JP3753145B2 - Anisotropic conductive sheet and method for manufacturing the same, adapter device and method for manufacturing the same, and electrical inspection device for circuit device - Google Patents

Description

  The present invention relates to an anisotropic conductive sheet that can be suitably used for electrical inspection of a circuit device such as a printed circuit board, a manufacturing method thereof, an adapter device and a manufacturing method thereof, and the anisotropic conductive sheet or adapter device. It is related with the electrical inspection apparatus of the circuit apparatus provided with.

In general, for a circuit board for configuring or mounting an integrated circuit device or other electronic component, the wiring pattern of the circuit board is expected before the electronic component is assembled or before the electronic component is mounted. It is necessary to inspect its electrical characteristics to confirm that it has performance.
Conventionally, as a method of performing an electrical inspection of a circuit board, a test electrode device in which a plurality of test electrodes are arranged according to lattice point positions arranged vertically and horizontally, and a circuit board to be inspected on the test electrodes of this test electrode device A method of using a combination with an adapter for electrically connecting the electrodes to be inspected is known. The adapter used in this method is a printed wiring board called a pitch conversion board.
This adapter has a plurality of connection electrodes arranged in accordance with a pattern corresponding to the inspection target electrode of the circuit board to be inspected on one surface, and a lattice point having the same pitch as the inspection electrode of the inspection electrode device on the other surface. A plurality of terminals having a plurality of terminal electrodes arranged at positions, and comprising a current supply connection electrode and a voltage measurement connection electrode arranged in accordance with a pattern corresponding to an electrode to be inspected on a circuit board to be inspected on one side Are known, and the other adapter has, for example, a plurality of terminal electrodes arranged at lattice point positions at the same pitch as the inspection electrodes of the inspection electrode device on the other surface. It is used for an open / short test of each circuit on a circuit board, and the latter adapter is used for an electrical resistance measurement test for each circuit on the circuit board.
Therefore, in the electrical inspection of a circuit board, in general, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, there is a difference between the circuit board to be inspected and the adapter. It has been practiced to interpose a directionally conductive elastomer sheet.

This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or has a number of pressurized conductive portions that show conductivity only in the thickness direction when pressed.
As such an anisotropically conductive elastomer sheet, those having various structures are conventionally known, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer (for example, patents). Reference 1), in which conductive magnetic metal particles are non-uniformly dispersed in an elastomer to form a number of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other. (For example, refer to Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, refer to Patent Document 3).
For a circuit board having electrodes to be inspected with a small arrangement pitch, an anisotropic conductive elastomer sheet in which a conductive path forming portion is formed according to a pattern corresponding to the pattern of the electrodes to be inspected on the circuit board is high. This is preferable in that connection reliability can be obtained.

However, such an anisotropically conductive elastomer sheet is manufactured as a single product and handled alone, and has a specific positional relationship with respect to the adapter and the circuit board in electrical connection work. It is necessary to hold and fix.
However, in the means for achieving the electrical connection of the circuit board using an independent anisotropic conductive elastomer sheet, the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected (hereinafter referred to as “electrode pitch”), That is, there is a problem that it becomes difficult to align and hold the anisotropic conductive elastomer sheet as the distance between the centers of the electrodes to be inspected adjacent to each other decreases.
Even when the desired alignment and holding / fixing are realized once, when a thermal history due to a temperature change is received, the degree of stress due to thermal expansion and contraction is determined by the circuit board to be inspected. There is a problem in that since the constituent material and the material constituting the anisotropic conductive elastomer sheet are greatly different, the electrical connection state is changed and a stable connection state is not maintained.

  Conventionally, in order to solve the above-described problems, terminals having connection electrodes arranged on the front surface in accordance with patterns corresponding to the electrodes to be inspected on the circuit board to be inspected and arranged on the back surface in accordance with the lattice point positions There has been proposed an adapter device including an adapter main body having electrodes and an anisotropic conductive elastomer sheet integrally provided on the surface of the adapter main body (see, for example, Patent Document 4 and Patent Document 5).

And in manufacture of such an adapter apparatus, an anisotropically conductive elastomer sheet is formed as follows, for example.
First, as shown in FIG. 27, a conductive magnetic material is formed on the surface of the adapter main body 90 on which the connection electrode 91 is formed (the upper surface in FIG. 27) and is cured into a polymer material forming material that becomes an elastic polymer material. The anisotropic conductive elastomer material layer 95A is formed by applying the anisotropic conductive elastomer material in which the particles are dispersed, for example, by screen printing.

  Next, as shown in FIG. 28, for example, the ferromagnetic part 81 is arranged according to the same pattern as the inspection target electrode of the circuit board to be inspected, and the non-magnetic part is provided in a part other than the ferromagnetic part 81. A ferromagnetic body 86 is arranged according to a pattern of one template (hereinafter referred to as “upper mold”) 80 in which 82 is arranged, and an inspection target electrode of the circuit board to be inspected and a palm pattern, The other mold plate (hereinafter referred to as “lower mold”) 85 in which the non-magnetic body part 87 is disposed in a portion other than the ferromagnetic body part 86 is used, and between the upper mold 80 and the lower mold 85. The adapter main body 90 in which the anisotropic conductive elastomer material layer 95 </ b> A is formed has a connection electrode 91 positioned between the ferromagnetic part 81 of the upper die 80 and the ferromagnetic part 86 of the lower die 85. Furthermore, the upper surface of the upper mold 80 and the lower mold 85 are arranged. Placing a pair of electromagnets 83 and 88 on the lower surface.

Then, by actuating the electromagnets 83 and 88, a parallel magnetic field is applied in a direction from the ferromagnetic part 81 of the upper die 80 toward the ferromagnetic part 86 of the lower die 85 corresponding thereto. At this time, each of the ferromagnetic part 81 of the upper die 80 and the ferromagnetic part 86 of the lower die 85 acts as a magnetic pole, and therefore, the ferromagnetic part 81 of the upper die 80 and the ferromagnetic part 86 of the lower die 85. A magnetic field having a larger strength than the other regions acts on the region between the two regions. As a result, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles dispersed in the anisotropic conductive elastomer material layer 95A are separated from the ferromagnetic portion 81 of the upper mold 80 and the lower mold. It moves toward the part located between the 85 ferromagnetic parts 86, that is, the part located on the connection electrode 91 of the adapter main body 90, gathers in that part, and further aligns in the thickness direction.
In this state, the anisotropic conductive elastomer material layer 95A is subjected to, for example, a curing process by heating, thereby insulating a plurality of conductive path forming portions 96 extending in the thickness direction from each other as shown in FIG. An anisotropic conductive elastomer sheet 95 composed of an insulating portion 97 is integrally formed on the upper surface of the adapter main body 90 in a state where the conductive path forming portion 96 is disposed on the connection electrode 91, and thus the adapter device Is manufactured.

  According to such an adapter device, in the electrical inspection of the circuit board, it is not necessary to align the anisotropic conductive elastomer sheet, and it is also good against environmental changes such as thermal history due to temperature changes. The electrical connection state is stably maintained, so that high connection reliability is obtained.

However, the adapter device has the following problems.
As a circuit board for constructing or mounting an electronic component, it is known that its electrodes are arranged in a frame shape, for example, along four sides of a rectangle. In order to perform an electrical inspection of such a circuit board As shown in FIG. 30, it is necessary to use an adapter device having an adapter body 90 in which connection electrodes 91 are arranged in a frame shape along four sides of a rectangle. In such an adapter device, an anisotropic conductive elastomer sheet 95 is provided in, for example, a rectangular region including the connection electrode 91 on the surface of the adapter main body 90, as indicated by a one-dot chain line in FIG.

  However, since such an anisotropic conductive elastomer sheet 95 is entirely an insulating portion, the anisotropic conductive elastomer sheet 95 is present in the central portion of the anisotropic conductive elastomer material layer 95A in the formation of the anisotropic conductive elastomer sheet 95. As a result of the movement distance of the conductive particles being extremely long, it is difficult to reliably gather the conductive particles in the portion to be the conductive portion. For this reason, the obtained conductive path forming portion 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remain in the insulating portion 97. A reliable elastomer layer cannot be formed reliably.

In addition, in integrated circuit devices, the number of electrodes has increased with the increase in functionality and capacity, and the arrangement pitch of electrodes, that is, the distance between the centers of adjacent electrodes has decreased, further increasing the density. Tend to. Therefore, when electrical inspection is performed on a circuit board for configuring or mounting such an integrated circuit device, it is necessary to use an adapter device in which connection electrodes are arranged with a small pitch and a high density. is necessary.
Thus, in the manufacture of such an adapter device, when the anisotropic conductive elastomer sheet 95 is formed on the surface of the adapter main body 90, the ferromagnetic parts 81 and 86 are naturally arranged at a very small pitch. It is necessary to use the upper mold 80 and the lower mold 85 that are formed.

