KR102036105B1 - Data signal transmission connector - Google Patents

Abstract

An objective of the present invention is to provide a signal transmission connector which prevents deformation of a conduction unit and an insulation unit to extend the life of a product and improve signal transfer performance. According to the present invention, the signal transmission connector is connected to an electronic part to transport an electric signal, and comprises: a plurality of conduction units having a plurality of conductive particles aligned in an elastic insulation material in a thickness direction to be connected to a terminal of the electronic part; an insulation unit which is made of an elastic insulation material and surrounds the plurality of conduction units to support the plurality of conduction units to separate the plurality of conduction units from each other; and a guide film coupled to one surface of the insulation unit and provided with film holes at positions corresponding to the plurality of conduction units. The film holes include a plurality of taper holes formed in a shape whose width becomes gradually smaller towards the insulation unit and vertically separated from each other to be arranged in multiple levels. The conduction units include a conduction unit body arranged in the insulation unit, and a conduction unit bump connected to the conduction unit body to be arranged on the film holes to fill one or more taper holes of the film holes.

Description

Signal transfer connector {DATA SIGNAL TRANSMISSION CONNECTOR}

The present invention relates to a signal transmission connector, and more particularly, to a signal transmission connector used to connect to an electronic component such as a semiconductor package and transmit an electrical signal.

Currently, various types of connectors for transmitting electrical signals are used in various fields such as the electronics industry or the semiconductor industry.

For example, a semiconductor package is manufactured through a pre-process, a post-process, and a test process, and a connector is used in such a manufacturing process. The entire process, also called a PAB process, is a process of forming an integrated circuit on a wafer made of single crystal silicon. The post process is also called an assembly process, and separates the wafer into individual chips, connects a conductive lead or ball to the chip so as to connect an electrical signal with an external device, and an epoxy resin for protecting the chip from the external environment. It is a process of forming a semiconductor package by molding with the same resin. The test process is a process of sorting good and defective products by testing whether the semiconductor package is operating normally.

One of the key components of the test process is a connector called a test socket. The test socket is mounted on a printed circuit board electrically connected to an integrated circuit tester and used to inspect a semiconductor package. The test socket has a contact pin, which electrically connects the leads of the semiconductor package to the terminals of the printed circuit board.

The tester generates an electrical signal for testing the semiconductor package to be connected to the test socket and outputs the electrical signal to the semiconductor package, and then tests whether the semiconductor package operates normally by using the electrical signal input through the semiconductor package. As a result, the semiconductor package is determined to be good or defective.

Meanwhile, the price of testers has become expensive due to the increase in the number of simultaneous device under test (DUT) for high speed, high functionality, and productivity of integrated circuits. In order to efficiently use such expensive testers, it is very important to select and use a suitable test socket and to manage the life of the test socket.

If the performance of the test socket is reduced due to the end of the life of the test socket during the inspection of a large number of semiconductor packages, there is a problem of treating a good quality semiconductor package as a defect. In addition, each time a bad test socket is generated, expensive testers and handlers have to be stopped for replacement, thereby reducing test efficiency and consequently adversely affecting production yield.

1 shows a conventional test socket used for inspecting a semiconductor package.

During the inspection of the semiconductor package, the terminal 12 of the semiconductor package 10 comes into contact with the conductive portion 22 of the test socket 20. The conductive part 22 of the test socket 20 has a form in which conductive particles are dispersed in an elastic material such as silicon, and is insulated from each other by an insulating part 24 made of a material having elastic force such as silicon. Is supported. The guide film 30 is disposed on the upper surface of the insulating portion 24.

However, as shown in FIG. 1, when the semiconductor package 10 is compressed, the test socket 20 is pushed sideways due to the force in the direction of the arrow. In particular, when the contact pressure is increased for stable contact between the terminal 12 of the semiconductor package 10 and the conductive portion 22 of the test socket 20, the conductive portion 22 or the insulating portion 24 may be damaged. If this phenomenon is accelerated and the phenomenon is repeated, a problem occurs that the life of the test socket 20 is shortened.

In addition, the conventional test socket 20 has a shape of the conductive part 22 when an overstroke occurs due to excessive movement force for pushing the semiconductor package 10 to the test socket 20. However, the position may be changed and the contact position between the conductive portion 22 and the terminal 12 may be misaligned. In this case, the connection between the terminal 12 and the conductive portion 22 may not be performed, or short circuits may occur. In addition, when the electrical signal transmission between the terminal 12 and the conductive part 22 is unstable, a problem arises in that the signal transmission characteristic is degraded due to an increase in the resistance value.

