KR101751269B1 - rubber socket for semiconductor test, and manufacturing method of conductive pole for the same - Google Patents

Abstract

TECHNICAL FIELD The present invention relates to a rubber socket for semiconductor testing which manufactures a rubber socket for semiconductor testing at low cost and can precisely and easily carry out alignment of the conductive pole. Particularly, the present invention is applied to the case where the conductive pawls of the semiconductor test rubber sockets are applied with the volume ratio and the specific permeability of the conductive powder to the liquid insulator differently from top to bottom so as to align the conductive pawls in the prior art, To a rubber socket for semiconductor testing capable of preventing the upper portion of the conductive pole from bending.

Description

TECHNICAL FIELD [0001] The present invention relates to a rubber socket for semiconductor testing, and a manufacturing method of a conductive pole for the rubber socket.

TECHNICAL FIELD The present invention relates to a rubber socket for semiconductor testing that can manufacture a rubber test socket for semiconductor testing at low cost and can precisely and easily carry out alignment of the conductive pole.

More particularly, the present invention relates to a method of aligning conductive pores in a conductive pawl of a rubber test socket for semiconductor testing, in which the ratio of the volume of the conductive powder to the liquid insulator is different for each region of the conductive pole, To a rubber socket for semiconductor testing which can prevent the upper portion of the conductive pole from bending due to the repulsive force of the interlayer and the magnetic force of the lower plate magnet.

Semiconductor packages that have been processed normally will be tested for electrical characteristics through semiconductor inspection equipment before sale. To this end, a test socket corresponding to the electrical pin arrangement of the semiconductor package is fabricated, and the test socket thus fabricated interfaces the semiconductor package and semiconductor inspection equipment.

Specifically, after connecting the semiconductor testing equipment and the semiconductor package through the rubber test socket for semiconductor testing, an electrical signal of a preset pattern is sent from the semiconductor testing equipment to the semiconductor package to check whether the signal response from the semiconductor package is good .

The rubber socket for semiconductor testing is also used as a burn-in socket for testing the durability of a semiconductor package in a harsh environment at a high temperature during the manufacturing process of the semiconductor package, in addition to checking whether the semiconductor package is turned on.

At this time, since the rubber test socket for semiconductor test is electrically connected to the semiconductor test equipment and performs inspection while making a number of temporary contact with a plurality of semiconductor packages, the conductive pole, which is a contact terminal of the rubber test socket for semiconductor test, Durability must be maintained to ensure a good contact environment from contact.

In addition, as the BGA (Ball Grid Array) type and the LGA (Land Grid Array) type have evolved, the pin pitch of the semiconductor package has been reduced, There arises a problem that they must be arranged at a high density.

As such, the rubber test socket for semiconductor testing is used in a process for examining the electrical characteristics of a semiconductor package.

On the other hand, in order to align the conductive pawls in the process of manufacturing the rubber test socket for semiconductor testing, the upper plate magnet and the lower plate magnet can be disposed on the upper and lower sides, respectively. When the conductive poles are aligned on one magnet Will be described with reference to [Figure 12] and [Figure 13].

12, a lower plate magnet (not shown) is disposed below the conductive pole 100 'to temporally magnetize the conductive pole 100', thereby vertically moving the plurality of conductive poles 100 ' Direction. At this time, as the density of the conductive pawls increases, the distance between the conductive pawls 100 'becomes very short, and repulsive force is generated between the conductive pawls 100'.

Here, it is assumed that the repulsive force F generated at the upper end portion and the lower end portion of the conductive pole 100 'is similar. The lower end of the conductive pole 100 'can overcome the repulsive force between the conductive poles because the attractive force with the lower plate magnet is strong. However, since the upper end of the conductive pole 100 'is weak in attraction with the lower plate magnet, the repulsive force between the conductive poles can not be overcome, and they are spread apart. Accordingly, as shown in FIG. 12, the distance between the adjacent conductive pods 100 'becomes larger than the lower end d1, and consequently, the alignment of the conductive pores becomes poor.

Next, referring to FIG. 13, when the plurality of conductive pawls are arranged on a lower plate magnet in a state in which they are arranged close to each other, a phenomenon occurs in which the conductive pole tilts by the magnetic force lines of the magnets.

The lower plate magnet forms a line of magnetic force as indicated by a dotted line in [Fig. 13]. The magnetic force lines will be formed in the vertical direction at the center portion of the lower plate magnet, but the magnetic force lines are distorted in the oblique direction at the edge of the lower plate magnet. Accordingly, the conductive pole 100 'disposed at the edge of the rubber test socket for semiconductor testing is affected by the distortion of the magnetic line of force.

The lower end of the conductive pole 100 'can strongly overcome the distortion of the magnetic force lines due to strong attraction with the lower plate magnet. However, since the upper end of the conductive pole 100' has weak attraction with the lower plate magnet, And is turned in the oblique direction as shown in Fig. 13.

Further, since two magnets are positioned above and below the conductive pole 100 ', the magnetic force lines for the conductive poles are complicatedly formed, making it difficult to perform technical analysis. Accordingly, a large number of conductive It has become very difficult to accurately align the pawls 100 '.

Therefore, a technique capable of solving such a problem has been desired.

