 connected to the first side wall 11 at a right angle is provided with a locking step 121 to which the release preventing portion 221 of the cover portion 20 is fitted.
  • the cover part 20 may be prevented from being separated from the body part 10 by being caught by the separation preventing part 221 of the cover part 20 which is lifted up and down by the locking step 121.
  • the cover portion 20 is disposed above the inspection substrate 60 and is elastically supported by the body portion 10 to be movable up and down.
  • An elastic spring 23 is disposed between the cover part 20 and the body part 10 so that the cover part 20 is elastically biased in a direction away from the body part 10.
  • the cover part 20 includes a pair of first cover side walls 21 facing each other and a pair of second cover side walls 22 connected to the first cover side wall 21 at right angles to form a rectangular frame as a whole. It has a structure.
  • the first cover side wall 21 of the cover part 20 is provided with a hinge coupler 211 extending downward and connected to the latch means 40.
  • the hinge coupler 211 is configured to move up and down while passing through the inspection substrate 60.
  • the first hinge pin 43 provided at the rear end of the latch arm 41 is fitted to the lower side of the hinge coupler 211, so that the latch arm 41 moves up and down as the cover portion 20 moves up and down. 20) to rotate in conjunction with.
  • the second cover side wall 22 is provided with a release preventing portion 221 which is caught by the body portion 10 and prevents the cover portion 20 from being separated from the body portion 10.
  • the departure prevention part 221 is moved up and down together with the cover part 20 while passing through the through hole 61 provided in the inspection substrate 60, the lower end is disposed below the inspection substrate 60.
  • the detachment preventing part 221 is configured to be caught by the locking step 121 of the body part 10.
  • the adapter 30 is provided with a central hole for accommodating the device under test 70 in the center, and has an approximately rectangular frame shape.
  • the adapter 30 is disposed between the body portion 10 and the cover portion 20, and is installed above the inspection substrate 60.
  • the adapter 30 is installed to be fixed to the inspection substrate 60 on the inspection substrate 60.
  • An anisotropic conductive sheet 50 seated on the upper surface of the inspection substrate 6 is disposed below the adapter 30, and the device under test 70 accommodated in the center of the adapter 30 is the anisotropic conductive sheet. Make contact with (50).
  • the latch means 40 comprises a latch arm 41, an intermediate arm 42, and a first hinge pin 43.
  • the latch arm 41 is for pressing the device under test 70.
  • the latch arm 41 is configured to press the device under test 70 and the other side of the cover part in a state where the first hinge pin 43 is fitted. It is connected rotatably to (20).
  • the intermediate arm 42 is one end is connected to the middle and the link of the latch arm 41 and the other end is rotatably coupled to the body portion 10, the other end of the intermediate arm 42 is the body portion Rotatingly coupled to the hinge connecting portion 111 of the (10).
  • the first hinge pin 43 is provided at the rear end of the latch arm 41 and is rotatably coupled to the cover part 20. When the cover part 20 moves up and down, the latch arm 41 connected to the first hinge pin 43 may operate in conjunction with the cover part 20.
  • the anisotropic conductive sheet 50 supports a plurality of conductive portions 51 in which a plurality of conductive particles 511 are arranged in the thickness direction in the elastic insulating material, and respective conductive portions 51 spaced apart from each other in the surface direction.
  • the insulating portion 52 is insulated from the adjacent conductive portion 51.
  • the anisotropic conductive sheet 50 is disposed between the adapter 30 and the inspection substrate 60.
  • the upper portion of the conductive portion 51 is located inside the central hole of the adapter (30).
  • the upper end of the conductive part 51 is in contact with the terminal of the device under test 70, and the lower end of the conductive part 51 is in contact with the pads of the test substrate 60.
  • the conductive portion 51 of the anisotropic conductive sheet 50 has conductive particles 511 that exhibit magnetic properties in the elastic insulating material densely arranged, extend in the thickness direction, and are insulated from each other by the insulating portion 52. Will be.
  • the elastic insulating material constituting the conductive portion 51 a polymer material having a crosslinked structure is preferable.
  • the curable polymer material forming material that can be used to obtain such a polymer material various materials can be used, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile.
  • Conjugated diene rubbers such as butadiene copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer, and hydrogenated products thereof and chloroprene rubber And urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.
  • the obtained anisotropic conductive sheet 50 when weather resistance is calculated
  • the liquid silicone rubber preferably has a viscosity of 10 5 poise or less at a distortion rate of 10 1 sec, and may be any of condensation type, addition type, and vinyl group or hydroxyl group. Specifically, a dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methylphenyl vinyl silicone raw rubber, etc. are mentioned.
  • the conductive particles 511 contained in the elastic insulating material a material having rigidity in which the particles themselves do not deform when the conductive portion 51 is pressed is preferably used.
