KR101779172B1 - Test socket for micro pitch - Google Patents

Test socket for micro pitch Download PDF

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Publication number
KR101779172B1
KR101779172B1 KR1020150110118A KR20150110118A KR101779172B1 KR 101779172 B1 KR101779172 B1 KR 101779172B1 KR 1020150110118 A KR1020150110118 A KR 1020150110118A KR 20150110118 A KR20150110118 A KR 20150110118A KR 101779172 B1 KR101779172 B1 KR 101779172B1
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KR
South Korea
Prior art keywords
conductive
terminal
inspected
test socket
conductive portion
Prior art date
Application number
KR1020150110118A
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Korean (ko)
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KR20170016688A (en
Inventor
정영배
Original Assignee
주식회사 아이에스시
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Priority to KR1020150110118A priority Critical patent/KR101779172B1/en
Publication of KR20170016688A publication Critical patent/KR20170016688A/en
Application granted granted Critical
Publication of KR101779172B1 publication Critical patent/KR101779172B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

The present invention relates to a test socket for fine pitch capable of reliable electrical contact with a terminal of an inspected device having a fine pitch. A test socket for fine pitch according to an embodiment of the present invention includes a conductive portion, a base portion, and an aligning portion. Here, the conductive portion is composed of a plurality of conductive particles provided in the elastic material, and the conductive portion is formed in a columnar shape and has a conductivity in the up-down direction and may be provided in plural. The base portion is integrally formed with the conductive portion, and is fixed so that each conductive portion is disposed at a position corresponding to the terminal of the device to be inspected and the pad of the inspection apparatus, and is insulated from the conductive portion. The aligning portion is formed in a thickness direction so as to insert each conductive portion, and is secondarily fixed so that the inserted conductive portion is disposed at a position corresponding to the terminal of the device to be inspected and the pad of the inspecting device.

Description

Test Socket for Micro Pitch {TEST SOCKET FOR MICRO PITCH}

TECHNICAL FIELD The present invention relates to a test socket for fine pitch, and more particularly, to a test socket for fine pitch capable of reliable electrical contact with a terminal of a device to be inspected having a fine pitch.

Generally, devices to be inspected such as semiconductor devices, which have been manufactured, are subjected to electrical tests to determine whether they are defective or not. Specifically, a predetermined test signal is caused to flow from the testing device to the device under test to determine whether the device under test is short-circuited. Here, the test device and the device under test are not directly connected to each other, but are indirectly connected using an intermediate device called a test socket.

Various test sockets such as pogo pins can be used. Recently, test sockets using anisotropic elastic sheets have been widely used.

FIG. 1 is a cross-sectional view showing an example of a conventional test socket, and FIG. 2 is an exemplary view showing an operation example of the test socket of FIG.

First, as shown in FIG. 1, the test socket 10 has a conductive portion 20. The conductive part 20 is formed in a manner that a plurality of conductive particles 22 are contained in a base material 21 made of an insulating elastic material. The plurality of conductive particles 22 are oriented in the thickness direction. The conductive portions 20 are arranged so as to correspond to the electrodes 51 of the device under test 50.

The conductive part 20 is insulated and supported by the insulating support part 30.

These test sockets 10 are placed on the test apparatus 60 so that each of the conductive sections 20 thereof is in contact with the pads 61 of the test apparatus 60.

2, when the inspected device 50 is lowered, the electrodes 51 of the device 50 to be inspected contact the respective conductive parts 20 to press the conductive parts 20, Accordingly, the conductive particles 22 in the conductive part 20 are in close contact with each other to form a state in which electricity can be supplied.

For aligning the test socket 10 and the test apparatus 60, the test apparatus 60 is provided with a guide pin 70. The guide pin 70 may be provided to protrude upward from the test apparatus 60.