  However, when such an upper die 80 and lower die 85 are used to form the anisotropic conductive elastomer sheet 95 as described above, each of the upper die 80 and the lower die 85 is provided as shown in FIG. , The distance between the ferromagnetic parts 81a, 86a and the adjacent ferromagnetic parts 81b, 86b is small, and the presence of the adapter main body 90 allows the upper die 80 and the lower die to vary depending on their thickness. Since the interval of 85 is considerably large, not only the direction (indicated by arrow X) from the ferromagnetic part 81a of the upper die 80 toward the ferromagnetic part 86a of the lower die 85 corresponding thereto, The magnetic field also acts in the direction (indicated by the arrow Y) from the ferromagnetic portion 81a of the mold 80 toward the ferromagnetic portion 86b adjacent to the corresponding ferromagnetic portion 86a of the lower mold 85. Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles are located between the ferromagnetic part 81a of the upper die 80 and the corresponding ferromagnetic part 86a of the lower die 85. The conductive magnetic particles are also collected in a portion located between the ferromagnetic part 81a of the upper die 80 and the ferromagnetic part 86b of the lower die 85, and the conductive It is difficult to sufficiently orient the conductive magnetic particles in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, an anisotropic conductive elastomer sheet having a desired conductive portion and insulating portion cannot be obtained. .

  Further, in forming the anisotropic conductive elastomer sheet, as described above, two mold plates of the upper mold 80 and the lower mold 85 are necessary. These templates are individually manufactured according to the target adapter device, and the manufacturing process is complicated, so that the manufacturing cost of the adapter device is extremely high, This increases the inspection cost of the circuit device.

In addition, as an adapter device, after forming a conductive elastomer layer on the surface of the adapter body, laser processing is performed on the conductive elastomer layer to remove a part thereof, thereby connecting each connection electrode of the adapter body. There has been proposed one in which conductive path forming portions independent from each other are formed (see, for example, Patent Document 6).
According to such an adapter device, since each of the conductive path forming portions is formed in an independent state, the required insulation can be reliably obtained between the adjacent conductive path forming portions.
However, in this adapter device, since each of the conductive path forming portions is supported only by the connection electrodes of the adapter main body, there is a problem that it is easy to drop off from the adapter main body and has low durability.
Moreover, when forming a conductive path formation part, there exists a problem that there exists a possibility of damaging an adapter main body by laser processing.

JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 4-151564 JP-A-6-82531 Japanese Patent Laid-Open No. 10-229270

The present invention has been made based on the above circumstances, and a first object of the present invention is to provide required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. It can be reliably achieved, and even if the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection is reliably achieved for each of the electrodes. It is another object of the present invention to provide an anisotropic conductive sheet that can be manufactured at a low cost and a method for manufacturing the same.
The second object of the present invention is to reliably achieve the required electrical connection for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, and to the circuit to be inspected. Even when the electrodes to be inspected of the device are arranged with a small pitch and a high density, the required electrical connection can be reliably achieved for the circuit device, and the device is manufactured at a low cost. It is another object of the present invention to provide a highly durable adapter device and a manufacturing method thereof.
The third object of the present invention is to perform a required electrical inspection for the circuit device reliably regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, and to the circuit to be inspected. An electrical inspection device for a circuit device capable of surely executing a required electrical inspection for the circuit device even when the electrodes to be inspected are arranged at a minute pitch and at a high density. It is to provide.

The method for manufacturing an anisotropic conductive sheet according to the present invention is a method for manufacturing an anisotropic conductive sheet in which a plurality of conductive path forming portions arranged in a specific pattern and extending in the thickness direction are mutually insulated by an insulating portion. There,
A metal mask is formed on the surface of the conductive elastomer layer supported on the releasable support plate according to a specific pattern, and then the conductive elastomer layer is laser-processed to form the metal mask on the releasable support plate. Conductive path forming portions arranged according to a specific pattern are formed, and an insulating material layer made of a material that is cured and becomes an elastic polymer substance is formed between the conductive path forming portions and cured. And a step of forming an insulating portion.

In the method for producing the anisotropic conductive sheet of the present invention, the laser processing is preferably performed by a carbon dioxide laser.
Moreover, in this anisotropic conductive sheet manufacturing method , it is preferable to form a metal mask by plating the surface of the conductive elastomer layer.
Further, a thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and exposed from the opening of the resist layer in the thin metal layer. It is preferable to form a metal mask by plating the surface of the part.

In the method for producing an anisotropic conductive sheet according to the present invention, the conductive elastomer layer is dispersed in an insulating elastic polymer material in a state where conductive particles exhibiting magnetism are aligned in the thickness direction. It is preferable that
In such a method for producing an anisotropic conductive sheet, a conductive material comprising magnetized conductive particles contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. Forming a conductive elastomer layer by forming a conductive elastomer material layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer. preferable.

  The anisotropic conductive sheet of the present invention is obtained by the above-described method for manufacturing an anisotropic conductive sheet.

The adapter device manufacturing method of the present invention includes an adapter main body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface, and connection of the adapter main body Anisotropic conductivity comprising a plurality of conductive path forming portions extending in the thickness direction located on the respective surfaces of the connection electrodes, and insulating portions that insulate them from each other, provided integrally on the electrode region A method of manufacturing an adapter device comprising a seat,
A connection electrode for the adapter body on the surface of a conductive elastomer layer in which conductive particles exhibiting magnetism are dispersed in an elastic polymer material supported on a releasable support plate so as to be aligned in the thickness direction. A metal mask is formed according to the specific pattern according to the above, and then the conductive elastomer layer is laser processed to form a conductive path forming portion arranged according to the specific pattern on the releasable support plate,
The releasable support plate on which the conductive path forming portion is formed is overlaid on the adapter body in which the insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed on the connection electrode region. Thus, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other, and the insulating portion material layer is cured in this state to form an insulating portion. It has the process to perform.

The adapter device manufacturing method of the present invention also includes a plurality of connection electrode pairs each comprising two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. An adapter main body having a connection electrode region formed with a plurality of extending in the thickness direction located on the surface of each of the connection electrodes provided integrally on the connection electrode region of the adapter main body A method of manufacturing an adapter device comprising a conductive path forming part and an anisotropic conductive sheet comprising an insulating part that insulates the conductive path forming part from each other, wherein the adapter device is magnetic in an elastic polymer material supported on a releasable support plate. A specific pattern relating to the connection electrode of the adapter body on the surface of the conductive elastomer layer in which the conductive particles exhibiting the orientation are dispersed so as to be aligned in the thickness direction A metal mask is formed according to the process, and then the conductive elastomer layer is laser-processed to form a conductive path forming portion arranged according to the specific pattern on the releasable support plate,
The releasable support plate on which the conductive path forming portion is formed is overlaid on the adapter body in which the insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed on the connection electrode region. Thus, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other, and the insulating portion material layer is cured in this state to form an insulating portion. It has the process to perform.

In the method for manufacturing an adapter device according to the present invention, the laser processing is preferably performed by a carbon dioxide laser.
In the method for manufacturing the adapter device, the metal mask is preferably formed by plating the surface of the conductive elastomer layer.
Further, a thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and exposed from the opening of the resist layer in the thin metal layer. It is preferable to form a metal mask by plating the surface of the part.

In the method for manufacturing an adapter device according to the present invention, the conductive elastomer layer is dispersed in an insulating elastic polymer substance in a state where conductive particles exhibiting magnetism are aligned in the thickness direction. Preferably there is.
In such a manufacturing method of an adapter device, for a conductive elastomer, a conductive material exhibiting magnetism is contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. It is preferable to form a conductive elastomer layer by forming a material layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer.

  The adapter device of the present invention is obtained by the above-described method for manufacturing an adapter device.

  An electrical inspection device for a circuit device according to the present invention comprises the above anisotropic conductive sheet or the above adapter device.

According to the method for producing an anisotropic conductive sheet of the present invention, a conductive path forming portion is formed by laser processing of the conductive elastomer layer, so that a conductive path forming portion having the desired conductivity is obtained with certainty. be able to. Moreover, in order to form an insulating part by forming a material layer for elastomer between these conductive path forming parts after forming a plurality of conductive path forming parts arranged according to a specific pattern, An insulating part in which no conductive particles are present can be reliably obtained. In addition, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
Therefore, according to the anisotropic conductive sheet of the present invention obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. At the same time, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection to each of the electrodes can be reliably achieved, and the manufacturing can be performed at a low cost. can do.