Publication No. 2006-0062824 (June 12, 2006)

The present invention has been made in view of the above-mentioned point, and by improving the guide film disposed on the upper portion of the insulating portion supporting the plurality of conductive portions to a structure capable of supporting the conductive portion, thereby preventing deformation of the conductive portion and the insulating portion, It is an object of the present invention to provide a signal transmission connector that can increase its lifespan and improve signal transmission performance.

The signal transmission connector according to the present invention for solving the above object is a signal transmission connector that can transmit an electrical signal by connecting to an electronic component, a plurality of elastic insulating material to be connected to the terminal of the electronic component A plurality of conductive portions in which the conductive particles are aligned in the thickness direction; An insulating part made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts so as to be spaced apart from each other; And a guide film coupled to one surface of the insulation portion and having a film hole formed at each position corresponding to each of the plurality of conductive portions, wherein the film hole has a shape in which the width gradually decreases toward the insulation portion. And a plurality of tapered holes spaced apart from each other and vertically spaced apart from each other, wherein the conductive part is connected to the conductive part body and fills one or more tapered holes of the film hole. And conductive bumps disposed in the film holes.

The film hole may include one or more extension holes extending to have a predetermined width between the tapered holes adjacent up and down.

The end width of the conductive part bump exposed to the outside from the outer surface of the guide film through the film hole is smaller than the width of the tapered hole formed on the outer surface of the guide film, the conductive tape is formed on the outer surface of the guide film Reinforcing insulation can be arranged surrounding the ends of the secondary bumps.

The reinforcement insulating part may be made of the same elastic insulating material as that of the elastic insulating material constituting the conductive part, and the elastic insulating material of the reinforcing insulating part may be integrally solidified with the elastic insulating material of the conductive part.

A plurality of inclined portions may be provided along the circumference of each of the plurality of tapered holes, and at least one of the plurality of inclined portions may be rounded inside the guide film.

Inside the guide film, a plurality of inclined portions are provided along the circumference of each of the plurality of tapered holes, and the inclined angle of the inclined portion disposed relatively close to the insulated portion is equal to the inclined angle of the inclined portion disposed relatively away from the insulated portion. May be less than that.

On the other hand, the signal transmission connector according to another aspect of the present invention for solving the above object is a signal transmission connector that can be connected to the electronic component to transmit an electrical signal, it is elastic so that it can be connected to the terminal of the electronic component A plurality of conductive parts in which a plurality of conductive particles are arranged in the thickness direction in the insulating material; An insulating part made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts so as to be spaced apart from each other; And a guide film coupled to one surface of the insulation portion and having a film hole formed at each position corresponding to each of the plurality of conductive portions, wherein the film hole extends from the outer surface of the guide film toward the insulation portion. An outer taper hole which gradually decreases in width while going toward the insulation portion, a connection hole connected to the outer taper hole and extending to the insulation portion at a predetermined width, and connected to the connection hole and extending toward the insulation portion, An inner tapered hole having a width gradually decreasing toward the insulating portion, wherein the conductive portion includes: a conductive portion body disposed in the insulating portion; a bump tapered portion connected to the conductive portion body to fill the inner tapered hole; A bump extension connected to the bump taper and extending outwardly with a width corresponding to the connection hole; And a conductive portion bump having a portion.

The signal transmission connector according to another aspect of the present invention may include a reinforcing insulation part disposed in the outer taper hole to surround the bump extension part.

In the signal transmission connector according to the present invention, the conductive part bumps are disposed in a film hole formed in the guide film disposed on one surface of the insulating part, and the periphery of the conductive part bumps is supported by the inclined part and the vertical part inside the guide film. When the terminal of the electronic component is pressed against the conductive portion, the external force received by the conductive portion is dispersed in various directions without being concentrated in the vertical direction of the conductive portion. Therefore, when the terminal of the electronic component is pressed against the conductive part bump, the problem of spreading or bending the conductive part sideways can be reduced, and the conductive part can be stably connected to the terminal.

In addition, the signal transmission connector according to the present invention is supported by the inclined portion and the vertical portion of the guide film even if the conductive part bump is repeatedly subjected to a compressive force, thereby maintaining a good surface flatness of the conductive part bump, life This can be increased.

