KR102530618B1 - Test socket, test apparatus having the same, and manufacturing method for the test socket - Google Patents

Abstract

The test socket of the present invention includes a non-elastic insulating housing having a plurality of housing holes formed therethrough in a thickness direction and made of an inelastic insulating material; It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and is formed in the housing hole to penetrate the inelastic insulating housing in the thickness direction a conductive part including a conductive part body and a conductive part upper bump protruding from the upper surface of the inelastic insulation housing on an upper surface of the conductive part body; an upper relief film attached to an upper surface of the inelastic insulation housing, spaced apart from the upper bump of the conductive part, and having an expansion and absorption space; a contact pin disposed above the conductive part to contact the terminal of the device under test; and a contact pin guide attached to an upper surface of the upper relief film to guide the vertical movement of the contact pin. It is composed by providing.

Description

Test socket, test apparatus including the test socket, and method for manufacturing the test socket

The present invention relates to a test socket, and more particularly, to a test socket for electrically connecting a device under test and a tester, a test apparatus including the test socket, and a method of manufacturing the test socket.

In general, a semiconductor package is formed by integrating minute electronic circuits at a high density, and undergoes a test process to determine whether each electronic circuit is normal during a manufacturing process. The test process is a process of sorting out good products and defective products by testing whether or not the semiconductor package operates normally.

A test device that electrically connects a terminal of the semiconductor package to a tester that applies a test signal is used to test the semiconductor package.

The test device has various structures depending on the type of semiconductor package to be tested. The test device and the semiconductor package are not directly connected to each other, but indirectly connected through a test socket (also referred to as a signal transmission connector).

Test sockets typically include pogo sockets and rubber sockets. Among them, the rubber socket has a structure in which a plurality of conductive particles are included inside an elastic material such as silicon so that conductive parts are insulated from each other inside an insulating housing made of an elastic material such as silicon.

These rubber sockets do not use mechanical means such as soldering or springs, and have the advantage of achieving a simple electrical connection, and thus have been widely used recently.

In a test device including a test socket of the rubber socket type, the contact stroke amount of the test socket is located on the outside of the pressing part of the pusher for pressing the semiconductor package and the outside of the conductive part of the test socket. It is determined according to the vertical thickness of the stopper portion, the thickness of the semiconductor package, the height of the test socket, and the like. Conventional rubber sockets have problems such as durability of the rubber itself, reduced service life due to contact depress and contact destruction due to over stroke that occurs during repeated contact.

In order to improve this, a structure having a contact pin of a conductor is proposed on the upper part of the conductive part of the rubber socket, and the durability of the contact with the device terminal under test is increased, but the upper and lower parts of the conductive part where the stress of the stroke is concentrated The problem of reduced lifespan is still unresolved.

Hereinafter, problems of the conventional test socket in which the contact pin is installed on the conductive part will be described with reference to FIGS. 1 and 2 .

1 is a longitudinal cross-sectional view showing a conventional rubber socket in which a contact pin is disposed on an upper part of a conductive part, and FIG. 2 is an enlarged view of an excerpt of the main part of FIG. It is a drawing for 1(a) and 2(a) show a state before testing, and FIGS. 1(b), 2(b) and 2(c) show a state during testing.

As shown in FIGS. 1 and 2, the conventional test socket 20 has a conductive part 23 formed in a form in which a plurality of conductive particles are included in an elastic insulating material in a housing hole 22 of an elastic insulating housing 21. is formed

The conductive part 23 includes a conductive part body 23a passing through the elastic insulating housing 21 in the thickness direction, and a conductive part protruding from the upper and lower surfaces of the elastic insulating housing 21 on the upper and lower surfaces of the conductive part body 23a. Upper and lower bumps 23b and 23c are provided.

A contact pin 24 is disposed on the upper part of the bump 23b of the conductive part to contact the terminal 11 of the device under test 10, and the lower surface of the contact pin 24 is formed in a round shape.

In addition, a contact pin guide 25 is attached to the upper surface of the elastic insulating housing 21 to guide the vertical movement of the contact pin 24 during device testing.

However, in the conventional test socket, when testing a device, as shown in FIG. 2(b), the terminal 11 of the device under test 10 moves the contact pin 24 downward by the pressing force of a pusher (not shown). When a stroke is transmitted to the conductive part 23 by pressing, the conductive part 23 is deformed while being pressed downward, so that stress is concentrated on the upper and lower parts of the conductive part 23 ("A" in the drawing indicates where the stress is concentrated). part is shown as an example). In particular, when an over stroke is applied to the test socket 20 because stroke control is not precisely performed, as shown in FIG. 2(c), the upper and lower bumps 23b and 23c of the conductive part There is a problem in that durability of the conductive portion 23 is deteriorated, such as damage to the upper and lower bumps 23b and 23c of the conductive portion due to severe compression deformation, thereby reducing the lifespan of the test socket.

