JP2004335450A - Anisotropic conductive connector and electric inspection device for circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive connector and an electric inspection device for a circuit device equipped with the same capable of performing expected electrical inspection even for a circuit device having a clock frequency of, for example, 1 GHz or higher. <P>SOLUTION: The anisotropy conductive connector is equipped with a plurality of connecting conductive parts extending in a thickness direction arranged according to a pattern corresponding to the electrodes to be connected, and an elastic anisotropic conductive membrane having an insulating part for insulating the connecting conductive parts from each other. High frequency shielding conductive parts extending in the thickness direction are formed on the elastic anisotropy conductive membrane. The electric inspection device for the circuit device is equipped with the anisotropy conductive connector. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an anisotropically conductive connector and an electrical inspection device for a circuit device provided with the anisotropically conductive connector, and more particularly to a device suitably used for electrical inspection of a circuit device having a clock frequency of 1 GHz or more. The present invention relates to an anisotropic conductive connector and an electrical inspection device for a circuit device.

The anisotropic conductive elastomer sheet is one having conductivity only in the thickness direction or having a pressurized conductive portion which is conductive only in the thickness direction when pressed in the thickness direction. As the electroconductive elastomer sheet, those having various structures are conventionally known.
For example, as an anisotropic conductive elastomer exhibiting conductivity only in the thickness direction in a non-pressurized state, in a sheet substrate made of insulating rubber, conductive fibers are arranged in a state of being oriented to extend in the thickness direction. There has been known a conductive rubber and a rubber in which conductive rubber containing carbon black or metal powder and insulating rubber are alternately laminated in the plane direction (for example, see Patent Document 1).
On the other hand, an anisotropic conductive elastomer sheet that exhibits conductivity only in the thickness direction when pressed in the thickness direction is obtained by uniformly dispersing metal particles in an elastomer (for example, see Patent Document 2). By dispersing conductive magnetic particles unevenly in an elastomer, a large number of conductive portions extending in the thickness direction and insulating portions that insulate them from each other are formed (for example, see Patent Document 3). ), And those in which a step is formed between the surface of the conductive portion and the insulating portion (for example, see Patent Document 4).

  Such an anisotropic conductive elastomer sheet is capable of achieving a compact electrical connection without using means such as soldering or mechanical fitting, and absorbs mechanical shock and strain. Since it has features such as being capable of soft connection, circuit devices such as printed circuit boards are used in the fields of, for example, electronic calculators, electronic digital watches, electronic cameras, and computer keyboards by utilizing such features. It is widely used as a connector for achieving an electrical connection between the device and a leadless chip carrier, a liquid crystal panel, or the like.

In the electrical inspection of circuit devices such as packaged ICs, semiconductor integrated circuit devices such as MCMs, wafers on which integrated circuits are formed, and printed circuit boards, electrodes to be inspected formed on one surface of the circuit device to be inspected In addition, an anisotropic conductive elastomer sheet is used as a connector for achieving electrical connection with the test electrode formed on the surface of the test circuit board.
In the electrical inspection of this circuit device, a DC characteristic test for measuring power supply current, input / output voltage, input / output current, etc. in the circuit device, propagation delay time between input / output terminals in the circuit device, transition time of output waveform, maximum An AC characteristic test for measuring a clock frequency and the like is performed.

2. Description of the Related Art In recent years, with a demand for faster arithmetic processing in electronic devices such as computers, a circuit device such as a CPU mounted on the electronic device has a higher clock frequency. In the electrical inspection of such a circuit device, in order to perform a desired AC characteristic test without causing a malfunction, it is important to sufficiently suppress noise with respect to a high-frequency signal.
In the anisotropic conductive elastomer sheet used for the electrical inspection of the circuit device, as means for suppressing noise with respect to a high-frequency signal, the anisotropic conductive elastomer sheet is supported by a conductive frame plate. Has been proposed for connecting to a ground (for example, see Patent Documents 5 and 6).
However, with such means, it is difficult to sufficiently suppress noise with respect to a high-frequency signal when performing an electrical test on a circuit device having a clock frequency of, for example, 1 GHz or more.

JP-A-50-94495 JP-A-51-93393 JP-A-53-147772 JP-A-61-250906 Japanese Patent Application Laid-Open No. 2000-164041 JP 2002-33358 A

The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide an anisotropic device capable of performing an intended electrical test even on a circuit device having a clock frequency of, for example, 1 GHz or more. An object of the present invention is to provide a conductive connector.
A second object of the present invention is to provide an electrical inspection device for a circuit device capable of performing an intended electrical inspection even for a circuit device having a clock frequency of, for example, 1 GHz or more.

The anisotropic conductive connector of the present invention is an elastic anisotropic connector having a plurality of connecting conductive portions arranged in a pattern corresponding to an electrode to be connected and extending in a thickness direction and an insulating portion for insulating these connecting conductive portions from each other. In an anisotropic conductive connector comprising a conductive film,
The elastic anisotropic conductive film is formed with a high-frequency shield conductive portion extending in the thickness direction.

Further, the anisotropic conductive connector of the present invention has a plurality of connecting conductive portions extending in the thickness direction arranged according to a pattern corresponding to an electrode to be connected, and an insulating portion for insulating these connecting conductive portions from each other. An anisotropic conductive connector comprising an elastic anisotropic conductive film,
The elastic anisotropic conductive film is formed with a high-frequency shielding conductive portion that is arranged so as to surround each connection conductive portion and extends in the thickness direction.

Further, the anisotropic conductive connector of the present invention has a plurality of connecting conductive portions extending in the thickness direction arranged according to a pattern corresponding to an electrode to be connected, and an insulating portion for insulating these connecting conductive portions from each other. An anisotropic conductive connector comprising an elastic anisotropic conductive film,
The elastic anisotropic conductive film is characterized in that a high-frequency shield conductive portion extending in the thickness direction is formed so as to surround a conductive portion group including a plurality of connection conductive portions.

Further, the anisotropic conductive connector of the present invention has a conductive frame plate having a plurality of openings formed according to a pattern corresponding to an electrode to be connected,
A plurality of functional portions including a conductive portion for connection extending in the thickness direction and an insulating portion integrally formed therearound, and a plurality of functional portions formed integrally with the conductive portion for connection arranged around each opening of the frame plate, and integrally formed around these functional portions, An anisotropic conductive connector comprising an elastic anisotropic conductive film formed of a supported portion stacked and fixed on the frame plate,
In the supported portion of the elastic anisotropic conductive film, a high-frequency shielding conductive portion extending in the thickness direction, which is disposed so as to surround the individual connecting conductive portions and is electrically connected to the frame plate, is formed. It is characterized by the following.

Further, the anisotropic conductive connector of the present invention, a conductive frame plate having an opening formed therethrough in the thickness direction,
A functional part having a plurality of connecting conductive parts arranged in an opening of the frame plate and extending in the thickness direction arranged according to a pattern corresponding to an electrode to be connected, and an insulating part for mutually insulating these connecting conductive parts; And an anisotropically conductive connector formed integrally with the periphery of the functional portion and comprising an elastic anisotropic conductive film composed of a supported portion stacked and fixed on the frame plate,
The supported portion of the elastic anisotropic conductive film is disposed so as to surround a conductive portion group including a plurality of conductive portions for connection, and is electrically connected to the frame plate, and is a conductive portion for a high-frequency shield extending in the thickness direction and electrically connected to the frame plate. Is formed.

Further, the anisotropic conductive connector of the present invention has a conductive frame plate having a plurality of openings formed according to a pattern corresponding to an electrode to be connected,
A plurality of functional portions including a conductive portion for connection extending in the thickness direction and an insulating portion integrally formed therearound, and a plurality of functional portions formed integrally with the conductive portion for connection arranged around each opening of the frame plate, and integrally formed around these functional portions, An anisotropic conductive connector comprising an elastic anisotropic conductive film formed of a supported portion stacked and fixed on the frame plate,
The supported portion of the elastic anisotropic conductive film is disposed so as to surround a conductive portion group including a plurality of conductive portions for connection, and is electrically connected to the frame plate, and is a conductive portion for a high-frequency shield extending in the thickness direction and electrically connected to the frame plate. Is formed.

The anisotropic conductive connector according to the present invention has a tubular high-frequency shield conductive portion, and the high-frequency shield conductive portion is concentrically positioned with respect to one connection conductive portion to perform the connection. May be arranged so as to surround the conductive part for use.
Further, it may have a plurality of high-frequency shielding conductive parts surrounding the same connection conductive part. In such an anisotropic conductive connector, adjacent high-frequency shielding conductive parts surrounding the same connection conductive part may be used. It is preferable that the separation distance between the shield conductive portions is 1/10 or less of the wavelength of the measurement signal.

  In the anisotropic conductive connector of the present invention, the elastic anisotropic conductive film has one or more non-connection conductive parts in addition to the connection conductive parts, and the high-frequency shield conductive part has a plurality of conductive parts. It may be arranged so as to surround a conductive part group including a conductive part for connection and one or more conductive parts for non-connection.

The anisotropic conductive connector of the present invention has a cylindrical high-frequency shield conductive portion, and the high-frequency shield conductive portion may be disposed so as to surround a conductive portion group including a plurality of connection conductive portions. Good.
Further, it may have a plurality of high-frequency shielding conductive parts surrounding a conductive part group including a plurality of connection conductive parts, and in such an anisotropic conductive connector, adjacent to each other surrounding the conductive part group. The distance between the high-frequency shield conductive portions is preferably 1/10 or less of the wavelength of the measurement signal.

In the anisotropic conductive connector of the present invention, it is preferable that the high-frequency shielding conductive portion is connected to the ground.
In the case where the high-frequency shielding conductive portion is electrically connected to the frame plate, the frame plate is preferably connected to the ground.

  An electrical inspection device for a circuit device according to the present invention includes any one of the anisotropic conductive connectors described above.

In addition, an electrical inspection apparatus for a circuit device according to the present invention includes an inspection circuit board on which an inspection electrode is formed in accordance with a pattern corresponding to an electrode to be inspected of a circuit device to be inspected, and an inspection circuit board disposed on the inspection circuit board. And the anisotropic conductive connector of any of the above,
An earth electrode connected to earth is formed on the inspection circuit board in accordance with a pattern corresponding to a conductive part for high-frequency shielding in the anisotropic conductive connector.

In addition, an electrical inspection device for a circuit device according to the present invention includes an inspection circuit board on which an inspection electrode is formed according to a pattern corresponding to an electrode to be inspected of a circuit device to be inspected, And an anisotropic conductive connector having the above-mentioned frame plate,
The frame plate of the anisotropic conductive connector is connected to a ground.

