JP2002289277A - Anisotropic conductive connector and applied product thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive connector and an applied product thereof allowing easily positioning and holding/fixing a circuit device to be connected and eliminating adverse effects by static change even when a pitch of electrodes of the circuit device is small. SOLUTION: This connector has a frame plate wherein a penetrating hole extending in a thickness direction is formed, and an elastic anisotropic conductive film arranged inside the penetrating hole and supported on a periphery of the penetrating hole. The elastic anisotropic conductive film is formed by a function part formed by a conductive part for connection extending in the thickness direction and an insulation part formed around the conductive part, and a supported part integrally formed on a circumference of the function part and fixed on the periphery of the penetrating hole. A conductive part for static charge elimination to have conductivity in a thickness direction to be connected to ground via the frame plate is formed on the supported part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropically conductive connector used for making electrical connections between circuit devices, for example, and more particularly to a plurality of integrated circuits formed on a wafer. The present invention relates to an anisotropic conductive connector suitable as a connector for performing each electrical inspection in a wafer state, and an application product thereof.

[0002]

2. Description of the Related Art An anisotropic conductive elastomer sheet has conductivity only in the thickness direction, or has a pressurized conductive portion which has conductivity only in the thickness direction when pressed in the thickness direction. It is possible to achieve a compact electrical connection without using means such as soldering or mechanical fitting, and it is possible to absorb mechanical shocks and strains and make a soft connection Since it has such features as, for example, using such a feature, for example, a computer,
In the fields of electronic digital watches, electronic cameras, computer keyboards, etc., it is widely used as a connector for achieving an electrical connection between circuit devices, for example, a printed circuit board and a leadless chip carrier, a liquid crystal panel, etc. ing.

In electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, an electrode to be inspected formed on one surface of the circuit device to be inspected and an electrode to be inspected formed on the surface of the inspection circuit substrate. In order to achieve electrical connection with the test electrode, an anisotropic conductive elastomer sheet is interposed between the test electrode region of the electric circuit component and the test electrode region of the test circuit board. ing.

Hitherto, as such an anisotropic conductive elastomer sheet, those having various structures are known. For example, JP-A-51-93393 discloses that metal particles are uniformly dispersed in an elastomer. Anisotropically conductive elastomer sheets (hereinafter referred to as “dispersion type anisotropically conductive elastomer sheets”) are disclosed, and Japanese Patent Application Laid-Open No. 53-147772 discloses a conductive magnetic material. By distributing the particles non-uniformly in the elastomer, an anisotropic conductive elastomer sheet (hereinafter, referred to as “unevenly distributed”) is formed by forming a number of conductive portions extending in the thickness direction and insulating portions that insulate them from each other. Mold anisotropic conductive elastomer sheet "), and JP-A-61-25.
No. 0906 discloses an unevenly distributed anisotropic conductive elastomer sheet in which a step is formed between the surface of a conductive portion and an insulating portion. The unevenly distributed anisotropically conductive elastomer sheet has a conductive portion formed in accordance with a pattern opposite to the electrode pattern of the circuit device to be connected. This is advantageous in that the electrical connection between the electrodes can be achieved with high reliability even in a circuit device or the like in which the arrangement pitch of the power electrodes, that is, the distance between the centers of adjacent electrodes, is small.

[0005] In such an unevenly distributed anisotropic conductive elastomer sheet, it is necessary to hold and fix it in a specific positional relationship with respect to the electric circuit component in an electric connection operation with a circuit device to be connected. . However, the anisotropic conductive elastomer sheet is flexible and easily deformable, has low handleability, and has been used in recent years due to miniaturization and high-density wiring of electric products. Since the number of electrodes in a circuit device increases, the arrangement pitch of the electrodes tends to be smaller and the density tends to be higher. It is becoming difficult to align and hold and fix the unevenly distributed anisotropically conductive elastomer sheet when making the electrical connection described above. Further, in the electrical inspection of a circuit device, a burn-in test or a heat sile test in which the electrical inspection is performed while the circuit device is heated to a predetermined temperature in order to develop a potential defect of the circuit device to be inspected. However, in such a test, even if the required alignment and holding and fixing of the circuit device and the unevenly distributed anisotropic conductive elastomer sheet are once realized, the heat due to the temperature change Upon receiving the history, the degree of stress due to thermal expansion and thermal contraction is different between the material constituting the circuit device to be inspected and the material constituting the unevenly distributed anisotropically conductive elastomer sheet. Is changed, and a stable connection state is not maintained.

In order to solve such a problem, a metal frame plate having an opening, and an anisotropic conductive member disposed in the opening of the frame plate and having a peripheral portion supported by the opening edge of the frame plate. An anisotropic conductive connector comprising an elastomer sheet has been proposed (JP-A-11-402).
No. 24).

According to the above-described anisotropically conductive connector, since the anisotropically conductive elastomer sheet is supported by the metal plate, it is not easily deformed and is easy to handle. By using the material, it is possible to easily perform alignment and holding and fixing with respect to the circuit device in the electrical connection work of the circuit device, and use a material having a low coefficient of thermal expansion as a material forming the support. Accordingly, the thermal expansion and thermal shrinkage of the anisotropic conductive sheet are regulated by the support, so that even when a thermal history due to a temperature change is received, a good electrical connection state is stably maintained.

[0008]

However, it has been found that such an anisotropically conductive connector has the following problems. In the above anisotropically conductive connector, the peripheral portion of the anisotropically conductive elastomer sheet is used as a supported portion supported by the frame plate. No conductive portion is formed at all for making the electrical connection. Therefore, in the peripheral portion of the anisotropically conductive elastomer sheet, since there is an insulating portion of a considerably large area, depending on the usage method and usage environment of the anisotropically conductive connector,
The peripheral surface of the anisotropically conductive elastomer sheet is charged with static electricity, causing various problems. For example, when an anisotropically conductive connector is used for electrical inspection of a circuit device, an anisotropically conductive connector is interposed between a circuit device to be inspected and a circuit board for inspection, and the anisotropically conductive connector in the anisotropically conductive connector is used. By pressing the anisotropic conductive elastomer sheet, an electrical connection is established between the circuit device to be tested and the circuit board for testing, and an electrical test is performed. It is easy to carry out the electrical inspection of a large number of circuit devices in succession, so that electric charges are accumulated on the surface of the peripheral portion of the anisotropic conductive elastomer sheet, and high voltage static electricity is charged. Then, the static electricity is discharged through the conductive portion of the anisotropic conductive elastomer sheet, so that not only the conductive portion of the anisotropic conductive elastomer sheet and the wiring circuit on the inspection circuit board, but also the circuit device to be inspected. In some cases, the anisotropic conductive elastomer sheet or the inspection circuit board may be damaged, or the inspection target circuit device to be inspected may be damaged. In addition, when electric charges are accumulated on the surface of the anisotropic conductive elastomer sheet and become electrostatic, the circuit device to be inspected adheres to the anisotropic conductive elastomer sheet due to the static electricity, so that the inspection work can be performed smoothly. It will be difficult.

The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a circuit device having a small electrode pitch even if the pitch of the electrodes of the circuit device to be connected is small. An object of the present invention is to provide an anisotropic conductive connector that can easily perform alignment and holding and fixing, and that can eliminate adverse effects due to static electricity. A second object of the present invention is to provide, in addition to the above objects, an anisotropically conductive connector capable of stably maintaining a good electrical connection state against environmental changes such as heat history due to temperature changes. To provide. A third object of the present invention is that even if a circuit device to be inspected has a small pitch of electrodes to be inspected, alignment and holding and fixing with respect to the circuit device can be easily performed, and furthermore, static electricity is generated by static electricity. An object of the present invention is to provide a probe member capable of eliminating an adverse effect. A fourth object of the present invention is to enable easy positioning and holding / fixing of a circuit device to be inspected even if the pitch of electrodes to be inspected is small, and furthermore, static electricity generated by static electricity An object of the present invention is to provide an electrical inspection device for a circuit device that can eliminate adverse effects. A fifth object of the present invention is to provide a conductive connection structure that can eliminate adverse effects due to static electricity.

[0010]

According to the present invention, there is provided an anisotropic conductive connector comprising: a frame plate having a through hole extending in a thickness direction; a frame plate disposed in the through hole of the frame plate; Consisting of an elastic anisotropic conductive film supported by
The elastic anisotropic conductive film is formed integrally with a conductive portion extending in a thickness direction and a functional portion including an insulating portion formed around the conductive portion for connection, and a peripheral portion of the functional portion. And a supported portion fixed to a peripheral portion of the through-hole, and the supported portion is formed with a conductive portion for static elimination in the thickness direction which is connected to ground via the frame plate and has conductivity in a thickness direction. It is characterized by being.

In the above anisotropic conductive connector,
The frame plate may have a plurality of through holes, and an elastic anisotropic conductive film may be disposed in each of the through holes.

