TWI516769B - Conductive connector and method of manufacturing the same - Google Patents

Description

Conductive connector and method of manufacturing same [related application]

The present application claims priority to Korean Patent Application No. 10-2013-0087499, filed on Jan. 24, 2013 in the Korean Intellectual Property Office (KIPO), the entire contents of which is incorporated by reference. In this article.

One or more embodiments of the present invention relate to a conductor connector and a method of fabricating the same, and more particularly to a conductive connector for testing a jack for detecting electrical characteristics of a test target device, A method of electrically conductive connectors.

In general, it is necessary to detect electrical characteristics after manufacturing an electronic component or a circuit board, such as an integrated circuit (IC) or an electronic component of a semiconductor package, or a circuit board constituting or mounting the electronic component. In order to detect the electrical characteristics of the test target device, it is necessary to stabilize the electrical connection between the test target device and the test device (test board), and for this purpose, a connector for electrical connection is required. Change sentence In other words, the connector for electrical connection provides the test target device and the pads of the test device are connected to each other such that the electrical signal can be exchanged between the two directions. This connector for electrical connection is used in a test device that can detect a test target device and, because it is combined with a test target device, can also be referred to as a test jack.

Connectors currently used for electrical connections, that is, generally use test sockets, conductive connectors, and spring pins. Wherein, the conductive connector has a structure that can connect the elastic conductive portion to the terminal of the test target device, and the spring pin is configured to be elastically brought into contact with the terminal of the test target device by a spring prepared therein.

In this way, current conductive connectors and spring pins reduce the mechanical shock that can occur when the test target device and the test device are connected to each other, and are thus widely used as test sockets.

1 shows an example of a conductive connector of a connector currently used for electrical connection, and FIGS. 2 and 3 are enlarged plan views and enlarged cross-sectional views of a conductive portion of the current conductive connector shown in FIG. 1.

Referring to FIGS. 1 through 3, the current conductive connector 10 includes a plurality of conductive portions 12 disposed at positions corresponding to the terminals 22 of the test target device 20, and an insulating support portion 11 that can support the plurality of conductive portions 12, The plurality of conductive portions 12 are insulated from each other.

The conductive portion 12 has a structure of a member formed of an insulating elastic body 11a such as ruthenium rubber, in which the conductive particles 12a are arranged in the thickness direction, that is, in the vertical direction, and the insulating support portion 11 is the same as the elastic body 11a in the conductive portion 12. Materials such as ruthenium rubber are formed.

The conductive connector 10 is mounted on the test device 30. When each conductive part When contacting the pad 32 of the test device 30, if the test target device 20 is lowered and the terminal 22 of the test target device 20 is pressed downward to the conductive portion 12, the conductive particles 12a in the conductive portion 12 will contact each other, so that the conductive portion 12 becomes electrically conductive. During this process, the conductive portion 12 is elastically compressed and deformed, thereby reducing mechanical shock that may occur due to contact between the conductive portion 12 and the terminal 22 of the test target device 20.

When the terminal 22 of the test target device 20 and the test device 30 are made in this way When the pads 32 are electrically connected to each other by the conductive portions 12 of the conductive connectors 10, if the pads 32 of the test device 30 provide a predetermined test signal, the signals are transmitted to the conductive portions 12 of the conductive connectors 10 to The terminal 22 of the target device 20 is tested to perform a predetermined electrical test.

As shown in FIG. 3, the conductive portion 12 of the current conductive connector 10 has The foregoing structure of the insulating elastic body 11a including the conductive particles 12a is such that only a small amount of the conductive particles 12a are exposed on the upper surface of the conductive portion 12 which will contact the terminal 22 of the test target device 20. For this reason, there is a small contact area between the conductive particles 12a of the conductive portion 12 and the terminal 22 of the test target device 20, and an electrical contact resistance increase or contact failure occurs between the conductive portion 12 and the terminal 22 of the test target device 20. . Therefore, there is a problem that the reliability of the conductive connector 10 is deteriorated, that is, the ability to discriminate the high quality product of the test target device 20 is deteriorated.

One or more embodiments of the present invention include a conductive connector configured to reduce electrical contact between terminals of the test target device and the conductive portion due to its conductive metal cap layer formed over the upper surface of the conductive portion resistance.

Other aspects will be set forth in the description which follows.

