KR101573450B1 - Test socket - Google Patents
Test socket Download PDFInfo
- Publication number
- KR101573450B1 KR101573450B1 KR1020140090346A KR20140090346A KR101573450B1 KR 101573450 B1 KR101573450 B1 KR 101573450B1 KR 1020140090346 A KR1020140090346 A KR 1020140090346A KR 20140090346 A KR20140090346 A KR 20140090346A KR 101573450 B1 KR101573450 B1 KR 101573450B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- insulating
- conductive particles
- elastic
- support sheet
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Abstract
Description
The present invention relates to a test socket, and more particularly, to a test socket capable of minimizing damage to a terminal of a device to be inspected and increasing the thickness of the entire test socket while improving the resistance characteristic .
Generally, in order to inspect the electrical characteristics of a device to be inspected, the electrical connection between the device to be inspected and the testing device must be stable. A test socket is usually used as a device for connecting a device to be tested with a test apparatus.
The role of such a test socket is to connect the terminals of the device under test and the pads of the test device to each other so that electrical signals can be exchanged in both directions. To this end, the contact means used in the interior of the test socket or an elastic conductive sheet or pogo pin is used. The elastic conductive sheet is configured to connect a conductive part having elasticity to a terminal of the device to be inspected. The pogo pin is provided with a spring inside to facilitate connection between the device under test and the testing device. It is used in most test sockets because it can buffer shocks.
1, a
Such a test socket is effective for electrical inspection for pressing several semiconductor elements to make electrical contact. In particular, since each of the conductive silicon parts is pressed independently, it is easy to cope with the flatness of the peripheral device, . Further, the conductive silicon part in the metal ring is prevented from spreading when pressed by the lead terminal of the semiconductor element, and the displacement is minimized, so that the life of the contactor is prolonged.
The test socket of Fig. 2, which is disclosed as another example of the prior art, electrically connects the
However, in the above-described technique, since the "rigid"
To solve this problem, a test socket as disclosed in Fig. 3 is disclosed. The test socket is formed in a region where the
However, the above conventional techniques have the following problems.
3, the
If the thickness of the conductive reinforcing layer can not be increased, the pressing force applied from the ball lead of the semiconductor device may be lowered.
In addition, when conductive particles are formed in the conductive reinforcing layer at a high density, the amount of the silicone rubber becomes small, so that the conductive particles can not be filled more than a certain amount.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a test socket in which an elastic insulating portion is disposed between a first conductive portion disposed on an anisotropic conductive sheet and an inner wall of a through- The purpose.
In order to achieve the above object, the present invention provides a test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device, the socket being disposed between an inspecting device and an inspecting device,
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive part disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material; a second conductive part disposed between the first conductive part and the inner wall of the through hole, An inserting portion surrounding the conductive portion and including an elastic insulating portion made of an insulating elastic material; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a thickness direction in an insulating elastic material for each position corresponding to the through hole; And an insulating support portion for insulating each second conductive portion while supporting the portion.
In the test socket,
It is preferable that the first conductive particles are not present in the elastic insulation portion.
In the test socket,
The elastic insulating portion may contain the first conductive particles in a volume fraction of 10% or less.
In the test socket,
The elastic insulation portion may be integrally coupled to the first conductive portion and the support sheet.
In the test socket,
The elastic insulation portion may be more resilient than the first conductive portion and the support sheet.
In the test socket,
The first conductive particles may be disposed at a higher density than the second conductive particles.
In the test socket,
The support sheet may be made of a harder material than the insulating paper.
In the test socket,
The through hole of the support sheet may be reduced in diameter from the upper end to the lower end.
According to an aspect of the present invention,
A test socket for electrically connecting a terminal of a device to be inspected and a pad of an inspecting device to each other, the socket being disposed between an inspected device and an inspecting device,
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive portion disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material and having an outer diameter smaller than an inner diameter of the through hole; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a lower density than the first conductive particles in the insulating elastic material at positions corresponding to the through holes; And an insulating sheet portion for insulating the second conductive portions while supporting the second conductive portions.
In the test socket,
Wherein the insulating support portion includes an upper insulating support portion and a lower insulating support portion disposed below the upper insulating support portion,
The upper insulating support portion and the lower insulating support portion may have different hardness from each other.
In the test socket,
The upper insulating support part may be made of a material softer than the lower insulating support part.
Wherein the second conductive portion comprises a second upper conductive pattern and a second lower conductive pattern disposed below the second upper conductive pattern,
The content of the second conductive particles in the second upper conductive pattern may be different from the content of the second conductive particles in the second lower conductive pattern.
In the test socket,
And the second conductive particles of the second upper conductive path may be arranged at a lower density than the second conductive particles of the second lower conductive path.