The anisotropically conductive connector according to the present invention is an anisotropically conductive connector used for performing an electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer. An anisotropically conductive connector used for performing an electrical inspection of the integrated circuit in a state of the wafer for each of the plurality of integrated circuits formed on the wafer. A frame plate having a plurality of through holes extending in the thickness direction corresponding to the electrode regions where the electrodes to be inspected are formed; and a frame plate disposed in each through hole of the frame plate and supported by a peripheral portion of the through hole. A plurality of elastic anisotropic conductive films, each of the elastic anisotropic conductive films is arranged in a thickness direction corresponding to an electrode to be inspected of an integrated circuit on a wafer to be inspected. Building conductive parts for connection, and a function portion made of an insulating part formed around the conductive parts for connection,
A thickness is formed integrally with the periphery of the functional portion, and is a supported portion fixed to a peripheral portion of the through hole in the frame plate. The supported portion has a thickness connected to ground via the frame plate. It is characterized in that a charge eliminating conductive portion having conductivity in the direction is formed.

In the anisotropically conductive connector of the present invention, the connection conductive portion and the static elimination conductive portion in the elastic anisotropic conductive film each contain magnetically conductive particles oriented in the thickness direction. Is preferred. Also,
The functional part in the elastic anisotropic conductive film may have a plurality of connecting conductive parts mutually insulated by an insulating part.

Further, in the anisotropic conductive connector of the present invention, it is preferable that the frame plate is made of metal. Further, in the frame plate, it is preferable that at least a peripheral portion of the through hole shows magnetism.
In such an anisotropic conductive connector, the saturation magnetization of the peripheral portion of the through hole in the frame plate is not more than 0.1.
It is preferably at least 1 wb / m ² . Preferably, the frame plate is made of a magnetic material. Further, in the anisotropic conductive connector of the present invention,
Preferably, the linear thermal expansion coefficient of the frame plate is 3 × 10 ⁻⁵ / K or less.

A probe member according to the present invention is a probe member used for electrical inspection of a circuit device, comprising the above-described anisotropic conductive connector, wherein the anisotropic conductive connector is a circuit to be inspected. The device is characterized by having an elastic anisotropic conductive film in which a conductive portion for connection is formed in accordance with a pattern corresponding to a pattern of an electrode to be inspected of the device.

In the probe member of the present invention, a circuit board for inspection on which a test electrode is formed on the surface in accordance with a pattern corresponding to the pattern of the electrode to be inspected, The connector comprises a sheet-like connector disposed on the surface of the anisotropic conductive connector. The sheet-like connector extends through the insulating sheet and the insulating sheet in the thickness direction thereof, and It is preferable to include a plurality of electrode structures arranged according to a pattern corresponding to the pattern of the inspection electrode.

According to a second aspect of the present invention, there is provided an electrical inspection apparatus for a circuit device, comprising the above-described probe member, wherein electrical connection to an electrode to be inspected of the circuit device to be inspected is achieved via the probe member. It is characterized by.

The electrical inspection apparatus for a circuit device according to the present invention has heating means for heating the circuit device to be inspected, and the heating device heats the circuit device to a predetermined temperature. An electrical test of the circuit device may be performed.

The conductive connection structure of the present invention is characterized by being electrically connected by the anisotropic conductive connector described above.

[0020]

According to the anisotropic conductive connector of the present invention, since the conductive portion for static elimination is formed on the supported portion of the elastic anisotropic conductive film, the conductive portion for static elimination is connected to the ground via the frame plate. Static connection, static electricity generated on the surface of the elastic anisotropic conductive film is eliminated through the static elimination conductive part. As a result, the accumulation of charges on the surface of the elastic anisotropic conductive film can be prevented or suppressed, so that the adverse effects of static electricity can be eliminated.

[0021]

Embodiments of the present invention will be described below in detail. [Anisotropically Conductive Connector] FIG. 1 is a plan view showing an example of the anisotropically conductive connector according to the present invention, and FIG. 2 is a plan view showing an enlarged part of the anisotropically conductive connector shown in FIG. ,
3 is an enlarged plan view showing an elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. 1, and FIG. 4 is an enlarged view of the elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. It is an explanatory sectional view shown.

The anisotropic conductive connector shown in FIG. 1 is used, for example, for conducting an electrical inspection of each integrated circuit on a wafer on which a plurality of integrated circuits are formed, in a state of the wafer. As shown in FIG. 2, there is a frame plate 10 in which a plurality of through-holes 11 (shown by broken lines) are formed, each penetrating and extending in the thickness direction. The through-holes 11 of the frame plate 10 are formed corresponding to the pattern of the electrode region where the electrodes to be inspected of the integrated circuit are formed on the wafer to be inspected. In each through hole 11 of the frame plate 10, an elastic anisotropic conductive film 20 having conductivity in the thickness direction is arranged in a state supported by a peripheral portion of the through hole 11 of the frame plate 10. Further, in the frame plate 10 in this example, an elastic anisotropic conductive film 2 is formed in a through hole 11 of the frame plate 10 in a manufacturing method described later.
A hole 15 for venting gas when forming 0 is formed.

The base material of the elastic anisotropic conductive film 20 is made of an elastic polymer material, and as shown in FIG.
, Extending in a direction perpendicular to the plane of the drawing), and an insulating portion 23 formed around each of the connecting conductive portions 22 and insulating each of the connecting conductive portions 22 from each other. And the function unit 21
Are arranged so as to be located in the through holes 11 of the frame plate 10. Around the periphery of this functional part 21, the frame plate 10
The supported portion 25 fixedly supported at the periphery of the through hole 11 is formed integrally and continuously with the functional portion 21. Specifically, the supported portion 25 in this example is formed in a forked shape, and the through-hole 1 in the frame plate 10 is formed.
1 is fixedly supported in a state of being closely contacted so as to grip the peripheral portion of the device 1. As shown in FIG. 4, the connection conductive portion 22 in the functional portion 21 of the elastic anisotropic conductive film 20 contains conductive particles P exhibiting magnetism densely in a state of being aligned in the thickness direction. On the other hand, the insulating portion 23 contains no or almost no conductive particles P. Further, in the illustrated example, on both surfaces of the functional portion 21 of the elastic anisotropic conductive film 20, a projecting portion 24 projecting from the other surface is formed at a position where the connecting conductive portion 22 and its peripheral portion are located. ing.

The supported portion 25 of the elastic anisotropic conductive film 20
Is formed with a static elimination conductive portion 26 that is electrically connected in the thickness direction and is connected to the ground via the frame plate 10. In this example, the supported portion 25 includes the conductive particles P
Are contained in a state oriented so as to be arranged in the thickness direction,
As a result, the entire supported portion 25 is formed as the charge eliminating conductive portion 26.

The thickness of the frame plate 10 depends on the material thereof, but is preferably 30 to 600 μm.
More preferably, it is 40 to 400 μm. This thickness is 3
When the thickness is less than 0 μm, the strength required for using the anisotropic conductive connector cannot be obtained, the durability is likely to be low, and the rigidity is such that the shape of the frame plate 10 is maintained. It cannot be obtained, and the handleability of the anisotropic conductive connector is low. On the other hand, when the thickness exceeds 600 μm, the elastic anisotropic conductive film 20 formed in the through-hole 11 has an excessively large thickness, so that the conductive portion 22 for the connection has good conductivity and an adjacent connection. In some cases, it may be difficult to obtain insulation between the conductive portions 22 for use. The shape and size of the through hole 11 of the frame plate 10 in the plane direction are designed according to the size, pitch and pattern of the electrodes to be inspected of the wafer to be inspected.

The material constituting the base material of the frame plate 10 is not particularly limited as long as the frame plate 10 does not easily deform and has a rigidity enough to maintain its shape stably. , Metal materials, ceramic materials,
Various materials such as a resin material can be used. Specific examples of the metal material constituting the base material of the frame plate 10 include iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminum, gold, platinum,
A metal such as silver or an alloy or alloy steel in which two or more of these are combined is exemplified. Specific examples of the resin material forming the base material of the frame plate 10 include a liquid crystal polymer and a polyimide resin.

In the anisotropic conductive connector of the present invention,
The static elimination conductive portion 26 of the elastic anisotropic conductive film 20 is electrically connected to the ground through the frame plate 10. A conductive layer such as a metal layer, a printed wiring, or the like may be formed on the surface of the device, and the conductive portion for static elimination 26 may be electrically connected to the ground.

The frame plate 10 has at least a peripheral portion of the through-hole 11, that is, a point that the supported portion 25 of the elastic anisotropic conductive film 20 can easily contain the conductive particles P by a method described later. It is preferable that the portion supporting the elastic anisotropic conductive film 20 shows magnetism, specifically, the saturation magnetization thereof is 0.1 wb / m ² or more. In this respect, it is preferable that the entire frame plate 10 be made of a magnetic material. Specific examples of the magnetic material constituting such a frame plate 10 include iron, nickel, cobalt, alloys of these magnetic metals, alloys of these magnetic metals with other metals, and alloy steels.

The material constituting the frame plate 10 is
Has a coefficient of linear thermal expansion of 3 × 10^-Five/ K or less
Preferably, more preferably 2 × 10^-Five~ 1 ×
10 ^-6/ K, particularly preferably 6 × 10^-6~ 1 × 10^-6/
K. Specific examples of such materials include Invar
Such as invar type alloy, elinvar type etc.
Alloy, Super Invar, Kovar, 42 alloy, etc.
Alloy or alloy steel of a conductive metal.