1. Korean Patent Application No. 10-2008-0087701 "Semiconductor Test Socket" 2. Korean Patent Application No. 10-2008-0079554 entitled "High Frequency Semiconductor Test Socket" 3. Korean Patent Application No. 10-2012-0050563 "Method of manufacturing test socket for package test through surface lamination" 4. Korean patent application No. 10-2012-0027331 "Test rubber socket including spring member" 5. Korean Patent Application No. 10-2007-0126227 entitled "Semiconductor Test Socket" 6. Korean Patent Application No. 10-2014-0016804 entitled "Test Socket Having High Density Conductive Portion" 7. Korean Patent Application No. 10-2010-0120160 entitled "METHOD FOR MANUFACTURING SEMICONDUCTOR TEST SOCKET, Bidirectional Conductive Multilayer Sheet and Semiconductor Test Socket Using Same" 8. Korean Patent Application No. 10-2013-0116755 entitled " Semiconductor Test Socket and Vertical Pitch Converter Manufacturing Method "

SUMMARY OF THE INVENTION It is an object of the present invention to provide a rubber socket for semiconductor testing which can increase the test reliability of a conductive pole.

Another object of the present invention is to provide a rubber socket for semiconductor testing which can prevent the upper portion of the conductive pole from being tilted by the influence of the repulsive force between the conductive poles or the magnetic force by the magnet when manufacturing the rubber socket.

Another object of the present invention is to provide a technique for manufacturing a rubber socket for semiconductor testing at low cost.

In order to accomplish the above object, a rubber socket for semiconductor testing according to the present invention is for electrically connecting a semiconductor package to be inspected device to a semiconductor inspection equipment, and includes a bar-shaped abbreviation forming pillar 110, Shaped conductive thin film portion 120 connected to the upper end of the conductive column portion and connected to the lower end portion of the weakly shaped conductive column portion so as to be mutually symmetric with the ferromagnetically formed upper conductive thin film portion, A plurality of conductive pawls (100) having a plurality of conductive pads (130); A plurality of through holes penetrating in the up and down direction are formed so that a plurality of conductive pawls can be inserted as an electrical insulator having an external force with an external force and the inner walls of the through holes are configured to grip the conductive pawl An insulating block 300; An insulation sheet 400 attached to a lower surface of the insulation block and having an opening communicating with the through hole so that the lower surface of the conductive pole is exposed downward so that the lower portion of the conductive pole is inserted into the opening hole; And a joint frame (500) interposed between the edge region of the insulating block and the insulating sheet, and protruding from the outer wall of the insulating block to interface with the semiconductor inspection equipment.

At this time, the abbreviation-shaped conductive column 110 has a bar-shaped first elastic insulator 111 which is elastic and electrically insulated from external force; And a first conductive powder 112 having a ratio of volume 10 to volume 15 of not less than 15 but not more than 15 volume of the first elastic insulator,

The ferrule-shaped upper conductive thin film portion 120 includes a second elastic insulator 121 in the form of a thin film, which is elastic and electrically insulated from external force; And a second conductive powder 122 having a ratio of volume 10 to less than 5 and less than 5 volume of the second elastic insulator, wherein the plurality of particles are embedded in the inner side of the second elastic insulator to exhibit conductivity,

The ferrule-shaped lower conductive thin film portion 130 includes a third elastic insulator 131 in the form of a thin film, which is elastic and electrically insulated from external force; And a third conductive powder 132 having a ratio of volume 10 to less than 5 and less than 5 volume of the third elastic insulator and exhibiting conductivity by being embedded in the form of a plurality of grains inside the third elastic insulator.

In addition, the abbreviation-shaped conductive column 110 has a bar-shaped first elastic insulator 111 which is elastic and electrically insulated from external force; And a first conductive powder (112) having a plurality of grains embedded in the first elastic insulator to show conductivity and exhibiting a relative permeability at a Kelvin temperature of 300K or less of nickel (Ni) or less,

The ferrule-shaped upper conductive thin film portion 120 includes a second elastic insulator 121 in the form of a thin film, which is elastic and electrically insulated from external force; And a second conductive powder 122 having a plurality of grains embedded in the inner side of the second elastic insulator to exhibit conductivity and having a relative permeability exceeding nickel (Ni) at a Kelvin temperature of 300K,

The ferrule-shaped lower conductive thin film portion 130 includes a third elastic insulator 131 in the form of a thin film, which is elastic and electrically insulated from external force; And a third conductive powder (132) having a plurality of grains embedded in the third elastic insulator and exhibiting conductivity and having a relative magnetic permeability at a Kelvin temperature of 300K exceeding nickel (Ni).

A method of manufacturing a conductive pole for a rubber test socket for semiconductor testing according to a first embodiment of the present invention is a method for electrically connecting a semiconductor package to be inspected device to a semiconductor inspection equipment, the method comprising the steps of: (a) A step of filling the mixture corresponding to the first volume ratio into a plurality of through holes formed in the upper and lower direction of the hole block by mixing the volume ratio of the liquid insulator at a predetermined first volume ratio and the volume ratio of the liquid insulator to the liquid insulator to the volume of the conductive powder A thin film layering step of mixing the mixture of the first volume ratio and the second volume ratio at a second volume ratio smaller than the first volume ratio and adding the mixture corresponding to the second volume ratio to the upper and lower portions of the through hole, (c) a final curing step of curing the liquid-phase insulator filled in the through-hole so as to be an elastic insulator; (d) separating the elastic insulator through the final curing step from the hole block.

In this case, a preliminary curing step may be further included between step (a) and step (b), in which the liquid insulator filled in the through hole through the pillar filling step is cured to be an elastic insulator.

A method of manufacturing a conductive pole for a rubber test socket for semiconductor testing according to a second embodiment of the present invention is a method for electrically connecting a semiconductor package to be inspected device to a semiconductor inspection equipment, comprising the steps of: (a) A pillar filling step of filling a liquid insulator mixed with a first conductive powder having a permeability of less than or equal to nickel into a plurality of through holes opened in a vertical direction of the hole block; (b) a thin film deposition step of adding a liquid insulator mixed with a second conductive powder having a relative permeability exceeding nickel at a Kelvin temperature of 300K to the upper and lower portions of the through holes, respectively; (c) a final curing step of curing the liquid-phase insulator filled in the through-hole so as to be an elastic insulator; (d) separating the elastic insulator through the final curing step from the hole block.