  • a magnetic material is used.
  • the conductive particles 511 include particles of metals having magnetic properties such as iron, cobalt, and nickel, particles of these alloys, particles containing these metals, or particles thereof as core particles.
  • the surface of the core particles the surface of which is coated with a metal having good conductivity such as gold, silver, palladium, rhodium, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles.
  • the plating of electroconductive magnetic metals, such as nickel and cobalt is mentioned.
  • nickel particle as a core particle and to plate the surface of gold with good electroconductivity on the surface.
  • the means for coating the conductive metal on the surface of the core particle is not particularly limited, but for example, chemical plating or electrolytic plating, sputtering, vapor deposition, or the like is used.
  • the conductive particles 511 are formed by coating a conductive metal on the surface of the core particles, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface (coating of the conductive metal to the surface area of the core particles) It is preferable that the ratio of area) is 40% or more, More preferably, it is 45% or more, Especially preferably, it is 47 to 95%.
  • the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, more preferably 3 to 25% by mass, particularly preferably 4 to 20% by mass. to be.
  • the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, still more preferably 3 to 15% by mass.
  • the particle diameter of the electroconductive particle 511 is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Especially preferably, it is 4-20 micrometers.
  • the insulating part 52 is made of an elastic insulating material constituting the conductive part 51, and specifically, made of silicon rubber.
  • the present invention is not limited thereto and may be made of a material different from that of the material constituting the conductive part 51.
  • a material that is harder than the elastic insulating material constituting the conductive part 51 may be used, and a material that is softer than the elastic insulating material may be used.
  • the cover portion 20 is pressed downward for the inspection, the rear end of the latch arm 41 connected to the cover portion 20 is moved downward, so that the pair of intermediate arms 42 are mutually
  • the front end of the latch arm 41 is rotated upward while moving in a direction away from it. Accordingly, as shown in FIG. 9, the latch arm 41 is kept open. That is, as the latch arm 41 rotates, the central hole 31 of the adapter 30 is opened so that the device under test 70 can be accommodated in the adapter 30.
  • the cover 20 is moved upward so that the latch arm 41 is moved to the device under test 70 as shown in FIG. 5. To pressurize the upper surface.
  • a predetermined electrical signal is applied from the test substrate 60, the electrical signal is applied to the device under test 70 through the conductive part 51 of the anisotropic conductive sheet 50 to perform a predetermined electrical test. .
  • the cover 20 In order to remove the device under inspection 70 from the inspection socket device 10, the cover 20 is pushed downward to operate the latch means 40 to release the pressure on the device under inspection 70. Let's go.
  • the inspection socket apparatus of the present invention allows the seating surface to be disposed in close proximity to the inspection substrate without reducing the height of the seating surface (the distance from the bottom of the inspection apparatus to the seating surface) on which the device to be inspected is placed. There is an advantage of improving the reliability of the inspection by eliminating the need for a terminal pin.
  • test socket device has an effect of increasing the pressing force in proportion to the leverage. That is, there is an advantage that the pressing force is increased in comparison with the existing structure with a minimum latch stroke.
  • the separation distance between the test substrate and the device under test can be shortened, so that low resistance measurement can be performed, thereby improving the reliability of the test.
  • the present invention has the advantage that can be easily applied to the electrical inspection of the device under inspection with a fine pitch.
  • the inspection socket apparatus can shorten the distance between the inspection substrate and the device under test, so that an anisotropic conductive sheet other than a conventional contactor pin can be used, thereby preventing the terminal of the device under test from being damaged. can do. That is, the anisotropic conductive sheet made of a soft silicone rubber material is difficult to use in the existing structure because it is difficult to produce a predetermined thickness or more, in the present invention, as the distance between the inspection substrate and the device to be inspected becomes short, smooth contact is possible. An anisotropic conductive sheet can be used to minimize damage to the terminals of the device under test.
  • Inspection socket device of the present invention is not limited to this, various modifications are possible.
  • the arrangement of the anisotropic conductive sheet on the lower side of the adapter is illustrated.
  • the present invention is not limited thereto, and the anisotropic conductive sheet is not arranged, and the inspection socket device may be configured using only the adapter.
  • the adapter is disposed between the test substrate and the cover part, but the present invention is not limited thereto, and the test socket device may be configured without the adapter.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Environmental & Geological Engineering (AREA)