According to one or more embodiments of the present invention, a conductive connector is disposed between the test target device and the test device, and electrically connects the terminals of the test target device and the pads of the test device to each other, including a plurality of conductive portions, and is disposed Corresponding to the position of the terminal of the test target device, and formed of an elastic material in which the conductive particles are arranged in the vertical direction, the insulating support portion, when supporting the plurality of conductive portions, insulates the plurality of conductive portions from each other, and the conductive metal A cover layer is formed over the upper surface of the plurality of conductive portions.

Here, the plurality of conductive portions are formed to protrude upward from the upper surface of the insulating support portion, and the conductive metal cover layer is formed over the upper surface of the protruding portion of the plurality of conductive portions.

A conductive metal cover layer may be formed over the side surface of the protruding portion of the plurality of conductive portions.

The conductive metal cap layer may be formed to have a larger diameter than the plurality of conductive portions.

A guide film for guiding the terminal of the test target device to the center of the plurality of conductive portions may be attached to an upper surface of the insulating support portion, and a plurality of holes are formed in the guide film, and the protruding portions of the plurality of conductive portions are inserted therein.

The conductive metal cover layer may have a thickness of from about 0.1 μm to about 10 μm.

The conductive metal of the conductive metal cap layer may comprise at least one of the group consisting of iron, nickel, chromium, gold, silver, copper, platinum, and alloys thereof.

The conductive metal coating layer may be formed of conductive metal nanoparticles.

The conductive metal nanoparticles may have an average particle diameter of from about 10 nm to about 100 nm.

In accordance with one or more embodiments of the present invention, a method of making a conductive connector includes injecting a liquid elastomer molding material including conductive particles into a molding space of a mold by injecting into a molding space of the mold The molding material applies a magnetic field in a vertical direction to align the conductive particles in a vertical direction, forms a plurality of conductive portions and an insulating support portion by hardening the molding material, and forms a conductive metal coating layer on the upper surface of the plurality of conductive portions Above.

Herein, forming the conductive metal cover layer may include attaching the cover film, wherein a hole exposing the plurality of conductive portions is formed on the upper surface of the insulating support portion, a conductive metal cover layer is formed on the upper surface of the cover film, and the hole is formed by the hole The cover film is removed from the upper surface of the exposed plurality of conductive portions, and the conductive film is formed on the upper surface of the cover film to remove the conductive metal cover layer formed on the upper surface of the cover film.

A plurality of conductive portions may be formed to protrude upward from an upper surface of the insulating support portion, and a conductive metal cover layer may be formed over an upper surface of the protruding portion of the plurality of conductive portions.

A conductive metal cover layer may be formed over the side surface of the protruding portion of the plurality of conductive portions.

The conductive metal cap layer may be formed to have a larger diameter than the plurality of conductive portions.

The method may further include attaching a guiding film to an upper surface of the insulating support portion to guide a terminal of the test target device to a center of the plurality of conductive portions, and forming a plurality of holes in the guiding film, wherein the protruding portions of the plurality of conductive portions Inserted in it.

The holes formed in the cover film may have a diameter greater than or equal to the plurality of conductive portions.

The cover film may be made of polyimide (PI), polyethylene terephthalate (PET), triacetate cellulous (TAC), ethylene/vinyl acetate copolymer (ethylene vinyl). One of the materials of the group consisting of acetate, EVA), polypropylene (PP), or polycarbonate (PC), a thin copper sheet, a thin aluminum sheet, and a thin stainless steel sheet is formed.

The conductive metal layer may be formed to have a thickness of about 0.1 μm to about 10 μm.

Forming the conductive metal cap layer includes forming a conductive metal cap layer by providing a conductive metal paste on the upper surface of the mask film and the upper surface of the plurality of conductive portions in accordance with a printing method, followed by drying the supplied conductive metal paste.

Forming the conductive metal cap layer may include providing the aqueous solution on the upper surface of the mask film and the upper surface of the conductive portion by spraying an aqueous solution of the conductive metal nanoparticles, and then drying the supplied aqueous solution to form a conductive metal cap layer.

