KR101573450B1 - Test socket - Google Patents

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Publication number
KR101573450B1
KR101573450B1 KR1020140090346A KR20140090346A KR101573450B1 KR 101573450 B1 KR101573450 B1 KR 101573450B1 KR 1020140090346 A KR1020140090346 A KR 1020140090346A KR 20140090346 A KR20140090346 A KR 20140090346A KR 101573450 B1 KR101573450 B1 KR 101573450B1
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KR
South Korea
Prior art keywords
conductive
insulating
conductive particles
elastic
support sheet
Prior art date
Application number
KR1020140090346A
Other languages
Korean (ko)
Inventor
정영배
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to KR1020140090346A priority Critical patent/KR101573450B1/en
Priority to TW104123001A priority patent/TWI555984B/en
Priority to PCT/KR2015/007408 priority patent/WO2016010383A1/en
Application granted granted Critical
Publication of KR101573450B1 publication Critical patent/KR101573450B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/20Connectors or connections adapted for particular applications for testing or measuring purposes

Abstract

The present invention relates to a test socket and, more particularly, relates to a test socket to electrically connect a terminal of a tested device and a pad of an inspection device by being arranged between the tested device and the inspection device. The test socket comprises: a support sheet, made of an insulating material, which has a penetration hole in every position corresponding to the terminal of the tested device; an insertion unit including a first conductive unit which is arranged a plurality of conductive particles inside an insulating and elastic material in a thickness direction, and is arranged inside the penetration hole of the support sheet, and an elastic and insulating unit, made of an insulating and elastic material to surround the first conductive unit, which is arranged between the first conductive unit and an inner wall of the penetration hole; and an anisotropic sheet including a second conductive unit which is arranged on the lower part of the first conductive unit and in which a plurality of second conductive particles inside the insulating and elastic material is arranged in a thickness direction, and an insulating support unit which is arranged on the lower part of the support sheet to support and insulate the second conductive.

Description

Test socket {Test socket}

The present invention relates to a test socket, and more particularly, to a test socket capable of minimizing damage to a terminal of a device to be inspected and increasing the thickness of the entire test socket while improving the resistance characteristic .

Generally, in order to inspect the electrical characteristics of a device to be inspected, the electrical connection between the device to be inspected and the testing device must be stable. A test socket is usually used as a device for connecting a device to be tested with a test apparatus.

The role of such a test socket is to connect the terminals of the device under test and the pads of the test device to each other so that electrical signals can be exchanged in both directions. To this end, the contact means used in the interior of the test socket or an elastic conductive sheet or pogo pin is used. The elastic conductive sheet is configured to connect a conductive part having elasticity to a terminal of the device to be inspected. The pogo pin is provided with a spring inside to facilitate connection between the device under test and the testing device. It is used in most test sockets because it can buffer shocks.

1, a test socket 20 is formed of a conductive silicon (Si) formed in a region where a ball lead 4 of a BGA (Ball Grid Array) semiconductor device 2 is contacted, And an insulating silicon part 6 formed in a region where the terminal 4 of the semiconductor element 2 does not contact to support the conductive silicon part 8 and serve as an insulating layer. An upper surface of the conductive silicon part 8 for electrically connecting the contact pad 10 of the socket board 12 and the lead terminal 4 of the semiconductor element 2 for performing the test of the semiconductor element 2 Type conductive ring 7 is mounted.

Such a test socket is effective for electrical inspection for pressing several semiconductor elements to make electrical contact. In particular, since each of the conductive silicon parts is pressed independently, it is easy to cope with the flatness of the peripheral device, . Further, the conductive silicon part in the metal ring is prevented from spreading when pressed by the lead terminal of the semiconductor element, and the displacement is minimized, so that the life of the contactor is prolonged.

The test socket of Fig. 2, which is disclosed as another example of the prior art, electrically connects the contact pad 10 of the socket board 12 and the lead terminal 4 of the semiconductor element 2, A structure for mounting the conductor (22) on the upper and lower surfaces of the conductive silicon part (8) to be connected by plating, etching, coating or the like is disclosed.