The test socket 10 is provided with a metal frame 71. The metal frame 71 forms a peripheral portion of the test socket 10 and is coupled to the guide pin 70 so that the conductive portion 20 of the test socket 10 contacts the pad 61 of the test apparatus 60, Lt; / RTI > position.

Thereafter, when a predetermined test signal is applied from the test apparatus 60, the test signal is transmitted to the inspected device 50 via the test socket 10, and the reflected signal is transmitted through the test socket 10 to the test apparatus 60).

Such a test socket has a characteristic of exhibiting conductivity only in its thickness direction when it is pressed in the thickness direction and has an advantage of being excellent in durability and achieving a simple electrical connection since no mechanical means such as soldering or a spring is used.

In addition, since it can absorb mechanical impact or deformation, it has a merit that a soft connection can be performed and is widely used for electrical connection between various electric circuit devices and test devices.

On the other hand, in the case where the terminals of the device to be inspected have fine pitches, it is very important to align the conductive parts of the test socket accurately to the terminals of the device to be inspected. However, due to the characteristics of the silicon material constituting the insulating support portion and the conductive portion, shrinkage and expansion occur at the time of manufacture of the product and in the test environment, and thus the position of the conductive portion of the test socket is deformed. The deformation of the position of the conductive portion may cause a contact failure between the conductive portion and the terminal of the device to be inspected, which may lower the reliability of the test.

Practically, when the pitch between the terminals of the device to be inspected is 0.4 mm or more, the allowable range of the position of the conductive portion of the test socket is required to be 0.05 mm or less. When the pitch between the terminals is a fine pitch of 0.4 mm or less, The allowable range of the conductive part of the socket is required to be within ± 0.03 mm.

Therefore, there is a demand for a fine pitch test socket having a conductive portion capable of making reliable contact with a terminal even when the terminal of the device to be inspected has a fine pitch.

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a test socket for fine pitch capable of reliable electrical contact with a terminal of an inspected device having a fine pitch.

According to an aspect of the present invention, there is provided an electro-optical device including: a plurality of conductive parts formed of a plurality of conductive particles provided in an elastic material and formed in a columnar shape and having conductivity in a vertical direction; A base part formed integrally with the conductive part and fixed so that each of the conductive parts is disposed at a position corresponding to a terminal of the device to be inspected and a pad of the inspection device and is insulated from the conductive parts; And an aligning portion having an alignment hole which is formed in a thickness direction so as to insert each of the conductive portions and is secondarily fixed so that the inserted conductive portion is disposed at a position corresponding to a terminal of the device to be inspected and a pad of the inspection apparatus, The test socket for fine pitch.

In one embodiment of the present invention, the upper portion of the liner may further include a guide portion extending upward in order to guide the terminal of the device under test to be correctly positioned on the conductive portion.

In one embodiment of the present invention, the base portion may be integrally formed at a lower portion of the conductive portion.

According to an embodiment of the present invention, a seating part may be formed on the lower part of the alignment part so that the base part is seated.

In one embodiment of the present invention, the lower end of the base portion may be formed to surround the pad of the inspection apparatus.

In one embodiment of the present invention, the base portion may be integrally formed on the conductive portion.

In an exemplary embodiment of the present invention, a guide protrusion may be further formed on the upper surface of the base portion so as to guide the terminal of the device under test to the upper portion of the conductive portion formed along the upper edge of the conductive portion.

In an embodiment of the present invention, the allowable range of the pitch between the liner and the inter-artificial air may be equal to or less than 0.03 mm.

According to the embodiment of the present invention, since the conductive parts can be arranged at fine pitches by being coupled to the artificial holes, it is possible to positively make contact with the terminals of the device under test having fine pitches, thereby improving the reliability of the test .