In addition, in the signal transmission connector according to the present invention, even when excessive movement force is provided to the electronic parts, the conductive part bumps are supported by the inclined and vertical portions of the guide film, so that the deformation of the conductive part is suppressed. The problem that the contact position between the terminal and the terminal is distorted can be reduced, and the conductive portion can be stably connected to the terminal to maintain good signal transmission performance.

In addition, the signal transmission connector according to the present invention is coupled to the guide film in the form of the conductive part bump to fill the multi-stage layered film hole formed in the guide film, thereby increasing the bonding area between the conductive part bump and the guide film. have. Accordingly, the conductive bumps may not be easily peeled off from the guide film and may maintain a stable bonding state with the guide film.

1 shows a conventional test socket used for semiconductor package inspection.
2 illustrates a signal transmission connector and an electronic component connected thereto according to an embodiment of the present invention.
FIG. 3 is a schematic view of a portion of the signal transmission connector shown in FIG. 2 and an electronic component connected thereto.
4 is a plan view showing a portion of a signal transmission connector according to an embodiment of the present invention.
Figure 5 is a cross-sectional view showing a guide film of the signal transmission connector according to an embodiment of the present invention.
6 illustrates a signal transmission connector and an electronic component connected thereto according to another embodiment of the present invention.
7 is a cross-sectional view showing a guide film of a signal transmission connector according to another embodiment of the present invention.

Hereinafter, a signal transmission connector according to the present invention will be described in detail with reference to the drawings.

FIG. 2 illustrates a signal transmission connector and an electronic component connected thereto according to an embodiment of the present invention. FIG. 3 illustrates an extract of a part of the signal transmission connector and an electronic component connected thereto illustrated in FIG. Is a plan view showing a portion of a signal transmission connector according to an embodiment of the present invention.

As shown in the figure, the signal transmission connector 100 according to an embodiment of the present invention may be connected to the electronic component 50 to transmit an electrical signal, and may be connected to the terminal 52 of the electronic component 50. A plurality of conductive parts 110 and an insulating part 120 surrounding the plurality of conductive parts 110 to support the plurality of conductive parts 110 so as to be spaced apart from each other, and coupled to one surface of the insulating part 120. And a guide film 130 covering one surface of the insulating part 120, and a support plate 150 coupled to the insulating part 120 to support the insulating part 120. The signal transmission connector 100 may be used to transmit an electrical signal by connecting to the electronic component 50 to transmit an electrical signal, or to electrically inspect the electronic component through a tester or electrically connect the electronic component and various electronic devices to transmit the electrical signal. have.

The conductive part 110 may be formed in a form in which a plurality of conductive particles are aligned in the thickness direction in the elastic insulating material so as to be connected to the terminal 52 of the electronic component 50. The conductive parts 110 are spaced apart from the inside of the insulating part 120 so as to correspond to the terminals 52 provided in the electronic component 50 to which the plurality of conductive parts are connected.

The conductive portion 110 is connected to the conductive portion body 111 disposed in the insulating portion 120 and the conductive portion body 111 so as to be in contact with the terminal 52 of the electronic component 50. And a conductive part bump 112 protruding from one surface of the substrate. The density of the conductive particles in the conductive part body 111 and the conductive part bump 112 may be the same or different.

The conductive part bump 112 includes a bump taper part 113 extending from the conductive part body 111 and a bump extension part 114 extending outwardly from the bump taper part 113. The bump tapered portion 113 is formed in a tapered shape so that the width thereof gradually decreases toward the insulating portion 120, and the bump extension portion 114 extends the same width from the bump tapered portion 113. The bump extension part 114 has a width corresponding to the width of the extension hole 134 provided in the guide film 130.

The conductive part body 111 of the conductive part 110 may be formed in a cylindrical shape as shown, or various other shapes. In addition, as illustrated, the conductive body 111 may be formed in a shape in which its width gradually increases as it moves away from the guide film 130, or various other shapes.

The elastic insulating material constituting the conductive portion 110 may be a heat-resistant polymer having a crosslinked structure, for example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acryl Nitrile-butadiene copolymer rubber, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, urethane rubber, polyester-based rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene Diene copolymer rubber, soft liquid epoxy rubber, and the like can be used.