However, in the above-described technique, since the "rigid" conductor 22 is mounted on the upper and lower end surfaces of the completed conductive silicon part by plating, etching, coating or the like, . Accordingly, the advantages of integrated silicon contactors intended to resiliently contact terminals of semiconductor devices and pads such as test boards are reduced, and the plating, etch, coated surface, and / The pad of the board is damaged, and foreign matter is caught in the pad.

To solve this problem, a test socket as disclosed in Fig. 3 is disclosed. The test socket is formed in a region where the ball lead 4 of the BGA semiconductor device 2 is in contact, and includes a conductive silicon part 8 in which conductive metal powder is mixed with silicon; Discloses an insulating silicon part 6 which is formed in a region where the lead terminal 4 of the semiconductor element 2 does not contact so as to support the conductive silicon part 8 and serves as an insulating layer. At this time, the conductive reinforcing layer 30 having a higher density than the conductive powder density of the conductive silicon part 8 is formed on the conductive silicon part 8. The test socket disclosed in Fig. 3 has an effect of improving the conductivity.

However, the above conventional techniques have the following problems.

3, the conductive layer 30 is formed on the conductive silicon part 8. However, in the case of such a conductive layer, the thickness of the conductive layer is limited. The reason for this is that in the case of the conductive reinforcing layer, the conductive powder is arranged at a high density. When the conductive powder is arranged at a high density, the amount of materials such as silicone rubber, which functions to maintain the shape of the conductive powder, It can not be helped. When the amount of the silicone rubber is reduced as described above, if the thickness of the conductive reinforcing layer is increased, the conductive reinforcing layer can not easily maintain its shape.

If the thickness of the conductive reinforcing layer can not be increased, the pressing force applied from the ball lead of the semiconductor device may be lowered.

In addition, when conductive particles are formed in the conductive reinforcing layer at a high density, the amount of the silicone rubber becomes small, so that the conductive particles can not be filled more than a certain amount.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a test socket in which an elastic insulating portion is disposed between a first conductive portion disposed on an anisotropic conductive sheet and an inner wall of a through- The purpose.

In order to achieve the above object, the present invention provides a test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device, the socket being disposed between an inspecting device and an inspecting device,

A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;

A first conductive part disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material; a second conductive part disposed between the first conductive part and the inner wall of the through hole, An inserting portion surrounding the conductive portion and including an elastic insulating portion made of an insulating elastic material; And

A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a thickness direction in an insulating elastic material for each position corresponding to the through hole; And an insulating support portion for insulating each second conductive portion while supporting the portion.

In the test socket,

It is preferable that the first conductive particles are not present in the elastic insulation portion.

In the test socket,

The elastic insulating portion may contain the first conductive particles in a volume fraction of 10% or less.

In the test socket,

The elastic insulation portion may be integrally coupled to the first conductive portion and the support sheet.

In the test socket,

The elastic insulation portion may be more resilient than the first conductive portion and the support sheet.

In the test socket,

The first conductive particles may be disposed at a higher density than the second conductive particles.

In the test socket,

The support sheet may be made of a harder material than the insulating paper.

In the test socket,

The through hole of the support sheet may be reduced in diameter from the upper end to the lower end.

According to an aspect of the present invention,

A test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device to each other, the socket being disposed between an inspected device and an inspecting device,

A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;

A first conductive portion disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material and having an outer diameter smaller than an inner diameter of the through hole; And

A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a lower density than the first conductive particles in the insulating elastic material at positions corresponding to the through holes; And an insulating sheet portion for insulating the second conductive portions while supporting the second conductive portions.

In the test socket,

Wherein the insulating support portion includes an upper insulating support portion and a lower insulating support portion disposed below the upper insulating support portion,

The upper insulating support portion and the lower insulating support portion may have different hardness from each other.

In the test socket,

The upper insulating support part may be made of a material softer than the lower insulating support part.

Wherein the second conductive portion comprises a second upper conductive pattern and a second lower conductive pattern disposed below the second upper conductive pattern,

The content of the second conductive particles in the second upper conductive pattern may be different from the content of the second conductive particles in the second lower conductive pattern.

