WO2006043628A1

WO2006043628A1 - Anisotropic conductive connector and production method therefor, adaptor device and electrical inspection device

Info

Publication number: WO2006043628A1
Application number: PCT/JP2005/019306
Authority: WO
Inventors: Kiyoshi Kimura; Fujio Hara
Original assignee: Jsr Corporation
Priority date: 2004-10-22
Filing date: 2005-10-20
Publication date: 2006-04-27
Also published as: TW200635158A

Abstract

An anisotropic conductive connector for positively achieving a specified electric connection independent of an electrode pattern or even if an electrode pitch is fine and at high density, and requiring a small production cost, and a production method therefor; an adaptor device; and an electrical inspection device for a circuit device. The anisotropic conductive connector is obtained by disposing a metal contact member exhibiting magnetism corresponding to the pattern of a conductive path forming unit on the surface of a conductive elastomer-use material layer formed on a mold-releasing support plate and formed by including magnetic conductive particles in a liquid polymer substance forming material, allowing magnetic field to act on the conductive elastomer-use material layer in a thickness direction and curing the conductive elastomer-use material layer to forma a conductive elastomer layer, laser processing the conductive elastomer layer to form a plurality of conductive path forming units, and forming an insulation unit-use material layer consisting of a polymer substance forming material between these conductive path forming units and curing it.

Description

Specification

Anisotropic conductive connector and method for manufacturing the same, adapter device and circuit device electrical inspection device

Technical field

[0001] The present invention relates to an anisotropic conductive connector that can be suitably used for electrical inspection of a circuit device such as a printed circuit board, a method for manufacturing the same, an adapter device including the anisotropic conductive connector, and the adapter. The present invention relates to an electrical inspection device for a circuit device including the device.

Background art

[0002] Generally, a circuit board for constituting or mounting an integrated circuit device or other electronic components is not suitable before assembling the electronic components or before mounting the electronic components. In order to confirm that the circuit board wiring pattern has the expected performance, it is necessary to inspect its electrical characteristics.

Conventionally, as a method of performing an electrical inspection of a circuit board, an inspection electrode device in which a plurality of inspection electrodes are arranged according to the grid point positions arranged in the vertical and horizontal directions, and the inspection electrode of this inspection electrode device are inspection targets. A method of using a combination with an adapter for electrically connecting an electrode to be inspected on a circuit board is known. In this method, the adapter used is a printed wiring board called a pitch conversion board.

This adapter has a plurality of connection electrodes arranged on one side according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected, and has the same pitch as the inspection electrodes of the inspection electrode device on the other side. Having a plurality of terminal electrodes arranged at the grid point positions of the current supply connection electrodes and voltage measurement connection electrodes arranged according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected on one side The former has a plurality of connection electrode pairs made of electrodes, and has a plurality of terminal electrodes arranged on the other surface at lattice point positions having the same pitch as the inspection electrodes of the inspection electrode device. This adapter is used for, for example, an open / short test of each circuit on a circuit board, and the latter adapter is used for an electric resistance measurement test of each circuit on the circuit board. Therefore, in the electrical inspection of the circuit board, in general, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, the circuit board to be inspected and the adapter are An anisotropic conductive elastomer sheet is interposed as a connector.

[0003] This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or there are a number of pressure-conducting conductive portions that exhibit conductivity only in the thickness direction when pressed. It has something.

Such anisotropically conductive elastomer sheets are conventionally known in various structures, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer ( For example, refer to Patent Document 1.) By disperse the conductive magnetic metal particles unevenly in the elastomer, many conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other are formed. (For example, see Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, see Patent Document 3).

For a circuit board having electrodes to be inspected with a small arrangement pitch, there is an anisotropic conductive elastomer sheet in which a conductive path forming portion is formed according to a pattern corresponding to the pattern of the electrodes to be inspected on the circuit board. High, preferred in terms of connection reliability ヽ

[0004] However, such an anisotropically conductive elastomer sheet is manufactured as a single product and handled alone, and is used for an adapter and a circuit board in electrical connection work. Therefore, it is necessary to hold and fix with a specific positional relationship.

However, in the means for achieving the electrical connection of the circuit board by using an independent anisotropic conductive elastomer sheet, the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected (hereinafter referred to as “electrode pitch”). That is, there is a problem that it becomes difficult to align and hold the anisotropic conductive elastomer sheet as the distance between the centers of the electrodes to be inspected adjacent to each other becomes smaller.

Also, even when the desired alignment and holding / fixing is achieved, When the thermal history due to temperature change is received, the degree of stress due to thermal expansion and contraction Force between the material composing the circuit board to be inspected and the material composing the anisotropic conductive elastomer sheet Because of the large difference, there is a problem that the electrical connection state changes and the stable connection state cannot be maintained.

Recently, in order to solve the above problems, an anisotropic conductive connector in which the peripheral edge portion of the anisotropic conductive elastomer sheet is supported by a frame plate made of metal has been proposed (for example, a patent). See Reference 4.) ₀

Such an anisotropic conductive connector 1 is manufactured as follows, for example.

First, a mold having a structure as shown in FIG. 55 is prepared. In this mold, a ferromagnetic part 82 is arranged on a substrate 81 in accordance with the same pattern as, for example, an electrode to be inspected on a circuit board to be inspected, and a non-magnetic part is formed on a part other than the ferromagnetic part 82. Ferromagnetic material is formed on one template 80 (hereinafter referred to as “upper die”) in which the body part 83 is disposed, and on the substrate 86 according to the pattern of the electrode to be inspected and the palm of the circuit board to be inspected. And the other mold plate (hereinafter referred to as “lower mold”) 85 in which the non-magnetic part 88 is arranged in a part other than the ferromagnetic part 87. .

Then, as shown in FIG. 56, a frame plate 90 having an opening 91 is disposed in the mold, and an anisotropic conductive elastomer material layer 95A is formed so as to close the opening 91 of the frame plate 90. . The anisotropic conductive elastomer material layer 95A is formed by containing conductive particles P exhibiting magnetism in a liquid polymer material forming material that is cured to become an elastic high molecular material.

Next, a pair of electromagnets (not shown) are arranged on the upper surface of the upper die 80 and the lower surface of the lower die 85, and by operating the electromagnet, the lower die 85 corresponding to the lower die 85 from the ferromagnetic portion 82 of the upper die 80 is operated. A parallel magnetic field is applied to the ferromagnet part 87 in the direction of the direction of force. At this time, since each of the ferromagnetic part 82 of the upper mold 80 and the ferromagnetic part 87 of the lower mold 85 acts as a magnetic pole, the ferromagnetic part 82 of the upper mold 80 and the ferromagnetic part 87 of the lower mold 85 are used. A magnetic field with a greater strength than the other areas acts on the area between the two. As a result, in the anisotropic conductive elastomer material layer 95A, the conductive particles P dispersed in the anisotropic conductive elastomer material layer 95A are dispersed in the upper 80 ferromagnetic material. Between the body part 82 and the ferromagnetic part 87 of the lower mold 85. The portion to be placed is moved by force and gathers in the portion, and is further aligned in the thickness direction.

In this state, the anisotropic conductive elastomer material layer 95A is hardened by heating, for example, so that a large number of layers extending in the thickness direction containing the conductive particles P as shown in FIG. An anisotropic conductive connector is manufactured in which an anisotropic conductive elastomer sheet 95 composed of the conductive path forming portion 96 and an insulating portion 97 that insulates the conductive path forming portion 96 from each other is supported by the frame plate 90.

[0006] According to such an anisotropically conductive connector, it is possible to easily perform the alignment work of the anisotropically conductive elastomer sheet with respect to the circuit board in the electrical inspection of the circuit board. Since the thermal expansion of the conductive elastomer sheet can be regulated by the frame plate, a good electrical connection state is stably maintained even with environmental changes such as thermal history due to temperature changes, and therefore high! Connection reliability can be obtained.

[0007] However, the anisotropic conductive connector has the following problems.

As a circuit board for configuring or mounting an electronic component, one in which electrodes are arranged in a frame shape along, for example, four sides of a rectangle is known. Thus, in order to perform an electrical inspection of such a circuit board, the anisotropic path having the anisotropic conductive elastomer sheet 95 in which the conductive path forming portion 96 is arranged in a frame shape along the four sides of the rectangle. It is necessary to use conductive connectors. However, in such an anisotropic conductive elastomer sheet 95, since the central portion surrounded by the conductive path forming portion 96 is all the insulating portion 97, the anisotropic conductive elastomer sheet 95 is different in forming the anisotropic conductive elastomer sheet 95. As for the conductive particles present in the central part of the material layer 95A for the conductive elastomer, the moving distance is extremely long. It is difficult. Therefore, the obtained conductive path forming part 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remain in the insulating part 97. A conductive elastomer sheet cannot be reliably formed.

[0008] In addition, in an integrated circuit device, the number of electrodes increases with the increase in functionality and capacity, and the arrangement pitch of electrodes, that is, the distance force between the centers of adjacent electrodes, increases the density. Tend to be further promoted. Therefore, such an integrated circuit device is configured or When an electrical inspection is performed on a circuit board to be mounted, it is necessary to use anisotropic conductive connectors that have a small pitch at the conductive path forming portion and are arranged with high density. Thus, in manufacturing such an anisotropic conductive connector, it is natural that it is necessary to use the upper die 80 and the lower die 85 in which the ferromagnetic parts 82 and 87 are arranged at an extremely small pitch. It is.

However, when such an upper die 80 and lower die 85 are used to form the anisotropic conductive elastomer sheet 95 as described above, as shown in FIG. 58, the upper die 80 and the lower die 85 are formed. In each of the molds 85, since the separation distance between a certain ferromagnetic part 82a, 87a and the adjacent ferromagnetic parts 82b, 87b is small, it corresponds to the ferromagnetic part 82a of the upper mold 80. Not only in the direction (indicated by the arrow X) in the direction of the ferromagnetic part 87a of the lower mold 85, but also from the ferromagnetic part 82a of the upper mold 80 to the corresponding lower ferromagnetic part 85 of the lower mold 85. The magnetic field also acts in the direction toward the ferromagnetic part 87 b adjacent to 87a (indicated by the arrow Y). Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles are located between the ferromagnetic portion 82a of the upper die 80 and the corresponding ferromagnetic portion 87a of the lower die 85. It becomes difficult to assemble them into the part, and the conductive magnetic particles also gather in the part located between the ferromagnetic part 82a of the upper die 80 and the ferromagnetic part 87b of the lower die 85. Therefore, it becomes difficult to sufficiently orient the conductive particles in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, an anisotropic conductive connector having a desired conductive path forming portion and insulating portion is obtained. I can't.

[0010] In addition, in forming the anisotropic conductive elastomer sheet, as described above, two mold plates of the upper mold 80 and the lower mold 85 are required. These templates are individually manufactured according to the circuit board to be inspected, for example, and the manufacturing process is complicated, so that the manufacturing cost of the anisotropic conductive connector is extremely high. This leads to an increase in the inspection cost of the circuit device.

[0011] In order to solve such a problem, a conductive elastomer layer containing conductive particles aligned in a thickness direction is formed by laser processing to be arranged according to a target pattern. a plurality of conductive path forming portion to form a method of forming an insulating portion between these conductive path-shaped forming portion has been proposed (see Patent Document 5.) ₀ However, it has been found that such a method has the following problems. In order to obtain an anisotropic conductive elastomer sheet having high conductivity, it is important to form a conductive path forming portion containing a high proportion of conductive particles. On the other hand, in order to obtain an anisotropic conductive elastomer sheet having high unevenness absorbability, it is important to form a conductive path forming portion having a large thickness.

Thus, in the manufacturing method described above, in order to form a conductive path forming part with a large thickness containing conductive particles at a high rate, a large thickness containing conductive particles at a high rate is used. It is necessary to form one conductive elastomer layer.

However, since such a conductive elastomer layer is difficult to be formed by laser processing, it is difficult to obtain a desired conductive path forming portion.

Patent Document 1: Japanese Patent Application Laid-Open No. 51-93393

Patent Document 2: Japanese Patent Laid-Open No. 53-147772

Patent Document 3: Japanese Patent Application Laid-Open No. 61-250906

Patent Document 4: JP-A-11-40224

Patent Document 5: Japanese Unexamined Patent Application Publication No. 2004-342597

Disclosure of the invention

[0013] The present invention has been made based on the circumstances as described above. The first object of the present invention is to provide required electric power for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. Reliable connection to each of the electrodes, even if the electrodes to be connected are arranged with a small pitch and high density. It is another object of the present invention to provide an anisotropic conductive connector that can be achieved at a low cost, and a method for manufacturing the same.