10, 100, 200, 300‧‧‧ conductive connectors

11, 110, 210, 310‧‧‧ insulated support

11a, 110a, 210a, 310a‧‧‧ Elastomers

12, 120, 220, 320‧‧‧ conductive parts

12a, 120a, 220a, 320a‧‧‧ conductive particles

20‧‧‧Test target device

22‧‧‧ Terminal

30‧‧‧Testing device

32‧‧‧ solder pads

100a‧‧‧Molded materials

130, 230, 330‧‧ ‧ overlay

150, 250, 350‧‧‧ cover film

152, 252, 352‧ ‧ holes

222, 322‧‧‧ protruding parts

340‧‧‧ Guide film

342‧‧‧ hole

400‧‧‧ model

410‧‧‧下模

411, 421‧‧‧ non-magnetic material layer

412, 422‧‧‧ magnetic material layer

414‧‧‧ Magnetic material substrate

420‧‧‧上模

424‧‧‧Upper magnetic material substrate

430‧‧ ‧ spacers

These and/or other aspects will be more apparent and readily apparent from the following description of the embodiments, wherein: FIG. 1 is a cross-sectional view of an example of a current conductive connector; FIGS. 2 and 3 are 1 is an enlarged plan view and an enlarged cross-sectional view of a conductive portion of a current conductive connector shown in FIG. 1. FIG. 4 is a schematic view of a conductive connector according to an embodiment of the present invention; FIG. 5 is a conductive portion and a cover layer shown in FIG. Figure 6 is a partial schematic view of a conductive connector in accordance with another embodiment of the present invention; Figure 7 is a partial schematic view of a conductive connector in accordance with yet another embodiment of the present invention; Figures 8 through 11 illustrate conductive A schematic diagram of a method of manufacturing a connector according to the embodiment of the present invention shown in FIG. 4; FIGS. 12 and 13 are schematic views showing a method of manufacturing a conductive connector according to another embodiment of the present invention shown in FIG. 14 and 15 are schematic views showing a method of manufacturing a conductive connector according to still another embodiment of the present invention shown in FIG.

The present invention will be described in detail with reference to the accompanying drawings. The present embodiments may have different forms in this regard, and should not be construed as being limited to the description. Accordingly, the present embodiments are to be considered as illustrative only,

4 is a schematic view of a conductive connector in accordance with an embodiment of the present invention, And FIG. 5 is an enlarged view of the conductive portion and the cover layer shown in FIG.

Referring to Figures 4 and 5 together, a conductive connector in accordance with an embodiment of the present invention 100 is a connector for electrical connection, that is, a test jack interposed between the test target device 20 and the test device 30 to electrically connect the terminal 22 of the test target device 20 and the pad 32 of the test device 30. To each other.

Conductive connector 100 allows current to be in the vertical direction and is not vertical In the plane direction of the thickness direction, that is, in the horizontal direction. The conductive connector 100 is configured to be deformed by elastic contraction to absorb the impact force applied by the test target device 20. Specifically, the conductive connector 100 includes a plurality of conductive portions 120, an insulating support portion 110, and a conductive metal cover layer 130.

The conductive portion 120 is disposed at the terminal 22 corresponding to the test target device 20 The position has a structure in which the elastic body 110a in which the conductive particles 120a are arranged in the thickness direction.

The horizontal cross section of the conductive portion 120 can have a variety of shapes, but preferably Has a circular cross section. In other words, the conductive portion 120 is preferably cylindrical.

A heat resistant polymer having a crosslinked structure can be used as a constituent conductive The elastomer 110a of the portion 120. In order to obtain the elastic polymer, various materials which can form a cured polymer can be used, however, liquid ruthenium rubber is preferable from the viewpoints of mold processability and electrical properties. Any other curable liquid enamel rubber having a vinyl group or a hydroxyl group, a condensation curable liquid rubber, or a liquid ruthenium rubber may be used. Specifically, it has a dimethyl fluorenone raw rubber, a methyl vinyl fluorenone raw rubber, a methyl phenyl vinyl virgin rubber, or the like.

When the conductive portion 120 is formed of a hardened material of ruthenium rubber, the hardened ruthenium rubber preferably has a permanent compression set of about 10% or less at 150 ° C, more preferably about 8% or less, and is optimal. It is about 6% or less. When the conductive connector 100 having a permanent compression set greater than 10% is repeatedly used in a high temperature environment, the chain of the conductive particles 120a in the conductive portion 120 is broken, and it is difficult to maintain the necessary conductivity.

It is preferable to use particles obtained by covering the highly conductive metal by magnetic core particles (hereinafter referred to as "magnetic core particles") as the conductive particles 120a constituting the conductive portion 120. The magnetic core particles preferably have an average particle diameter of from about 3 μm to about 40 μm on average. Here, the average particle diameter of the magnetic core particles is measured in a laser diffraction manner. May be used iron, nickel, cobalt or an alloy as the material constituting the magnetic core particles, and the material preferably having from about 0.1Wb / m ² or greater saturation magnetization, more preferably about 0.3Wb / m ² or more Preferably, it is about 0.5 Wb/m ² or more. The highly conductive metal has a conductivity of about 5 x ^{10 6} Ω/m or more at 0 °C. The highly conductive metal covering the surface of the magnetic core particles is gold, silver, rhodium, platinum, chromium, or the like. Among them, gold is preferred because of its stable chemical properties and high electrical conductivity.