In the test socket,

And the second conductive particles of the second upper conductive path may be arranged at a lower density than the second conductive particles of the second lower conductive path.

The test socket of the present invention has an advantage that it can be improved in high current and resistance characteristics by improving the density of the conductive portion.

In addition, the test socket of the present invention has an advantage that the thickness of the first conductive part in which the conductive particles are arranged at high density due to the elastic insulating part can be increased.

Further, the test socket of the present invention can increase the size of the through hole of the support sheet regardless of the outer diameter of the first conductive portion, so that the terminal of the device to be inspected contacts the support sheet, There is an advantage to be able to do.

In addition, the test socket of the present invention has an advantage that the pressing force can be adjusted within a certain range by changing the hardness of the insulating paper.

Figures 1 to 3 show a socket for testing according to the prior art.
4 shows a socket for testing according to an embodiment of the invention.
5 is an operational view of Fig.
6 is a view showing a case where the device to be tested is not placed in the correct position of the test socket in Fig.
7 shows a socket for testing according to another embodiment of the present invention.
8 shows a socket for testing according to another embodiment of the present invention.

Hereinafter, a test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The test socket 100 according to the present invention is disposed between an inspected device 140 and an inspection device 150 and is provided with a terminal 141 of the inspected device 140 and a pad 151 of the inspection device 150, To each other. The test socket 100 includes a support sheet 110, an inserting portion 120, and an anisotropic sheet 130.

The supporting sheet 110 is formed of an insulating material and has through holes 111 formed at positions corresponding to the terminals 141 of the device under test 140. The support sheet 110 may be attached to the upper surface side of the anisotropic sheet 130. Specifically, the support sheet 110 is integrally attached to the insulating support portion 132 of the anisotropic sheet 130. The support sheet 110 performs the function of supporting the insertion portion 120, which will be described later.

The support sheet 110 is preferably made of a material having excellent elasticity and restoring force, but various materials can be selected according to requirements such as heat resistance, insulation, and the like. For example, silicon, urethane or other elastic material may be used in consideration of the elasticity and the restoring force. Synthetic resin materials such as polyimide (PI), polycarbonate (PC), polypropylene (PP), polyester (PET) and polymethylmethacrylate (PMMA) may be used in consideration of heat resistance and insulation. In particular, the support sheet 110 may be made of a material harder than the insulating sheet 132 of the anisotropic sheet 130 to protect the insulating sheet 132.

Also, the through holes 111 of the support sheet 110 may be formed by a laser, but not limited thereto, and may be formed by mechanical processing.

The insertion portion 120 is inserted into the through hole 111 of the support sheet 110 and includes a first conductive portion 121 and an elastic insulation portion 122.

The first conductive part 121 is disposed in the through hole 111 of the support sheet 110 and a plurality of first conductive particles 1211 are disposed in the insulating elastic material in the thickness direction. The outer diameter of the first conductive portion 121 may be smaller than the inner diameter of the through hole 111. [ For example, the outer diameter of the first conductive portion 121 is preferably 0.9 times or less, more preferably 0.85 times or less the inner diameter of the through-hole 111. When the outer diameter of the first conductive portion 121 is smaller than the inner diameter of the through hole 111 as described above, the terminal 141 of the device under test 140 is not positioned at the center of the first conductive portion 121, The terminal 141 of the device 140 to be inspected does not directly contact the supporting sheet 110 and the surface of the terminal 141 of the device 140 to be inspected Less damage is done. Even when the support sheet 110 is made of a relatively hard material such as polyimide, the terminals 141 of the device under test 140 are less likely to contact the support sheet 110 directly.

As the elastic material for forming the first conductive part 121, a heat-resistant polymer material having a crosslinked structure is preferable. As the curable polymeric substance-forming material that can be used to obtain such a crosslinked polymeric substance, various ones can be used, but liquid silicone rubber is preferable. The liquid silicone rubber may be of an addition type or a condensation type, but an addition type liquid silicone rubber is preferable. In the case where the first conductive portion 121 is formed of a liquid silicone rubber cured product (hereinafter referred to as " silicone rubber cured product "), the silicone cured product has a compression set of 10 Or less, more preferably 8% or less, further preferably 6% or less. In the case where the compression set is more than 10%, when the first conductive portion 121 that can be obtained is repeatedly used under a high-temperature environment, the chain of the conductive particles in the first conductive portion 121 is disturbed As a result, it becomes difficult to maintain required conductivity.