According to the adapter device manufacturing method of the present invention, the conductive elastomer layer is laser processed and a part thereof is removed to form a conductive path forming portion of a desired form. The anisotropic conductive sheet in which the conductive path formation part which has is formed can be obtained reliably.
In addition, after forming a plurality of conductive path forming portions arranged according to a specific pattern related to the connection electrode of the adapter body on the releasable support plate, an elastomer material layer is formed between these conductive path forming portions. Since the insulating portion is formed by forming and curing, an anisotropic conductive sheet on which an insulating portion having no conductive particles is formed can be obtained with certainty.
In addition, it is not necessary to use an expensive mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
In addition, since each of the conductive path forming portions and the insulating portion are integrally formed and are entirely supported by the adapter main body, the conductive path forming portion does not fall off from the adapter main body.
Moreover, since the formation process of the conductive path formation part by laser processing is performed on the releasable support plate, the surface of the adapter main body is not damaged in the formation of the anisotropic conductive sheet.
Therefore, according to the adapter device of the present invention obtained by such a method, the required electrical connection is made to each of the electrodes to be inspected regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. It can be reliably achieved, and even if the electrodes to be inspected are arranged with a small pitch and a high density, the required electrical connection to each of the electrodes to be inspected can be reliably achieved. In addition, the manufacturing cost can be reduced, and higher durability can be obtained.

  According to the electrical inspection apparatus for a circuit device of the present invention, it is possible to reliably perform a required electrical inspection for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. Even if the electrodes to be inspected of the circuit device are arranged with a small pitch and a high density, the required electrical inspection can be reliably performed on the circuit device.

Hereinafter, embodiments of the present invention will be described in detail.
<Anisotropic conductive sheet>
FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of the anisotropic conductive sheet according to the present invention, and FIG. 2 is an explanatory cross-sectional view showing an enlarged main part of the anisotropic conductive sheet shown in FIG. FIG. In this anisotropic conductive sheet 10, a plurality of conductive path forming portions 11 extending in the thickness direction are arranged according to a specific pattern, and an insulating portion 12 that insulates them from each other between adjacent conductive path forming portions 11. Is formed in a state of being integrally bonded to the conductive path forming portion 11. The specific pattern of the conductive path forming portion 11 is a pattern corresponding to a pattern of an electrode to be connected, for example, an inspection target electrode of a circuit device to be inspected.
The conductive path forming part 11 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so that they are aligned in the thickness direction. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain any conductive particles P. The elastic polymer material constituting the conductive path forming portion 11 and the elastic polymer material constituting the insulating portion 12 may be of different types or the same type.

In the illustrated example, on one surface of the anisotropic conductive sheet 10 (upper surface in FIG. 1), a protruding portion in which the conductive path forming portion 11 protrudes from the surface of the insulating portion 12 is formed.
According to such an example, since the degree of compression by pressurization is greater in the conductive path forming portion 11 than in the insulating portion 12, a conductive path having a sufficiently low resistance value is reliably formed in the conductive path forming portion 11, thereby The change in resistance value can be reduced with respect to the change or fluctuation of the applied pressure. As a result, even if the applied pressure applied to the anisotropic conductive sheet 10 is not uniform, each conductive path forming portion 11 It is possible to prevent the occurrence of conductive variation between the two.

The elastic polymer substances constituting the conductive path forming part 11 and the insulating part 12 may be the same or different from each other.
As the elastic polymer material constituting the conductive path forming portion 11 and the insulating portion 12, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. , Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, blocks such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Examples include copolymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber.
In the above, when the anisotropic conductive sheet 10 is required to have weather resistance, it is preferable to use a material other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, use silicone rubber. Is preferred.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is acquired in the obtained conductive path formation part 11, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

As the conductive particles P contained in the conductive path forming portion 11, conductive particles exhibiting magnetism are used because the particles can be easily aligned in the thickness direction by a method described later. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

When the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface (the surface area of the core particles) The ratio of the covering area of the conductive metal with respect to is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the particle diameter of the electroconductive particle P is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ~ 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming portion 11 is easily deformed under pressure, and sufficient electric power is provided between the conductive particles in the conductive path forming portion 11. Contact is obtained.
Further, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. Secondary particles are preferred.
Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropically conductive connector is improved.

  Such conductive particles P are preferably contained in the conductive path forming portion 11 at a volume fraction of 15 to 45%, preferably 20 to 40%. When this ratio is too small, the conductive path forming part 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming portion 11 is likely to be fragile, and the elasticity required for the conductive path forming portion 11 may not be obtained.

In the present invention, the anisotropic conductive sheet 10 is disposed according to a specific pattern on the releasable support plate by laser processing the conductive elastomer layer supported on the releasable support plate. Conductive path forming portions 11 are formed, and an insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed between the conductive path forming portions 11, and the insulating portion material layer is cured. In this way, the insulating portion 12 is formed.
In addition, the conductive elastomer layer is a material for a conductive elastomer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. It is obtained by forming a layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer.
Hereinafter, a method for manufacturing the anisotropic conductive sheet 10 will be specifically described.

<Formation of conductive elastomer layer>
First, a conductive elastomer material in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance is prepared. As shown in FIG. A conductive elastomer material layer 11 </ b> A is formed on the mold release support plate 15 by applying a conductive elastomer material. Here, in the conductive elastomer material layer 11A, as shown in FIG. 4, the conductive particles P exhibiting magnetism are contained in a dispersed state.
Next, by applying a magnetic field in the thickness direction to the conductive elastomer material layer 11A, the conductive particles P dispersed in the conductive elastomer material layer 11A are made conductive as shown in FIG. The material layer 11A is oriented so as to be aligned in the thickness direction. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 11A, or after stopping the action of the magnetic field, the conductive elastomer material layer 11A is cured, as shown in FIG. A conductive elastomer layer 11 </ b> B is formed in a state in which the conductive particles P are contained in the polymer material so that the conductive particles P are aligned in the thickness direction and supported on the releasable support plate 15.

In the above, as a material constituting the releasable support plate 15, metals, ceramics, resins, and composite materials thereof can be used.
As a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the conductive elastomer material layer 11A is set according to the thickness of the conductive path forming portion to be formed.
As a means for applying a magnetic field to the conductive elastomer material layer 11A, an electromagnet, a permanent magnet, or the like can be used.
The strength of the magnetic field applied to the conductive elastomer material layer 11A is preferably 0.2 to 2.5 Tesla.
The curing process of the conductive elastomer material layer 11A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 11A, the time required to move the conductive particles, and the like.

<< Formation of conductive path forming part >>
As shown in FIG. 7, a thin metal layer 16 for a plating electrode is formed on the surface of the conductive elastomer layer 11 </ b> B supported on the releasable support plate 15. Next, as shown in FIG. 8, a plurality of openings 17a are formed on the thin metal layer 16 by photolithography according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected. Then, a resist layer 17 formed with is formed. Thereafter, as shown in FIG. 9, by using the metal thin layer 16 as a plating electrode, a portion of the metal thin layer 16 exposed through the opening 17a of the resist layer 17 is subjected to an electrolytic plating process, whereby the resist layer 17 A metal mask 18 is formed in the opening 17a. In this state, the conductive elastomer layer 11B, the metal thin layer 16 and the resist layer 17 are subjected to laser processing, whereby a part of the resist layer 17, the metal thin layer 16 and the conductive elastomer layer 11B is removed. As a result, as shown in FIG. 10, a plurality of conductive path forming portions 11 arranged according to a specific pattern are formed on the releasable support plate 15. Thereafter, the remaining thin metal layer 16 and metal mask 18 are peeled off from the surface of the conductive path forming portion 11.

In the above, as a method of forming the metal thin layer 16 on the surface of the conductive elastomer layer 11B, an electroless plating method, a sputtering method, or the like can be used.
As a material constituting the metal thin layer 16, copper, gold, aluminum, rhodium, or the like can be used.
The thickness of the metal thin layer 16 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.
The thickness of the resist layer 17 is set according to the thickness of the metal mask 18 to be formed.
As a material constituting the metal mask 18, copper, iron, aluminum unime, gold, rhodium, or the like can be used.
The thickness of the metal mask 18 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.
The laser processing is preferably performed by a carbon dioxide laser, whereby the conductive path forming portion 11 having a desired form can be reliably formed.