According to the anisotropic conductive connector of the present invention, the elastic anisotropic conductive film has a high-frequency shield extending in the same direction as the connection conductive part, in addition to the connection conductive part electrically connected to the connection target electrode. Since the conductive portion is formed, the high-frequency shield conductive portion is connected to the ground, thereby suppressing the external noise or the noise from the adjacent connection conductive portion with respect to the high-frequency signal in each connection conductive portion. can do. Therefore, when the anisotropic conductive connector of the present invention is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the influence of noise on the circuit device is not affected. The intended electrical inspection can be performed without receiving it.
According to the electrical inspection device for a circuit device of the present invention, since the above-described anisotropic conductive connector is provided, by connecting the high-frequency shielding conductive portion of the anisotropic conductive connector to the ground, In each connection conductive portion of the connector, both external noise and high frequency signal noise from the adjacent connection conductive portion can be suppressed. Therefore, even if the clock frequency of the circuit device to be tested is, for example, 1 GHz or more, the intended electrical test can be performed on the circuit device without being affected by noise.

Hereinafter, embodiments of the present invention will be described in detail.
[Anisotropic conductive connector]
FIG. 1 is a plan view showing an anisotropic conductive connector according to a first example of the present invention, and FIG. 2 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the first example. It is sectional drawing.
The anisotropic conductive connector 10 according to the first example has a rectangular frame-shaped frame plate 11 in which a rectangular opening 12 (indicated by a broken line in FIG. 1) is formed in the center, and this frame is provided. In the opening 12 of the plate 11, a rectangular elastic anisotropic conductive film 20 having conductivity in the thickness direction is arranged while being supported by the opening edge of the frame plate 11. Further, positioning holes 13 for positioning with respect to a circuit device to be connected are formed at four corner positions of the frame plate 11 in this example.

The elastic anisotropic conductive film 20 includes a plurality of connection conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. And a plurality of high-frequency shielding conductive portions 26 extending in the thickness direction arranged so as to surround the connecting conductive portion 22, and an insulating portion 23 that insulates each connecting conductive portion 22 and each high-frequency shielding conductive portion 26 from each other. The functional unit 21 is disposed so as to be located in the opening 12 of the frame plate 11.
In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions. Each of the high-frequency shield conductive portions 26 has a cylindrical shape having an inner diameter larger than the diameter of the connection conductive portion 22, and is positioned concentrically with respect to one connection conductive portion 22. It is arranged so as to surround the connection conductive portion 22. In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped.

Although the thickness of the frame plate 11 varies depending on its material, it is preferably 20 to 600 μm, and more preferably 40 to 400 μm.
If the thickness is less than 20 μm, the strength required when using the anisotropic conductive connector 10 cannot be obtained, the durability tends to be low, and the shape of the frame plate 11 is maintained. A degree of rigidity cannot be obtained, and the handleability of the anisotropic conductive connector 10 is low. On the other hand, if the thickness exceeds 600 μm, the elastic anisotropic conductive film 20 disposed in the opening 12 has an excessively large thickness, so that the conductive portion 22 for the connection has good conductivity and good conductivity. It may be difficult to obtain the required insulation between the part 22 and the high-frequency shielding conductive part 26.

The material constituting the frame plate 11 is not particularly limited as long as the frame plate 11 does not easily deform and has such a rigidity that its shape is stably maintained. When the frame plate 11 is made of, for example, a metal material, an insulating coating may be formed on the surface of the frame plate 11.
Specific examples of the metal material constituting the frame plate 11 include metals such as iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminum, gold, platinum, and silver. Alternatively, an alloy or alloy steel in which two or more of these are combined may be used.
Specific examples of the resin material forming the frame plate 11 include a liquid crystal polymer and a polyimide resin.

As the elastic polymer material constituting the elastic anisotropic conductive film 20, a heat-resistant polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain such a crosslinked polymer substance, and specific examples thereof include silicone rubber, polybutadiene rubber, natural rubber, and polyisoprene. Rubber, styrene-butadiene copolymer rubber, conjugated diene rubbers such as acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Block copolymer rubbers and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber, and the like. .
Among these, silicone rubber is preferred in terms of moldability and electrical properties.

As the silicone rubber, one obtained by crosslinking or condensing a liquid silicone rubber is preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group. Good. Specifically, dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber and the like can be mentioned.

Among them, the liquid silicone rubber containing a vinyl group (vinyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane. And a condensation reaction, for example, followed by fractionation by repeated dissolution-precipitation.
The liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, using dimethyldivinylsiloxane as a polymerization terminator, and other reaction conditions. (For example, the amount of the cyclic siloxane and the amount of the polymerization terminator) are appropriately selected. Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.
Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained elastic anisotropic conductive film 20, the molecular weight distribution index (refers to the value of the ratio Mw / Mn of the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn. The same applies hereinafter. ) Is preferably 2 or less.

On the other hand, liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation reaction in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. For example, followed by fractionation by repeated dissolution-precipitation.
Further, the cyclic siloxane is anionically polymerized in the presence of a catalyst, and a polymerization terminator such as dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. The amount can be obtained by appropriately selecting the amount of the agent). Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

Such hydroxyl group-containing polydimethylsiloxane preferably has a molecular weight Mw of 10,000 to 40,000. From the viewpoint of heat resistance of the obtained elastic anisotropic conductive film 20, those having a molecular weight distribution index of 2 or less are preferable.
In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

A curing catalyst for curing the polymer substance forming material can be contained in the polymer substance forming material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used.
Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, ditertiary butyl peroxide, and the like.
Specific examples of the fatty acid azo compound used as a curing catalyst include azobisisobutyronitrile and the like.
Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum-unsaturated group, a complex of vinylsiloxane and platinum, and platinum and 1,3-divinyltetramethyldisiloxane. Known complexes such as a complex of triorganophosphine or phosphite with platinum, an acetylacetate platinum chelate, and a complex of cyclic diene and platinum.
The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer substance-forming material, the type of the curing catalyst, and other curing treatment conditions. 15 parts by weight.

If necessary, ordinary fillers such as silica powder, colloidal silica, airgel silica, and alumina can be contained in the polymer substance forming material. By including such an inorganic filler, the thixotropic property of the obtained molding material is ensured, the viscosity is increased, and the dispersion stability of the conductive particles P is improved, and the molding material is obtained by being subjected to a curing treatment. The strength of the elastic anisotropic conductive film 20 increases.
The use amount of such an inorganic filler is not particularly limited, but using an excessively large amount is not preferable because the movement of the conductive particles P due to a magnetic field is greatly inhibited in a manufacturing method described later.

As shown in FIG. 2, the conductive particles P exhibiting magnetism are aligned in the thickness direction on the connection conductive part 22 and the high-frequency shield conductive part 26 in the functional part 21 of the elastic anisotropic conductive film 20. It is contained densely. On the other hand, the insulating portion 23 contains no or almost no conductive particles P.
As the conductive particles P contained in the connection conductive part 22 and the high-frequency shield conductive part 26, the conductive particles P are used in a molding material for forming the elastic anisotropic conductive film 20 by a method described later. From the viewpoint of easy movement, it is preferable to use a material exhibiting magnetism. Specific examples of the conductive particles P exhibiting such magnetism include particles of metals exhibiting magnetism such as iron, nickel, and cobalt, particles of alloys thereof, particles containing these metals, and particles containing these metals as cores. Particles obtained by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, and rhodium, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles. The surface of the core particle is plated with a conductive magnetic material such as nickel or cobalt, or the core particle is coated with both a conductive magnetic material and a metal having good conductivity. Can be
Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver.
Means for coating the surface of the core particles with the conductive metal is not particularly limited, but may be, for example, electroless plating.

When the conductive particles P are formed by coating the surface of a core particle with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (the surface area of the core particle) Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 2.5 to 50% by weight of the core particles, more preferably 3 to 45% by weight, still more preferably 3.5 to 40% by weight, and particularly preferably 5 to 40% by weight. ３０30% by weight.

The particle size of the conductive particles P is preferably 1 to 500 μm, more preferably 2 to 400 μm, further preferably 5 to 300 μm, and particularly preferably 10 to 150 μm.
The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1 to 7, further preferably 1 to 5, and particularly preferably 1 to 4.
By using the conductive particles P satisfying such a condition, the obtained elastic anisotropic conductive film 20 can be easily deformed under pressure. Sufficient electrical contact is obtained between the conductive particles P.
The shape of the conductive particles P is not particularly limited. However, since the conductive particles P can be easily dispersed in the polymer substance-forming material, they may be spherical, star-shaped, or aggregated. It is preferable that it is a lump composed of secondary particles.

  Further, the water content of the conductive particles P is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, and particularly preferably 1% or less. By using the conductive particles P satisfying such conditions, it is possible to prevent or suppress the occurrence of bubbles in the molding material layer when the molding material layer is cured in the manufacturing method described below.

Further, a material in which the surface of the conductive particles P is treated with a coupling agent such as a silane coupling agent can be appropriately used. When the surface of the conductive particles P is treated with the coupling agent, the adhesiveness between the conductive particles P and the elastic polymer material is increased, and as a result, the obtained elastic anisotropic conductive film 20 is formed repeatedly. The durability in use becomes high.
The amount of the coupling agent to be used is appropriately selected within a range that does not affect the conductivity of the conductive particles P, but the coverage of the coupling agent on the surface of the conductive particles P (the coupling ratio with respect to the surface area of the conductive core particles). (The ratio of the coating area of the ring agent) is preferably 5% or more, more preferably 7 to 100%, further preferably 10 to 100%, and particularly preferably 20 to 100%. Quantity.

It is preferable that the content ratio of the conductive particles P in the connection conductive portion 22 of the functional portion 21 be 10 to 60% by volume, and preferably 15 to 50%. If this ratio is less than 10%, the connection conductive portion 22 having a sufficiently low electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive part 22 for connection tends to be fragile, and the elasticity required for the conductive part 22 for connection may not be obtained.
Further, the content ratio of the conductive particles P in the high-frequency shielding conductive portion 26 is preferably used in a volume fraction of 5 to 60%, preferably 10 to 50%. If this ratio is less than 5%, the high-frequency shielding conductive part 26 tends to be rough and dense, and it may be difficult to form the high-frequency shielding conductive part 26 having a uniform composition. On the other hand, when this ratio exceeds 60%, the conductive particles are likely to remain between the adjacent high-frequency shielding conductive portions 26 and the connecting conductive portions 22 during the production of the anisotropic conductive sheet. Insulation between them tends to be insufficient, and it is difficult to obtain an anisotropic conductive sheet that can be used for electrical inspection of a circuit device having a clock frequency of, for example, 1 GHz or more.

Such an anisotropic conductive connector 10 can be manufactured, for example, as follows.
First, the frame plate 11 in which the opening 12 is formed is manufactured. Here, as a method of forming the opening 12 of the frame plate 11, for example, an etching method or the like can be used.