In this case, a preliminary curing step may be further included between step (a) and step (b), in which the liquid insulator filled in the through hole through the pillar filling step is cured to be an elastic insulator.

When the conductive pawls are aligned in the manufacturing process of the rubber test socket for semiconductor testing, there is no phenomenon that the upper portions of the conductive pawls are tilted or tilted by the influence of the repulsive force or the magnetic force. Therefore, As shown in FIG.

Further, since the conductive pawls of the present invention are symmetrically formed at both ends thereof, the conductive pawls can be aligned and aligned without any distinction, thereby improving the workability.

1 is a sectional view of a rubber socket for semiconductor testing according to the present invention;
2 is a view showing a conductive pole for constituting a rubber socket for semiconductor testing according to the present invention.
3 is an exemplary view of a hole block for manufacturing the conductive pole according to the present invention;
4 is an exemplary view showing a step of a cross section of a hole block in a first process example of manufacturing a conductive pole in the present invention.
5 is an exemplary view showing a step of a cross section of a hole block in a second process embodiment of manufacturing a conductive pole in the present invention.
Fig. 6 is an illustration of a pallet temporarily arraying conductive pores produced according to the present invention. Fig.
7 is a view illustrating an example of a process in which the top plate magnet according to the present invention grips the conductive pole and moves to the bottom plate magnet,
8 is an illustration showing a moment when the top plate magnet according to the present invention aligns the conductive pole with the insulating sheet based on the magnetic force of the bottom plate magnet,
9 is a view showing an example of a process in which a top plate magnet according to the present invention is detached from a conductive pole aligned with a bottom plate magnet,
10 is an illustration showing a state in which the space between the conductive pawls is filled with the liquid insulator in the state of Fig. 9, Fig.
11 is an illustration showing a state in which adjacent conductive pores are accurately aligned in the present invention.
12 is an exemplary view showing a state in which a repulsive force is generated by a magnetic force between adjacent conductive poles in the prior art.
13 is an exemplary view showing a state in which conductive pawls are inclined by a magnetic force line of a magnet in the prior art.
14 is a flowchart showing a manufacturing process of a conductive pole for a rubber test socket for semiconductor testing according to a third process embodiment of the present invention.
15 is a flowchart showing a manufacturing process of a conductive pole for a rubber test socket for semiconductor testing according to a fourth process embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings.

1 is a sectional view of a rubber socket for semiconductor testing according to the present invention. 1, the rubber socket for semiconductor testing according to the present invention is an apparatus for electrically connecting a semiconductor package (not shown) as a device to be inspected to semiconductor inspection equipment (not shown), and includes a conductive pole 100, A block 300, an insulating sheet 400, and a joint frame 500. In the present invention, the conductive pole 100 is composed of the abbreviated conductive pillar portion 110, the ferromagnetic shaped upper conductive thin film portion 120, and the ferromagnetic formed lower conductive thin film portion 130, Will be described later.

The insulating block 300 is an electrical insulator having a certain elasticity against an external force and has a plurality of through holes penetrating in a vertical direction so that the plurality of conductive pawls 100 can be inserted therein. So as to grip the conductive pawl 100 in a wrapping manner.

Insulation block 300 is preferably made of cured liquid silicon, which is an insulator. When liquid silicone is injected so as to fill a space between the conductive pawls 100 in a state where the plurality of conductive pawls 100 are erected and cured, the conductive pawls 100 are gripped with the conductive pawls 100 as shown in FIG. An insulating block 300 integrally connected to the insulating layer 100 is formed.

The insulating sheet 400 is attached to the lower surface of the insulating block 300 and has an opening communicating with the through hole of the insulating block 300. The bottom of the conductive pole 100 is inserted into the opening hole, And the lower surface is exposed in a downward direction.

The joint frame 500 is sandwiched between the edge region of the insulating block 300 and the insulating sheet 400 and protrudes to the outer wall of the insulating block 300 to interface with the semiconductor inspection equipment (not shown).

The joint frame 500 is integrally connected to the insulating block 300 without a connecting means separate from the rubber test socket for semiconductor test. When the joint frame 500 is placed in contact with the liquid silicone as shown in FIG. 1 in the liquid silicone state before the insulating block 300 is cured, the liquid silicone is cured by the insulating block 300, And is integrally connected to the block 300.

2 is a view showing a conductive pole for constituting a rubber socket for semiconductor testing according to the present invention. The semiconductor testing equipment is mounted in one end of the conductive pole 100 of FIG. 2 and the semiconductor package is in contact with the other end.

2, conductive powder in the form of powder particles and a liquid insulator (for example, silicon) are mixed so that a liquid insulator is coated on the surfaces of the conductive powders 112, 122 and 132. Then, when the liquid insulator is cured with the elastic insulators 111, 121, and 131, the conductive pores 112, 122, and 132 located between the liquid insulators have electrical characteristics of mutual electricity, so that the conductive pores 100 serving as one conductive elastic body as a whole .

Here, when the conductive pawls 100 are aligned by applying the 'volume ratio' to the 'specific permeability ratio' of the conductive powder to the elastic insulator in the liquid state differently from region to region, So that the upper portion of the conductive pole 100 is not bent from the repulsive force of the arm and the magnetic force of the lower plate magnet 220.

For this purpose, the conductive pole 100 includes a bar-shaped abbreviated-shaped conductive pillar 110, a thin-film-shaped ferromagnetic-shaped upper conductive thin film portion 120 connected to the upper end of the weakly-shaped conductive pillar, Shaped conductive thin film portion 130 connected to the lower end of the weakly shaped conductive column portion so as to be symmetrically symmetrical with the lower conductive thin film portion.

