KR200313240Y1 - Test socket for ball grid array package - Google Patents

Abstract

The present invention relates to a test socket for a ball grid array (BGA) package, which is easy to manufacture and maintain the test socket, and when the ball grid array (BGA) package contacts the test socket, the ball grid array (BGA) Provides test sockets for ball grid array (BGA) packages that can minimize solder ball damage and minimize contamination of test sockets and ensure good contact reliability between test sockets and ball grid array (BGA) packages. do. That is, a test socket for a ball grid array (BGA) package that electrically mediates a ball grid array (BGA) package and a test substrate, the plurality of holes being perpendicular to the position corresponding to the solder balls of the ball grid array (BGA) package to be tested. A socket body having a mounting hole formed therein; A spring pin mounted to the mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate, wherein the spring pin is inserted into the mounting hole of the socket body and is mounted thereon. A lower end protruding to a lower surface of the socket body to be in electrical contact with the test substrate, and an upper end of the contact pin to be positioned below the upper surface of the socket body; A lower end portion inserted into and fixed to the contact pin, and an upper end portion connected to the lower end portion protruding to an upper portion of the socket body to make contact springs in mechanical contact with solder balls of a ball grid array (BGA) package to be tested. Provides test sockets for array (BGA) packages. At this time, while the contact pin is in contact with the test substrate and electrically connected, the solder ball of the ball grid array (BGA) package to be tested is pressed to a predetermined pressure and electrically connected to the other end of the contact spring. .

Description

Test socket for ball grid array package

The present invention relates to a test socket for a ball grid array package. More specifically, the test socket for the ball grid array package which is easy to manufacture and maintain the test socket and is connected to the solder ball of the ball grid array package by spring contact method. It's about sockets.

In general, a semiconductor package manufactured by a semiconductor package manufacturing process is subjected to various tests in order to confirm the reliability of the product after manufacturing. The test is performed by connecting all the input / output terminals of the semiconductor package with the test signal generating circuit to check the normal operation and disconnection, and connecting the input / output terminals such as the power input terminal of the semiconductor package with the test signal generating circuit to normal operating conditions. There is a burn-in test that checks the lifetime and bonding of semiconductor packages by applying stress at higher temperatures, voltages and currents.

Usually, the above reliability test is carried out with a semiconductor package mounted in a test socket. In addition, the shape of the test socket is basically determined according to the shape of the semiconductor package, and serves as a medium for connecting the test board by mechanical contact between the external connection terminal of the semiconductor package and the socket lead.

In particular, in the case of a ball grid array (BGA) package using solder balls as an external connection terminal among semiconductor packages, Korean Utility Model Publication No. 182523 (March 7, 2000) or Korean Utility Model Publication As disclosed in 247732 (September 11, 2001), a test socket has a structure in which a test probe is built into a socket body made of plastic, and is manufactured by a molding method. In order to ensure good contact reliability between the inspection probe and the solder ball of the BGA package, it is common to sharply form an upper end of the inspection probe that is in mechanical contact with the solder ball of the BGA package.

However, the test socket manufactured by the conventional molding method has a structure in which a part of the inspection probe is sealed to the socket body, so that almost no maintenance work on the inspection probe can be performed. If it does, it should be replaced with a new test socket.

Since the top of the inspection probe that is in mechanical contact with the solder ball of the BGA package is sharp, the solder ball of the BGA package may be damaged by the inspection probe during contact with a predetermined pressure. The top of the inspection probe is also contaminated by material stripped from the solder balls in the BGA package.

In addition, since the test probe of the test socket has fluidity in the up and down but little movement from side to side, when a tolerance occurs between the solder ball of the BGA package and the test probe of the test socket, the solder ball and the test probe Contact reliability between probes may be degraded or contact misses may occur. That is, even in the same BGA package, the position of the solder balls is slightly different within the allowable tolerance, so that a tolerance occurs between the solder balls of the BGA package and the inspection probe of the test socket, which causes the BGA package. The contact reliability between the solder ball and the inspection probe may be degraded or contact misses may occur during contact with the test socket. Such defects are a factor in reducing test reliability.

Accordingly, a first object of the present invention is to provide a test socket for a BGA package that can be easily manufactured and can easily undergo maintenance work.

The second object of the present invention is to provide a test socket for a BGA package that can minimize the contamination of the test socket with damage to the solder ball of the BGA package when the BGA package is in contact with the test socket.

A third object of the present invention is to provide a test socket for a BGA package capable of ensuring good contact reliability between the test socket and the BGA package.

1 is an exploded perspective view showing a test socket for a ball grid array (BGA) package according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1.