<Formation of insulation>
As shown in FIG. 11, a releasable support plate 15A for forming an insulating part is prepared, and a liquid elastomer material is cured on the surface of the releasable support plate 15A to become an insulating elastic polymer material. Is applied to form the insulating part material layer 12A. Next, as shown in FIG. 12, the releasable support plate 15 formed with the plurality of conductive path forming portions 11 is overlaid on the releasable support plate 15A formed with the insulating material layer 12A. Each of the conductive path forming portions 11 is brought into contact with the releasable support plate 15A. Thereby, the insulating material layer 12A is formed between the adjacent conductive path forming portions 11. Thereafter, in this state, the insulating portion material layer 12A is cured to perform insulation between the adjacent conductive path forming portions 11 between the adjacent conductive path forming portions 11, as shown in FIG. It is formed integrally with the forming part 11.
And the anisotropic conductive sheet 10 of the structure shown in FIG. 1 is obtained by making it release from the releasable support plates 15 and 15A.

In the above, as the material constituting the releasable support plate 15A, the same material as the releasable support plate 15 for forming the conductive path forming portion can be used.
As a method of applying the elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the insulating part material layer 12A is set according to the thickness of the insulating part to be formed.
The curing process of the insulating part material layer 12A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating material layer 12A.

According to the above manufacturing method, the conductive elastomer layer 11A, which is dispersed in a state in which the conductive particles P are aligned so as to be aligned in the thickness direction, is laser-processed to remove a part of the conductive elastomer layer 11A. Since the conductive path forming part 11 is formed, it is possible to reliably obtain the conductive path forming part 11 having a desired conductivity filled with a predetermined amount of the conductive particles P.
Further, after forming a plurality of conductive path forming portions 11 arranged according to a specific pattern on the releasable support plate 15, an insulating material layer 12 </ b> A is formed between these conductive path forming portions 11. Since the insulating part 12 is formed by performing the curing process, the insulating part 12 in which the conductive particles P are not present can be reliably obtained.
In addition, it is not necessary to use an expensive mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
Therefore, according to the anisotropic conductive sheet 10 obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. At the same time, even when the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, and to manufacture the electrodes. Cost can be reduced.

<Adapter device>
FIG. 14 is an explanatory cross-sectional view showing a configuration of the adapter device according to the first example of the present invention, and FIG. 15 is an explanatory cross-sectional view showing an adapter main body in the adapter device shown in FIG. This adapter device is used, for example, for performing an open / short test on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter body 20 (upper surface in FIGS. 14 and 15), a connection electrode region in which a plurality of connection electrodes 21 are arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. 25 is formed.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, 2.54 mm, for example. The internal wiring portion 23 is electrically connected to the connection electrode 21.

On the surface of the adapter main body 20, the anisotropic conductive sheet 10 is formed on the connection electrode region 25 in a state of being bonded or closely adhered. In the illustrated example, the anisotropic conductive sheet 10 is formed so as to cover the entire surface of the adapter main body 20.
The anisotropic conductive sheet 10 is arranged according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter main body 20, and each of the conductive path forming portions 11 extending in the thickness direction and adjacent conductive path forming. It is comprised by the insulating part 12 which mutually formed these conductive path formation parts 11 formed in the state integrally adhere | attached on each of the said conductive path formation parts 11 between the parts 11, and the said anisotropic The conductive sheet 10 is disposed such that each of the conductive path forming portions 11 is positioned on the connection electrode 21 of the adapter main body 20.

As shown in an enlarged view in FIG. 16, each conductive path forming portion 11 is configured to be contained in an insulating elastic polymer material in a state where conductive particles P exhibiting magnetism are aligned in the thickness direction. Yes. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain any conductive particles P. The elastic polymer material constituting the conductive path forming portion 11 and the elastic polymer material constituting the insulating portion 12 may be of different types or the same type.
The elastic polymer material constituting the conductive path forming part 11 and the insulating part 12 in the anisotropic conductive sheet 10 and the conductive particles constituting the conductive path forming 11 are the same as those of the anisotropic conductive sheet 10 shown in FIG. Things can be used.

In the illustrated example, the conductive path forming portion 11 forms a protruding portion that protrudes from the surface of the insulating portion 12 on the surface (the upper surface in FIG. 16) of the anisotropic conductive sheet 10.
According to such an example, since the degree of compression by pressurization is greater in the conductive path forming portion 11 than in the insulating portion 12, a conductive path having a sufficiently low resistance value is reliably formed in the conductive path forming portion 11, thereby The change in resistance value can be reduced with respect to the change or fluctuation of the applied pressure. As a result, even if the applied pressure applied to the anisotropic conductive sheet 10 is not uniform, each conductive path forming portion 11 It is possible to prevent the occurrence of conductive variation between the two.

In the present invention, the adapter device described above relates to the connection electrode 21 of the adapter body 20 on the releasable support plate by laser processing the conductive elastomer layer supported on the releasable support plate. Insulation made of an elastomer material that forms conductive path forming portions 11 arranged according to a specific pattern, and the release support plate on which the conductive path forming portions 11 are formed is cured to become an insulating elastic polymer substance. Each of the connection electrodes 21 in the connection electrode region 25 of the adapter main body 20 and the corresponding conductive path formation are formed by superimposing the part material layer on the adapter main body 20 formed on the connection electrode region 25. The insulating part 12 is obtained by making the insulating part 12 in contact with the part 11 and curing the material layer for the insulating part in this state.
In addition, the conductive elastomer layer is a material for a conductive elastomer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. It is obtained by forming a layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer.
Hereinafter, a method for manufacturing the adapter device will be specifically described.

First, the conductive elastomer layer 11B is formed on the releasable support plate 15 in the same manner as in the method for manufacturing the anisotropic conductive sheet 10 shown in FIG. 1, and a metal thin film is formed on the surface of the conductive elastomer layer 11B. A layer 16 is formed, a resist layer 17 and a metal mask 18 are formed on the surface of the thin metal layer 16, and laser processing is performed on the conductive elastomer layer 11B, the thin metal layer 16 and the resist layer 17 in this state. Thus, a plurality of conductive path forming portions 11 arranged on the releasable support plate 15 are formed according to a specific pattern related to the connection electrode 21 of the adapter body 20 (see FIGS. 3 to 10).
On the other hand, as shown in FIG. 17, an insulating material layer 12 </ b> A is formed on the surface of the adapter body 20 by applying a liquid elastomer material that is cured and becomes an insulating elastic polymer substance. Next, as shown in FIG. 18, the releasable support plate 15 on which the plurality of conductive path forming portions 11 are formed is overlaid on the releasable support plate 15A on which the insulating material layer 12A is formed. Then, each of the connection electrodes 21 in the connection electrode region 25 of the adapter main body 20 is brought into contact with the corresponding conductive path forming portion 11. Thereby, the insulating material layer 12A is formed between the adjacent conductive path forming portions 11. Thereafter, in this state, the insulating portion material layer 12A is cured to perform insulation between the adjacent conductive path forming portions 11 between the adjacent conductive path forming portions 11 as shown in FIG. It is formed integrally with the forming portion 11 and the adapter main body 20.
And the adapter apparatus of the structure shown in FIG. 14 by which the anisotropic conductive sheet 10 is integrally formed in the surface of the adapter main body 20 by releasing from the mold release support plate 15 is obtained.

In the above, the adapter main body 20 can be obtained by the normal manufacturing method of a multilayer wiring board.
As a method for applying the elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the insulating part material layer 12A is set according to the thickness of the insulating part 12 to be formed.
The curing process of the insulating part material layer 12A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating material layer 12A.

According to the above manufacturing method, the conductive elastomer layer 11A, which is dispersed in a state in which the conductive particles P are aligned so as to be aligned in the thickness direction, is laser-processed to remove a part of the conductive elastomer layer 11A. In order to form the conductive path forming part 11, it is possible to reliably obtain the anisotropic conductive sheet 10 formed with the desired conductive path forming part 11 filled with a predetermined amount of conductive particles P. it can.
In addition, a plurality of conductive path forming portions 11 arranged in accordance with a specific pattern related to the connection electrode 21 of the adapter main body 20 are formed on the releasable support plate 15, and then between these conductive path forming portions 11. Since the insulating part 12 is formed by forming the elastomer material layer 12A and performing the curing process, it is possible to reliably obtain the anisotropic conductive sheet 10 on which the insulating part 12 in which the conductive particles P are not present is formed. .
In addition, it is not necessary to use an expensive mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
In addition, each of the conductive path forming portions 11 and the insulating portion 12 are integrally formed and are supported by the adapter main body 20, so that the conductive path forming portion 11 does not fall off from the adapter main body 20.
Moreover, since the formation process of the conductive path formation part 11 by laser processing is performed on the releasable support plate 15, the surface of the adapter main body 20 is not damaged in the formation of the anisotropic conductive sheet 10.
Therefore, according to the adapter device obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. And the required electrical connection to each of the electrodes to be inspected can be reliably achieved even when the electrodes to be inspected are arranged with a small pitch and a high density. In addition, the manufacturing cost can be reduced and higher durability can be obtained.