It is preferable that the first conductive particles 1211 in the first conductive part 121 are arranged at a higher density than the second conductive particles 1311 in the second conductive part 131. [

As the first conductive particles 1211 in the first conductive portion 121, it is preferable to use core particles (hereinafter referred to as " high conductive metal ") coated with a high-conductive metal. is the conductivity of the 0 ℃ say not less than 5 × 10 6 Ω / m. the magnetic core particles for obtaining the conductive particles (P) is preferably the number average particle diameter of 3 to 40 ㎛. here, the magnetic The number average particle diameter of the core particles is measured by a laser diffraction scattering method. As the material constituting the magnetic core particles, iron, nickel, cobalt, those obtained by coating these metals with copper or resin can be used. The saturation magnetization is preferably 0.1 ㏝ / m 2 or more, more preferably 0.3 ㏝ / m 2 or more, and particularly preferably 0.5 ㏝ / m 2 or more. Specifically, iron, nickel, Or it may be an alloy of them.

Gold, silver, rhodium, platinum, chromium and the like can be used as the high-conductive metal to be coated on the surface of the magnetic core particles. Among them, gold is preferably used because it is chemically stable and has high conductivity.

The elastic insulation part 122 is disposed between the first conductive part 121 and the inner wall of the through hole 111 of the support sheet 110 and surrounds the first conductive part 121. It is preferable that the elastic insulation part 122 is integrally coupled to the first conductive part 121 and the support sheet 110. However, the elastic insulation part 122 is not limited thereto and may be spaced at a certain interval. The elastic insulating part 122 is preferably made of an insulating elastic material and is more elastic than the first conductive part 121 and the supporting sheet 110. The first conductive portion 121 may be made of a relatively soft material such as silicone rubber or urethane. The elastic insulation part 122 functions to connect the first conductive part 121 which exhibits conductivity to the support sheet 110. Since the first insulation part 122 is made of a relatively soft material, So that the support sheet 110 can be relatively moved up and down relative to the support sheet 110. That is, it is possible to perform the function of increasing the individual operation of the first conductive parts 121. It is preferable that the first conductive particles 1211 are not present at all in the elastic insulation portion 122, but the present invention is not limited thereto. The fact that the first conductive particles 1211 are distributed in a small amount in a volume fraction of 10% It is acceptable.

Since the elastic insulating portion 122 is disposed between the inner wall of the through hole 111 of the support sheet 110 and the first conductive portion 121, In addition, since the hole size of the through hole 111 can be increased in the manufacturing method, the surface damage of the terminal 141 of the inspected device 140 can be improved.

The anisotropic sheet 130 is disposed on the lower side of the first conductive portion 121 and a plurality of second conductive particles 1311 are arranged in the thickness direction in the insulating elastic material at positions corresponding to the through holes 111 And an insulating support portion 132 disposed below the support sheet 110 and insulating the second conductive portions 131 while supporting the second conductive portions 131 do.

Since the insulating elastic material in the second conductive part 131 may be the same or similar to the insulating elastic material of the first conductive part 121, a detailed description thereof will be omitted. The material of the second conductive particles 1311 of the second conductive part 131 may be the same as or similar to the material of the first conductive particles 1211, and thus a detailed description thereof will be omitted. It is preferable that the second conductive particles 1311 have an average particle diameter larger than that of the first conductive particles 1211 and that the ratio of the second conductive particles 1311 per unit area in the second conductive portions 131 is larger than that of the first conductive particles 1211, 1 < / RTI > That is, the second conductive particles 1311 are preferably disposed at a lower density than the first conductive particles 1211.

The insulating support part 132 is formed of the same material as the insulating elastic material of the second conductive part 131 to insulate the second conductive part 131 while supporting the second conductive part 131 But it is needless to say that other materials may be used. For example, it is also possible that a material having an elasticity higher than that of the insulating elastic material constituting the second conductive portion 131 is used as the insulating support portion 132.