Also, according to an embodiment of the present invention, the conductive portion and the base portion may be separately manufactured from the aligning portion and combined so as to be detachable from the aligning portion. Therefore, when a problem such as breakage or deformation occurs in the upper part of the conductive part due to repetitive contact with the terminal of the device to be inspected, only the conductive part and the base part can be separated and replaced.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a cross-sectional view showing an example of a conventional test socket.
2 is an exemplary view showing an operation example of the test socket of FIG.
3 is a cross-sectional view illustrating a test socket for fine pitch according to the first embodiment of the present invention.
4 is an exploded view showing a test socket for fine pitch according to the first embodiment of the present invention.
5 and 6 are diagrams illustrating an example of operation of a test socket for fine pitch according to the first embodiment of the present invention.
7 is an exemplary view showing another embodiment of the alignment portion in the test socket for fine pitch according to the first embodiment of the present invention.
8 is an exemplary view showing another embodiment of the base portion in the test socket for fine pitch according to the first embodiment of the present invention.
9 is a cross-sectional view illustrating a test socket for fine pitch according to a second embodiment of the present invention.
10 is an exploded view showing a test socket for fine pitch according to a second embodiment of the present invention.
11 and 12 are diagrams illustrating an operation example of a test socket for fine pitch according to a second embodiment of the present invention.
13 is an exemplary view showing another embodiment of the alignment portion in the test socket for fine pitch according to the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a cross-sectional view illustrating a test socket for fine pitch according to a first embodiment of the present invention, FIG. 4 is an exploded view illustrating a test socket for fine pitch according to the first embodiment of the present invention, 6 is an exemplary view showing an operation example of a test socket for fine pitch according to the first embodiment of the present invention.

3 to 6, the test socket 100 for fine pitch according to an embodiment of the present invention may include a conductive portion 200, a base portion 300, and an aligning portion 400.

Here, the conductive part 200 may include a plurality of conductive particles 220 provided in the elastic material 210, may be formed in a columnar shape and may have conductivity in the vertical direction, and may be provided in plurality.

The base portion 300 is formed integrally with the conductive portion 200 so that each conductive portion 200 corresponds to the terminal 510 of the device under test 500 and the pad 610 of the inspection device 600 The conductive part 200 can be firstly fixed. Can be insulated between the conductive parts (200) by the base part (300).

In addition, the alignment portion 400 may have an artificial hole 410. The liner 410 is formed in a thickness direction so that each conductive part 200 is inserted and the inserted conductive part 200 is electrically connected to the terminal 510 of the device under test 500 and the pad 510 of the inspection device 600. [ The conductive part 200 may be secondarily fixed so as to be disposed at a position corresponding to the second conductive part 610. Accordingly, the pitch between the conductive parts 200 can be managed within a minute error range, and even if the device to be inspected has terminals with a fine pitch, reliability of contact with terminals of such fine pitches can be enhanced.

The test socket 100 according to one embodiment of the present invention is disposed between the device under test 500 and the inspection device 600 and is disposed between the terminal 510 of the device under inspection 500 and the terminal 510 of the inspection device 600. [ The pad 610 can be electrically connected.

The test socket 100 may include a conductive portion 200, a base portion 300, and an alignment portion 400.

The conductive part 200 may include an elastic material 210 and a plurality of conductive particles 220 provided in the elastic material 210.

Here, as the elastic material 210, a heat-resistant polymer material having a crosslinked structure may be used. Various materials can be used as the curable polymeric substance-forming material that can be used to obtain the polymer material having such a crosslinked structure, but liquid silicone rubber can be preferably used. As the liquid silicone rubber, both addition type and condensation type may be used, but addition type liquid silicone rubber can be preferably used. In the case where the conductive part 200 is formed of a cured liquid silicone rubber, the cured product of the liquid silicone rubber preferably has a compression set of 10% or less, more preferably 8% or less, Or less, more preferably 6% or less. When the compression set is more than 10%, when the conductive part 200 that can be obtained is repeatedly used under a high-temperature environment, the conductive particles may be disturbed and it may be difficult to maintain the required conductivity.