3 and 4 are cross-sectional views illustrating a state in which a ball grid array (BGA) package is mounted in the test socket of FIG. 1.

5 is a cross-sectional view illustrating a test socket for a ball grid array (BGA) package according to a second embodiment of the present invention.

Description of the main parts of the drawing

10: first film 12: fitting holes

20: second film 22: guide hole

30 socket body 32 mounting hole

40: contact pin 50: contact spring

60: spring pin 70: test socket

80: test substrate 82: substrate pad

90: BGA Package 92: Solder Ball

In order to achieve the above object, a test socket for a BGA package that electrically mediates the BGA package and the test substrate, the socket body having a plurality of mounting holes formed perpendicularly to a position corresponding to the solder balls of the BGA package to be tested; And a spring pin mounted to a mounting hole of the socket body to electrically connect the BGA package to be tested and the test substrate.

The spring pin is inserted into the mounting hole of the socket body, and the lower end protrudes into the lower surface of the socket body to be in electrical contact with the test substrate, and the upper end is positioned below the upper surface of the socket body. Contact pins; A lower end is inserted into and fixed to the contact pin, and an upper end connected to the lower end protrudes into an upper portion of the socket body, and a contact spring makes mechanical contact with the solder ball of the BGA package to be tested.

In the state in which the contact pin is in contact with the test substrate and electrically connected, the solder ball of the BGA package to be tested at the other end of the contact spring is pressed to a predetermined pressure to be elastically contacted and electrically connected. Provide test sockets for BGA packages.

The socket body according to the present invention, the first film is formed with a fitting hole is fixed to the lower end of the contact pin, and laminated on the upper portion of the first film, formed to correspond to the fitting hole to move the contact spring fitted to the contact pin And a second film having guide holes for guiding. At this time, the guide hole is preferably formed to have a larger inner diameter than the fitting hole.

The contact pin according to the present invention includes a contact protrusion contacting the substrate pad of the test substrate, a first fixing jaw connected to the contact protrusion and fitted into a fitting hole of the first film, and connected to an upper portion of the first fixing jaw and contact springs. The lower end of the second fixing jaw and the second fixing jaw is connected to the upper fixing jaw and the contact spring is inserted in the longitudinal direction includes a guide bar for guiding the vertical movement of the contact spring.

In addition, the contact spring according to the present invention is a coil spring, the first contact portion which is fitted and fixed to the second fixing jaw of the contact pin to make an electrical connection with the contact pin, and the force applied by the BGA package to be tested connected to the first contact portion, etc. And a second contact portion which is connected to the buffer portion and the buffer portion and which is electrically connected to the solder ball of the BGA package to be tested by mechanical contact. At this time, the second contact is tightly wound so as to make stable mechanical contact with the contact spring and the solder ball of the BGA package, and the cushioning portion is spaced apart from the second contact so as to relieve the force applied by the BGA package during contact. It is wound up.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is an exploded perspective view illustrating a test socket 70 for a BGA package according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1.

1 and 2, the test socket 70 according to the embodiment of the present invention has a socket body 30 having a plurality of vertically penetrating mounting holes 32 and a mounting hole of the socket body 30. It is composed of a spring pin (60) to electrically connect the test substrate and the BGA package to be mounted on the test 32.

The socket body 30 has a mounting hole 32 vertically penetrated to mount the spring pin 60 at a position corresponding to the solder ball of the BGA package. The spring pin 60 is inserted into the mounting hole 32 of the socket body, and the contact pin 40 is mounted so that the lower end protrudes out of the socket body 30, and the lower end is the contact pin through the mounting hole 32. The upper end inserted into the 40 and connected to the lower end includes a contact spring 50 protruding to the upper surface of the socket body 30.

In more detail, the socket body 30 is made of a thin film such as polyimidetape or plastic plate, and the fitting hole 12 into which the lower end of the spring pin 60 is fitted is fixed. A first film 10 formed on the upper surface of the first film 10 and a guide hole 22 formed to correspond to the fitting hole 12 to guide the movement of the spring pin 60. It consists of two films 20. At this time, the fitting hole 12 and the guide hole 22 form the mounting hole 32, the guide to insert the spring pin 60 through the guide hole 22 to the fitting hole 12 to be fixed. The hole 22 is formed wider than the inner diameter of the fitting hole 12. Meanwhile, in the embodiment of the present invention, the socket body 30 is formed of a film in which no wiring pattern is formed, but when a circuit element is required, the socket body may be formed of a film such as a tape wiring board on which a wiring pattern is formed.