In addition, a mold for forming the elastic anisotropic conductive film is prepared. FIG. 3 is an explanatory cross-sectional view illustrating a configuration of an example of a mold for forming an elastic anisotropic conductive film. This mold is configured such that an upper mold 30 and a lower mold 35 that is a pair with the upper mold 30 are arranged to face each other.
In the upper die 30, a ferromagnetic layer 32 is formed on the lower surface of the ferromagnetic substrate 31 according to a pattern opposite to the arrangement pattern of the connection conductive portions 22 of the elastic anisotropic conductive film 20 to be formed. The ferromagnetic layer 33 is formed in accordance with a pattern opposite to the arrangement pattern of the high-frequency shield conductive portion 26, and the non-magnetic layer 34 is formed in a region other than the region where the ferromagnetic layers 32 and 33 are formed. Are formed, and the molding surface is formed by the ferromagnetic layers 32 and 33 and the non-magnetic layer 34. Further, each of the ferromagnetic layers 32 and 33 has a thickness smaller than the thickness of the magnetic layer 34, so that the protrusion of the elastic anisotropic conductive film 20 to be molded is formed on the molding surface of the upper mold 30. Recesses 32a, 33a are formed corresponding to 22a, 26a.
On the other hand, in the lower mold 35, the ferromagnetic layer 37 is formed on the upper surface of the ferromagnetic substrate 36 according to the same pattern as the arrangement pattern of the connection conductive portions 22 of the elastic anisotropic conductive film 20 to be formed. A ferromagnetic layer 38 is formed according to the same pattern as the arrangement pattern of the high-frequency shield conductive portions 26, and a non-magnetic layer 39 is formed in a region other than the region where the ferromagnetic layers 37 and 38 are formed. The ferromagnetic layers 37 and 38 and the nonmagnetic layer 39 form a molding surface. Further, each of the ferromagnetic layers 37 and 38 has a thickness smaller than the thickness of the nonmagnetic layer 39, so that the projecting portion of the elastic anisotropic conductive film 20 to be molded is formed on the molding surface of the lower mold 35. Recesses 37a, 38a are formed corresponding to 22a, 26a.

  As the ferromagnetic material constituting the ferromagnetic substrates 31 and 36 in each of the upper mold 30 and the lower mold 35, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt is used. Can be. The ferromagnetic substrates 31 and 36 preferably have a thickness of 0.1 to 50 mm, and have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

  The ferromagnetic material forming the ferromagnetic layers 32, 33, 37, and 38 in each of the upper mold 30 and the lower mold 35 includes iron, an iron-nickel alloy, an iron-cobalt alloy, nickel, and cobalt. Ferromagnetic metals can be used. These ferromagnetic layers 32, 33, 37, and 38 preferably have a thickness of 10 μm or more. When the thickness is 10 μm or more, a magnetic field having a sufficient intensity distribution can be applied to the molding material layer 20A, and as a result, a portion of the molding material layer 20A that should become the connection conductive portion 22 and The conductive particles can be gathered at a high density in a portion to be the high-frequency shield conductive portion 26, and the connection conductive portion 22 and the high-frequency shield conductive portion 26 having good conductivity can be obtained.

  Further, as a material for forming the nonmagnetic layers 34 and 39 in each of the upper mold 30 and the lower mold 35, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. Since the nonmagnetic material layers 34 and 39 can be easily formed by the method described above, a polymer substance cured by radiation can be preferably used. Examples of the material include an acrylic dry film resist and an epoxy resin. A photoresist such as a liquid resist of a system or a liquid resist of a polyimide can be used.

Next, a molding material for molding an elastic anisotropic conductive film is prepared, in which conductive particles exhibiting magnetism are dispersed in a polymer material forming material that becomes an elastic polymer material by a curing treatment.
Then, as shown in FIG. 4, the frame plate 11 is positioned and arranged on the molding surface of the lower mold 35 via the spacer 16, and the upper mold 30 is placed on the frame plate 11 via the spacer 15. Are arranged in alignment with each other to form a molding space between the upper mold 30 and the lower mold 35, and fill the molding space with a molding material to form a molding material layer 20A. In the molding material layer 20A, the conductive particles P are contained in a state of being dispersed throughout the molding material layer 20A.

  After that, for example, a pair of electromagnets are arranged on the upper surface of the ferromagnetic substrate 31 in the upper die 30 and the lower surface of the ferromagnetic substrate 36 in the lower die 35 to operate the upper die 30 and the lower die 35. Because of the presence of the magnetic layers 32, 33, 37, and 38, between the ferromagnetic layer 32 of the upper die 30 and the corresponding ferromagnetic layer 37 of the lower die 35 and the ferromagnetic layer 33 of the upper die 30. A magnetic field having an intensity higher than that of the peripheral region is formed between the ferromagnetic layer 38 of the lower mold 35 and the corresponding ferromagnetic layer 38 of the lower die 35. As a result, in the molding material layer 20A, as shown in FIG. 5, the conductive particles P dispersed in the molding material layer 20A become the ferromagnetic layer 32 of the upper mold 30 and the corresponding lower mold 35 and a portion to be the connecting conductive portion 22 located between the ferromagnetic layer 37 of the upper die 30 and the ferromagnetic layer 38 of the lower die 35 corresponding thereto. The high frequency shield conductive portions 26 are aligned at a portion to be the conductive portion 26 and are aligned in the thickness direction.

  Then, in this state, by curing the molding material layer 20A, the plurality of connection conductive portions 22 in which the conductive particles P are contained in the elastic polymer material in a state of being aligned in the thickness direction, and A functional part in which the high-frequency shielding conductive part 26 surrounding each of the connection conductive parts 22 is insulated from each other by an insulating part 23 made of a polymer elastic material having no or almost no conductive particles P. An elastic anisotropic conductive film 20 comprising an elastic polymer material 21 formed integrally and continuously around the functional portion 21 is provided on the edge of the opening of the frame plate 11. The portion 28 is formed in a fixed state, and the anisotropic conductive connector 10 is manufactured.

In the above, the strength of the magnetic field applied to the portion serving as the conductive portion 22 for connection and the portion serving as the conductive portion 26 for high-frequency shielding in the molding material layer 20A preferably has a magnitude of 0.1 to 2.5 Tesla on average. .
The curing treatment of the molding material layer 20A is appropriately selected depending on the material used, but is usually performed by a heat treatment. When the curing treatment of the molding material layer 20A is performed by heating, a heater may be provided to the electromagnet. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material forming material constituting the molding material layer 20A, the time required for the movement of the conductive particles P, and the like.

  According to the anisotropic conductive connector 10 according to the first example, the functional portion 21 of the elastic anisotropic conductive film 20 includes, in addition to the connection conductive portion 22 electrically connected to the connection target electrode, the connection portion. The high-frequency shielding conductive portion 26 extending in the same direction as the connecting conductive portion 22 is disposed concentrically with respect to each connecting conductive portion 22 so as to surround the connecting conductive portion 22. Therefore, by connecting the high-frequency shield conductive portion 26 to the ground, it is possible to suppress both the external noise and the noise from the adjacent connection conductive portion 22 with respect to the high-frequency signal in each connection conductive portion 22. Can be. Therefore, when the anisotropic conductive connector 10 of the first example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the The intended electrical inspection can be performed without being affected by noise.

FIG. 6 is a plan view illustrating an anisotropic conductive connector according to a second example of the present invention, and FIG. 7 is an explanatory diagram illustrating an enlarged configuration of a main part of the anisotropic conductive connector according to the second example. It is sectional drawing.
The anisotropically conductive connector 10 according to the second example has a frame plate 11 having the same configuration as that of the anisotropically conductive connector 10 according to the first example. An elastic anisotropic conductive film 20 having conductivity in the direction is arranged in a state supported by the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 includes a plurality of connection conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. And a plurality of high-frequency shielding conductive portions 26 extending in the thickness direction arranged so as to surround the connecting conductive portion 22, and an insulating portion 23 that insulates each connecting conductive portion 22 and each high-frequency shielding conductive portion 26 from each other. The functional unit 21 is disposed so as to be located in the opening 12 of the frame plate 11.
In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions. Further, each of the high-frequency shield conductive portions 26 has a columnar shape, and a plurality (eight in the illustrated example) of the high-frequency shield conductive portions 26 are concentric circles having a diameter larger than the diameter of the connection conductive portion 22. (Indicated by a two-dot chain line in FIG. 6) so as to surround the connecting conductive portion 22. In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 7, the conductive particles P exhibiting magnetism are aligned in the thickness direction on the connection conductive part 22 and the high-frequency shield conductive part 26 in the functional part 21 of the elastic anisotropic conductive film 20. It is contained densely. On the other hand, the insulating portion 23 contains no or almost no conductive particles P.

  A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped.

  In such an anisotropic conductive connector 10, it is preferable that the separation distance between the adjacent high-frequency shield conductive portions 26 surrounding the same connection conductive portion 22 is 1/10 or less of the wavelength of the measurement signal. . If the separation distance is excessively large, high-frequency noise is likely to pass between adjacent high-frequency shielding conductive portions 26, so that the shielding effect of the high-frequency shielding conductive portion 26 is reduced, and electrical inspection using high-frequency signals is performed. Can be difficult.

In the anisotropically conductive connector 10 according to the second example, the material of the elastic polymer material constituting the elastic anisotropically conductive film, and the material of the conductive particles P in the connecting conductive part 22 and the high-frequency shielding conductive part 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
Further, the anisotropic conductive connector 10 according to the second example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropic conductive connector 10 according to the second example, the functional portion 21 of the elastic anisotropic conductive film 20 includes the connection conductive portion 22 electrically connected to the connection target electrode and the connection portion. Since the plurality of high-frequency shielding conductive portions 26 extending in the same direction as the connection conductive portion 22 are arranged along the concentric circles of the individual connection conductive portions 22 so as to surround the connection conductive portion 22, By connecting the conductive portion 26 to the ground, both the external noise and the noise from the adjacent connecting conductive portion 22 with respect to the high-frequency signal can be suppressed in each connecting conductive portion 22. Therefore, when the anisotropic conductive connector 10 of the second example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

FIG. 8 is a plan view showing an anisotropic conductive connector according to a third example of the present invention, and FIG. 9 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the third example. It is sectional drawing.
The anisotropic conductive connector 10 according to the third example has a frame plate 11 having the same configuration as the anisotropic conductive connector 10 according to the first example. The elastic anisotropic conductive film 20 having conductivity is disposed in a state supported by the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 includes a plurality of connection conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. One high-frequency shielding conductive portion 26 extending in the thickness direction and disposed so as to surround the conductive portion group 25 including the connecting conductive portion 22, and insulates each connecting conductive portion 22 and the high-frequency shielding conductive portion 26 from each other. It has a functional part 21 composed of an insulating part 23, and this functional part 21 is arranged so as to be located in the opening 12 of the frame plate 11.
In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions. The high-frequency shield conductive portion 26 has a rectangular cylindrical shape, and its cylindrical hole has a size larger than the size of the conductive portion group 25. The conductive portion group 25 is accommodated in the cylindrical hole. It is arranged so as to surround the conductive part group 25. In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 9, the conductive particles P exhibiting magnetism are oriented in the thickness direction in the connection conductive part 22 and the high-frequency shield conductive part 26 in the functional part 21 of the elastic anisotropic conductive film 20. It is contained densely. On the other hand, the insulating portion 23 contains no or almost no conductive particles P.