The total thickness of the elastic anisotropic conductive film 20 (the thickness of the connecting conductive portion 22 in the illustrated example) is 50 to 3000 μm.
m, more preferably 70 to 250
0 μm, particularly preferably 100 to 2000 μm.
When the thickness is 50 μm or more, the elastic anisotropic conductive film 20 having sufficient strength can be obtained without fail. On the other hand, if the thickness is 3000 μm or less, the connecting conductive portion 22 having the required conductive characteristics can be reliably obtained. The total height of the protrusions 24 is one of the thickness of the protrusions 24.
0% or more, more preferably 20%
That is all. By forming the protruding portion 24 having such a protruding height, the connecting conductive portion 22 can be formed with a small pressing force.
Is sufficiently compressed, so that good conductivity is reliably obtained. Further, the protrusion height of the protrusion 24 is preferably 100% or less of the shortest width or diameter of the protrusion 24, and more preferably 70% or less. By forming the protruding portion 24 having such a protruding height, the protruding portion 24 does not buckle when pressed,
The desired conductivity is reliably obtained. Further, the thickness of the supported portion 25 (one thickness of the forked portion) is preferably 5 to 600 μm, more preferably 10 to 500 μm,
Particularly preferably, it is 20 to 400 μm. Supported part 25
The conductivity of the static elimination conductive portion 26 in the step (b) may be such that static electricity generated on the surface of the elastic anisotropic conductive film 20 is neutralized. It is sufficient that the volume resistivity is 10 Ω · m or less.

As the elastic polymer material constituting the elastic anisotropic conductive film 20, a heat-resistant polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain such a crosslinked polymer substance, and specific examples thereof include silicone rubber, polybutadiene rubber, natural rubber, and polyisoprene. Rubber, styrene-butadiene copolymer rubber, conjugated diene rubbers such as acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and the like Block copolymer rubbers and their hydrogenated products, chloroprene, urethane rubber,
Polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-
Examples include diene copolymer rubber and soft liquid epoxy rubber. Among them, silicone rubber is preferred in terms of moldability and electrical properties.

As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group. Good. Specifically, dimethylsilicone raw rubber, methylvinylsilicone raw rubber, methylphenylvinylsilicone raw rubber and the like can be mentioned.

Among these, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
A liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, and uses, for example, dimethyldivinylsiloxane as a polymerization terminator and other reaction conditions (for example, , The amount of cyclic siloxane and the amount of polymerization terminator). Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained elastic anisotropic conductive film 20, the molecular weight distribution index (refers to the value of the ratio Mw / Mn of the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn. The same applies hereinafter. ) Is preferably 2 or less.

On the other hand, liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
Further, cyclic siloxane is anionically polymerized in the presence of a catalyst, and dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used as a polymerization terminator, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

Such a hydroxyl group-containing polydimethylsiloxane has a molecular weight Mw of 10,000 to 400.
00 is preferred. From the viewpoint of heat resistance of the obtained elastic anisotropic conductive film 20, those having a molecular weight distribution index of 2 or less are preferable. In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

The polymer substance-forming material may contain a curing catalyst for curing the polymer substance-forming material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as a curing catalyst include azobisisobutyronitrile. Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum-unsaturated group, a complex of vinylsiloxane and platinum, and platinum and 1,3-divinyltetramethyldisiloxane. And a complex of triorganophosphine or phosphite with platinum, acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer substance-forming material, the type of the curing catalyst, and other curing treatment conditions.
It is 3 to 15 parts by weight based on 100 parts by weight of the polymer substance forming material.

The conductive particles P contained in the conductive portion 22 for connection and the conductive portion 26 for static elimination in the elastic anisotropic conductive film 20
From the viewpoint that the conductive particles P can be easily moved in a molding material for forming the elastic anisotropic conductive film 20 by a method described later, it is preferable to use a material exhibiting magnetism. Specific examples of the conductive particles P exhibiting such magnetism include particles of metals exhibiting magnetism such as iron, nickel, and cobalt, particles of alloys thereof, particles containing these metals, and particles containing these metals as cores. Particles obtained by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, and rhodium, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles. And the surface of the core particles is plated with a conductive magnetic material such as nickel or cobalt, or the core particles are coated with both a conductive magnetic material and a metal having good conductivity. Can be Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver. Means for coating the surface of the core particles with the conductive metal is not particularly limited, but may be, for example, electroless plating.

When the conductive particles P are formed by coating the surface of a core particle with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (core (The ratio of the area covered by the conductive metal to the surface area of the particles) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
It is. The amount of the conductive metal coating is 2.5% of the core particles.
To 50% by weight, more preferably 3% by weight.
To 30% by weight, more preferably 3.5 to 25% by weight,
Particularly preferably, it is 4 to 20% by weight. When the conductive metal to be coated is gold, the coating amount is 3% of the core particle.
It is preferably from 30 to 30% by weight, more preferably from 3.5 to 25% by weight, further preferably from 4 to 20% by weight, particularly preferably from 4.5 to 10% by weight. Also,
When the conductive metal to be coated is silver, the coating amount is preferably 3 to 30% by weight of the core particles, more preferably 4 to 25% by weight, and still more preferably 5 to 2% by weight.
It is 3% by weight, particularly preferably 6 to 20% by weight.

The particle diameter of the conductive particles P is 1 to 50.
0 μm, more preferably 2 to 40 μm.
0 μm, more preferably 5 to 300 μm, particularly preferably 10 to 150 μm. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1 to 7, and still more preferably 1 to 7.
5, particularly preferably 1 to 4. By using the conductive particles P satisfying such conditions, the obtained elastic anisotropic conductive film 20 can be easily deformed under pressure.
In addition, a sufficient electrical contact is obtained between the conductive particles P in the conductive portion 26 for static elimination. The shape of the conductive particles P is not particularly limited. However, since the conductive particles P can be easily dispersed in the polymer substance-forming material, they have a spherical shape, a star shape, or a shape in which these are aggregated. It is preferably a lump formed by the secondary particles.

The water content of the conductive particles P is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, and particularly preferably 1% or less. By using the conductive particles P satisfying such conditions, it is possible to prevent or suppress the occurrence of air bubbles in the molding material layer when the molding material layer is cured in the manufacturing method described below.

The conductive particles P whose surfaces have been treated with a coupling agent such as a silane coupling agent can be used as appropriate. When the surface of the conductive particles P is treated with the coupling agent, the adhesiveness between the conductive particles P and the elastic polymer substance is increased, and as a result, the obtained elastic anisotropic conductive film 20 is formed repeatedly. The durability in use is high. The amount of the coupling agent to be used is appropriately selected within a range that does not affect the conductivity of the conductive particles P, but the coverage of the coupling agent on the surface of the conductive particles P (the coupling ratio with respect to the surface area of the conductive core particles). (The ratio of the coating area of the ring agent) is preferably 5% or more, more preferably 7 to 100%, more preferably 10 to 100%, and particularly preferably 20 to 10%.
The amount is 0%.

The content ratio of the conductive particles P in the connecting conductive portion 22 of the functional portion 21 is preferably 10 to 60%, preferably 15 to 50% in volume fraction. If this ratio is less than 10%, the connection conductive portion 22 having a sufficiently low electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive portion 2 for connection is not obtained.
2 tends to be brittle, and the elasticity required for the connection conductive portion 22 may not be obtained in some cases. The supported part 2
The content ratio of the conductive particles P in the conductive portion 26 for static elimination of No. 5 is preferably 5 to 40%, preferably 5 to 30% by volume fraction. When this ratio is less than 5%, it may be difficult to sufficiently remove static electricity generated on the surface of the elastic anisotropic conductive film 20. On the other hand, this ratio is 40
%, The obtained conductive portion for static elimination 22 tends to be brittle, and the required strength as the supported portion 25 may not be obtained in some cases.

The polymer material forming material may contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, and alumina, if necessary. By including such an inorganic filler,
The thixotropic property of the obtained molding material is ensured, the viscosity is increased, and the dispersion stability of the conductive particles P is improved, and the strength of the elastic anisotropic conductive film 20 obtained by the curing treatment is increased. The use amount of such an inorganic filler is not particularly limited, but using an excessively large amount is not preferable because the movement of the conductive particles P due to a magnetic field is greatly inhibited in a manufacturing method described later.

The above anisotropic conductive connector can be manufactured, for example, as follows. First, a frame plate 10 made of a magnetic metal having through-holes 11 formed therein corresponding to the pattern of the electrode region where the electrodes to be inspected of the integrated circuit on the wafer to be inspected is formed. Here, as a method of forming the through holes 11 of the frame plate 10, for example, an etching method or the like can be used.

Next, a molding material for forming an elastic anisotropic conductive film is prepared, in which conductive particles exhibiting magnetism are dispersed in a polymer material forming material which becomes an elastic polymer material by a curing treatment. Then, as shown in FIG. 5, a mold 60 for forming an elastic anisotropic conductive film is prepared. Coating material layer 2 by applying
OA is formed.

Here, the mold 60 will be specifically described. The mold 60 is configured such that an upper mold 61 and a lower mold 65 that is a pair with the mold 61 are arranged to face each other. In the upper die 61, as shown in FIG.
A ferromagnetic layer 63 is formed on the lower surface of the substrate 62 in accordance with a pattern opposite to the arrangement pattern of the connecting conductive portions 22 of the elastic anisotropic conductive film 20 to be formed. Has a non-magnetic layer 64 formed thereon, and the ferromagnetic layer 63 and the non-magnetic layer 64 form a molding surface. In addition, a recess 64 a is formed on the molding surface of the upper die 61, corresponding to the projection 24 of the elastic anisotropic conductive film 20 to be molded. On the other hand, in the lower mold 65, a ferromagnetic layer 67 is formed on the upper surface of the substrate 66 in accordance with the same pattern as the arrangement pattern of the connection conductive portions 22 of the elastic anisotropic conductive film 20 to be formed. A nonmagnetic layer 68 is formed in a portion other than the layer 67, and the ferromagnetic layer 67 and the nonmagnetic layer 68 form a molding surface. Further, on the molding surface of the lower mold 65, the projecting portion 2 of the elastic anisotropic conductive film 20 to be molded is provided.
4, a recess 68a is formed.