The second object of the present invention is to reliably achieve the required electrical connection for the circuit device regardless of the arrangement pattern of the electrode to be inspected of the circuit device to be inspected. Even when the pitch is very small and densely arranged, the adapter device can reliably achieve the required electrical connection for the circuit device and can be manufactured at low cost. Is to provide.

A third object of the present invention is to provide an arrangement pattern of electrodes to be inspected of a circuit device to be inspected. Regardless of this, the required electrical inspection can be reliably performed on the circuit device, and the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. However, it is an object of the present invention to provide an electrical inspection device for a circuit device that can surely execute a required electrical inspection for the circuit device.

[0014] In the method for manufacturing an anisotropic conductive connector of the present invention, a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated. A method of manufacturing an anisotropic conductive connector having an elastic anisotropic conductive film insulated from each other by a portion and a contact member made of metal integrally provided on the conductive path forming portion,

On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed.

A contact member made of a metal exhibiting magnetism is disposed on the surface of the material layer for the conductive elastomer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. A conductive elastomer layer is formed by applying a magnetic field to the material layer in the thickness direction and curing the material layer for the conductive elastomer.

The conductive elastomer layer is laser-processed to remove a portion other than the portion where the contact member is disposed, whereby a plurality of conductive layers disposed according to the specific pattern on the releasable support plate. A path forming part is formed, and between these conductive path forming parts, an insulating part material layer made of a polymer material forming material that is cured and becomes an elastic polymer substance is formed and cured to form an insulating part. It has the process of forming, It is characterized by the above-mentioned.

[0015] Further, the method for manufacturing an anisotropic conductive connector according to the present invention includes a frame plate in which one or more openings are formed, and is arranged so as to close the opening of the frame plate and is supported by the frame plate. In addition, one or more elastic differences in which a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by the insulating portion. A method of manufacturing an anisotropic conductive connector having a conductive film and a contact member made of metal integrally provided on the conductive path forming portion, On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed.

The conductive elastomer layer is laser processed to remove a portion other than the portion where the contact member is disposed, so that the conductive member is disposed according to the specific pattern on the releasable support plate. In this state, each of the conductive path forming portions provided with the contact member is formed so as to close the opening of the frame plate, and is cured to be highly elastic. It is characterized by having a process of forming an insulating part by infiltrating into an insulating part material layer made of a liquid polymer substance forming material that becomes a molecular substance and curing the insulating part material layer.

[0016] In the above method for manufacturing an anisotropic conductive connector, a resist layer having an opening formed in accordance with a specific pattern is formed on a metal foil, and the opening force of the resist layer in the metal foil is exposed. A contact member composite in which a contact member is formed in each of the openings of the resist layer is manufactured by performing a plating treatment with a metal exhibiting magnetism on the surface of the resist, and this contact member composite is used for a conductive elastomer. By stacking on the surface of the material layer, it is preferable to arrange a contact member made of a metal exhibiting magnetic properties according to the specific pattern on the surface of the conductive elastomer material layer.

[0017] Further, the method for manufacturing an anisotropic conductive connector of the present invention includes a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned so as to be aligned in the thickness direction. A method for producing an anisotropic conductive connector having an elastic anisotropic conductive film insulated from each other by an insulating part, comprising:

On the releasable support plate, a material layer for a conductive elastomer is formed, in which a liquid polymer material forming material that is cured to become an elastic polymer material contains conductive particles exhibiting magnetism. And

A metal mask showing magnetism is disposed on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. In this state, the conductive elastomer material layer is formed on the conductive elastomer material layer. On the other hand, a conductive elastomer layer is formed by applying a magnetic field in the thickness direction and curing the conductive elastomer material layer.

The conductive elastomer layer is laser-processed to remove a portion other than the portion where the metal mask is disposed, whereby a plurality of conductive layers disposed in accordance with the specific pattern on the releasable support plate. A path forming part is formed, and between these conductive path forming parts, an insulating part material layer made of a polymer material forming material that is cured and becomes an elastic polymer substance is formed and cured to form an insulating part. It has the process of forming, It is characterized by the above-mentioned.

In addition, the method for manufacturing an anisotropic conductive connector according to the present invention includes a frame plate having one or more openings formed therein, and a frame plate arranged so as to close the opening of the frame plate and supported by the frame plate. Two or more elastic anisotropic conductive films, wherein the elastic anisotropic conductive film is disposed in the opening of the frame plate and oriented so that the conductive particles exhibiting magnetism are aligned in the thickness direction. A method of manufacturing an anisotropic conductive connector comprising a plurality of conductive path forming portions extending in the thickness direction, and an insulating portion formed around the conductive path forming portion,

The conductive elastomer layer is laser-processed to remove portions other than the portion where the metal mask is disposed, thereby following the specific pattern on the releasable support plate. Forming a plurality of conductive path forming portions arranged

Each of the conductive path forming portions formed on the releasable support plate is used for an insulating portion made of a liquid polymer material forming material that is cured and becomes an elastic polymer material so as to close the opening of the frame plate. It has the process of forming an insulating part by making it infiltrate into a material layer and carrying out the hardening process of the said insulating part material layer in this state, It is characterized by the above-mentioned.

[0019] In the above method for manufacturing an anisotropic conductive connector, a resist layer having an opening formed in accordance with a specific pattern is formed on a metal foil, and the opening force of the resist layer in the metal foil is exposed. A metal mask composite in which a metal mask is formed in each of the openings of the resist layer is manufactured by applying a metal-plating treatment to the surface of the resist layer, and the metal mask composite is used for a conductive elastomer. By stacking on the surface of the material layer, it is preferable to dispose a metal mask made of a metal exhibiting magnetism according to the specific pattern on the surface of the material layer for conductive elastomer.

[0020] In the method for producing an anisotropic conductive connector of the present invention, laser processing using a carbon dioxide gas laser or an ultraviolet laser can be preferably used.

[0021] An anisotropic conductive connector according to the present invention is obtained by the above-described manufacturing method.

[0022] The adapter device of the present invention includes an adapter main body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;

The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter body and formed according to a pattern corresponding to the connection electrode in the adapter body.

It is characterized by comprising.

[0023] In addition, the adapter device of the present invention is for a plurality of connections comprising two connection electrodes for current supply and voltage measurement, respectively, according to a pattern corresponding to the inspected electrode in the circuit device to be inspected on the surface. An adapter body having an electrode region for connection in which an electrode pair is formed; The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter body and formed according to a pattern corresponding to the connection electrode in the adapter body.

It is characterized by comprising.

[0024] An electrical inspection device for a circuit device according to the present invention comprises the adapter device described above.

[0025] According to the method for manufacturing an anisotropic conductive connector of the present invention, a contact member or a metal mask exhibiting magnetism is arranged on a conductive elastomer material layer according to a specific pattern of a conductive path forming portion to be formed. In such a state, a magnetic field is applied in the thickness direction of the conductive elastomer material layer and the conductive elastomer material layer is cured.

In the obtained conductive elastomer layer, the conductive particles in the portion where the contact member or the metal mask is arranged, that is, the portion forming the conductive path is dense, and the conductive particles in other portions are sparse. As a result, it becomes extremely easy to remove a portion other than the portion forming the conductive path in the conductive elastomer layer by laser processing. For this reason, the conductive path forming portion of the desired form can be reliably formed by laser processing one layer of the conductive elastomer through the contact member or the metal mask. Then, after forming a plurality of conductive path forming portions arranged according to a specific pattern, an insulating portion material layer is formed between these conductive path forming portions and cured to form an insulating portion. In the absence of conductive particles, the insulating portion can be reliably obtained. For this reason, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropically conductive connector are arranged.

Therefore, according to the anisotropic conductive connector of the present invention obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. At the same time, even if the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection can be reliably achieved for each of the electrodes, and the force can be reduced at a low cost. Can be manufactured.

[0026] According to the adapter device of the present invention, since the anisotropic conductive connector is provided, regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, the circuit device Therefore, the required electrical connection can be reliably achieved, and the circuit device is required even when the electrodes to be inspected are arranged with a small pitch and a high density. The electrical connection can be reliably achieved, and the force can be manufactured at a low cost.

[0027] According to the electrical inspection device for a circuit device of the present invention, since the adapter device described above is provided, the circuit device required for the circuit device is required regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. The electrical inspection can be performed reliably, and the required electrical inspection can be performed for the circuit device even when the electrodes to be inspected of the circuit device are arranged with a small pitch and a high density. It can be executed reliably.

Brief Description of Drawings

FIG. 1 is an explanatory sectional view showing a configuration in a first example of an anisotropically conductive connector according to the present invention.

2 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the anisotropic conductive connector shown in FIG.

FIG. 3 is an explanatory cross-sectional view showing a state in which a resist layer having a plurality of openings formed according to a specific pattern is formed on a metal foil.

FIG. 4 is an explanatory sectional view showing a state in which a contact member is formed in each opening of a resist layer to form a contact member composite.

FIG. 5 is an explanatory cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.

FIG. 6 is an explanatory cross-sectional view showing a state in which the contact member composite is disposed on the surface of the conductive elastomer material layer.

FIG. 7 is an explanatory sectional view showing a state in which a magnetic field is applied to the conductive elastomer material layer in the thickness direction.

FIG. 8 is an explanatory sectional view showing a state in which a conductive elastomer layer is formed on a releasable support plate.

FIG. 9 is an explanatory cross-sectional view showing a state where the metal foil of the contact member composite is removed.

[FIG. 10] A plurality of conductive path forming portions are formed on a releasable support according to a specific pattern. It is sectional drawing for description which shows the state.

FIG. 11 is an explanatory cross-sectional view showing a state in which an insulating material layer is formed on a releasable support.

FIG. 12 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a releasable support plate on which an insulating material layer is formed.

FIG. 13 is an explanatory sectional view showing a state in which an insulating part is formed between adjacent conductive path forming parts.

14] A sectional view for explanation showing the configuration of the anisotropic conductive connector according to the second example of the present invention.

15] FIG. 15 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the anisotropic conductive connector shown in FIG.

FIG. 16 is an explanatory cross-sectional view showing a state in which a frame plate is disposed on a releasable support and an insulating material layer is formed.

FIG. 17 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a releasable support plate on which an insulating material layer is formed.

FIG. 18 is an explanatory sectional view showing a state in which an insulating portion is formed between adjacent conductive path forming portions.

[19] FIG. 19 is an explanatory sectional view showing a configuration of a third example of the anisotropic conductive connector according to the present invention.

20 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the anisotropic conductive connector shown in FIG.

FIG. 21 is an explanatory sectional view showing a state in which a resist layer having a plurality of openings formed according to a specific pattern is formed on a metal foil.

FIG. 22 is an explanatory cross-sectional view showing a state in which a metal mask is formed by forming a metal mask in each opening of a resist layer.

[FIG. 23] (a) is an explanatory sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate, and (b) is an enlarged view of the conductive elastomer material layer. It is sectional drawing for description shown. FIG. 24 is an explanatory cross-sectional view showing a state in which a metal mask composite is disposed on the surface of a conductive elastomer material layer.

25] A sectional view for explanation showing a state where a magnetic field is applied to the material layer for conductive elastomer in the thickness direction.

FIG. 26 is an explanatory sectional view showing a state in which a conductive elastomer layer is formed on the releasable support plate.

[27] FIG. 27 is an explanatory cross-sectional view showing a state in which the metal foil of the metal mask composite has been removed.

FIG. 28 is an explanatory cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on a releasable support.

29] A sectional view for explanation showing a state in which an insulating material layer is formed on a releasable support.

FIG. 30 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a releasable support plate on which an insulating material layer is formed.

[31] FIG. 31 is an explanatory cross-sectional view showing a state in which an insulating portion is formed between adjacent conductive path forming portions.

FIG. 32 is an explanatory sectional view showing a configuration in a fourth example of the anisotropic conductive connector according to the present invention.

[33] FIG. 33 is an explanatory sectional view showing, in an enlarged manner, a configuration of a main part of the anisotropic conductive connector shown in FIG.

FIG. 34 is an explanatory cross-sectional view showing a state in which a frame plate is disposed on a releasable support and an insulating material layer is formed.