  A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped.

In the anisotropically conductive connector 10 according to the third example, the material of the elastic polymer material constituting the elastic anisotropically conductive film, and the material of the conductive particles P in the connecting conductive part 22 and the high-frequency shielding conductive part 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
Further, the anisotropic conductive connector 10 according to the third example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropic conductive connector 10 according to the third example, the functional portion 21 of the elastic anisotropic conductive film 20 includes, in addition to the connection conductive portion 22 electrically connected to the connection target electrode, the connection portion. The conductive part group 25 including all the conductive parts 22 for connection is accommodated in the cylindrical hole of the high-frequency shielding conductive part 26 extending in the same direction as the conductive part 22 for connection. Since the high-frequency shield conductive portion 26 is arranged so as to surround the high-frequency shield conductive portion 26, the connection high-frequency shield conductive portion 26 is connected to the ground, so that each connection conductive portion 22 can suppress external noise with respect to a high-frequency signal. Therefore, when the anisotropic conductive connector 10 of the third example is used for an electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the The intended electrical inspection can be performed without being affected by noise.

FIG. 10 is a plan view showing an anisotropic conductive connector according to a fourth example of the present invention, and FIG. 11 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the fourth example. It is sectional drawing.
The anisotropically conductive connector 10 according to the fourth example has a frame plate 11 having the same configuration as the anisotropically conductive connector 10 according to the first example. The elastic anisotropic conductive film 20 having conductivity is disposed in a state supported by the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 includes a plurality of connection conductive portions 22 whose base material is formed of an elastic polymer material and extends in a thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. A plurality of high-frequency shielding conductive portions 26 extending in the thickness direction and arranged so as to surround a conductive portion group 25 (indicated by a dashed line in FIG. 10) including the conductive portions 22 for connection. It has a functional part 21 composed of an insulating part 23 that insulates the shielding conductive parts 26 from each other. The functional part 21 is arranged so as to be located in the opening 12 of the frame plate 11.
In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions. Further, each of the high-frequency shield conductive portions 26 has a columnar shape, and the plurality of high-frequency shield conductive portions 26 are formed along the rectangular side having a size larger than the size of the conductive portion group 25. 25 are arranged. In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 11, the conductive particles P having magnetism are aligned in the thickness direction in the connection conductive part 22 and the high-frequency shield conductive part 26 in the functional part 21 of the elastic anisotropic conductive film 20. It is contained densely. On the other hand, the insulating portion 23 contains no or almost no conductive particles P.

  A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped.

  In such an anisotropic conductive connector 10, it is preferable that the separation distance between adjacent high-frequency shield conductive portions 26 surrounding the conductive portion group 25 is 1/10 or less of the wavelength of the measurement signal. If the separation distance is excessively large, high-frequency noise is likely to pass between adjacent high-frequency shielding conductive portions 26, so that the shielding effect of the high-frequency shielding conductive portion 26 is reduced, and electrical inspection using high-frequency signals is performed. Can be difficult.

In the anisotropic conductive connector 10 according to the fourth example, the material of the elastic polymer material constituting the elastic anisotropic conductive film, and the material of the conductive particles P in the connecting conductive part 22 and the high-frequency shielding conductive part 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
Further, the anisotropic conductive connector 10 according to the fourth example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropic conductive connector 10 according to the fourth example, the functional portion 21 of the elastic anisotropic conductive film 20 includes the connection conductive portion 22 electrically connected to the connection target electrode and the connection portion. Since the plurality of high-frequency shield conductive portions 26 extending in the same direction as the conductive portion 22 for surroundings are arranged so as to surround the conductive portion group 25 including all the conductive portions 22 for connection, the conductive portion 26 for high-frequency shield is grounded. , External noise for high-frequency signals can be suppressed in each connection conductive portion 22. Therefore, when the anisotropic conductive connector 10 of the fourth example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the The intended electrical inspection can be performed without being affected by noise.

FIG. 12 is a plan view showing an anisotropic conductive connector according to a fifth example of the present invention, and FIG. 13 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the fifth example. It is sectional drawing.
The anisotropic conductive connector 10 according to the fifth example has a frame plate 11 having the same configuration as that of the anisotropic conductive connector 10 according to the first example. An elastic anisotropic conductive film 20 having electrical conductivity is disposed in a state of being stacked and supported on the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 has a plurality of connection conductive portions 22 whose base material is made of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. A plurality of non-connection conductive portions 24 formed around a connection conductive portion group (indicated by a two-dot chain line in FIG. 12) including the connection conductive portions 22 of FIG. A plurality of high-frequency shielding conductive portions 26 arranged in a thickness direction so as to surround a conductive portion group 25 (indicated by a dashed line in FIG. 12) including a non-connection conductive portion 24, and each of the connection conductive portions 22 and the high-frequency It has a functional part 21 composed of an insulating part 23 that insulates the shielding conductive part 26 from each other. The functional part 21 is arranged so as to be located in the opening 12 of the frame plate 11.
In this example, each of the connecting conductive part 22 and the non-connecting conductive part 24 has a columnar shape, and these are arranged according to the lattice point positions. Further, each of the high-frequency shield conductive portions 26 has a columnar shape, and the plurality of high-frequency shield conductive portions 26 are formed along the rectangular side having a size larger than the size of the conductive portion group 25. 25 are arranged. In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 13, the conductive particles P exhibiting magnetism are aligned in the thickness direction on the connection conductive part 22 and the high-frequency shield conductive part 26 in the functional part 21 of the elastic anisotropic conductive film 20. It is contained densely. On the other hand, the insulating portion 23 contains no or almost no conductive particles P.

  A supported portion 28 fixed and supported at an opening edge of the frame plate 11 is formed integrally and continuously with the functional portion 21 on the periphery of the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped.

In the anisotropic conductive connector 10 according to the fifth example, the material of the elastic polymer material constituting the elastic anisotropic conductive film, and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26. The same as the anisotropic conductive connector 10 according to the first example described above can be used.
The distance between the adjacent high-frequency shield conductive portions 26 surrounding the conductive portion group 25 is the same as that of the anisotropic conductive connector 10 according to the above-described fourth example.
Further, the anisotropic conductive connector 10 according to the fifth example can be manufactured according to the method for manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropic conductive connector 10 according to the fifth example, the functional portion 21 of the elastic anisotropic conductive film 20 includes the connection conductive portion 22 electrically connected to the connection target electrode and the connection portion. Since the plurality of high-frequency shield conductive portions 26 extending in the same direction as the conductive portion 22 for surroundings are arranged so as to surround the conductive portion group 25 including all the conductive portions 22 for connection, the conductive portion 26 for high-frequency shield is grounded. , External noise for high-frequency signals can be suppressed in each connection conductive portion 22. Therefore, when the anisotropic conductive connector 10 of the fifth example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the The intended electrical inspection can be performed without being affected by noise.

FIG. 14 is a plan view showing an anisotropically conductive connector according to a sixth example of the present invention, and FIG. 15 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropically conductive connector according to the sixth example. It is sectional drawing.
The anisotropic conductive connector 10 according to the sixth example has an overall rectangular frame plate in which a plurality of circular openings 12 (shown by broken lines in FIG. 14) are formed in accordance with a pattern corresponding to a pattern of an electrode to be connected. A rectangular elastic anisotropic conductive film 20 having conductivity in the thickness direction is fixed and supported on the frame plate 11. Further, positioning holes 13 for positioning with respect to a circuit device to be connected are formed at four corner positions of the frame plate 11 in this example.

The elastic anisotropic conductive film 20 has a base made of an elastic polymer material, and has a columnar connecting conductive part 22 extending in the thickness direction, and an insulating part integrally formed around the connecting conductive part 22. 23, and each of these functional units 21 is disposed so as to be located in each opening 12 of the frame plate 11.
On the periphery of each functional part 21, a supported part 28 stacked and fixedly supported on each of both surfaces of the frame plate 11 is formed integrally and continuously with each of the functional parts 21. A plurality of conductive portions 26 for high-frequency shielding are formed on the supported portion 28 and extend in the thickness direction and are electrically connected to the frame plate 11. Each of these high-frequency shield conductive portions 26 has a cylindrical shape having an inner diameter larger than the diameter of the connection conductive portion 22, and is positioned concentrically with respect to one connection conductive portion 22. It is arranged so as to surround the connection conductive portion 22. Further, on both surfaces of the elastic anisotropic conductive film 20, protruding portions 22 a and 26 a protruding from other surfaces are formed at locations where the connecting conductive portion 22 and the high-frequency shielding conductive portion 26 are located. .
As shown in FIG. 15, conductive particles P exhibiting magnetism are arranged in the thickness direction on the conductive part 22 for connection in the functional part 21 of the elastic anisotropic conductive film 20 and the conductive part 26 for high frequency shielding in the supported part 28 as shown in FIG. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

The material constituting the frame plate 11 is not particularly limited as long as the material has conductivity, and the frame plate 11 does not easily deform and has a rigidity enough to maintain its shape stably. However, it is preferable to use a metal material.
Specific examples of the metal material constituting the frame plate 11 include metals such as iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminum, gold, platinum, and silver. Alternatively, an alloy or alloy steel in which two or more of these are combined may be used.

In the anisotropically conductive connector 10 according to the sixth example, the material of the elastic polymer material constituting the elastic anisotropically conductive film, and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26. The same as the anisotropic conductive connector 10 according to the first example described above can be used.
Further, the anisotropic conductive connector 10 according to the sixth example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropically conductive connector 10 according to the sixth example, the elastic anisotropically conductive film 20 has a structure other than the connecting conductive portion 22 disposed in the functional portion 21 and electrically connected to the connection target electrode. In addition, a cylindrical high-frequency shielding conductive portion 26 extending in the same direction as the connection conductive portion 22 is concentrically positioned on each of the connection conductive portions 22 on the supported portion 28 so that the connection Since each of the high-frequency shielding conductive portions 26 is arranged to surround the conductive portion 22 and is electrically connected to the conductive frame plate 11, the frame plate 11 must be connected to ground. Accordingly, in each of the connection conductive portions 22, both external noise and high-frequency signal noise from the adjacent connection conductive portion 22 can be suppressed. Therefore, when the anisotropic conductive connector 10 of the sixth example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

FIG. 16 is a plan view showing an anisotropic conductive connector according to a seventh example of the present invention, and FIG. 17 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the seventh example. It is sectional drawing.
The anisotropically conductive connector 10 according to the seventh example has a frame plate 11 having the same configuration as the anisotropically conductive connector 10 according to the sixth example. Is fixedly supported.