In addition, as the conductive particles constituting the conductive portion 110 may be used having a magnetic so as to react by the magnetic field. For example, as electroconductive particle, the particle | grains of the metal which show magnetism, such as iron, nickel, cobalt, or these alloy particles, or particle | grains containing these metals, or these particle | grains are made into the core particle, and the surface of this core particle | grain is made of gold Metal having good conductivity, such as silver, palladium, and radium, or inorganic particles of nonmagnetic metal particles, glass beads, and polymer particles as core particles, and conductive surfaces such as nickel and cobalt on the surface of the core particles. The plated magnetic material, or the plated conductive magnetic material and the metal having good conductivity to the core particles may be used.

The insulating part 120 may be made of an elastic insulating material. The insulating part 120 surrounds the plurality of conductive parts 110 to support the plurality of conductive parts 110 so as to be spaced apart from each other. The elastic insulating material constituting the insulating part 120 may be made of the same material as the elastic insulating material constituting the conductive part 110.

2 to 5, the guide film 130 is disposed on one surface of the insulating part 120, that is, a surface facing the electronic component 50 of the insulating part 120. The guide film 130 may be formed of various materials having rigidity greater than that of the insulating part 120 so that the shape is stably maintained. For example, the guide film 130 may be made of a material such as synthetic resin and ceramics. In the guide film 130, a film hole 131 is formed at each position corresponding to each of the plurality of conductive parts 110.

The film hole 131 includes a plurality of taper holes 132 and 133 and extension holes 134 disposed between the plurality of taper holes 132 and 133. The plurality of tapered holes 132 and 133 are formed in a shape in which the width gradually decreases toward the insulating portion 120 and is spaced apart from each other up and down to be concentrically disposed. Inside the guide film 130, a plurality of inclined portions 135 and 136 and a vertical portion 137 disposed between the plurality of inclined portions 135 and 136 are provided along the circumference of the film hole 131. do.

In the present exemplary embodiment, the inner surface of the guide film 130 which contacts the insulation portion 120 by the outer tapered hole 132 that extends inward from the outer surface of the guide film 130 among the plurality of tapered holes 132 and 133. An inner tapered hole 133 is divided into an inner tapered hole 133, and one of the plurality of inclined portions 135 and 136 is disposed around the outer tapered hole 132 as an outer tapered hole 135. What is arranged around the periphery of 133 will be described by dividing the inner inclined portion 136.

The outer tapered hole 132 extends from the outer surface of the guide film 130 to the insulation portion 120 side, and has a shape in which the width gradually decreases while going toward the insulation portion 120 side. The inner tapered hole 133 extends from the inside of the guide film 130 to the insulating part 120 side, and has a shape in which the width gradually decreases while going toward the insulating part 120 side. The extension hole 134 extends with a constant width between the outer taper hole 132 and the inner taper hole 133 to connect the outer taper hole 132 and the inner taper hole 133. The outer tapered hole 132 has a larger width than the inner tapered hole 133 as a whole.

The bump tapered portion 113 of the conductive portion 110 is disposed in the inner tapered hole 133, and the bump tapered portion 113 is supported by the inner inclined portion 136 in contact with the inner inclined portion 136. The bump extension part 114 of the conductive part 110 is disposed in the extension hole 134, and the bump extension part 114 is supported by the vertical part 137 in contact with the vertical part 137. Therefore, when the terminal 52 of the electronic component 50 contacts the conductive portion bump 112, the bump tapered portion 113 and the bump extension portion 114 of the conductive portion bump 112 have an inner inclined portion 136. ) And the vertical portion 137. In addition, the external force applied to the conductive portion bump 112 is transmitted from the bump taper portion 113 to the inner inclined portion 136 and transmitted from the bump extension portion 114 to the vertical portion 137 to thereby form the conductive portion bump ( The external force applied to the 112 may be distributed in various directions without being concentrated in the vertical direction of the conductive portion 110. Therefore, when the terminal 52 of the electronic component 50 is pressed against the conductive portion bump 112, the spreading amount or deformation amount of the conductive portion 110 can be reduced.