20 is an explanatory cross-sectional view showing the configuration of the adapter device according to the second example of the present invention, and FIG. 21 is an explanatory cross-sectional view showing the adapter main body in the adapter device shown in FIG. This adapter device is used for conducting an electrical resistance measurement test of each wiring pattern on a circuit device such as a printed circuit board, for example, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter body 20 (the upper surface in FIGS. 20 and 21), connection electrodes for current supply (hereinafter referred to as “current supply”) that are electrically connected to the same electrode to be inspected and are spaced apart from each other. A connection electrode region 25 in which a plurality of connection electrode pairs 21a each including a connection electrode 21b and a voltage measurement connection electrode (hereinafter also referred to as a "voltage measurement electrode") 21c are formed. Has been. These connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrodes to be inspected of the circuit device to be inspected.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, 2.54 mm, for example.
Each of the current supply electrode 21 b and the voltage measurement electrode 21 c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.

On the surface of the adapter main body 20, the anisotropic conductive sheet 10 is formed on the connection electrode region 25 in a state of being bonded or closely adhered. In the illustrated example, the anisotropic conductive sheet 10 is formed so as to cover the entire surface of the adapter main body 20.
The anisotropic conductive sheet 10 is arranged according to the same pattern as the specific pattern related to the connection electrodes 21b and 21c in the adapter main body 20, and each of the conductive path forming portions 11 extending in the thickness direction and adjacent conductive Between the path forming portions 11, the conductive path forming portions 11 are formed in a state of being integrally bonded to each of the conductive path forming portions 11, and the conductive path forming portions 11 are insulated from each other. The anisotropic conductive sheet 10 is disposed such that each of the conductive path forming portions 11 is positioned on the connection electrodes 21 b and 21 c of the adapter body 20. The conductive path forming portion 11 and the insulating portion 12 in the anisotropic conductive sheet 10 have basically the same configuration as the anisotropic conductive sheet 10 in the adapter device in the first example. That is, as shown in FIG. 22, each of the conductive path forming portions 11 is configured to be contained in an insulating elastic polymer material in a state where the conductive particles P exhibiting magnetism are aligned in the thickness direction. Yes. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain any conductive particles P.

In the present invention, the adapter device of the second example can be manufactured in the same manner as the adapter device of the first example.
That is, in the adapter device of the second example, the conductive elastomer layer supported on the releasable support plate is laser-processed, so that the connection electrodes 21b of the adapter body 20 are formed on the releasable support plate. The elastomer material which forms the conductive path forming part 11 arranged according to the specific pattern according to 21c, and the releaseable support plate on which the conductive path forming part 11 is formed is cured to become an insulating elastic polymer substance. Each of the connection electrodes 21b and 21c in the connection electrode region 25 of the adapter main body 20 is overlapped on the adapter main body 20 formed on the connection electrode region 25 by an insulating material layer made of It is obtained by forming the insulating part 12 by contacting the corresponding conductive path forming part 11 and curing the insulating part material layer in this state. .
In addition, the conductive elastomer layer is a material for a conductive elastomer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. It is obtained by forming a layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer.

According to the above manufacturing method, the conductive elastomer layer formed by dispersing the conductive particles P in a state of being aligned in the thickness direction is laser-processed to remove a part thereof, whereby a conductive material having a desired form is obtained. Since the path forming part 11 is formed, it is possible to reliably obtain the anisotropic conductive sheet 10 in which the conductive path forming part 11 having the desired conductivity and filled with a predetermined amount of the conductive particles P is formed. .
Further, a plurality of conductive path forming portions 11 arranged according to a specific pattern related to the connection electrodes 21b and 21c of the adapter main body 20 are formed on the releasable support plate, and the space between these conductive path forming portions 11 is formed. Since the insulating part 12 is formed by forming a material layer for elastomer and performing a curing process, the anisotropic conductive sheet 10 having the insulating part 12 in which the conductive particles P are not present can be reliably obtained. .
In addition, it is not necessary to use an expensive mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
In addition, each of the conductive path forming portions 11 and the insulating portion 12 are integrally formed and are supported by the adapter main body 20, so that the conductive path forming portion 11 does not fall off from the adapter main body 20.
Moreover, since the formation process of the conductive path formation part 11 by laser processing is performed on the releasable support plate, the surface of the adapter main body 20 is not damaged in the formation of the anisotropic conductive sheet 10.
Therefore, according to the adapter device obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. And the required electrical connection to each of the electrodes to be inspected can be reliably achieved even when the electrodes to be inspected are arranged with a small pitch and a high density. In addition, the manufacturing cost can be reduced and higher durability can be obtained.

<Electrical inspection equipment for circuit devices>
FIG. 23 is an explanatory diagram showing a configuration of the first example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board having electrodes 6 and 7 to be inspected on both sides, and the circuit device 5 is placed in an inspection execution region E. The holder 2 for holding is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution region E. Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 14 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 14 are arranged in this order from above, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the support plate 56b by a support column 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.

  The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction. As such anisotropically conductive sheets 55a and 55b, those in which the respective conductive path forming portions are formed so as to protrude in the thickness direction on at least one surface are preferable in terms of exhibiting high electrical contact stability.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper adapter device 1a via the conductive path forming portion 11 of the anisotropic conductive sheet 10. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via an anisotropic conductive sheet 55a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device 1b via the conductive path forming portion 11 of the anisotropic conductive sheet 10, and this lower portion The terminal electrode 22 of the side adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state.

  According to the circuit board electrical inspection apparatus described above, the upper side adapter device 1a and the lower side adapter device 1b having the configuration shown in FIG. Regardless, the required electrical inspection can be surely performed for the circuit device 5 and the electrodes 6 and 7 of the circuit device 5 are arranged with a small pitch and a high density. However, the required electrical inspection can be reliably executed for the circuit device 5.

FIG. 24 is an explanatory diagram showing the configuration of a second example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 to be inspected are formed. The holder 2 for holding in the inspection execution area E is provided, and the holder 2 is provided with positioning pins 3 for arranging the circuit device 5 at an appropriate position in the inspection execution area E.
Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 20 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 20 are arranged in this order from the top, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the support plate 56b by a support column 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.
The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper adapter device 1a. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a. ing. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 has a conductive path of the anisotropic conductive sheet 10 on both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the lower adapter device 1b. The terminal electrode 22 of the lower adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state. Specifically, a constant current is supplied between the current supply electrode 21b in the upper-side adapter device 1a and the current-supply electrode 21b in the lower-side adapter device 1b, and in the upper-side adapter device 1a. One of the plurality of voltage measuring electrodes 21c is designated, and the designated one voltage measuring electrode 21c is connected to the inspected electrode 5 on the upper surface side electrically connected to the voltage measuring electrode 21c. A voltage is measured between the voltage measuring electrode 21c in the lower adapter device 1b and electrically connected to the corresponding electrode 6 to be inspected on the lower surface side. Based on the obtained voltage value, the designated voltage is measured. The electrical resistance value of the wiring pattern formed between the upper electrode under test 5 electrically connected to one voltage measuring electrode 21c and the corresponding other electrode 6 under test is taken. It is. And the electrical resistance of all the wiring patterns is measured by sequentially changing the designated voltage measuring electrode 21c.

  According to the circuit board electrical inspection apparatus described above, since the upper side adapter device 1a and the lower side adapter device 1b having the configuration shown in FIG. Regardless, the required electrical inspection can be surely performed for the circuit device 5 and the electrodes 6 and 7 of the circuit device 5 are arranged with a small pitch and a high density. However, the required electrical inspection can be reliably executed for the circuit device 5.

The present invention is not limited to the above embodiment, and various modifications can be made.
For example, in the anisotropic conductive sheet 10, it is not essential that the protruding portion is formed in the conductive path forming portion 11, and the entire surface of the anisotropic conductive sheet 10 may be flat.
In the adapter device, the anisotropic conductive sheet 10 may be formed so as to cover only the connection electrode region 25 of the adapter body 20.
Further, in the electrical inspection device for a circuit device, an adapter constituted by an adapter main body and an anisotropic conductive sheet shown in FIG. 1, which is a separate body from the adapter main body, instead of the adapter device shown in FIG. An apparatus can be used.
The circuit device to be inspected is not limited to a printed circuit board, but may be a semiconductor integrated circuit device such as a package IC or MCM, or a circuit device formed on a wafer.