At this time, the ferromagnetic layered and lower conductive thin film portions 120 and 130 are formed in a thin film shape, and preferably have a thickness of about 50 to 150 μm.

Meanwhile, the conductive pole 100 according to the first constitutional example in which the 'volume ratio' of the conductive powder to the elastic insulator (liquid insulator) in a liquid state is set differently for each region will be described in detail.

First, the abbreviation-forming conductive column 110 has a bar-shaped first elastic insulator 111 which is elastic and electrically insulated from external force, and a plurality of pellets in the form of a plurality of pellets in the inside of the first elastic insulator 111 And a first conductive powder 112 having a ratio of volume 10 to volume 15 of not more than 15 of the first elastic insulator 111.

That is, when the volume of the first elastic insulator 111 is set in the range of 5 to 15, the volume of the first conductive powder 112 is set to 10.

In addition, the ferromagnetic-formed upper conductive thin film portion 120 includes a second elastic insulator 121 in the form of a thin film, which is resilient and electrically insulated from external force, and a plurality of microstructures formed inside the second elastic insulator 121 And a second conductive powder 122 having a volume of 10 to less than 5 and less than 5 of the volume of the second elastic insulator 121. [

That is, when the volume of the second elastic insulator 121 is set in the range of 1 to less than 5, the volume of the second conductive powder 122 is set to 10.

In addition, the ferromagnetic-formed lower conductive thin film portion 130 includes a third elastic insulator 131 in the form of a thin film, which is resilient and electrically insulated from external force, and a plurality of pellets formed inside the third elastic insulator 131 And a third conductive powder 132 having a volume ratio of 10 to less than 5 and less than 5 volume of the third elastic insulator 131.

That is, when the volume of the third elastic insulator 131 is set in the range of 1 to less than 5, the volume of the third conductive powder 132 is set to 10.

On the other hand, the conductive pole 100 according to the second constitutional example in which the 'specific permeability' of the conductive powder with respect to the elastic insulator (liquid insulator) in a liquid state is set differently for each region will be described in detail.

First, the abbreviation-forming conductive column 110 has a bar-shaped first elastic insulator 111 which is elastic and electrically insulated from external force, and a plurality of grains are embedded in the inside of the first elastic insulator 111 And a first conductive powder 112 that exhibits conductivity and exhibits a relative permeability at a Kelvin temperature of 300 K of less than or equal to nickel (Ni).

In addition, the ferromagnetic-formed upper conductive thin film portion 120 includes a second elastic insulator 121 in the form of a thin film, which is resilient and electrically insulated from external force, and a plurality of microstructures formed inside the second elastic insulator 121 And a second conductive powder 122 having a relative permeability at a Kelvin temperature of 300 K exceeding nickel (Ni).

In addition, the ferromagnetic-formed lower conductive thin film portion 130 includes a third elastic insulator 131 in the form of a thin film, which is resilient and electrically insulated from external force, and a plurality of pellets formed inside the third elastic insulator 131 And a third conductive powder 132 having a specific magnetic permeability at a Kelvin temperature of 300 K exceeding nickel (Ni).

At this time, the relative permeability is a ratio indicating the degree of magnetic flux passing through a specific object based on the degree of permeation of the magnetic flux in a vacuum, and the magnetic body is generally classified into a semi-magnetic body, a paramagnetic body, and a ferromagnetic body according to the magnitude of the non- . That is, the nonmagnetic permeability is a value smaller than 1, and the paramagnetic material (e.g., Al, Pt, ...) has a nonmagnetic permeability higher than 1 in the case of a diamagnetic material (e.g., Au, Ag, Cu, Zn, And the ferromagnetic material (e.g., Ni, Co, Fe, ...) shows a value whose relative magnetic permeability is sufficiently larger than 1. [ Since a metal having a high specific magnetic permeability has a relatively higher density of magnetic flux passing through the magnetic field than a metal having a relatively low specific magnetic permeability, a metal having a high specific magnetic permeability is more affected by the magnetic force.

Here, the value of the specific magnetic permeability may be as large as several thousands at a Kelvin temperature of 300 K, and the nickel (Ni) is a metal exhibiting a relatively low magnetic property in the ferromagnetic substance.

In the present invention, the second and third conductive powders 122 and 132 forming the ferromagnetic-shaped upper conductive thin film portion 120 and the ferromagnetic-formed lower conductive thin film portion 130 are preferably employed in the ferromagnetic material.

As shown in FIG. 2, the ferromagnetic-shaped upper conductive thin film portion 120 and the ferromagnetic-formed lower conductive thin film portion 130, which are laminated in the form of thin films at both ends of the conductive pole 100, (Such as a top plate magnet or a bottom plate magnet) is strongly attracted by a strong attraction to the magnet.

Since the ferromagnetically-formed upper conductive thin film portion 120 and the ferromagnetically-formed lower conductive thin film portion 130 are formed in a thin film shape of about 50 to 150 μm and are connected to both ends of the weakly-shaped conductive pillar portion 110, 12 and Fig. 12 due to the repulsive force or the distortion of the magnetic force lines between the ferromagnetic shaped upper conductive thin film portions 120 between the pawls 100 or the ferromagnetic formed lower conductive thin film portions 130 between the adjacent conductive pawls 100 13], and the conductive pawls 100 are straightly aligned as intended.

For example, assuming that a plurality of conductive pawls 100 are adjacent to each other, and each of the ferromagnetic-shaped lower conductive thin film portions 130 is caught by a strong attraction force to the lower plate magnet 220, (130) are strongly magnetized.

At this time, since the ferromagnetically-formed upper conductive thin film part 120 has the weakly shaped conductive pillar part 110 between the lower conductive thin film part 130 and the ferromagnetic upper conductive film part 130, So that the attractive force does not remain in the ferromagnetic upper conductive thin film portion 120.