FIG. 35 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a releasable support plate on which an insulating material layer is formed.

FIG. 36 is a cross-sectional view for explaining a state where an insulating portion is formed between adjacent conductive path forming portions.

[37] FIG. 37 is a cross-sectional view illustrating the configuration of the adapter device according to the first example of the present invention.

圆 38] Description of the configuration of the adapter body in the adapter device shown in FIG. FIG.

[39] FIG. 39 is a cross-sectional view illustrating the configuration of the adapter device according to the second example of the present invention.

40] FIG. 40 is an explanatory sectional view showing the configuration of the adapter main body in the adapter device shown in FIG.

[41] FIG. 41 is an explanatory diagram showing a configuration in the first example of the electrical inspection device for a circuit device according to the present invention.

[42] FIG. 42 is an explanatory diagram showing a configuration in a second example of the electrical inspection device for a circuit device according to the present invention.

FIG. 43 is an explanatory cross-sectional view showing a configuration in another example of a releasable support plate for forming a conductive path forming portion.

FIG. 44 is an explanatory cross-sectional view showing a state in which a nonmagnetic part is formed on a metal film. 45] FIG. 45 is an explanatory cross-sectional view showing a state in which the contact member composite is disposed on the surface of the conductive elastomer material layer formed on the releasable support plate shown in FIG.

FIG. 46 is an explanatory cross-sectional view showing a state where a magnetic field is applied to the material layer for conductive elastomer in the thickness direction.

47] A sectional view for explanation showing a state in which a conductive elastomer layer is formed on the releasable support plate shown in FIG.

FIG. 48 is an explanatory cross-sectional view showing a state where the metal foil of the contact member composite is removed.

FIG. 49 is an explanatory cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on the releasable support.

FIG. 50 is a cross-sectional view illustrating the configuration of another example of a releasable support plate for forming an insulating portion.

[51] FIG. 51 is an explanatory view showing a state in which a conductive path forming portion is formed by removing only a peripheral portion of a conductive elastomer forming layer in a portion that becomes a conductive path forming portion.

FIG. 52 is an explanatory cross-sectional view showing a state in which a conductive path forming portion is formed by removing only a peripheral portion of a conductive elastomer forming layer in the conductive elastomer layer. [53] FIG. 53 is an explanatory view showing a configuration in another example of the anisotropic conductive connector according to the present invention. The

FIG. 54 is an explanatory diagram showing a configuration of still another example of the anisotropic conductive connector according to the present invention.

FIG. 55 is a cross-sectional view illustrating the structure of a mold for forming an anisotropic conductive elastomer sheet in the conventional method for manufacturing an anisotropic conductive connector.

FIG. 56 is an explanatory cross-sectional view showing a state in which a frame plate is arranged in the mold shown in FIG. 55 and an anisotropic conductive elastomer material layer is formed.

FIG. 57 is an explanatory sectional view showing a state in which a conventional anisotropically conductive connector is manufactured.

FIG. 58 is a cross-sectional view illustrating the direction of a magnetic field applied to the anisotropic conductive elastomer material layer in the conventional method for manufacturing an anisotropic conductive connector.

Explanation of symbols

la Upper adapter device

lb Lower adapter device

2 Holder 3 Positioning pin

5 Circuit device 6, 7 Electrode to be inspected

10 Anisotropic conductive connector

11 Frame plate 12 Opening

13, 13A releasable support plate

14 Metal foil 15 Elastic anisotropic conductive film

16 Conductive path forming section

16A Material layer for conductive elastomer

16B conductive elastomer layer

17 Insulation part 17A Insulation part material layer

18 Contact material

18F contact member composite 19 resist layer

19K opening

20 Adapter body

21, 21b, 21c Connecting electrode a Connection electrode pair

Terminal electrode 23 Internal wiring area Connection electrode area

Metal mask 26F Metal mask composite Metal foil 28 Resist layer

K opening

Releasable support plate 31 Metal film

Ferromagnetic part 33 Non-magnetic part K Opening 35 Releasable support plate

Elastic substrate 37 Metal film

a Upper inspection head

b Lower side inspection head

a, 51b Inspection electrode device

a, 52b Test electrode

a, 53b Electric wire

a, 54b strut

a, 55b Anisotropic conductive sheet

a Upper support plate 56b Lower support plate a, 57b Connector

One template 81 substrate

, 82a, 82b Ferromagnetic part

Nonmagnetic part 85 The other template Substrate 87, 87a, 87b Ferromagnetic part Nonmagnetic part 90 Frame plate Opening

Anisotropic conductive elastomer sheet

A Material layer for anisotropic conductive elastomer

Conductive path forming part 97 Insulating part BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is an explanatory cross-sectional view showing the configuration of a first example of an anisotropic conductive connector according to the present invention, and FIG. 2 shows an enlarged main portion of the anisotropic conductive connector shown in FIG. It is sectional drawing for description. In this anisotropic conductive connector 10, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged according to a specific pattern, and an insulating portion 17 that insulates them from each other between adjacent conductive path forming portions 16. Is formed in a state of being integrally bonded to the conductive path forming portion 16, whereby the elastic anisotropic conductive film 15 is formed. The specific pattern of the conductive path forming unit 16 is a pattern corresponding to a pattern of an electrode to be connected, for example, a test electrode of a circuit device to be inspected.

The conductive path forming portion 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. The elastic polymer material constituting the conductive path forming portion 16 and the elastic polymer material constituting the insulating portion 17 may be of different types or the same type.

In the illustrated example, the conductive path forming portion 16 is formed so that the double-sided force of the insulating portion 17 protrudes. According to such an example, the degree of compression by pressurization is larger than that of the insulating part 17 in the conductive path forming part 16, so that the resistance value is sufficiently low! As a result, the change in the resistance value can be reduced with respect to the change or fluctuation of the applied pressure, and as a result, even if the applied pressure acting on the anisotropic conductive connector 10 is not uniform, It is possible to prevent the conductive variation between the conductive path forming portions 16.

[0032] The elastic polymer materials constituting the conductive path forming portion 16 and the insulating portion 17 may be the same or different from each other! /.

As the elastic polymer material constituting the conductive path forming portion 16 and the insulating portion 17, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples of these include conjugated rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile butadiene copolymer rubber, hydrogenated products thereof, and styrene butadiene gen block copolymer. Combined rubber, block copolymer rubber such as styrene isoprene block copolymer and hydrogenated products thereof, black-opened plane, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer Examples thereof include a combined rubber and an ethylene / propylene / copolymer rubber.

In the above, when the anisotropic conductive connector 10 is required to have weather resistance, it is preferable to use a rubber other than the conjugated gen-based rubber. Silicone rubber is particularly preferable from the viewpoint of molding processability and electrical characteristics. U, prefer to use.

[0033] The silicone rubber is preferably one obtained by crosslinking or condensing liquid silicone rubber.

The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10- ^ ec, and is any of a condensation type, an addition type, a bur group or a hydroxyl group-containing one. May be. Specific examples include dimethyl silicone raw rubber, methyl beer silicone raw rubber, and methyl vinyl silicone raw rubber.

The silicone rubber preferably has a molecular weight Mw (standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. In addition, since good heat resistance is obtained in the obtained conductive path forming part 16, the molecular weight distribution index (the ratio MwZMn of the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn is referred to. The same shall apply hereinafter) is preferably 2 or less.

[0034] As the conductive particles P contained in the conductive path forming portion 16, magnetic particles are used because the particles can be easily aligned in the thickness direction by a method described later. . Specific examples of such conductive particles include particles of magnetic metals such as iron, cobalt and nickel, particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles. The core particles are made of metal particles with good conductivity such as gold, silver, palladium, rhodium, etc., or inorganic particles such as non-magnetic metal particles or glass beads, or polymer particles. The surface of the core particle is plated with a conductive magnetic metal such as nickel or cobalt. And so on.

Among these, it is preferable to use a nickel particle as a core particle and a surface with a gold mesh having good conductivity.

The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, an electrochemical plating method, an electrolytic plating method, a sputtering method, a vapor deposition method or the like is used.

[0035] When the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface ( The ratio of the covering area of the conductive metal to the surface area of the core particles is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4%. ~ 20% by mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and still more preferably 3 to 15% by mass.

[0036] The conductive particles P preferably have a particle size of 1 to: LOO / zm, more preferably 2 to 50 μm, still more preferably 3 to 30 μm, and particularly preferably 4-20 μm. The particle size distribution (DwZDn) of the conductive particles P is preferably 1 to: LO, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ~ 4.

By using conductive particles satisfying such conditions, the obtained conductive path forming part 16 can be easily deformed under pressure, and the conductive path forming part 16 has sufficient space between the conductive particles. Electrical contact can be obtained.

In addition, the shape of the conductive particles P is not particularly limited, but is spherical, star-shaped or aggregated in that they can be easily dispersed in the polymer material-forming material. Preferred to be secondary particles.

Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or lubricant, the durability of the anisotropically conductive connector is improved. [0037] It is preferable that the conductive particles P are contained in the conductive path forming part 16 in a volume fraction of 15 to 45%, preferably 20 to 40%. If this ratio is too small, the conductive path forming portion 16 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming portion 16 becomes fragile and the necessary elasticity as the conductive path forming portion 16 may not be obtained immediately.

[0038] On each surface of the conductive path forming portion 16 in the elastic anisotropic conductive film 15, a flat plate-like contact member 18 made of metal is provided integrally with the conductive path forming portion 16.

As the metal constituting the contact member 18, a material exhibiting magnetism is used, and specific examples thereof include nickel, cobalt, and alloys thereof.

The thickness of the contact member 18 is preferably 1 to: LOO / zm, more preferably 5 to 40 / zm. If this thickness is too small, it may be difficult to use as a mask in laser processing in the manufacturing method described later. On the other hand, when this thickness is excessive, a large pressure may be required to compressively deform the conductive path forming portion when used for electrical inspection of the circuit device, which is not preferable.

[0039] In the present invention, the anisotropic conductive connector 10 includes conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material on a releasable support plate. A conductive elastomer material layer containing a child is formed, and a contact member 18 made of a metal exhibiting magnetism according to a specific pattern is disposed on the surface of the conductive elastomer material layer. In this state, A magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer, and this conductive elastomer layer is formed. A plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on the releasable support plate by removing a portion other than the portion where the contact member 18 is arranged by laser processing one layer, An insulating material layer made of a polymer material forming material that is cured to become an elastic polymer material is formed between these conductive path forming portions 16, and the insulating material layer is cured to be insulated. It is obtained by forming part 17.

Hereinafter, a method for manufacturing the anisotropic conductive connector 10 will be specifically described.

[0040] << Formation of one layer of conductive elastomer >> First, a contact member composite 18F having a plurality of contact members 18 arranged according to a specific pattern is manufactured.

Specifically, as shown in FIG. 3, openings are formed on the metal foil 14 according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, by a photolithography technique. A resist layer 19 in which 19K is formed is formed. Thereafter, the surface of the exposed portion of the metal foil 14 through the opening 19 of the resist layer 19 is subjected to a plating treatment with a metal exhibiting magnetism, thereby forming each of the openings 19K of the resist layer 19 as shown in FIG. A contact member 18 is formed. As a result, a contact member composite 18F is obtained in which the contact member 18 is formed on the metal foil 14 according to a specific pattern.

In the above, as the metal foil 14, copper, nickel, or the like can be used. The metal foil may be laminated on a resin film.

The thickness of the metal foil 14 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.

The thickness of the resist layer 19 is set according to the thickness of the contact member 18 to be formed.

[0042] Next, a conductive elastomer material is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material. As described above, the conductive elastomer material layer 16A is formed by applying the conductive elastomer material on the releasable support plate 13 for forming the conductive path forming portion. Then, as shown in FIG. 6, the contact member composite 18F is arranged on the conductive elastomer material layer 16A so that each of the contact members 18 is in contact with the conductive elastomer material layer 16A. . Here, the conductive elastomer material layer 16A contains the conductive particles P exhibiting magnetism in a dispersed state.

