KR102211358B1 - Test socket and test apparatus having the same, manufacturing method for the test socket - Google Patents

Abstract

The present invention relates to a test socket which electrically mediates a tester generating a test signal and an inspection target device having a terminal. The apparatus includes: a non-elastic conductive housing comprising a plurality of housing holes penetrating in a thickness direction and made of a non-elastic conductive material; an insulating coating layer coated on at least the upper surface of the non-elastic conductive housing and the perimeter of the plurality of housing holes; and a conductive part made in a form wherein a number of conductive particles are included in the elastic insulating material, the lower end connected to the signal electrode of the tester placed on the lower side of the non-elastic conductive housing, the upper end disposed in the housing hole so that it can be connected to the terminal of the device under test placed on the upper side of the non-elastic conductive housing, and insulated from the non-elastic conductive housing by the insulating coating layer.

Description

A test socket, a test device including the same, and a method of manufacturing the test socket {TEST SOCKET AND TEST APPARATUS HAVING THE SAME, MANUFACTURING METHOD FOR THE TEST SOCKET}

The present invention relates to a test socket, and more particularly, to a test socket for electrically connecting a device to be tested and a tester, a test apparatus including the same, and a method of manufacturing the test socket.

A semiconductor package is formed by integrating fine electronic circuits at a high density, and during the manufacturing process, each electronic circuit is tested for normality. The test process is a process of selecting good products and defective products by testing whether a semiconductor package operates normally.

For testing of a semiconductor package, a test device that electrically connects a terminal of the semiconductor package to a tester that applies a test signal is used. The test apparatus has various structures depending on the type of semiconductor package to be tested. The test device and the semiconductor package are not directly connected to each other, but indirectly through a test socket.

Typical test sockets are pogo sockets and rubber sockets. Among them, the rubber socket has a structure in which conductive portions in which a plurality of conductive particles are included in a material having elasticity such as silicon are insulated from each other inside an insulating portion made of a material having elasticity such as silicon. Since such a rubber socket does not use a mechanical means such as soldering or a spring, it is excellent in durability and has the advantage of achieving a simple electrical connection, and has been widely used in recent years.

In a test apparatus including a rubber socket type test socket, the contact stroke amount of the test socket is located at the outer side of the conductive part of the test socket and the stroke limiting part located outside the pressing part of the pusher that presses the semiconductor package. It is determined according to the vertical thickness of the stopper part, the thickness of the semiconductor package, and the height of the test socket.

However, in the conventional test apparatus, the thickness tolerance of the stroke limiting part, the thickness tolerance of the stopper part, the height tolerance of the test socket, and the thickness tolerance of the semiconductor package were added, and thus it was difficult to precisely control the stroke.

In addition, in the conventional rubber socket type test socket, since the insulating portion is made of a non-conductive material, high-frequency signal interference between the conductive portions cannot be avoided, and a desired impedance cannot be obtained, thereby deteriorating high-frequency signal transmission characteristics.

Public Patent Publication No. 2006-0062824 (2006. 06. 12)

The present invention was conceived in consideration of the above points, and the difficulty of controlling the stroke due to the thickness tolerance of the device under test is small, precise control of the stroke is possible, and a test socket having excellent high-frequency signal transmission characteristics and the same is included. It is an object of the present invention to provide a test apparatus and a method of manufacturing a test socket.

In the test socket according to the present invention for solving the above-described object, in the test socket electrically mediating a tester generating a test signal and a device under test having a terminal, a plurality of housing holes formed through the thickness direction And an inelastic conductive housing made of an inelastic conductive material; An insulating coating layer coated on at least an upper surface of the inelastic conductive housing and around the plurality of housing holes; And a plurality of conductive particles in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic conductive housing, and the upper end is placed on the upper side of the inelastic conductive housing. And a conductive portion disposed in the housing hole so as to be connected to a terminal of the device, and insulated from the inelastic conductive housing by the insulating coating layer.

The insulating coating layer may be coated on the entire inelastic conductive housing.

The insulating coating layer may be formed by a coating method selected from feralin coating, anodizing treatment, Teflon coating, and liquid silicone coating.

The housing hole has a housing lower hole extending upward from the lower surface of the inelastic conductive housing with a constant width, and a width gradually decreasing from the upper surface to the lower side of the inelastic conductive housing, and is connected to the housing lower hole. It may include an upper hole in the housing.

On the other hand, in the test socket according to another aspect of the present invention for solving the object as described above, in the test socket that electrically mediates a tester that generates a test signal and a device to be tested having a terminal, a penetration is formed in the thickness direction An inelastic conductive housing comprising a plurality of housing holes and made of an inelastic conductive material; The device under test in which a plurality of conductive particles are contained in an elastic insulating material, a lower end is connected to a signal electrode of the tester placed on a lower side of the inelastic conductive housing, and an upper end is placed on an upper side of the inelastic conductive housing. A conductive part disposed in the housing hole to be connected to the terminal of the terminal; An insulating part made of an elastic insulating material and disposed between the inelastic conductive housing and the conductive part to insulate the conductive part from the inelastic conductive housing; And an upper insulating sheet made of an insulating material, having an upper insulating sheet hole formed at a position corresponding to the conductive part, and coupled to an upper surface of the inelastic conductive housing.

The conductive part includes a conductive part body placed in the housing hole, and a conductive part upper bump connected to the conductive part body and protruding from an upper surface of the inelastic conductive housing, and the insulating part comprises the conductive part in the housing hole. An insulating part body surrounding the body, and an insulating part upper bump connected to the insulating part body to protrude from an upper surface of the inelastic conductive housing to surround the upper bump of the conductive part.

At least a portion of the upper insulating sheet hole may have a tapered shape such that a width gradually decreases from an upper surface of the upper insulating sheet toward the inelastic conductive housing.

The conductive part includes a conductive part body placed in the housing hole, and a conductive part upper bump connected to the conductive part body and protruding from an upper surface of the inelastic conductive housing, and the insulating part comprises the conductive part in the housing hole. An insulating part body surrounding the body, and an insulating part upper bump connected to the insulating part body to protrude from the upper surface of the inelastic conductive housing and surrounding the upper bump of the conductive part, wherein the uppermost width of the upper insulating sheet hole is the insulating part May be larger than the width of the upper bump.

The test socket according to the present invention may include a ground terminal protruding from a lower surface of the inelastic conductive housing so as to electrically connect the inelastic conductive housing and a ground electrode provided in the tester to contact the ground electrode. have.

The ground terminal may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material.

The inelastic conductive housing may be made of metal.

The conductive part includes a conductive part body placed in the housing hole, and a conductive part lower bump connected to the conductive part body and protruding from a lower surface of the inelastic conductive housing, and the following conditions may be satisfied.

(Lt: the length of the sum of the conductive part body and the conductive part lower bump, Lb: the length of the conductive part lower bump)

The test socket according to the present invention includes; a lower insulating sheet made of an insulating material, having a lower insulating sheet hole formed at a position corresponding to the conductive part, and coupled to a lower surface of the inelastic conductive housing, wherein the The conductive portion may pass through the hole in the lower insulating sheet and connect to the signal electrode of the tester placed under the inelastic conductive housing.

The test socket according to the present invention includes a support frame coupled to one surface of the lower insulating sheet, wherein the lower insulating sheet has a lower insulating sheet guide hole penetrating the lower insulating sheet in a thickness direction, and the support A support frame guide hole connected to the lower insulating sheet guide hole may be provided in the frame.