The contact pin 40 is a pin made of a conductive metal having good electrical conductivity or plated with a conductive material, and has a lower end protruding to the lower surface of the socket body 30 to be in electrical contact with the test substrate, and the upper end of the socket It is mounted below the upper surface of the body (30). That is, the contact pin 40 has a first fixing jaw 44 which can be fixed to the fitting hole 12 of the first film at the lower end, and the contact spring 50 on the upper portion of the first fixing jaw 44. The lower end of the second fixing jaw 46 is formed that can be fixed. At this time, the contact protrusion 42 below the first fixing jaw 44 protruding to the lower surface of the first film 10 after being inserted into the fitting hole 12 of the first film is in contact with the substrate pad of the test substrate, The contact spring 50 is inserted in the guide bar 48 of the upper portion of the second fixing jaw 46 to guide the vertical movement of the contact spring 50.

The contact spring 50 is installed by being inserted into the contact pin 40 in the longitudinal direction by a coil spring. The contact spring 50 is fitted into and fixed to the second fixing jaw 46 of the contact pin to make an electrical connection with the contact pin 40. A first contact portion 52, a buffer portion 54 connected to the first contact portion 52 to buffer a force applied by the BGA package, and the solder ball of the BGA package connected to the buffer portion 54 to be tested. And a second contact portion 56 which makes an electrical connection by means of mechanical contact. In this case, the second contact portion 56 is installed to protrude to a predetermined height above the upper surface of the socket body 30 so as to stably contact the solder ball of the BGA package to be tested.

In particular, the second contact portion 56 is closely wound so that the contact spring 50 and the solder ball of the BGA package can be stably formed, and the shock absorbing portion 54 presses the force applied by the BGA package during contact. It is wound at intervals rather than the second contact 56 so as to be relaxed. Preferably, the inner diameter of the second contact portion 56 is smaller than the outer diameter of the solder ball of the BGA package so that the second contact portion 56 of the contact spring can contact the outer surface of the solder ball of the BGA package. The surface of the contact spring 50 is preferably plated with a conductive material having good electrical conductivity so that electrical signals can be smoothly exchanged between the contact spring 50, the solder ball of the BGA package, and the contact pin 40. Do.

Therefore, since the test socket 70 according to the present invention has a structure in which the lower end of the spring pin 60 is fitted into the mounting hole 32 of the socket body, the spring pin 60 is mounted in the socket body 30. And easy to separate. That is, the test socket 70 according to the present invention has a simple manufacturing process compared to the conventional test socket manufactured by the molding process, and maintenance such as replacement of the spring pin 60, which may be damaged during the test process. Work can be easily performed.

In order to proceed with the test process, a state in which the BGA package 90 is mounted on the test socket 80 according to the present invention will be described with reference to FIGS. 3 and 4.

First, as shown in FIG. 3, a test socket 70 is installed on the test substrate 80. The contact protrusion 42 of the spring pin protruding to the lower surface of the test socket 70 is installed to be in contact with the substrate pad 82 of the test substrate.

The BGA package 90 to be tested is then transported and aligned over the test socket 70. Of course, the solder balls 92 of the BGA package are transferred to the top of the test socket 70. In this case, the BGA packages 90 may be transported one by one by the transport means, and the test process may be performed. Of course, when the BGA packages are accommodated in the tray, the test socket is installed at a position corresponding to the position of the BGA package accommodated in the tray.

Next, as shown in FIG. 4, when the BGA package 90 is moved downward to be in close contact with the test socket 70, the solder ball 92 of the BGA package elastically contacts the contact spring 50 of the spring pin. Contact. At this time, the hemispherical solder ball 92 is in contact with the contact spring 50 in a state accommodated in the second contact portion 56 of the contact spring, the pressing force of the BGA package 90 is below the second contact portion 56 The buffer 54 is absorbed to allow the second contact 56 to be in elastic contact with the solder balls 92 of the BGA package so as to be electrically connected. Therefore, the damage of the solder ball 92 of the BGA package due to the pressing force that is inevitably applied when testing the BGA package 90 can be minimized by contact with the contact spring 50. In addition, since the damage of the solder ball 92 of the BGA package is minimized, the contamination of the spring pin 60 of the test socket can also be minimized.

In addition, although a slight difference occurs within a tolerance where the position of the solder ball 92 of the BGA package is allowed, the position of the solder ball 92 is due to the contact between the solder ball 92 of the BGA package and the contact spring 50. Is pressed in the displaced state, the solder ball 92 is guided into the groove of the second contact portion 56 of the contact spring to ensure good contact reliability between the test socket 70 and the BGA package 90. . That is, the contact spring 40 is moved up, down, left, and right as much as the upper and lower buffering action of the contact spring 50 in the guide hole 22 corresponds to the clearance formed between the contact pin 40 and the guide hole 22. Since the movement is also possible, the spring pin 60 can stably contact the solder ball 92 which is crimped | bonded in the state which the position of the solder ball 92 shifted.