The conductive particles 220 may be formed by coating a surface of a core particle exhibiting magnetism with a high-conductive metal. Here, the high-conductive metal means that the conductivity at 0 ° C is 5 × 10 6 Ω / m or more. As the high-conductive metal, gold, silver, rhodium, platinum, chromium and the like can be used. Among them, gold is preferably used because it is chemically stable and has high conductivity.

It is preferable that the magnetic core particles for obtaining the conductive particles 220 have a number average particle diameter of 3 to 40 占 퐉. Here, the number average particle diameter of the magnetic core particles may be measured by a laser diffraction scattering method. As the material constituting the magnetic core particles, iron, nickel, cobalt, those coated with copper or resin, or the like can be used, and those having a saturation magnetization of 0.1 ㏝ / m 2 or more can be preferably used, M 2 or more, particularly preferably 0.5 m 2 / m 2 or more.

The conductive part 200 may be formed in a columnar shape and may have conductivity in the vertical direction. In other words, the conductive part 200 can enable electrical flow in the height direction of the test socket 100.

The upper surface of the conductive part 200 may be positioned on the same plane as the upper surface of the alignment part 400. [ Alternatively, as shown in FIG. 3, the conductive portion 200 may be formed such that the upper end portion 230 is positioned lower than the upper end portion 420 of the artificial hole 410. The upper end 420 of the liner 410 may function to guide the terminal 510 of the device under test 500 into contact with the upper end 230 of the conductive part 200. In this case,

In addition, the base portion 300 can maintain the insulating property between the conductive portions 200 while supporting the conductive portion 200.

The base portion 300 may be integrally formed with the conductive portion 200 and the conductive portion 200 may be electrically connected to the terminal 510 of the device under test 500 and the pad 610 of the inspection device 600 The conductive part 200 can be firstly fixed to be disposed at the corresponding position. That is, the conductive portion 200 can be fixed to the base portion 300 at a position corresponding to the terminal 510 of the device under test 500 and the pad 610 of the inspection apparatus 600 . In this embodiment, the base portion 300 may be integrally formed on the lower portion of the conductive portion 200.

The base 300 may be made of the same material as the elastic material of the conductive part 200. However, the present invention is not limited thereto. The base part 300 may be formed of a material that can be formed integrally with the conductive part, Do.

The conductive part 200 and the base part 300 may be manufactured by various methods such as being separately manufactured and then integrally formed or simultaneously formed by a bulk molding using an elastic material and conductive particles.

On the other hand, the alignment portion 400 may have an alignment hole 410 into which the conductive portions 200 are inserted.

The conductive part 200 may be inserted into the lower side of the artificial hole 410 and may be coupled into the artificial hole 410. In addition,

At this time, the liner 410 may be formed to have a pitch P2 corresponding to the pitch P1 of the terminals 510 of the device 500 to be inspected. In an embodiment of the present invention, the pitch P2 of the liner 410 is generally within a tolerance range of 占 0.03 mm or less, which is the level required when the pitch between the terminals of the device to be inspected is a fine pitch of 0.4 mm or less As shown in Fig.

The alignment portion 400 may be formed of an insulating material. Accordingly, the insulating property can be maintained between the conductive parts 200 inserted and bonded to the respective alignment holes 410.

The alignment portion 400 is made of a material having no deformation such as expansion and contraction in a thermal condition in a test environment or having a deformation range of ± 0.03 mm or less between the pitch P2 of the uneven portion 410 .

Therefore, the fine holes 410 formed at fine pitches corresponding to the terminals 510 of the device 500 to be inspected are minimized in the test environment so that the pitch P2 having a tolerance range of 0.03 mm or less Can be maintained.

The terminal 510 of the device under test 500 and the pad 510 of the inspecting apparatus 600 can be positioned within a tolerance range of 0.03 mm or less. 610), so that the reliability of the test can be improved.