The insulating support portion 110 performs a function of maintaining insulation between the conductive portions 120 when supporting the conductive portion 120. The insulating support portion 110 is preferably formed of the same material as the elastomer 110a of the conductive portion 120, such as a rubber. However, the material of the insulating support portion 110 is not limited to the ruthenium rubber, and any material having excellent elasticity and insulation can be used.

The cover layer 130 covers the terminal 22 that will contact the test target device 20 Above the upper surface of the conductive portion. The cover layer 130 may be formed to have the same diameter as the conductive portion 120. However, the diameter of the cover layer 130 is not limited to being the same as the conductive portion 120, and the cover layer 130 may be formed to have a larger diameter than the conductive portion 120. Additionally, the cover layer 130 is preferably formed to have a thickness of from about 0.1 μm to about 10 μm.

As the conductive metal constituting the cover layer 130, for example, iron, nickel, chromium, gold, silver, copper, platinum, or an alloy thereof can be used. In addition, the cover layer 130 may be formed of nano particles of a conductive metal, and the average particle diameter of the conductive metal nanoparticles is preferably from about 10 nm to about 100 nm.

The operation and efficacy of the conductive connector 100 having the structure according to the embodiment of the present invention described above will be described below.

Referring to FIG. 4, the conductive connector 100 having the structure described above is mounted on the test device 30, and in the conductive connector 100, the lower surface of the conductive portion 120 will relatively contact the pad 32 of the test device 30. When the test target device 20 is lowered in this state, the terminal 22 of the test target device 20 will contact the cover layer 130 formed over the upper surface of the conductive portion 120 and press down on the cover layer 130 and the conductive portion 120. At this time, the conductive particles 120a in the conductive portion 120 will contact each other, so that the conductive portion 120 becomes electrically conductive. In this process, the conductive portion 120 is elastically compressed and deformed, thereby reducing the mechanical shock that may occur when the conductive portion 120 and the terminal 22 of the test target device 20 are in contact.

When the terminal 22 of the test target device 20 is electrically connected to the pad 32 of the test device 30 by the conductive portion 120 and the cover layer 130, the pad 32 of the test device 30 will provide a predetermined signal and be covered by the conductive portion 120 and Layer 130 pass To the terminal 22 of the test target device 20, a predetermined electrical test can be performed.

The conductive connector 100 has the following effects.

In the electrical test process using the conductive connector 100 in accordance with an embodiment of the present invention to test the target device 20, as described above, the terminal 22 of the test target device 20 will contact the cover layer 130 formed over the upper surface of the conductive portion 20. And thus increase the electrical contact area. Therefore, the electrical contact resistance between the terminal 22 of the test target device 20 and the conductive portion 120 is reduced, and the electrical connection is stabilized. Therefore, the reliability of the conductive connector 100 and the ability to discriminate the high quality product of the target device 20 are improved.

Further, the cover layer 130 is formed of a conductive metal and thus is harder than the conductive portion 120. Since the upper surface of the conductive portion 120 covers the hard cover layer 130 in this manner, wear and damage caused by direct contact between the conductive portion 120 and the terminal 22 of the test target device 20 can be prevented, and the foreign material can also be prevented. The contamination or damage of the conductive portion 120 is caused. Therefore, the life of the conductive connector 100 can be extended.

Conductive connectors in accordance with other embodiments of the present invention will be described below.

6 is a partial schematic view of a conductive connector in accordance with another embodiment of the present invention, and FIG. 7 is a partial schematic view of a conductive connector in accordance with yet another embodiment of the present invention.

Referring first to FIG. 6, a conductive connector 200 in accordance with another embodiment of the present invention includes a plurality of conductive portions 220, an insulating support portion 210, and a conductive metal cap layer 230.

The conductive portion 220 is disposed at the terminal 22 corresponding to the test target device 20 The position has a structure in which the conductive particles 220a are arranged in the thickness direction of the elastic body 210a. The insulating support portion 210 performs a function of maintaining insulation between the conductive portions 220 when supporting the conductive portion 220. Since the detailed composition of the conductive portion 220 and the insulating support portion 210 is the same as that of the conductive portion 120 and the insulating support portion 110 in the conductive connector 100 according to the embodiment shown in FIGS. 4 and 5, a detailed description thereof will be omitted.

