TWI516769B - 導電連接器及其製造方法 - Google Patents

導電連接器及其製造方法 Download PDF

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Publication number
TWI516769B
TWI516769B TW103125334A TW103125334A TWI516769B TW I516769 B TWI516769 B TW I516769B TW 103125334 A TW103125334 A TW 103125334A TW 103125334 A TW103125334 A TW 103125334A TW I516769 B TWI516769 B TW I516769B
Authority
TW
Taiwan
Prior art keywords
conductive
conductive metal
portions
connector
insulating support
Prior art date
Application number
TW103125334A
Other languages
English (en)
Chinese (zh)
Other versions
TW201512664A (zh
Inventor
黃珪植
李柄周
Original Assignee
Isc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc股份有限公司 filed Critical Isc股份有限公司
Publication of TW201512664A publication Critical patent/TW201512664A/zh
Application granted granted Critical
Publication of TWI516769B publication Critical patent/TWI516769B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW103125334A 2013-07-24 2014-07-24 導電連接器及其製造方法 TWI516769B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130087499A KR101393601B1 (ko) 2013-07-24 2013-07-24 도전성 커넥터 및 그 제조방법

Publications (2)

Publication Number Publication Date
TW201512664A TW201512664A (zh) 2015-04-01
TWI516769B true TWI516769B (zh) 2016-01-11

Family

ID=50893725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103125334A TWI516769B (zh) 2013-07-24 2014-07-24 導電連接器及其製造方法

Country Status (4)

Country Link
KR (1) KR101393601B1 (fr)
CN (1) CN105452877B (fr)
TW (1) TWI516769B (fr)
WO (1) WO2015012498A1 (fr)

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* Cited by examiner, † Cited by third party
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KR101591670B1 (ko) * 2014-06-02 2016-02-04 배준규 반도체 테스트용 러버 소켓의 제조방법 및 이를 위한 컴퓨터로 판독가능한 기록매체
KR101624689B1 (ko) 2014-08-21 2016-05-26 주식회사 아이에스시 접속용 커넥터
KR101567296B1 (ko) 2014-10-30 2015-11-10 주식회사 아이에스시 변색 가능한 테스트 소켓 및 그 제조 방법
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
KR101673142B1 (ko) * 2015-05-29 2016-11-16 배준규 반도체 테스트용 러버 소켓 및 이의 제조방법 및 이를 위한 기록매체
KR101685023B1 (ko) * 2015-06-24 2016-12-09 배준규 반도체 테스트용 러버 소켓 및 이의 제조방법, 그리고 이를 위한 기록매체
WO2016195251A1 (fr) * 2015-05-29 2016-12-08 배준규 Support en caoutchouc pour test de semi-conducteur et son procédé de fabrication
KR101683017B1 (ko) * 2015-07-03 2016-12-07 주식회사 오킨스전자 테스트 소켓, 및 그 제조 방법 그리고 금형
KR101739536B1 (ko) * 2016-05-11 2017-05-24 주식회사 아이에스시 검사용 소켓 및 도전성 입자
JP6918518B2 (ja) * 2017-02-27 2021-08-11 デクセリアルズ株式会社 電気特性の検査冶具
KR101920855B1 (ko) 2017-05-11 2018-11-21 주식회사 아이에스시 검사용 소켓
KR101923144B1 (ko) 2017-05-18 2018-11-28 이승용 반도체 소자 테스트용 인터페이스
KR101967401B1 (ko) * 2017-12-29 2019-04-10 에스케이하이닉스 주식회사 테스트 소켓
CN109037974B (zh) * 2018-06-26 2020-09-01 中国电子科技集团公司第二十九研究所 一种接触式宽带射频互连方法及结构
KR102080006B1 (ko) * 2018-09-06 2020-04-07 주식회사 아이에스시 검사용 커넥터 및 검사용 커넥터의 제조방법
KR102103747B1 (ko) * 2018-10-25 2020-04-23 주식회사 오킨스전자 메탈-ｃｎｔ 복합체 및/또는 폴리머-ｃｎｔ 복합체를 포함하는 테스트 소켓
KR102148330B1 (ko) * 2018-11-13 2020-08-26 주식회사 아이에스시 전기접속용 커넥터
KR102193528B1 (ko) * 2019-04-17 2020-12-23 주식회사 아이에스시 극저온에서 적용 가능한 검사용 커넥터
JP7308660B2 (ja) * 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置
KR102466454B1 (ko) * 2019-08-29 2022-11-14 주식회사 아이에스시 검사용 소켓
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes
KR102606892B1 (ko) 2021-06-15 2023-11-29 (주)포인트엔지니어링 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓
US12051865B2 (en) 2021-12-28 2024-07-30 Te Connectivity Solutions Gmbh Socket connector
WO2024035163A1 (fr) * 2022-08-10 2024-02-15 삼성전자 주식회사 Connecteur et dispositif électronique le comprenant

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JP2001093599A (ja) * 1999-09-28 2001-04-06 Jsr Corp 異方導電性コネクターおよびこれを備えてなる検査装置
KR200312739Y1 (ko) 2003-01-27 2003-05-13 주식회사 아이에스시테크놀러지 도전체가 실장된 집적화된 실리콘 콘택터
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터
JP5548428B2 (ja) * 2009-11-02 2014-07-16 藤森工業株式会社 透明導電性フィルムの製造方法及び透明導電性フィルム
JP2011226786A (ja) * 2010-04-15 2011-11-10 Tokyo Electron Ltd 接触構造体および接触構造体の製造方法
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법

Also Published As

Publication number Publication date
WO2015012498A1 (fr) 2015-01-29
CN105452877B (zh) 2019-04-09
KR101393601B1 (ko) 2014-05-13
TW201512664A (zh) 2015-04-01
CN105452877A (zh) 2016-03-30

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