In addition, according to the present invention, the conductive portion 200 and the base portion 300 may be separately formed from the aligning portion 400 and coupled to the aligning portion 400 so as to be detachable. Therefore, when the upper part of the conductive part 200 is damaged or deformed due to repetitive contact with the terminal of the device to be inspected, only the conductive part 200 and the base part 300 are separated and replaced There is an advantage that it can be.

7 is a view illustrating another example of the alignment portion in the test socket for fine pitch according to the first embodiment of the present invention. Referring to FIG. 7, the guide portion 430 ) Can be provided.

Here, the guide portion 430 may be enlarged in the upward direction. When the inspected device 500 moves to the test socket 100, the terminal 510 of the inspected device 500 is guided by the guide portion 430 and is guided to the upper portion of the conductive portion 200 To be positively positioned.

A seating part 440 may be further formed on the lower part of the alignment part 400 to seat the base part 300 thereon.

The seating part 440 may be formed in a shape corresponding to the base part 300 so that when the conductive part 200 is inserted into and coupled with the artificial body 410, (440). ≪ / RTI >

The bottom surface 310 of the base part 300 may be provided on the same plane as the bottom surface 240 of the conductive part 200. In this case, The seating portion 440 may have a depth that is deeper than the thickness of the base portion 300. The bottom surface 240 of the conductive part 200 may be positioned inside the seating part 440 when the base part 300 is seated in the seating part 440. [

The distance D between the lower surface 240 of the conductive part 200 and the lower surface 450 of the alignment part 400 may correspond to the height H of the pad 610 of the inspection apparatus 600 . When the test socket 100 is mounted on the inspection apparatus 600 and the conductive section 200 is in contact with the pad 610 of the inspection apparatus 600, the lower surface 450 of the alignment section 400 Can be stably placed in contact with the inspection apparatus 600 as a whole.

The inspection apparatus 600 may further include alignment protrusions 620 for supporting the outer surface of the alignment section 400 so that the alignment section 400 can be aligned at a predetermined position.

According to the present invention, since the lower surface 450 of the aligning part 400 is closely adhered to the inspection device 600 as a whole, the alignment of the aligning part 400 can be precisely adjusted and the outer surface of the aligning part 400 Precise alignment can be achieved only by being placed in contact with the alignment protrusion 620. [ Therefore, there is an effect that the structure of the metal frame 71 like the conventional test socket 10 described above with reference to Figs. 1 and 2 is unnecessary.

8 is a view illustrating another embodiment of the base portion in the test socket for fine pitch according to the first embodiment of the present invention. Referring to FIG. 8, the base portion 300a has a bottom surface 310a, May be formed on the same plane as the lower surface 450 of the substrate 400. That is, the lower surface 310a of the base portion 300a may extend further downward than the lower surface 240 of the conductive portion 200.

In this configuration, since the lower end of the base portion 300a can cover the pad 610 of the inspection apparatus 600, when the test socket 100 is provided in the inspection apparatus 600, It is possible to further obtain the effect of the alignment to be positively positioned with the pad 610 of the inspection apparatus 600.

FIG. 9 is a cross-sectional view illustrating a test socket for fine pitch according to a second embodiment of the present invention, FIG. 10 is an exploded view showing a test socket for fine pitch according to a second embodiment of the present invention, and FIGS. 11 and 12 Is an exemplary view showing an operation example of the test socket for fine pitch according to the second embodiment of the present invention. In this embodiment, the base portion can be integrally formed on the upper portion of the conductive portion and can have a difference in configuration due to this, and other basic structures are the same as those of the first embodiment, and thus description thereof is omitted.

9 to 12, according to the embodiment of the present invention, the base portion 1300 may be integrally formed on the conductive portion 1200.

Accordingly, the conductive part 1200 can be inserted into and coupled to the upper part of the alignment part 1400 and the base part 1300 can be provided on the upper part of the alignment part 1400.

Further, a guide protrusion 1350 may be further provided on the upper surface of the base portion 1300.