However, in this embodiment, the conductive portion 220 is formed as an insulating branch The upper surface of the struts 210 protrudes upward. In other words, the conductive portion 220 includes a protruding portion 222 that protrudes upward from the upper surface of the insulating supporting portion 210 by a predetermined height. When the conductive portion 220 protrudes upward from the upper surface of the insulating support portion 210 in this manner, contact with the terminal 22 of the test target device 20 can be ensured.

In this case, the cover layer 230 is formed on the protrusion of the conductive portion 220 Above the upper surface of the subsection 222. Further, the cover layer 230 may be formed over the side surface of the protruding portion 222 and may be formed to have a larger diameter than the conductive portion 220.

Due to the conductive metal constituting the cover layer 230, the type and thickness thereof are The conductive metal constituting the cover layer 130 in the conductive connector 100 according to the embodiment shown in FIGS. 4 and 5 is omitted, and thus detailed description thereof will be omitted.

Next, referring to FIG. 7, a conductive connection according to still another embodiment of the present invention The device 300 includes a plurality of conductive portions 320, an insulating support portion 310, a conductive metal cover layer 330, and a guide film 340.

The conductive portion 320 is disposed at the terminal 22 corresponding to the test target device 20 The position has a structure in which the conductive particles 320a are arranged in the thickness direction of the elastic body 310a. The insulating support portion 310 performs a function of maintaining insulation between the conductive portions 320 when supporting the conductive portion 320. A conductive metal cap layer 330 is formed over the upper surface of the protruding portion 322 of the conductive portion 320. Further, the cover layer 330 may also be formed over the side surface of the protruding portion 322 and may be formed to have a larger diameter than the conductive portion 320. The detailed composition of the conductive portion 320, the insulating support portion 310, and the conductive metal cover layer 330 and the conductive portion 220, the insulating support portion 210, and the cover layer 230 in the conductive connector 200 according to other embodiments shown in FIG. The same, and thus a detailed description thereof will be omitted.

However, in this embodiment, when the terminal 22 is lowered and deviates from the conductive portion At the center of 320, a guide film 340 of the center of the test target device 20 to the center of the conductive portion 320, which is attached to the upper surface of the insulating support portion 310, may be guided. The guide film 340 is formed to surround the side surface of the protruding portion 322 by a predetermined distance. In other words, a plurality of holes 342 in which the protruding portion 322 of the conductive portion 320 is inserted are formed in the guide film 340. The hole 342 is formed to have a larger diameter than the protruding portion 322. Further, the guide film 340 may have the same height as the protruding portion 322. The guide film 340 may use a synthetic resin material such as polyimide, but the guide film 340 is not limited to a synthetic resin material.

Due to the electrically conductive connector 200 and having the aforementioned further according to the invention The conductive connector 300 of the embodiment has the same operation and efficiency as the conductive connector 100 according to the embodiment shown in FIGS. 4 and 5, and thus a detailed description thereof will be omitted.

A conductive connector having the foregoing structure according to an embodiment of the present invention, a manufacturing method thereof will be described below.

8 to 11 are schematic views showing a method of manufacturing a conductive connector in accordance with an embodiment of the present invention shown in FIG.

First, as shown in FIG. 8, the upper mold 420 is disposed on the lower mold 410 with the spacer 430 interposed therebetween. A molding space surrounded by the spacer 430 is formed between the lower mold 410 and the upper mold 420.

In the lower mold 410, a magnetic material layer 412 is formed on the upper surface of the lower magnetic material substrate 414, corresponding to the position of the conductive portion 120 of the conductive connector 100, that is, corresponding to the position of the terminal 22 of the test target device 20. And a non-magnetic material layer 411 is formed over the upper surface of the lower magnetic material substrate 414, different from the position of the magnetic material layer 412.

The upper mold 420 is also the same, the magnetic material layer 422 is formed on the lower surface of the upper magnetic material substrate 424, corresponding to the position of the conductive portion 120 of the conductive connector 100, and the non-magnetic material layer 421 is formed under the upper magnetic material substrate 424. Above the surface, it is different from the position of the magnetic material layer 422.