This phenomenon occurs when the distortion of the magnetic force lines generated by the lower plate magnet 220 is strongly generated in the lower conductive thin film portion 130 of the ferromagnetism and becomes weak in the course of passing through the weakly shaped conductive column portion 110, So that it hardly reaches the upper conductive thin film portion 120.

Since the ferromagnetic-formed upper conductive thin film portion 120 is a component physically connected to the lower ferromagnetic conductive thin film portion 130, the lower ferromagnetic conductive thin film portion 130 is strongly magnetized by the lower magnet 220 The ferromagnetic-formed upper conductive thin film portion 120 is aligned without any flare or inclination.

3 is an illustration of a hole block for manufacturing the conductive pole according to the present invention. Referring to FIG. 3, a plate-shaped hole block 10 is first formed to form the conductive pole 100 according to the present invention.

A plurality of through holes 11 are formed in the hole block 10. The through holes 11 are formed through the hole block 10 in the vertical direction.

When a liquid insulator mixed with the first, second and third conductive powders 112, 122 and 132 is injected into the through hole 11 and then cured, elastic insulators 111, 121 and 131 are generated, and the cured elastic insulators 111, 121 and 131 The conductive pole 100 having a predetermined elastic force can be obtained. The diameter of the conductive pole 100 corresponds to the inner diameter of the through hole 11 formed in the hole block 10. [

4 is an exemplary view showing a step of a cross-section of a hole block in a first process embodiment of manufacturing a conductive pole in the present invention. At this time, the material selection of the first, second, and third conductive powders 112, 122, 132 and the volume ratio with the liquid insulator are performed according to the first and second embodiments described above.

First, as shown in FIG. 4 (a), the first conductive powder 112 and the liquid phase (first conductive powder) 112 are formed so as to correspond to the through hole 11, which is an empty space of the hole block 10, Filling the plurality of through holes 11 opened in the up-and-down direction of the hole block 10 by mixing the insulators, as shown in Fig. 4 (b).

Next, as shown in FIG. 4 (c), the second and third conductive powders 122 and 132 are mixed with a liquid-phase insulator to form a thin film on the upper and lower portions of the through-hole 11.

For example, in the thin film lamination, a liquid insulator in which the second conductive powder 122 is mixed is injected into the upper portion of the through hole 11 for 10 seconds under the column filling step of FIG. 4 (b) And a liquid insulator mixed with the through hole (132) is injected into the lower part of the through hole (11) for 5 seconds.

That is, in the process of injecting the liquid insulator mixed with the third conductive powder 132 into the lower part of the through hole 11 for 5 seconds, a liquid insulator in which the second conductive powder 122 is mixed is formed on the top of the through hole 11 The upper half of the conductive layer 120 and the lower half of the lower conductive layer 130 are symmetric with respect to each other. As a result, .

After the final curing step in which the liquid insulator filled in the through hole is cured so as to become the elastic insulator, the cured elastic insulator is separated from the hole block 10 as shown in FIG. 4 (d) ) Is obtained.

On the other hand, a preliminary curing step may be carried out after completion of the pillar filling step of FIG. 4 (b), before the thin film laminating step is performed, a preliminary curing step of curing the liquid insulator filled in the through hole 11 to become an elastic insulator .

5 is an exemplary view showing a step of a cross-section of a hole block in a second process embodiment of manufacturing a conductive pole in the present invention. Here, the material selection of the first, second and third conductive powders 112, 122 and 132 and the volume ratio to the liquid insulator are performed according to the first and second constitutional embodiments described above.

First, as shown in FIG. 5 (a), the first conductive powder 112 and the liquid phase (not shown) are formed in correspondence with the through hole 11, which is an empty space of the hole block 10, (B) shown in FIG. 5 (b) filling the plurality of through holes 11 opened in the vertical direction of the hole block 10 by mixing the insulators.

Next, in the state of FIG. 5 (b), a curing step is performed in which the liquid insulator is hardened so as to form an elastic insulator.

5 (c), after the cured elastic insulator is separated from the hole block 10, the ferromagnetic-shaped upper conductive thin film portion 120 and the ferromagnetic- And the second and third conductive powders 122 and 132 and the liquid insulator are mixed with each other in correspondence with the formed lower conductive thin film portion 130 and coated on the upper and lower ends of the cured weakened conductive pillar portion 110, respectively.

Finally, the conductive polyolefin 100 is obtained by curing the liquid insulator after the coating step.

[Fig. 6] is an illustration of a pallet for provisionally arraying conductive pores produced according to the present invention. [Fig. 6, a conductive pole 100 is fitted to a pallet 20 provided with a plurality of holes in order to manufacture the rubber test socket for semiconductor testing according to the present invention with the conductive pole 100 obtained above.

By arranging the conductive pawls 100 in a desired pattern on the rubber test socket for semiconductor test in advance in the pallet 20 so as to be able to align the upper surface of the conductive pawls 20, 100) with a magnetic force so as to be moved to a desired position.

7 is a view illustrating an example of a process in which a top plate magnet according to the present invention grips a conductive pole and moves the bottom plate magnet to the bottom plate magnet according to the present invention. FIG. 9 is an exemplary view showing a process in which the top plate magnet according to the present invention is separated from the conductive poles aligned with the bottom plate magnet. FIG.

7, the upper plate magnet 210 grips the conductive pole 100 aligned and aligned with the pallet 20 of FIG. 6 by a magnetic force, and moves the lower plate magnet 220 to a position where the lower plate magnet 220 is located To this end, it may be constituted by an electromagnet which can turn on / off the magnetic force of the top plate magnet 210.

That is, when the top plate magnet 210 grips the conductive pole 100, the top plate magnet 210 is turned on and when the top plate magnet 210 grips the conductive pole 100 at a desired position, So that it is naturally released from the upper end portion.