On the other hand, in the test apparatus according to the present invention for solving the object as described above, in the test apparatus for testing the device under test by connecting a device under test having a terminal to a tester that generates a test signal, the tester A test socket electrically interposed between the tester and the device under test so that a test signal of is transmitted to the device under test; And a pusher that moves to the tester side or moves away from the tester to provide a pressing force capable of pressing the device under test placed on the test socket toward the tester, wherein the test socket penetrates in the thickness direction. An inelastic conductive housing comprising a plurality of housing holes to be formed, an inelastic conductive housing made of an inelastic conductive material, an insulating coating layer coated around at least an upper surface of the inelastic conductive housing and the plurality of housing holes, and a plurality of conductive particles in the elastic insulating material The housing hole so that the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic conductive housing, and the upper end is connected to the terminal of the device under test placed on the upper side of the inelastic conductive housing. It is disposed in, and includes a conductive portion insulated from the inelastic conductive housing by the insulating coating layer.

On the other hand, a test apparatus according to another aspect of the present invention for solving the above-described object is a test apparatus for testing the device under test by connecting a device under test having a terminal to a tester that generates a test signal. A test socket electrically interposed between the tester and the device under test so that a test signal of the tester can be transmitted to the device under test; And a pusher that moves to the tester side or moves away from the tester to provide a pressing force capable of pressing the device under test placed on the test socket toward the tester, wherein the test socket penetrates in the thickness direction. The tester has a plurality of housing holes formed and is made of an inelastic conductive housing made of an inelastic conductive material, and a plurality of conductive particles are contained in an elastic insulating material, and the lower end of the tester is placed under the inelastic conductive housing. A conductive portion disposed in the housing hole to be connected to a signal electrode and connected to a terminal of the device under test placed on the upper side of the inelastic conductive housing, and made of an elastic insulating material, the inelastic conductive housing and the conductive An insulating portion disposed between the portions to insulate the conductive portion from the inelastic conductive housing, and an upper insulating sheet hole made of an insulating material and formed at a position corresponding to the conductive portion, and the upper surface of the inelastic conductive housing It includes an upper insulating sheet to be joined.

The test apparatus according to the present invention may include a buffering unit disposed between the pusher and the device under test so that the pusher can buffer a pressure applied to the device under test.

On the other hand, in the manufacturing method of the test socket according to the present invention for solving the above-described object, in the manufacturing method of the test socket electrically mediating a tester generating a test signal and a device under test having a terminal, (a ) Preparing an inelastic conductive member made of an inelastic conductive material; (b) forming a plurality of housing holes penetrating the inelastic conductive member in the thickness direction in the inelastic conductive member to form an inelastic conductive housing; (c) coating at least an upper surface of the inelastic conductive housing and around the plurality of housing holes with an insulating coating layer; And (d) forming a conductive portion including a plurality of conductive particles in an elastic insulating material in the insulating portion hole to be insulated from the inelastic conductive housing by the insulating coating layer.

In the step (c), the insulating coating layer may be formed by a coating method selected from among feralin coating, anodizing treatment, Teflon coating, and liquid silicone coating.

In step (d), the conductive portion may be formed in a shape that satisfies the following conditions.

(Lt: length of the conductive part body placed in the housing hole and the length of the conductive part lower bump that is connected to the conductive part body and protruding from the lower surface of the inelastic conductive housing, Lb: the length of the conductive part lower bump)

In the step (d), a mixture of conductive particles containing a plurality of conductive particles in an elastic insulating material is filled into the plurality of housing holes, and a mold having a plurality of mold holes corresponding to the plurality of housing holes is prepared. And, filling the plurality of mold holes with the conductive particle mixture, and coupling the mold to the lower surface of the inelastic conductive housing so that the plurality of mold holes correspond to the plurality of housing holes on a one-to-one basis, and the housing It may include the step of integrally curing the hole and the conductive particle mixture filled in the mold hole.

In the method of manufacturing a test socket according to the present invention, after the step (a), a plurality of conductive particles are included in an elastic insulating material, and the inelastic conductive housing and the ground electrode provided in the tester are electrically And forming a ground terminal protruding from the lower surface of the inelastic conductive housing so as to be connected to the ground electrode on the lower surface of the inelastic conductive housing.

The test apparatus according to the present invention electrically connects the tester and the device under test using a test socket including an inelastic conductive housing made of an inelastic conductive material supporting a plurality of conductive parts, so that the pressing force of the pusher is between the device under test and the test socket. And evenly applied between the test socket and the tester.

Further, in the test apparatus according to the present invention, when the pusher presses the device under test, the bump of the conductive part of the conductive part protruding from the lower surface of the inelastic conductive housing is elastically deformed to provide a stroke required to connect the terminal of the device under test to the tester I can. Therefore, there is little difficulty in stroke control due to the thickness tolerance of the stroke limiting part, the thickness tolerance of the stopper part of the test socket, the height tolerance of the test socket, and the thickness tolerance of the device under test, as in the prior art using the rubber socket type test socket. , Precise control of the stroke is possible.

In addition, the test socket according to the present invention has a coaxial cable structure because an insulating portion is wrapped around a conductive portion transmitting a signal, and an inelastic conductive housing is wrapped around the insulating portion. Accordingly, high-frequency signal transmission characteristics are excellent, and high-frequency signal interference between conductive parts is small, so that signal transmission loss can be minimized.

In addition, the test socket according to the present invention is advantageous for high-speed signal transmission because characteristic impedance matching is possible by adjusting the diameter of the conductive part or the distance between the conductive part and the inelastic conductive housing.

1 is a front view showing a test apparatus according to an embodiment of the present invention.
2 is a front cross-sectional view showing a test socket provided in a test apparatus according to an embodiment of the present invention.
3 is a plan cross-sectional view showing a part of a test socket provided in a test apparatus according to an embodiment of the present invention.
4 is for explaining the operation of the test apparatus according to an embodiment of the present invention.
5 is a front view showing a test apparatus according to another embodiment of the present invention.
6 is a front cross-sectional view showing a test socket provided in the test apparatus shown in FIG. 5.
7 is for explaining the operation of the test apparatus shown in FIG. 5.
8 is a front cross-sectional view showing a test socket according to another embodiment of the present invention.
9 and 10 show the manufacturing process of the test socket shown in FIG.
11 to 18 show various modifications of the test socket.

Hereinafter, a test socket according to the present invention, a test apparatus including the same, and a method of manufacturing the test socket will be described in detail with reference to the drawings.

1 is a front view showing a test device according to an embodiment of the present invention, Figure 2 is a front cross-sectional view showing a test socket provided in the test device according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention It is a top cross-sectional view showing a part of a test socket provided in a test apparatus according to an example.

As shown in the drawing, the test apparatus 100 according to an embodiment of the present invention connects the device under test 10 having the terminal 11 to the tester 20 that generates a test signal, so that the device under test 10 ) To test, and press the test socket 110 electrically between the tester 20 and the device under test 10, and the device under test 10 placed on the test socket 110 toward the tester 20 It includes a pusher 130 for doing.