The test socket of the present invention has an advantage that it can be improved in high current and resistance characteristics by improving the density of the conductive portion.
In addition, the test socket of the present invention has an advantage that the thickness of the first conductive part in which the conductive particles are arranged at high density due to the elastic insulating part can be increased.
Further, the test socket of the present invention can increase the size of the through hole of the support sheet regardless of the outer diameter of the first conductive portion, so that the terminal of the device to be inspected contacts the support sheet, There is an advantage to be able to do.
In addition, the test socket of the present invention has an advantage that the pressing force can be adjusted within a certain range by changing the hardness of the insulating paper.
Figures 1 to 3 show a socket for testing according to the prior art.
4 shows a socket for testing according to an embodiment of the invention.
5 is an operational view of Fig.
6 is a view showing a case where the device to be tested is not placed in the correct position of the test socket in Fig.
7 shows a socket for testing according to another embodiment of the present invention.
8 shows a socket for testing according to another embodiment of the present invention.
Hereinafter, a test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
The
The supporting
The
Also, the through
The
The first
As the elastic material for forming the first
It is preferable that the first
As the first
Gold, silver, rhodium, platinum, chromium and the like can be used as the high-conductive metal to be coated on the surface of the magnetic core particles. Among them, gold is preferably used because it is chemically stable and has high conductivity.
The
Since the elastic insulating
The
Since the insulating elastic material in the second
The insulating
The
4, in a state where the
6 shows a case where the
When the height of the
In the present invention, it is also possible to increase the thickness of the first
The test socket according to an embodiment of the present invention may be modified as shown in FIGS. 7 and 8. FIG.
In the embodiments of FIGS. 4 to 6, the insulating support portion is made of the same insulating elastic material. However, the present invention is not limited to this, and it is also possible to have a plurality of layers having different characteristics. 7, the insulating
4 to 6, the density of the conductive particles in the second conductive portion is maintained to be the same. However, the present invention is not limited to this, and the second
Although the through holes of the support sheet have the same upper and lower diameters in the above embodiment, the present invention is not limited thereto. The through holes of the support sheet may be reduced in diameter from the upper end to the lower end. 9, the inner diameter of the through
While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.
100 ...
111 ... through
121 ... first
122 ...
131 ... second
132 ...
141 ...
151 ... pad
Claims (13)
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive part disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material; a second conductive part disposed between the first conductive part and the inner wall of the through hole, An inserting portion surrounding the conductive portion and including an elastic insulating portion made of an insulating elastic material; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a thickness direction in an insulating elastic material for each position corresponding to the through hole; And an insulating sheet portion for insulating each of the second conductive portions while supporting the first and second conductive portions,
Wherein the elastic insulating portion is more resilient than the first conductive portion and the support sheet.
And the first conductive particles are not present in the elastic insulation portion.
Wherein the elastic insulating portion contains the first conductive particles in a volume fraction of 10% or less.
Wherein the elastic insulating portion is integrally coupled to the first conductive portion and the support sheet.
Wherein the first conductive particles are disposed at a higher density than the second conductive particles.
Wherein the support sheet is made of a material harder than the insulating paper.
Wherein the through hole of the support sheet is reduced in diameter from the upper end to the lower end.
A support sheet formed of an insulating material and having a through hole formed at a position corresponding to a terminal of the device to be inspected;
A first conductive portion disposed in the through hole of the support sheet and having a plurality of first conductive particles arranged in a thickness direction in an insulating elastic material and having an outer diameter smaller than an inner diameter of the through hole; And
A second conductive part disposed below the first conductive part and having a plurality of second conductive particles arranged in a lower density than the first conductive particles in the insulating elastic material at positions corresponding to the through holes; And an insulating sheet portion for insulating the second conductive portions while supporting the second conductive portions,
Wherein the insulating support portion includes an upper insulating support portion and a lower insulating support portion disposed below the upper insulating support portion,
Wherein the upper insulating support portion and the lower insulating support portion have different hardness from each other.
Wherein the upper insulating support portion is made of a material softer than the lower insulating support portion.
Wherein the second conductive portion comprises a second upper conductive pattern and a second lower conductive pattern disposed below the second upper conductive pattern,
Wherein the content of the second conductive particles in the second upper conductive pattern and the content of the second conductive particles in the second lower conductive pattern are different from each other.