The upper plate magnet 210 may include a magnet arm 211, a separating block 212 and an insulating sheet 213 so as to smoothly grip the upper end of the conductive pole 100 aligned with the pallet 20 have.

A plurality of magnet arms 211 protrude downward from the bottom surface of the top plate magnet 210 and the isolation block 212 is filled between the magnet arms 211 so as to block magnetic field interference between the magnet arms 211.

The insulating sheet 213 is sandwiched by the lower surface of the isolation block 212 to block magnetic field interference between the magnet block 211 and the isolation block 212 and the upper end of the conductive pole 100 is connected to the magnet arm 211 The upper surface of the conductive pawl 100 is guided so as to be accurately gripped on the lower end surface of the conductive pawl 100. [

7, while the plurality of conductive pawls 100 are suspended on the lower surface of the top plate magnet 210, the ferrule-shaped upper conductive thin film portion 120 corresponding to the upper end of the conductive pole 100 is supported by the upper plate 220, The strong magnetization of the magnet 210 is strongly magnetized but the strong magnetized magnetic force weakens at the weakly shaped conductive pillar 110 so that the stronger formed lower conductive thin film portion 110 corresponding to the bottom surface of the weakly shaped conductive pillar 110 Magnetization by the upper plate magnet 210 hardly occurs.

As a result, even when the conductive pawls 100 are suspended from the upper plate magnet 210, mutual repulsive force is not generated between the distal ends far from the magnet as in FIG. 12, and the magnetic force lines of the magnets The conductive pawl 100 is positioned vertically in the vertical direction as shown in Fig. 7 in a state in which the conductive pole 100 is suspended from the top plate magnet 210. As shown in Fig.

When the conductive pole 100 moved by the upper plate magnet 210 is seated on the upper surface of the lower plate magnet 220 as shown in FIG. 8, the upper plate magnet 210 is turned off, as shown in FIG. 9 The upper plate magnet 210 is detached from the upper end surface of the conductive pole 100.

The lower conductive thin film portion 130 corresponding to the lower end portion of the conductive pole 100 is strongly magnetized to the lower plate magnet 2210 while the plurality of conductive pawls 100 are seated on the upper surface of the lower plate magnet 220, The strong magnetized magnetic force weakens at the weakly shaped conductive pillar 110 so that the ferromagnetic shaped upper conductive thin film portion 120 corresponding to the top surface of the weakly shaped conductive pillar portion 110 is electrically connected to the bottom magnet 210) hardly occurs.

As a result, even when the conductive pawls 100 are seated on the lower plate magnet 210 as shown in Fig. 9, no mutual repulsive force is generated between the distal ends far from the magnets as in Fig. 12 The conductive pawl 100 is kept standing upright in the vertical direction as shown in Fig. 9 in a state where it is erected on the lower plate magnet 220, because it is not affected by the distortion by the magnetic force lines of the magnets.

[Fig. 10] is an illustration showing an example in which a liquid insulator is filled in a space between conductive pores in the state of Fig. 9;

First, as shown in FIG. 7, an insulating sheet 400 having a plurality of openings is inserted at a position where a plurality of conductive pawls 100 are to be placed so that the lower end of the conductive pole 100 is inserted. Here, it is preferable to arrange the lower plate magnet 220 on the lower surface of the insulating sheet 400 in advance. It is also preferable that an adhesive layer 600 is formed between the insulating sheet 400 and the lower plate magnet 220 so that the insulating sheet 400 and the lower plate magnet 220 are integrally fixed.

The joint frame 500 is laminated on the upper surface of the insulating sheet 400 corresponding to the rim of the insulating sheet 400 and the guide frame 700 is stacked along the upper surface of the joint frame 500, 700 are bounded by the conductive pawls 100 to form a recessed structure.

In this state, a liquid insulator (for example, silicon) is injected into the upper surface of the insulating sheet 400 at a height not exceeding the guide frame 700, as shown in Fig. 10, 300) is generated.

The conductive pole 100 integrally connected to the lower plate magnet 220 and the guide frame 700, the insulating block 300, the insulating sheet 400 and the joint frame 500 are fixed to the lower plate magnet 220 and the guide frame 700, (700), the rubber socket for semiconductor testing according to the present invention is completed.

When the insulating block 300 is separated from the lower plate magnet 220, it is preferable that the insulating sheet 400 located on the lower surface of the insulating block 300 is separated from the lower surface of the insulating block 300. The insulating sheet 400 may be detached from the lower surface of the insulating block 300 separately.

When the lower plate magnet 220 is separated from the lower surface of the insulating sheet 400, the adhesive layer 600 may be simultaneously removed together with the lower plate magnet 220 and the lower plate magnet 220 may be separated from the insulating sheet 400 After the separation, the adhesive layer 600 may be separated sequentially.

11 is an exemplary view showing a state in which adjacent conductive pores are accurately aligned in the present invention. The present invention overcomes the problems of the prior art described with reference to FIG. 12 and FIG.

Referring to FIG. 11, the lower plate magnet 220 is disposed adjacent to the lower portion of the conductive pole 100, thereby magnetizing the conductive pole 100. Accordingly, the mutually adjacent conductive pawls 100 are magnetized with the same polarity, so that they generate repulsive force that physically push each other.

That is, the upper portions of the conductive pawls 100 generate repulsive force between the upper portions and the lower portions of the conductive pawls 100 generate repulsive forces between the lower portions.

However, the lower part of the conductive pole 100 corresponds to the ferromagnetic-formed lower conductive thin film part 130, and even if mutual repulsive force acts between the adjacent lower-layer conductive thin film parts 130, The separation distance d1 originally intended by the strong attraction force is maintained.