The substrates 62 and 66 in each of the upper die 61 and the lower die 65 are preferably made of a ferromagnetic material. Specific examples of such a ferromagnetic material include iron,
Ferromagnetic metals such as iron-nickel alloys, iron-cobalt alloys, nickel, and cobalt are exemplified. These substrates 62, 6
6 preferably has a thickness of 0.1 to 50 mm, has a smooth surface, is chemically degreased, and is mechanically polished.

The materials forming the ferromagnetic layers 63 and 67 in each of the upper mold 61 and the lower mold 65 include:
Iron, iron-nickel alloy, iron-cobalt alloy, nickel,
A ferromagnetic metal such as cobalt can be used. The ferromagnetic layers 63 and 67 preferably have a thickness of 10 μm or more. If this thickness is 10 μm or more,
A magnetic field having a sufficient intensity distribution can be applied to the molding material layer 20A, and as a result, the conductive particles are gathered at a high density in the portion of the molding material layer 20A that is to be the conductive portion 22 for connection. Thus, the connection conductive portion 22 having good conductivity can be obtained.

As a material for forming the nonmagnetic layers 64 and 68 in each of the upper mold 61 and the lower mold 65, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. Since the nonmagnetic layers 64 and 68 can be easily formed by a photolithography technique, a polymer material cured by radiation can be preferably used, and the material is, for example, an acrylic dry film. A photoresist such as a resist, an epoxy-based liquid resist, or a polyimide-based liquid resist can be used.

Next, as shown in FIG.
0A is formed on the molding surface of the lower mold 65 on which the spacer 6 is formed.
9a, the frame plate 10 is aligned and arranged, and a spacer 69b is placed on the frame plate 10.
, The upper mold 61 on which the molding material layer 20A is formed is aligned and arranged, and furthermore, by superimposing them, as shown in FIG. Then, a molding material layer 20A in a desired form (the form of the elastic anisotropic conductive film 20 to be formed) is formed. In this molding material layer 20A, as shown in FIG.
Is contained in a state dispersed throughout the molding material layer 20A.

After that, for example, a pair of electromagnets are arranged on the upper surface of the substrate 62 in the upper die 61 and the lower surface of the substrate 66 in the lower die 65 and actuated, whereby the upper die 6 is activated.
1 and the lower mold 65 have the ferromagnetic layers 63 and 67, so that the ferromagnetic layer 63 of the upper mold 61 and the corresponding lower mold 6
A magnetic field having an intensity larger than that of the peripheral region is formed between the ferromagnetic layer 67 and the fifth ferromagnetic layer 67. As a result, in the molding material layer 20A, the conductive particles P dispersed in the molding material layer 20A are, as shown in FIG. The ferromagnetic layers 65 are aligned so as to be arranged in the thickness direction in a portion to be the connection conductive portion 22 located between the ferromagnetic layer 65 and the ferromagnetic layer 67. on the other hand,
Since the frame plate 10 is made of a magnetic metal, a magnetic field having a higher intensity is formed between each of the upper mold 61 and the lower mold 65 and the frame plate 10, and as a result, the molding material layer 20 </ b> A is located above the frame plate 10. The conductive particles P below and below are oriented so as to line up in the thickness direction above and below the frame plate 10.

Then, in this state, the molding material layer 2
By performing a hardening treatment on 0A, the plurality of connection conductive portions 22 in which the conductive particles P are contained in the elastic polymer material in a state of being aligned in the thickness direction are completely or almost not present. A functional part 21 arranged in a state of being insulated from each other by an insulating part 23 made of a non-polymeric elastic material, and a conductive part formed in an elastic polymer material continuously and integrally formed around the functional part 21 The elastically anisotropic conductive film 20 composed of the supported part 25 on which the conductive part for static elimination 26 containing the conductive particles P is formed is fixed to the peripheral part of the through hole 11 of the frame plate 10. Thus, the anisotropic conductive connector is manufactured.

In the above description, it is preferable that the intensity of the magnetic field applied to the portion serving as the connecting conductive portion 22 in the molding material layer 20A be 0.1 to 2.5 Tesla on average. The curing treatment of the molding material layer 20A is appropriately selected depending on the material used, but is usually performed by a heat treatment. When the molding material layer 20A is cured by heating, a heater may be provided on the electromagnet. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material forming material constituting the molding material layer 20A, the time required for the movement of the conductive particles P, and the like.

According to the anisotropic conductive connector described above, the elastically anisotropic conductive film 20 has the supported portion 25 formed around the periphery of the functional portion 21 having the conductive portion 22 for connection. Since 25 is fixed to the peripheral portion of the through hole 11 of the frame plate 10, it is difficult to deform and is easy to handle. In the electrical connection operation with the target wafer, positioning and holding and fixing with respect to the wafer can be easily performed.

Since the conductive portion 26 for static elimination is formed in the supported portion 25 of the elastic anisotropic conductive film 20,
By electrically connecting the static elimination conductive portion 26 to the ground via the frame plate 10, the elastic anisotropic conductive film 20 is formed.
The static electricity generated on the surface of the substrate is discharged through the discharging portion 26. As a result, the accumulation of electric charges on the surface of the elastic anisotropic conductive film 20 can be prevented or suppressed, so that the adverse effects of static electricity can be eliminated. Specifically, static electricity generated on the surface of the elastic anisotropic conductive film 20 can be removed through the charge removing conductive portion 26 by repeatedly performing the pressing operation and the peeling operation on the wafer to be inspected. As a result, the accumulation of charges on the surface of the elastic anisotropic conductive film 20 can be sufficiently suppressed, and the generation of high potential static electricity can be prevented. Thus, the electrical inspection of the wafer can be performed with high efficiency and high safety. Even if the surface of the elastic anisotropic conductive film 20 is charged with static electricity by repeatedly performing the pressurizing operation and the peeling operation, and the static electricity is discharged, the discharge is generated in the conductive portion 26 for static elimination. Conductive part 2
2 can be eliminated, and the electrical inspection of the wafer can be performed with high security.

Since the expansion of the elastic anisotropic conductive film 20 in the surface direction due to heat is restricted by the frame plate 10, the use of a material having a small linear thermal expansion coefficient as a material of the frame plate 10 allows temperature change. , The good electrical connection to the wafer is stably maintained. Further, the frame plate 10 includes
Since a plurality of through-holes are formed corresponding to the electrode regions where the electrodes to be inspected of the integrated circuit are formed on the wafer to be inspected, the elastic anisotropic conductive film 20 arranged in each of the through-holes 11 A small area is sufficient. Therefore, even when a thermal history is received, since the absolute amount of thermal expansion in each surface direction of the elastic anisotropic conductive film 20 is small, a good electrical connection state is stably maintained even for a large-area wafer. be able to.

FIG. 11 is a plan view showing another example of the anisotropic conductive connector according to the present invention. FIG. 12 is an enlarged view of the elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. It is an explanatory sectional view shown. This anisotropically conductive connector has a frame-shaped frame plate 10 in which a through-hole 11 extending in the thickness direction is formed at the center, and the through-hole 11 of the frame plate 10 has a conductive material in the thickness direction. The elastic anisotropic conductive film 20 having the following structure is disposed in a state where the elastic anisotropic conductive film 20 is supported by the periphery of the through hole 11 of the frame plate 10. The elastic anisotropic conductive film 20 includes a plurality of connection conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. A functional portion 21 is formed around each of the conductive portions 22 for connection and includes an insulating portion 23 that insulates each of the conductive portions 22 for connection from each other. It is arranged to be located in the hole 11. A supported portion 25 fixedly supported on the periphery of the through hole 11 in the frame plate 10 is formed integrally with the peripheral portion of the functional portion 21 so as to be continuous with the functional portion 21. Specifically, the supported portion 25 in this example is
It is formed in a forked shape, and is fixedly supported in a state in which the frame plate 10 is in close contact with the periphery of the through hole 11 in the frame plate 10 so as to be gripped. In the supported portion 25, a plurality of columnar conductive portions for static elimination 26 having conductivity in the thickness direction are formed apart from each other along the peripheral wall of the through hole of the frame plate 10. Frame plate 10 and elastic anisotropic conductive film 2
The material constituting 0 is the same as that of the anisotropic conductive connector shown in FIGS.

Such an anisotropic conductive connector can be manufactured, for example, as follows. First, FIG.
As shown in FIG. 3, a frame plate 10 made of a magnetic metal having a through hole 11 formed therein was prepared.
The composite body 2A is formed in which the insulating elastic polymer film 23A is formed in the through hole 11 of the “0” in a state where the peripheral portion thereof is fixed to the peripheral portion of the through hole 11 of the frame plate 10.
Thereafter, as shown in FIG. 14, the connection conductive portion 22 to be formed is formed on the elastic polymer film 23A in the composite 2A.
In accordance with a pattern corresponding to the pattern of (a), a hole 22H for a conductive part for connection penetrating the elastic polymer film 23A in the thickness direction thereof is formed, and the conductive part 26 for static elimination to be formed is formed.
According to the pattern corresponding to the pattern of FIG.
Is formed in the hole 26H for the conductive portion for static elimination to reach. Here, the connection conductive portion hole 22H and the charge removing conductive portion hole 2
As a method for forming 6H, a laser processing method or the like can be used.