The test socket 110 penetrates the inelastic conductive housing 112 having a plurality of housing holes 113, the insulating coating layer 116 coated on the inelastic conductive housing 112, and the inelastic conductive housing 112 in the thickness direction. It includes a plurality of conductive parts 120 arranged in the plurality of housing holes 113 so as to be.

The inelastic conductive housing 112 is made of an inelastic conductive material. As the inelastic conductive material constituting the inelastic conductive housing 112, a conductive metal such as aluminum, copper, brass, SUS, iron, nickel, or various materials having conductivity and inelastic properties may be used. The plurality of housing holes 113 provided in the inelastic conductive housing 112 are formed to penetrate the inelastic conductive housing 112 in the thickness direction. As shown, the support frame 114 may be coupled to the inelastic conductive housing 112.

The insulating coating layer 116 is coated on the inelastic conductive housing 112 in the form of a thin film having an even thickness. The insulating coating layer 116 is coated around at least the upper surface of the inelastic conductive housing 112 and around the plurality of housing holes 113. The insulating coating layer 116 coated on the upper surface of the inelastic conductive housing 112 may insulate between the inelastic conductive housing 112 and the device under test 10 disposed thereon. The insulating coating layer 116 coated around the housing hole 113 insulates the conductive part 120 disposed in the housing hole 113 from the inelastic conductive housing 112. The insulating coating layer 116 may be coated on the inelastic conductive housing 112 by a coating method selected from among feralin coating, anodizing treatment, Teflon coating, and liquid silicone coating.

Ferralin coating is a method of forming a polymer-type insulating film using a powdery dimer using chemical vapor deposition (CVD), and using this method, the insulating coating layer 116 is formed on the inelastic conductive housing 112. I can. The paralin coating method is a process in which a powdery dimer is evaporated by heat, a process in which the evaporated dimer is converted into a gaseous state through a pyrolysis unit, a process in which a dimer in a gaseous state is cooled before it diffuses into the vacuum chamber, and cooling The resulting gas particles may be polymerized in a vacuum chamber and coated on the surface of the object in the form of a film. Since the polymerization reaction of the parolin coating occurs at a very low pressure and at room temperature, thermal stress is not generated on the surface of the object to be treated. Unlike the wet coating method, the paralin coating is coated even in fine gaps, and a uniform insulating film can be formed regardless of the shape of sharp needles, holes, corners, corners, and fine holes.

Among the anodizing treatment techniques, the hard anodizing method is a method of converting the surface of an aluminum metal into alumina ceramic using an electrochemical method, and the insulating coating layer 116 can be formed on the inelastic conductive housing 112 by using this hard anodizing method. have. When aluminum metal is subjected to hard anodizing, the aluminum metal itself is oxidized and turned into alumina ceramic. Alumina ceramics have excellent wear resistance, do not cause peeling problems like plating or painting, and have excellent electrical insulation.

Teflon coating is a method of coating a material such as metal by making a fluorocarbon resin as a paint, and it is possible to form the insulating coating layer 116 on the inelastic conductive housing 112 by using such Teflon coating. The insulating coating layer 116 coated on the inelastic conductive housing 112 through the Teflon coating has insulating properties.

In the case of using the liquid silicone coating method, by immersing the inelastic conductive housing 112 in the liquid silicone liquid, the insulating coating layer 116 made of a silicone film can be formed on the inelastic conductive housing 112.

In addition, various other methods can be used to form the insulating coating layer 116 on the inelastic conductive housing 112.

As shown, the insulating coating layer 116 disposed on the upper surface of the inelastic conductive housing 112 insulates between the device under test 10 and the inelastic conductive housing 112, and is disposed on the lower surface of the inelastic conductive housing 112 The insulating coating layer 116 insulates the tester 20 and the inelastic conductive housing 112. In addition, the insulating coating layer 116 disposed around the housing hole 113 of the inelastic conductive housing 112 may insulate between the conductive portion 120 and the inelastic conductive housing 112.

The conductive part 120 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material so as to be connected to the signal electrode 21 of the tester 20 and the terminal 11 of the device under test 10. The conductive part 120 is disposed in the insulating part hole 119 to penetrate the inelastic conductive housing 112 in the thickness direction. The conductive part 120 contacts the insulating coating layer 116 disposed around the housing hole 113 and is insulated from the inelastic conductive housing 112 by the insulating coating layer 116.

The conductive part 120 is disposed in the insulating part hole 119, so that the lower end is connected to the signal electrode 21 of the tester 20 placed under the inelastic conductive housing 112, and the upper end is connected to the inelastic conductive housing 112 It can be connected to the terminal 11 of the device under test 10 placed on the upper side of.

The elastic insulating material constituting the conductive part 120 is a heat-resistant polymer material having a crosslinked structure, for example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylic. Nitrile-butadiene copolymer rubber, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene -Diene copolymer rubber, soft liquid epoxy rubber, etc. may be used.

In addition, the conductive particles constituting the conductive part 120 may be those having magnetism so as to react by a magnetic field. For example, as conductive particles, particles of metals exhibiting magnetism such as iron, nickel, cobalt, or alloy particles thereof, or particles containing these metals, or particles containing these metals, are used as core particles, and the surface of the core particles is gold , Silver, palladium, radium, etc. plated with good conductivity metal, or non-magnetic metal particles, inorganic particles such as glass beads, and polymer particles as core particles, and conductivity of nickel and cobalt on the surface of the core particles A magnetic material plated, or a core particle plated with a conductive magnetic material and a metal having good conductivity, may be used.

In the test socket 110, the inelastic conductive housing 112 supports a plurality of conductive parts 120 electrically connecting the signal electrode 21 of the tester 20 and the terminal 11 of the device under test 10. By doing so, the inelastic conductive housing 112 comes into contact with the tester 20 when it is pressed toward the tester 20 by the pusher 130 to function as a stopper.

Accordingly, there is little difficulty in stroke control due to the thickness tolerance of the stroke limiting part, the thickness tolerance of the stopper part of the test socket, the height tolerance of the test socket, and the thickness tolerance of the device under test, as in the conventional rubber socket type test socket.

In addition, in the test socket 110 according to an embodiment of the present invention, as shown in FIG. 3, an insulating coating layer 116 surrounds the conductive part 120 for transmitting a signal, and the circumference of the insulating coating layer 116 is inelastic. Since the conductive housing 112 is enclosed, a coaxial cable structure is taken. Accordingly, high-frequency signal transmission characteristics are excellent, and high-frequency signal interference between the conductive parts 120 is small, so that signal transmission loss can be minimized.

In addition, since the test socket 110 according to an embodiment of the present invention is capable of matching the characteristic impedance by adjusting the diameter of the conductive part 120 or the distance between the conductive part 120 and the inelastic conductive housing 112, high speed It is advantageous for signal transmission.

The pusher 130 provides a pressing force capable of pressing the device under test 10 disposed on the test socket 110 toward the tester 20 by moving to approach the tester 20 side or away from the tester 20. . The pusher 130 may be moved by receiving a moving force from a driving unit (not shown).

The lower side of the pusher 130 is provided with a pressing unit 140 and a buffer unit 150, and the pusher 130 can pressurize the device under test 10 through the pressing unit 140 and the buffer unit 150. have. The pressing unit 140 contacts the upper surface of the device under test 10 and transmits the pressing force of the pusher 130 to the device under test 10. The buffer unit 150 serves to buffer the pressure applied by the pusher 130 to the device under test 10. The buffer unit 150 may be made of a material having elasticity such as rubber or silicon, or may take various structures capable of absorbing shock, such as a structure including a spring.