Here, the guide protrusion 1350 may be formed along the upper edge of the conductive part 1200. The guide protrusion 1350 can guide the terminal 1510 of the device under test 1500 to be positioned right above the conductive part 1200.

In addition, an inclined portion 1360 having an upwardly enlarged shape may be further formed on the inner circumferential surface of the guide projection 1350. The inclined portion 1360 can effectively guide the terminal 1510 of the device 1500 to be inspected to be correctly positioned on the conductive portion 1200. [

13 is an exemplary view showing another embodiment of the alignment portion in the test socket for fine pitch according to the second embodiment of the present invention. Referring to FIG. 13, the seating portion 1440 of the alignment portion 1400a The bottom surface 1441 may be formed to be flush with the bottom surface 1201 of the conductive part 1200.

The alignment portion 1400a can support the lower end of the conductive portion 1200 so that the overall shape of the conductive portion 1200 can be stably maintained even if the device under test 1500 is pressed against the conductive portion 1200 .

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100: Test socket 200, 1200: Conductive part
300, 300a, 1300: base part 400, 1400, 1400a:
410, 1410: LINEAR ARTIF 430:
440, and 1440: a mounting portion 500, 1500: a device to be inspected
510, 1510: Terminal 600: Inspection device
610: Pad 620: Alignment projection
1350: guide projection

Claims (8)

A plurality of conductive parts formed of a plurality of conductive particles provided in the elastic material and formed in a columnar shape and having conductivity in the vertical direction;
A base part formed integrally with the conductive part and fixed so that each of the conductive parts is disposed at a position corresponding to a terminal of the device to be inspected and a pad of the inspection device and is insulated from the conductive parts; And
And an aligning portion formed in the thickness direction so as to insert each of the conductive portions and having an alignment hole for securing the inserted conductive portion to a position of a terminal of the device to be inspected and a pad of the inspection apparatus and,
Wherein the base portion is integrally formed on the conductive portion,
And a guide protrusion is formed on an upper surface of the base portion so as to guide the terminal of the device under test to be positioned on the upper portion of the conductive portion. The method according to claim 1,
Further comprising a guide portion extending upward in an upward direction for guiding the terminal of the device to be inspected to be positioned right above the conductive portion, at an upper end of the liner. The method according to claim 1,
Wherein the base portion is integrally formed at a lower portion of the conductive portion. The method of claim 3,
And a seating portion is further formed at a lower portion of the alignment portion so that the base portion is seated. The method of claim 3,
And a lower end of the base portion is formed to surround a pad of the testing apparatus. delete delete The method according to claim 1,
Wherein a tolerance range of the pitch between the liner and the interlayer is 0.03 mm or less.
KR1020150110118A 2015-08-04 2015-08-04 Test socket for micro pitch KR101779172B1 (en)

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KR101779172B1 true KR101779172B1 (en) 2017-09-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220135082A (en) * 2021-03-29 2022-10-06 (주)위드멤스 Contactor assembly and method for manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101961101B1 (en) * 2017-12-07 2019-03-22 (주)티에스이 Rubber socket for test having no-frame structure and manufacturing method thereof
KR102211358B1 (en) * 2020-03-19 2021-02-03 (주)티에스이 Test socket and test apparatus having the same, manufacturing method for the test socket
KR102271503B1 (en) * 2020-05-25 2021-07-01 (주)티에스이 Data signal transmission connector

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101284212B1 (en) 2012-04-27 2013-07-09 주식회사 아이에스시 Test socket which can be aligned easily

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101284212B1 (en) 2012-04-27 2013-07-09 주식회사 아이에스시 Test socket which can be aligned easily

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220135082A (en) * 2021-03-29 2022-10-06 (주)위드멤스 Contactor assembly and method for manufacturing the same
KR102525844B1 (en) 2021-03-29 2023-04-28 (주)위드멤스 Contactor assembly and method for manufacturing the same

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