On the other hand, embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

For example, in the embodiment of the present invention, the socket body forms a structure in which the first film and the second film are laminated, but may be integrally formed as shown in FIG. 5. In this case, the first embodiment of the present invention The fitting hole 112 formed in the first film corresponding to the mounting hole 132 corresponding to the guide hole 122 formed in the second film is integrally formed in the second embodiment. Meanwhile, since the test socket 170 according to the second embodiment has the same structure as the test socket according to the first embodiment except that the socket body 130 is integrally formed, a detailed description thereof will be omitted.

Therefore, the test socket according to the present invention is fixed by fitting the lower end of the spring pin to the mounting hole of the socket body, it is easy to mount and detach the spring pin in the socket body. That is, compared with the test socket manufactured by the conventional molding process, the manufacturing process is simple, mass production is possible by shortening the manufacturing time, and the manufacturing cost can be lowered.

Since spring pins are easily installed and removed from the socket body, maintenance work, such as replacing spring pins, which are easily damaged during the test process, can be easily performed.

Since the hemispherical solder ball is in contact with the contact spring in a state accommodated inside the second contact of the contact spring, damage of the solder ball of the BGA package due to the inevitably compressive force applied during the test can be minimized. In addition, damage to the solder balls in the BGA package is minimized, minimizing contamination of the spring pins on the test sockets.

And even if there is a slight difference within the tolerance of the solder ball of the BGA package, the contact of the solder ball and the contact spring of the BGA package makes contact, so even if the solder ball is pressed in the displaced position, the solder ball contacts Guided into the groove of the second contact of the spring can ensure good contact reliability between the test socket and the BGA package.

Claims (7)

Test sockets for ball grid array (BGA) packages that electrically mediate ball grid array (BGA) packages and test boards. A socket body having a plurality of mounting holes formed perpendicularly to a position corresponding to the solder balls of the ball grid array (BGA) package to be tested; And a spring pin mounted to a mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate. The spring pin, A contact pin inserted into the mounting hole of the socket body, the lower end protruding to the lower surface of the socket body to be in electrical contact with the test substrate, and the upper end of the contact pin being positioned below the upper surface of the socket body; A lower end portion inserted into and fixed to the contact pin, and an upper end portion connected to the lower end portion protruding to an upper portion of the socket body, the contact spring making a mechanical contact with a solder ball of a ball grid array (BGA) package to be tested; With the contact pins in contact with and electrically connected to the test substrate, the solder balls of the ball grid array (BGA) package to be tested are pressed to a predetermined pressure and elastically contacted with the other end of the contact spring. Test socket for a ball grid array (BGA) package, characterized in that. The method of claim 1, wherein the socket body, A first film having a fitting hole to which the lower end of the contact pin is inserted and fixed; And a second film stacked on top of the first film, the second film being formed to correspond to the fitting hole and having a guide hole for guiding movement of the contact spring fitted to the contact pin. Test socket for BGA) package. The test socket of claim 2, wherein the guide hole has a larger inner diameter than the fitting hole. The method of claim 2, wherein the contact pin, A contact protrusion in contact with the substrate pad of the test substrate; A first fixing jaw connected to the contact protrusion and fixed to a fitting hole of the first film; A second fixing jaw connected to an upper portion of the first fixing jaw and fixed to a lower end of the contact spring; And And a guide bar connected to an upper portion of the second fixing jaw, wherein the contact spring is inserted in a length direction to guide the vertical movement of the contact spring. The method of claim 4, wherein the contact spring is a coil spring, A first contact portion inserted into and fixed to a second fixing jaw of the contact pin to make an electrical connection with the contact pin; A buffer unit connected to the first contact unit to buffer a force applied by a ball grid array (BGA) package to be tested; And And a second contact portion connected to the buffer part and electrically connected to the solder ball of the ball grid array (BGA) package to be tested by mechanical contact. The ball grid array (BGA) of claim 5, wherein the second contact portion is tightly wound to achieve stable mechanical contact with the solder spring of the contact spring and the ball grid array (BGA) package. A test socket for a ball grid array (BGA) package, characterized in that it is wound at a spacing rather than the second contact to relieve the pressing force of the package. The method of claim 1, wherein the mounting hole of the socket body, In the upper surface of the socket body is formed with a predetermined depth that can be inserted into the spring pin, the guide hole for guiding the vertical movement of the contact spring, and the inner diameter is formed narrower than the guide hole below the guide hole And a fitting hole penetrating through the lower surface of the socket body and having a lower end portion of the contact pin inserted into and fixed to the socket body.