The load applied by the pusher 130 to the device under test 10, the test socket 110, and the tester 20 when the pressing part 140 presses the device under test 10 due to the buffering action of the buffer part 150 This can be limited to not excessive. Accordingly, damage or damage to the device under test 10, the test socket 110, or the tester 20 due to excessive pressing force can be prevented.

As shown in FIG. 4, when the pusher 130 presses the device under test 10 toward the test socket 110 through the pressing part 140 and the buffer part 150, the terminal of the device under test 10 ( 11) is crimped to the upper end of the conductive part 120 and the lower end of the conductive part 120 is crimped to the signal electrode 21 of the tester 20. In this case, a test signal generated from the tester 20 is transmitted to the device under test 10 through the test socket 110 to perform an electrical test on the device under test 10.

When the terminal 11 of the device under test 10 is pressed against the conductive portion 120 of the test socket 110, the conductive portion 120 has an elastic force, so that the terminal 11 resiliences the conductive portion 120 It is possible to enter the housing hole 113 while being deformed. At this time, the lower surface of the device under test 10 may come into contact with the upper surface of the inelastic conductive housing 112. Then, the lower surface of the inelastic conductive housing 112 comes into contact with the upper surface of the tester 20 by the pressing force that the device under test 10 presses the test socket 110. As the lower surface of the inelastic conductive housing 112 contacts the upper surface of the tester 20, the stroke does not increase further.

In this way, the lower surface of the device under test 10 contacts the upper surface of the inelastic conductive housing 112 and presses the test socket 110 toward the tester 20, so that the pressing force applied to the device under test 10 is applied to the test socket ( 110) It can be evenly transmitted to the whole, and the plurality of conductive parts 120 can maintain a contact state with the plurality of signal electrodes 21 and the plurality of terminals 11 with uniform adhesion as a whole. Therefore, since the plurality of signal electrodes 21 and the plurality of terminals 11 can maintain a stable connection state through the test socket 110, a stable test is possible without signal transmission loss.

On the other hand, while the pusher 130 presses the device under test 10 toward the tester 20, after the lower surface of the test socket 110 touches the tester 20, the buffer unit 150 is elastically deformed to further stroke. Is not authorized. In addition, since the buffer unit 150 buffers the pressing force of the pusher 130, damage or damage to the device under test 10, the test socket 110, or the tester 20 due to excessive pressing force may be prevented.

After the lower surface of the inelastic conductive housing 112 contacts the tester 20, a sensor capable of sensing the pressing force in addition to the method of using the buffer unit 150 to prevent excessive pressing force from being applied to the device under test 10 It is also possible to feedback control the pusher 130 by installing. In addition, a method of using a pneumatic cylinder capable of pressure control or a method of controlling a motor capable of sensing pressing force may be used to prevent excessive pressing force from being applied to the device under test 10.

As described above, the test apparatus 100 according to an embodiment of the present invention uses a test socket 110 including an inelastic conductive housing 112 made of an inelastic conductive material supporting the plurality of conductive parts 120. By electrically connecting the tester 20 and the device under test 10, the pressing force of the pusher 130 is between the device under test 10 and the test socket 110 and between the test socket 110 and the tester 20. It can be applied evenly.

In addition, in the test apparatus 100 according to an embodiment of the present invention, the inelastic conductive housing 112 of the test socket 110 serves as a stopper. Therefore, there is little difficulty in stroke control due to the thickness tolerance of the stroke limiting part, the thickness tolerance of the stopper part of the test socket, the height tolerance of the test socket, and the thickness tolerance of the device under test, as in the prior art using the rubber socket type test socket. , Precise control of the stroke is possible. In addition, the life characteristics of the test socket 110 may be improved by precise control of the stroke.

Meanwhile, FIG. 5 is a front view showing a test apparatus according to another embodiment of the present invention, and FIG. 6 is a front cross-sectional view showing a test socket provided in the test apparatus shown in FIG. 5.

The test apparatus 200 shown in FIG. 5 includes a test socket 210 that electrically communicates the tester 20 and the device under test 10, and the device under test 10 placed on the test socket 210. ) A pusher 130 for pressing the side, and a pressing unit 140 and a buffer unit 150 for transmitting the pressing force of the pusher 130 to the device under test 10 between the pusher 130 and the device under test 10 ). Here, the pusher 130, the pressing unit 140, and the buffer unit 150 are the same as described above.

The test socket 210 includes an inelastic conductive housing 112 having a plurality of housing holes 113, an insulating coating layer 116 coated on the inelastic conductive housing 112, and a plurality of housing holes 113, respectively. A plurality of insulating parts 212, a plurality of conductive parts 216 supported by the insulating part 212 so as to penetrate the inelastic conductive housing 112 in the thickness direction, and a ground disposed on the lower surface of the inelastic conductive housing 112 It includes a terminal 220 and a lower insulating sheet 222. Here, the inelastic conductive housing 112 and the insulating coating layer 116 are the same as described above.

The insulating part 212 includes an insulating part body 213 placed in the housing hole 113 and an insulating part lower bump 214 extending downward from the insulating part body 213 so as to protrude from the lower surface of the inelastic conductive housing 112. Includes. The insulating part 212 contacts the insulating coating layer 116 in the housing hole 113. An insulating part hole 215 parallel to the housing hole 113 is provided inside the insulating part 212.

The conductive part 216 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material so as to be connected to the signal electrode 21 of the tester 20 and the terminal 11 of the device under test 10. The conductive part 216 is supported by the insulating part 212 and disposed in the housing hole 113 to penetrate the inelastic conductive housing 112 in the thickness direction.

The conductive part 216 includes a conductive part body 217 located in the housing hole 113 and a conductive part lower bump 218 that is connected to the conductive part body 217 and protrudes from the lower surface of the inelastic conductive housing 112. Include. The conductive part body 217 is surrounded by the insulating part body 213 of the insulating part 212, and the conductive part lower bump 218 is surrounded by the insulating part lower bump 214 of the insulating part 212.

The ground terminal 220 protrudes from the lower surface of the inelastic conductive housing 112 so as to contact the ground electrode 22 provided in the tester 20. The ground terminal 220 electrically connects the inelastic conductive housing 112 and the ground electrode 22 provided in the tester 20.

The ground terminal 220 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material, such as the conductive part 216, or may be formed of another conductive material.

The lower insulating sheet 222 is made of an insulating material and covers the lower surface of the inelastic conductive housing 112. The lower insulating sheet 222 is formed with a plurality of lower insulating sheet holes 223 into which the conductive part 216 or the ground terminal 220 is inserted. The lower insulating sheet 222 serves to prevent a short-circuit defect in which the lower surface of the inelastic conductive housing 112 and the signal electrode 21 of the tester 20 come into contact.

In the test socket 210, the inelastic conductive housing 112 supports a plurality of conductive parts 216 electrically connecting the signal electrode 21 of the tester 20 and the terminal 11 of the device under test 10. Accordingly, only the insulating lower bump 214 and the conductive lower bump 218 protruding from the lower surface of the inelastic conductive housing 112 when pressed toward the tester 20 by the pusher 130 can be elastically deformed.