Domestic Patent Publication No. 2006-0062824 (published on June 12, 2006)

The present invention was invented to solve the above problems, and the first object of the present invention is to provide a relief film to be spaced apart from the upper and lower bumps of the conductive part, and since the relief film has an expansion and absorption space, during device testing, a pusher When the terminal of the device presses the contact pin downward by the pressing force of the contact pin and the stroke is transmitted to the conductive part, the conductive part is pressed downward and deformed, so that stress is concentrated on the upper and lower parts of the conductive part. A test socket capable of extending the lifespan of a test socket by suction control of the deformed parts of the upper and lower parts of the conductive part and reducing the stress concentrated on the upper and lower parts of the conductive part by the relief film, a test device including the test socket, and the same It is to provide a method of manufacturing a test socket. In addition, a second object of the present invention is to increase the durability of the conductive part by arranging a contact pin on the upper part of the conductive part, replace the existing elastic insulator with an inelastic insulator, and prepare a relief film to be spaced apart from the upper and lower bumps of the conductive part, during device testing. It is to provide a test socket capable of reducing stress generated on the top and bottom of the conductive part and minimizing the amount of deformation of the test socket, a test device including the test socket, and a method of manufacturing the test socket. In addition, a third object of the present invention is to enable the relief film to function as a hard stop that limits the descending position of the contact pin when the contact pin compresses the upper part of the conductive part due to the pressure of the device under test, thereby conducting the conductive part. It is an object of the present invention to provide a test socket capable of preventing damage to parts and extending the useful life of the test socket, a test device including the test socket, and a method of manufacturing the test socket.

The test socket of the present invention for achieving the above object is a test socket disposed between a device under test and a tester to electrically connect a terminal of the device under test and a signal electrode of the tester to each other. a non-elastic insulating housing having a housing hole and made of an inelastic insulating material; It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and is formed in the housing hole to penetrate the inelastic insulating housing in the thickness direction a conductive part including a conductive part body and a conductive part upper bump protruding from the upper surface of the inelastic insulation housing on an upper surface of the conductive part body; an upper relief film attached to an upper surface of the inelastic insulation housing, spaced apart from the upper bump of the conductive part, and having an expansion and absorption space; a contact pin disposed above the conductive part so as to contact the terminal of the device under test, and the lowering position of which is limited by the upper relief film; and a contact pin guide attached to an upper surface of the upper relief film to guide the vertical movement of the contact pin. It can be configured to include.

In addition, a lower bump of the conductive part is formed on the lower surface of the conductive part body and protrudes from the lower surface of the inelastic insulating housing, and a lower relief film is attached to the lower surface of the inelastic insulating housing while being spaced apart from the lower bump of the conductive part. An expansion absorption space may be provided between the lower relief film and the lower bump of the conductive part.

In addition, the upper relief film has a structure surrounding the upper bump of the conductive part in a state of being spaced apart from the upper bump of the conductive part at a predetermined distance, and the lower relief film is spaced apart from the lower bump of the conductive part at a predetermined distance. may have a structure surrounding the lower bump of the conductive part.

In addition, the contact pin may include a contact pin body connected to a terminal of the device under test; a flat portion formed on a lower surface of the contact pin body connected to an upper surface of the conductive portion; and contact pin arms formed on both sides of the contact pin body to be guided by the contact pin guide and contacting the upper surface of the upper relief film. can include Meanwhile, the test apparatus of the present invention is a test apparatus for testing a device under test by connecting a device under test having a terminal to a tester generating a test signal, wherein the test signal of the tester is transmitted to the device under test. a test socket electrically intermediary between the tester and the device under test; a guide housing coupled to the tester to fix the test socket to the tester and having an alignment pin inserted into a fixing hole of the tester; and a pusher that moves toward or away from the tester and provides a pressing force capable of pressing the device under test placed on the test socket toward the tester. The test socket includes: an inelastic insulation housing having a plurality of housing holes formed therethrough in a thickness direction and made of an inelastic insulation material; It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and is formed in the housing hole to penetrate the inelastic insulating housing in the thickness direction a conductive part including a conductive part body and a conductive part upper bump protruding from the upper surface of the inelastic insulation housing on an upper surface of the conductive part body; an upper relief film attached to an upper surface of the inelastic insulation housing, spaced apart from the upper bump of the conductive part, and having an expansion and absorption space; a contact pin disposed above the conductive part so as to contact the terminal of the device under test, and the lowering position of which is limited by the upper relief film; and a contact pin guide attached to an upper surface of the upper relief film to guide the vertical movement of the contact pin. can be provided.

In addition, a lower bump of the conductive part protruding from the lower surface of the inelastic insulating housing is further formed on the lower surface of the conductive part body, and a lower relief film is further attached to the lower surface of the inelastic insulating housing while being spaced apart from the lower bump of the conductive part. Thus, an expansion absorption space may be provided between the lower relief film and the lower bump of the conductive part.

On the other hand, in the method of manufacturing a test socket of the present invention, in the method of manufacturing a test socket provided in a test apparatus for testing a device under test by connecting a device under test having a terminal to a tester generating a test signal, (a ) preparing an inelastic member made of an inelastic insulating material; (b) forming a plurality of housing holes penetrating the inelastic member in a thickness direction to form an inelastic insulation housing; (c) made in the form of including a plurality of conductive particles in an elastic insulating material, a lower end connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and a conductive protruding from the upper surface of the inelastic insulating housing at the upper end forming a conductive part having a second upper bump in the housing hole; (d) attaching an upper relief film to an upper surface of the inelastic insulating housing to form an expansion-absorbing space spaced apart from the upper bump of the conductive part; (e) arranging contact pins on top of the conductive portion to contact terminals of the device under test; and (f) attaching a contact pin guide to the upper surface of the upper relief film to guide the vertical movement of the contact pins. includes

After the step (c), a lower bump of the conductive part protruding from the lower surface of the inelastic insulation housing is formed on the lower surface of the conductive part, and after the step (d), an expansion-absorbing space is formed spaced apart from the lower bump of the conductive part. A lower relief film may be attached to a lower surface of the inelastic insulation housing to form a lower relief film.