Next, a magnetic field is applied to the conductive elastomer material layer 16A via the contact member 18 in the thickness direction of the conductive elastomer material layer 16A. As a result, the contact member 18 is made of a metal exhibiting magnetism, so that the portion of the conductive elastomer material layer 16 A where the contact member 18 is disposed has a higher strength than the other portions. A field is formed. As a result, as shown in FIG. 7, the conductive particles P dispersed in the conductive elastomer material layer 16A gather in the portion where the contact member 18 is arranged, and further, the conductive elastomer material material. Orient so that it is aligned in the thickness direction of layer 16A. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A, or after stopping the action of the magnetic field, the conductive elastomer material layer 16A is cured, as shown in FIG. In addition, a conductive elastomer layer 16B is formed in a state in which the conductive particles P are aligned in the thickness direction in the elastic polymer material so as to be supported on the releasable support plate 13. The

[0043] In the above, as a material constituting the releasable support plate 13, metals, ceramics, resins, composite materials thereof, and the like can be used.

As a method of applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 16A is set according to the thickness of the conductive path forming portion to be formed.

As means for applying a magnetic field to the conductive elastomer material layer 16A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 16A is preferably 0.2 to 2.5 Tesla.

The curing process of the conductive elastomer material layer 16A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the conductive elastomer material layer 16A, the time required to move the conductive particles, and the like.

First, as shown in FIG. 9, by removing the metal foil 14 in the contact member composite 18F disposed on the conductive elastomer layer 16B by etching, the contact member 18 and the resist layer are removed. Expose 19 Then, the conductive elastomer layer 16B and the resist layer 19 are subjected to laser processing using the contact member 18 as a mask to remove a part of the resist layer 19 and the conductive elastomer layer 16B. Ten As shown in FIG. 2, a plurality of conductive path forming portions 16 arranged according to a specific pattern and each provided with a contact member 18 are formed on the releasable support plate 13. Here, as the laser processing, a carbon dioxide laser or an ultraviolet laser is preferable, so that the conductive path forming portion 16 having a desired form can be surely formed.

[0045] <Formation of insulating part>

As shown in FIG. 11, a releasable support plate 13A for forming an insulating portion is prepared, and a liquid polymer material that is cured on the surface of the releasable support plate 13A to become an insulating elastic polymer material. The insulating material layer 17A is formed by applying the forming material. Next, as shown in FIG. 12, the releasable support plate 13 formed with the plurality of conductive path forming portions 16 each provided with the contact member 18 is replaced with the releasable property formed with the insulating material layer 17A. By superimposing on the support plate 13A, the conductive path forming portion 16 enters into the insulating material layer 17A to bring each of the contact members 18 into contact with the releasable support plate 13A, and further pressurizing. Each of the conductive path forming portions 16 is deformed to be compressed in the thickness direction, and an insulating portion material layer 17A is formed between adjacent conductive path forming portions 16. Thereafter, in this state, the insulating portion material layer 17A is cured, so that the insulating portions 17 that insulate them from each other between the adjacent conductive path forming portions 16 as shown in FIG. The elastic anisotropic conductive film 15 is formed integrally with the conductive path forming portion 16.

Then, by releasing from the releasable support plates 13 and 13A, each of the compressed conductive path forming portions 16 is restored to its original form, and as a result, protrudes from both surfaces of the insulating portion 17. Thus, the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is obtained.

As described above, as the material constituting the releasable support plate 13A, the same material as the releasable support plate 13 for forming the conductive path forming portion can be used.

As a method for applying the polymer material forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the insulating part material layer 17A is set according to the thickness of the insulating part to be formed. The curing process of the insulating layer material layer 17A is usually performed by a heating process. The specific heating temperature and heating time are determined by the polymer material forming material that constitutes the insulating material layer 17A. It is set as appropriate in consideration of the type of fee.

[0047] According to the above manufacturing method, in a state where the contact member 18 showing magnetism is disposed on the conductive elastomer material layer 16A according to the specific pattern of the conductive path forming portion 16 to be formed, By applying a magnetic field in the thickness direction of the elastomer material layer 16A and curing the conductive elastomer material layer 16A, the resulting conductive elastomer layer 16B is formed at the portion where the contact member 18 is disposed. The conductive particles P become dense, and the conductive particles P in other parts become sparse, so that it is very easy to remove the parts other than the conductive path forming part in the conductive elastomer layer 16B by laser processing. It becomes. Therefore, by using the contact member 18 as a mask and laser processing the conductive elastomer layer 16B, it is possible to reliably form the conductive path forming portion 16 having the desired form. Then, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between these conductive path forming portions 16 and subjected to curing treatment, whereby the insulating portions 17 Therefore, it is possible to reliably obtain the insulating portion 17 in which no conductive particles are present. However, it is not necessary to use a mold that is used to manufacture a conventional anisotropically conductive connector and in which a large number of ferromagnetic parts are arranged.

Therefore, according to the anisotropic conductive connector 10 obtained by such a method, it is possible to reliably achieve the required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. In addition, even if the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, The manufacturing cost can be reduced.

FIG. 14 is an explanatory cross-sectional view showing the configuration of the anisotropic conductive connector according to the second example of the present invention, and FIG. 15 is an enlarged view of the main part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description shown. This anisotropic conductive connector 10 is arranged so as to close each of the opening 12 of the frame plate 11 and the frame plate 11 formed with a plurality of openings 12, and is supported by the frame plate 11. And an anisotropic conductive film 15.

In the elastic anisotropic conductive film 15, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged so as to be positioned in the openings 12 of the frame plate 11 according to a specific pattern. Around each of the electric circuit forming portions 16, a single insulating portion 17 that insulates the adjacent conductive path forming portions 16 from each other is formed in a state of being integrally bonded to the conductive path forming portion 16! Speak. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to the pattern of the electrode to be connected, for example, the electrode to be inspected of the circuit device to be inspected.

The conductive path forming portion 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. In the illustrated example, each of the conductive path forming portions 16 is formed with a protruding portion that also protrudes the surface force of the insulating portion 17.

On each surface of the conductive path forming portion 16 in the elastic anisotropic conductive film 15, a flat plate-like contact member 18 made of metal is provided integrally with the conductive path forming portion 16.

As a material constituting the frame plate 11, various non-metallic materials and metallic materials having high mechanical strength can be used.

Specific examples of non-metallic materials include liquid crystal polymers, polyimide resins, polyester resins, polyaramide resins, polyamide resins, and other resin materials, glass fiber reinforced epoxy resins, glass fiber reinforced polyester resins, Examples thereof include a fiber reinforced resin material such as a glass fiber reinforced polyimide resin, and a composite resin material containing an inorganic material such as alumina or boron nitride as a filler in an epoxy resin.

Examples of the metal material include gold, silver, copper, iron, nickel, cobalt, alloys thereof, and alloy steels.

In the case of using the anisotropic conductive connector in a high temperature environment, the frame plate 11, a coefficient of linear thermal expansion 3 X 10- ⁵ ZK following more preferably it is preferred instrument to use a 1 X ^{^{10- 6 ~2 X 10- 5 / Κ}} , particularly preferably ^{^{1 X 10- 6 ~6 X 10- 6}} / Κ. By using such a frame plate 11, it is possible to suppress displacement due to thermal expansion of the elastic anisotropic conductive film 15.

The thickness of the frame plate 11 is preferably 10 to 200 m, more preferably 15 to L00 m. If this thickness is too small, the frame plate 11 may not have the required strength. On the other hand, if this thickness is excessive, inertia anisotropic conductivity The thickness of the film 15 is inevitably increased, so that good conductivity may not be obtained.

[0050] The elastic polymer material, conductive particles, and other specific configurations of the elastic anisotropic conductive film 15 are the same as those of the anisotropic conductive connector 10 according to the first example.

The material and dimensions of the contact member 18 are the same as those of the anisotropic conductive connector 10 according to the first example described above.

[0051] The anisotropically conductive connector 10 described above can be manufactured as follows.

<< Formation of conductive path forming part >>

First, in the same manner as in the method for manufacturing the anisotropic conductive connector 10 according to the first example, a plurality of conductive paths are formed on the releasable support 13 according to a specific pattern and provided with contact members 18. A portion 16 is formed (see FIGS. 3 to 10).

[0052] << Formation of Insulating Portion >>

As shown in FIG. 16, a releasable support plate 13A for forming an insulating portion is prepared, and a frame plate 11 is disposed on the surface of the releasable support plate 13A and cured to be an insulating elastic polymer. The insulating material layer 17A is formed by applying a liquid elastomer material that is a substance. Next, as shown in FIG. 17, the releasable support plate 13 formed with the plurality of conductive path forming portions 16 each provided with the contact member 18 is replaced with the releasable support formed with the insulating portion material layer 17A. By superimposing on the plate 13A, the conductive path forming part 16 enters the insulating part material layer 17A to bring each of the contact members 18 into contact with the releasable support plate 13A and further pressurize, thereby conducting the conductive. Each of the path forming portions 16 is deformed into a compressed state in the thickness direction, and an insulating material layer 17A is formed between the adjacent conductive path forming portions 16. Thereafter, the insulating material layer 17A is cured in this state, so that the insulating portion 17 that insulates them from each other is provided between the adjacent conductive path forming portions 16, as shown in FIG. Thus, the elastic anisotropic conductive film 15 is formed integrally with the conductive path forming portion 16.

Then, by releasing from the releasable support plates 13 and 13A, each of the compressed conductive path forming portions 16 is restored to its original form, and as a result, protrudes from both surfaces of the insulating portion 17. Thus, the anisotropic conductive connector 10 having the configuration shown in FIG. 14 is obtained.

[0053] In the above, the material constituting the releasable support plate 13A is for forming a conductive path forming portion. The same releasable support plate 13 can be used.

The thickness of the insulating part material layer 17A is set according to the thickness of the insulating part 17 to be formed. The curing process of the insulating part material layer 17A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 17A.

According to the above manufacturing method, in the state where the contact member 18 showing magnetism is arranged on the conductive elastomer material layer 16A according to the specific pattern of the conductive path forming portion 16 to be formed, the conductive elastomer material By applying a magnetic field in the thickness direction of the layer 16A and curing the conductive elastomer material layer 16A, the resulting conductive elastomer layer 16B has conductive particles in the portion where the contact member 18 is disposed. P becomes dense, and the conductive particles P in the other portions become sparse, which makes it very easy to remove the portions other than the portions forming the conductive path in the conductive elastomer layer 16B by laser processing. Therefore, the conductive path forming portion 16 having the desired shape can be formed by laser processing the conductive elastomer layer 16B using the contact member 18 as a mask. Then, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between the conductive path forming portions 16 and cured to form the insulating portion 17. Therefore, it is possible to reliably obtain the insulating portion 17 in which no conductive particles are present. However, it is not necessary to use a mold in which a large number of ferromagnetic parts are arranged, which is used to manufacture a conventional anisotropically conductive connector.

Therefore, according to the anisotropic conductive connector 10 obtained by such a method, it is possible to reliably achieve the required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. In addition, even if the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, The manufacturing cost can be reduced. FIG. 19 is a cross-sectional view illustrating the configuration of the anisotropic conductive connector according to the third example of the invention, and FIG. 20 is an enlarged view of the main part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description shown. The anisotropic conductive connector 10 is composed only of an elastic anisotropic conductive film 15. In the elastic anisotropic conductive film 15, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged according to a specific pattern. An insulating portion 17 that insulates the conductive path forming portions 16 from each other is formed in a state of being integrally bonded to the conductive path forming portions 16. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to the pattern of the electrode to be connected, for example, the electrode to be inspected of the circuit device to be inspected. The conductive path forming portion 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. In the example shown in the figure, the conductive path forming portion 16 is formed so that the one surface force of the insulating portion 17 protrudes. The elastic polymer material, conductive particles, and other specific configurations forming the elastic anisotropic conductive film 15 are the same as those of the anisotropic conductive connector 10 according to the first example.

[0056] The anisotropic conductive connector 10 can be manufactured as follows.

First, a metal mask composite having a plurality of metal masks arranged according to a specific pattern is manufactured.

Specifically, as shown in FIG. 21, according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed on the metal foil 27, that is, the pattern of the electrode to be connected, by one photolithography method. A resist layer 28 having openings 28K is formed. After that, the surface of the exposed portion of the metal foil 27 through the opening 28K of the resist layer 28 is subjected to a plating treatment with a metal exhibiting magnetism, thereby forming each of the openings 28K of the resist layer 28 as shown in FIG. A metal mask 26 is formed. Thereby, a metal mask composite 26F in which the metal mask 26 is formed on the metal foil 27 according to a specific pattern is obtained.