Since the upper part of the conductive pole 100 corresponds to the ferromagnetic upper conductive thin film part 120 and is formed in the form of a thin film having a thickness of about 50 to 150 袖 m, The repulsive force is so weak that the upper distance d2 of the conductive pawls 100 maintains the same level as the lower spacing distance d1.

The lower conductive layer 220 corresponding to the lower end of the conductive pole 100 strongly magnetizes the lower conductive plate 2210. The strongly magnetized magnetic force is weakly shaped, The pole portion 110 is weakened, so that the magnetically-formed upper conductive thin film portion 120 hardly magnetizes by the lower plate magnet 210.

As a result, in spite of the magnetization of the lower conductive thin film portion 130 formed by the lower plate magnet 220, the upper gap distance d2 of the conductive pole 100 is maintained at the same level as the lower gap distance d1 .

As described above, in the present invention, the conductive pawls 100 are formed on the upper and lower end surfaces of the bar-shaped abbreviated conductive pillar 110 as a base, and the ferromagnetic formed upper conductive thin film portion 120 and the ferromagnetic formed lower conductive thin film portion 130 The alignment of the conductive pawls 100 can be precisely and easily performed when the rubber test socket 1000 is manufactured.

14 is a flowchart showing a process of manufacturing a conductive pole for a rubber test socket for semiconductor test according to a third process embodiment of the present invention.

Step S110: In order to manufacture the conductive pawl 100 for the semiconductor test rubber socket for electrically connecting the semiconductor package to be inspected to the semiconductor inspection equipment, first, Filling a plurality of through holes (11) in the vertical direction of the hole block (10) by mixing the volume ratio of the liquid insulator at a predetermined first volume ratio and corresponding to the first volume ratio.

Here, a preliminary curing step may be performed in which the liquid insulator filled in the through hole 11 through the pillar filling step is cured first to become an elastic insulator before the thin film laminating step is performed.

Step S120: Then, the volume ratio of the liquid insulator to the volume of the second and third conductive powders 122 and 132 is mixed with a predetermined volume ratio smaller than the first volume ratio to penetrate the mixture corresponding to the second volume ratio And a thin film lamination step of adding the thin film to the upper and lower portions of the hole 11, respectively.

Here, when the mixture corresponding to the second volume ratio is added to the upper and lower portions of the through-hole 11 without going through the pre-curing step after the pillar filling step, some mixing at the portion contacting the mixture corresponding to the first volume ratio A layer can occur.

Therefore, the shorter the time to start the final curing step after the addition of the mixture corresponding to the second volume ratio, the thinner the layer of the portion where the mixture corresponding to the first volume ratio and the mixture corresponding to the second volume ratio come into contact with each other.

Step S130: Subsequently, a final curing step of curing the liquid insulator filled in the through hole 11 to become an elastic insulator is performed.

Step S140: Then, the elastic insulation body having undergone the final curing step is separated from the hole block 10 to obtain the conductive pole 100.

15 is a flowchart showing a process of manufacturing a conductive pole for a rubber test socket for semiconductor testing according to a fourth process embodiment of the present invention.

Step S210: In order to manufacture a conductive pole 100 for a semiconductor test rubber socket for electrically connecting a semiconductor package to be inspected to a semiconductor inspection device, first, a non-magnetic permeability at a Kelvin temperature of 300K 1 is filled with a plurality of through holes 11 formed in the vertical direction of the hole block 10, in which a liquid insulator having the conductive powder 112 mixed therein is filled.

Here, a preliminary curing step may be performed in which the liquid insulator filled in the through hole 11 through the pillar filling step is cured first to become an elastic insulator before the thin film laminating step is performed.

Step S220: A thin film stacking step of adding, to the upper and lower portions of the through hole 11, a liquid insulator formed by mixing the second conductive powder 122 having a relative magnetic permeability at a Kelvin temperature of 300K and exceeding nickel, ≪ / RTI >

Also in this case, when a liquid insulator in which the second conductive powder 122 is mixed in the upper part and the lower part of the through hole 11 is added without performing the pre-curing step after the pillar filling step, a liquid phase insulator mixed with the first conductive powder 112 Some intermixing layer may occur at the portion contacting the insulator.

Therefore, as the time to start the final curing step after the addition of the liquid insulator mixed with the second conductive powder 122 becomes shorter, the liquid insulator in which the liquid insulator mixed with the first conductive powder 112 and the second conductive powder 122 are mixed The layer of the contact portion is made thin.

Step S230: Subsequently, a final curing step of curing the liquid insulator filled in the through hole 11 to become an elastic insulator is performed.

Step S240: Then, the elastic insulation body that has undergone the final curing step is separated from the hole block 10 to obtain the conductive pole 100.

The present invention can also be embodied in the form of computer readable code on a computer readable recording medium. At this time, the computer-readable recording medium includes all kinds of recording apparatuses in which data that can be read by a computer system is stored.

Examples of the computer-readable recording medium include a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage, and the like, and may be implemented in the form of a carrier wave . The computer-readable recording medium can also be stored and executed by a computer-readable code in a distributed manner on a networked computer system. And functional programs, codes, and code segments for implementing the present invention can be easily deduced by programmers skilled in the art to which the present invention belongs.