Accordingly, there is little difficulty in stroke control due to the thickness tolerance of the stroke limiting part, the thickness tolerance of the stopper part of the test socket, the height tolerance of the test socket, and the thickness tolerance of the device under test, as in the conventional rubber socket type test socket.

As shown in Fig. 7, when the pusher 130 presses the device under test 10 toward the test socket 210 through the pressing part 140 and the buffer part 150, the lower surface of the device under test 10 is The inelastic conductive housing 112 comes into contact with the upper surface, and the insulating lower bump 214 and the conductive lower bump 218 are compressed until the inelastic conductive housing 112 contacts the tester 20. Further, the ground terminal 220 is connected to the ground electrode 22 of the tester 20 so that the inelastic conductive housing 112 is grounded. In this way, since the test socket 210 is grounded, noise is not generated between the plurality of conductive parts 216 provided in the test socket 210, and signal transmission efficiency may be improved.

Meanwhile, FIG. 8 is a front cross-sectional view showing a test socket according to another embodiment of the present invention.

The test socket 230 shown in FIG. 8 includes an inelastic conductive housing 112 having a plurality of housing holes 113, an insulating coating layer 116 coated on the inelastic conductive housing 112, and a plurality of housing holes 113. It includes a plurality of conductive portions 232 disposed in each of the inelastic conductive housing 112 in the thickness direction. Here, the inelastic conductive housing 112 and the insulating coating layer 116 are the same as described above.

The conductive part 232 may be formed in a form in which a plurality of conductive particles are included in the elastic insulating material so as to be connected to the signal electrode 21 of the tester 20 and the terminal 11 of the device under test 10. The conductive part 232 may be disposed in the housing hole 113 to penetrate the inelastic conductive housing 112 in the thickness direction.

The conductive part 232 includes a conductive part body 233 located in the housing hole 113 and a conductive part lower bump 234 connected to the conductive part body 233 and protruding from the lower surface of the inelastic conductive housing 112. Include.

This test socket 230 may be manufactured in the same manner as shown in FIGS. 9 and 10.

First, as shown in Fig. 9A, an inelastic conductive member 240 made of an inelastic conductive material is prepared.

Next, as shown in (b) of FIG. 9, a plurality of housing holes 113 penetrating the inelastic conductive member 240 in the thickness direction are formed in the inelastic conductive member 240 to form the inelastic conductive housing 112. To form.

Next, as shown in FIG. 9C, an insulating coating layer 116 is coated on the inelastic conductive housing 112. As a method of coating the insulating coating layer 116 on the inelastic conductive housing 112, a ferrule coating, anodizing treatment, Teflon coating, liquid silicone coating method, and the like as described above may be used.

Next, as shown in (d) of FIG. 9, the plurality of housing holes 113 are filled with a conductive particle mixture 40 containing conductive particles in an elastic insulating material. The conductive particle mixture 40 may be pressed into the housing hole 113 in a paste state having fluidity.

Next, as shown in FIG. 10A, a mold 30 having a plurality of mold holes 31 corresponding to the housing hole 113 of the inelastic conductive housing 112 is prepared, and a plurality of mold holes (31) is filled with the conductive particle mixture (40). The conductive particle mixture 40 may be pressed into the mold hole 31 in a paste state having fluidity.

Next, as shown in FIG. 10B, the mold 30 in which the conductive particle mixture 40 is disposed is coupled to the inelastic conductive housing 112 filled with the conductive particle mixture 40. In this case, the mold 30 is coupled to the inelastic conductive housing 112 so that the plurality of mold holes 31 correspond to the plurality of housing holes 113 on a one-to-one basis. In addition, a curing process is performed while the conductive particle mixture 40 disposed in the housing hole 113 is connected to the conductive particle mixture 40 disposed in the mold 30. As a method of curing the conductive particle mixture 40, various methods may be used depending on the characteristics of the conductive particle mixture 40, such as a method of heating to a certain temperature and then cooling to room temperature.

A conductive part including a conductive part body 233 disposed in the housing hole 113 and a conductive part lower bump 234 disposed in the mold hole 31 by curing the conductive particle mixture 40 through a curing process ( 232) is formed.

Next, as shown in Fig. 10C, by removing the mold 30, the test socket 230 can be completed.

In the method of manufacturing the test socket 230, a process of applying a magnetic field to the conductive particle mixture 40 may be performed before curing the conductive particle mixture 40. When a magnetic field is applied to the conductive particle mixture 40, the conductive particles dispersed in the elastic insulating material are oriented in the thickness direction of the inelastic conductive housing 112 under the influence of the magnetic field, thereby forming an electrical path.

In addition, in the manufacturing method of the test socket 230, the conductive part body 233 of the conductive part 232 and the conductive part lower bump 234 may be formed simultaneously in one mold.

Meanwhile, FIGS. 11 to 18 show various modifications of the test socket.

First, the test socket 240 shown in FIG. 11 includes an inelastic conductive housing 112 having a plurality of housing holes 113, an insulating coating layer 116 coated on the inelastic conductive housing 112, and a plurality of housing holes ( 113), and each includes a plurality of conductive portions 232 passing through the inelastic conductive housing 112 in the thickness direction.

Compared with the test socket 230 shown in FIG. 8, the test socket 240 has an insulating coating layer 116 formed on a part of the inelastic conductive housing 112. That is, the insulating coating layer 116 is formed on the upper surface of the inelastic conductive housing 112 and around the plurality of housing holes 113.

The conductive part 232 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material, and includes a conductive part body 233 and a conductive part lower bump 234.

The conductive part 232 has the following structural features.

Here, Lt is a length obtained by adding the conductive part body 233 and the conductive part lower bump 234, and Lb indicates the length of the conductive part lower bump 234.

The conductive portion 232 having such a structure can smoothly provide a stroke required to connect the terminal 11 of the device under test 10 to the tester 20. In addition, the conductive portion 232 including the conductive portion lower bump 234 is advantageous in preventing damage to the device under test 10 by distributing the load when the terminal 11 of the device under test 10 contacts. Do.

That is, the lower bump 234 of the conductive part protruding from the lower surface of the inelastic conductive housing 112 has a relatively high degree of freedom because there is no part of the inelastic conductive housing 112 or the insulating part that holds it. Therefore, if the length of the lower bump 234 of the conductive part is designed to have an appropriate length, a minute movement of the test socket 230 may be induced when the device under test 10 contacts. In addition, when the test socket 230 moves finely up, down, front, back, left and right when the device under test 10 is in contact, the load according to the contact of the device under test 10 is distributed and the impact is buffered.

The length of the lower bump 234 of the conductive part may be appropriately determined according to the width or number of the conductive parts 232. If the length of the lower bump 234 of the conductive part is too short, fine movement of the test socket 230 cannot be induced, and if the length of the lower bump 234 of the conductive part is too long, there is a problem that durability is deteriorated. Accordingly, as described above, the length of the lower bump 234 of the conductive part is preferably determined to satisfy the following condition.

When the ratio of the length Lb of the conductive part lower bump 234 to the length Lt of the conductive part body 233 and the conductive part lower bump 234 is less than 0.05, the terminal 11 of the device under test 10 It is difficult to provide a smooth stroke required to connect) to the tester 20, and it is not possible to induce fine movement of the test socket 230, so there is no effect of distributing the load.