In the above, as the material constituting the metal mask 26, a material exhibiting magnetism is used, and specific examples thereof include iron, nickel, cobalt, and alloys thereof. The thickness of the metal mask 26 is preferably 2 m or more, more preferably 5 to 150 m. If this thickness is too small, it may be unsuitable as a mask for the laser.

As the metal foil 27, copper, gold, aluminum, rhodium, or the like can be used. Further, the metal foil 27 may be laminated on a resin film.

The thickness of the metal foil 27 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.

The thickness of the resist layer 28 is set according to the thickness of the metal mask 26 to be formed. Next, a conductive elastomer material is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material, as shown in Fig. 23 (a). As described above, the conductive elastomer material layer 16A is formed by applying the conductive elastomer material on the releasable support plate 13 for forming the conductive path forming portion. Here, in the conductive elastomer material layer 16A, as shown in an enlarged view in FIG. 23 (b), the conductive particles P exhibiting magnetism are contained in a dispersed state. Then, as shown in FIG. 24, a metal mask composite 26F is arranged on the conductive elastomer material layer 16A so that each of the metal masks 26 is in contact with the conductive elastomer material layer 16A. Next, a magnetic field is applied to the conductive elastomer material layer 16A through the metal mask 26 in the thickness direction of the conductive elastomer material layer 16A. As a result, since the metal mask 26 is formed of a metal exhibiting magnetism, a portion of the conductive elastomer material layer 16A where the metal mask 26 is disposed has a stronger magnetic field than the other portions. It is formed. As a result, as shown in FIG. 25, the conductive particles P dispersed in the conductive elastomer material layer 16A gather at the portion where the metal mask 26 is arranged, and further, the conductive elastomer material material. Orient so that it is aligned in the thickness direction of layer 16A. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A, or after stopping the magnetic field action, the conductive elastomer material layer 16A is cured, as shown in FIG. In addition, the conductive particles P are arranged in the thickness direction in the elastic polymer material. A conductive elastomer layer 16B, which is contained in such an oriented state, is formed in a state of being supported on the releasable support plate 13.

[0059] In the above, the material constituting the releasable support plate 13, the method of applying the conductive elastomer material, the means for applying a magnetic field to the conductive elastomer material layer 16A, the strength of the magnetic field, the conductivity The conditions for the curing treatment of the material layer 16A for the elastomeric elastomer are the same as the method for manufacturing the anisotropic conductive connector of the first example described above.

[0060] <Formation of conductive path forming portion>

First, the metal foil 27 in the metal mask composite 26F disposed on the conductive elastomer layer 16B is removed by, for example, etching treatment to remove the metal mask 26 and the resist as shown in FIG. Layer 28 is exposed. Then, the conductive elastomer layer 16B and the resist layer 28 are subjected to laser processing through the metal mask 26, whereby a part of the resist layer 28 and the conductive elastomer layer 16B is removed. As shown in 28, a plurality of conductive path forming portions 16 arranged according to a specific pattern are formed in a state of being supported on the releasable support plate 13. Thereafter, the surface force of each of the conductive path forming portions 16 also peels off the metal mask 26.

Here, the laser processing is preferably performed using a carbon dioxide laser, whereby the conductive path forming portion 16 having a desired form can be reliably formed.

[0061] << Formation of Insulating Portion >>

As shown in FIG. 29, a releasable support plate 13A for forming an insulating portion is prepared, and a liquid polymer material that is cured on the surface of the releasable support plate 13A to become an insulating elastic polymer material. The insulating material layer 17A is formed by applying the forming material. Next, as shown in FIG. 30, the releasable support plate 13 formed with a plurality of conductive path forming portions 16 is overlaid on the releasable support plate 13A formed with the insulating material layer 17A. Thus, the conductive path forming portion 16 is infiltrated into the insulating portion material layer 17A and brought into contact with the releasable support plate 13A. As a result, the insulating material layer 17A is formed between the adjacent conductive path forming portions 16. Thereafter, in this state, the insulating portion material layer 17A is cured to insulate the adjacent conductive path forming portions 16 from each other as shown in FIG. The elastic anisotropic conductive film is formed integrally with the forming portion 16 and thereby formed. Then, the anisotropically conductive connector 10 having the configuration shown in FIG. 19 is obtained by releasing the molds by releasing the support plates 13 and 13A.

In the above, the material constituting the releasable support plate 13A, the method of applying the polymer substance-forming material, and the conditions for the curing treatment of the insulating material layer 17A are as described in the first example of the anisotropic conductive connector 10 This is the same as the manufacturing method.

[0062] According to the above manufacturing method, in a state where the metal mask 26 showing magnetism is arranged on the conductive elastomer material layer 16A according to the specific pattern of the conductive path forming portion 16 to be formed, By applying a magnetic field in the thickness direction of the elastomer material layer 16A and curing the conductive elastomer material layer 16A, the resulting conductive elastomer layer 16B is formed at the portion where the contact member 18 is disposed. The conductive particles P become dense, and the conductive particles P in other parts become sparse, so that it is very easy to remove the parts other than the conductive path forming part in the conductive elastomer layer 16B by laser processing. It becomes. Therefore, the conductive path forming portion 16 having the expected form can be reliably formed by laser processing the conductive elastomer layer 16 B through the metal mask 26. Then, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between the conductive path forming portions 16 and cured, thereby insulating portions 17 Therefore, it is possible to reliably obtain the insulating portion 17 in which no conductive particles are present. For this reason, it is not necessary to use a mold in which a large number of ferromagnetic parts, which have been used for manufacturing a conventional anisotropically conductive connector, are arranged.

[0063] FIG. 32 is a cross-sectional view illustrating the configuration of the fourth example of the anisotropic conductive connector according to the present invention, and FIG. 33 is an enlarged view of the main part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description shown. The anisotropic conductive connector 10 has a plurality of openings 12 formed therein. The frame plate 11 and a single elastic anisotropic conductive film 15 arranged so as to close each of the openings 12 of the frame plate 11 and supported by the frame plate 11 may be used.

In the elastic anisotropic conductive film 15, a plurality of conductive path forming portions 16 1S extending in the thickness direction are arranged so as to be positioned in the openings 12 of the frame plate 11 according to a specific pattern, and around each of the conductive path forming portions 16. Is formed in a state where a single insulating portion 17 that insulates the adjacent conductive path forming portions 16 from each other is integrally bonded to the conductive path forming portion 16! Speak. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to the pattern of the electrode to be connected, for example, the electrode to be inspected of the circuit device to be inspected.

The conductive path forming portion 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. In the illustrated example, each of the conductive path forming portions 16 is formed with a protruding portion protruding from one surface of the insulating portion 17.

[0064] The material constituting the frame plate 11 and the thickness of the frame plate 11 are the same as those of the anisotropic conductive connector 10 of the second example described above.

The elastic polymer material, conductive particles and other specific configurations of the elastic anisotropic conductive film 15 are the same as those of the anisotropic conductive connector 10 according to the first example.

[0065] The anisotropic conductive connector 10 described above can be manufactured as follows.

<< Formation of conductive path forming part >>

First, in the same manner as the method for manufacturing the anisotropic conductive connector 10 according to the third example, a plurality of conductive path forming portions 16 arranged and supported according to a specific pattern are formed on the releasable support 13. (Refer to Fig. 21 to Fig. 28).

[0066] <Formation of insulating portion>

As shown in FIG. 34, a releasable support plate 13A for forming an insulating portion is prepared, and a frame plate 11 is arranged on the surface of the releasable support plate 13A and cured to be an insulating elastic polymer. The insulating material layer 17A is formed by applying a liquid elastomer material that is a substance. Next, as shown in FIG. 35, the releasable support plate 13 formed with a plurality of conductive path forming portions 16 is superimposed on the releasable support plate 13A formed with the insulating material layer 17A. As a result, the conductive path forming portion 16 enters the insulating portion material layer 17A and is brought into contact with the releasable support plate 13A. As a result, the insulating material layer 17A is formed between the adjacent conductive path forming portions 16. Thereafter, in this state, the insulating portion material layer 17A is cured, so that the insulating portions 17 that insulate them from each other between the adjacent conductive path forming portions 16 as shown in FIG. An anisotropic anisotropic conductive film is formed integrally with the conductive path forming portion 16, thereby forming an anisotropic anisotropic conductive film. Then, the anisotropic conductive connector 10 having the configuration shown in FIG. 32 is obtained by releasing from the releasable support plates 13 and 13A.

In the above, the material constituting the releasable support plate 13A, the method of applying the polymer substance forming material, and the conditions for the curing treatment of the insulating material layer 17A are the anisotropic conductive connectors 10 of the second example described above. This is the same as the manufacturing method.

According to the above manufacturing method, in the state where the contact member 18 showing magnetism is arranged on the conductive elastomer material layer 16A according to the specific pattern of the conductive path forming portion 16 to be formed, the conductive elastomer material By applying a magnetic field in the thickness direction of the layer 16A and curing the conductive elastomer material layer 16A, the resulting conductive elastomer layer 16B has conductive particles in the portion where the contact member 18 is disposed. P becomes dense, and the conductive particles P in the other portions become sparse, which makes it very easy to remove the portions other than the portions forming the conductive path in the conductive elastomer layer 16B by laser processing. Therefore, by using the contact member 18 as a mask and laser processing the conductive elastomer layer 16B, it is possible to reliably form the conductive path forming portion 16 having the desired form. Then, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between these conductive path forming portions 16 and subjected to curing treatment, whereby the insulating portions 17 Therefore, it is possible to reliably obtain the insulating portion 17 in which no conductive particles are present. However, it is not necessary to use a mold that is used to manufacture a conventional anisotropically conductive connector and in which a large number of ferromagnetic parts are arranged.

Therefore, according to the anisotropic conductive connector 10 obtained by such a method, it is possible to reliably achieve the required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. In addition, the electrodes to be connected have a small and high pitch. Even if the electrodes are arranged at a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, and to reduce the manufacturing cost.

[0068] <Adapter device>

FIG. 37 is an explanatory cross-sectional view showing the configuration of the adapter device according to the first example of the present invention, and FIG. 38 is an explanatory cross-sectional view showing the adapter body in the adapter device shown in FIG. The adapter device is a circuit device such as a printed circuit board, for example, for testing a circuit device used for performing an open / short test, and has an adapter body 20 made of a multilayer wiring board.

On the surface of the adapter body 20 (upper surface in FIGS. 37 and 38), a connection electrode region in which a plurality of connection electrodes 21 are arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. 25 is formed.

A plurality of terminal electrodes 22 are arranged on the back surface of the adapter body 20 according to the grid point positions of pitches of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, and 2.54 mm, for example. Are electrically connected to the connection electrode 21 by the internal wiring portion 23. On the surface of the adapter body 20, the anisotropic conductive connector 10 of the second example shown in FIG. 14 is disposed on the connection electrode region 25. The adapter body 20 has an appropriate means (not shown). It is fixed by.

In this anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20, and the anisotropic conductive connector 10 Each of the conductive path forming portions 16 is arranged so as to be positioned on the connection electrode 21 of the adapter main body 20.

[0069] According to such an adapter device, since the anisotropic conductive connector 10 of the second example is provided, each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. The required electrical connection can be reliably achieved with respect to each of the electrodes to be inspected even when the electrodes to be inspected are arranged with a small pitch and a high density. The required electrical connection can be reliably achieved, and the manufacturing cost can be reduced.

FIG. 39 is a cross-sectional view illustrating the configuration of the adapter device according to the second example of the invention. FIG. 40 is a cross-sectional view illustrating the adapter body in the adapter device shown in FIG. This adapter device is for testing a circuit device used for conducting an electrical resistance measurement test of each wiring pattern by a circuit device such as a printed circuit board, for example. Have

On the surface of the adapter body 20 (upper surface in FIGS. 39 and 40), connection electrodes (hereinafter referred to as “the current supply electrodes”) that are spaced apart from each other and are electrically connected to the same electrode to be inspected. Also referred to as “current supply electrode”.) 21b and connection electrode for voltage measurement (hereinafter also referred to as “voltage measurement electrode”) Connection electrode region in which a plurality of connection electrode pairs 21a made of 21c are arranged 25 is formed. These connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. For example, the pitch of the adapter body 20 on the back surface is 0.8 mm, 0.75 mm, 1 A plurality of terminal electrodes 22 are arranged according to the grid point positions of 5 mm, 1.8 mm, and 2.54 mm. Each of the current supply electrode 21b and the voltage measurement electrode 21c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.