10: Hall block
11: Through hole
20: Pallet
100, 100 ': Conductive pole
110: Abbreviation forming conductive column portion
111: first elastic insulator
112: first conductive powder
120: Strongly-shaped upper conductive thin film portion
121: second elastic insulator
122: second conductive powder
130: Strongly-shaped lower conductive thin film portion
131: third elastic insulator
132: third conductive powder
210: top plate magnet
211: Magnetic arm
212: isolation block
213: Insulation sheet
220: Lower magnet
300: insulation block
400: insulating sheet
500: Joint frame
600: adhesion layer
700: guide frame

Claims (8)

A rubber socket for semiconductor testing for electrically connecting a semiconductor package to a semiconductor inspection device,
Shaped conductive pillar portion 110 connected to the upper end of the abbreviated conductive pillar portion, a thin-film shaped upper conductive thin film portion 120 connected to the upper end of the weakly shaped conductive pillar portion, A plurality of conductive pawls 100 having a thin film-shaped ferromagnetic-formed lower conductive thin film portion 130 connected to a lower end portion of the forming conductive pillar portion;
A plurality of through holes penetrating in a vertical direction are formed so that a plurality of the conductive pawls can be fitted as an electrical insulator having a predetermined elasticity to an external force and the inner walls of the through holes surround the outer walls of the conductive pawls, An insulation block 300 for gripping the electrode assembly 300;
An insulating sheet 400 attached to a lower surface of the insulating block and having an opening communicating with the through hole so that a lower portion of the conductive pole is inserted into the opening hole so that a lower surface of the conductive pole is exposed downward;
A joint frame (500) sandwiched between a rim region of the insulation block and the insulation sheet and protruding from an outer wall of the insulation block to interface with a connection with the semiconductor inspection equipment;
And a rubber socket for semiconductor testing.
The method according to claim 1,
The abbreviated-shaped conductive pillar portion 110 is formed in a substantially U-
A first elastic insulator 111 in the form of a bar having elasticity with respect to external force and electrically insulated;
A first conductive powder 112 having a ratio of volume 10 to volume 15 of not less than 15 and less than 15 volume of the first elastic insulator, wherein the plurality of particles are embedded in the inside of the first elastic insulator to exhibit conductivity;
And,
The ferromagnetic-formed upper conductive thin film portion 120 may be formed of,
A second elastic insulator 121 in the form of a thin film which is elastically and electrically insulated from external force;
A second conductive powder 122 having a ratio of volume 10 to less than 5 and less than 5 volume of the second elastic insulator, wherein the plurality of particles are embedded in the inside of the second elastic insulator to exhibit conductivity;
And,
The ferromagnetic-formed lower conductive thin-film portion 130 may be formed by,
A third elastic insulator 131 in the form of a thin film that is elastically and electrically insulated from external force;
A third conductive powder 132 having a ratio of volume 10 to less than 5 but less than 5 volume of the third elastic insulator;
And a rubber socket for semiconductor testing.
The method according to claim 1,
The abbreviated-shaped conductive pillar portion 110 is formed in a substantially U-
A first elastic insulator 111 in the form of a bar having elasticity with respect to external force and electrically insulated;
A first conductive powder 112 having a plurality of grains embedded in the first elastic insulator and exhibiting conductivity and exhibiting a specific magnetic permeability at a Kelvin temperature of 300K or less;
And,
The ferromagnetic-formed upper conductive thin film portion 120 may be formed of,
A second elastic insulator 121 in the form of a thin film which is elastically and electrically insulated from external force;
A second conductive powder 122 having a plurality of pellets embedded in the second elastic insulator and exhibiting conductivity and having a relative permeability exceeding nickel (Ni) at a Kelvin temperature of 300K;
And,
The ferromagnetic-formed lower conductive thin-film portion 130 may be formed by,
A third elastic insulator 131 in the form of a thin film that is elastically and electrically insulated from external force;
A third conductive powder 132 having a plurality of grains embedded in the third elastic insulator and exhibiting conductivity and having a relative magnetic permeability at a Kelvin temperature of 300K exceeding nickel (Ni);
And a rubber socket for semiconductor testing.
1. A method of manufacturing a conductive pole for a semiconductor test rubber socket for electrically connecting a semiconductor package to a semiconductor inspection device,
(a) mixing a volume ratio of the liquid insulator to a volume of the conductive powder at a predetermined first volume ratio, and filling the mixture corresponding to the first volume ratio in a plurality of through holes opened in the vertical direction of the hole block;
(b) mixing the volume ratio of the liquid-phase insulator to the volume of the conductive powder at a second volume ratio smaller than the first volume ratio, and forming a mixture corresponding to the second volume ratio in the form of a thin film A thin film laminating step to be added;
(c) a final curing step of curing the liquid insulator filled in the through-holes so as to become an elastic insulator;
(d) separating the elastic insulation after the final curing step from the hole block;
Wherein the conductive pawl is made of a conductive material.
The method of claim 4,
Between the step (a) and the step (b)
A preliminary curing step of curing the liquid insulator filled in the through hole through the pillar filling step so as to become an elastic insulator;
Wherein the step of forming the conductive pawl includes the step of forming the conductive pawl.
1. A method of manufacturing a conductive pole for a semiconductor test rubber socket for electrically connecting a semiconductor package to a semiconductor inspection device,
(a) a pillar filling step of filling a liquid insulator mixed with a first conductive powder having a specific magnetic permeability at a Kelvin temperature of 300K or less into a plurality of through holes opened in a vertical direction of the hole block;
(b) a thin film laminating step of adding a liquid insulator mixed with a second conductive powder having a relative permeability exceeding nickel at a Kelvin temperature of 300K to the upper and lower portions of the through holes, respectively;
(c) a final curing step of curing the liquid insulator filled in the through-holes so as to become an elastic insulator;
(d) separating the elastic insulation after the final curing step from the hole block;
Wherein the conductive pawl is made of a conductive material.
The method of claim 6,
Between the step (a) and the step (b)
A preliminary curing step of curing the liquid insulator filled in the through hole through the pillar filling step so as to become an elastic insulator;
Wherein the step of forming the conductive pawl includes the step of forming the conductive pawl.
A computer-readable recording medium recording a program for causing a computer to execute a method of manufacturing a conductive pole for a rubber test socket for semiconductor testing according to any one of claims 4 to 7.

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