As such, the present invention has the following effects. First, a relief film is provided to be spaced apart from the upper and lower bumps of the conductive part, and since the relief film has an expansion and absorption space, during a device test, the terminal of the device presses the contact pin downward by the pressing force of the pusher to stroke the conductive part. When is transmitted, when the conductive part is deformed while being pressed downward, and stress is concentrated on the upper and lower parts of the conductive part, the upper and lower deformed parts of the conductive part are suction controlled into the expansion absorbing space, and the relief film limits the descending position of the contact pin. It is possible to extend the life of the test socket by preventing damage to the conductive part by functioning as a hard stop.

Second, by placing contact pins on the upper part of the conductive part to increase the durability of the conductive part, replacing the existing elastic insulator with an inelastic insulator, and providing a relief film to be spaced apart from the upper and lower bumps of the conductive part, during device testing, the upper and lower parts of the conductive part Stress can be reduced and the amount of deformation of the test socket can be minimized.

Third, by forming the lower part of the contact pin in a flat shape, the conductive part can stably contact the terminal of the device, the stress applied to the conductive part can be minimized, and the signal transmission characteristics can be improved compared to the prior art. there is.

Fourth, the lower surface of the device comes into contact with the upper surface of the test socket by the pressing force of the pusher. At this time, since the insulating housing is made of an inelastic insulator, the stroke can be limited by the inelastic insulating housing when an overstroke occurs. Damage to the test socket can be effectively prevented, and precise stroke control is possible because the hard stop is achieved through the non-elastic insulation housing.

Fifth, by controlling the expansion and absorption space of the relief film to absorb the amount of compression of the upper and lower bumps of the conductive part, it is possible to effectively prevent the upper and lower bumps of the conductive part from being excessively compressed and deteriorating in durability.

Sixth, since an inelastic insulation housing having inelastic properties is used as an insulator supporting a plurality of conductive parts, deformation is minimized and durability is excellent compared to a conventional test socket.

Seventh, since the inelastic insulation housing is made of a material with a relatively low dielectric constant so that electromagnetic waves can propagate well, high frequency signal transmission characteristics can be improved, and even if a conductive part of the same diameter is applied, it is better to use an inelastic insulator than an elastic insulator. Since it is advantageous to improve signal transmission characteristics, the signal transmission characteristics are superior to those of the prior art, and during testing of the device under test, oil elution from the inelastic insulator can be prevented, thereby preventing defects in the device under test.

Eighthly, in a conventional test socket using an elastic insulator and conductive particles, a phenomenon in which oil is eluted from the elastic insulator and the oil touches the device under test may cause a problem in that the device under test is defective. In contrast, since the present invention uses an inelastic insulator, it is possible to reduce oil generation and defects in the device under test.

1 is a longitudinal sectional view showing a conventional rubber socket in which a contact pin is disposed on an upper portion of a conductive part.
FIG. 2 is an enlarged view of an excerpt of a main part of FIG. 1, and is a view for explaining problems caused by stress concentration occurring in the upper and lower parts of the conductive part.
3 is a front view showing a test device according to an embodiment of the present invention.
Figure 4 is for explaining the operation of the test device according to an embodiment of the present invention.
5 is a longitudinal cross-sectional view illustrating a test socket according to an embodiment of the present invention.
6 is an enlarged view of an excerpt of the main part of FIG. 5, and when stress is concentrated on the upper part of the conductive part, the deformation of the upper and lower parts of the conductive part is absorbed into the expansion absorption space to minimize the deformation and explain the hard stop by the inelastic insulation housing. It is a drawing for
7 is a longitudinal cross-sectional view showing a test socket according to another embodiment of the present invention. When stress is concentrated on the lower part of the conductive part, the upper and lower parts of the conductive part are absorbed into the expansion absorbing space to minimize the deformation, and the inelasticity is reduced. It is a drawing for explaining a hard stop by an insulating housing.
8 is a longitudinal cross-sectional view showing the shape of a contact pin in a test socket according to an embodiment of the present invention.
9 illustrates a manufacturing process of a test socket included in a test device according to an embodiment of the present invention.

Hereinafter, a test socket according to an embodiment of the present invention, a test device including the test socket, and a manufacturing method of the test socket will be described in detail with reference to the accompanying drawings.

The present invention can apply various changes and can have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail in the detailed description.

However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

As used herein, "comprising." or "to have." The terms such as are intended to specify that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or numbers, steps, operations, components, parts, or It should be understood that it does not preclude the possibility of existence or addition of combinations thereof.

Also, terms such as “… unit” described in the specification refer to a unit that processes at least one function or operation, and may be implemented by hardware, software, or a combination of hardware and software.

In addition, components of an embodiment described with reference to each drawing are not limitedly applied only to the corresponding embodiment, and may be implemented to be included in other embodiments within the scope of maintaining the technical idea of the present invention, and also separate Even if the description is omitted, it is natural that a plurality of embodiments may be re-implemented as an integrated embodiment.

In addition, in the description with reference to the accompanying drawings, the same or related reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

Prior to the description of the present invention, the following specific structural or functional descriptions are only exemplified for the purpose of explaining embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention may be implemented in various forms, It should not be construed as being limited to the embodiments described herein.

In addition, since embodiments according to the concept of the present invention can be changed and have various forms, specific embodiments are illustrated in the drawings and described in detail herein.