  As a method of forming the conductive elastomer layer 11B supported on the releasable support plate 15, conductive particles exhibiting magnetism are arranged in the thickness direction in an insulating elastic polymer material manufactured in advance. Utilizing a method in which a conductive elastomer sheet dispersed in such a state is adhered and supported on the releasable support plate 15 by the adhesive property of the conductive elastomer sheet or by an appropriate adhesive. You can also. Here, the conductive elastomer sheet is formed, for example, by forming a conductive elastomer material layer between two resin sheets and applying a magnetic field in the thickness direction to the conductive elastomer layer. It is manufactured by orienting the conductive particles in the material layer to be aligned in the thickness direction and curing the material layer for the conductive elastomer while continuing the action of the magnetic field or after stopping the action of the magnetic field. be able to.

  Moreover, in formation of the conductive path formation part 11, a conductive path formation part can also be formed by removing all parts other than the part used as the conductive path formation part in the conductive elastomer layer 11B by laser processing. However, as shown in FIG. 25 and FIG. 26, the conductive path forming portion 11 can be formed by removing only the peripheral portion of the portion that becomes the conductive path forming portion in the conductive elastomer layer 11 </ b> B. In this case, the remaining part of the conductive elastomer layer 11 </ b> B can be removed by mechanically peeling from the releasable support plate 15.

  Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.

<Example 1>
(1) Manufacture of adapter body:
An adapter body (20) having the following specifications was manufactured according to the configuration shown in FIG.
That is, the adapter body (20) has a vertical and horizontal dimension of 40 mm × 80 mm, the substrate material is a glass fiber reinforced epoxy resin, and the connection electrode (21) is a rectangle having a dimension of 50 μm × 100 μm, and 100 μm. A total of 1024 pieces are arranged at a pitch of. Further, the terminal electrodes (22) are circular with a diameter of 300 μm, and a total of 1024 terminal electrodes (22 μm) are arranged at a pitch of 500 μm.

(2) Formation of conductive elastomer layer:
Conductive elastomer is obtained by dispersing 400 parts by weight of conductive particles (the ratio of gold to the core particles is 2% by weight) in which core particles made of nickel are coated in 100 parts by weight of addition-type liquid silicone rubber. Preparation materials were prepared. By applying this conductive elastomer material to the surface of a releasable support plate (15) made of stainless steel having a thickness of 5 mm by screen printing, the thickness is reduced to 0 on the releasable support plate (15). A .05 mm conductive elastomer material layer (11A) was formed (see FIGS. 3 and 4).
Next, a release treatment support plate 15 is obtained by subjecting the conductive elastomer material layer (11A) to curing at 120 ° C. for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet. A conductive elastomer layer (11B) having a thickness of 0.05 mm supported thereon was formed (see FIGS. 5 and 6).

(3) Formation of conductive path forming portion:
A thin metal layer (16) made of copper having a thickness of 0.3 μm is formed by subjecting the surface of the conductive elastomer layer (11B) supported on the releasable support plate (15) to electroless plating. On the thin metal layer (16), a rectangular 1024 openings (17a) each having a size of 50 μm × 100 μm are formed at a pitch of 100 μm by a photolithography technique. 17) was formed. Thereafter, a metal mask (18) made of copper having a thickness of 20 μm was formed in the opening (17a) of the resist layer (17) by subjecting the surface of the metal thin layer (16) to electrolytic plating. In this state, the conductive elastomer layer (11B), the metal thin layer (16), and the resist layer (17) are subjected to laser processing using a carbon dioxide gas laser device, so that the releasable support plates (15 ) 1024 conductive path forming portions (11) supported thereon were formed, and then the remaining thin metal layer (16) and metal mask (18) were peeled off from the surface of the conductive path forming portion (11) ( (See FIG. 10).
In the above, the laser processing conditions by the carbon dioxide laser device are as follows. That is, a carbon dioxide gas laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) is used as an apparatus, and a laser beam is applied to one processing point under the conditions of a laser beam diameter of 60 μm and a laser output of 0.8 mJ. Was irradiated with 10 shots to perform laser processing.

(4) Formation of insulating part:
By applying addition-type liquid silicone rubber to the surface of the adapter body (20), an insulating part material layer (12A) having a thickness of 0.05 mm is formed. On the insulating part material layer (12A), By aligning and superposing the releasable support plate (15) on which 1024 conductive path forming portions (11) are formed, each of the connection electrodes (22) of the adapter body (20) and each of the connection electrodes (22) The corresponding conductive path forming part (11) was brought into contact. Then, by applying a pressure of 20 kgf to the releasable support plate (15), the thickness of the insulating part material layer (12A) is set to 0.04 mm, and the thickness of the conductive path forming part (11) is set to 0.05 mm. In this state, the insulating material layer (12A) is cured under the conditions of 120 ° C. and 1 hour, so that the adjacent conductive path forming portion (11) is cured. An insulating part (12) was formed between them, and then the mold was released from the releasable support plate (15) to produce the adapter device of the present invention (see FIGS. 17 to 19). The anisotropic conductive sheet in this adapter device has a conductive path forming portion (11) thickness of 0.05 mm, an insulating portion (12) thickness of 0.04 mm, a conductive path forming portion (11) pitch of 100 μm, and an insulating material. The protruding height of the conductive path forming part (11) from the part (12) is 0.01 mm.

<Example 2>
(1) Manufacture of adapter body:
An adapter body (20) having the following specifications was manufactured according to the configuration shown in FIG.
That is, the adapter body (20) has a vertical and horizontal dimension of 40 mm × 80 mm, the substrate material is a glass fiber reinforced epoxy resin, and the connection electrode (21) is a rectangle having a dimension of 50 μm × 100 μm, and 100 μm. A total of 1024 pieces are arranged at a pitch of. Further, the terminal electrodes (22) are circular with a diameter of 300 μm, and a total of 1024 terminal electrodes (22 μm) are arranged at a pitch of 500 μm.

(2) Formation of conductive elastomer layer:
After adding and mixing 25 parts by volume of conductive particles having an average particle diameter of 20 μm to 100 parts by volume of a mixture of two liquid type addition type liquid silicone rubbers A and B mixed in equal proportions A conductive elastomer material was prepared by performing a defoaming treatment under reduced pressure. Here, as the conductive particles, nickel particles are used as core particles, and the core particles are subjected to electroless gold plating (average coating amount: an amount that is 5% by weight of the weight of the core particles).

Prepare two sheets of a polyester resin sheet (product name “Mattle Mirror S10”, manufactured by Toray Industries, Inc.) having a glossy surface (0.04 μm surface roughness) and a non-glossy back surface and a thickness of 0.1 mm. A frame-shaped spacer having a rectangular opening of 120 mm × 200 mm and a thickness of 0.06 mm is disposed on the surface of the polyester resin sheet, and the prepared conductive elastomer material is applied to the opening of the spacer, On this conductive elastomer material, the other polyester resin sheet was disposed so that the surface thereof was in contact with the conductive elastomer material. Then, using the pressure roll apparatus which consists of a pressure roll and a support roll, the material layer for conductive elastomers having a thickness of 0.06 mm was formed by sandwiching the material for conductive elastomers with two polyester resin sheets. .
Next, an electromagnet is placed on the back of each of the two polyester resin sheets, and molding is performed at 120 ° C. for 30 minutes while applying a 0.3 T parallel magnetic field in the thickness direction to the conductive elastomer material layer. A rectangular conductive elastomer sheet having a thickness of 0.06 mm was manufactured by performing a curing process on the material layer. The proportion of conductive particles in the obtained conductive elastomer sheet was 12% in terms of volume fraction.
And the conductive elastomer layer (11B) was formed by sticking the obtained conductive elastomer sheet on the surface of the releasable support plate (15) made of stainless steel having a thickness of 5 mm with a silicone adhesive ( (See FIG. 5).

(3) Formation of conductive path forming portion:
A thin metal layer (16) made of copper having a thickness of 0.3 μm is formed by subjecting the surface of the conductive elastomer layer (11B) supported on the releasable support plate (15) to electroless plating. On the thin metal layer (16), a rectangular 1024 openings (17a) each having a size of 50 μm × 100 μm are formed at a pitch of 100 μm by a photolithography technique. 17) was formed. Thereafter, a metal mask (18) made of copper having a thickness of 20 μm was formed in the opening (17a) of the resist layer (17) by subjecting the surface of the metal thin layer (16) to electrolytic plating. In this state, the conductive elastomer layer (11B), the metal thin layer (16), and the resist layer (17) are subjected to laser processing using a carbon dioxide gas laser device, so that the releasable support plates (15 ) 1024 conductive path forming portions (11) supported thereon were formed, and then the remaining thin metal layer (16) and metal mask (18) were peeled off from the surface of the conductive path forming portion (11) ( (See FIG. 10).
In the above, the laser processing conditions by the carbon dioxide laser device are as follows. That is, a carbon dioxide gas laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) is used as an apparatus, and a laser beam is applied to one processing point under the conditions of a laser beam diameter of 60 μm and a laser output of 0.8 mJ. Was irradiated with 10 shots to perform laser processing.