Next, as shown in FIG. 15, a conductive material exhibiting magnetism is formed in a liquid polymer material forming material which becomes an elastic polymer material by curing treatment in the connection conductive hole 22H of the elastic polymer film 23A. The forming material layer 22A is formed by filling the forming material for the connecting conductive portion 22 in which the conductive particles are dispersed, and the charge removing conductive portion holes 26 of the elastic polymer film 23A are formed.
H is filled with a molding material for the static elimination conductive part 26 in which conductive particles exhibiting magnetism are dispersed in a liquid polymer material forming material which becomes an elastic polymer material by curing treatment, and a molding material layer 26A is formed. To form Thus, the molding material layer 2
FIG. 16 shows the composite 2A on which 2A and 26A are formed.
As shown in the figure, a spacer 6 is provided on the upper surface of the complex 2A.
9b, the upper die 61 of the die is aligned and arranged, and a spacer 69a is provided on the lower surface of the composite 2A.
, The lower mold 65 is aligned and arranged.

Thereafter, for example, a pair of electromagnets are arranged on the upper surface of the substrate 62 in the upper die 61 and the lower surface of the substrate 66 in the lower die 65 and actuated to thereby operate the upper die 6.
1 and the lower mold 65 have the ferromagnetic layers 63 and 67, so that the ferromagnetic layer 63 of the upper mold 61 and the corresponding lower mold 6
A magnetic field having an intensity larger than that of the peripheral region is formed between the ferromagnetic layer 67 and the fifth ferromagnetic layer 67. As a result, in the molding material layer 22A, as shown in FIG. 17, the conductive particles P dispersed in the molding material layer 22A become the ferromagnetic layer 63 of the upper mold 61 and the lower mold corresponding thereto. The ferromagnetic layers 65 are aligned so as to be arranged in the thickness direction in a portion to be the connection conductive portion 22 located between the ferromagnetic layer 65 and the ferromagnetic layer 67. on the other hand,
Since the frame plate 10 is made of a magnetic metal, a high-intensity magnetic field is formed between each of the upper die 61 and the lower die 65 and the frame plate 10, and as a result, in the molding material layer 26A, The conductive particles P dispersed in are oriented so as to be arranged in the thickness direction of the molding material layer 26A.

Then, in this state, the molding material layer 2
By curing the 2A and 26A, the plurality of connection conductive portions 22 in which the conductive particles P are contained in the elastic polymer material in a state of being aligned in the thickness direction are formed. A functional part 21 arranged in a state of being insulated from each other by an insulating part 23 made of an elastic material, and a conductive particle P in an elastic polymer material formed continuously and integrally around the functional part 21. The elastically anisotropic conductive film 20 composed of the supported portion 25 on which the plurality of conductive portions 26 for static electricity removal are formed is fixed to the peripheral portion of the through hole 11 of the frame plate 10. Thus, an anisotropic conductive connector is manufactured.

Such an anisotropic conductive connector can be, for example, a printed circuit board such as a single-sided printed circuit board, a double-sided printed circuit board, a multilayer printed circuit board, and a surface-mounted semiconductor integrated circuit such as a semiconductor chip, BGA, or CSP. Can be used as a connector for achieving electrical connection between circuit devices and electronic devices such as liquid crystal display elements, and the electrical devices of the above circuit devices such as printed circuit boards and electronic components. In inspection, it can be used as a connector interposed between the circuit device and the tester to achieve an electrical connection between them.

According to the anisotropic conductive connector described above, the elastically anisotropic conductive film 20 has the supported portion 25 formed around the periphery of the functional portion 21 having the conductive portion 22 for connection. 25 is fixed to the peripheral portion of the through hole 11 of the frame plate 10 so that it is difficult to deform and is easy to handle. Further, for example, by forming a positioning mark (for example, a hole or a cutout) on the frame plate, the connection In the electrical connection work with the circuit device to be performed, the positioning and the holding and fixing with respect to the circuit device can be easily performed.

Since the conductive portion 26 for static elimination is formed in the supported portion 25 of the elastic anisotropic conductive film 20,
By electrically connecting the static elimination conductive portion 26 to the ground via the frame plate 10, the elastic anisotropic conductive film 20 is formed.
The static electricity generated on the surface of the substrate is discharged through the discharging portion 26. As a result, the accumulation of electric charges on the surface of the elastic anisotropic conductive film 20 can be prevented or suppressed, so that the generation of high potential static electricity can be prevented, or the surface is charged with static electricity. As a result, the discharge is generated in the conductive portion for static elimination 26, and thus various adverse effects due to static electricity can be eliminated.

Further, since the expansion in the surface direction due to heat in the elastic anisotropic conductive film 20 is restricted by the frame plate 10, by using a material having a small linear thermal expansion coefficient as the material forming the frame plate 10, the temperature change can be prevented. , The good electrical connection state to the circuit device to be connected is stably maintained.

[Electrical Inspection Apparatus for Circuit Device] FIG.
FIG. 1 is an explanatory cross-sectional view schematically illustrating a configuration of an example of an electrical inspection device for a circuit device according to the present invention. The electrical inspection device of the circuit device includes a plurality of integrated circuits formed on a wafer. This is for performing an electrical inspection of the integrated circuit in a wafer state.

The electrical inspection apparatus of the circuit device shown in FIG. 18 has a probe member 1 for electrically connecting each of the electrodes 7 to be inspected of the wafer 6 to be inspected and the tester.
In the probe member 1, as shown in an enlarged manner in FIG.
Inspection circuit board 3 having a surface (lower surface in the figure) formed
0 on the surface of the circuit board 30 for inspection.
The anisotropic conductive connector 2 having the configuration shown in FIG. 4 is provided such that each of the connection conductive portions 22 in the elastic anisotropic conductive film 20 is in contact with each of the test electrodes 31 of the test circuit board 30, The frame plate 10 of the anisotropic conductive connector 2 is grounded by an appropriate means. On the surface (the lower surface in the figure) of the anisotropic conductive connector 2, the electrode 7 to be inspected of the wafer 6 to be inspected is placed on the insulating sheet 41.
A sheet-like connector 40 in which a plurality of electrode structures 42 are arranged in accordance with a pattern corresponding to the above pattern is formed by connecting each of the electrode structures 42 to the connection conductive portion in the elastic anisotropic conductive film 20 of the anisotropic conductive connector 2. 22 are provided so as to be in contact with each other. A pressure plate 3 for pressing the probe member 1 downward is provided on the back surface (the upper surface in the figure) of the inspection circuit board 30 in the probe member 1, and a wafer to be inspected is provided below the probe member 1. A wafer mounting table 4 on which the wafer 6 is mounted is provided.
Each of the pressure plate 3 and the wafer mounting table 4 is connected to a heater 5.

The sheet-like connector 40 of the probe member 1 will be specifically described. The sheet-like connector 40 has a flexible insulating sheet 41, and the insulating sheet 41 has a thickness equal to the thickness of the insulating sheet 41. An electrode structure 42 made of a plurality of metals extending in the direction is arranged apart from each other in the surface direction of the insulating sheet 41 according to a pattern corresponding to the pattern of the electrode 7 to be inspected on the wafer 6 to be inspected. . Each of the electrode structures 42 includes a protruding front surface electrode portion 43 exposed on the surface (the lower surface in the figure) of the insulating sheet 41 and a plate-shaped back surface electrode portion 44 exposed on the back surface of the insulating sheet 41. The insulating sheets 41 are integrally connected to each other by short-circuit portions 45 extending through the insulating sheet 41 in the thickness direction.

The insulating sheet 41 is not particularly limited as long as it is flexible and has insulating properties. For example, a resin sheet made of a polyimide resin, a liquid crystal polymer, polyester, a fluororesin, or the like, or a knitted fiber. A sheet in which the cloth is impregnated with the above resin can be used. The thickness of the insulating sheet 41 is not particularly limited as long as the insulating sheet 41 is flexible.
It is preferably from 0 to 50 μm, more preferably from 1 to 50 μm.
0 to 25 μm.

The metal constituting the electrode structure 42 includes
Nickel, copper, gold, silver, palladium, iron, and the like can be used, and the electrode structure 42 may be made of an alloy of two or more metals, even if the whole is made of a single metal, or Two or more metals may be laminated. In addition, on the surfaces of the front electrode portion 43 and the back electrode portion 44 in the electrode structure 42, gold, silver, palladium, and the like are used in that oxidation of the electrode portion is prevented and an electrode portion having low contact resistance is obtained. It is preferable that a chemically stable metal film having high conductivity is formed.