Figure 3 is a front view showing a test device according to an embodiment of the present invention, Figure 4 is for explaining the operation of the test device according to an embodiment of the present invention.

5 is a longitudinal cross-sectional view showing a test socket according to an embodiment of the present invention, and FIG. 6 is an enlarged view of an excerpt of the main part of FIG. It is a drawing for explaining a hard stop by absorbing the deformed portion of and minimizing the deformity, and using an inelastic insulation housing.

7 is a longitudinal cross-sectional view of a test socket according to another embodiment of the present invention. When stress is concentrated on the lower part of the conductive part, deformation of the upper and lower parts of the conductive part is absorbed into the expansion absorbing space to minimize deformation, and inelasticity is reduced. It is a drawing for explaining a hard stop by an insulating housing.

8 is a longitudinal cross-sectional view showing the shape of a contact pin in a test socket according to an embodiment of the present invention.

9 illustrates a manufacturing process of a test socket provided in a test device according to an embodiment of the present invention.

5 to 7, (a) shows a state before testing, and (b) shows a state during testing.

First, as shown in FIGS. 3 and 4 , in the test apparatus 100 according to an embodiment of the present invention, a device under test 10 having a terminal 11 is connected to a tester 30 generating a test signal. It is a test device for connecting and testing the device under test 10 .

The test apparatus 100 according to an embodiment of the present invention electrically mediates the tester 30 and the device under test 10 so that the test signal of the tester 30 is transmitted to the device under test 10. socket 110; A guide housing 160 coupled to the tester 30 to fix the test socket 110 to the tester 30 and having an alignment pin 162 inserted into the fixing hole 32 of the tester 30; and a pusher 130 that moves toward or away from the tester 30 and provides pressing force capable of pressing the device under test 10 placed on the test socket 110 toward the tester 30 . ); It can be configured to include.

5 and 6, the test socket 110 according to an embodiment of the present invention is disposed between the device under test 10 and the tester 30, and the terminal ( 11) and the signal electrode 31 of the tester 30 are electrically connected to each other. The test socket 110 according to an embodiment of the present invention includes a plurality of housing holes 111 penetrating in a thickness direction, and includes an inelastic insulation housing 112 made of an inelastic insulation material; It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, and the lower end is connected to the signal electrode 31 of the tester 30 placed on the lower side of the inelastic insulation housing 112, and is formed in the housing hole 111 A conductive part including a conductive part body 113a penetrating the inelastic insulating housing 112 in the thickness direction and a conductive part upper bump 113b protruding from the upper surface of the inelastic insulating housing 112 on the upper surface of the conductive part body 113a. section 113; an upper relief film 114 attached to an upper surface of the inelastic insulation housing 112 and spaced apart from the upper bump 113b of the conductive part and having an expansion-absorbing space 114a; a contact pin 115 disposed above the conductive portion 113 so as to contact the terminal 11 of the device under test 10 and whose lowering position is limited by the upper relief film 114; and a contact pin guide 116 attached to the upper surface of the upper relief film 114 and guiding the vertical movement of the contact pin 115; It can be configured to include.

An alignment hole 119 through which the alignment pin 162 of the guide housing 160 passes may be formed in the non-elastic insulation housing 112, and the test socket 110 is aligned at a predetermined position on the tester 30. allow it to be fixed.

The conductive part 113 may further include a conductive part lower bump 113c connected to the conductive part body 113a located in the housing hole 111 and protruding from the lower surface of the inelastic insulation housing 112 .

The conductive portion 113 including the conductive portion lower bump 113c is advantageous in preventing damage to the device under test 10 by distributing a load when the terminal 11 of the device under test 10 comes into contact with it.

That is, the lower bump 113c of the conductive part protruding from the lower surface of the inelastic insulation housing 112 has a relatively high degree of freedom because there is no part held by the inelastic insulation housing 112 . Therefore, if the length of the lower bump 113c of the conductive part is designed to be an appropriate length, minute movement of the test socket 110 can be induced when the device under test 10 is brought into contact with it. In addition, if the test socket 110 moves finely up, down, front, left, and right when the device under test 10 is in contact, an effect of distributing the load caused by the contact of the device under test 10 and buffering the impact can be obtained. The length of the conductive portion lower bump 113c may be appropriately determined according to the width or number of the conductive portion 113 .

The elastic insulating material constituting the conductive part 113 is a heat-resistant high molecular material having a cross-linked structure, for example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile. -Butadiene copolymer rubber, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene Copolymer rubber, soft liquid epoxy rubber and the like can be used. Conductive particles constituting the conductive part 113 may be those having magnetism so that they can react with a magnetic field. For example, as the conductive particles, particles of a magnetic metal such as iron, nickel, or cobalt, or alloy particles thereof, or particles containing these metals or these particles are used as core particles, and gold is formed on the surface of the core particles. , silver, palladium, radium, etc. plated metal, or non-magnetic metal particles, inorganic material particles such as glass beads, and polymer particles as core particles, and the surface of the core particles is conductive such as nickel and cobalt A plated magnetic material or a plated core particle with a conductive magnetic material and a metal having good conductivity may be used.

Among the plurality of conductive parts 113, some may be used for signal transmission in contact with the tester's signal electrode, and the other may be used for ground.

The upper relief film 114 is attached to the upper surface of the inelastic insulation housing 112 and is spaced apart from the conductive part upper bump 113b to form an expansion and absorption space 114a.