The elastic anisotropic conductive film 20 has a base made of an elastic polymer material, and has a columnar connecting conductive part 22 extending in the thickness direction, and an insulating part integrally formed around the connecting conductive part 22. 23, and each of these functional units 21 is disposed so as to be located in each opening 12 of the frame plate 11.
On the periphery of each functional part 21, a supported part 28 stacked and fixedly supported on each of both surfaces of the frame plate 11 is formed integrally and continuously with each of the functional parts 21. A plurality of conductive portions 26 for high-frequency shielding are formed on the supported portion 28 and extend in the thickness direction and are electrically connected to the frame plate 11. Each of these high-frequency shield conductive portions 26 has a columnar shape, and a plurality of (eight in the illustrated example) high-frequency shield conductive portions 26 are concentric circles having a diameter larger than the diameter of the connection conductive portion 22. (Indicated by a two-dot chain line in FIG. 16) so as to surround the connection conductive portion 22. Further, on both surfaces of the elastic anisotropic conductive film 20, protruding portions 22 a and 26 a protruding from other surfaces are formed at locations where the connecting conductive portion 22 and the high-frequency shielding conductive portion 26 are located. .
As shown in FIG. 17, the conductive particles P exhibiting magnetism are arranged in the thickness direction on the conductive portion 22 for connection in the functional portion 21 of the elastic anisotropic conductive film 20 and the conductive portion 26 for high frequency shielding in the supported portion 28 as shown in FIG. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

In the anisotropic conductive connector 10 according to the seventh example, the material of the elastic polymer material constituting the elastic anisotropic conductive film, and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26. The same as the anisotropic conductive connector 10 according to the first example described above can be used.
The distance between adjacent high-frequency shield conductive portions 26 surrounding the connection conductive portion 25 is the same as that of the anisotropic conductive connector 10 according to the above-described second example.
The anisotropically conductive connector 10 according to the seventh example can be manufactured according to the method for manufacturing the anisotropically conductive connector 10 according to the above-described first example.

  According to the anisotropically conductive connector 10 according to the seventh example, the elastic anisotropically conductive film 20 includes the connecting conductive portion 22 that is disposed in the functional portion 21 and is electrically connected to the connection target electrode. In the supported portion 28, a plurality of high-frequency shielding conductive portions 26 extending in the same direction as the connection conductive portion 22 are arranged so as to surround the connection conductive portions 22 along concentric circles of the individual connection conductive portions 22. Since each of the high-frequency shield conductive portions 26 is electrically connected to the conductive frame plate 11, the connection of each connection conductive portion is performed by connecting the frame plate 11 to ground. At 22, both external noise and high-frequency signal noise from the adjacent connection conductive portion 22 can be suppressed. Therefore, when the anisotropic conductive connector 10 of the seventh example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, the The intended electrical inspection can be performed without being affected by noise.

FIG. 18 is a plan view showing an anisotropic conductive connector according to an eighth example of the present invention, and FIG. 19 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the eighth example. It is sectional drawing.
The anisotropic conductive connector 10 according to the eighth example has a frame plate 11 having the same configuration as that of the anisotropic conductive connector 10 according to the first example. The elastic anisotropic conductive film 20 having conductivity is disposed in a state supported by the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 has a plurality of connecting conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. It has a functional part 21 composed of an insulating part 23 that insulates the connection conductive parts 22 from each other. In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions.
A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped. On the supported portion 28, a high-frequency shielding conductive portion 26 extending in the thickness direction and electrically connected to the frame plate 11 is formed. The high-frequency shield conductive portion 26 in this example has a rectangular cylindrical shape, and its cylindrical hole has a size larger than the size of the opening 12 of the frame plate 11. The conductive part group 25 (indicated by a dashed line in FIG. 18) including the conductive part 22 for connection is housed and arranged so as to surround the conductive part group 25.
In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 19, the conductive particles P exhibiting magnetism are arranged in the thickness direction on the conductive portion 22 for connection in the functional portion 21 of the elastic anisotropic conductive film 20 and the conductive portion 26 for high frequency shielding in the supported portion 28 as shown in FIG. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

In the anisotropic conductive connector 10 according to the eighth example, the material of the elastic polymer material constituting the elastic anisotropic conductive film, and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
The anisotropically conductive connector 10 according to the eighth example can be manufactured according to the method for manufacturing the anisotropically conductive connector 10 according to the above-described first example.

  According to the anisotropically conductive connector 10 according to the eighth example, the elastic anisotropically conductive film 20 includes the connecting conductive portion 22 disposed in the functional portion 21 and electrically connected to the connection target electrode. In the supported part 28, a rectangular cylindrical high-frequency shielding conductive part 26 extending in the same direction as the connecting conductive part 22 is formed, and a conductive part group 25 including all the connecting conductive parts 22 in the cylindrical hole is formed. The high-frequency shield conductive portion 26 is electrically connected to the conductive frame plate 11 so that the frame plate 11 is grounded. , External noise for high-frequency signals can be suppressed in each connection conductive portion 22. Therefore, when the anisotropic conductive connector 10 of the eighth example is used for the electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

FIG. 20 is a plan view showing an anisotropic conductive connector according to a ninth example of the present invention, and FIG. 21 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the ninth example. It is sectional drawing.
The anisotropic conductive connector 10 according to the ninth example has a frame plate 11 having the same configuration as the anisotropic conductive connector 10 according to the first example. The elastic anisotropic conductive film 20 having conductivity is disposed in a state supported by the opening edge of the frame plate 11.

The elastic anisotropic conductive film 20 has a plurality of connecting conductive portions 22 whose base material is formed of an elastic polymer material and extends in the thickness direction arranged according to a pattern corresponding to an electrode pattern of a circuit device to be connected. It has a functional part 21 composed of an insulating part 23 that insulates the connecting conductive part 22 from each other. In this example, each of the connection conductive portions 22 has a columnar shape and is arranged according to the lattice point positions.
A supported portion 28 that is stacked and fixedly supported on the opening edge portion of the frame plate 11 is formed continuously around the periphery of the functional portion 21 integrally with the functional portion 21. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in a state in which it is in close contact with the opening edge of the frame plate 11 so as to be gripped. A plurality of cylindrical high-frequency shield conductive portions 26 extending in the thickness direction and electrically connected to the frame plate 11 are formed on the supported portion 28. Each of the high-frequency shield conductive portions 26 in this example is a conductive portion group 25 (including all connection conductive portions 22 in the functional portion 21) along a rectangular side having a size larger than the size of the opening 12 of the frame plate 11. 20 (indicated by a dashed line in FIG. 20).
In addition, on both surfaces of the functional portion 21 in the elastic anisotropic conductive film 20, projection portions 22a and 26a protruding from the other surface are provided at locations where the connection conductive portion 22 and the high-frequency shield conductive portion 26 are located. Is formed.
As shown in FIG. 21, the conductive particles P exhibiting magnetism are arranged in the thickness direction on the connection conductive part 22 in the functional part 21 of the elastic anisotropic conductive film 20 and the high-frequency shield conductive part 26 in the supported part 28, as shown in FIG. 21. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

In the anisotropic conductive connector 10 according to the ninth example, the material of the elastic polymer material constituting the elastic anisotropic conductive film and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
The distance between the adjacent high-frequency shield conductive portions 26 surrounding the conductive portion group 25 is the same as that of the anisotropic conductive connector 10 according to the above-described fourth example.
Further, the anisotropic conductive connector 10 according to the ninth example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the above-described first example.

  According to the anisotropic conductive connector 10 according to the ninth example, the elastic anisotropic conductive film 20 includes the connecting conductive portion 22 disposed in the functional portion 21 and electrically connected to the connection target electrode. In the supported part 28, a plurality of high-frequency shielding conductive parts 26 extending in the same direction as the connection conductive part 22 are arranged so as to surround the conductive part group 25 including all the connection conductive parts 22. Since each of the high-frequency shield conductive portions 26 is electrically connected to the frame plate 11 having conductivity, by connecting the frame plate 11 to the ground, the high-frequency signal From outside noise can be suppressed. Therefore, when the anisotropic conductive connector 10 of the ninth example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

FIG. 22 is a plan view showing an anisotropic conductive connector according to a tenth example of the present invention, and FIG. 23 is an explanatory diagram showing an enlarged configuration of a main part of the anisotropic conductive connector according to the tenth example. It is sectional drawing.
The anisotropic conductive connector 10 according to the tenth example has a frame plate 11 having the same configuration as that of the anisotropic conductive connector 10 according to the sixth example. Is fixedly supported.

The elastic anisotropic conductive film 20 has a base made of an elastic polymer material, and has a columnar connecting conductive part 22 extending in the thickness direction, and an insulating part integrally formed around the connecting conductive part 22. 23, and each of these functional units 21 is disposed so as to be located in each opening 12 of the frame plate 11.
On the periphery of each functional part 21, a supported part 28 stacked and fixedly supported on each of both surfaces of the frame plate 11 is formed integrally and continuously with each of the functional parts 21. On the supported portion 28, a high-frequency shielding conductive portion 26 extending in the thickness direction and electrically connected to the frame plate 11 is formed. The conductive part 26 for high-frequency shielding in this example has a rectangular cylindrical shape, and its cylindrical hole has the dimensions of a conductive part group 25 (indicated by a dashed line in FIG. 22) including all the conductive parts 22 for connection. It has a larger dimension, and the conductive portion group 25 is accommodated in the cylindrical hole and arranged so as to surround the conductive portion group 25. Further, on both surfaces of the elastic anisotropic conductive film 20, protruding portions 22 a and 26 a protruding from other surfaces are formed at locations where the connecting conductive portion 22 and the high-frequency shielding conductive portion 26 are located. .
As shown in FIG. 23, conductive particles P exhibiting magnetism are arranged in the thickness direction on the conductive part 22 for connection in the functional part 21 of the elastic anisotropic conductive film 20 and the conductive part 26 for high-frequency shielding in the supported part 28 as shown in FIG. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

In the anisotropic conductive connector 10 according to the tenth example, the material of the elastic polymer material forming the elastic anisotropic conductive film and the material of the conductive particles P in the connection conductive portion 22 and the high-frequency shield conductive portion 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
Further, the anisotropic conductive connector 10 according to the tenth example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the first example.