The protruding height of the surface electrode portion 43 in the electrode structure 42 is 15 to 50 μm in that a stable electrical connection to the electrode 7 to be inspected on the wafer 6 can be achieved.
And more preferably 15 to 30 μm
It is. The diameter of the surface electrode portion 43 is set according to the size and pitch of the electrodes to be inspected on the wafer 6, and is, for example, 30 to 80 μm, and preferably 30 to 50 μm. The diameter of the back electrode portion 44 in the electrode structure 42 is
As long as the diameter is larger than the diameter of the short-circuit portion 45 and smaller than the arrangement pitch of the electrode structures 42, it is preferably as large as possible. Stable electrical connection to the connection conductive portion 22 in the conductive film 20 can be reliably achieved. In addition, the thickness of the back electrode portion 44 is 2 in that the strength is sufficiently high and excellent repetition durability is obtained.
It is preferably 0 to 50 μm, more preferably 3 to 50 μm.
5 to 50 μm. Short-circuit part 4 in electrode structure 42
The diameter of 5 is 30 to 80 in that a sufficiently high strength is obtained.
μm, more preferably 30 to 50 μm.
μm.

The sheet connector 40 can be manufactured, for example, as follows. That is, a laminated material in which a metal layer is laminated on the insulating sheet 41 is prepared, and for the insulating sheet 41 in this laminated material,
A plurality of through-holes penetrating in the thickness direction of the insulating sheet 41 by laser processing, dry etching processing, or the like,
It is formed according to a pattern corresponding to the pattern of the electrode structure 42 to be formed. Next, by subjecting the laminated material to photolithography and plating, a short-circuit portion 45 integrally connected to the metal layer is formed in the through-hole of the insulating sheet 41 and the surface of the insulating sheet 41 is formed. Then, a projecting surface electrode portion 43 integrally connected to the short-circuit portion 45 is formed. Thereafter, the metal layer in the laminated material is subjected to a photoetching treatment to remove a part of the metal layer, thereby forming the back electrode portion 44 to form the electrode structure 42, thereby obtaining the sheet connector 40. .

In such an electrical inspection apparatus, a wafer 6 to be inspected is mounted on a wafer mounting table 4,
Next, when the probe member 1 is pressed downward by the pressing plate 3, each of the surface electrode portions 43 in the electrode structure 42 of the sheet-like connector 40 is
, And each of the electrodes 7 to be inspected on the wafer 6 is pressed by each of the surface electrode portions 43. In this state, each of the connection conductive portions 22 in the elastic anisotropic conductive film 20 of the anisotropic conductive connector 2 is connected to the inspection electrode 31 of the inspection circuit board 30 and the surface electrode of the electrode structure 42 of the sheet connector 40. The connection portion 43 is compressed by pressure in the thickness direction, whereby a conductive path is formed in the connection conductive portion 22 in the thickness direction. Electrical connection with the test electrode 31 of the circuit board 30 is achieved. Thereafter, the heater 6 heats the wafer 6 to a predetermined temperature via the wafer mounting table 4 and the pressure plate 3, and in this state, performs a required electrical test on each of the plurality of integrated circuits on the wafer 6. Is done.

According to such an electrical inspection apparatus, the probe member 1 having the above-described anisotropic conductive connector 2 is provided to electrically connect the wafer 6 to be inspected with the electrode 7 to be inspected. Since the static electricity removing conductive portion 26 of the elastic anisotropic conductive film 20 of the anisotropic conductive connector 2 is electrically connected to the ground via the frame plate 10, the probe member 1 is applied to the wafer 6. By repeatedly performing the pressure operation and the peeling operation, static electricity generated on the surface of the elastic anisotropic conductive film 20 in the anisotropic conductive connector 2 can be eliminated through the static elimination conductive part 26. As a result, the electric charge is reduced. Accumulation on the surface of the elastic anisotropic conductive film 20 can be sufficiently suppressed, and generation of high potential static electricity can be prevented. Is eliminated, it is possible to perform the electrical inspection of the wafer 6 at a high efficiency, and high safety. Even if the pressing operation and the peeling operation of the probe member 1 are repeatedly performed, even if the surface of the elastic anisotropic conductive film 20 in the anisotropic conductive connector 2 is charged with static electricity, the static electricity is discharged. Discharge is conductive part 2 for static elimination
As a result, the effect of the elastic anisotropic conductive film 20 on the connection conductive part 22, the inspection circuit board 10, the wafer 6 to be inspected, and the like is eliminated, and the electrical inspection of the wafer 6 can be performed with high safety. It can be carried out.

Further, in the anisotropic conductive connector 2, since the expansion in the surface direction due to heat in the elastic anisotropic conductive film 20 is regulated by the frame plate 10, the material constituting the frame plate 10 has a linear thermal expansion coefficient. By using a small one, a good electrical connection state to the wafer 6 is stably maintained even when a thermal history due to a temperature change is received. Further, since a plurality of through-holes are formed in the frame plate 10 of the anisotropic conductive connector 2 in correspondence with the electrode area where the electrode 7 to be inspected of the integrated circuit on the wafer 6 to be inspected is formed. The elastic anisotropic conductive film 20 disposed in each of the through holes may have a small area. Therefore, even when the wafer 6 has a thermal history, since the absolute amount of thermal expansion in each surface direction of the elastic anisotropic conductive film 20 is small, even if the wafer 6 has a large area, it is favorable for the wafer 6. A stable electrical connection state can be maintained.

[Conductive Connection Structure] FIG. 20 is an explanatory sectional view showing the structure of an example of the conductive connection structure according to the present invention. In this conductive connection structure, the circuit board 5
The anisotropic conductive connector 2 having the configuration shown in FIGS. 11 and 12, for example, is disposed on the electrode 5 such that the connection conductive portion 22 of the elastic anisotropic conductive film 20 is located on the electrode 56 of the circuit board 55. The frame plate 10 of the anisotropic conductive connector 2 is grounded by an appropriate means. On the anisotropic conductive connector 2, an electronic component 50 is provided.
The electrode 51 is arranged so as to be located on the connection conductive portion 22 in the elastic anisotropic conductive film 20 of the anisotropic conductive connector 2. Then, the electronic component 50 and the anisotropic conductive connector 2 are connected by the fixing member 52, and the connecting conductive portion 22 of the elastic anisotropic conductive film 20 is connected to the electronic component 50.
The electrode 51 of the electronic component 50 is fixed to the circuit board 55 while being sandwiched between the electrode 51 of the circuit board 55 and the electrode 56 of the circuit board 55. It is electrically connected to the electrode 56 of the substrate 55. Reference numeral 16 denotes a positioning hole formed in the frame plate 10 of the anisotropic conductive connector 2, and 57 denotes a positioning hole formed in the circuit board 55.
The leg of the fixing member 52 is inserted into each of the positioning hole 16 of the zero and the positioning hole 57 of the circuit board 55.

The electronic component 50 is not particularly limited as long as it is a surface-mount type, and various types can be used.
Examples include an active component including a semiconductor device such as a CM (Multi Chip Module), a passive component such as a resistor, a capacitor, and a crystal resonator. As the circuit board 55, a single-sided printed circuit board, a double-sided printed circuit board,
Various structures such as a multilayer printed circuit board can be used. The circuit board 55 may be a flexible board, a rigid board, or a
Any of a rigid substrate may be used.

When a flexible board is used as the circuit board 55, polyimide, polyamide, polyester, polysulfone, or the like can be used as a material forming the flexible board. Circuit board 5
In the case where a rigid substrate is used as 5, the material constituting the rigid substrate includes glass fiber reinforced epoxy resin, glass fiber reinforced phenol resin, glass fiber reinforced polyimide resin, glass fiber reinforced bismaleimide triazine resin, and the like. Composite resin material, silicon dioxide,
A ceramic material such as alumina can be used.

Electrode 51 of electronic component 50 and circuit board 5
Examples of the material of the fifth electrode 56 include gold, silver, copper, nickel, palladium, carbon, aluminum, ITO, and the like. The thickness of the electrode 51 of the electronic component 50 and the thickness of the electrode 56 of the circuit board 55 are 0.1 to 10 respectively.
It is preferably 0 μm. The width of the electrode 51 of the electronic component 50 and the width of the electrode 56 of the circuit board 55 are 1 to 50.
It is preferably 0 μm.

According to the above-described conductive connection structure, the electronic component 50 and the circuit board 55 are electrically connected via the above-described anisotropic conductive connector 2. Since the conductive portion for static elimination 26 in the elastic anisotropic conductive film 20 is electrically connected to ground via the frame plate 10, static electricity generated on the surface of the elastic anisotropic conductive film 20 is transferred through the conductive portion for static elimination 26. Static electricity. As a result, it is possible to prevent or suppress the accumulation of electric charges on the surface of the elastic anisotropic conductive film 20, so that the malfunction of the electronic component 50 due to static electricity, the failure of the electronic component 50 or the circuit board 55 due to the discharge of static electricity, etc. Adverse effects can be eliminated.

[Other Embodiments] The present invention is not limited to the above embodiment, and various modifications can be made. For example, in an anisotropically conductive connector, the protrusion 24 in the elastic anisotropically conductive film 20 is not essential, and may have a flat surface on one or both surfaces, or may have a recess. Further, when the frame plate 10 has a plurality of through holes 11, a part or all of the elastic anisotropic conductive film 20 disposed in the through holes 11 has one connection conductive part 22. It may be something. In the case of using a non-magnetic material as the base material of the frame plate 10 in the manufacture of the anisotropic conductive connector, the conductive portion 2 for static elimination in the molding material layer 20A is used.
As a method of applying a magnetic field to the portion which becomes 6, means for applying a magnetic field by plating a magnetic material on the periphery of the through hole 11 of the frame plate 10 or applying a magnetic paint thereto, Means for forming a ferromagnetic layer corresponding to the supported portion 25 of the conductive film 20 and applying a magnetic field can be used.