And the second conductive particles of the second upper conductive path are disposed at a lower density than the second conductive particles of the second lower conductive path.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140090346A KR101573450B1 (en) | 2014-07-17 | 2014-07-17 | Test socket |
TW104123001A TWI555984B (en) | 2014-07-17 | 2015-07-16 | Test socket |
PCT/KR2015/007408 WO2016010383A1 (en) | 2014-07-17 | 2015-07-16 | Test socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140090346A KR101573450B1 (en) | 2014-07-17 | 2014-07-17 | Test socket |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101573450B1 true KR101573450B1 (en) | 2015-12-11 |
Family
ID=55020653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140090346A KR101573450B1 (en) | 2014-07-17 | 2014-07-17 | Test socket |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101573450B1 (en) |
TW (1) | TWI555984B (en) |
WO (1) | WO2016010383A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101751269B1 (en) | 2016-05-13 | 2017-06-27 | 배준규 | rubber socket for semiconductor test, and manufacturing method of conductive pole for the same |
KR101823006B1 (en) * | 2016-08-01 | 2018-01-31 | (주)티에스이 | Semiconductor test socket and manufacturing method there of |
KR20180031106A (en) * | 2016-09-19 | 2018-03-28 | (주)티에스이 | Test socket for semiconductor |
KR20200057579A (en) * | 2018-11-15 | 2020-05-26 | 주식회사 이노글로벌 | Elastically contactable by-directional electrically conductive module |
KR20200115036A (en) * | 2019-03-25 | 2020-10-07 | 주식회사 아이에스시 | Electrical test socket |
KR20210149352A (en) * | 2020-06-02 | 2021-12-09 | (주)티에스이 | Test apparatus for semiconductor package |
KR102342480B1 (en) * | 2020-08-21 | 2021-12-23 | (주)티에스이 | Test socket and test apparatus having the same |
KR20230005530A (en) * | 2021-07-01 | 2023-01-10 | 주식회사 아이에스시 | Connector for electrical connection |
KR20230011637A (en) * | 2021-07-14 | 2023-01-25 | (주)티에스이 | Test socket, test apparatus having the same, and manufacturing method for the test socket |
WO2023229281A1 (en) * | 2022-05-24 | 2023-11-30 | 주식회사 아이에스시 | Test connector |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019027932A (en) * | 2017-07-31 | 2019-02-21 | 日東電工株式会社 | Substrate for inspection and substrate for inspection with conduction protection |
KR101985445B1 (en) * | 2018-07-25 | 2019-06-04 | 주식회사 아이에스시 | Conductive sheet for electrical test |
JP2020027723A (en) * | 2018-08-10 | 2020-02-20 | 信越ポリマー株式会社 | Manufacturing method of electrical connector |
JP2020027725A (en) * | 2018-08-10 | 2020-02-20 | 信越ポリマー株式会社 | Electric connector and manufacturing method thereof |
JP7258488B2 (en) * | 2018-08-10 | 2023-04-17 | 信越ポリマー株式会社 | Electrical connector and manufacturing method thereof |
KR102148330B1 (en) * | 2018-11-13 | 2020-08-26 | 주식회사 아이에스시 | Connector for electrical connection |
KR102127229B1 (en) * | 2018-11-27 | 2020-06-29 | 주식회사 아이에스시 | Connector for electrical connection |
KR102211358B1 (en) * | 2020-03-19 | 2021-02-03 | (주)티에스이 | Test socket and test apparatus having the same, manufacturing method for the test socket |
KR102179457B1 (en) * | 2020-03-25 | 2020-11-16 | (주)티에스이 | Test socket and test apparatus having the same, manufacturing method for the test socket |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008059895A (en) * | 2006-08-31 | 2008-03-13 | Masashi Okuma | Contact sheet and its manufacturing method, and cable and elastic member for forming contact sheet |
KR101266124B1 (en) * | 2012-04-03 | 2013-05-27 | 주식회사 아이에스시 | Test socket with high density conduction section and fabrication method thereof |
KR101353481B1 (en) * | 2013-02-28 | 2014-01-20 | 주식회사 아이에스시 | Test socket with high density conduction section |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2549125Y2 (en) * | 1992-03-27 | 1997-09-30 | 日本航空電子工業株式会社 | Connector for electrical connection |
KR100577947B1 (en) * | 2001-02-09 | 2006-05-10 | 제이에스알 가부시끼가이샤 | Anisotropic conductive connector, its manufacture method and probe member |
WO2007135990A1 (en) * | 2006-05-18 | 2007-11-29 | Nikon Corporation | Exposure method and apparatus, maintenance method and device manufacturing method |
JP4793203B2 (en) * | 2006-09-28 | 2011-10-12 | Jsr株式会社 | Anisotropic conductive connector and method for inspecting test object using this anisotropic conductive connector |
TWI503553B (en) * | 2011-10-19 | 2015-10-11 | Johnstech Int Corp | Improved electrically conductive kelvin contacts for microcircuit tester |