Next, the molding material 100a is injected into the molding space of the preliminary mold 400. The molding material 100a can be produced by a liquid elastomer 110a of liquid ruthenium rubber including a large amount of conductive particles 120a therein. The elastomer 110a and the conductive particles 120a have been described in detail above.

Next, referring to FIG. 9, electromagnets (not shown) are disposed, which are respectively disposed on the lower surface of the lower mold 410 and the upper surface of the upper mold 420, thereby being vertically oriented. A magnetic field is applied to the molding material 100a injected into the molding space in the mold 400. Then, the conductive particles 120a dispersed in the liquid elastomer 110a are collected between the magnetic material layer 422 of the upper mold 420 and the magnetic material layer 412 of the lower mold 410, and are arranged in the vertical direction.

Further, the molding material 100a is subjected to a hardening process in the mold 400 for about 1.5 hours and at a temperature of, for example, about 100 °C. Next, the hardened elastic body 110a in which the conductive particles 120a are arranged in the vertical direction forms a plurality of conductive portions 120, and the hardened elastic body 110a surrounding the plurality of conductive portions 120 forms the insulating support portion 110.

Next, as shown in FIG. 10, the mask film 150 is attached to the upper surface of the insulating support portion 110. A plurality of holes 152 are formed in the cover film 150, and the plurality of conductive portions 120 are exposed by the plurality of holes 152. The diameter of the plurality of holes 152 may be formed to be equal to or larger than the diameter of the conductive portion 120.

As a material of the cover film 150, polyimide (PI), polyethylene terephthalate (PET), triacetate cellulous (TAC), ethylene can be used for the non-metal material. /ethylene vinyl acetate (EVA), polypropylene (PP), or polycarbonate (PC), and metal materials can also be used in thin copper, thin aluminum, or thin Stainless steel sheet. In addition, various methods can be used as a method of forming the holes 152 in the mask film 150, such as a laser process, a mechanical drilling process, a wet etching process, and a method based on exposure and development using a photoresist and a mask.

Next, as shown in FIG. 11, a conductive metal cap layer 130 is formed on the mask film. Above the upper surface of 150, and over the upper surface of the plurality of conductive portions 120 exposed by the apertures 152.

Specifically, a conductive metal paste of a predetermined thickness is provided on the upper surface of the mask film 150 and the upper surface of the plurality of conductive portions 120 by using a printing method, followed by heating and drying the supplied conductive metal paste. Then, the conductive metal paste is hardened, so that the conductive metal layer 130 can be formed. At this time, for example, iron, nickel, chromium, gold, silver, copper, platinum, or an alloy thereof may be used as the conductive metal.

Alternatively, an aqueous solution of conductive metal nanoparticles of a predetermined thickness may be sprayed and provided on the upper surface of the cover film 150 and the upper surface of the plurality of conductive portions 120, followed by dry operation, thereby forming the conductive metal cover layer 130. At this time, the conductive metal nanoparticles preferably have an average particle diameter of about 10 nm to about 100 nm.

Finally, the cover film 150 is removed. Specifically, when the cover film 150 is removed from the upper surface of the insulating support portion 110, the cover layer 130 formed over the upper surface of the cover film 150 is removed together, and is left overlying the plurality of conductive portions 120. A conductive metal cap layer 130 over the upper surface. The conductive metal cap layer 130 formed in this manner has the same diameter as the conductive portion 120 or has a larger diameter than the conductive portion 120 depending on the hole 152 formed in the mask film 150.

Thus, the fabrication of the conductive connector 100 having the structure shown in FIG. 4 is completed.

12 and 13 are schematic views showing a method of manufacturing a conductive connector in accordance with another embodiment of the present invention shown in FIG.

Due to the conductive connector 200 according to another embodiment of the present invention, The manufacturing method is similar to the manufacturing method of the conductive connector 100 according to the embodiment of the present invention described above, and therefore the following description will focus on the difference between the foregoing method and the method described later.

First, as in the manner illustrated in FIGS. 8 and 9, a plurality of conductive portions 220 and an insulating support portion 210 are formed. At this time, as shown in FIG. 12, the conductive portion 220 protrudes from the upper surface of the insulating support portion 210 to form the protruding portion 222. The protruding portion 222 of the conductive portion 220 can be obtained by forming the magnetic material layer 422 of the upper mold 420 shown in FIGS. 8 and 9 to be recessed toward the upper magnetic material substrate 424 with respect to the non-magnetic material layer 421.