(4) Formation of insulating part:
By applying addition-type liquid silicone rubber to the surface of the adapter body (20), an insulating part material layer (12A) having a thickness of 0.05 mm is formed. On the insulating part material layer (12A), Corresponding to each of the connection electrodes (22) of the adapter body (20) by aligning and overlapping the releasable support plate (15) formed with a plurality of conductive path forming portions (11). The conductive path forming part (11) to be brought into contact with each other. Then, by applying a pressure of 1500 kgf to the releasable support plate (15), the thickness of the insulating part material layer (12A) is set to 0.04 mm, and the thickness of the conductive path forming part (11) is set to 0.06 mm. In this state, the insulating material layer (12A) is cured under the conditions of 120 ° C. and 1 hour, so that the adjacent conductive path forming portion (11) is cured. An insulating part (12) was formed between them, and then the mold was released from the releasable support plate (15) to produce the adapter device of the present invention (see FIGS. 17 to 19). The anisotropic conductive sheet in this adapter device has a conductive path forming part (11) thickness of 0.06 mm, an insulating part (12) thickness of 0.04 mm, a conductive path forming part (11) pitch of 100 μm, and an insulating material. The protruding height of the conductive path forming part (11) from the part (12) is 0.02 mm.

<Comparative example 1>
(1) Manufacture of adapter body:
An adapter body having the following specifications was manufactured according to the configuration shown in FIG.
That is, the adapter body has a vertical and horizontal dimension of 40 mm × 80 mm, the substrate material is a glass fiber reinforced epoxy resin, and the connection electrode is a rectangle having a dimension of 50 μm × 100 μm, with a total of 1024 at a pitch of 100 μm. Are arranged. The terminal electrodes are circular with a diameter of 300 μm, and a total of 1024 terminal electrodes are arranged at a pitch of 500 μm.

(2) Production of anisotropic conductive elastomer layer forming mold:
According to the configuration shown in FIG. 28, upper and lower molds having the following specifications were produced.
Each of the ferromagnetic parts in the upper mold has a vertical and horizontal dimension of 50 μm × 100 μm, a thickness of 100 μm, a material of nickel, and a total of 1024 are arranged according to the pattern of the connection electrode of the adapter body. ing. The nonmagnetic part in the upper mold is 120 μm in thickness and is made of a hardened material of dry film resist, and the surface thereof is formed so as to protrude 20 μm from the ferromagnetic part.
Each of the ferromagnetic parts in the lower mold has a vertical and horizontal dimension of 50 μm × 100 μm, a thickness of 100 μm, a material of nickel, and a total of 1024 are arranged according to the same pattern as the connection electrode pattern of the adapter body. Yes. The nonmagnetic part in the lower mold is a cured product of a dry film resist having a thickness of 100 μm.

(3) Formation of anisotropic conductive sheet:
After adding and mixing 10 parts by volume of conductive particles having an average particle diameter of 20 μm to 100 parts by volume of a mixture of two liquid type addition type liquid silicone rubbers A and B mixed in equal proportions A conductive elastomer material was prepared by performing a defoaming treatment under reduced pressure. Here, as the conductive particles, nickel particles are used as core particles, and the core particles are subjected to electroless gold plating (average coating amount: an amount that is 5% by weight of the weight of the core particles). The conductive elastomer material was applied to the surface of the adapter main body by screen printing to form a conductive elastomer material layer having a thickness of 0.06 mm on the adapter main body. Next, the adapter body on which the conductive elastomer material layer is formed is positioned and positioned on the surface of the lower mold, and the upper mold is positioned on the surface of the conductive elastomer material layer formed on the adapter body. Arranged together. After that, a pair of electromagnets are arranged on the upper and lower surfaces of the upper mold, and the electromagnet is operated, whereby a magnetic field of 2 Tesla is provided between the upper and lower ferromagnetic parts. The conductive elastomer layer is cured under the conditions of 120 ° C. and 1 hour with the action of 1024, and the 1024 conductors disposed on each connection electrode provided integrally on the surface of the adapter body. An anisotropic conductive sheet comprising a path forming part and an insulating part interposed between these conductive path forming parts was formed, and thus a comparative adapter device was manufactured. The anisotropic conductive sheet in this adapter device has a conductive path forming portion thickness of 0.06 mm, an insulating portion thickness of 0.04 mm, a conductive path forming portion pitch of 100 μm, and a protrusion of the conductive path forming portion from the insulating portion. The height was 0.02 m, and the proportion of conductive particles in the conductive path forming portion was 16% in volume fraction.

<Comparative example 2>
A comparative adapter device was manufactured in the same manner as Comparative Example 1 except that the amount of conductive particles used was changed from 10 to 15 parts by volume in the preparation of the conductive elastomer material. The anisotropic conductive sheet in this adapter device has a conductive path forming portion thickness of 0.06 mm, an insulating portion thickness of 0.04 mm, a conductive path forming portion pitch of 100 μm, and a protrusion of the conductive path forming portion from the insulating portion. The height was 0.02 mm, and the proportion of conductive particles in the conductive path forming portion was 21% in terms of volume fraction.

<Comparative Example 3>
A comparative adapter device was manufactured in the same manner as Comparative Example 1 except that the amount of conductive particles used was changed from 10 to 20 parts by volume in the preparation of the conductive elastomer material. The anisotropic conductive sheet in this adapter device has a conductive path forming portion thickness of 0.06 mm, an insulating portion thickness of 0.04 mm, a conductive path forming portion pitch of 100 μm, and a protrusion of the conductive path forming portion from the insulating portion. The height was 0.02 mm, and the proportion of conductive particles in the conductive path forming portion was 25% in terms of volume fraction.

<Comparative example 4>
A comparative adapter device was manufactured in the same manner as in Comparative Example 1 except that the amount of conductive particles used was changed from 10 to 25 parts by volume in the preparation of the conductive elastomer material. The anisotropic conductive sheet in this adapter device has a conductive path forming portion thickness of 0.06 mm, an insulating portion thickness of 0.04 mm, a conductive path forming portion pitch of 100 μm, and a protrusion of the conductive path forming portion from the insulating portion. The height was 0.02 mm, and the proportion of conductive particles in the conductive path forming portion was 28% in terms of volume fraction.

[Adapter evaluation]
About the adapter apparatus obtained in Examples 1-2 and Comparative Examples 1-4, using the electrical resistance measuring instrument, in the state which compressed each 5% of the conductive path formation parts in the thickness direction of the said conductive path formation part An electrical resistance (hereinafter referred to as “conducting resistance”) between the surface and a terminal electrode electrically connected to the conductive path forming section is measured, and the conductive path forming section has a conduction resistance of 0.1Ω or less. The ratio was calculated.
Moreover, about the adapter apparatus obtained in Examples 1-2 and Comparative Examples 1-4, it is 2 mutually adjacent in the state which compressed each conductive path formation part 5% in the thickness direction using an electrical resistance measuring device. An electrical resistance (hereinafter referred to as “insulation resistance”) between two conductive path forming portions (hereinafter referred to as “conductive path forming portion pair”) is measured, and the conductive path forming portion pair whose insulation resistance is 100 MΩ or more. The ratio was calculated.
The results are shown in Table 1.

As is apparent from the results in Table 1, in the adapter devices obtained in Examples 1 and 2, high conductivity is obtained in all the conductive path forming portions, and all the conductive path forming portions are adjacent to each other. It was confirmed that a sufficient insulation state was achieved between the conductive path forming portions.
On the other hand, in the adapter device obtained in Comparative Examples 1 to 4, with respect to the conductive path forming part having high conductivity, the insulation state between the conductive path forming part adjacent thereto is sufficiently achieved. On the other hand, high conductivity is not obtained with respect to the conductive path forming part in which the insulation state between the adjacent conductive path forming parts is sufficiently achieved, and therefore high with respect to all the conductive path forming parts. An adapter device having conductivity and sufficiently achieving an insulation state between adjacent conductive path forming portions could not be obtained.