The upper relief film 114 is made of an inelastic insulator, and various materials such as polyimide (PI) may be used.

The expansion-absorbing space 114a is an area where stress generated on the top of the conductive part 113 is relieved during device testing ("B" in FIGS. 6 and 7 is an exemplary portion where stress is relieved). is indicated).

In other words, when the terminal 11 of the device under test 10 presses the contact pin 115 downward by the pressing force of the pusher 130 and the stroke is transmitted to the conductive part 113, the conductive part 113 Stress is concentrated on the top of the conductive part 113 as it is deformed while being pressed downward. In particular, when an over stroke is applied to the test socket 110 because the stroke control is not precisely performed, the bump 113b on the top of the conductive part is severely compressed and deformed. At this time, the deformation of the conductive part 113 The stress generated on the upper part of the conductive part 113 is reduced by controlling the absorbed portion into the expansion and absorption space 114a.

In addition, as described above, a lower bump 113c of the conductive part protruding from the lower surface of the inelastic insulating housing 112 may be formed on the lower surface of the conductive part body 113a. Referring to FIG. 7, the inelastic insulating housing ( 112), a lower relief film 117 is additionally attached to the lower bump 113c of the conductive part in a state of being spaced apart from each other, so that an expansion-absorbing space 117a is formed between the lower relief film 117 and the lower bump 113c of the conductive part. ) can be provided.

The expansion and absorption space 117a is an area in which stress generated in the lower portion of the conductive portion 113 is relieved during a device test.

In other words, when the terminal 11 of the device 10 presses the contact pin 115 downward by the pressing force of the pusher 130 and the stroke is transmitted to the conductive part 113, the conductive part 113 moves downward. It is deformed while being pressed, and stress is concentrated on the top of the conductive part 113. In particular, when an over stroke is applied to the test socket 110 because stroke control is not precisely performed, the bump 113c under the conductive part is severely compressed and deformed. At this time, the deformation of the conductive part 113 The stress generated in the lower portion of the conductive portion 113 is reduced by controlling the absorbed portion into the expansion and absorption space portion 117a.

In addition, the upper relief film 114 may have a structure that surrounds the upper bump 113b of the conductive part while being spaced apart from the upper bump 113b of the conductive part at a predetermined interval, and the lower relief film 117 may have a structure that surrounds the upper bump 113b of the conductive part. It may have a structure surrounding the lower bump 117 of the conductive part while being spaced apart from the bump 113c at a predetermined interval.

Further, as shown in FIG. 8 , the contact pin 115 includes a contact pin body 115a connected to the terminal 11 of the device under test 10; a flat portion 115b formed on the lower surface of the contact pin body 115a that is connected to the upper surface of the conductive portion 113; and contact pin arms 115c formed on both sides of the contact pin body 115a to be guided by the contact pin guide 116 and contacting the upper surface of the upper relief film 114; It can be configured to include. When the terminal 11 of the device under test 10 is compressed by pressing the contact pin 115, the lower surface of the contact pin arm 115c comes into contact with the upper surface of the upper relief film 114, and the upper relief film 114 ) is formed of an inelastic insulator, so the contact pin arm 115c no longer descends, and accordingly, the conductive portion 113 is no longer compressed. That is, since the upper relief film 114 functions as a hard stop that limits the descending position of the contact pin 115, the life of the test socket can be extended by preventing the conductive part from being damaged due to excessive compression. .

In addition, the lower part of the contact pin 115 is formed in a flat shape so that the conductive part 113 can stably contact the terminal 11 of the device 10, and the stress applied to the conductive part 113 can be minimized, and signal transmission characteristics can be improved compared to the prior art.

In addition, as shown in FIGS. 3 and 4 , the guide housing 160 is coupled to the tester 30 to fix the test socket 110 to the tester 30 . The guide housing 160 may guide the device under test 10 toward the test socket 110 .

An opening 161 through which the device under test 10 can pass is provided inside the guide housing 160 . An alignment pin 162 inserted into the fixing hole 32 of the tester 30 may be provided in the guide housing 160 . The guide housing 160 is coupled to the tester 30 in such a way that the alignment pin 162 passes through the alignment hole 119 of the inelastic insulation housing 112 and is inserted into the fixing hole 32, and the test socket 110 It can be fixed by aligning it to a predetermined position on the tester 30. A conventional test socket having an elastic insulator is coupled to a frame made of a hard material having an alignment hole into which an alignment pin of a guide housing is inserted and installed in a tester, but since it is assembled through a separate frame, assembly errors between the rubber socket and the frame Due to this, alignment accuracy on the tester 30 is degraded.

On the other hand, in the test socket 110 according to the present invention, since the alignment hole 119 for assembly with the guide housing 160 is formed on the non-elastic insulation housing 112, the conductive portion ( 113) is constant to the housing hole 111. In addition, since the test socket 110 is directly assembled with the guide housing 160, it can be precisely aligned and placed on the tester 30.

Further, the pusher 130 is moved to approach or move away from the tester 30 to provide a pressing force capable of pressing the device under test 10 disposed on the test socket 110 toward the tester 30. to provide. The pusher 130 may be moved by receiving a moving force from a driving unit (not shown).

When the pusher 130 presses the device under test 10 , loads applied to the device under test 10 , the test socket 110 , and the tester 30 may be limited so as not to be excessive. Accordingly, damage or breakage of the device under test 10, the test socket 110, or the tester 30 due to excessive pressing force can be prevented.