In the electrical inspection apparatus for a circuit device, the circuit device to be inspected is not limited to a wafer on which an integrated circuit is formed, but may be a single-sided printed circuit board, a double-sided printed circuit board, a multilayer printed circuit board, or the like. The present invention can also be applied to an electrical inspection device for printed circuit boards, semiconductor chips, BGAs, CSPs, and other surface-mounted electronic components. Further, the sheet-like connector 40 is not essential, and may have a configuration in which the anisotropically conductive film 20 in the anisotropically conductive connector 2 comes into contact with a circuit device to be inspected to achieve electrical connection.

[0083]

EXAMPLES Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.

Example 1 A mold for forming a frame plate and an anisotropic conductive film was prepared according to the following conditions. [Frame plate (10)] Material: Kovar (saturation magnetization 1.
4 wb / m ² ), thickness: 0.4 mm, dimensions of through hole (11): 16 mm × 16 mm [die (60)] Substrate (62, 66): material; iron, thickness: 6 mm, ferromagnetic layer ( 63, 67): material; nickel, dimensions; diameter 1 m
m (circle), thickness 0.1 mm, arrangement pitch (center-to-center distance); 2 mm, number of ferromagnetic layers: 64 (8 × 8)
), Non-magnetic layer (64, 68): material; hardened dry film resist, dimensions of recesses (64a, 68a); diameter 1.1 mm (circle), depth 0.4 mm, recess 0.5 mm (thickness of recessed part: 0.1 mm) at portions other than (64a, 68a)

To 100 parts by weight of the addition type liquid silicone rubber, 100 parts by weight of conductive particles having an average particle diameter of 20 μm are added and mixed, and then subjected to defoaming treatment under reduced pressure to form an elastic anisotropic conductive film. A molding material for use was prepared. Above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used. On the surface of the upper mold (61) and the lower mold (65) of the mold (60),
By applying the prepared molding material by screen printing, a molding material layer (20A) is formed.
The above-mentioned frame plate (10) is positioned and overlapped on the molding surface of 5) via a lower mold-side spacer (69a) made of SUS304 having a thickness of 0.4 mm. SUS30 with a thickness of 0.4mm on top
The upper mold (61) was positioned and overlapped via the upper mold side spacer (69b) made of No.4. And the upper mold (6
1T and a molding material layer (20A) formed between the lower mold (65), a magnetic field of 2T acts in a thickness direction by an electromagnet on a portion located between the ferromagnetic layers (63, 67). By performing the curing treatment at 100 ° C. for 1 hour while performing the process, the width and height of the connection conductive portion (22) are 2.0 mm and the pitch of the connection conductive portion (22) is 22 mm, respectively. An elastic anisotropic conductive film (20) having a thickness of 2 mm, a thickness of the insulating portion (23) of 1.2 mm, and a thickness of the supported portion (25) (one thickness of the forked portion) of 0.4 mm is formed. An anisotropic conductive connector was manufactured.

The content ratio of the conductive particles in the conductive portion (22) for connection and the supported portion (25) in the elastic anisotropic conductive film (20) of the obtained anisotropic conductive connector was examined. In proportion, the conductive portion for connection (22) was 30% and the supported portion (25) was 10%. The supported portion (2
In a state where 5) was compressed by 3% in the thickness direction, the volume resistivity of the supported portion (25) in the thickness direction was measured and found to be 3 × 10 ⁻¹ Ω · m. The whole was a conductive part for static elimination (26).

Comparative Example 1 An anisotropic conductive connector was manufactured in the same manner as in Example 1, except that the material of the frame plate (10) was changed to SUS304 (saturation magnetization: 0.01 wb / m ² ). When the supported portion (25) of the elastic anisotropic conductive film (20) of the obtained anisotropically conductive connector was observed, it was confirmed that almost no conductive particles were present. In addition, the supported portion (25) is moved three times in the thickness direction.
%, The volume resistivity of the supported portion (26) in the thickness direction was measured to be 8 × 10 ⁵ Ω ·
m.

Comparative Example 2 The procedure of Example 1 was repeated, except that the amount of the conductive particles was changed from 100 parts by weight to 35 parts by weight in the preparation of the molding material for forming the elastic anisotropic conductive film. An anisotropic conductive connector was manufactured. When the content ratio of the conductive particles in the supported portion (25) in the elastic anisotropic conductive film (20) of the obtained anisotropic conductive connector was examined, it was 3.5% by volume. In a state where the supported portion (25) is compressed by 3% in the thickness direction,
When the volume resistivity in the thickness direction of the supported portion (26) was measured, it was 3 × 10 ² Ω · m, and the supported portion (25) did not have a conductive portion for static elimination. Was.

[Evaluation of Anisotropic Conductive Connector] Example 1
The performance of each of the anisotropic conductive connectors according to Comparative Examples 1 and 2 was evaluated as follows. Two electrode plates having electrodes formed according to a pattern corresponding to the conductive portion for connection in the elastic anisotropic conductive film of the anisotropic conductive connector are prepared, and the anisotropic conductive connector is placed on one of the electrode plates. Each conductive part of the conductive film is fixed in an aligned state so as to be positioned on the electrode of the electrode plate. On the anisotropic conductive connector, the other electrode plate is connected to the anisotropic conductive connector. The connector was fixed in a state where it was positioned so as to be located on the conductive portion of the elastic anisotropic conductive film of the connector. And a temperature of 25 ° C. and a relative humidity of 30%
In the above environment, the other electrode plate presses the elastic anisotropic conductive film of the anisotropic conductive connector so that the thickness of the connection conductive portion becomes 25% in the thickness direction, and is maintained in this state for 1 second. Then, the other electrode plate was separated from the elastic anisotropic conductive film of the anisotropic conductive connector, and after 2 seconds, the other electrode plate pressed the elastic anisotropic conductive film of the anisotropic conductive connector. This operation is regarded as one cycle and a total of 50
After performing the 00 cycle, the surface potential of the elastic anisotropic conductive film of the anisotropic conductive connector was measured within 40 seconds. In the above, the measurement of the surface potential was performed using the surface potential measurement device “Model 520” manufactured by Trek Japan, and as shown in FIG. went. The surface potential is 50 V
In the above case, for example, in the inspection of the circuit device,
There is a possibility that the circuit device under test has an adverse effect such as destruction. The above results are shown in Table 1 below.

[0090]

[Table 1]

As is clear from the results in Table 1, Example 1
According to the anisotropic conductive connector according to the above, the measuring points A to D
In any of the above, the value of the surface potential is less than 50V, and even when used for a long time, accumulation of electric charge on the surface of the elastic anisotropic conductive film is suppressed, and
It was confirmed that the adverse effects of static electricity could be eliminated. On the other hand, in the anisotropic conductive connectors according to Comparative Examples 1 and 2, the value of the surface potential was 50 V or more at any of the measurement points A to D. Electric charge was accumulated on the surface, and the surface was charged with high voltage static electricity.

[0092]

According to the anisotropic conductive connector of the present invention, the elastic anisotropic conductive film has a supported portion formed around the periphery of the functional portion having the connecting conductive portion. Because it is fixed to the periphery of the through hole of the frame plate, it is difficult to deform and easy to handle, and, for example, by forming a positioning mark on the frame plate, in the electrical connection work with the circuit device to be connected, Positioning and holding and fixing with respect to the circuit device can be easily performed. Since the conductive portion for static elimination is formed on the supported portion of the elastic anisotropic conductive film, the conductive portion for static elimination is electrically connected to the ground via the frame plate, so that the elastic anisotropic conductive film is formed. Static electricity generated on the surface of the film is eliminated through the static elimination conductive part. As a result, the accumulation of charges on the surface of the elastic anisotropic conductive film can be prevented or suppressed, so that the adverse effects of static electricity can be eliminated. In addition, since the expansion in the surface direction due to heat in the elastic anisotropic conductive film is regulated by the frame plate, the material having a small linear thermal expansion coefficient as a material forming the frame plate has received a heat history due to a temperature change. Also in this case, a good electrical connection state to the circuit device to be connected is stably maintained.

According to the probe member of the present invention, since the above-described anisotropic conductive connector is provided, the conductive portion for static elimination in the elastic anisotropic conductive film is electrically connected to the ground via the frame plate. Then, the static electricity generated on the surface of the elastic anisotropic conductive film is discharged through the discharging portion. As a result, the accumulation of charges on the surface of the elastic anisotropic conductive film can be prevented or suppressed, so that the adverse effects of static electricity can be eliminated.

According to the circuit device electrical inspection apparatus of the present invention, the probe member having the anisotropic conductive connector is provided to electrically connect the circuit device to be inspected with the electrode to be inspected. Because the conductive portion for static elimination in the elastic anisotropic conductive film is electrically connected to the ground through the frame plate, the pressing operation and the peeling operation of the probe member with respect to the circuit device are repeatedly performed. The static electricity generated on the surface of the elastic anisotropic conductive film in the anisotropic conductive connector can be eliminated through the static elimination conductive part. It is possible to sufficiently suppress the occurrence of static electricity at a high potential, thereby eliminating the adverse effects of static electricity, and providing a circuit with high efficiency and high safety. It is possible to perform the electrical inspection of the location. Even if the pressurizing operation and the peeling operation of the probe member are repeatedly performed, even if the surface of the elastic anisotropic conductive film in the anisotropic conductive connector is charged with static electricity and the static electricity is discharged, the discharge is removed. As a result generated in the conductive portion for use, the influence of the elastic anisotropic conductive film on the conductive portion for connection and the circuit device to be inspected is eliminated, and the electrical inspection of the circuit device can be performed with high safety.