It is sectional drawing for description which shows the structure in an example of the anisotropically conductive sheet which concerns on this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive sheet shown in FIG. It is sectional drawing for description which shows the state by which the material layer for conductive elastomers was formed on the releasable support plate. It is sectional drawing for description which expands and shows the material layer for electroconductive elastomers. It is sectional drawing for description which shows the state by which the magnetic field was acted on the thickness direction of the conductive elastomer material layer. It is sectional drawing for description which shows the state in which the electroconductive elastomer layer was formed on the releasable support plate. It is sectional drawing for description which shows the state by which the metal thin layer was formed on the conductive elastomer layer. It is sectional drawing for description which shows the state in which the resist layer which has an opening was formed on the metal thin layer. It is sectional drawing for description which shows the state in which the metal mask was formed in opening of a resist layer. It is sectional drawing for description which shows the state in which the several conductive path formation part was formed according to the specific pattern on the releasable support body. It is sectional drawing for description which shows the state by which the insulating part material layer was formed on the releasable support body. It is sectional drawing for description which shows the state by which the releasable support board in which the conductive path formation part was formed was piled up on the releasable support board in which the material layer for insulation parts was formed. It is sectional drawing for description which shows the state by which the insulating part was formed between the adjacent conductive path formation parts. It is sectional drawing for description which shows the structure in the 1st example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is sectional drawing for description which expands and shows the anisotropic conductive sheet in the adapter apparatus shown in FIG. It is sectional drawing for description which shows the state in which the insulating part material layer was formed in the surface of an adapter main body. It is sectional drawing for description which shows the state with which the mold release support plate in which the conductive path formation part was formed was piled up on the adapter main body in which the insulating part material layer was formed. It is sectional drawing for description which shows the state by which the insulating part was formed between the adjacent conductive path formation parts. It is sectional drawing for description which shows the structure in the 2nd example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is sectional drawing for description which expands and shows the anisotropically conductive sheet in the adapter apparatus shown in FIG. It is explanatory drawing which shows the structure in the 1st example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is explanatory drawing which shows the structure in the 2nd example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is explanatory drawing which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. It is sectional drawing for description which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. In manufacture of the conventional adapter apparatus, it is sectional drawing for description which shows the state in which the material layer for anisotropic conductive elastomer was formed in the surface of the adapter main body. It is sectional drawing for description which shows the state by which the adapter main body in which the anisotropic conductive elastomer material layer was formed was arrange | positioned between one type | mold and the other type | mold. It is sectional drawing for description which shows the state by which the anisotropic conductive sheet was formed on the surface of an adapter main body, and the adapter apparatus was manufactured. It is sectional drawing for description which shows the arrangement | positioning state of the electrode for a connection of an adapter main body. It is sectional drawing for description which shows the direction of the magnetic field acted on the material layer for anisotropically conductive elastomers in manufacture of the conventional adapter apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a Upper side adapter apparatus 1b Lower side adapter apparatus 2 Holder 3 Positioning pin 5 Circuit apparatus 6,7 Electrode 10 to be tested 10 Anisotropic conductive sheet 11 Conductive path formation part 11A Conductive elastomer material layer 11B Conductive elastomer layer 12 Insulation part 12A Insulating part material layer 15, 15A Releaseable support plate 16 Metal thin layer 17 Resist layer 17a Opening 18 Metal mask 20 Adapter body 21, 21b, 21c Connection electrode 21a Connection electrode pair 22 Terminal electrode 23 Internal wiring part 25 Connecting electrode region 50a Upper side inspection head 50b Lower side inspection heads 51a, 51b Inspection electrode devices 52a, 52b Inspection electrodes 53a, 53b Electric wires 54a, 54b Struts 55a, 55b Anisotropic conductive sheet 56a Upper side support plate 56b Lower side support Plate 57a, 57b Connector 80 One type 81, 81a, 81b Ferromagnetic part 82 Nonmagnetic part 83 Electromagnet 85 Other template 86, 86a, 86b Ferromagnetic part 87 Nonmagnetic part 88 Electromagnet 90 Adapter body 91 Connecting electrode 95 Anisotropic conductive elastomer Sheet 95A Material layer for anisotropic conductive elastomer 96 Conductive path forming portion 97 Insulating portion

Claims (16)

A method of manufacturing an anisotropic conductive sheet in which a plurality of conductive path forming portions arranged in a thickness direction arranged according to a specific pattern are insulated from each other by an insulating portion,
A metal mask is formed on the surface of the conductive elastomer layer supported on the releasable support plate according to a specific pattern, and then the conductive elastomer layer is laser-processed to form the metal mask on the releasable support plate. Conductive path forming portions arranged according to a specific pattern are formed, and an insulating material layer made of a material that is cured and becomes an elastic polymer substance is formed between the conductive path forming portions and cured. The manufacturing method of the anisotropically conductive sheet characterized by having the process of forming an insulating part by this.   The method for producing an anisotropic conductive sheet according to claim 1, wherein the laser processing is performed using a carbon dioxide laser. The method for producing an anisotropic conductive sheet according to claim 1 , wherein a metal mask is formed by plating the surface of the conductive elastomer layer . A thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and a portion of the thin metal layer exposed from the opening of the resist layer The method for producing an anisotropic conductive sheet according to claim 1 , wherein a metal mask is formed by plating the surface of the anisotropic conductive sheet. Conductive elastomer layer, claims 1 to 4, wherein the insulating elastic polymeric substance conductive particles exhibiting magnetism in is one that is dispersed in a state oriented so as to align in the thickness direction The manufacturing method of the anisotropically conductive sheet in any one of. A conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance is formed on a releasable support plate. The anisotropic conductive sheet according to claim 5 , wherein a conductive elastomer layer is formed by applying a magnetic field to the material layer in the thickness direction and curing the material layer for the conductive elastomer. Manufacturing method. An anisotropic conductive sheet obtained by the manufacturing method according to claim 1. An adapter main body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface, and provided integrally on the connection electrode region of the adapter main body A method of manufacturing an adapter device comprising a plurality of conductive path forming portions positioned on the surfaces of the connection electrodes and extending in the thickness direction, and an anisotropic conductive sheet comprising insulating portions that insulate them from each other. Because
A connection electrode for the adapter body on the surface of a conductive elastomer layer in which conductive particles exhibiting magnetism are dispersed in an elastic polymer material supported on a releasable support plate so as to be aligned in the thickness direction. A metal mask is formed according to the specific pattern according to the above, and then the conductive elastomer layer is laser processed to form a conductive path forming portion arranged according to the specific pattern on the releasable support plate,
The releasable support plate on which the conductive path forming portion is formed is overlaid on the adapter body in which the insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed on the connection electrode region. Thus, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other, and the insulating portion material layer is cured in this state to form an insulating portion. The manufacturing method of the adapter apparatus characterized by having the process to do. Adapter main body having a connection electrode region in which a plurality of connection electrode pairs each formed of two connection electrodes for current supply and voltage measurement are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface And a plurality of conductive path forming portions extending in the thickness direction, which are integrally provided on the connection electrode region of the adapter body and are located on the surfaces of the connection electrodes, and insulation for insulating them from each other A method of manufacturing an adapter device comprising an anisotropic conductive sheet comprising a portion,
A connection electrode for the adapter body on the surface of a conductive elastomer layer in which conductive particles exhibiting magnetism are dispersed in an elastic polymer material supported on a releasable support plate so as to be aligned in the thickness direction. A metal mask is formed according to the specific pattern according to the above, and then the conductive elastomer layer is laser processed to form a conductive path forming portion arranged according to the specific pattern on the releasable support plate,
The releasable support plate on which the conductive path forming portion is formed is overlaid on the adapter body in which the insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed on the connection electrode region. Thus, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other, and the insulating portion material layer is cured in this state to form an insulating portion. The manufacturing method of the adapter apparatus characterized by having the process to do. 10. The method of manufacturing an adapter device according to claim 8, wherein the laser processing is performed by a carbon dioxide laser . The method for manufacturing an adapter device according to any one of claims 8 to 10, wherein the metal mask is formed by plating the surface of the conductive elastomer layer . A thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and a portion of the thin metal layer exposed from the opening of the resist layer The method for manufacturing an adapter device according to claim 8, wherein a metal mask is formed by plating the surface of the adapter device. 13. The conductive elastomer layer is formed by dispersing conductive particles exhibiting magnetism in an insulating elastic polymer material so as to be aligned in the thickness direction. The manufacturing method of the adapter apparatus in any one of. A conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance is formed on a releasable support plate. 14. The method of manufacturing an adapter device according to claim 13, wherein the conductive elastomer layer is formed by applying a magnetic field to the material layer in the thickness direction and curing the material layer for the conductive elastomer. . An adapter device obtained by the manufacturing method according to any one of claims 8 to 14. An electrical inspection device for a circuit device comprising the anisotropic conductive sheet according to claim 7 or the adapter device according to claim 15.

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