The test apparatus 100 according to an embodiment of the present invention acts in the following manner when testing the device under test 10 .

As shown in FIGS. 3 and 4 , when the pusher 130 presses the terminal 11 of the device under test 10 through the contact pin 115 of the test socket 110, the upper end of the conductive part 113 and the lower end of the terminal 11 is pressed to the signal electrode 31 of the tester 30. At this time, a test signal generated by the tester 30 is transferred to the device under test 10 through the test socket 110 so that the device under test 10 can be electrically tested. Since the upper and lower relief films 114 and 117 are provided to be spaced apart from the upper and lower bumps 113b and 113c of the conductive part, and the upper and lower relief films 114 and 117 have expansion and absorption space portions 114a and 117a, respectively. , During the device test, when the terminal 11 of the device 10 presses the contact pin 115 downward by the pressing force of the pusher 130 and the stroke is transmitted to the conductive part 113, the conductive part 113 When is deformed while being pressed downward and stress is concentrated on the upper and lower portions of the conductive part 113, the upper and lower deformed parts of the conductive part 113 are absorbed and controlled into the expansion and absorption spaces 114a and 117a, thereby controlling the conductive part. (113) Stress concentrated on the upper and lower portions is reduced by the relief films 114 and 117, thereby minimizing the amount of deformation of the test socket 110 and extending the life of the test socket 110.

The expansion and absorption spaces 114a and 117a of the upper and lower relief films 114 and 117 absorb and control the amount of compression of the upper and lower bumps 113b and 113c of the conductive part, and the upper relief film 114 controls the contact pins ( By functioning as a hard stop that limits the lowering position of 115), it is possible to effectively prevent the upper and lower bumps 113b and 113c of the conductive part from being excessively compressed and degraded in durability.

In addition, by placing the contact pin 115 on the upper part of the conductive part 113 to increase the durability of the conductive part 113 and replacing the existing elastic insulator with an inelastic insulator, the device 10 is moved by the pressing force of the pusher 130. When the lower surface comes into contact with the upper surface of the test socket 110, stroke limitation is possible because the inelastic insulation housing 112 is made of an inelastic insulator. As the lower surface of the inelastic insulation housing 112 touches the upper surface of the tester 30, the stroke does not further increase.

In this way, the lower surface of the device under test 10 touches the upper surface of the inelastic insulation housing 112 to press the test socket 110 toward the tester 30, so that the pressing force applied to the device under test 10 is applied to the test socket ( 110), and the plurality of conductive parts 113 can maintain a contact state with the plurality of signal electrodes 31 and the plurality of terminals 11 with an even adhesion as a whole. Therefore, since the plurality of signal electrodes 31 and the plurality of terminals 11 can maintain a stable connection state through the test socket 110, a stable test is possible without signal transmission loss.

In particular, when an overstroke occurs, the inelastic insulation housing 112 limits the excessive pressure by the pusher 130 to effectively prevent breakage of the test socket 110, and the hard stop is used in the inelastic insulation housing ( 112), so precise stroke control is possible. Since the non-elastic insulation housing 112 having inelastic properties is used as an insulating part supporting the plurality of conductive parts 113, deformation is minimized and durability is excellent compared to the conventional test socket. Since the inelastic insulation housing 112 is made of a material with a relatively low dielectric constant so that electromagnetic waves can propagate well, high-frequency signal transmission characteristics can be improved, and even if a conductive part of the same diameter is applied, an inelastic insulator is used rather than an elastic insulator. Since it is advantageous to improve the signal transmission characteristics, the signal transmission characteristics are superior to those of the prior art.

Meanwhile, the test socket 110 of the present invention can be manufactured in the following way. A method of manufacturing a test socket according to an embodiment of the present invention is a test apparatus for testing a device under test 10 by connecting a device under test 10 having a terminal 11 to a tester 30 generating a test signal. A method of manufacturing the test socket 110 provided in (100), comprising: (a) preparing an inelastic member 170 made of an inelastic insulating material; (b) forming a plurality of housing holes 111 penetrating the inelastic member 170 in a thickness direction to form an inelastic insulation housing 112; (c) It is made in the form of including a plurality of conductive particles in an elastic insulating material, and the lower end is connected to the signal electrode 31 of the tester 30 placed on the lower side of the inelastic insulation housing 112, and the upper end forming a conductive part 113 having a conductive part upper bump 113b protruding from the upper surface of the inelastic insulation housing 112 into the housing hole 111; (d) attaching an upper relief film 114 to an upper surface of the inelastic insulation housing 112 to form an expansion and absorption space 114a spaced apart from the upper bump 113b of the conductive part; (e) disposing contact pins 115 on top of the conductive part 113 so as to contact the terminal 11 of the device under test 10; and (f) attaching a contact pin guide 116 to an upper surface of the upper relief film 114 to guide the vertical movement of the contact pin 115; It can be configured to include.

Referring further with reference to FIG. 9 , in the test socket manufacturing method according to an embodiment of the present invention, as shown in FIG. 9 (a), (a) preparing an inelastic member 170 made of an inelastic insulating material. do. The inelastic member 170 may be made of polyimide or other materials.