On the other hand, when the ratio of the length Lb of the conductive part lower bump 234 to the length Lt of the sum of the conductive part body 233 and the conductive part lower bump 234 exceeds 0.5, the test socket 230 There is a problem that durability is poor and the life of the product is shortened. That is, if the length (Lb) of the lower bump 234 of the conductive part is too long, the lower bump 234 of the conductive part is bent when the device 10 is in contact with each other, resulting in short failure. Otherwise, the bump 234 under the conductive part may be damaged.

The test socket 250 shown in FIG. 12 includes an inelastic conductive housing 112 having a plurality of housing holes 113, an insulating coating layer 116 coated on the inelastic conductive housing 112, and a plurality of housing holes 113. It includes a plurality of conductive portions 252 disposed in each of the inelastic conductive housing 112 in the thickness direction.

Compared with the test socket 240 shown in FIG. 11, the test socket 250 has a slightly modified structure of the conductive part 252. The conductive part 252 has a structure without bumps under the conductive part.

The test socket 260 shown in FIG. 13 includes an inelastic conductive housing 262 having a plurality of housing holes 263, an insulating coating layer 116 coated on the inelastic conductive housing 262, and a plurality of housing holes 263. It includes a plurality of conductive portions 267 disposed in each of the inelastic conductive housings 262 in the thickness direction. Here, the insulating coating layer 116 is the same as described above.

The inelastic conductive housing 262 is made of an inelastic conductive material as described above. The plurality of housing holes 263 are formed to penetrate the inelastic conductive housing 262 in the thickness direction. The housing hole 263 has a housing lower hole 264 extending upward from the lower surface of the inelastic conductive housing 262 with a constant width, and the housing lower hole 264 extending downward from the upper surface of the inelastic conductive housing 262. It includes a housing upper hole 265 to be connected. The housing upper hole 265 has a tapered shape whose width gradually decreases from the upper surface of the inelastic conductive housing 262 to the lower side.

The conductive part 267 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material, and is disposed in the housing hole 263 to be insulated by the insulating coating layer 116. The conductive part 267 includes a conductive part body 268 located in the housing lower hole 264 and a conductive part upper bump 269 connected to the conductive part body 268 and located in the housing upper hole 265 do. The width of the conductive part body 268 and the conductive part upper bump 269 is the same as the width of the lower housing hole 264. Accordingly, a space is provided between the upper bump 269 of the conductive part and the inelastic conductive housing 262.

Since the test socket 260 is disposed in the upper hole 265 of the housing in which the conductive part upper bump 269 is tapered, when the device under test 10 approaches the test socket 260, the device under test 10 The terminal 11 of may more stably contact the upper bump 269 of the conductive part. And when the device under test 10 approaches the test socket 260, the terminal 11 of the device under test 10 comes into contact with the inelastic conductive housing 262 to reduce the problem that the terminal 11 is damaged. have.

The test socket 310 shown in FIG. 14 includes an inelastic conductive housing 312 having a plurality of housing holes 313, a plurality of insulating portions 315 respectively disposed in the plurality of housing holes 313, and an inelastic conductive housing. A plurality of conductive parts 320 supported by the insulating part 315 so as to penetrate 312 in the thickness direction, and a ground terminal 324 and a lower insulating sheet 326 disposed on the lower surface of the inelastic conductive housing 312 Include.

The insulating part 315 includes an insulating part body 316 placed in the housing hole 313 and an insulating part lower bump 317 extending downward from the insulating part body 316 so as to protrude from the lower surface of the inelastic conductive housing 312. Includes. An insulating part hole 318 parallel to the housing hole 313 is provided inside the insulating part 315.

The conductive part 320 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material. The conductive part 320 is supported by the insulating part 315 and disposed in the housing hole 313 to penetrate the inelastic conductive housing 312 in the thickness direction.

The conductive part 320 includes a conductive part body 321 located in the housing hole 313 and a conductive part lower bump 322 connected to the conductive part body 321 and protruding from the lower surface of the inelastic conductive housing 312. Include. The conductive part body 321 is surrounded by the insulating part body 316, and the conductive part lower bump 322 is surrounded by the insulating part lower bump 317.

The ground terminal 324 protrudes from the lower surface of the inelastic conductive housing 312 so as to contact the ground electrode 22 provided in the tester 20. The ground terminal 324 electrically connects the inelastic conductive housing 312 and the ground electrode 22 provided in the tester 20.

The ground terminal 324 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material, such as the conductive part 320, or may be formed of another conductive material.

The lower insulating sheet 326 is made of an insulating material and covers the lower surface of the inelastic conductive housing 312. The lower insulating sheet 326 serves to prevent a short-circuit defect in which the lower surface of the inelastic conductive housing 312 and the signal electrode 21 of the tester 20 come into contact. The lower insulating sheet 326 is formed with a plurality of lower insulating sheet holes 327 into which the conductive part 320 or the ground terminal 324 is inserted. In addition, the lower insulating sheet 326 is provided with a lower insulating sheet guide hole 328 penetrating the lower insulating sheet 326 in the thickness direction. Guide pins for coupling the test socket 310 with other members may be inserted into the lower insulating sheet guide hole 328. The test socket 310 and other members such as the guide housing may be coupled in an aligned state by inserting the guide pin into the lower insulating sheet guide hole 328.

A support frame 330 is coupled to one surface of the lower insulating sheet 326. The support frame 330 is provided with a support frame guide hole 331 connected to the lower insulating sheet guide hole 328.

The test socket 340 shown in FIG. 15 includes an inelastic conductive housing 312 having a plurality of housing holes 313, a plurality of insulating portions 315 respectively disposed in the plurality of housing holes 313, and an inelastic conductive housing. A plurality of conductive parts 320 supported by the insulating part 315 so as to penetrate 312 in the thickness direction, a ground terminal 324 and a lower insulating sheet 326 disposed on the lower surface of the inelastic conductive housing 312 , And a support frame 330 coupled to one surface of the lower insulating sheet 326, and an upper insulating sheet 342 disposed on the upper surface of the inelastic conductive housing 312. The test socket 310 further includes an upper insulating sheet 342 compared to the test socket 310 shown in FIG. 14, and the rest of the configuration is the same as described above.

The upper insulating sheet 342 is made of an insulating material and includes a plurality of upper insulating sheet holes 343 formed at positions corresponding to the plurality of conductive parts 320. The upper insulating sheet 342 may insulate between the inelastic conductive housing 312 and the device under test 10 disposed thereon.

The test socket 350 shown in FIG. 16 includes an inelastic conductive housing 312 having a plurality of housing holes 313, a plurality of insulating portions 352 respectively disposed in the plurality of housing holes 313, and an inelastic conductive housing. A plurality of conductive parts 357 supported by the insulating part 352 so as to penetrate 312 in the thickness direction, a ground terminal 324 and a lower insulating sheet 326 disposed on the lower surface of the inelastic conductive housing 312 , And an upper insulating sheet 342 disposed on the upper surface of the inelastic conductive housing 312. Compared with the test socket 350 shown in FIG. 15, the test socket 350 has a modified structure of the insulating part 352 and the conductive part 357, and the remaining configurations are the same as described above.

The insulating portion 352 includes an insulating portion body 353 placed in the housing hole 313 and an insulating portion lower bump 354 extending downward from the insulating portion body 353 so as to protrude from the lower surface of the inelastic conductive housing 312. And, it includes an insulating portion upper bump 355 extending upwardly from the insulating portion body 353 so as to protrude from the upper surface of the inelastic conductive housing 312. An insulating part hole 356 parallel to the housing hole 313 is provided inside the insulating part 352. The insulating upper bump 355 is located in the upper insulating sheet hole 343 of the upper insulating sheet 342.