Abstract

La présente invention concerne un appareil de type prise de test et, plus spécifiquement, un appareil de type prise de test comprenant : une partie corps disposée de manière fixe sur un côté inférieur d'un substrat de test ; une partie couvercle qui est disposée sur un côté supérieur du substrat de test et est supportée élastiquement par la partie corps, et peut ainsi se déplacer vers le haut et vers le bas ; un adaptateur dans lequel un dispositif à tester est placé de manière stable et qui est disposé entre la partie corps et la partie couvercle et est installé sur un côté supérieur du substrat de test ; et un moyen de verrouillage qui se déplace en association avec le mouvement vers le haut et vers le bas de la partie couvercle et est relié de manière rotative à chacune de la partie corps et de la partie couvercle de manière à mettre sous pression, vers le substrat de test, la partie supérieure du dispositif à tester placé de manière stable dans l'adaptateur, la partie couvercle actionnant le moyen de verrouillage tandis qu'au moins une de ses parties passe à travers le substrat de test, lors de son mouvement concomitant vers le haut et vers le bas par rapport à la partie corps disposée sur un côté inférieur du substrat de test.
PCT/KR2017/012347 2016-12-07 2017-11-02 Appareil de type prise de test WO2018105896A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780081264.6A CN110121655A (zh) 2016-12-07 2017-11-02 测试插座

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160166182A KR101864859B1 (ko) 2016-12-07 2016-12-07 검사용 소켓장치
KR10-2016-0166182 2016-12-07

Publications (1)

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WO2018105896A1 true WO2018105896A1 (fr) 2018-06-14

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CN (1) CN110121655A (fr)
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KR102088305B1 (ko) * 2018-11-22 2020-03-13 주식회사 아이에스시 피검사 디바이스 검사용 테스트 소켓
KR102393083B1 (ko) 2020-08-21 2022-05-03 주식회사 스노우 도전성 입자 및 이를 포함하는 검사용 소켓
KR102477224B1 (ko) * 2020-09-23 2022-12-14 주식회사 아이에스시 검사용 소켓
TWI752760B (zh) * 2020-12-18 2022-01-11 致茂電子股份有限公司 測試座之晶片固定裝置
KR102606908B1 (ko) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓
CN114152783B (zh) * 2021-11-12 2023-06-16 环维电子(上海)有限公司 一种微针浮动测试工具及测试模组
KR102641973B1 (ko) 2023-03-31 2024-02-29 보이드코리아유한회사 컨텍트핀안전정렬삽입부가 적용된 반도체 패키지 검사용 소켓 장치

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