Next, as shown in (b) of FIG. 9 , a plurality of housing holes 111 penetrating the inelastic member 170 in the thickness direction are formed to form the inelastic insulation housing 112 . An alignment hole 119 through which an alignment pin 162 of the guide housing 160 passes may be formed in the inelastic insulation housing 112, and the alignment hole 119 connects the test socket 110 to the tester 30. It can be fixed by aligning it to a fixed position on the image (see Fig. 4). Next, as shown in (c) of FIG. 9 , the plurality of housing holes 111 are filled with the conductive particle mixture 50 including conductive particles in the elastic insulating material. The conductive particle mixture 50 may be press-fitted into the housing hole 111 in a paste state having fluidity. That is, the mold 40 in which the conductive particle mixture 50 is disposed is placed on the lower side of the inelastic insulation housing 112, and the plurality of mold holes 41 correspond to the plurality of housing holes 111 on a one-to-one basis. After the conductive particle mixture 50 is filled into the mold hole 41 and the housing hole 111, the conductive particle mixture 50 is cured through a curing process.

As a method of curing the conductive particle mixture 50, various methods may be used depending on the characteristics of the conductive particle mixture 50, such as a method of heating to a certain temperature and then cooling to room temperature. As the conductive particle mixture 50 is cured through the curing process, the conductive part body 113a disposed in the housing hole 111 and the conductive part upper bump 113b formed on the conductive part body 113a are included. to form a conductive portion 113. After the conductive part 113 is formed, the inelastic insulation housing 112 and the mold 40 are separated.

A process of applying a magnetic field to the conductive particle mixture 50 may be performed before curing the conductive particle mixture 50 .

When a magnetic field is applied to the conductive particle mixture 50, the conductive particles dispersed in the elastic insulating material may be oriented in the thickness direction of the inelastic insulating housing 112 under the influence of the magnetic field to form an electrical passage.

Also, in the method of manufacturing the test socket 110, the conductive part body 113a of the conductive part 113 and the conductive part upper bump 113b may be simultaneously formed in one molding mold. Next, as shown in (d) of FIG. 9, an upper relief film 114 is formed on the upper surface of the inelastic insulation housing 112 to form an expansion-absorbing space 114a spaced apart from the conductive part upper bump 113b. attach The upper relief film 114 may be made of an inelastic insulator. Next, as shown in (e) of FIG. 9 , contact pins 115 are placed on top of the conductive portion 113 so as to contact the terminal 11 of the device under test 10 . Next, as shown in (f) of FIG. 9, a contact pin guide 116 is attached to the upper surface of the upper relief film 114 to guide the vertical movement of the contact pin 115. Furthermore, as shown in (d) of FIG. 9 , in the step (c), the conductive part lower bump 113c protruding from the lower surface of the inelastic insulation housing 112 is simultaneously formed on the lower surface of the conductive part 113. can do. The lower bump 113c of the conductive part may be formed under the conductive part body 113a in the same manner as described in (c) of FIG. 9 . In step (d), the lower relief film 117 may also be attached to the lower surface of the inelastic insulation housing 112 to form an expansion-absorbing space 117a spaced apart from the lower bump 113c of the conductive part.

As such, the present invention has the following effects. First, a relief film is provided to be spaced apart from the upper and lower bumps of the conductive part, and since the relief film has an expansion-absorbing space, during a device test, the contact pin of the device presses the contact pin downward by the pressing force of the pusher to conduct conduction. When a stroke is transmitted to the part, when the conductive part is pressed downward and deformed, and stress is concentrated on the upper and lower parts of the conductive part, the upper and lower deformed parts of the conductive part are suction controlled into the expansion absorbing space, and the relief film descends the contact pin. By functioning as a hard stop that limits the position, it is possible to extend the life of the test socket by preventing damage to the conductive part.

Second, by placing contact pins on the upper part of the conductive part to increase the durability of the conductive part, replacing the existing elastic insulator with an inelastic insulator, and providing a relief film to be spaced apart from the upper and lower bumps of the conductive part, during device testing, the upper and lower parts of the conductive part Stress can be reduced and the amount of deformation of the test socket can be minimized.

Third, by forming the lower part of the contact pin in a flat shape, the conductive part can stably contact the terminal of the device, the stress applied to the conductive part can be minimized, and the signal transmission characteristics can be improved compared to the prior art. there is.

Fourth, the lower surface of the device comes into contact with the upper surface of the test socket by the pressing force of the pusher. At this time, since the inelastic insulation housing is made of an inelastic insulator, the stroke can be limited by the inelastic insulation housing when an overstroke occurs. Therefore, damage to the test socket can be effectively prevented, and precise stroke control is possible because the hard stop is achieved through the non-elastic insulation housing.

Fifth, by controlling the expansion and absorption space of the relief film to absorb the amount of compression of the upper and lower bumps of the conductive part, it is possible to effectively prevent the upper and lower bumps of the conductive part from being excessively compressed and deteriorating in durability.

Sixth, since an inelastic insulation housing having inelastic properties is used as an insulator supporting a plurality of conductive parts, deformation is minimized and durability is excellent compared to a conventional test socket.

Seventh, since the inelastic insulation housing is made of a material with a relatively low dielectric constant so that electromagnetic waves can propagate well, high frequency signal transmission characteristics can be improved, and even if a conductive part of the same diameter is applied, it is better to use an inelastic insulator than an elastic insulator. Since it is advantageous to improve the signal transmission characteristics, it is possible to improve the signal transmission characteristics compared to the prior art.

Eighthly, in a conventional test socket using an elastic insulator and conductive particles, a phenomenon in which oil is eluted from the elastic insulator and the oil touches the device under test may cause a problem in that the device under test is defective. In contrast, since the present invention uses an inelastic insulator, it is possible to reduce oil generation and defects in the device under test.