  According to the anisotropic conductive connector 10 according to the tenth example, the elastic anisotropic conductive film 20 includes the connecting conductive portion 22 disposed in the functional portion 21 and electrically connected to the connection target electrode. In the supported part 28, a rectangular cylindrical high-frequency shielding conductive part 26 extending in the same direction as the connecting conductive part 22 is formed, and a conductive part group 25 including all the connecting conductive parts 22 in the cylindrical hole is formed. The high-frequency shield conductive portion 26 is electrically connected to the conductive frame plate 11 so that the frame plate 11 is grounded. , External noise for high-frequency signals can be suppressed in each connection conductive portion 22. Therefore, when the anisotropic conductive connector 10 of the tenth example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

FIG. 24 is a plan view showing an anisotropically conductive connector according to an eleventh example of the present invention, and FIG. It is sectional drawing.
The anisotropic conductive connector 10 according to the eleventh example has a frame plate 11 having the same configuration as the anisotropic conductive connector 10 according to the sixth example. Is fixedly supported.

The elastic anisotropic conductive film 20 has a base made of an elastic polymer material, and has a columnar connecting conductive part 22 extending in the thickness direction, and an insulating part integrally formed around the connecting conductive part 22. 23, and each of these functional units 21 is disposed so as to be located in each opening 12 of the frame plate 11.
On the periphery of each functional part 21, a supported part 28 stacked and fixedly supported on each of both surfaces of the frame plate 11 is formed integrally and continuously with each of the functional parts 21. A plurality of cylindrical high-frequency shield conductive portions 26 extending in the thickness direction and electrically connected to the frame plate 11 are formed on the supported portion 28. Each of the high-frequency shielding conductive portions 26 in this example has a function along a rectangular side having a size larger than the size of the conductive portion group 25 (indicated by a dashed line in FIG. 24) including all the connecting conductive portions 22. It is arranged so as to surround the conductive part group 25 in the part 21.
Further, on both surfaces of the elastic anisotropic conductive film 20, protruding portions 22 a and 26 a protruding from other surfaces are formed at locations where the connecting conductive portion 22 and the high-frequency shielding conductive portion 26 are located. .
As shown in FIG. 25, the conductive particles P exhibiting magnetism are arranged in the thickness direction in the connection conductive part 22 in the functional part 21 of the elastic anisotropic conductive film 20 and the high-frequency shield conductive part 26 in the supported part 28 as shown in FIG. It is densely contained in such an oriented state. On the other hand, portions other than the insulating portion 23 in the functional portion 21 and the conductive portion 26 for the high-frequency shield in the supported portion 28 contain no or almost no conductive particles P.

In the anisotropic conductive connector 10 according to the eleventh example, the material of the elastic polymer material constituting the elastic anisotropic conductive film, and the material of the conductive particles P in the connection conductive part 22 and the high-frequency shield conductive part 26 The same as the anisotropic conductive connector 10 according to the first example described above can be used.
The distance between the adjacent high-frequency shield conductive portions 26 surrounding the conductive portion group 25 is the same as that of the anisotropic conductive connector 10 according to the above-described fourth example.
Further, the anisotropic conductive connector 10 according to the eleventh example can be manufactured according to the method of manufacturing the anisotropic conductive connector 10 according to the first example.

  According to the anisotropic conductive connector 10 according to the eleventh example, the elastic anisotropic conductive film 20 includes the connecting conductive portion 22 disposed in the functional portion 21 and electrically connected to the connection target electrode. In the supported part 28, a plurality of high-frequency shielding conductive parts 26 extending in the same direction as the connection conductive part 22 are arranged so as to surround the conductive part group 25 including all the connection conductive parts 22. Since each of the high-frequency shield conductive portions 26 is electrically connected to the frame plate 11 having conductivity, by connecting the frame plate 11 to the ground, the high-frequency signal From outside noise can be suppressed. Therefore, when the anisotropic conductive connector 10 of the eleventh example is used for electrical inspection of a circuit device, even if the clock frequency of the circuit device to be inspected is, for example, 1 GHz or more, The intended electrical inspection can be performed without being affected by noise.

As described above, the anisotropic conductive connector of the present invention is not limited to the above-described first to eleventh examples, and various modifications can be made.
For example, as shown in FIG. 26, the functional portion 21 in the elastic anisotropic conductive film 20 includes a plurality of connecting conductive portions 22a in addition to the high-frequency shielding conductive portion 26a surrounding each connecting conductive portion 22. 27, a high-frequency shielding conductive portion 26b surrounding the conductive portion group including the conductive portions may be formed. As shown in FIG. The support portion 28 may be formed with a high-frequency shielding conductive portion 26c surrounding a conductive portion group including a plurality of connection conductive portions 22.
Further, as shown in FIG. 28, a plurality of conductive part groups 25 (indicated by dashed lines in the figure) formed apart from each other and including a plurality of connection conductive parts 22 are formed in the functional part 21. In this case, the high-frequency shielding conductive portion 26 may be formed so as to surround all the conductive portion groups 25, and as shown in FIG. 25 may be formed.
Further, the application of the anisotropic conductive connector of the present invention is not limited to electrical inspection of a circuit device, but is also useful as a connector used for mounting an electronic component on a printed wiring board.

[Electrical inspection equipment for circuit devices]
FIG. 30 is an explanatory diagram showing a configuration of a first example of an electrical inspection device for a circuit device according to the present invention. The electrical inspection device of this circuit device has a rectangular inspection circuit board 40 and the anisotropic conductive connector 10 of the first example described above, which is arranged on the surface of the inspection circuit board 40.
A plurality of circular test electrodes 41 are arranged on the surface of the test circuit board 40 in accordance with a pattern corresponding to the pattern of the test electrode 2 of the circuit device 1 to be tested. A plurality of ring-shaped grounding electrodes 42 are arranged according to a pattern corresponding to the pattern of the shield conductive portion 26. Specifically, each of the ground electrodes 42 is disposed concentrically with respect to one inspection electrode 41 so as to surround the inspection electrode 41. The test electrode 41 is electrically connected to a tester (not shown), while the ground electrode 42 is connected to ground. In addition, guide pins 43 extending upward from the surface of the inspection circuit board 40 are provided at each of the four corners on the surface of the inspection circuit board 40.
Then, by inserting the guide pins 43 of the test circuit board 40 into the positioning holes 13 of the frame plate 11 of the anisotropic conductive connector 10, the connection conductive portions 22 of the elastic anisotropic conductive film 20 are connected to the test electrodes 41. The anisotropic conductive connector 10 is arranged and fixed on the surface of the inspection circuit board 40 with the high-frequency shield conductive portion 26 positioned on the ground electrode 42 while being positioned above.

In such an electrical inspection device for a circuit device, the circuit device 1 is arranged on the anisotropic conductive connector 10 such that the electrode 2 to be inspected is located on the conductive portion 22 for connection. By pressing the circuit device 1 downward, each of the connection conductive portions 22 in the anisotropic conductive connector 10 is brought into a state where it is sandwiched between the electrode 2 to be inspected and the electrode 41 for inspection. As a result of the conductive path being formed in the conductive portion 22 in the thickness direction, electrical connection between each of the electrodes 2 to be inspected of the circuit device 1 and each of the inspection electrodes 41 of the inspection circuit board 40 is achieved. Then, a required electrical test for the circuit device 1 is performed.
Here, the circuit device 1 to be inspected includes a packaged IC, a semiconductor integrated circuit device such as an MCM, a wafer on which an integrated circuit is formed, a printed circuit board for forming the semiconductor integrated circuit device, and the semiconductor integrated circuit. There is a printed circuit board for mounting the device.

  According to the electrical inspection device for such a circuit device, the anisotropic conductive connector 10 according to the first example is provided, and each of the high-frequency shielding conductive portions 26 in the anisotropic conductive connector 10 includes: Since the connection conductive portion 22 of the anisotropic conductive connector 10 is connected to the ground via the ground electrode 42 of the inspection circuit board 40, external noise to a high-frequency signal and the adjacent connection conductive portion 22 can be suppressed. Therefore, even if the clock frequency of the circuit device 1 to be inspected is, for example, 1 GHz or more, the intended electrical inspection can be performed on the circuit device 1 without being affected by noise.

FIG. 31 is an explanatory diagram showing the configuration of a second example of the electrical inspection device for a circuit device according to the present invention. The electrical inspection device of this circuit device has a rectangular inspection circuit board 40 and the anisotropic conductive connector 10 of the sixth example described above, which is disposed on the surface of the inspection circuit board 40.
On the surface of the inspection circuit board 40, a plurality of circular inspection electrodes 41 are formed in accordance with a pattern corresponding to the pattern of the electrode 2 to be inspected of the circuit device 1 to be inspected. It is electrically connected to a tester (not shown). Guide pins 43 extending upward from the surface of the inspection circuit board 40 are provided at each of the four corners of the surface of the inspection circuit board 40, and positioning holes of the frame plate 11 in the anisotropic conductive connector 10 are provided. 13, the guide pins 43 of the test circuit board 40 are inserted, so that the connection conductive portions 22 of the elastic anisotropic conductive film 20 are positioned on the test electrodes 41. Are arranged and fixed on the surface of the inspection circuit board 40.
The frame plate 11 of the anisotropic conductive connector 10 is connected to the ground.

  In such an electrical inspection device for a circuit device, the circuit device 1 is arranged on the anisotropic conductive connector 10 such that the electrode 2 to be inspected is located on the conductive portion 22 for connection. By pressing the circuit device 1 downward, each of the connection conductive portions 22 in the anisotropic conductive connector 10 is brought into a state where it is sandwiched between the electrode 2 to be inspected and the electrode 41 for inspection. As a result of the conductive path being formed in the conductive portion 22 in the thickness direction, electrical connection between each of the electrodes 2 to be inspected of the circuit device 1 and each of the inspection electrodes 41 of the inspection circuit board 40 is achieved. Then, a required electrical test for the circuit device 1 is performed. Here, the circuit device 1 to be inspected is the same as the electrical inspection device of the circuit device shown in FIG.

  According to the electrical inspection device for such a circuit device, the anisotropic conductive connector 10 according to the sixth example is provided, and each of the high-frequency shielding conductive portions 26 in the anisotropic conductive connector 10 is: Since the connection conductive portions 22 of the anisotropic conductive connector 10 are connected to the ground via the frame plate 11, both the external noise and the noise from the adjacent connection conductive portions 22 with respect to the high-frequency signal are reduced. Can be suppressed. Therefore, even if the clock frequency of the circuit device 1 to be inspected is, for example, 1 GHz or more, the intended electrical inspection can be performed on the circuit device 1 without being affected by noise.