 The outermost width of the outer tapered hole 132 is larger than the width of the bump extension part 114, and the bump extension part 114 does not contact the outer inclined part 135. In the outer tapered hole 132, a reinforcement insulating part 140 is disposed to surround the bump extension part 114. The reinforcement insulating part 140 reinforces the strength of the bump extension part 114, and the bump extension part 114 does not spread sideways when the terminal 52 of the electronic component 50 contacts the bump extension part 114. The bump extension 114 may be supported to prevent the bump extension 114. That is, the bump extension part 114 may be supported by the outer inclined part 135 through the reinforcing insulation part 140.

In addition, the reinforcement insulating part 140 is spaced and insulated between adjacent conductive part bumps 112, so that the conductive part bumps 112 are spread sideways when the terminal 52 is compressed to the conductive part bumps 112. The problem of short-circuit with other adjacent conductive bumps 112 can be prevented.

The reinforcement insulating part 140 may be made of an elastic insulating material such as an elastic insulating material forming the conductive part 110. That is, the elastic insulating material of the reinforcing insulating part 140 may be solidified integrally with the elastic insulating material of the conductive part 110. In the manufacturing process of the signal transmission connector 100, by applying a magnetic field to the liquid elastic insulating material in which a plurality of conductive particles are dispersed, the conductive portion bump 112 and the conductive particles in which the conductive particles are concentrated are not distributed or Reinforcing insulation 140 may be formed at the same time, which is included in such a way that it cannot transmit an electrical signal.

As shown in FIG. 5, the inclination angle α1 of the inner inclined portion 136 may be designed to be equal to or smaller than the inclination angle α2 of the outer inclined portion 135. Here, the inclination angles α1 (α2) of the inner inclined portion 136 and the outer inclined portion 135 are such that the inclined portion 136 and the outer inclined portion 135 are inclined with respect to the surface of the guide film 130. Indicates an angle. As such, the inclination angle α1 of the inner inclined portion 136 disposed relatively close to the insulator 120 is the same as the inclination angle α2 of the outer inclined portion 135 disposed relatively far from the insulator 120. It is advantageous to disperse the external force applied to the conductive portion 110 in more various directions. The inclination angle α1 of the inner inclined portion 136 is equal to or smaller than the inclination angle α2 of the outer inclined portion 135. It is advantageous to increase the volume of the conductive part bumps 112 located in the film hole 131 as compared with increasing the inclination angle α2 of 135.

The support plate 150 may be made of various materials having rigidity such that the shape of the support plate 150 is not easily deformed while stably supporting the insulator 120 having elastic force and its shape is stably maintained. For example, the support plate 150 may be made of a material such as synthetic resin, metal, ceramic, and the like. When the support plate 150 is made of metal, an insulating coating may be coated on the surface of the support plate 150.

As described above, the signal transmission connector 100 according to the exemplary embodiment of the present invention conducts the conductive portion 110 to the film hole 131 formed in the guide film 130 disposed on one surface of the insulating portion 120. The secondary bumps 112 are disposed, and the periphery of the conductive part bumps 112 is supported by the inclined portions 135 and 136 and the vertical portion 137 inside the guide film 130, thereby providing the electronic components 50. When the terminal 52 is pressed against the conductive portion 110, the external force received by the conductive portion 110 is not concentrated in the vertical direction of the conductive portion 110 but is dispersed in various directions. Therefore, when the terminal 52 of the electronic component 50 is pressed against the conductive part bump 112, the problem of the conductive part 110 spreading or bending sideways can be reduced, and the conductive part 110 is connected to the terminal 52. ) Can be connected stably.

In addition, in the signal transmission connector 100 according to the exemplary embodiment, the conductive parts bump 112 may be inclined parts 135 and 136 of the guide film 130 even when the conductive parts bump 112 is repeatedly compressed. And by being supported by the vertical portion 137, the surface flatness of the conductive portion bump 112 can be maintained good and life can be increased.

In addition, the signal transmission connector 100 according to the embodiment of the present invention, even if the excessive movement force is provided to the electronic component 50, overstroke occurs, the conductive part bump 112 is inclined portion of the guide film 130 Since the deformation of the conductive portion 110 is supported by the support portions 135 and 136 and the vertical portion 137, the problem that the contact position between the conductive portion 110 and the terminal 52 is distorted can be reduced. The 110 may be stably connected to the terminal 52 to maintain good signal transmission performance.