Next, the cover film 250 is attached to the upper surface of the insulating support portion 210. A plurality of holes 252 are formed in the cover film 250, and the protruding portions 222 of the plurality of conductive portions 220 are exposed by the plurality of holes 252. The diameter of the plurality of holes 252 may be formed to be equal to or larger than the diameter of the protruding portion 222 of the conductive portion 220. Since the material of the mask film 250 and the method of forming the hole 252 are the same as those described in the foregoing embodiment, a detailed description thereof will be omitted.

Next, as shown in FIG. 13, a conductive metal cap layer 230 is formed over the upper surface of the mask film 250, and over the upper surface of the plurality of conductive portions 220 exposed by the holes 252. At this time, the cover layer 230 may also be formed on the side surface of the protruding portion 222. The method of forming the conductive metal cap layer 230 is the same as described in the previous embodiment.

Finally, the cover film 250 is removed from the upper surface of the insulating support portion 210, thereby removing the cover layer 230 formed over the upper surface of the cover film 250. So leave A conductive metal cap layer 230 overlying the upper surface and the side surface of the protruding portion 222 of the plurality of conductive portions 220.

Thus, the fabrication of the conductive connector 200 having the structure shown in FIG. 6 is completed.

14 and 15 are schematic views showing a method of manufacturing a conductive connector in accordance with still another embodiment of the present invention shown in FIG.

Since the conductive connector 300 according to still another embodiment of the present invention is manufactured in a manner similar to the above-described manufacturing method of the conductive connector 200 according to another embodiment of the present invention, the following description will focus on the foregoing method and the following description. The difference in the method.

First, referring to FIG. 14, in the same manner as described above, a plurality of conductive portions 320 including the protruding portions 322 and insulating support portions 310 are formed.

Further, a guide film 340 is attached to the upper surface of the insulating support portion 310, which is formed with a plurality of holes 342 into which the protruding portion 322 of the conductive portion 320 can be inserted. Here, the guide film 340 may have the same height as the protruding portion 322, and the diameter of the plurality of holes 342 may be formed to be larger than the diameter of the protruding portion 322 of the conductive portion 320.

Next, the mask film 350 is attached to the upper surface of the guide film 340. A plurality of holes 352 are formed in the cover film 350, and the protruding portions 322 of the plurality of conductive portions 320 are exposed by the plurality of holes 352. The diameter of the plurality of holes 352 may be formed to be equivalent to the diameter of the hole 342 of the guide film 340. In other words, the diameter of the plurality of holes 352 may be formed to be equal to or larger than the diameter of the protruding portion 322 of the conductive portion 320. Cover film The material of 350 and the method of forming the hole 352 are the same as those described in the foregoing embodiment, and thus a detailed description thereof will be omitted.

Next, as shown in FIG. 15, a conductive metal cap layer 330 is formed over the upper surface of the mask film 350, and over the upper surface of the plurality of conductive portions 320 exposed by the holes 352. At this time, the cover layer 330 may also be formed on the side surface of the protruding portion 322. The method of forming the conductive metal cap layer 330 is the same as described in the foregoing embodiments.

Finally, the cover film 350 is removed from the upper surface of the guide film 340, thereby removing the cover layer 330 formed on the upper surface of the cover film 350. Therefore, the conductive metal cap layer 330 overlying the upper surface and the side surface of the protruding portion 322 of the plurality of conductive portions 320 is left.

Thereby, the fabrication of the conductive connector 300 having the structure shown in FIG. 7 is completed.

Based on the above, in accordance with one or more embodiments of the foregoing invention, in the conductive connector, a conductive metal cap layer is formed over the upper surface of the conductive portion, thereby increasing its contact area with the terminal of the test target device. Therefore, the electrical contact resistance between the terminals of the test target device and the conductive portion is reduced, and the electrical connection is stabilized. Therefore, the reliability of the conductive connector can be improved, and the ability to test the high quality product of the target device can be discriminated.

In addition, since the upper surface of the conductive portion is covered with a harder covering layer than the conductive portion, abrasion and damage caused by direct contact between the conductive portion and the terminal of the test target device can be prevented, and the foreign material can also be prevented. Causing conduction Part of the pollution or damage. Therefore, the life of the conductive connector can be extended.

It is understood that the exemplary embodiments described herein are to be understood as illustrative only and not limiting. The features and aspects described in each embodiment are generally understood to be applicable to other similar features or aspects in other embodiments.

Although one or more embodiments of the present invention are described with reference to the drawings, it will be understood by those of ordinary skill in the art that, without departing from the spirit of the invention, Make changes in various forms and details.