The test socket 100 according to the embodiment of the present invention has the following operational effects.

4, in a state where the test socket 100 is mounted on the inspection apparatus 150, the inspected device 140 transferred by a predetermined transfer means (not shown) is inserted into the test socket 150 100). The inspected device 140 is lowered so that the terminal 141 of the inspected device 140 is brought into contact with the first conductive portion 121 as shown in FIG. When the inspected device 140 in contact with the third conductive part is further pressed downward, the terminal 141 of the inspected device 140 contacts the first conductive part 121 and the second conductive part 131 By compressing in the thickness direction, the conductive particles in the first and second conductive parts are brought into contact with each other such that the first and second conductive parts are electrically conductive. When a predetermined electrical signal is applied from the inspection apparatus 150, the electrical signal is transmitted to the device under test 140 through the first conductive unit 121 and the second conductive unit 131, The electrical inspection is carried out.

6 shows a case where the terminal 141 of the device under test 140 is not disposed at the center of the top surface of the first conductive portion 121 but is located at a position slightly deviated from the center of the top surface. The terminal 141 of the device under test 140 is electrically connected to the supporting sheet (not shown) even when the terminal 141 of the device 140 to be inspected is placed at a position slightly deviated from the center of the first conductive part 121 The surface of the terminal 141 is minimized by contacting the elastic insulation portion 122 without directly contacting the terminal 141. [ For example, when the supporting sheet 110 is made of a relatively hard material such as polyimide in consideration of heat resistance, when the surface of the terminal 141 is in contact with the inner circumferential surface (in particular, the edge portion) of the through- The hole 111 may be scratched by the through hole 111 to cause surface damage (scratch). However, in the present invention, since the elastic insulation portion 122 is relatively soft between the through hole 111 and the first conductive portion 121, surface damage of the terminal 141 can be minimized.

When the height of the terminals 141 of the inspected device 140 is different from the height of the terminals 141 of the inspected device 140 in the related art, The first conductive parts 121 may not contact each other. However, in the present invention, since the elastic insulating part 122 is disposed between the first conductive part 121 and the support sheet 110, the first conductive part 121 can move up and down relative to the support sheet 110 .

In the present invention, it is also possible to increase the thickness of the first conductive portion 121. For example, the first conductive parts 121 are distributed in a high density with the first conductive particles 1211, so that the amount of the insulating elastic material that maintains the shape of the first conductive particles 1211 is small, The elastic insulation part 122 tightly surrounds the first conductive part 121 around the first conductive part 121 so that the first conductive part 121 Can be made sufficiently thick. As a result, high current and resistance characteristics can be expected to be improved.

The test socket according to an embodiment of the present invention may be modified as shown in FIGS. 7 and 8. FIG.

In the embodiments of FIGS. 4 to 6, the insulating support portion is made of the same insulating elastic material. However, the present invention is not limited to this, and it is also possible to have a plurality of layers having different characteristics. 7, the insulating support part 232 includes an upper insulating support part 2321 and a lower insulating support part 2322 disposed below the upper insulating support part 2321, The insulating support portion 2321 and the lower insulating support portion 2322 may have different hardness from each other. For example, the upper insulating support portion may be made of a material that is softer than the lower insulating support portion. As described above, the pressing force applied to the test socket can be changed as the layer of the insulating sheet portion of the socket has different characteristics.

4 to 6, the density of the conductive particles in the second conductive portion is maintained to be the same. However, the present invention is not limited to this, and the second conductive portion 331 may be formed as shown in FIG. Of the second upper conductive part 3311 is composed of a second upper conductive part 3311 and a second lower conductive part 3312 disposed below the second upper conductive part 3311, The content of the conductive particles and the content of the second conductive particles in the second lower conductive pattern 3312 may be different from each other. In particular, the second conductive particles of the second upper conductive layer 3311 may be disposed at a lower density than the second conductive particles of the second lower conductive layer 3312. As such, the second conductive part is divided into a plurality of layers having different densities, thereby improving the overall characteristics of the test socket.