In addition, the signal transmission connector 100 according to an embodiment of the present invention fills the film hole 131 having a multi-stage layer shape in which the conductive part bumps 112 of the conductive part 110 are formed in the guide film 130. By being combined with the furnace guide film 130, the bonding area between the conductive part bump 112 and the guide film 130 is relatively large. Therefore, the conductive part bump 112 and the guide film 130 can maintain a stable coupling state, and the problem that the conductive part bump 112 is peeled off from the guide film 130 does not occur.

6 illustrates a signal transmission connector and an electronic component connected thereto according to another embodiment of the present invention, and FIG. 7 is a cross-sectional view illustrating a guide film of the signal transmission connector according to another embodiment of the present invention.

The signal transmission connector 200 illustrated in FIGS. 6 and 7 includes a plurality of conductive parts 210, an insulating part 120 supporting the plurality of conductive parts 210 so as to be spaced apart from each other, and one surface of the insulating part 120. It is coupled to the guide film 230 covering one surface of the insulating portion 120. The signal transmission connector 200 is a modification of some components of the conductive portion 210 and the guide film 230 compared to the signal transmission connector 100 described above.

The conductive part 210 is connected to the conductive part body 211 so as to be in contact with the conductive part body 211 disposed in the insulating part 120 and the terminal 52 of the electronic component 50. Conductive part bumps 212 protruding from one surface of the (). The conductive portion bump 212 includes a bump taper portion 213 extending from the conductive portion body 211 and a bump extension portion 214 extending outwardly from the bump taper portion 213. The bump tapered portion 213 is formed in a tapered shape so that the width thereof gradually decreases toward the insulating portion 120, and the bump extension portion 214 extends the same width from the bump tapered portion 213. The outer surface of the bump tapered portion 213 is rounded. The bump extension part 214 has a width corresponding to the width of the extension hole 234 provided in the guide film 130.

The guide film 230 may be made of a material having a rigidity greater than that of the insulating part 120. In the guide film 230, a film hole 231 is formed at each position corresponding to each of the plurality of conductive parts 210.

The film hole 231 has an outer taper hole 232 and an inner taper hole 233, and an outer taper hole 232 and an inner taper hole 233 having a shape in which the width gradually decreases toward the insulating part 120. It includes an extension hole 234 disposed between. The outer taper hole 232 and the inner taper hole 233 are spaced up and down concentrically. Inside the guide film 230, an outer inclined portion 235, an inner inclined portion 236, and a vertical portion 237 are provided along the circumference of the film hole 231. The inner inclined portion 236 is rounded to correspond to the shape of the bump tapered portion 213 of the conductive portion 210.

The outer taper hole 232 extends from the outer surface of the guide film 130 to the insulation portion 120 side, and has a shape in which the width gradually decreases while going toward the insulation portion 120 side. The inner tapered hole 233 also extends from the inside of the guide film 130 to the insulating part 120 side, and has a shape in which the width gradually decreases while going toward the insulating part 120 side. The extension hole 234 extends with a predetermined width between the outer taper hole 232 and the inner taper hole 233 to connect the outer taper hole 232 and the inner taper hole 233.

The bump tapered portion 213 of the conductive portion 210 is disposed in the inner tapered hole 233, and the bump tapered portion 213 is supported by the inner inclined portion 236 in contact with the inner inclined portion 236. The bump extension part 214 of the conductive part 210 is disposed in the extension hole 234, and the bump extension part 214 is supported by the vertical part 237 in contact with the vertical part 237.

The outermost width of the outer taper hole 232 is greater than the width of the bump extension part 214, and the reinforcing insulation part 140 is disposed in the outer taper hole 232 so as to surround the bump extension part 214. The function of the reinforcing insulation part 140 is as described above.

In the signal transmission connector 200 according to another exemplary embodiment of the present invention, the conductive part bumps 212 are disposed in the film hole 231 of the guide film 230, and the periphery of the conductive part bumps 212 is formed in the guide film ( 130 is supported by the inclined portions 235 and 236 and the vertical portion 237, so that the conductive portion 110 receives when the terminal 52 of the electronic component 50 is pressed against the conductive portion 110. The external force is not concentrated in the vertical direction of the conductive portion 110 but is dispersed in various directions. Therefore, when the terminal 52 of the electronic component 50 is compressed to the conductive part bump 212, a problem of spreading or bending the conductive part 210 sideways may be reduced, and the conductive part 210 may be connected to the terminal 52. ) Can be connected stably.

Although the present invention has been described with reference to preferred examples, the scope of the present invention is not limited to the forms described and illustrated above.