On the surface of the adapter body 20, the anisotropic conductive connector 10 of the second example shown in FIG. 14 is basically disposed on the electrode region 25 for connection. (Omitted).

In this anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrodes 21b, 21c in the adapter body 20, and the anisotropic conductive connector 10 Each of the conductive path forming portions 16 is disposed on the connection electrodes 21b and 21c of the adapter body 20.

According to the adapter device described above, since the anisotropic conductive connector 10 of the second example is provided, it is necessary for each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. Electrical connection can be reliably achieved, and even when the test electrodes are arranged with a small pitch and a high density, the required test electrodes are required for each of the test electrodes. The electrical connection can be achieved reliably, and the manufacturing force can be reduced. <Electrical inspection equipment for circuit devices>

FIG. 41 is an explanatory diagram showing the configuration of the first example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board on which electrodes 6 and 7 to be inspected are formed on both sides. The holder 2 is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution region E. Above the inspection execution area E, the upper side adapter device la and the upper side inspection head 50a configured as shown in FIG. 37 are arranged in this order, and further above the upper side inspection head 50a, A side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, the lower side adapter device lb and the lower side inspection head 50b configured as shown in FIG. 37 are arranged in this order, and further below the lower side inspection head 50b. The lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the lower side support plate 56b by a support 54b.

The upper inspection head 50a is composed of a plate-shaped inspection electrode device 5la and an anisotropically conductive sheet 55a having elasticity arranged and fixed to the lower surface of the inspection electrode device 5la. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged at lattice point positions at the same pitch as the terminal electrodes 22 of the upper-side adapter device la on the lower surface thereof, and each of these inspection electrodes 52a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.

The lower inspection head 50b is composed of a plate-shaped inspection electrode device 5 lb and an anisotropically conductive sheet 55b having elasticity arranged and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 5 lb has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device lb. Each is electrically connected to a connector 57b provided on the lower support plate 56b by an electric wire 53b, and further electrically connected to an inspection circuit (not shown) of the tester via this connector 57b. . [0073] The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction. As such anisotropically conductive sheets 55a and 55b, each of the conductive path forming portions is formed so as to protrude in the thickness direction at least on one surface, and exhibits high electrical contact stability. It is preferable in point to do.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, the upper support plate 56a and the lower support plate are supported. As each of the plates 56b moves in a direction approaching the circuit device 5, the circuit device 5 is clamped by the upper adapter device la and the lower adapter device lb.

In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper-side adapter device la through the conductive path forming portion 16 of the anisotropic conductive connector 10. The terminal electrode 22 of the upper adapter device la is electrically connected to the test electrode 52a of the test electrode device 5la via an anisotropic conductive sheet 55a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device lb through the conductive path forming portion 16 of the anisotropic conductive connector 10. The terminal electrode 22 of the side adapter device lb is electrically connected to the test electrode 52b of the test electrode device 5 lb through the anisotropic conductive sheet 55b.

[0075] In this way, each of the test electrodes 6 and 7 on both the upper surface and the lower surface of the circuit device 5 is connected to the test electrode 52a and the lower test head 50b of the test electrode device 51a in the upper test head 50a. As a result of being electrically connected to each of the inspection electrodes 52b of the inspection electrode device 51b, a state of being electrically connected to the inspection circuit of the tester is achieved, and a required electrical inspection is performed in this state.

[0076] According to the electrical inspection apparatus for a circuit board described above, since it has the upper side adapter device la and the lower side adapter device lb configured as shown in FIG. Regardless of the arrangement pattern of 7, the required electrical inspection can be reliably performed on the circuit device 5, and the electrodes 6 and 7 to be inspected of the circuit device 5 have minute pitches and high density. Required for the circuit device 5 even if it is placed It is possible to reliably perform the electrical inspection.

FIG. 42 is an explanatory view showing the configuration of the second example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 are formed on both sides. A holder 2 for holding 5 in the inspection execution area E is provided, and the holder 2 is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution area E.

Above the inspection execution area E, an upper adapter device la and an upper inspection head 50a configured as shown in FIG. 39 are arranged in this order, and further above the upper inspection head 5 Oa, The upper side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a support column 54a. On the other hand, below the inspection execution area E, the lower side adapter device lb and the lower side inspection head 50b configured as shown in FIG. 39 are arranged in this order, and further below the lower side inspection head 50b. The lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the support plate 56b by a support 54b.

The lower inspection head 50b is composed of a plate-shaped inspection electrode device 5 lb and an anisotropically conductive sheet 55b having elasticity arranged and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 5 lb has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device lb. Each is electrically connected to a connector 57b provided on the lower support plate 56b by an electric wire 53b, and further, a tester inspection is performed via this connector 57b. It is electrically connected to a circuit (not shown).

The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, the upper side support plate 56a and the lower side support As each of the plates 56b moves in a direction approaching the circuit device 5, the circuit device 5 is clamped by the upper adapter device la and the lower adapter device lb.

In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is anisotropically conductive to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper-side adapter device la. The terminal electrode 22 of the upper adapter device la is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a. Connected. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the lower adapter device lb. The terminal electrode 22 of this lower side adapter device lb is electrically connected to the inspection electrode device 5 lb of the inspection electrode 52b via the anisotropic conductive sheet 55b. Electrically connected.

[0079] In this way, each of the electrodes to be inspected 6, 7 on both the upper surface and the lower surface of the circuit device 5 is in the inspection electrode 52a and the lower inspection head 50b of the inspection electrode device 51a in the upper inspection head 50a. As a result of being electrically connected to each of the inspection electrodes 52b of the inspection electrode device 51b, a state of being electrically connected to the inspection circuit of the tester is achieved, and a required electrical inspection is performed in this state. Specifically, a constant current is supplied between the current supply electrode 21b in the upper adapter device la and the current supply electrode 21b in the lower adapter device lb, and the upper adapter device la. Designate one of the multiple voltage measurement electrodes 21c in la, the one specified voltage measurement electrode 21c, and the upper surface side inspected electrically connected to the voltage measurement electrode 21c Lower side adapter device electrically connected to the electrode 6 to be inspected on the lower surface side corresponding to the electrode 5 The voltage between the electrode 21c for voltage measurement at lb is measured, and based on the obtained voltage value, the electrode to be inspected on the upper surface side electrically connected to the one specified voltage measuring electrode 21c The electric resistance value of the wiring pattern formed between 5 and the corresponding electrode 6 to be inspected on the other side is obtained. Then, the electrical resistances of all the wiring patterns are measured by sequentially changing the designated voltage measuring electrode 21c.

[0080] According to the electrical inspection apparatus for a circuit board described above, since it has the upper side adapter device la and the lower side adapter device lb configured as shown in FIG. Regardless of the arrangement pattern of 7, the required electrical inspection can be reliably performed on the circuit device 5, and the electrodes 6 and 7 to be inspected of the circuit device 5 have minute pitches and high density. Even if it is arranged, the required electrical inspection can be reliably performed on the circuit device 5.

In the present invention, the present invention is not limited to the above-described embodiment, and various changes such as the following can be covered.

(1) In the anisotropic conductive connector 10, it is not essential that the conductive path forming portion 16 of the elastic anisotropic conductive film 15 has a protruding portion, and the entire surface of the elastic anisotropic conductive film 15 Even flat ones! /.

(2) In the adapter device, the anisotropic conductive connector 10 may be arranged so as to cover only the connection electrode region 25 of the adapter body 20.

(3) The circuit device to be inspected is not limited to a printed circuit board, but may be a semiconductor integrated circuit device such as a knock IC or MCM, or a circuit device formed on a wafer.

(4) In the adapter device, instead of the anisotropic conductive connector of the second example, the anisotropic conductive connector of the first example, the anisotropic conductive connector of the third example, or the anisotropic of the fourth example Conductive connectors can be used.

[0082] (5) In the method for manufacturing the anisotropic conductive connector 10, according to the pattern corresponding to the pattern of the conductive path forming portion 16 to be formed as the releasable support plate for forming the conductive path forming portion. A material in which a ferromagnetic part is arranged can be used. The configuration of an example of such a releasable support plate is shown in FIG. The releasable support plate 30 has a metal film 31 having a releasable surface (upper surface in FIG. 43) on which a conductive elastomer material layer is formed. On the back surface of the metal film 31, a ferromagnetic portion 32 is arranged according to a pattern corresponding to the pattern of the conductive path forming portion 16 to be formed, and a nonmagnetic portion 33 is arranged in the other region. Yes.

As a material constituting the metal film 31, nickel, gold, copper, or the like can be used. As a material constituting the ferromagnetic portion 32, nickel, cobalt, or an alloy thereof can be used.

As a material constituting the nonmagnetic part 33, a photoresist can be used. As shown in FIG. 44, such a releasable support plate 30 is formed by using a photoresist to form a non-magnetic part 33 having openings 33K formed on the metal film 31 according to the pattern of the ferromagnetic part 32 to be formed. After the formation, the surface of the portion exposed through the opening 33K of the non-magnetic portion 33 in the metal film 31 can be manufactured by performing a plating process. In such a releasable support plate 30, the conductive path forming portion 16 is formed as follows.

First, as shown in FIG. 45, a conductive elastomer material layer 16A is formed on the surface of the metal film 31 of the releasable support plate 30, and a contact member composite is formed on the conductive elastomer material layer 16A. 18F is arranged so that each of its contact members 18 is in contact with the conductive elastomer material layer 16A. Next, a magnetic field is applied to the conductive elastomer material layer 16A via the contact member 18 and the ferromagnetic portion 32 of the releasable support plate 30 in the thickness direction of the conductive elastomer material layer 16A. As a result, a portion of the conductive elastomer material layer 16 A located between the contact member 18 and the ferromagnetic portion 32 of the releasable support plate 30 has a stronger magnetic field than the other portions. It is formed. As a result, the conductive particles P dispersed in the conductive elastomer material layer 16A are formed between the contact member 18 and the ferromagnetic portion 32 of the releasable support plate 30 as shown in FIG. Are aligned in the thickness direction of the material layer 16A for the conductive elastomer. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A or after stopping the action of the magnetic field, the conductive elastomer material layer 16A is subjected to a curing process to obtain the result shown in FIG. As shown, a conductive elastomer layer 16B, which is contained in an elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction, is supported on the releasable support plate 13. It is formed in a held state.

Thereafter, the metal foil 14 in the contact member composite 18F disposed on the conductive elastomer layer 16B is removed by etching to remove the contact member 18 and the resist layer 19 as shown in FIG. Expose. Then, laser processing is performed on the conductive elastomer layer 16B and the resist layer 19 using the contact member 18 as a mask to remove a part of the resist layer 19 and the conductive elastomer layer 16B. As a result, as shown in FIG. As shown in FIG. 2, a plurality of conductive path forming portions 16 arranged according to a specific pattern and each provided with a contact member 18 are formed on the releasable support plate 30.

[0084] According to such a method using the releasable support plate 30, the magnetic material having a higher strength than the other portions in the portion where the contact member 18 is disposed with respect to the conductive elastomer material layer 16A. In the resulting conductive elastomer layer 16B, the conductive particles P in the portion where the contact member 18 is disposed become dense, and the conductive particles P in the other portions become the layer. Sparse. Therefore, even if the thickness of the conductive elastomer layer 16 is considerably large, the conductive path forming portion of the desired form can be obtained by laser processing the conductive elastomer layer 16 B using the contact member 18 as a mask. 16 can be formed.

[0085] (6) In the method of manufacturing the anisotropic conductive connector 10, as shown in FIG. 50, a metal film 37 is disposed on the elastic substrate 36 as the releasable support plate 35 for forming the insulating portion. You can use what you have!

As a material constituting the elastic substrate 36, an elastic polymer substance such as a hardened rubber or a thermoplastic elastomer can be used.

As a material constituting the metal film 37, copper, gold, nickel, silver, iron, cobalt, alloys thereof, alloy steels thereof, or the like can be used.

According to such a method using the releasable support plate 35, the conductive path forming portion 16 is infiltrated into the insulating material layer 17A formed on the releasable support plate 35 so that each contact member 18 is By making contact with the releasable support plate 35 and further pressurization, the pressurized portion of the releasable support plate 35 is deformed into a compressed state in the thickness direction, and thereby, the insulating portion material. Before the layer 17A is cured, the contact member 18 and the conductive path forming portion 16 are also in a state where the bottom surface force of the insulating material layer 17A also protrudes, so that the anisotropic conductive connector 10 having the protruding portion is reliably manufactured. can do.