The conductive part 357 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material. The conductive part 357 includes a conductive part body 358 located in the housing hole 313, a conductive part lower bump 359 connected to the conductive part body 358 and protruding from the lower surface of the inelastic conductive housing 312. , And a conductive part upper bump 360 connected to the conductive part body 358 and protruding from the upper surface of the inelastic conductive housing 312. The conductive part body 358 is surrounded by the insulating part body 353 of the insulating part 352, the conductive part lower bump 359 is surrounded by the insulating part lower bump 354, and the conductive part upper bump ( 360 is surrounded by the upper bump 355 of the insulating part.

The test socket 370 shown in FIG. 17 includes an inelastic conductive housing 372 having a plurality of housing holes 373, a plurality of insulating portions 375 respectively disposed in the plurality of housing holes 373, and an inelastic conductive housing. A plurality of conductive parts 377 supported by the insulating part 375 so as to penetrate 372 in the thickness direction, and an upper insulating sheet 379 disposed on the upper surface of the inelastic conductive housing 372.

The conductive part 377 is made of a mixture of conductive particles including conductive particles in an elastic insulating material. A conductive particle mixture is filled into the plurality of housing holes 373, and a magnet smaller than the width of the housing hole 373 is placed at a position corresponding to each of the housing holes 373 to apply a magnetic field to the conductive particle mixture. 377) can be made. That is, by the magnetic field of the magnet, the conductive particles in the conductive particle mixture are collected at the center of the housing hole 373 and aligned in the thickness direction of the inelastic conductive housing 372 to form the conductive part 377. In addition, only the elastic insulating material remains around the conductive part 377, and the elastic insulating material is cured to form the insulating part 375.

The upper insulating sheet 379 is made of an insulating material and includes a plurality of upper insulating sheet holes 380 formed at positions corresponding to the plurality of conductive parts 377. The upper insulating sheet hole 380 is formed in a tapered shape such that at least a portion of the upper insulating sheet 379 gradually decreases in width from the upper surface of the upper insulating sheet 379 toward the inelastic conductive housing 372. That is, the upper insulating sheet hole 380 is an insulating sheet lower hole 381 extending from the lower surface of the upper insulating sheet 379 to the upper surface of the upper insulating sheet 379 with the same width as the housing hole 373, and the upper insulating sheet. It includes an insulating sheet upper hole 382 extending from the upper surface of the sheet 379 to the lower surface of the upper insulating sheet 379 and connected to the insulating sheet lower hole 381. The insulating sheet upper hole 382 has a tapered shape so that the width gradually decreases from the upper surface of the upper insulating sheet 379 toward the insulating sheet lower hole 381.

Since the test socket 370 has an upper insulating sheet hole 380 in a tapered form, when the device under test 10 approaches the test socket 370, the terminal 11 of the device under test 10 Is guided by the upper insulating sheet 379 to make contact with the conductive part 377 more stably.

The test socket 390 shown in FIG. 18 includes an inelastic conductive housing 372 having a plurality of housing holes 373, a plurality of insulating portions 392 respectively disposed in the plurality of housing holes 373, and an inelastic conductive housing. A plurality of conductive portions 396 supported by the insulating portion 392 so as to penetrate 372 in the thickness direction, and an upper insulating sheet 379 disposed on the upper surface of the inelastic conductive housing 372. Here, the inelastic conductive housing 372 and the upper insulating sheet 379 are as shown in FIG. 17.

The insulating portion 392 includes an insulating portion body 393 placed in the housing hole 373 and an insulating portion upper bump 394 extending upward from the insulating portion body 393 so as to protrude from the upper surface of the inelastic conductive housing 372. Includes. The insulating part upper bump 394 is located in the insulating sheet upper hole 382 of the upper insulating sheet 379. The uppermost width of the upper insulating sheet hole 380 is greater than the width of the upper bump 394 of the insulating part, so a space is provided between the upper insulating sheet 379 and the upper bump 394 of the insulating part.

The conductive part 396 may be formed in a form in which a plurality of conductive particles are included in an elastic insulating material. The conductive part 396 includes a conductive part body 397 located in the housing hole 373 and a conductive part upper bump 398 connected to the conductive part body 397 and protruding from the upper surface of the inelastic conductive housing 372. Include. The conductive part body 397 is surrounded by the insulating part body 393 of the insulating part 392, and the conductive part upper bump 398 is surrounded by the insulating part upper bump 394.

The present invention has been described with a preferred example, but the scope of the present invention is not limited to the form described and illustrated above.

For example, the insulating coating layer coated on the inelastic conductive housing may be formed only on the upper surface of the inelastic conductive housing and around the housing hole, or may be formed only around the housing hole.

In addition, the pressure transmission structure in which the pressing force of the pusher 130 is transmitted to the device under test 10 is not limited to the illustrated one and may be variously changed.

Above, the present invention has been shown and described in connection with a preferred embodiment for illustrating the principle of the present invention, but the present invention is not limited to the configuration and operation as shown and described as such. Rather, it will be well understood by those skilled in the art that many changes and modifications may be made to the present invention without departing from the spirit and scope of the appended claims.

100, 200: test device
110, 210, 230, 240, 250, 260, 310, 340, 350, 370, 390: Test socket
112, 262, 312, 372: inelastic conductive housing
116: insulating coating layer
120, 216, 232, 252, 267, 320, 357, 377, 396: conductive part
130: pusher 140: pressing part
150: buffer part 212, 315, 352, 375, 392: insulation part
222, 326: lower insulating sheet 342, 379: upper insulating sheet

Claims (22)