10: Device to be tested
11: terminal of device
30: tester
31: signal electrode
32: fixed hole
100: test device
110: test socket
112 inelastic insulating housing
113: conductive part
113a: conductive part body
113b: conductive part upper bump
113c: conductive part lower bump
114: upper relief film
114a: expansion and absorption space
115: contact pin
115a: contact pin body
115b: flat part
115c: contact pin arm
116: contact pin guide
117: lower relief film
117a: expansion and absorption space
119 Alignment hole
130: pusher
160: guide housing
161: opening
162 alignment pin

Claims (8)

A test socket disposed between a device under test and a tester to electrically connect a terminal of the device under test and a signal electrode of the tester to each other,
an inelastic insulation housing having a plurality of housing holes formed therethrough in a thickness direction and made of an inelastic insulation material;
It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and is formed in the housing hole to penetrate the inelastic insulating housing in the thickness direction a conductive part including a conductive part body and a conductive part upper bump protruding from the upper surface of the inelastic insulation housing on an upper surface of the conductive part body;
an upper relief film attached to an upper surface of the inelastic insulation housing, spaced apart from the upper bump of the conductive part, and having an expansion and absorption space;
a contact pin disposed above the conductive part so as to contact the terminal of the device under test, and the lowering position of which is limited by the upper relief film; and
a contact pin guide attached to an upper surface of the upper relief film and guiding vertical movement of the contact pin; A test socket containing a . According to claim 1,
A lower bump of the conductive part protruding from the lower surface of the inelastic insulation housing is formed on the lower surface of the conductive part body,
A test socket, characterized in that a lower relief film is attached to the lower surface of the inelastic insulation housing while being spaced apart from the lower bump of the conductive part, and an expansion-absorbing space is provided between the lower relief film and the lower bump of the conductive part. According to claim 2,
The upper relief film has a structure surrounding the upper bump of the conductive part while being spaced apart from the upper bump of the conductive part at a predetermined interval,
The test socket of claim 1 , wherein the lower relief film has a structure surrounding the lower bump of the conductive part while being spaced apart from the lower bump of the conductive part at a predetermined interval. According to claim 1,
The contact pin,
a contact pin body connected to a terminal of the device under test;
a flat portion formed on a lower surface of the contact pin body connected to an upper surface of the conductive portion; and
contact pin arms formed on both sides of the contact pin body to be guided by the contact pin guide and contacting an upper surface of the upper relief film; A test socket containing a . A test apparatus for testing a device under test by connecting a device under test having a terminal to a tester that generates a test signal, comprising:
a test socket electrically mediating the tester and the device under test so that the test signal of the tester is transferred to the device under test;
a guide housing coupled to the tester to fix the test socket to the tester and having an alignment pin inserted into a fixing hole of the tester; and
a pusher that moves toward or away from the tester and provides a pressing force capable of pressing the device under test placed on the test socket toward the tester; including,
The test socket,
an inelastic insulation housing having a plurality of housing holes formed therethrough in a thickness direction and made of an inelastic insulation material;
It is made in a form in which a plurality of conductive particles are included in an elastic insulating material, the lower end is connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and is formed in the housing hole to penetrate the inelastic insulating housing in the thickness direction a conductive part including a conductive part body and a conductive part upper bump protruding from the upper surface of the inelastic insulation housing on an upper surface of the conductive part body;
an upper relief film attached to an upper surface of the inelastic insulation housing, spaced apart from the upper bump of the conductive part, and having an expansion and absorption space;
a contact pin disposed above the conductive part so as to contact the terminal of the device under test, and the lowering position of which is limited by the upper relief film; and
a contact pin guide attached to an upper surface of the upper relief film and guiding vertical movement of the contact pin; A test device comprising a. According to claim 5,
A lower bump of the conductive part protruding from the lower surface of the inelastic insulation housing is formed on the lower surface of the conductive part body,
A test device, characterized in that a lower relief film is attached to the lower surface of the inelastic insulation housing while being spaced apart from the lower bump of the conductive part, and an expansion-absorbing space is provided between the lower relief film and the lower bump of the conductive part. A method of manufacturing a test socket provided in a test apparatus for testing a device under test by connecting a device under test having a terminal to a tester generating a test signal, the method comprising:
(a) preparing an inelastic member made of an inelastic insulating material;
(b) forming a plurality of housing holes penetrating the inelastic member in a thickness direction to form an inelastic insulation housing;
(c) made in the form of including a plurality of conductive particles in an elastic insulating material, a lower end connected to the signal electrode of the tester placed on the lower side of the inelastic insulating housing, and a conductive protruding from the upper surface of the inelastic insulating housing at the upper end forming a conductive part having a second upper bump in the housing hole;
(d) attaching an upper relief film to an upper surface of the inelastic insulating housing to form an expansion-absorbing space spaced apart from the upper bump of the conductive part;
(e) arranging contact pins on top of the conductive portion to contact terminals of the device under test; and
(f) attaching a contact pin guide to the upper surface of the upper relief film to guide the vertical movement of the contact pin; Method of manufacturing a test socket comprising a. According to claim 7,
In the step (c), a lower bump of the conductive part protrudes from the lower surface of the inelastic insulation housing is formed on the lower surface of the conductive part, and in the step (d), an expansion-absorbing space is formed spaced apart from the lower bump of the conductive part. A method of manufacturing a test socket, characterized in that attaching a lower relief film to the lower surface of the inelastic insulation housing.

Images