[0086] Further, in forming the conductive path forming portion 16, all of the conductive elastomer layer 16B other than the portion that becomes the conductive path forming portion is removed by laser processing, whereby the conductive path forming portion is removed. However, as shown in FIGS. 51 and 52, the conductive path forming portion 16 can be formed by removing only the peripheral portion of the conductive elastomer layer 16B that becomes the conductive path forming portion. You can also. In this case, the remaining portion of the conductive elastomer layer 16B can be removed by mechanically peeling from the releasable support plate 15.

(7) As shown in FIG. 53, the anisotropically conductive connector 10 is arranged so as to close the frame plate 11 formed with a single opening 12 and the opening 12 of the frame plate 11. A structure composed of a single elastic anisotropic conductive film 15 may be used.

Further, as shown in FIG. 54, the anisotropically conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a plurality of elastic plates each arranged so as to close one opening 12 of the frame plate 11. A structure composed of the directionally conductive film 15 may be used.

Further, the anisotropic conductive connector 10 includes a frame plate in which a plurality of openings are formed, one or more elastic anisotropic conductive films arranged so as to close one opening of the frame plate, and a frame plate. A configuration including one or two or more elastic anisotropic conductive films arranged to block a plurality of openings may be used.

Example

(1) Manufacture of contact member composite:

Prepare a laminated material in which a metal foil (14) made of copper with a thickness of S18 μm is peeled and laminated on one surface of a 100 μm thick resin film made of polyethylene terephthalate. On the surface of the foil (14), using a photolithography technique, 4800 rectangular (19K) forces each having a dimension of 120 m x m Minimum separation distance Force S30 m (minimum center-to-center distance of 90 μm) resist layer with a thickness of 80 μm (19) was formed (see FIG. 3). Thereafter, electrolytic nickel plating is applied to the surface of the metal foil (14) to form a contact member (18) made of nickel having a thickness of about 80 m in each opening (19K) of the resist layer (19). Therefore, the contact member composite (18F) was manufactured (see Fig. 4).

) o

(2) Formation of one layer of conductive elastomer:

Additive liquid silicone rubber 100 parts by weight of conductive particles in which core particles made of nickel are coated with gold (number average particle diameter is 12 m, the ratio of gold to core particles is 2% by weight) 70 parts by weight Was dispersed to prepare a conductive elastomer material. This conductive elastomer material is applied to the surface of a releasable support plate (13) made of stainless steel having a thickness of 5 mm by screen printing, so that the thickness of the conductive elastomer material is increased on the releasable support plate (13). A conductive elastomer material layer (16A) with a thickness of 150 m was formed (see Fig. 5).

Next, the contact member composite (18F) is disposed on the conductive elastomer material layer (16A) such that each of the contact members (18) is in contact with the conductive elastomer material layer (16A). In this state, the material layer for conductive conductive elastomer (16A) is cured at 120 ° C for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction with an electromagnet. Thus, a conductive elastomer layer (16B) having a thickness of 150 m supported on the releasable support plate 13 was formed (see FIGS. 6 to 8).

(3) Formation of conductive path forming part:

Surface force of the metal foil (14) in the contact member composite (18F) The resin film is peeled off, and the metal foil (14) is removed by an etching process, whereby the contact member (18) and the resist layer (19) Was exposed (see Figure 9). Then, in this state, the conductive elastomer layer (16B) and the resist layer (18) are subjected to laser processing with a carbon dioxide laser device using the contact member (14) as a mask, so that the releasable support plates ( 13) 4800 conductive path forming portions (16) supported on each of the contact members (18) and physically formed were formed (see FIG. 10).

In the above, the laser processing conditions by the carbon dioxide laser device are as follows. In other words, a carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) is used as the equipment, and the laser beam diameter is 60 m and the laser output is 0.8 mJ. The laser processing was performed by irradiating 10 shots of the laser beam at one processing point.

[0090] (4) Fabrication of frame plate:

In accordance with the configuration shown in FIG. 14, a frame plate (11) was produced as follows. Prepare a laminated sheet (“Espanex LB18—50—18NEP” made by Nippon Steel Engineering Co., Ltd.) in which copper foil is laminated on both sides of a resin sheet made of a liquid crystal polymer with a thickness of 50 μm. A resist film was formed by laminating a dry film resist on the copper foil on one side of the sheet. Next, by performing exposure processing and development processing on the formed resist film, pattern holes corresponding to the opening of the target frame plate are formed in the resist film, and further, etching processing is performed. An opening having a pattern corresponding to the opening of the target frame plate was formed in the copper foil, and then the resist film was removed.

Then, the resin sheet in the laminated sheet is subjected to laser processing through the opening formed in the copper foil to form an opening, and thereafter, the copper foil on both sides of the laminated sheet is subjected to etching treatment. By removing, a frame plate (11) was created.

This frame plate (11) is made of liquid crystal polymer and has dimensions of 190mm XI 30mm X 50 / zm, the opening (12) is a circle with a diameter force of OO / zm, and the total number of openings (12) is 2400 It is.

[0091] (5) Formation of insulating portion:

By applying addition-type liquid silicone rubber to the surface of the releasable support plate (13A), a coating film having a thickness of 10 m is formed, and a frame plate (11) is disposed on the coating film. By applying additional liquid silicone rubber, an insulating material layer (17A) with a total thickness of 100 m was formed, which was placed to close the opening (12) of the frame plate (11) (see Fig. 16). ). On this insulating part material layer (12), the releasable support plate (13) on which 4800 conductive path forming parts (16) each having contact members (18) are formed is aligned and overlapped. Thus, each of the conductive path forming portions (16) was allowed to enter the insulating material layer (17A), and the contact member (18) was brought into contact with the releasable support plate (13A). . Then, by applying a pressure of 800 kgf to the releasable support plate (13), the thickness of the conductive path forming part (16) was inertially compressed to 1200 / zm even at 150 μm force (see Fig. 17). In this state, 120 ° C for 1 hour In this case, the insulating material layer (17A) is hardened to form an integral insulating portion (17) around the conductive path forming portion (16), and thus an elastic anisotropic conductive film (15 ) (See FIG. 18), and then the anisotropic anisotropic conductive film (15) is released with the release support plate (13, 13A) force, so that the anisotropic conductive connector of the present invention is released. (10) was produced. In this anisotropic conductive connector (10), the elastic anisotropic conductive film (15) has a conductive path forming part (16) having a thickness of 150 111, an insulating part (17) having a thickness of 100 μm, a conductive path forming part ( 16) The minimum separation distance is 30 m (minimum center-to-center distance is 90 m), and the two conductive path forming parts (16) are positioned within the opening (12) of the frame plate (11) Has been. In addition, the conductive path forming portion (17) protrudes from both surfaces of the insulating portion (17), and the protruding height of the conductive path forming portion (16) is 50 m in total.

[0092] (6) Manufacture of adapter device:

According to the configuration shown in FIG. 38, an adapter body (20) having the following specifications was manufactured. That is, the adapter body (20) has a vertical and horizontal dimension of 160 mm X 120 mm, and the substrate material is a glass fiber reinforced epoxy resin. The connection electrode region on the surface of the adapter body (20) includes A rectangular connecting electrode with dimensions of 120 m x 60 m (21) force The minimum separation distance is 30 m (minimum center-to-center distance is 90 m). On the back of the adapter body (20), a total of 4800 terminals are arranged at a pitch of a circular terminal electrode (22) force of 750 μm with a diameter of 400 m.

The anisotropic conductive connector (10) is placed on the connection electrode region on the surface of the adapter body (20), and each of the conductive path forming portions (16) is positioned on the connection electrode (21). The adapter device of the present invention was manufactured by arranging and fixing as described above.

[0093] (7) Evaluation of adapter device:

For the adapter device described above, an electrical resistance measuring instrument is used to electrically connect each of the conductive path forming portions to the surface of the conductive path forming portion and the conductive path forming portion in a state where each of the conductive path forming portions is compressed 5% in the thickness direction. The electrical resistance (hereinafter referred to as “conducting resistance”) between the terminal electrode and the terminal electrode was measured, and the ratio of the conductive path forming part having this conducting resistance of 0.1 Ω or less was found to be 100%.

Also, two conductive path forming parts adjacent to each other (hereinafter referred to as “conductive path forming part pair”) in a state where each of the conductive path forming parts is compressed 5% in the thickness direction using an electric resistance measuring instrument. The electrical resistance (hereinafter referred to as “insulation resistance”) was measured, and the ratio of the pair of conductive path forming portions having an insulation resistance of 100 μΩ or more was determined to be 100%.

Thus, in the adapter device described above, high conductivity is obtained in all the conductive path forming portions, and all the conductive path forming portions are sufficiently insulated between the adjacent conductive path forming portions. It was confirmed that the condition was achieved.

(1) Fabrication of metal mask composite

Prepare a laminated material in which a metal foil (27) made of copper with a thickness of S18 μm is peeled and laminated on one surface of a 100 μm thick resin film made of polyethylene terephthalate. On the surface of the foil (27), using a photolithographic technique, 4800 rectangular (28K) forces each with a dimension of 120 m x m Minimum separation distance Force S30 m (minimum center-to-center distance of 90 A resist layer (28) with a thickness of 80 μm was formed (see FIG. 21). After that, the surface of the metal foil (27) is subjected to electrolytic nickel plating treatment, so that a metal mask (26) made of approximately 80 m thick in each opening (28K) of the resist layer (28). Thus, a metal smack composite (26F) was produced (see FIG. 22).

Here, the plating treatment was performed under the conditions of a plating bath temperature of 50 ° C, a current density of 2.5 AZdm, and a plating treatment time of 2 hours.

(2) Formation of one layer of conductive elastomer:

Conductive particles in which gold is coated on nickel core particles in 100 parts by weight of addition type liquid silicone rubber (number average particle diameter is 12 m, the ratio of gold to core particles is 2% by weight) 76 parts by weight Was dispersed to prepare a conductive elastomer material. This conductive elastomer material is applied to the surface of a releasable support plate (13) made of stainless steel having a thickness of 5 mm by screen printing, so that the thickness of the conductive elastomer material is increased on the releasable support plate (13). A conductive elastomer material layer (16A) having a thickness of 150 m was formed (see FIG. 23).

Next, the metal mask composite (26F) is disposed on the conductive elastomer material layer (16A) so that each of the metal masks (26) is in contact with the conductive elastomer material layer (16A). In this state, the electroconductive elastomer material layer (16A) is electromagnetized. Thus, a conductive elastomer layer with a thickness of 150 m supported on the releasable support plate 13 is obtained by performing a curing process at 120 ° C for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction. (16B) was formed (see FIGS. 24 to 26).

[0095] (3) Formation of conductive path forming portion

Surface force of metal foil (27) in metal mask composite (26F) Peel off the resin film, and use ferric chloride etching solution on the exposed metal foil (27) at 50 ° C for 30 seconds. By removing the metal foil (27) by etching under the conditions described above, the metal mask (26) and the resist layer (28) were exposed (see FIG. 27). In this state, each of the conductive elastomer layer (16B) and the resist layer (28) is subjected to laser processing with a carbon dioxide gas laser device through a metal mask (26), thereby providing a releasable support plate. (13) 4800 conductive path forming portions (16) supported on the top were formed (see FIG. 28). In the above, the laser processing conditions by the carbon dioxide laser device are as follows. In other words, the carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) was used as the equipment, the laser beam diameter was 60 m, and the laser output was 0.8 mJ. Laser processing was performed by irradiating the laser beam with 10 shots.

[0096] (4) Fabrication of frame plate:

In accordance with the configuration shown in FIG. 32, a frame plate (11) was produced as follows. Prepare a laminate sheet (“Espanex LB18—50—18NEP” made by Nippon Steel Engineering Co., Ltd.) in which copper foil is laminated on both sides of a resin sheet made of a liquid crystal polymer with a thickness of 50 μm. A resist film was formed by laminating a dry film resist on the copper foil on one side of the sheet. Next, by performing exposure processing and development processing on the formed resist film, pattern holes corresponding to the opening of the target frame plate are formed in the resist film, and further, etching processing is performed. An opening having a pattern corresponding to the opening of the target frame plate was formed in the copper foil, and then the resist film was removed.