The electrical inspection device for a circuit device according to the present invention is not limited to the above example, and various changes can be made.
For example, in the electrical inspection apparatus for a circuit device shown in FIG. 30, in place of the anisotropic conductive connector 10 according to the first example, the anisotropic conductive connectors according to the second to fifth examples and FIG. 29. Any of the anisotropic conductive connectors shown in FIGS. In this case, the ground electrode 42 on the inspection circuit board 40 is arranged in accordance with the pattern corresponding to the pattern of the high-frequency shielding conductive part formed on the functional part of the elastic anisotropic conductive film in the anisotropic conductive connector used. do it. When the anisotropic conductive connector shown in FIG. 27 is used, it is preferable to connect the frame plate 11 to ground.
In the electrical inspection of the circuit device shown in FIG. 31, any of the anisotropic conductive connectors according to the seventh to eleventh examples is replaced with the anisotropic conductive connector 10 according to the sixth example. Can be used.
Further, in the electrical inspection apparatus for a circuit device shown in FIG. 30, the anisotropic conductive connector 10 of the sixth example can be used instead of the anisotropic conductive connector 10 of the first example. In such a configuration, as shown in FIG. 32, only the ground electrode 42 of the inspection circuit board 40 may be connected to the ground, but as shown in FIG. Preferably, both 11 are electrically connected to ground.

  Hereinafter, specific examples of the present invention will be described, but the present invention is not limited thereto.

<Example 1>
According to the configuration shown in FIGS. 14 and 15, the anisotropic conductive connector (10) according to the present invention was manufactured under the following conditions.
[Frame plate (11)]
A frame plate having the following specifications was produced.
Material: stainless steel (JIS standard symbol: SUS304), dimensions: 10 mm x 10 mm x 0.1 mm, diameter of opening (12): 500 µm, number of openings (12): 16 (4 x 4), opening ( 12) Arrangement pitch: 1 mm
[Mold for forming elastic anisotropic conductive film]
According to the configuration shown in FIG. 3, a mold for molding an elastic anisotropic conductive film having the following specifications (upper die (30) and lower die (35)) was produced.
Ferromagnetic substrate (31, 36): material; steel material (JIS standard symbol: SS400), thickness: 6 mm,
Ferromagnetic layer (32, 37): material; nickel, diameter: 300 μm, thickness: 50 μm, number: 16 (4 × 4), arrangement pitch: 1 mm,
Ferromagnetic layer (33, 38): material; nickel, inner diameter: 600 μm, outer diameter: 800 μm, thickness: 50 μm, number: 16 (4 × 4), arrangement pitch: 1 mm,
Non-magnetic layer (34, 39): material; cured product of dry film resist, thickness: 100 μm
[Spacers (15, 16)]
Two spacers (15, 16) each made of stainless steel (JIS standard symbol: SUS304), having a thickness of 100 μm, and having an opening of 7.5 mm × 7.5 mm were produced.

[Formation of elastic anisotropic conductive film]
To 100 parts by weight of the addition type liquid silicone rubber, 80 parts by weight of conductive particles having an average particle diameter of 30 μm are added and mixed, and then subjected to defoaming treatment under reduced pressure to form an elastic anisotropic conductive film. Materials were prepared. In the above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 8% of the weight of the core particles) were used.
Next, the prepared molding material is applied by screen printing to each of the molding surfaces of the upper mold (30) and the lower mold (35) in the above mold, and the molding material formed on the molding surface of the lower mold (35). The frame plate (11) is positioned and arranged on the coating layer of (1) via a spacer (16), and the coating layer of a molding material is further placed on the frame plate (11) via a spacer (15). The upper mold (30) on which the was formed was aligned and arranged to form a molding material layer in a molding space between the upper mold (30) and the lower mold (35).
Electromagnets are arranged on the upper surface of the ferromagnetic substrate (31) of the upper die (30) and the lower surface of the ferromagnetic substrate (36) of the lower die (35) and actuated, thereby forming a molding material layer. On the other hand, the portion located between the ferromagnetic layers (32, 33) of the upper die (30) and the ferromagnetic layers (37, 38) of the lower die (35) has a thickness of 1.3T in its thickness direction. By applying a magnetic field and performing a curing treatment of the molding material layer in this state at 100 ° C. for 1 hour, an elastic anisotropic conductive film (20) is formed on the frame plate (11). The anisotropic conductive connector (10) was manufactured.

Sixteen (4 × 4) connection conductive portions (22) are formed on the elastic anisotropic conductive film (20) in the obtained anisotropic conductive connector (10), and the adjacent connection conductive portions are formed. The center-to-center distance (pitch) between (22) is 1 mm. Each of the conductive portions for connection (22) has a diameter of 300 μm, a thickness of 400 μm, and a protrusion height from both sides of the insulating portion of 50 μm. Each of the high-frequency shield conductive portions (26) has an inner diameter of 600 μm, an outer diameter of 800 μm, a thickness of 150 μm, and a protrusion height from both surfaces of the insulating portion (23) of 50 μm. The thickness of the insulating part (23) is 300 μm.
The ratio of the conductive particles in the connecting conductive portion (22) was 25% by volume, and the ratio of the conductive particles in the high-frequency shielding conductive portion (26) was 25% by volume. Was.

[Inspection circuit board]
According to the configuration shown in FIG. 32, an inspection circuit board (40) having the following specifications was produced.
The test electrode (41) has a diameter of 300 μm, a number of 16 (4 × 4), an arrangement pitch of 1 mm, and a ground electrode (42) having an inner diameter of 600 μm, an outer diameter of 800 μm, and a number of Are 16 pieces (4 pieces × 4 pieces), and the arrangement pitch is 1 mm. The inspection circuit board (40) has an external lead-out terminal (not shown) electrically connected to the test electrode, and is formed between the test electrode (41) and the external lead-out terminal. The impedance Z of each circuit and the measurement probe cable connected to the external lead-out terminal is designed to be 50Ω.

[Evaluation of anisotropic conductive connectors]
The above anisotropic conductive connector was evaluated as follows using the circuit board for inspection.
The pulse generator was electrically connected to a lead-out terminal of the test circuit board via a probe cable for measurement, and the test terminal of the oscilloscope was pressed against the test electrode of the test circuit board. In this state, the pulse generator supplies an electric signal having a set voltage of 2 V and a frequency shown in Table 1 below to the external lead-out terminal of the test circuit board, and the electric signal output from the test electrode of the test circuit board. Was detected by an oscilloscope. Next, in the waveform of the detected electric signal, the time required for the voltage to reach a value (1.8 V) at which the voltage becomes 10% of the set voltage (0.2 V) and 90% of the set voltage was measured. This time is referred to as “T ₀ ”.
In addition, the anisotropic conductive connector is aligned and placed on the inspection circuit board, and the pulse generator is electrically connected to the lead-out terminal of the inspection circuit board via the measurement probe cable, and the oscilloscope measurement is performed. Terminal was pressed against the connecting conductive portion of the anisotropic conductive connector so that the distortion rate was 20%. In this state, an electric signal having a set voltage of 2 V and a frequency shown in Table 1 below was supplied to the external lead-out terminal of the inspection circuit board by the pulse generator, and the electric signal was outputted from the connection conductive portion of the anisotropic conductive connector. Electrical signals were detected by an oscilloscope. Next, in the waveform of the detected electric signal, the time required for the voltage to reach a value (1.8 V) at which the voltage becomes 10% of the set voltage (0.2 V) and 90% of the set voltage was measured. This time is referred to as “T ₁ ”.
Then, the value of (T ₁ −T ₀ ) / T ₀ is calculated, and when this value is less than 0.05 A, when this value is 0.05 to 0.2, B and this value is 0. A case exceeding 2 was evaluated as C.
Here, when the value of (T ₁ −T ₀ ) / T ₀ exceeds 0.2, it is practically difficult to perform a test of the high-frequency characteristics due to a large transmission loss.
The measurement of the value of (T ₁ −T ₀ ) / T ₀ was performed for each of the following conditions 1 to 3.
Condition 1: The frame plate of the anisotropic conductive connector is connected to ground, and the ground electrode of the test circuit board is not connected to ground.
Condition 2: The frame electrode of the anisotropic conductive connector is not connected to ground, and the ground electrode of the inspection circuit board is connected to ground.
Condition 3: Both the frame plate of the anisotropic conductive connector and the ground electrode of the inspection circuit board are connected to ground.
The results are shown in Table 1 below.

<Comparative Example 1>
According to the configuration shown in FIGS. 34 and 35, an anisotropic conductive connector (50) for comparison was manufactured under the following conditions.
[Frame board (51)]
A frame plate (51) having the following specifications was produced.
Material: Stainless steel (JIS standard code: SUS304), Dimensions: 10 mm x 10 mm x 0.1 mm, Dimensions of opening (52): 5.5 mm x 5.5 mm
[Mold for forming elastic anisotropic conductive film]
According to the configuration shown in FIG. 36, a mold for forming an elastic anisotropic conductive film composed of an upper mold (60) and a lower mold (65) having the following specifications was produced.
Ferromagnetic substrate (61, 66): material; steel material (JIS standard symbol: SS400), thickness: 6 mm,
Ferromagnetic layer (62, 67): material; nickel, diameter: 300 μm, thickness: 50 μm, number: 16 (4 × 4), arrangement pitch: 1 mm,
Non-magnetic layer (63.68): material; cured product of dry film resist, thickness: 100 μm
[Spacers (70, 71)]
Two spacers (70, 71) each made of stainless steel (JIS standard symbol: SUS304), having a thickness of 100 μm, and having an opening of 7.5 mm × 7.5 mm were produced.

[Formation of elastic anisotropic conductive film]
To 100 parts by weight of the addition type liquid silicone rubber, 53 parts by weight of conductive particles having an average particle diameter of 30 μm are added and mixed, and then subjected to defoaming treatment under reduced pressure to form an elastic anisotropic conductive film. Materials were prepared. Above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 10% of the weight of the core particles) were used. Next, the prepared molding material is applied by screen printing to each of the molding surfaces of the upper mold (60) and the lower mold (65) in the above mold, and the molding material formed on the molding surface of the lower mold (65). The frame plate (51) is positioned and arranged on the coating layer of (1) via a spacer (71), and the coating layer of a molding material is further placed on the frame plate (51) via a spacer (70). The upper mold (60) on which the was formed was aligned and arranged to form a molding material layer in a molding space between the upper mold (60) and the lower mold (65).
Then, an electromagnet is arranged on the upper surface of the ferromagnetic substrate (61) of the upper die (60) and the lower surface of the ferromagnetic substrate (66) of the lower die (65), and the electromagnet is actuated. On the other hand, a magnetic field of 1.3 T is applied to a portion located between the ferromagnetic layer (62) of the upper die (60) and the ferromagnetic layer (67) of the lower die (65) in the thickness direction thereof. In this state, the molding material layer is cured at 100 ° C. for one hour to form an elastic anisotropic conductive film on the frame plate (51), thereby forming a comparative anisotropic conductive connector (50). ) Manufactured.

In the functional part (56) of the elastic anisotropic conductive film (55) in the obtained anisotropic conductive connector (50), 16 (4 × 4) connection conductive parts (57) are formed, The center-to-center distance (pitch) between adjacent connection conductive portions (57) is 1 mm. Each of the conductive portions for connection (57) has a diameter of 300 μm, a thickness of 400 μm, and a protrusion height from both surfaces of the insulating portion (58) of 50 μm. The thickness of the insulating part (58) is 300 μm.
The ratio of the conductive particles in the connecting conductive portion (57) was 25% by volume.