According to the conductive connection structure of the present invention, since the conductive connection structure is electrically connected through the anisotropic conductive connector, the conductive portion for static elimination in the elastic anisotropic conductive film is connected via the frame plate. By being electrically connected to the ground, the static electricity generated on the surface of the elastic anisotropic conductive film is discharged through the charge eliminating conductive portion, and as a result, electric charges are accumulated on the surface of the elastic anisotropic conductive film. Since it can be prevented or suppressed, an adverse effect due to static electricity can be eliminated.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of an anisotropic conductive connector according to the present invention.

FIG. 2 is an enlarged plan view showing a part of the anisotropic conductive connector shown in FIG. 1;

FIG. 3 is an enlarged plan view showing an elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. 1;

FIG. 4 is an enlarged sectional view illustrating an elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. 1;

FIG. 5 is an explanatory cross-sectional view showing a state in which a molding material is applied to a mold for molding an elastic anisotropic conductive film to form a molding material layer.

FIG. 6 is an explanatory cross-sectional view showing a part of a mold for elastic anisotropic conductive molding in an enlarged manner.

7 is an explanatory cross-sectional view showing a state in which a frame plate is arranged via a spacer between an upper mold and a lower mold of the mold shown in FIG. 5;

FIG. 8 is an explanatory sectional view showing a state in which a molding material layer of a desired form is formed between an upper mold and a lower mold of a mold.

9 is an explanatory cross-sectional view showing the molding material layer shown in FIG. 8 in an enlarged manner.

10 is an explanatory sectional view showing a state in which a magnetic field having an intensity distribution in a thickness direction of the molding material layer shown in FIG. 9 is formed.

FIG. 11 is a plan view showing another example of the anisotropic conductive connector according to the present invention.

FIG. 12 is an enlarged sectional view illustrating an elastic anisotropic conductive film in the anisotropic conductive connector shown in FIG. 11;

FIG. 13 is an explanatory cross-sectional view showing a composite in which an insulating elastic polymer film is formed in a through hole of a frame plate with its peripheral portion fixed to the periphery of the through hole of the frame plate. FIG.

FIG. 14 is an explanatory cross-sectional view showing a state in which a hole for a conductive part for connection and a hole for a conductive part for static elimination are formed in the elastic polymer film in the composite.

FIG. 15 is an explanatory cross-sectional view showing a state in which a molding material layer is formed in the conductive hole for connection and the conductive hole for static elimination in the elastic polymer film.

FIG. 16 is an explanatory cross-sectional view showing a state where an upper mold and a lower mold are arranged on an upper surface and a lower surface of a composite, respectively.

FIG. 17 is an explanatory cross-sectional view showing a state where a magnetic field is formed on a molding material layer in a thickness direction thereof.

FIG. 18 is an explanatory cross-sectional view illustrating a configuration of an example of an electrical inspection device for a circuit device according to the present invention.

FIG. 19 is an explanatory cross-sectional view showing a configuration of a main part of an example of the probe member according to the present invention.

FIG. 20 is an explanatory cross-sectional view showing a configuration of an example of a conductive connection structure according to the present invention.

FIG. 21 is an explanatory diagram showing measurement points of a surface potential in an anisotropic conductive connector in an example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Probe member 2 Anisotropic conductive connector 2A composite 3 Pressing plate 4 Wafer mounting table 5 Heater 6 Wafer 7 Electrode to be inspected 10 Frame plate 11 Through hole 15 Hole 16 Positioning hole 20 Elastic anisotropic conductive film 20A Molding material layer DESCRIPTION OF SYMBOLS 21 Functional part 22 Connection conductive part 22A Molding material layer 22H Connection conductive part hole 23 Insulating part 23A Elastic polymer film 24 Projection part 25 Supported part 26 Static electricity removing conductive part 26A Molding material layer 26H Static electricity removing conductive part hole DESCRIPTION OF SYMBOLS 30 Inspection circuit board 31 Inspection electrode 41 Insulating sheet 40 Sheet connector 42 Electrode structure 43 Front electrode part 44 Back electrode part 45 Short circuit part 50 Electronic component 51 Electrode 52 Fixing member 55 Circuit board 56 Electrode 57 Positioning hole 60 Gold Mold 61 Upper mold 62 Substrate 63 Ferromagnetic layer 64 Non-magnetic layer 64a Recess 65 Lower mold 6 Substrate 67 ferromagnetic substance layers 68 non-magnetic layer 68a recesses 69a, 69b spacer

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AA10 AG07 AG12 AH05 AH09 2G011 AB06 AB08 AC06 AC14 AC33 AE03 AF04 4M106 AA01 BA01 DD09 5E023 AA04 AA05 AA16 AA26 BB01 BB22 BB29 CC02 DD03 DD26 EE18EE

Claims (15)

[Claims] 1. A frame plate having a through-hole extending in a thickness direction thereof, and an elastic anisotropic conductive film disposed in the through-hole of the frame plate and supported on a peripheral portion of the through-hole. The elastic anisotropic conductive film is formed integrally with a connecting conductive portion extending in the thickness direction and a functional portion including an insulating portion formed around the connecting conductive portion, and is formed integrally with a peripheral edge of the functional portion. A conductive portion for static elimination, which is conductive in the thickness direction and is connected to the ground via the frame plate, is formed on the supported portion fixed to the periphery of the through hole. An anisotropically conductive connector, characterized in that: 2. The anisotropically conductive connector according to claim 1, wherein the frame plate has a plurality of through holes, and an elastic anisotropic conductive film is disposed in each of the through holes. 3. An anisotropically conductive connector used for conducting an electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer, wherein the anisotropically conductive connector is provided on a wafer to be inspected. A frame plate having a plurality of through-holes extending in the thickness direction corresponding to the electrode regions where the electrodes to be inspected of the integrated circuit are formed; and a frame plate disposed in each through-hole of the frame plate, and a periphery of the through-hole. A plurality of elastic anisotropic conductive films supported by the portion, each of the elastic anisotropic conductive films having a connection extending in a thickness direction arranged corresponding to an electrode to be inspected of an integrated circuit on a wafer to be inspected. A functional portion comprising a conductive portion for connection and an insulating portion formed around the conductive portion for connection; and a cover formed integrally with the periphery of the functional portion and fixed to a peripheral portion of a through hole in the frame plate. An anisotropic conductive connector, wherein the supported portion is formed with a conductive portion for static elimination in the thickness direction which is connected to the ground via the frame plate and has conductivity in the thickness direction. . 4. The conductive part for connection and the conductive part for static elimination in the elastic anisotropic conductive film each contain conductive particles exhibiting magnetism oriented in the thickness direction. The anisotropic conductive connector according to claim 3. 5. The anisotropic conductive film according to claim 1, wherein the functional portion in the elastic anisotropic conductive film has a plurality of connecting conductive portions mutually insulated by an insulating portion. One side conductive connector. 6. The anisotropic conductive connector according to claim 1, wherein the frame plate is made of metal. 7. The anisotropically conductive connector according to claim 1, wherein at least a peripheral portion of the through hole of the frame plate shows magnetism. 8. The peripheral portion of the through hole in the frame plate,
Anisotropically conductive connector according to claim 7 in which the saturation magnetization is equal to or is least 0.1 Wb / m ² or more. 9. The anisotropically conductive connector according to claim 7, wherein the frame plate is made of a magnetic material. 10. The frame plate has a linear thermal expansion coefficient of 3 × 10.
^The anisotropic conductive connector according to any one of claims 1 to 9, wherein the value is ^-5 / K or less. 11. A probe member used for electrical inspection of a circuit device, comprising: the anisotropic conductive connector according to claim 1; wherein the anisotropic conductive connector is A probe member comprising an elastic anisotropic conductive film in which a conductive portion for connection is formed in accordance with a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected. 12. An inspection circuit board on which inspection electrodes are formed on the surface in accordance with a pattern corresponding to the pattern of the electrode to be inspected, an anisotropic conductive connector arranged on the surface of the inspection circuit board, and an anisotropic conductive connector. A sheet-like connector disposed on a surface of the conductive connector, wherein the sheet-like connector extends through an insulating sheet and the insulating sheet in a thickness direction thereof, and corresponds to a pattern of an electrode to be inspected. 12. The probe member according to claim 11, comprising a plurality of electrode structures arranged according to a pattern. 13. A probe member according to claim 11, wherein electrical connection to an electrode to be inspected of a circuit device to be inspected is achieved via the probe member. Electrical inspection equipment for circuit devices. 14. An electric inspection of a circuit device to be inspected, the heating device heating a circuit device to be inspected, and the circuit device is heated to a predetermined temperature by the heating device. The electrical inspection apparatus for a circuit device according to claim 13, wherein: 15. A conductive connection structure which is electrically connected by the anisotropic conductive connector according to claim 1, 2 or 4 to 10.