For example, in the drawing, the film hole 131 includes a pair of tapered holes 132 and 133 spaced up and down and a pair of extension holes 134 connecting the pair of tapered holes 132 and 133. Although shown, but the number of tapered holes included in the film hole may be variously changed. The film hole may be changed into various other shapes in which a plurality of tapered holes are spaced up and down and arranged in multiple stages. The conductive portion may also be changed to various other structures having a plurality of inclined portions according to the shape of the film hole.

In addition, the number or shape of the inclined portion provided in the guide film 130, the inclination angle of each is not limited to those shown, and may be variously changed.

While the invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, it will be apparent to those skilled in the art that many changes and modifications to the present invention are possible without departing from the spirit and scope of the appended claims.

100, 200: signal transmission connector 110, 210: conductive part
111, 211: conductive part body 112, 212: conductive part bump
113 and 213: bump tapered portions 114 and 214: bump extension portions
120: insulation part 130, 230: guide film
131, 231: film hole 132, 232: outer tapered hole
133, 233: inner taper hole 134, 234: extension hole
135, 235: outer inclined portion 136, 236: inner inclined portion
137, 237: vertical portion 140: reinforcement insulation portion
150: support plate

Claims (8)

In the signal transmission connector capable of transmitting an electrical signal by connecting to an electronic component,
A plurality of conductive parts in which a plurality of conductive particles are arranged in a thickness direction in the elastic insulating material so as to be connected to the terminals of the electronic component;
An insulating part made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts so as to be spaced apart from each other; And
And a guide film coupled to one surface of the insulating part and having a film hole formed at each position corresponding to each of the plurality of conductive parts.
The film hole has a shape in which the width gradually decreases toward the insulating portion side and includes a plurality of tapered holes spaced up and down and arranged in multiple stages,
The conductive part includes a conductive part body disposed in the insulating part, and a conductive part bump disposed in the film hole to be connected to the conductive part body to fill one or more tapered holes of the film hole.
An end width of the conductive part bump exposed to the outside from the outer surface of the guide film through the film hole is smaller than the width of the tapered hole formed on the outer surface of the guide film,
And a reinforcing insulation portion disposed around an end of the conductive portion bump in a tapered hole formed on an outer surface of the guide film.
The method of claim 1,
The film hole, the signal transmission connector, characterized in that it comprises one or more extension holes extending to have a constant width between the tapered holes neighboring up and down.
delete The method of claim 1,
And the reinforcing insulating part is made of the same elastic insulating material as that of the elastic insulating material constituting the conductive part, wherein the resilient insulating material of the reinforcing insulating part is solidified integrally with the elastic insulating material of the conductive part.
The method of claim 1,
A plurality of inclined portions are provided along the circumference of each of the plurality of tapered holes inside the guide film.
At least one of the plurality of inclined portions is rounded.
The method of claim 1,
A plurality of inclined portions are provided along the circumference of each of the plurality of tapered holes inside the guide film.
And the inclination angle of the inclined portion relatively disposed relatively to the insulator portion is relatively equal to or smaller than the inclination angle of the inclined portion disposed relatively far from the insulator portion.
In the signal transmission connector capable of transmitting an electrical signal by connecting to an electronic component,
A plurality of conductive parts in which a plurality of conductive particles are arranged in a thickness direction in the elastic insulating material so as to be connected to the terminals of the electronic component;
An insulating part made of an elastic insulating material and surrounding the plurality of conductive parts to support the plurality of conductive parts so as to be spaced apart from each other; And
And a guide film coupled to one surface of the insulating part and having a film hole formed at each position corresponding to each of the plurality of conductive parts.
The film hole extends from the outer surface of the guide film to the insulating part side, the outer taper hole gradually decreasing in width as it goes toward the insulating part side, and connected to the outer taper hole to extend to the insulating part side at a constant width. A connection hole and an inner taper hole which is connected to the connection hole and extends toward the insulation portion and gradually decreases in width while going toward the insulation portion;
The conductive part may include a conductive part body disposed in the insulating part, a bump taper part connected to the conductive part body to fill the inner taper hole and a width connected to the bump taper part to have a width corresponding to the connection hole to the outside. And a conductive bump having an extended bump extension.
The method of claim 7, wherein
And a reinforcing insulation part disposed in the outer taper hole to surround the bump extension part.

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