[Evaluation of anisotropic conductive connectors]
With respect to the anisotropically conductive connector described above, using the inspection circuit board prepared in Example 1, the conditions were changed such that both the frame plate of the anisotropically conductive connector and the ground electrode of the inspection circuit board were not grounded. Except for the above, evaluation was performed in the same manner as in Example 1. The results are shown in Table 1 below.

It is a top view showing the anisotropic conductive connector concerning the 1st example of the present invention. FIG. 2 is an explanatory cross-sectional view showing, on an enlarged scale, a configuration of a main part of the anisotropic conductive connector according to the first example of the present invention. FIG. 4 is an explanatory cross-sectional view showing an enlarged main part of a mold used for molding an elastic anisotropic conductive film in the anisotropic conductive connector according to the first example. FIG. 4 is an explanatory cross-sectional view showing a state where a frame plate is arranged in a mold shown in FIG. 3 and a molding material layer for an elastic anisotropic conductive film is formed. It is explanatory sectional drawing which shows the state which applied the magnetic field which has intensity distribution to the thickness direction of a molding material layer. It is a top view showing the anisotropic conductive connector concerning the 2nd example of the present invention. It is explanatory sectional drawing which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 2nd example of this invention. It is a top view showing the anisotropic conductive connector concerning the 3rd example of the present invention. It is explanatory sectional drawing which expands and shows the structure of the principal part of the anisotropic conductive connector concerning the 3rd example of this invention. It is a top view showing the anisotropic conductive connector concerning the 4th example of the present invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 4th example of this invention. It is a top view showing the anisotropic conductive connector concerning the 5th example of the present invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 5th example of this invention. It is a top view showing the anisotropic conductive connector concerning the 6th example of the present invention. It is explanatory sectional drawing which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 6th example of this invention. It is a top view showing the anisotropic conductive connector concerning the 7th example of the present invention. It is explanatory sectional drawing which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 7th example of this invention. It is a top view showing the anisotropic conductive connector concerning an 8th example of the present invention. It is explanatory sectional drawing which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 8th example of this invention. It is a top view showing the anisotropic conductive connector concerning a 9th example of the present invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 9th example of this invention. It is a top view showing the anisotropic conductive connector concerning a 10th example of the present invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 10th example of this invention. It is a top view showing the anisotropic conductive connector concerning the 11th example of the present invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropic conductive connector which concerns on the 11th example of this invention. It is a top view which shows the modification of the anisotropic conductive connector of this invention. It is a top view which shows the other modification of the anisotropic conductive connector of this invention. It is a top view which shows another modification of the anisotropic conductive connector of this invention. It is a top view which shows another modification of the anisotropic conductive connector of this invention. It is an explanatory view showing the composition in the 1st example of the electrical inspection device of the circuit device of the present invention. It is an explanatory view showing the composition in the 2nd example of the electrical inspection device of the circuit device of the present invention. It is an explanatory view showing the composition in the modification of the electrical inspection device of the circuit device of the present invention. It is explanatory drawing which shows the structure in the other modification of the electrical inspection apparatus of the circuit device of this invention. FIG. 5 is a plan view illustrating a configuration of an anisotropic conductive connector manufactured in Comparative Example 1. FIG. 4 is an explanatory cross-sectional view showing, on an enlarged scale, a configuration of a main part of an anisotropic conductive connector manufactured in Comparative Example 1. FIG. 4 is an explanatory cross-sectional view showing, on an enlarged scale, a configuration of a main part of a mold for forming an elastic anisotropic conductive film used in Comparative Example 1.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 circuit device 2 electrode under test 10 anisotropic conductive connector 11 frame plate 12 opening 13 positioning hole 15, 16 spacer 20 elastic anisotropic conductive film 20A molding material layer 21 functional portion 22 conductive portion 22a for connection protrusion 23 insulating portion 24 Non-connection conductive part 25 Conductive part group 26, 26a, 26b, 26c High-frequency shield conductive part 26a Projection 28 Supported part 30 Upper die 31 Ferromagnetic substrates 32, 33 Ferromagnetic layers 32a, 33a Recess 34 Non Magnetic layer 35 Upper die 36 Ferromagnetic substrate 37, 38 Ferromagnetic layer 37a, 38a Recess 39 Nonmagnetic layer 40 Test circuit board 41 Test electrode 42 Ground electrode 43 Guide pin 50 Anisotropically conductive connector Reference Signs List 51 frame plate 52 opening 55 elastic anisotropic conductive film 56 functional part 57 connecting conductive part 58 insulating part 60 upper die 61 ferromagnetic substrate 62 ferromagnetic Layer 63 Nonmagnetic layer 65 Lower die 66 Ferromagnetic substrate 67 Ferromagnetic layer 68 Nonmagnetic layers 70 and 71 Spacer P Conductive particles

Claims (18)

Anisotropic conductive material comprising an elastic anisotropic conductive film having a plurality of connecting conductive portions extending in a thickness direction arranged according to a pattern corresponding to an electrode to be connected and an insulating portion for insulating these connecting conductive portions from each other. In the sex connector,
An anisotropic conductive connector, wherein a conductive part for high-frequency shielding extending in a thickness direction is formed on the elastic anisotropic conductive film. Anisotropic conductive material comprising an elastic anisotropic conductive film having a plurality of connecting conductive portions extending in a thickness direction arranged according to a pattern corresponding to an electrode to be connected and an insulating portion for insulating these connecting conductive portions from each other. In the sex connector,
An anisotropically conductive connector, wherein a conductive portion for high-frequency shielding extending in the thickness direction is formed on the elastic anisotropic conductive film so as to surround each of the conductive portions for connection. Anisotropic conductive material comprising an elastic anisotropic conductive film having a plurality of connecting conductive portions extending in a thickness direction arranged according to a pattern corresponding to an electrode to be connected and an insulating portion for insulating these connecting conductive portions from each other. In the sex connector,
The elastic anisotropic conductive film is formed with a high-frequency shield conductive portion extending in the thickness direction and disposed so as to surround a conductive portion group including a plurality of connection conductive portions. connector. A conductive frame plate having a plurality of openings formed according to a pattern corresponding to an electrode to be connected,
A plurality of functional portions including a conductive portion for connection extending in the thickness direction and an insulating portion integrally formed therearound, and a plurality of functional portions formed integrally with the conductive portion for connection arranged around each opening of the frame plate, and integrally formed around these functional portions, An anisotropic conductive connector comprising an elastic anisotropic conductive film formed of a supported portion stacked and fixed on the frame plate,
In the supported portion of the elastic anisotropic conductive film, a high-frequency shielding conductive portion extending in the thickness direction, which is disposed so as to surround the individual connecting conductive portions and is electrically connected to the frame plate, is formed. An anisotropically conductive connector, characterized in that: A conductive frame plate having an opening formed therethrough in the thickness direction,
A functional part having a plurality of connecting conductive parts arranged in an opening of the frame plate and extending in the thickness direction arranged according to a pattern corresponding to an electrode to be connected, and an insulating part for mutually insulating these connecting conductive parts; And an anisotropically conductive connector formed integrally with the periphery of the functional portion and comprising an elastic anisotropic conductive film composed of a supported portion stacked and fixed on the frame plate,
The supported portion of the elastic anisotropic conductive film is disposed so as to surround a conductive portion group including a plurality of conductive portions for connection, and is electrically connected to the frame plate, and is a conductive portion for a high-frequency shield extending in the thickness direction and electrically connected to the frame plate. An anisotropic conductive connector, characterized in that a connector is formed. A conductive frame plate having a plurality of openings formed according to a pattern corresponding to an electrode to be connected,
A plurality of functional portions including a conductive portion for connection extending in the thickness direction and an insulating portion integrally formed around the conductive portion for connection arranged in each opening of the frame plate, and integrally formed around these functional portions, An anisotropic conductive connector comprising an elastic anisotropic conductive film formed of a supported portion stacked and fixed on the frame plate,
The supported portion of the elastic anisotropic conductive film is disposed so as to surround a conductive portion group including a plurality of connection conductive portions, and is electrically connected to the frame plate and extends in the thickness direction. An anisotropic conductive connector, characterized by having an opening formed thereon.   It has a cylindrical high-frequency shield conductive portion, and the high-frequency shield conductive portion is disposed concentrically with respect to one connection conductive portion, so as to surround the connection conductive portion. The anisotropically conductive connector according to claim 1, 2 or 4, wherein:   8. The anisotropic conductive connector according to claim 1, further comprising a plurality of high-frequency shield conductive portions surrounding the same connection conductive portion.   9. The anisotropic conductive connector according to claim 8, wherein a distance between adjacent high-frequency shield conductive portions surrounding the same connection conductive portion is 1/10 or less of a wavelength of a measurement signal.   In the elastic anisotropic conductive film, one or more non-connection conductive parts are formed in addition to the connection conductive part, and the high-frequency shield conductive part includes a plurality of connection conductive parts and one or more non-connection conductive parts. The anisotropic conductive connector according to claim 5, wherein the connector is arranged so as to surround a conductive part group including a conductive part for use.   4. A high-frequency shielding conductive part having a cylindrical shape, wherein the high-frequency shielding conductive part is arranged to surround a conductive part group including a plurality of connection conductive parts. The anisotropic conductive connector according to claim 5, claim 6, or claim 10.   12. A high-frequency shield conductive part surrounding a conductive part group including a plurality of connection conductive parts, wherein the conductive part has a plurality of high-frequency shielding conductive parts. An anisotropic conductive connector according to claim 1.   The anisotropically conductive connector according to claim 12, wherein a distance between adjacent high-frequency shield conductive portions surrounding the conductive portion group is 1/10 or less of a wavelength of a measurement signal.   The anisotropic conductive connector according to any one of claims 1 to 3, wherein the high-frequency shield conductive part is connected to a ground.   7. The anisotropic conductive connector according to claim 4, wherein the frame plate is connected to a ground.   An electrical inspection device for a circuit device, comprising: the anisotropic conductive connector according to claim 1. An inspection circuit board on which an inspection electrode is formed in accordance with a pattern corresponding to an electrode to be inspected of a circuit device to be inspected, and the anisotropic conductive connector according to claim 14 disposed on the inspection circuit board. With
An electrical inspection of a circuit device, wherein an earth electrode connected to earth is formed on the inspection circuit board in accordance with a pattern corresponding to a high-frequency shielding conductive portion of the anisotropic conductive connector. apparatus. An inspection circuit board on which an inspection electrode is formed according to a pattern corresponding to an electrode to be inspected of a circuit device to be inspected, and the anisotropically conductive connector according to claim 15 disposed on the inspection circuit board. With
An electrical inspection device for a circuit device, wherein a frame plate of the anisotropic conductive connector is connected to a ground.

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