Although the through holes of the support sheet have the same upper and lower diameters in the above embodiment, the present invention is not limited thereto. The through holes of the support sheet may be reduced in diameter from the upper end to the lower end. 9, the inner diameter of the through hole 411 of the support sheet 410 can be reduced from the upper end to the lower end. According to this configuration, there is an advantage that the damage of the terminal surface of the device to be inspected which contacts the upper end of the through hole 411 of the support sheet 410 can be minimized.

While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

100 ... test socket 110 ... support sheet
111 ... through hole 120 ... insertion portion
121 ... first conductive part 1211 ... first conductive particle
122 ... elastic insulation part 130 ... anisotropic sheet
131 ... second conductive portion 1311 ... second conductive particle
132 ... insulation paper part 140 ... inspected device
141 ... Terminal 150 ... Inspection device
151 ... pad

Claims (13)

A test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device to each other, the socket being disposed between an inspected device and an inspecting device,
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive part disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material; a second conductive part disposed between the first conductive part and the inner wall of the through hole, An inserting portion surrounding the conductive portion and including an elastic insulating portion made of an insulating elastic material; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a thickness direction in an insulating elastic material for each position corresponding to the through hole; And an insulating sheet portion for insulating each of the second conductive portions while supporting the first and second conductive portions,
Wherein the elastic insulating portion is more resilient than the first conductive portion and the support sheet.
The method according to claim 1,
And the first conductive particles are not present in the elastic insulation portion.
The method according to claim 1,
Wherein the elastic insulating portion contains the first conductive particles in a volume fraction of 10% or less.
The method according to claim 1,
Wherein the elastic insulating portion is integrally coupled to the first conductive portion and the support sheet.
delete The method according to claim 1,
Wherein the first conductive particles are disposed at a higher density than the second conductive particles.
The method according to claim 1,
Wherein the support sheet is made of a material harder than the insulating paper.
The method according to claim 1,
Wherein the through hole of the support sheet is reduced in diameter from the upper end to the lower end.
A test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device to each other, the socket being disposed between an inspected device and an inspecting device,
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive portion disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material and having an outer diameter smaller than an inner diameter of the through hole; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a lower density than the first conductive particles in the insulating elastic material at positions corresponding to the through holes; And an insulating sheet portion for insulating the second conductive portions while supporting the second conductive portions,
Wherein the insulating support portion includes an upper insulating support portion and a lower insulating support portion disposed below the upper insulating support portion,
Wherein the upper insulating support portion and the lower insulating support portion have different hardness from each other.
delete 10. The method of claim 9,
Wherein the upper insulating support portion is made of a material softer than the lower insulating support portion.
10. The method of claim 9,
Wherein the second conductive portion comprises a second upper conductive pattern and a second lower conductive pattern disposed below the second upper conductive pattern,
Wherein the content of the second conductive particles in the second upper conductive pattern and the content of the second conductive particles in the second lower conductive pattern are different from each other.
13. The method of claim 12,
And the second conductive particles of the second upper conductive path are disposed at a lower density than the second conductive particles of the second lower conductive path.
KR1020140090346A 2014-07-17 2014-07-17 Test socket KR101573450B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020140090346A KR101573450B1 (en) 2014-07-17 2014-07-17 Test socket
TW104123001A TWI555984B (en) 2014-07-17 2015-07-16 Test socket
PCT/KR2015/007408 WO2016010383A1 (en) 2014-07-17 2015-07-16 Test socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140090346A KR101573450B1 (en) 2014-07-17 2014-07-17 Test socket

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Publication Number Publication Date
KR101573450B1 true KR101573450B1 (en) 2015-12-11

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KR1020140090346A KR101573450B1 (en) 2014-07-17 2014-07-17 Test socket

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KR101823006B1 (en) * 2016-08-01 2018-01-31 (주)티에스이 Semiconductor test socket and manufacturing method there of
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KR20200057579A (en) * 2018-11-15 2020-05-26 주식회사 이노글로벌 Elastically contactable by-directional electrically conductive module
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