Then, the resin sheet in the laminated sheet is subjected to laser processing through the opening formed in the copper foil to form an opening, and thereafter, the copper foil on both sides of the laminated sheet is subjected to etching treatment. By removing, a frame plate (11) was created. This frame plate (11) is made of liquid crystal polymer and has dimensions of 190mm XI 30mm X 50 / zm, the opening (12) is a circle with a diameter force of OO / zm, and the total number of openings (12) is 2400 It is.

[0097] (5) Formation of insulating portion:

By applying addition-type liquid silicone rubber to the surface of the releasable support plate (13A), a coating film having a thickness of 10 m is formed, and a frame plate (11) is disposed on the coating film. By applying the addition type liquid silicone rubber, an insulating material layer (17A) having a total thickness of 100 m is formed to close the opening (12) of the frame plate (11). On the part material layer (127), the releasable support plate (13) on which 4800 conductive path forming parts (16) are formed is aligned and overlapped to form the conductive path forming part (16). Each of these was infiltrated into the insulating material layer (17A) and brought into contact with the releasable support plate (13A) (see FIGS. 34 and 35). Then, by applying a pressure of 800 kgf to the releasable support plate (13), the thickness of the conductive path forming part (16) is inertially compressed from 150 m to 120 m, and in this state, 120 ° C, 1 The insulating material layer (17A) is cured under conditions of time to form an integral insulating portion (17) around the conductive path forming portion (16), and thus the elastic anisotropic conductive film is formed. After forming (see FIG. 36), the anisotropic conductive film (10) of the present invention was manufactured by releasing the elastic anisotropic conductive film from the release support plate (13, 13A). The elastic anisotropic conductive film (15) in this anisotropic conductive connector (10) has a conductive path forming part (16) thickness of 15 O ^ m, an insulating part (17) thickness of 100 m, and a conductive path forming part. The minimum separation distance of (16) is 3 O ^ m (minimum center-to-center distance is 90 μm), and two conductive path forming parts (16) are placed in the opening (12) of the frame plate (11). It is arranged to be located. Further, the conductive path forming portion (17) protrudes on both sides of the insulating portion (17), and the total projecting height of the conductive path forming portion (16) is 50 μm.

[0098] (6) Manufacture of adapter device:

According to the configuration shown in FIG. 38, an adapter body (20) having the following specifications was manufactured. That is, the adapter body (20) has a vertical and horizontal dimension of 160 mm X 120 mm, and the substrate material is a glass fiber reinforced epoxy resin. The connection electrode region on the surface of the adapter body (20) includes Rectangular connection electrode with dimensions of 120 m x 60 m (21) force The minimum separation distance is 30 m (minimum center distance is 90 m), and a total of 4800 are arranged. On the back of the adapter body (20), a total of 4800 terminals are arranged at a pitch of a circular terminal electrode (22) force of 750 μm with a diameter of 400 m.

[0099] (7) Evaluation of adapter device:

[0100] <Comparative Example 1>

(1) Mold making:

In accordance with the configuration shown in FIG. 55, a mold for forming an anisotropic conductive film having the following specifications was produced.

The substrate (81, 86) in each of the upper mold (80) and the lower mold (85) is made of iron and has a thickness of omm.

The ferromagnetic part (82, 87) is made of nickel, is rectangular with dimensions of 120 m x 60 m in length and width, is 100 m in thickness, and is the smallest of the plate-like ferromagnetic parts (82, 87). The total number of ferromagnetic layers is 4800 with a separation distance of 30 μm (minimum center-to-center distance is 90 μm). The non-magnetic part (83, 88) is made of a hardened dry film resist and has a thickness of 0.125 mm.

(2) Fabrication of frame plate:

A frame plate (90) was produced in the same manner as in Example 1.

(3) Preparation of anisotropic conductive elastomer material:

By adding 60 parts by weight of conductive particles with an average particle diameter of 12 m to 100 parts by weight of addition-type liquid silicone rubber, mixing, and then subjecting to degassing treatment under reduced pressure, a material for anisotropic conductive elastomers Was prepared. In the above, as the conductive particles, those obtained by subjecting core particles made of nickel to gold plating (average coating amount: 2% by weight of the weight of the core particles) were used.

(4) Formation of elastic anisotropic conductive film:

On the molding surface of the lower mold (85) of the above-mentioned mold, a spacer with a thickness of 25 μm with an opening of 160mm x 120mm formed is aligned and placed in the opening of this spacer. The prepared anisotropic conductive elastomer material was applied by screen printing to form an anisotropic conductive elastomer material layer having a thickness of 25 m. Next, the spacer and the spacer with the thickness of 25 μm in which the prepared frame plate (90) and 160mm X 1 20mm opening were formed on the spacer and anisotropic conductive elastomer layer were aligned in this order. An anisotropic conductive elastomer material layer (95A) having a form corresponding to the target elastic anisotropic conductive film was formed by applying the arranged and adjusted anisotropic conductive elastomer material by screen printing. .

Then, the upper mold (80) is positioned and arranged on the anisotropic conductive elastomer material layer (95A), and the ferromagnetic part (82A) is placed against the anisotropic conductive elastomer material layer (95A). , 87) by applying a 2T magnetic field in the thickness direction with an electromagnet to the part located between 120 ° C and 1 hour for the thickness between the conductive particles. An anisotropic anisotropic conductive film composed of 4800 conductive path forming portions extending in the direction and insulating portions formed around the conductive path forming portions was formed. Thus, an anisotropic conductive connector for comparison was manufactured. The elastic anisotropic conductive film in this anisotropic conductive connector has a conductive path forming portion thickness of 1 m, an insulating portion thickness of 100 m, and a minimum separation distance of the conductive path forming portion of 30 m (maximum The small center-to-center distance is 90 m), and the two conductive path forming portions are arranged so as to be positioned in the opening of the frame plate. In addition, the conductive path forming part protrudes from each side of the insulating part, and the total projecting height of the conductive path forming part is 50 m. In addition, the content ratio of the conductive particles in the conductive path forming portion is about 30% in volume fraction.

(5) Manufacture of adapter device:

An adapter body having the same specifications as in Example 1 was prepared, and the anisotropic conductive connector was placed on the connection electrode area on the surface of the adapter body, and each of the conductive path forming portions was a connection electrode. An adapter device for comparison was manufactured by placing and fixing it so as to be positioned above.

(6) Evaluation of adapter device:

With respect to the adapter device, the conduction resistance was measured in the same manner as in Example 1, and the ratio of the conductive path forming portion having the conduction resistance of 0.1 Ω or less was determined to be 100%. Further, the insulation resistance was measured in the same manner as in Example 1, and the ratio of the conductive path forming portion pair having an insulation resistance of 100 μΩ or more was determined to be 97%.

As described above, in the comparative adapter device described above, high conductivity was obtained in all the conductive path forming portions, but sufficient insulation was provided between adjacent conductive path forming portions for all the conductive path forming portions. The force was unable to achieve the condition.

Claims

The scope of the claims

[1] An elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state in which the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by an insulating portion; A method of manufacturing an anisotropic conductive connector having a contact member made of metal integrally provided on the conductive path forming portion,

The conductive elastomer layer is laser-processed to remove a portion other than the portion where the contact member is disposed, whereby a plurality of conductive layers disposed according to the specific pattern on the releasable support plate. A path forming part is formed, and between these conductive path forming parts, an insulating part material layer made of a polymer material forming material that is cured and becomes an elastic polymer substance is formed and cured to form an insulating part. A method for manufacturing an anisotropically conductive connector, comprising the step of forming.

[2] A frame plate in which one or more openings are formed, and oriented so that the conductive particles exhibiting magnetism arranged to close the opening of the frame plate and supported by the frame plate are aligned in the thickness direction. A plurality of conductive path forming portions that extend in the thickness direction and are contained in an isolated state are integrally formed on one or two or more elastic anisotropic conductive films that are insulated from each other by insulating portions. A method of manufacturing an anisotropic conductive connector having a contact member made of metal provided on

On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed. A contact member made of a metal exhibiting magnetism is disposed on the surface of the material layer for the conductive elastomer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. A conductive elastomer layer is formed by applying a magnetic field to the material layer in the thickness direction and curing the material layer for the conductive elastomer.

The conductive elastomer layer is laser processed to remove a portion other than the portion where the contact member is disposed, so that the conductive member is disposed according to the specific pattern on the releasable support plate. In this state, each of the conductive path forming portions provided with the contact member is formed so as to close the opening of the frame plate, and is cured to be highly elastic. A process of forming an insulating part by infiltrating into an insulating part material layer made of a liquid polymer substance forming material that becomes a molecular substance, and curing the insulating part material layer. A method of manufacturing a conductive connector.

[3] A resist layer having openings formed according to a specific pattern is formed on the metal foil, and the opening force of the resist layer in the metal foil is subjected to a plating process with a metal exhibiting magnetism. By manufacturing a contact member composite in which contact members are formed in each of the openings of the resist layer, and stacking the contact member composite on the surface of the material layer for the conductive elastomer, 3. The method of manufacturing an anisotropic conductive connector according to claim 1, wherein a contact member made of a metal exhibiting magnetism is disposed on the surface of the material layer for an elastomer according to the specific pattern.

[4] An elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by an insulating portion. A method of manufacturing an anisotropic conductive connector having:

A metal mask showing magnetism is disposed on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. In this state, the conductive elastomer material layer is formed on the conductive elastomer material layer. On the other hand, if a magnetic field is applied in the thickness direction, Next, the conductive elastomer material layer is cured to form a conductive elastomer layer,

The conductive elastomer layer is laser-processed to remove a portion other than the portion where the metal mask is disposed, whereby a plurality of conductive layers disposed in accordance with the specific pattern on the releasable support plate. A path forming part is formed, and between these conductive path forming parts, an insulating part material layer made of a polymer material forming material that is cured and becomes an elastic polymer substance is formed and cured to form an insulating part. A method for manufacturing an anisotropically conductive connector, comprising the step of forming.

A frame plate in which one or more openings are formed, and one or more elastic anisotropic conductive films arranged to close the frame plate and supported by the frame plate. The elastic anisotropic conductive film includes a plurality of conductive path forming portions extending in the thickness direction, which are disposed in the openings of the frame plate, and are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction. A method of manufacturing an anisotropic conductive connector comprising an insulating portion formed around a conductive path forming portion,

The conductive elastomer layer is laser-processed to remove a portion other than the portion where the metal mask is disposed, whereby a plurality of conductive layers disposed in accordance with the specific pattern on the releasable support plate. Forming a path forming section,

Each of the conductive path forming portions formed on the releasable support plate is used for an insulating portion made of a liquid polymer material forming material that is cured and becomes an elastic polymer material so as to close the opening of the frame plate. Penetration into the material layer, and in this state, the insulating material layer is cured. A method for manufacturing an anisotropic conductive connector, comprising a step of forming an insulating portion by forming an insulating portion.

[6] A resist layer having openings formed according to a specific pattern is formed on the metal foil, and the opening force of the resist layer in the metal foil is subjected to a plating process with a metal exhibiting magnetism. From this, a metal mask composite in which a metal mask is formed in each of the openings of the resist layer is manufactured, and the metal mask composite is stacked on the surface of the material layer for the conductive elastomer. 6. The anisotropic conductive connector according to claim 4, wherein a metal mask made of a metal exhibiting magnetism is disposed on the surface of the material layer for the conductive elastomer according to the specific pattern. Method.

[7] An anisotropic conductive connector obtained by the manufacturing method according to any one of [1] to [6].

[8] An adapter body having a connection electrode area in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface, and disposed on the connection electrode area of the adapter body The anisotropic conductive connector according to claim 7, further comprising a plurality of conductive path forming portions formed according to a pattern corresponding to a connection electrode in the adapter body.

An adapter device characterized by comprising:

[9] A connection in which a plurality of connection electrode pairs each consisting of two connection electrodes for current supply and voltage measurement are formed according to the pattern corresponding to the electrode to be inspected in the circuit device to be inspected on the surface. An adapter body having an electrode region for,

The anisotropic conductive material according to claim 7, further comprising a plurality of conductive path forming portions arranged on a connection electrode region of the adapter body and formed according to a pattern corresponding to the connection electrode in the adapter body. Sex connector and

An adapter device characterized by comprising:

[10] An electrical inspection device for a circuit device comprising the adapter device according to claim 8 or 9.