100‧‧‧Electrical connector

110‧‧‧Insulation support

120‧‧‧Electrical part

120a‧‧‧ conductive particles

130‧‧‧ Coverage

20‧‧‧Test target device

22‧‧‧ Terminal

30‧‧‧Testing device

32‧‧‧ solder pads

Claims (15)

a conductive connector disposed between the test target device and the test device, and electrically connecting the terminal of the test target device and the solder pads of the test device to each other, the conductive connector comprising: a plurality of conductive portions, setting And corresponding to the position of the terminal of the test target device, and formed by an elastic material in which the conductive particles are arranged in a vertical direction; and an insulating support portion that makes the plurality of conductive materials when supporting the plurality of conductive portions Partially insulated from each other; and a conductive metal coating layer formed over the upper surface of the plurality of conductive portions, wherein the plurality of conductive portions are formed to protrude upward from an upper surface of the insulating support portion, and the conductive metal A cover layer is formed over the upper surface and the side surface of the protruding portion of the plurality of conductive portions. The conductive connector of claim 1, wherein the conductive metal cover layer is formed to have a larger diameter than the plurality of conductive portions. The conductive connector of claim 1, further comprising a guiding film attached to the upper surface of the insulating support portion and guiding the terminal of the test target device to the plurality of conductive portions a center in which a plurality of holes are formed in the guide film, and the protruding portions of the plurality of conductive portions are inserted therein. The conductive connector of claim 1 or 3, wherein The conductive metal cap layer has a thickness of from about 0.1 μm to about 10 μm. The conductive connector of claim 1 or 3, wherein the conductive metal of the conductive metal cover layer comprises a group of at least iron, nickel, chromium, gold, silver, copper, platinum, and alloys thereof. Choose one of them. The conductive connector of claim 1 or 3, wherein the conductive metal coating layer is formed of conductive metal nanoparticles. The conductive connector of claim 6, wherein the conductive metal nanoparticles have an average particle diameter of from about 10 nm to about 100 nm. A method of manufacturing a conductive connector according to claim 1, wherein the method comprises: injecting a molding material made of a liquid elastomer including conductive particles into a molding space of a model; The molding material in the molding space applies a magnetic field in a vertical direction to align the conductive particles in a vertical direction; forming the plurality of conductive portions and the insulating support portion by hardening the molding material And forming the conductive metal cap layer over the upper surface of the plurality of conductive portions, wherein the forming the conductive metal cap layer comprises: attaching a mask film, wherein forming the plurality of conductive portions is exposed a hole in an upper surface of the insulating support portion; forming the conductive metal cover layer on an upper surface of the cover film, and the upper surface of the plurality of conductive portions exposed by the hole Above; and Removing the cover film from the upper surface of the insulating support portion to remove the conductive metal cover layer formed over the upper surface of the cover film, wherein the plurality of conductive portions are formed The upper surface of the insulating support portion is protruded upward, and the conductive metal cover layer is formed on the upper surface and the side surface of the protruding portion of the plurality of conductive portions. The method of claim 8, wherein the conductive metal cover layer is formed to have a larger diameter than the plurality of conductive portions. The method of claim 8, further comprising attaching a guiding film to the upper surface of the insulating support portion to guide the terminal of the test target device to a center of the plurality of conductive portions Wherein a plurality of holes are formed in the guiding film, wherein the protruding portions of the plurality of conductive portions are inserted therein. The method of claim 8, wherein the holes formed in the cover film have a diameter greater than or equal to the plurality of conductive portions. The method of claim 8, wherein the cover film comprises polyimide (PI), polyethylene terephthalate (PET), triacetate cellulous. , TAC), ethylene vinyl acetate (EVA), polypropylene (PP), or polycarbonate (PC), thin copper, thin aluminum, and thin stainless steel One of the materials of the group formed is formed. The method of claim 8, wherein the conductive metal The layer is formed to have a thickness of about 0.1 μm to about 10 μm. The method of claim 8, wherein the forming the conductive metal cover layer comprises providing the conductive metal paste to the upper surface of the cover film according to a printing method, and the plurality of conductive Part of the upper surface to form the conductive metal cover layer, followed by drying the provided conductive metal paste. The method of claim 8, wherein the forming the conductive metal coating layer comprises providing the aqueous solution to the upper surface of the cover film by spraying an aqueous solution of conductive metal nanoparticles, and The upper surface of the conductive portion is then dried to provide the aqueous solution to form the conductive metal cap layer.