-
2014
- 2014-07-17 KR KR1020140090346A patent/KR101573450B1/en active IP Right Grant
-
2015
- 2015-07-16 WO PCT/KR2015/007408 patent/WO2016010383A1/en active Application Filing
- 2015-07-16 TW TW104123001A patent/TWI555984B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008059895A (en) * | 2006-08-31 | 2008-03-13 | Masashi Okuma | Contact sheet and its manufacturing method, and cable and elastic member for forming contact sheet |
KR101266124B1 (en) * | 2012-04-03 | 2013-05-27 | 주식회사 아이에스시 | Test socket with high density conduction section and fabrication method thereof |
KR101353481B1 (en) * | 2013-02-28 | 2014-01-20 | 주식회사 아이에스시 | Test socket with high density conduction section |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101751269B1 (en) | 2016-05-13 | 2017-06-27 | 배준규 | rubber socket for semiconductor test, and manufacturing method of conductive pole for the same |
KR101823006B1 (en) * | 2016-08-01 | 2018-01-31 | (주)티에스이 | Semiconductor test socket and manufacturing method there of |
KR20180031106A (en) * | 2016-09-19 | 2018-03-28 | (주)티에스이 | Test socket for semiconductor |
KR101895002B1 (en) | 2016-09-19 | 2018-09-05 | (주)티에스이 | Test socket for semiconductor |
KR20200057579A (en) * | 2018-11-15 | 2020-05-26 | 주식회사 이노글로벌 | Elastically contactable by-directional electrically conductive module |
KR102147744B1 (en) * | 2018-11-15 | 2020-10-15 | 주식회사 이노글로벌 | Elastically contactable by-directional electrically conductive module |
KR20200115036A (en) * | 2019-03-25 | 2020-10-07 | 주식회사 아이에스시 | Electrical test socket |
KR102175797B1 (en) | 2019-03-25 | 2020-11-06 | 주식회사 아이에스시 | Electrical test socket |
KR20210149352A (en) * | 2020-06-02 | 2021-12-09 | (주)티에스이 | Test apparatus for semiconductor package |
KR102410156B1 (en) * | 2020-06-02 | 2022-06-17 | (주)티에스이 | Test apparatus for semiconductor package |
KR102342480B1 (en) * | 2020-08-21 | 2021-12-23 | (주)티에스이 | Test socket and test apparatus having the same |
KR20230005530A (en) * | 2021-07-01 | 2023-01-10 | 주식회사 아이에스시 | Connector for electrical connection |
KR102626152B1 (en) * | 2021-07-01 | 2024-01-17 | 주식회사 아이에스시 | Connector for electrical connection |
KR20230011637A (en) * | 2021-07-14 | 2023-01-25 | (주)티에스이 | Test socket, test apparatus having the same, and manufacturing method for the test socket |
KR102530618B1 (en) | 2021-07-14 | 2023-05-09 | (주)티에스이 | Test socket, test apparatus having the same, and manufacturing method for the test socket |
WO2023229281A1 (en) * | 2022-05-24 | 2023-11-30 | 주식회사 아이에스시 | Test connector |
Also Published As
Publication number | Publication date |
---|---|
WO2016010383A1 (en) | 2016-01-21 |
TW201606311A (en) | 2016-02-16 |
TWI555984B (en) | 2016-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101573450B1 (en) | Test socket | |
KR101353481B1 (en) | Test socket with high density conduction section | |
KR101366171B1 (en) | Test socket with high density conduction section | |
US20150377923A1 (en) | Test socket with high density conduction section | |
JP5950366B2 (en) | Test socket having high-density conductive portion and method of manufacturing the same | |
KR101393601B1 (en) | Conductive connector and manufacturing method of the same | |
KR101471116B1 (en) | Test socket with high density conduction section | |
KR101706331B1 (en) | Test socket | |
KR100926777B1 (en) | Test socket with conductive pad having conductive protrusions | |
KR101482245B1 (en) | Electrical test socket | |
KR101522624B1 (en) | Electrical test socket | |
KR101667929B1 (en) | Silicon rubber socket | |
JP2006162617A (en) | Connector for semiconductor package test | |
KR101490501B1 (en) | Electrical test socket | |
KR101606866B1 (en) | Test connector | |
KR20140147207A (en) | Insert for test | |
KR20190052726A (en) | By-directional electrically conductive module | |
KR101483757B1 (en) | Connector for electrical connection | |
KR20100020793A (en) | Test socket for high-frequency semiconductor ic test | |
KR101173191B1 (en) | Test socket | |
KR20110076855A (en) | Semiconductor test socket | |
KR101506131B1 (en) | Fabrication method of test sheet and test sheet | |
KR20150079255A (en) | Sheet-form connector and electrical connector apparatus | |
KR101779172B1 (en) | Test socket for micro pitch | |
KR101920855B1 (en) | Electrical test socket |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20181119 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20191118 Year of fee payment: 5 |