In the test socket that electrically mediates a tester for generating a test signal and a device under test having a terminal,
An inelastic conductive housing made of an inelastic conductive material and having a plurality of housing holes formed through the thickness direction;
An insulating coating layer coated on at least an upper surface of the inelastic conductive housing and around the plurality of housing holes; And
The device under test in which a plurality of conductive particles are contained in an elastic insulating material, a lower end is connected to a signal electrode of the tester placed on a lower side of the inelastic conductive housing, and an upper end is placed on an upper side of the inelastic conductive housing. And a conductive portion disposed in the housing hole so as to be connected to the terminal of, and insulated from the inelastic conductive housing by the insulating coating layer.
The method of claim 1,
The test socket, characterized in that the insulating coating layer is coated on the entire inelastic conductive housing.
The method according to claim 1 or 2,
The insulating coating layer is a test socket, characterized in that formed by a coating method selected from feralin coating, anodizing treatment, Teflon coating, and liquid silicone coating.
The method according to claim 1 or 2,
The housing hole has a housing lower hole extending upward from the lower surface of the inelastic conductive housing with a constant width, and a width gradually decreasing from the upper surface to the lower side of the inelastic conductive housing, and is connected to the housing lower hole. A test socket comprising a housing upper hole.
In the test socket that electrically mediates a tester for generating a test signal and a device under test having a terminal,
An inelastic conductive housing made of an inelastic conductive material and having a plurality of housing holes formed through the thickness direction;
The device under test in which a plurality of conductive particles are contained in an elastic insulating material, a lower end is connected to a signal electrode of the tester placed on a lower side of the inelastic conductive housing, and an upper end is placed on an upper side of the inelastic conductive housing. A conductive part disposed in the housing hole to be connected to the terminal of the terminal;
An insulating part made of an elastic insulating material and disposed between the inelastic conductive housing and the conductive part to insulate the conductive part from the inelastic conductive housing; And
And an upper insulating sheet made of an insulating material, having an upper insulating sheet hole formed at a position corresponding to the conductive part, and coupled to an upper surface of the inelastic conductive housing.
The method of claim 5,
The conductive part includes a conductive part body placed in the housing hole, and a conductive part upper bump connected to the conductive part body and protruding from an upper surface of the inelastic conductive housing,
The insulating part includes an insulating part body surrounding the conductive part body in the housing hole, and an insulating part upper bump connected to the insulating part body so as to protrude from an upper surface of the inelastic conductive housing to surround the conductive part upper bump. Test socket, characterized in that.
The method of claim 5,
The test socket, wherein at least a portion of the upper insulating sheet hole has a tapered shape such that a width gradually decreases from an upper surface of the upper insulating sheet toward the inelastic conductive housing.
The method of claim 7,
The conductive part includes a conductive part body placed in the housing hole, and a conductive part upper bump connected to the conductive part body and protruding from an upper surface of the inelastic conductive housing,
The insulating part includes an insulating part body surrounding the conductive part body in the housing hole, and an insulating part upper bump connected to the insulating part body so as to protrude from an upper surface of the inelastic conductive housing to surround the conductive part upper bump. ,
The test socket, characterized in that the uppermost width of the upper insulating sheet hole is greater than the width of the upper bump of the insulating part.
The method according to claim 1 or 5,
And a ground terminal protruding from a lower surface of the inelastic conductive housing so as to electrically connect the inelastic conductive housing and a ground electrode provided in the tester to contact the ground electrode.
The method of claim 9,
The ground terminal is a test socket, characterized in that formed in a form in which a plurality of conductive particles are contained in an elastic insulating material.
The method according to claim 1 or 5,
The test socket, characterized in that the inelastic conductive housing is made of metal.
The method according to claim 1 or 5,
The conductive part includes a conductive part body placed in the housing hole, and a conductive part lower bump connected to the conductive part body and protruding from a lower surface of the inelastic conductive housing, wherein the following conditions are satisfied: .

(Lt: the length of the sum of the conductive part body and the conductive part lower bump, Lb: the length of the conductive part lower bump)
The method according to claim 1 or 5,
Includes; a lower insulating sheet made of an insulating material, having a lower insulating sheet hole formed at a position corresponding to the conductive part, and coupled to a lower surface of the inelastic conductive housing,
The conductive part passes through the hole in the lower insulating sheet and connects to a signal electrode of the tester placed under the inelastic conductive housing.
The method of claim 13,
Including; a support frame coupled to one surface of the lower insulating sheet,
The lower insulating sheet is provided with a lower insulating sheet guide hole penetrating the lower insulating sheet in a thickness direction,
The test socket, characterized in that the support frame is provided with a support frame guide hole connected to the lower insulating sheet guide hole.
A test apparatus for testing the device under test by connecting a device under test having a terminal to a tester that generates a test signal,
A test socket electrically interposed between the tester and the device under test so that a test signal of the tester can be transmitted to the device under test; And
Including; a pusher that moves to the tester side or moves away from the tester to provide a pressing force capable of pressing the device under test placed on the test socket toward the tester.
The test socket,
An inelastic conductive housing comprising a plurality of housing holes penetrating through the thickness direction and made of an inelastic conductive material,
An insulating coating layer coated around at least an upper surface of the inelastic conductive housing and around the plurality of housing holes,
The device under test in which a plurality of conductive particles are contained in an elastic insulating material, a lower end is connected to a signal electrode of the tester placed on a lower side of the inelastic conductive housing, and an upper end is placed on an upper side of the inelastic conductive housing. And a conductive portion disposed in the housing hole so as to be connected to a terminal of, and insulated from the inelastic conductive housing by the insulating coating layer.
A test apparatus for testing the device under test by connecting a device under test having a terminal to a tester that generates a test signal,
A test socket electrically interposed between the tester and the device under test so that a test signal of the tester can be transmitted to the device under test; And
Including; a pusher that moves to the tester side or moves away from the tester to provide a pressing force capable of pressing the device under test placed on the test socket toward the tester.
The test socket,
An inelastic conductive housing comprising a plurality of housing holes penetrating through the thickness direction and made of an inelastic conductive material,
The device under test in which a plurality of conductive particles are contained in an elastic insulating material, a lower end is connected to a signal electrode of the tester placed on a lower side of the inelastic conductive housing, and an upper end is placed on an upper side of the inelastic conductive housing. A conductive part disposed in the housing hole to be connected to the terminal
An insulating portion made of an elastic insulating material and disposed between the inelastic conductive housing and the conductive portion to insulate the conductive portion from the inelastic conductive housing;
A test apparatus comprising an upper insulating sheet made of an insulating material, having an upper insulating sheet hole formed at a position corresponding to the conductive part, and coupled to an upper surface of the inelastic conductive housing.
The method of claim 15 or 16,
And a buffering unit disposed between the pusher and the device under test so that the pusher can buffer a pressure applied to the device under test.
In the method of manufacturing a test socket electrically mediating a tester generating a test signal and a device under test having a terminal,
(a) preparing an inelastic conductive member made of an inelastic conductive material;
(b) forming a plurality of housing holes penetrating the inelastic conductive member in the thickness direction in the inelastic conductive member to form an inelastic conductive housing;
(c) coating at least an upper surface of the inelastic conductive housing and around the plurality of housing holes with an insulating coating layer; And
(d) forming a conductive part including a plurality of conductive particles in an elastic insulating material in the insulating part hole so as to be insulated from the inelastic conductive housing by the insulating coating layer; and a method of manufacturing a test socket, comprising: .
The method of claim 18,
In the step (c), the method of manufacturing a test socket, characterized in that forming the insulating coating layer by a coating method selected from among feralin coating, anodizing treatment, Teflon coating, and liquid silicone coating.
The method of claim 18,
In the step (d), the method of manufacturing a test socket, characterized in that the conductive portion is formed in a shape satisfying the following conditions.

(Lt: length of the conductive part body placed in the housing hole and the length of the conductive part lower bump that is connected to the conductive part body and protruding from the lower surface of the inelastic conductive housing, Lb: the length of the conductive part lower bump)
The method of claim 20,
The step (d),
Filling the plurality of housing holes with a mixture of conductive particles containing a plurality of conductive particles in an elastic insulating material,
Preparing a mold having a plurality of mold holes corresponding to the plurality of housing holes, and filling the plurality of mold holes with the conductive particle mixture,
Coupling the mold to the lower surface of the inelastic conductive housing so that the plurality of mold holes correspond to the plurality of housing holes on a one-to-one basis;
And integrally curing the mixture of conductive particles filled in the housing hole and the mold hole.
The method of claim 18,
After step (a),
A plurality of conductive particles are included in the elastic insulating material, and protruding from the lower surface of the inelastic conductive housing so as to electrically connect the inelastic conductive housing and the ground electrode provided in the tester to contact the ground electrode. And forming a ground terminal that can be used on a lower surface of the inelastic conductive housing.

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